WO2013107030A1 - 一种多功能的基片磨抛装置及其磨抛方法 - Google Patents

一种多功能的基片磨抛装置及其磨抛方法 Download PDF

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Publication number
WO2013107030A1
WO2013107030A1 PCT/CN2012/070627 CN2012070627W WO2013107030A1 WO 2013107030 A1 WO2013107030 A1 WO 2013107030A1 CN 2012070627 W CN2012070627 W CN 2012070627W WO 2013107030 A1 WO2013107030 A1 WO 2013107030A1
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WO
WIPO (PCT)
Prior art keywords
grinding
polishing
substrate
spindle unit
spindle
Prior art date
Application number
PCT/CN2012/070627
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English (en)
French (fr)
Inventor
康仁科
朱祥龙
董志刚
冯光
郭东明
Original Assignee
大连理工大学
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Application filed by 大连理工大学 filed Critical 大连理工大学
Priority to PCT/CN2012/070627 priority Critical patent/WO2013107030A1/zh
Priority to US14/124,398 priority patent/US9138855B2/en
Publication of WO2013107030A1 publication Critical patent/WO2013107030A1/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers

Definitions

  • the invention belongs to the technical field of ultra-precision processing of a planar substrate, and particularly relates to a grinding and polishing flattening processing and thinning processing for a flat substrate of a hard and brittle material such as a silicon wafer, a sapphire substrate and a glass substrate, and can also be used for ceramics. Grinding and polishing of flat sheets such as metals and composites.
  • Ultra-precision surface processing and ultra-precision thinning of flat sheet-like substrates such as silicon wafers, sapphire substrates, glass panels and ceramic sheets, usually through grinding, grinding and polishing processes, respectively, by grinding and grinding machine tools and The polishing machine is independently completed.
  • the grinding and grinding machine is used for surface flattening of the substrate to make the substrate reach a predetermined thickness to obtain a high-flatness high-quality surface.
  • the polishing machine is used for surface polishing of the substrate to remove the substrate. Grinding and grinding the surface damage layer to achieve a damage-free ultra-smooth surface.
  • the thinning of the substrate usually requires the thickness of the substrate to be reduced. 30 ⁇ 100 ⁇ m
  • the substrate is made light and compact below.
  • the substrate is thinned to a predetermined thickness by grinding, it is removed from the grinding machine and then clamped to the polishing machine for polishing.
  • the surface of the substrate is ground.
  • the stress causes deformation of the substrate, which causes the substrate to be transferred between the grinding and polishing processes and is easily broken during the re-clamping process on the polishing machine.
  • the two machines are separately used for grinding and polishing, and the equipment investment is large. The efficiency is relatively low.
  • the substrate grinding and polishing machine tools that are commonly used on the market are usually special grinding equipment. For wafer-shaped silicon wafers, flattening and thinning are mainly performed by silicon ultra-precision grinding machines.
  • the surface of the polishing machine is polished; for the glass plate of the square piece, it is mainly flattened and thinned by a special plane grinding machine, and then polished by a surface polishing machine.
  • These existing grinding and polishing machines are often not suitable for different use requirements of multiple substrates. .
  • the technical problem to be solved by the present invention is to overcome the deficiencies of the above-mentioned existing grinding and polishing machine tools and processing methods, and to invent a multifunctional substrate grinding and polishing device and a grinding and polishing method thereof.
  • the multi-functional substrate grinding and polishing device adopts a double-spindle structure to complete grinding and polishing of a wafer, a glass panel, a ceramic sheet, a sapphire substrate and the like on a device, that is, after grinding, the substrate is not Need to unload the film, directly from the grinding station into the polishing station for substrate polishing, can achieve the axial cutting-type grinding and polishing of the substrate, radial cutting-type grinding and polishing, radial reciprocating grinding and polishing and edge grinding A variety of grinding and polishing methods.
  • the grinding spindle unit and the polishing spindle unit are counterweights, sharing a set of motor-driven feed mechanism and cylinder feed mechanism, and the substrate can realize both fixed-stage grinding and controlled-force grinding during grinding or polishing
  • the technical solution adopted by the invention is a multifunctional substrate grinding and polishing device and a grinding and polishing method thereof, and the grinding and polishing method adopts three methods: 1) When the wafer-shaped substrate is processed by the axial plunge grinding and polishing method, the processed substrate W is placed on the chuck 12, and the table 3 is driven horizontally toward the b by the feed mechanism 8.
  • the direction of the arrow is advanced to the lower side of the grinding spindle unit 18, and the center of the wafer-shaped substrate W is located at the outer edge of the grinding wheel 15, keeping the table 3 fixed in the horizontal direction; 2
  • the grinding wheel 15 of the grinding spindle unit 18 rotates in the e direction; meanwhile, the grinding spindle unit 18 is in the motor 26 D is fed downward in the grinding feed direction during forward rotation, keeping the grinding spindle unit 18 fixed in the grinding feed direction;
  • 3 When using a small-diameter grinding wheel or a throwing wheel, the edge grinding or polishing method is used to achieve the edge grinding or the edge polishing.
  • the diameter of the small diameter grinding wheel or the throwing wheel is slightly smaller than the radius of the processed substrate W, and the substrate to be processed W placed on the suction cup 12
  • the substrate W to be processed is first adsorbed on the chuck (12), and the chuck 12 Made of a porous ceramic material, the feed mechanism 8 drives the table 3 to move in the horizontal direction toward the a direction of the grinding spindle unit 18, and the grinding motor spindle 17 drives the Grinding wheel 15 is rotated in the e direction of the direction of rotation of the grinding wheel, and the motor 26 or the cylinder 39 drives the grinding spindle unit 18 to feed the grinding substrate in the grinding feed direction d.
  • the force measuring device 10 transmits the monitored grinding force to the control system, and controls the grinding force to be equal to a preset value.
  • the grinding spindle unit 18 Grinding and retracting along the grinding vertical rail 23, thereby completing the grinding of the substrate W;
  • the feeding mechanism 8 drives the table 3 to move in the horizontal direction toward the polishing spindle Unit 35
  • the polishing motor spindle 36 drives the throwing wheel 37 to rotate in the h direction of the direction of rotation of the throwing wheel, and the motor 26 or the cylinder 39 drives the polishing spindle unit 35.
  • the polishing spindle unit 35 The blade is raised and retracted along the polished vertical rail 30, and the polishing of the substrate W is completed, the force measuring device 10 The grinding force during the grinding process or the polishing pressure during the polishing process are respectively detected, and the detection data is sent to the control system to ensure that the grinding force or the polishing pressure is equal to the preset pressure; the table 3 is in the Feeding mechanism 8 Under the drive, remove the polishing processing area in the horizontal direction toward the a direction to unload the sheet.
  • the utility model relates to a multifunctional substrate grinding and polishing device, characterized in that the grinding and polishing device adopts a double spindle structure composed of a grinding spindle unit and a polishing spindle unit, and completes a silicon wafer, a glass panel, a ceramic sheet and a sapphire base on one device. Grinding and polishing of substrates such as sheets; multi-functional substrate grinding and polishing apparatus having a rectangular parallelepiped base 1.
  • a pair of horizontal rails 5 are fixed on the upper surface of the base 1, the guide slider 6 is mounted on the horizontal rail 5, the slide plate 7 is fixed with the guide slider 6, and the slide plate 7 is mounted on the table 3
  • the table 3 is fitted to the pair of horizontal rails 5 through the guide slider 6 and the slider 7;
  • the base 9 is mounted on the top of the table 3;
  • the upper surface is provided with an annular force measuring device 10 for measuring the grinding force on-line, and the thickness measuring device 13 is mounted on the table 3;
  • the workpiece motor shaft main 11 installed at the center of the table 3 is placed on the force measuring device.
  • the suction cup 12 is mounted on the top of the workpiece motor spindle 11 and the feed mechanism 8 is connected to the table 3;
  • the column 2 is installed in the middle of the base 1, and a pair of ground vertical guides 23 are fixedly mounted on the front side of the column 2 in the vertical feed direction. c or d
  • the moving grinding spindle unit 18 is mounted on the grinding vertical rail 23; a pair of polished vertical rails 30 moving in the polishing feed direction f and g are fixed to the column 2
  • the polishing spindle unit 35 is mounted on the polishing rail 30; the grinding spindle unit 18 and the polishing spindle unit 35 are connected to each other by a suspension mechanism 25, and the suspension mechanism 25 is passed through the traction rope 28 Fastened to the front support 27 and rear support 29 at the top of the column 2.
  • the grinding spindle unit 18 has a spindle holder 19, and a grinding motor spindle 17 is mounted inside the spindle housing 19, and the grinding spindle is The lower end is equipped with a grinding wheel 15 that rotates in the e direction; the main shaft seat 19 is mounted on the slide 21, and a slide slider 22 is mounted on the slide 21, and the slide 21 passes through the guide slider 22 The fitting is moved on a pair of ground vertical rails 23; the screw mechanism 24 fixed to the back of the slide 21 is connected at the top end to the motor 26; the grinding motor spindle 17 can drive the grinding wheel 15 Rotating in the direction of rotation e of the grinding wheel, the motor 26 can drive the grinding spindle unit 18 to move up and down in the grinding feed direction c or d, and can also drive the polishing spindle unit 35
  • the f and g along the polishing feed direction are lifted up and down to realize the feed control mode of the fixed grinding;
  • the polishing spindle unit 35 has a spindle holder 33, and a polishing motor spindle is mounted inside the spindle holder 33.
  • the lower end of the polishing motor spindle 36 is mounted with a throwing wheel 37 that rotates in the h direction.
  • the spindle seat 33 is mounted on the slide plate 32, and a guide slider 31 is mounted on the slide plate 32, and the slide plate 32 By moving the guide slider 31 to engage on a pair of polished vertical rails 30, the polishing spindle unit 35 is moved upward in the polishing feed direction f or g; the cylinders 39 are mounted in parallel on the polished vertical rails 30.
  • the lower end; the cylinder 39 drives the polishing spindle unit 35 to descend in the direction of the polishing feed g or to rise in the f direction. Under the traction of the traction rope 28, the grinding spindle unit 18 is simultaneously moved along the grinding feed direction. Falling upwards or d
  • the suspension mechanism 25 is fixed by the traction ropes 28 to the front support base 27 and the rear support base 29 at the top of the column 2, respectively.
  • the A41 and pulley B42 are mounted on the front support base 27, the pulley C43 and the pulley D45 are mounted on the rear support base 29, and the pulley E44 and pulley F46 are mounted on the slide plate 32.
  • the traction rope 28 fixed at one end to the slide 21 respectively bypasses the pulley A41, the pulley C43, the pulley E44, the pulley F46, the pulley D45 and the pulley B42 And finally attached to the slide 21; the traction rope 28 connects the grinding spindle unit 18 and the polishing spindle unit 35, so that the grinding spindle unit 18 and the polishing spindle unit are 35 are counterweights to each other, ensuring that the grinding spindle unit 18 and the polishing spindle unit 35 have the same amount of displacement.
  • the remarkable effect of the invention is that the multifunctional substrate grinding and polishing device integrates the grinding machine and the polishing machine, the polishing spindle unit and the grinding spindle unit are pulled by a traction rope, and the grinding spindle unit and the polishing spindle unit are mutually The counterweight, the grinding spindle unit and the polishing spindle unit share a set of motor drive feed mechanism and cylinder feed mechanism.
  • a variety of grinding and polishing methods can be realized.
  • the multi-functional substrate grinding and polishing device of the invention can greatly improve the efficiency of the grinding and polishing process and improve the precision of the substrate, thereby greatly improving the product quality while reducing the production cost.
  • FIG. 1 is a schematic structural view of a multi-functional substrate grinding and polishing apparatus of the present invention
  • FIG. 2 is a schematic diagram of a suspension mechanism of the multi-functional substrate grinding and polishing apparatus of the present invention
  • the grinding and polishing processing method of the multifunctional substrate grinding and polishing equipment of the invention is: when grinding, the substrate is ground W is adsorbed on the suction cup 12, the suction cup 12 is made of a porous ceramic material, and the feed mechanism 8 drives the table 3 to move in the horizontal direction toward the a direction to the grinding spindle unit 18, grinding the motor spindle 17 Drive grinding wheel 15 Rotate in the e direction of the grinding wheel rotation direction, motor 26 or cylinder 39 drives the grinding spindle unit 18 along the grinding feed direction d Feed the grinding substrate W upwards, the force measuring device 10 The monitored grinding force is transmitted to the control system, and the grinding force is controlled to be equal to the preset value.
  • the grinding spindle unit 18 grinds the vertical rail 23 Rising and retracting, the grinding of the substrate W is completed from now on; the feed mechanism 8 drives the table 3 to move horizontally in the a direction to the lower side of the polishing spindle unit 35, polishing the motor spindle 36 to drive the throwing wheel 37 Rotating in the h direction of the direction of rotation of the throwing wheel, the motor 26 or the cylinder 39 drives the polishing spindle unit 35.
  • the polishing feed direction g the grinding substrate W is fed upward, the force measuring device 10
  • the monitored polishing pressure is transmitted to the control system, and the polishing pressure is controlled to be equal to the preset value.
  • the polishing spindle unit 35 is raised and retracted along the polishing vertical rail 30, and the polishing of the substrate W is completed, and the force measuring device is completed. 10 Detect the grinding force during the grinding process or the polishing pressure during the polishing process, and send the test data to the control system to ensure that the grinding force or polishing pressure is equal to the preset pressure; the table 3 is at the feed mechanism 8 Under the drive, remove the polishing processing area in the horizontal direction toward the a direction, as shown in Figure 1.
  • the multi-functional substrate grinding and polishing apparatus has a rectangular parallelepiped base 1 on which a pair of horizontal guide rails extending in the front-rear direction are fixed on the base 1
  • the table 3 carrying the substrate W is mounted on the horizontal rail 5, and the table 3 can be moved along a or b.
  • the center of the base 1 is erected with a column 2 and a pair of ground vertical guides 23 Fixed on the front side of the column 2, the grinding spindle unit 18 is mounted on the grinding vertical rail 23, and the grinding spindle unit 18 for grinding can be moved in the grinding feed direction c or d Move to.
  • a pair of polished vertical rails 30 are attached to the rear side of the column 2, and a polished spindle unit 35 for polishing is mounted on the polished vertical rail 30, and the polishing spindle unit 35 can be oriented along the polishing feed direction f And g move, as shown in Figure 2.
  • the grinding spindle unit 18 and the polishing spindle unit 35 are connected to each other by a suspension mechanism 25, and the suspension mechanism 25 is fixed to the column by the traction rope 28
  • the above-mentioned roping method is only one of the solutions. The patent is not limited to this solution, and the above-mentioned slide 21 and slide 32 can also be used. Interchange plan.
  • the table 3 is moved in the horizontal direction by the feed mechanism 8, and the feed mechanism 8 It can be a linear module or a linear motor or a 'servo motor + screw pair' structure.
  • the table 3 is moved forward in the horizontal direction toward the a direction or backward in the b direction while being driven by the feed mechanism 8.
  • an annular force measuring device 10 for measuring the grinding force on the line is mounted on the upper surface of the base 9, and the force measuring device 10
  • the grinding force during the grinding process or the polishing pressure during the polishing process is respectively detected, and the detection data is sent to the control system to ensure that the grinding force or the polishing pressure is equal to the preset pressure;
  • a workpiece main motor shaft 11 that is rotatable inside and in a horizontal plane, a suction cup 12 formed of a porous ceramic material and formed into a disk shape at the upper end of the main motor shaft 11, and the processed substrate W is placed on the suction cup 12 Above, the suction cup 12 is driven by the main motor shaft 11 in the i direction of the direction in which the chuck rotates.
  • the thickness of the substrate W is ground to a predetermined thickness.
  • Thickness measuring device 13 The height of the substrate W held on the chuck 12 is detected, and the detection data is sent to the control system, and when the grinding thickness reaches the preset thickness, the machining feed is stopped.
  • the above-described grinding spindle unit 18 has a spindle holder 19 in which a grinding spindle is mounted. 17 .
  • Grinding spindle 17 The lower end is equipped with a freely rotatable grinding wheel 15 .
  • the grinding wheel rotates in the direction of 16 and rotates in the e direction.
  • the spindle seat 19 is mounted on the slide 21 .
  • a guide slider 22 is provided thereon, by movably fitting the guide slider 22 to a pair of guide rails 23, grinding the spindle unit 18 along the grinding feed direction 20 at c or d Move in the direction.
  • the grinding spindle unit 18 has a motor 26 for driving the grinding wheel 15 for grinding, the motor 26 drives a screw module 24 parallel to the guide rail 23, the grinding spindle unit 18 is in the motor 26 During the forward rotation, the d direction in the grinding feed direction 20 is lowered. Under the traction of the traction rope 28, the polishing spindle unit 36 is simultaneously raised in the f direction in the polishing feed direction 34; in the motor 26 Grinding the spindle unit 18 during reverse rotation rises in the c direction in the grinding feed direction 20, and the polishing spindle unit 36 simultaneously descends in the g direction in the polishing feed direction 34.
  • the above-described polishing spindle unit 35 has a spindle holder 33, and a polishing spindle is mounted inside the spindle holder 33. 36.
  • the lower end of the polishing spindle 36 is provided with a freely rotatable throwing wheel 37.
  • the direction of rotation of the throwing wheel 38 is rotated in the h direction, and the spindle seat 33 is mounted on the slide plate 32.
  • a guide slider 31 is provided, by which the guide slider 31 is movably fitted on a pair of guide rails 30, and the spindle unit 35 is polished in the polishing feed direction 34 at f or g Move in the direction.
  • the polishing spindle unit 35 has a cylinder 39 that drives the polishing wheel 37 to be polished and is parallel to the guide rail 30.
  • the polishing spindle unit 35 is in the cylinder 39 When the upper chamber passes through the compressed air, it descends along the g direction in the polishing feed direction 34. Under the traction of the traction rope 28, the grinding spindle unit 18 simultaneously rises along the c direction in the grinding feed direction 20; 39 When the lower chamber passes through the compressed air, it rises in the f direction in the polishing feed direction 34, and the grinding spindle unit 18 simultaneously descends in the d direction in the grinding feed direction 20.
  • the wafer-shaped substrate is processed by an axial plunge-type grinding and polishing method, as shown in Fig. 4.
  • the substrate W is rotated in the direction of rotation of the chuck.
  • the grinding spindle unit 18 feeds in the d direction of the grinding feed direction when the motor 26 is rotating forward, and as a result, the substrate W on the suction cup 12 Implement traditional fixed-length grinding. Or the grinding spindle unit 18 feeds in the d direction of the grinding feed direction when the lower chamber of the cylinder 39 passes the compressed air, and as a result, the substrate W on the suction cup 12 The control force grinding process is performed.
  • the thickness measuring device 13 detects that the thickness of the substrate W reaches the preset thickness, the grinding spindle unit 18 moves along the grinding feed direction when the motor 26 is reversed. Retreat to the rise.
  • the table 3 is moved in the horizontal direction toward the b-arrow direction under the driving of the feed mechanism 8 to the lower side of the polishing spindle unit 35 to press the wafer-shaped substrate W.
  • the center is located at the outer edge of the throwing wheel 37, keeping the table 3 fixed in the horizontal direction.
  • the substrate W is rotated in the direction of the suction cup i.
  • Polished spindle unit The throwing wheel 37 of 35 rotates in the direction of rotation h.
  • the polishing spindle unit 35 feeds down g in the polishing feed direction when the motor 26 is reversed, and as a result, the substrate W on the chuck 12 Implement traditional fixed-length polishing.
  • the polishing spindle unit 35 feeds down the g in the polishing feed direction when the cavity in the cylinder 39 passes the compressed air, and as a result, the substrate W on the suction cup 12 Implement control force polishing.
  • the table 3 is unloaded in the horizontal direction toward the a direction by the feed mechanism 8 to be unloaded.
  • the square chip substrate is processed by a radial plunge grinding and polishing method, as shown in Fig. 4.
  • Grinding the grinding wheel 15 of the spindle unit 18 in the direction of rotation e rotates.
  • the grinding spindle unit 18 feeds down the d in the grinding feed direction when the motor 26 is rotating forward, keeping the grinding spindle unit 18 fixed in the grinding feed direction, the table 3 Driven by the feed mechanism 8 in the horizontal direction toward the b direction until the edge of the substrate W contacts the outer edge of the grinding wheel 15 to start grinding, and continues to move in the horizontal direction toward the b direction until the edge of the substrate W is separated from the grinding wheel.
  • the outer edge of 15 is finished grinding, and the table 3 is moved in the horizontal direction toward the a direction by the feed mechanism 8, and returns to the initial position of the grinding, and the thickness measuring device 13 measures the substrate W.
  • the thickness of the first round is completed; then, the grinding spindle unit 18 continues to feed a certain amount of removal in the d direction of the grinding feed direction while the motor 26 is rotating forward, maintaining the grinding spindle unit 18 The position is fixed in the grinding feed direction for the second round of grinding, and so on until the substrate W is ground to the preset grinding thickness.
  • the table 3 is at the feed mechanism 8
  • the drive is moved forward in the horizontal direction toward the b toward the lower side of the polishing spindle unit 35, so that the center of the wafer-like substrate W is located at the outer edge of the throwing wheel 37, keeping the table 3 in the horizontal direction a and b.
  • the front and rear swings in the direction, and the substrate W is rotated in the i direction of the rotation direction of the suction cup under the driving of the main motor shaft 11 of the workpiece; the throwing wheel 37 of the spindle unit 35 is polished to rotate in the direction of the throwing wheel h Direction rotation.
  • the polishing spindle unit 35 feeds down in the g direction of the polishing feed direction when the motor 26 is reversed, and as a result, the substrate W on the chuck 12 Implement traditional fixed-length polishing.
  • the polishing spindle unit 35 feeds downward in the polishing feed direction when the upper chamber of the cylinder 39 is compressed air, and as a result, the substrate W on the suction cup 12 Implement control force polishing.
  • the table 3 is unloaded in the horizontal direction toward the a direction by the feed mechanism 8 to be unloaded.
  • the edge grinding and polishing method is used, as shown in Fig. 5.
  • edge grinding or edge polishing can be achieved. 40
  • the diameter of the small diameter grinding wheel or the throwing wheel is slightly smaller than the radius of the substrate W.
  • the substrate W to be processed is placed on the chuck 12, and the table 3 is driven horizontally toward the b by the feed mechanism 8.
  • the substrate W is rotated in the i direction of the direction in which the chuck rotates.
  • Grinded substrate W An annular side is left unground on the outer circumference for increasing the strength of the substrate W.
  • the table 3 is moved forward by the feed mechanism 8 toward the horizontal direction toward the polishing spindle unit 35. Below the bottom, so that the outer edge of the throwing wheel 37 passes through the center of the wafer-shaped substrate W, keeping the table 3 fixed in the horizontal direction.
  • Drive the substrate W under the drive of the workpiece main motor shaft 11 Rotate in the i direction of the direction of rotation of the suction cup.
  • the throwing wheel 37 of the spindle unit 35 is polished to rotate in the h direction of the throwing wheel; at the same time, the spindle unit 35 is polished in the motor 26
  • the g in the polishing feed direction is fed downward, and as a result, the conventional wafer polishing process is performed on the substrate W on the chuck 12.
  • polishing the spindle unit 35 in the cylinder 39 When the upper chamber passes through the compressed air, the g is fed downward in the polishing feed direction, and as a result, the substrate W on the chuck 12 is subjected to a control force polishing process. Polished substrate W An annular side is left unpolished on the outer circumference for increasing the strength of the substrate W.
  • the table 3 is driven horizontally by the feed mechanism 8 toward a The direction of the arrow moves out of the polishing zone for unloading.
  • the invention also has various forms of embodiments, and various grinding and polishing methods can be realized.
  • the multi-functional substrate grinding and polishing equipment of the invention can greatly improve the efficiency of the grinding and polishing process and the processing precision of the substrate, reduce the production cost, and greatly improve the product quality.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)

Abstract

一种基片磨抛装置及其磨抛方法，属于平面基片的超精密加工技术领域，用于硅片、蓝宝石基片和玻璃基板等硬脆材料的磨抛平整化加工及减薄加工。基片磨抛方法采用三种方式：轴向切入式磨抛、径向切入式磨削和留边磨抛方法。磨抛装置采用由磨削主轴单元（18）和抛光主轴单元（35）组成的双主轴结构，在一台装置上完成基片的磨削和抛光加工；磨削主轴单元和抛光主轴单元通过一根牵引绳（28）牵引，互为配重。磨抛装置将磨削机和抛光机集成于一体，基片只需一次性装夹，即可完成磨削和抛光两道工序加工，提高基片磨抛加工精度和磨抛加工自动化，降低碎片率，提高了生产效率。

Description

一种多功能的基片磨抛装置及其磨抛方法
技术领域
本发明属于平面基片的超精密加工技术领域，具体涉及一种用于硅片、蓝宝石基片和玻璃基板等硬脆材料平面基片的磨抛平整化加工及减薄加工，也可用于陶瓷、金属和复合材料等平面薄板的磨削和抛光加工。
背景技术
硅片、蓝宝石基片、玻璃面板和陶瓷片等平面薄片状基片的超精密表面加工及超精密减薄加工，通常经过磨削、研磨和抛光等加工工序，分别由磨削、研磨机床和抛光机床独立完成，磨削、研磨机床用于基片的表面平整化加工，使基片达到预定厚度，获得高平整度高质量的表面，抛光机床用于基片的表面抛光，去除基片的磨削、研磨表面损伤层，使基片达到无损伤超光滑表面。目前，基片的减薄加工通常要求基片减薄厚度达到 30~100µm 以下使基片重量轻和紧密，。通常此时基片经过磨削减薄到预定厚度时，从磨削机床上卸下，再装夹到抛光机上进行抛光加工，在从磨削到抛光的转换的过程中，由于基片表面磨削应力会造成基片的变形，使基片在磨削和抛光工序间传送以及在抛光机上再装夹过程中非常容易破碎，而且采用两个机床分别进行磨削和抛光加工，设备投资大，生产效率比较低。目前市场上常见的基片磨削和抛磨削光机床通常为专用磨削加工设备，如对于圆片状硅片，主要用硅片超精密磨床进行平整化加工和减薄加工，再用平面抛光机床进行表面抛光；对于方片状的玻璃面板，主要用专用平面研磨机床进行平整化加工和减薄加工，再用平面抛光机床进行表面抛光。这些现有的磨削和抛光机床往往不适用于多种基片的不同使用要求 。
发明内容
本发明要解决的技术难题是克服上述现有的磨削和抛光机床及加工方法的不足，发明了一种多功能的基片磨抛装置及其磨抛方法。该多功能基片磨抛装置采用双主轴结构，在一台设备上完成硅片、玻璃面板、陶瓷片、蓝宝石基片等基片的磨削和抛光加工，即经过磨削后，基片不需卸片，从磨削工位直接进入抛光工位进行基片抛光加工，可实现基片的轴向切入式磨抛、径向切入式磨抛、径向往复式磨抛和留边磨抛等多种磨抛方法。磨削主轴单元和抛光主轴单元互为配重，共用一套电机驱动进给机构和气缸进给机构，基片在磨削或抛光过程中可实现定程磨削和控制力磨削两种进给控制方式。
本发明采用的技术方案是一种多功能的基片磨抛装置及其磨抛方法，其 磨抛方法采用三种方式： 1 ） 当采用轴向切入式磨抛方法加工圆片状基片时，将被加工基片 W 置于吸盘 12 上，工作台 3 在进给机构 8 的驱动下沿水平方向朝 b 箭头方向前移至磨削主轴单元 18 的下方，将圆片状基片 W 的中心位于磨轮 15 的外边缘处，保持工作台 3 在水平方向上位置固定； 2 ）当采用径向切入式磨抛方法加工方片状基片时，磨削主轴单元 18 的磨轮 15 转动方向为 e 向旋转；同时，磨削主轴单元 18 在电机 26 正转时沿磨削进给方向的 d 向下进给，保持磨削主轴单元 18 在磨削进给方向上位置固定； 3 ）当采用小直径磨轮或抛轮时，采用留边磨抛方法实现留边磨削或留边抛光，小直径磨轮或抛轮的直径略小于被加工基片 W 的半径，将被加工基片 W 载置于吸盘 12 上；
当采用上述方法中任意一种方式磨削时，先将被加工基片 W 吸附在所述的吸盘（ 12 ）上，所述的吸盘 12 由多孔陶瓷材料制成圆盘状，进给机构 8 驱动所述的工作台 3 沿水平方向朝 a 向移至所述的磨削主轴单元 18 下方，所述的磨削电机主轴 17 驱动所述的磨轮 15 沿磨轮转动方向的 e 方向转动，所述的电机 26 或所述的气缸 39 驱动所述的磨削主轴单元 18 沿磨削进给方向 d 向上进给磨削基片 W ，所述的测力装置 10 将监测的磨削力传输给控制系统，控制磨削力等于预设值，当所述的测厚装置 13 检测到基片 W 达到预设的厚度后，所述的磨削主轴单元 18 沿所述的磨削垂直导轨 23 上升退刀，自此完成基片 W 的磨削；所述的进给机构 8 驱动所述的工作台 3 沿水平方向朝 a 向移至所述的抛光主轴单元 35 下方，所述的抛光电机主轴 36 驱动所述的抛轮 37 沿抛轮转动方向的 h 方向转动，所述的电机 26 或所述的气缸 39 驱动所述的抛光主轴单元 35 沿抛光进给方向 g 向上进给磨削基片 W ，所述的测力装置 10 将监测的抛光压力传输给控制系统，控制抛光压力等于预设值，抛光结束后，所述的抛光主轴单元 35 沿所述的抛光垂直导轨 30 上升退刀，自此完成基片 W 的抛光，所述的测力装置 10 分别检测出磨削过程中的磨削力或抛光过程中的抛光压力，并将检测数据向控制系统输送，保证磨削力或抛光压力等于预设压力；所述的工作台 3 在所述的进给机构 8 的驱动下沿水平方向朝 a 向移出抛光加工区进行卸片。
一种多功能基片磨抛装置，其特征在于，磨抛装置采用由磨削主轴单元和抛光主轴单元组成的双主轴结构，在一台装置上完成硅片、玻璃面板、陶瓷片、蓝宝石基片等基片的磨削和抛光加工；多功能基片磨抛装置具有长方体状的基座 1 ，在基座 1 的上面固定着一对水平导轨 5 ，导引滑块 6 装在水平导轨 5 上，滑板 7 与导引滑块 6 固结，滑板 7 安在工作台 3 的下面，即通过导引滑块 6 和滑板 7 将工作台 3 嵌合在一对水平导轨 5 上；底座 9 安装在工作台 3 的上面；在底座 9 的上表面安装有用于在线测量磨削力的圆环状的测力装置 10 ，测厚装置 13 安装在工作台 3 上；安装在工作台 3 中心的工件电机轴主 11 是套在测力装置 10 的内部，吸盘 12 安装在工件电机主轴 11 顶部，进给机构 8 与工作台 3 连接；
立柱 2 安装在基座 1 的中部，在立柱 2 的前侧面固定安装有一对磨削垂直导轨 23 ，沿垂直进给方向 c 或 d 向移动的磨削主轴单元 18 安装在磨削垂直导轨 23 上；沿抛光进给方向 f 和 g 向移动的一对抛光垂直导轨 30 固定在立柱 2 的后侧面，抛光主轴单元 35 安装在抛光导轨 30 上；磨削主轴单元 18 和抛光主轴单元 35 通过悬挂机构 25 相互连接，悬挂机构 25 通过牵引绳 28 固定在立柱 2 顶部的前支撑座 27 和后支撑座 29 上。
所述的磨削主轴单元 18 具有主轴座 19 ，在主轴座 19 的内部安装有磨削电机主轴 17 ，磨削主轴 17 下端安装有沿 e 方向转动的磨轮 15 ；主轴座 19 安装在溜板 21 上，在溜板 21 上装有导引滑块 22 ，溜板 21 通过导引滑块 22 嵌合在一对磨削垂直导轨 23 上做移动；固定于溜板 21 背面的丝杠机构 24 在顶端和电机 26 相连接；所述磨削电机主轴 17 可驱动所述磨轮 15 沿磨轮转动方向 e 方向转动，所述电机 26 可驱动磨削主轴单元 18 沿磨削进给方向 c 或 d 向进行升降运动，同时也可以驱动所述抛光主轴单元 35 沿抛光进给方向的 f 和 g 向上进行升降运动，从而实现定程磨削的进给控制方式；
所述的抛光主轴单元 35 具有主轴座 33 ，在主轴座 33 的内部安装有抛光电机主轴 36 ，抛光电机主轴 36 下端安装有沿 h 方向转动的抛轮 37 ，主轴座 33 安装在溜板 32 上，在溜板上 32 装有导引滑块 31 ，溜板上 32 通过导引滑块 31 嵌合在一对抛光垂直导轨 30 上做移动，抛光主轴单元 35 沿抛光进给方向 f 或 g 向上移动；气缸 39 平行安装在抛光垂直导轨 30 得下端；气缸 39 带动抛光主轴单元 35 沿抛光进给方向的 g 向下降或 f 向上升，在牵引绳 28 的牵引下，磨削主轴单元 18 同时沿磨削进给方向的 c 向上升或 d 向下降；
所述的悬挂机构 25 由牵引绳 28 分别固定在立柱 2 顶部的前支撑座 27 和后支撑座 29 上，滑轮 A41 和滑轮 B42 安装在前支撑座 27 上，滑轮 C43 和滑轮 D45 安装在后支撑座 29 上，滑轮 E44 和滑轮 F46 安装在溜板 32 侧面；一端固定在溜板 21 上的牵引绳 28 分别绕过滑轮 A41 、滑轮 C43 、滑轮 E44 、滑轮 F46 、滑轮 D45 和滑轮 B42 ，最后固定在溜板 21 上；牵引绳 28 将所述的磨削主轴单元 18 和所述的抛光主轴单元 35 相连，从而使所述的磨削主轴单元 18 和所述的抛光主轴单元 35 彼此为配重，保证所述的磨削主轴单元 18 和所述的抛光主轴单元 35 具有相同的位移量。
本发明的显著效果是多功能基片磨抛设备通过将磨削机和抛光机集成于一体，抛光主轴单元与磨削主轴单元通过一根牵引绳牵引，磨削主轴单元和抛光主轴单元互为配重，磨削主轴单元和抛光主轴单元共用一套电机驱动进给机构和气缸进给机构， 可实现多种磨抛加工方式 。采用本发明的多功能基片磨抛设备可大大提高磨抛加工的效率，提高基片的精度，从而能够在降低生产成本的同时大幅提高产品质量。
附图说明
图 1 本发明多功能基片磨抛设备的结构示意图，图 2 本发明多功能基片磨抛设备的悬挂机构示意图，图 3 本发明多功能基片磨抛设备的剖视图，图 4 第一种和第二种实施例所述的磨抛方法，图 5 第三种实施例所述的磨抛方法。图中： 1 基座， 2 立柱， 3 工作台， 5 水平导轨， 6 滑块， 7 滑板， 8 进给机构， 9 底座， 10 测力装置， 11 工件电机主轴， 12 吸盘， 13 测厚装置， 15 磨轮， 17 磨削电机主轴， 18 磨削主轴单元， 19 主轴座， 21 溜板， 22 滑块， 23 磨削垂直导轨， 24 丝杠模块， 25 悬挂机构， 26 电机， 27 前支撑座， 28 牵引绳， 29 后支撑座， 30 抛光垂直导轨， 31 滑块， 32 溜板， 33 主轴座， 35 抛光主轴单元， 36 抛光电机主轴， 37 抛轮， 39 气缸， 40 小直径磨轮或抛轮， 41 滑轮 A ， 42 滑轮 B ， 43 滑轮 C ， 44 滑轮 E ， 45 滑轮 D ， 46 滑轮 F ， W 基片。
具体实施方式
以下结合附图和技术方案详细说明本发明的具体实施。本发明中多功能基片磨抛设备的磨抛加工方法为：磨削时，将基片 W 吸附在吸盘 12 上，吸盘 12 由多孔陶瓷材料制成圆盘状，进给机构 8 驱动工作台 3 沿水平方向朝 a 向移至磨削主轴单元 18 下方，磨削电机主轴 17 驱动磨轮 15 沿磨轮转动方向的 e 方向转动，电机 26 或气缸 39 驱动磨削主轴单元 18 沿磨削进给方向 d 向上进给磨削基片 W ，测力装置 10 将监测的磨削力传输给控制系统，控制磨削力等于预设值，当测厚装置 13 检测到基片 W 达到预设的厚度后，磨削主轴单元 18 沿磨削垂直导轨 23 上升退刀，自此完成基片 W 的磨削；进给机构 8 驱动工作台 3 沿水平方向朝 a 向移至抛光主轴单元 35 下方，抛光电机主轴 36 驱动抛轮 37 沿抛轮转动方向的 h 方向转动，电机 26 或气缸 39 驱动抛光主轴单元 35 沿抛光进给方向 g 向上进给磨削基片 W ，测力装置 10 将监测的抛光压力传输给控制系统，控制抛光压力等于预设值，抛光结束后，抛光主轴单元 35 沿抛光垂直导轨 30 上升退刀，自此完成基片 W 的抛光，测力装置 10 分别检测出磨削过程中的磨削力或抛光过程中的抛光压力，并将检测数据向控制系统输送，保证磨削力或抛光压力等于预设压力；工作台 3 在进给机构 8 的驱动下沿水平方向朝 a 向移出抛光加工区进行卸片，见图 1 。
多功能基片磨抛设备具有长方体状的基座 1 ，在基座 1 的上面固定着沿前后方向延伸的一对水平导轨 5 ，承载基片 W 的工作台 3 安装在水平导轨 5 上，工作台 3 可以沿 a 或 b 向移动。基座 1 的中部直立设置着立柱 2 ，一对磨削垂直导轨 23 固定在立柱 2 的前侧面，磨削主轴单元 18 安在磨削垂直导轨 23 上，用于磨削的磨削主轴单元 18 可以沿磨削进给方向 c 或 d 向移动。一对抛光垂直导轨 30 固定在立柱 2 的后侧面，用于抛光的抛光主轴单元 35 安在抛光垂直导轨 30 上，抛光主轴单元 35 可以沿抛光进给方向 f 和 g 向移动，见图 2 。磨削主轴单元 18 和抛光主轴单元 35 通过悬挂机构 25 相互连接，悬挂机构 25 由牵引绳 28 ，固定于立柱 2 顶部的前支撑座 27 和后支撑座 29 ，以及安在前支撑座 27 上的滑轮 A41 和滑轮 B42 ，配置于后支撑座 29 上的滑轮 C43 和滑轮 D45 以及配置于溜板 32 侧面的滑轮 E44 和滑轮 F46 。一端固定于溜板 21 左上的牵引绳 28 分别绕过滑轮 A41 、滑轮 C43 、滑轮 E44 、滑轮 F46 、滑轮 D45 和滑轮 B42 ，最后固定于溜板 21 右上。采用一根牵引绳 28 牵引，可保证溜板 21 和溜板 32 的两侧受到相同的牵引力，以免增加倾覆力矩。当然，上述的绕绳方式仅是其中一个方案，本专利并不局限于该方案，亦可将上述的溜板 21 和溜板 32 互换方案。
结合图 1 和图 3 ，工作台 3 通过进给机构 8 驱动在水平方向上移动，进给机构 8 可为线性模组或直线电机或'伺服电机 + 丝杠副'的结构。该工作台 3 在进给机构 8 的驱动下时沿水平方向朝 a 向为前移或者朝 b 向为后退。工作台 3 具有底座 9 ，在底座 9 的上表面安装有用于在线测量磨削力的圆环状的测力装置 10 ，测力装置 10 分别检测出磨削过程中的磨削力或抛光过程中的抛光压力，并将检测数据向控制系统输送，保证磨削力或抛光压力等于预设压力；套在测力装置 10 的内部且在水平面内能够旋转的工件主电机轴 11 ，装配于主电机轴 11 上端的由多孔陶瓷材料形成为圆盘状的吸盘 12 ，将被加工基片 W 放在吸盘 12 的上面，吸盘 12 在主电机轴 11 的驱动下沿吸盘转动方向的 i 向旋转。在上述的磨削和抛光加工中，将基片 W 的厚度磨削至预设的厚度。测厚装置 13 检测出定位于吸盘 12 上保持的基片 W 的高度，并将检测数据向控制系统输送，当磨削厚度达到预设厚度时，停止加工进给。
结合图 1 和图 3 ，上述的磨削主轴单元 18 具有主轴座 19 ，在主轴座 19 的内部安装有磨削主轴 17 ，磨削主轴 17 下端安装有可自由回转的磨轮 15 ，磨轮转动方向 16 沿 e 方向转动，主轴座 19 安装于溜板 21 上。在溜板 21 上设有导引滑块 22 ，通过将该导引滑块 22 可移动地嵌合在一对导轨 23 上，磨削主轴单元 18 沿磨削进给方向 20 在 c 或 d 方向上移动。磨削主轴单元 18 具有驱动磨轮 15 进行磨削的电机 26 ，电机 26 驱动与导轨 23 平行的丝杠模块 24 ，该磨削主轴单元 18 在电机 26 正转时沿磨削进给方向 20 中的 d 向下降，在牵引绳 28 的牵引下，抛光主轴单元 36 同时沿抛光进给方向 34 中的 f 向上升；在电机 26 反转时磨削主轴单元 18 沿磨削进给方向 20 中的 c 向上升，抛光主轴单元 36 同时沿抛光进给方向 34 中的 g 向下降。
结合图 1 和图 3 ，上述的抛光主轴单元 35 具有主轴座 33 ，在主轴座 33 的内部安装有抛光主轴 36 ，抛光主轴 36 下端安装有可自由回转的抛轮 37 ，抛轮转动方向 38 沿 h 方向转动，主轴座 33 安装于溜板 32 上。在溜板上 32 设有导引滑块 31 ，通过将该导引滑块 31 可移动地嵌合在一对导轨 30 上，抛光主轴单元 35 沿抛光进给方向 34 在 f 或 g 方向上移动。抛光主轴单元 35 具有驱动抛轮 37 进行抛光的且与导轨 30 平行的气缸 39 。该抛光主轴单元 35 在气缸 39 上腔体通压缩空气时沿抛光进给方向 34 中的 g 向下降，在牵引绳 28 的牵引下，磨削主轴单元 18 同时沿磨削进给方向 20 中的 c 向上升；在气缸 39 下腔体通压缩空气时沿抛光进给方向 34 中的 f 向上升，磨削主轴单元 18 同时沿磨削进给方向 20 中的 d 向下降。
实施例一，采用轴向切入式磨抛方法加工圆片状基片，见图 4 。将被加工基片 W 置于吸盘 12 上，工作台 3 在进给机构 8 的驱动下沿水平方向朝 b 箭头方向前移至磨削主轴单元 18 的下方，将圆片状基片 W 的中心位于磨轮 15 的外边缘处，保持工作台 3 在水平方向上位置固定。在工件主轴 11 的驱动下，使基片 W 沿吸盘转动方向 i 向旋转。磨削主轴单元 18 的磨轮 15 沿磨轮转动方向 1 e 向旋转；同时，磨削主轴单元 18 在电机 26 正转时沿磨削进给方向的 d 向进给，其结果是，对吸盘 12 上的基片 W 实施传统的定程磨削加工。或者磨削主轴单元 18 在气缸 39 下腔体通压缩空气时时沿磨削进给方向的 d 向进给，其结果是，对吸盘 12 上的基片 W 实施控制力磨削加工，当测厚装置 13 检测到基片 W 的厚度到达预设的厚度后，磨削主轴单元 18 在电机 26 反转时沿磨削进给方向的 c 向上升退刀。磨削加工完毕之后，工作台 3 在进给机构 8 的驱动下沿水平方向朝 b 箭头方向前移至抛光主轴单元 35 的下方，以将圆片状基片 W 的中心位于抛轮 37 的外边缘处，保持工作台 3 在水平方向上位置固定。在工件主电机轴 11 的驱动下，使基片 W 沿吸盘转动方向 i 方向旋转。抛光主轴单元 35 的抛轮 37 沿转动方向 h 向旋转。同时，抛光主轴单元 35 在电机 26 反转时沿抛光进给方向的 g 向下进给，其结果是，对吸盘 12 上的基片 W 实施传统的定程抛光加工。或者抛光主轴单元 35 在气缸 39 上腔体通压缩空气时时沿抛光进给方向的 g 向下进给，其结果是，对吸盘 12 上的基片 W 实施控制力抛光加工。抛光加工完毕之后，工作台 3 在进给机构 8 的驱动下沿水平方向朝 a 向移出抛光加工区进行卸片。
实施例二，采用径向切入式磨抛方法加工方片状基片，见图 4 。磨削主轴单元 18 的磨轮 15 转动方向为 e 向旋转。同时，磨削主轴单元 18 在电机 26 正转时沿磨削进给方向的 d 向下进给，保持磨削主轴单元 18 在磨削进给方向上位置固定，工作台 3 在进给机构 8 的驱动下沿水平方向朝 b 向移动，直至基片 W 边缘接触磨轮 15 的外边缘开始磨削，继续沿水平方向朝 b 向移动，直至基片 W 边缘脱离磨轮 15 的外边缘结束磨削，工作台 3 在进给机构 8 的驱动下沿水平方向朝 a 向移动，返回磨削初始位置，测厚装置 13 测量基片 W 的厚度，完成第一回合的磨削加工；然后，磨削主轴单元 18 在电机 26 正转时沿磨削进给方向的 d 向继续进给一定去除量，保持磨削主轴单元 18 在磨削进给方向上位置固定，进行第二回合的磨削加工，以此类推，直至基片 W 磨削到预设的磨削厚度。磨削加工完毕之后，工作台 3 在进给机构 8 的驱动下沿水平方向朝 b 向向前移至抛光主轴单元 35 的下方，以将圆片状基片 W 的中心位于抛轮 37 的外边缘处，保持工作台 3 在水平方向沿 a 和 b 方向上前后摆动，在工件主电机轴 11 的驱动下，使基片 W 沿吸盘转动方向的 i 向旋转；抛光主轴单元 35 的抛轮 37 以便沿抛轮转动方向 h 方向旋转。同时，抛光主轴单元 35 在电机 26 反转时沿抛光进给方向的 g 向向下降进给，其结果是，对吸盘 12 上的基片 W 实施传统的定程抛光加工。或者抛光主轴单元 35 在气缸 39 上腔体通压缩空气时时沿抛光进给方向的 g 向向下进给，其结果是，对吸盘 12 上的基片 W 实施控制力抛光加工。抛光加工完毕之后，工作台 3 在进给机构 8 的驱动下沿水平方向朝 a 向移出抛光加工区进行卸片。
实施例三，采用留边磨抛方法加工，见图 5 。当采用小直径磨轮或抛轮 40 时，可以实现留边磨削或留边抛光， 40 小直径磨轮或抛轮的直径略小于基片 W 的半径。将被加工基片 W 载置于吸盘 12 上，工作台 3 在进给机构 8 的驱动下沿水平方向朝 b 向前移至磨削主轴单元 18 的下方，以使磨轮 15 的外边缘通过圆片状基片 W 的中心处，保持工作台 3 在水平方向上位置固定。在工件主电机轴 11 的驱动下，使基片 W 沿吸盘转动方向的 i 向旋转。磨削主轴单元 18 的磨轮 15 以便沿磨轮转动方向 e 向旋转；同时，磨削主轴单元 18 在电机 26 正转时沿磨削进给方向的 d 向下进给，其结果是，对吸盘 12 上的基片 W 实施传统的定程磨削加工。或者磨削主轴单元 18 在气缸 39 下腔体通压缩空气时时沿磨削进给方向的 d 向向下进给，其结果是，对吸盘 12 上的基片 W 实施控制力磨削加工，当测厚装置 13 检测到基片 W 的厚度到达预设的厚度后，磨削主轴单元 18 在电机 26 反转时沿磨削进给方向的 c 向上升退刀。磨削后的基片 W 在外圆周上保留有环形的边未磨削，用于提高基片 W 的强度。磨削加工完毕之后，工作台 3 在进给机构 8 的驱动下沿水平方向朝 b 向前移至抛光主轴单元 35 的下方，以使抛轮 37 的外边缘通过圆片状基片 W 的中心处，保持工作台 3 在水平方向上位置固定。在工件主电机轴 11 的驱动下，使基片 W 沿吸盘转动方向的 i 方向旋转。抛光主轴单元 35 的抛轮 37 以便沿抛轮转动方向 h 向旋转；同时，抛光主轴单元 35 在电机 26 反转时沿抛光进给方向的 g 向向下进给，其结果是，对吸盘 12 上的基片 W 实施传统的定程抛光加工。或者抛光主轴单元 35 在气缸 39 上腔体通压缩空气时时沿抛光进给方向的 g 向下进给，其结果是，对吸盘 12 上的基片 W 实施控制力抛光加工。抛光后的基片 W 在外圆周上保留有环形的边未抛光，用于提高基片 W 的强度。抛光加工完毕之后，工作台 3 在进给机构 8 的驱动下沿水平方向朝 a 箭头方向移出抛光加工区进行卸片。
本发明还具有多种形式的实施例，都 可实现多种磨、抛加工方式 。采用本发明的多功能基片磨抛设备可大大提高磨抛加工的效率和基片的加工精度，降低生产成本，大幅度的提高产品质量。

Claims (1)

1 、 一种 多功能的基片磨抛 方法， 其特征是， 基片磨抛方法采用三种方式： 1 ） 当采用轴向切入式磨抛方法加工圆片状基片时，将被加工基片 W 置于吸盘（ 12 ）上，工作台（ 3 ）在进给机构（ 8 ）的驱动下沿水平方向朝（ b ）箭头方向前移至磨削主轴单元（ 18 ）的下方，将圆片状基片（ W ）的中心位于磨轮（ 15 ）的外边缘处，保持工作台（ 3 ）在水平方向上位置固定；
2 ）当采用径向切入式磨抛方法加工方片状基片时，磨削主轴单元（ 18 ）的磨轮（ 15 ）转动方向为（ e ）向旋转；同时，磨削主轴单元（ 18 ）在电机（ 26 ）正转时沿磨削进给方向的（ d ）向下进给，保持磨削主轴单元（ 18 ）在磨削进给方向上位置固定；
3 ）当采用小直径磨轮或抛轮时，采用留边磨抛方法实现留边磨削或留边抛光，小直径磨轮或抛轮的直径略小于被加工基片（ W ）的半径，将被加工基片（ W ）置于吸盘（ 12 ）上；
当采用上述方法中任意一种方式磨削时，先将被加工基片（ W ）吸附在所述的吸盘（ 12 ）上，所述的吸盘（ 12 ）由多孔陶瓷材料制成圆盘状，进给机构（ 8 ）驱动所述的工作台（ 3 ）沿水平方向朝（ a ）向移至所述的磨削主轴单元（ 18 ）下方，所述的磨削电机主轴（ 17 ）驱动所述的磨轮（ 15 ）沿磨轮转动方向的（ e ）方向转动，所述的电机（ 26 ）或所述的气缸（ 39 ）驱动所述的磨削主轴单元（ 18 ）沿磨削进给方向（ d ）向上进给磨削基片（ W ），所述的测力装置（ 10 ）将监测的磨削力传输给控制系统，控制磨削力等于预设值，当所述的测厚装置（ 13 ）检测到基片（ W ）达到预设的厚度后，所述的磨削主轴单元（ 18 ）沿所述的磨削垂直导轨（ 23 ）上升退刀，自此完成基片 W 的磨削；所述的进给机构（ 8 ）驱动所述的工作台（ 3 ）沿水平方向朝（ a ）向移至所述的抛光主轴单元（ 35 ）下方，所述的抛光电机主轴（ 36 ）驱动所述的抛轮（ 37 ）沿抛轮转动方向的（ h ）方向转动，所述的电机（ 26 ）或所述的气缸（ 39 ）驱动所述的抛光主轴单元（ 35 ）沿抛光进给方向（ g ）向上进给磨削基片（ W ），所述的测力装置（ 10 ）将监测的抛光压力传输给控制系统，控制抛光压力等于预设值，抛光结束后，所述的抛光主轴单元（ 35 ）沿所述的抛光垂直导轨（ 30 ）上升退刀，自此完成基片（ W ）的抛光，所述的测力装置（ 10 ）分别检测出磨削过程中的磨削力或抛光过程中的抛光压力，并将检测数据向控制系统输送，保证磨削力或抛光压力等于预设压力；所述的工作台（ 3 ）在所述的进给机构（ 8 ）的驱动下沿水平方向朝（ a ）向移出抛光加工区进行卸片。
2 、一种多功能的基片磨抛装置，其特征在于，磨抛装置采用由磨削主轴单元和抛光主轴单元组成的双主轴结构，在一台装置上完成基片的磨削和抛光加工；基片磨抛装置具有长方体状的基座（ 1 ），在基座（ 1 ）的上面固定着一对水平导轨（ 5 ），导引滑块（ 6 ）装在水平导轨（ 5 ）上，滑板（ 7 ）与导引滑块（ 6 ）固结，滑板（ 7 ）安在工作台（ 3 ）的下面，即通过导引滑块（ 6 ）和滑板（ 7 ）将工作台（ 3 ）嵌合在一对水平导轨（ 5 ）上；底座（ 9 ）安装在工作台（ 3 ）的上面；在底座（ 9 ）的上表面安装有用于在线测量磨削力的圆环状的测力装置（ 10 ），测厚装置（ 13 ）安装在工作台（ 3 ）上；安装在工作台（ 3 ）中心的工件电机主轴（ 11 ）是套在测力装置（ 10 ）的内部，吸盘（ 12 ）安装在工件电机主轴（ 11 ）顶部，进给机构（ 8 ）与工作台（ 3 ）连接；
立柱（ 2 ）安装在基座（ 1 ）的中部，在立柱（ 2 ）的前侧面固定安装有一对磨削垂直导轨（ 23 ），沿垂直进给方向（ c ）或（ d ）向移动的磨削主轴单元（ 18 ）安装在磨削垂直导轨（ 23 ）上；沿抛光进给方向（ f ）和（ g ）向移动的一对抛光垂直导轨（ 30 ）固定在立柱（ 2 ）的后侧面，抛光主轴单元（ 35 ）安装在抛光导轨（ 30 ）上；磨削主轴单元（ 18 ）和抛光主轴单元（ 35 ）通过悬挂机构（ 25 ）相互连接，悬挂机构（ 25 ）通过牵引绳（ 28 固定在立柱（ 2 ）顶部的前支撑座（ 27 ）和后支撑座（ 29 ）上。
3 、如权利要求 2 所述的一种基片磨抛装置，其特征在于，所述的磨削主轴单元（ 18 ）具有主轴座（ 19 ），在主轴座（ 19 ）的内部安装有磨削电机主轴（ 17 ），磨削电机主轴（ 17 ）下端安装有沿 e 方向转动的磨轮（ 15 ）；主轴座（ 19 ）安装在溜板（ 21 ）上，在溜板（ 21 ）上装有导引滑块（ 22 ），溜板（ 21 ）通过导引滑块（ 22 ）嵌合在一对磨削垂直导轨（ 23 ）上做移动；固定于溜板（ 21 ）背面的丝杠机构（ 24 ）在顶端和电机（ 26 ）相连接；所述磨削电机主轴（ 17 ）可驱动所述磨轮（ 15 ）沿磨轮转动方向的（ e ）方向转动，所述电机（ 26 ）可驱动磨削主轴单元（ 18 ）沿磨削进给方向（ c ）或（ d ）向进行升降运动，同时也可以驱动所述抛光主轴单元（ 35 ）沿抛光进给方向的（ f ）和（ g ）向上进行升降运动，从而实现定程磨削的进给控制方式；
所述的抛光主轴单元（ 35 ）具有主轴座（ 33 ），在主轴座（ 33 ）的内部安装有抛光电机主轴（ 36 ），抛光电机主轴（ 36 ）下端安装有沿（ h ）方向转动的抛轮（ 37 ），主轴座（ 33 ）安装在溜板（ 32 ）上，在溜板上（ 32 ）装有导引滑块（ 31 ），溜板上（ 32 ）通过导引滑块（ 31 ）嵌合在一对抛光垂直导轨（ 30 ）上做移动，抛光主轴单元（ 35 ）沿抛光进给方向（ f ）或（ g ）向上移动；气缸（ 39 ）平行安装在抛光垂直导轨（ 30 ）得下端；气缸（ 39 ）带动抛光主轴单元（ 35 ）沿抛光进给方向的（ g ）向下降或（ f ）向上升，在牵引绳（ 28 ）的牵引下，磨削主轴单元（ 18 ）同时沿磨削进给方向的（ c ）向上升或（ d ）向下降；
所述的悬挂机构（ 25 ）由牵引绳（ 28 ）分别固定在立柱（ 2 ）顶部的前支撑座（ 27 ）和后支撑座（ 29 ）上，滑轮 A （ 41 ）和滑轮 B （ 42 ）安装在前支撑座（ 27 ）上，滑轮 C （ 43 ）和滑轮 D （ 45 ）安装在后支撑座（ 29 ）上，滑轮 E （ 44 ）和滑轮 F （ 46 ）安装在溜板（ 32 ）侧面；一端固定在溜板（ 21 ）左上的牵引绳（ 28 ）分别绕过滑轮 A （ 41 ）、滑轮 C （ 43 ）、滑轮 E （ 44 ）、滑轮 F （ 46 ）、滑轮 D （ 45 ）和滑轮 B （ 42 ），最后固定在溜板（ 21 ）右上；牵引绳（ 28 ）将所述的磨削主轴单元（ 18 ）和所述的抛光主轴单元（ 35 ）相连，从而使所述的磨削主轴单元（ 18 ）和所述的抛光主轴单元（ 35 ）彼此为配重，保证所述的磨削主轴单元（ 18 ）和所述的抛光主轴单元（ 35 ）具有相同的位移量。
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