WO2013097336A1 - 一种基于耦合的非接触式温度测量系统及其测量方法 - Google Patents

一种基于耦合的非接触式温度测量系统及其测量方法 Download PDF

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Publication number
WO2013097336A1
WO2013097336A1 PCT/CN2012/071580 CN2012071580W WO2013097336A1 WO 2013097336 A1 WO2013097336 A1 WO 2013097336A1 CN 2012071580 W CN2012071580 W CN 2012071580W WO 2013097336 A1 WO2013097336 A1 WO 2013097336A1
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Prior art keywords
temperature
circuit
signal
voltage signal
resonant circuit
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PCT/CN2012/071580
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English (en)
French (fr)
Inventor
吴建德
赵崇文
黄强
何湘宁
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浙江大学
浙江图维电力科技有限公司
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Application filed by 浙江大学, 浙江图维电力科技有限公司 filed Critical 浙江大学
Priority to AU2012363207A priority Critical patent/AU2012363207B9/en
Priority to JP2014549301A priority patent/JP2015508495A/ja
Priority to EA201491162A priority patent/EA201491162A1/ru
Priority to US14/368,959 priority patent/US20140334521A1/en
Priority to EP12863650.3A priority patent/EP2799825A4/en
Priority to CA2861689A priority patent/CA2861689A1/en
Publication of WO2013097336A1 publication Critical patent/WO2013097336A1/zh

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • G01K7/24—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor in a specially-adapted circuit, e.g. bridge circuit
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/32—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using change of resonant frequency of a crystal

Definitions

  • the invention belongs to the technical field of temperature measurement, and particularly relates to a non-contact temperature measurement system and a measurement method based on coupling. Background technique
  • Temperature is a very important indicator in many technical fields. Temperature measurement devices are used to monitor temperature in many areas such as industry, medical, military and life. Automatic monitoring of temperature has become one of the important measures taken by all walks of life for safe production and loss reduction. In the specific case, because the monitoring points are scattered and remote, the traditional temperature measurement method has a long cycle and high cost, and the surveyor must go to the site for measurement, so the work efficiency is very low.
  • Temperature measurement technology is divided into two categories: contact temperature measurement and non-contact temperature measurement.
  • Contact temperature measurement requires the sensor to be placed close to the surface of the object to be measured, and the line between the measuring circuit and the sensor is connected.
  • Commonly used contact temperature measurement techniques include thermocouple temperature measurement, thermal resistance temperature measurement, semiconductor temperature measurement, and fiber temperature measurement.
  • the non-contact measurement system represented by optical measurement technology has greatly improved in sensitivity, precision, stability and automation.
  • Several common optical temperature measurement technologies are: spectral temperature measurement technology, holographic interferometry technology, based on CCD's three primary color temperature measurement technology and infrared radiation temperature technology.
  • the measurement circuit of the non-contact temperature measurement system is separated from the surface of the object to be measured, and is suitable for long-distance measurement or some special occasions.
  • the patent publication No. US 2004/0066833 discloses a non-contact temperature measuring device based on optical testing technology, which has an output display device corresponding to the detected temperature, which is convenient for the user to use.
  • the patent application publication of US 2007/0019705 A1 proposes an anemometer having a non-contact temperature measuring function, the device comprising a temperature sensor based on optical testing technology.
  • Patent Application Publication No. US-A-005826980A discloses a non-contact thermometer whose non-contact temperature measurement principle is based on infrared radiation temperature measurement technology.
  • the non-contact temperature measurement technique based on optical measurement technology is limited in the case where there is an obstacle between the object to be tested and the measuring device.
  • the internal core temperature measurement of a high-voltage power cable cannot be used because of the insulation of the core wire and the infrared rays cannot penetrate, so the infrared radiation temperature measurement technology cannot be used.
  • Due to the existence of an insulating protective layer, spectral temperature measurement technology, holographic interferometric temperature measurement technology, and CCD-based three primary color temperature measurement techniques are also limited.
  • the cable core is at a high potential, human safety considerations cannot be directly measured by circuit contact.
  • the fiber temperature measurement method is used, although the problem of electrical isolation is solved, it is very difficult to actually install. Therefore, at present, for the temperature measurement of the inner core wire of the high-voltage power cable, a reliable temperature measurement technology and equipment are urgently needed, which can deploy the safety measures for the relevant application according to the temperature.
  • the present invention provides a non-contact temperature measurement system based on electromagnetic coupling and a measurement method thereof, which can be applied between an object to be tested and a measurement device. In the case of obstacles, reliable temperature measurement of the inner core of the high-voltage power cable can be achieved.
  • the non-contact temperature measuring system according to the present invention has a simple circuit and a low cost, and is suitable for a compact design and can be applied to various occasions.
  • the physical principle of non-contact temperature measurement technology based on electromagnetic coupling is different from the non-contact temperature measurement technology based on optical measurement technology in the prior art, and it is expected to expand into a new field of non-contact temperature measurement, and achieve huge in the international market. Commercial success.
  • the present invention employs the following technical solutions.
  • a coupling-based non-contact temperature measuring system including - a controller
  • the driving circuit amplifies and outputs two driving signals provided by the controller
  • the switching circuit connected to the driving circuit; the switching circuit outputs a square wave signal according to the two amplified driving signals;
  • a resonant circuit connected to the switching circuit; the resonant circuit converting the square wave signal into an alternating current voltage signal; a temperature sensor coupled to the resonant circuit; the temperature sensor for sensing a temperature of the object to be tested, which The alternating voltage signal is used as an operating voltage, and generates a temperature voltage signal corresponding to the temperature to be transmitted to the resonant circuit; a signal detecting circuit connected to the resonant circuit; and the signal detecting circuit collects the temperature voltage signal received by the resonant circuit, And conditioning and shaping the signal, and outputting a detection voltage signal;
  • the controller is connected to the signal detecting circuit; and analyzing and calculating the temperature of the object to be tested according to the detected voltage signal.
  • the temperature sensor adopts a series resonant circuit or a parallel resonant circuit, wherein the resonant resistance is a thermistor.
  • the switching circuit is composed of two MOS transistors QfQ2 and two diodes DfD2; wherein the source of the MOS transistor Q1 is connected to the first power supply voltage, the gate is the first input end of the switching circuit and receives the first driving output of the driving circuit The signal is connected to the anode of the diode D1; the source of the MOS transistor Q2 is grounded, the gate is the second input of the switching circuit and receives the second driving signal output from the driving circuit, and the drain is connected to the cathode of the diode D2; the diode D1 The cathode is connected to the anode of diode D2 to form the output of the switching circuit and output a square wave signal.
  • the signal detecting circuit is composed of four resistors R3 R R6, a capacitor C3 and an operational amplifier U; wherein, one end of the resistor R3 is an input end of the signal detecting circuit and collects a temperature voltage signal received by the resonant circuit, and the resistor R3 of The other end of the specification is connected to one end of the resistor R4 and the non-inverting input terminal of the operational amplifier U.
  • the other end of the resistor R4 is connected to one end of the resistor R5 and grounded.
  • the other end of the resistor R5 is connected to the inverting input terminal of the operational amplifier U, and the resistor R6.
  • One end is connected to one end of the capacitor C3, the positive power terminal of the operational amplifier U is connected to the second power supply voltage, the negative power terminal of the operational amplifier U is connected to the third power supply voltage, the output end of the operational amplifier U and the other end of the resistor R6 and the capacitor C3 The other end is connected to form an output terminal of the signal detecting circuit and outputs a detection voltage signal.
  • the resonant circuit uses a series resonant circuit.
  • the controller is a DSP (Digital Signal Processor).
  • a coupling-based non-contact temperature measurement method includes the following steps:
  • the temperature sensor senses the temperature of the object to be tested, and generates a temperature voltage signal corresponding to the temperature, thereby kneading the temperature voltage signal to the resonant circuit; collecting the received by the resonant circuit by using the signal detecting circuit The temperature and voltage signals are conditioned and shaped to provide a corresponding detection voltage signal to the controller;
  • the controller analyzes and calculates the temperature of the object to be tested according to the detected voltage signal.
  • the controller analyzes the temperature of the object to be tested as follows:
  • the resistance value of the thermistor in the temperature sensor is solved by the following formula, and the temperature of the object to be tested is obtained according to the resistance analysis;
  • R is the resistance of the thermistor in the temperature sensor
  • C is the capacitance of the resonant capacitor in the temperature sensor.
  • the temperature measuring method of the invention separates the temperature sensor from other devices of the system, realizes the transmission of the temperature signal through the form of electromagnetic coupling, performs calculation and analysis according to the temperature signal, and further realizes the non-contact temperature measurement of the object, and is applicable to the interior of the high-voltage power cable. Reliable temperature measurement of the core wire.
  • the temperature measuring system of the invention has simple circuit and low cost, is suitable for miniaturization design, and can be applied to various occasions.
  • Figure 1 is a block diagram showing a preferred embodiment of a coupling-based non-contact temperature measuring system in accordance with the present invention.
  • 2 is a circuit schematic of a preferred embodiment of a coupling-based non-contact temperature measurement system in accordance with the present invention.
  • 3 is a schematic view showing the arrangement of a preferred embodiment of a temperature sensor based on a coupled non-contact temperature measuring system in accordance with the present invention.
  • Fig. 4 is a waveform diagram showing the detected voltage signal collected by the signal detecting circuit of the coupling-based non-contact temperature measuring system according to the present invention.
  • thermosensor 1, temperature sensor, 2, insulation layer, 3, core wire.
  • a coupling-based non-contact temperature measuring system includes: a DSP, a driving circuit, a switching circuit 101, a resonant circuit 102, a signal detecting circuit 104, and a temperature sensor 103.
  • the driving circuit is connected to the DSP, and the two driving signals provided by the DSP are amplified and output.
  • the driving circuit adopts the IRF2110 chip of International Rectifier Company.
  • the switch circuit 101 is connected to the driving circuit, and outputs a square wave signal according to the two amplified driving signals provided by the driving circuit.
  • the switching circuit 101 is composed of two M0S tubes Q1 ⁇ Q2 and two diodes D1 ⁇ D2.
  • the MOS transistor Q1 has a source connected to a +12V power supply voltage, the gate is a first input terminal of the switching circuit 101 and receives a first driving signal output by the driving circuit, and the drain is connected to the anode of the diode D1; the MOS transistor Q2 The source is grounded, the gate is the second input of the switch circuit 101 and receives the second drive signal output by the drive circuit, the drain is connected to the cathode of the diode D2; the cathode of the diode D1 is connected to the anode of the diode D2 to form the switch circuit 101.
  • the output terminal outputs a square wave signal.
  • the resonant circuit 102 is connected to the switch circuit 101, which converts the square wave signal into an alternating current voltage signal.
  • the resonant circuit 102 uses a series resonant circuit including a resistor R2, a capacitor C2 and an inductor L2.
  • R2 is connected to one end of the capacitor C2 to form an input end of the resonant circuit 102 and receive the output of the switch circuit 101.
  • the square wave signal is described.
  • the other end of the capacitor C2 is connected to one end of the inductor L2, and the other end of the inductor L2 is connected to the other end of the resistor R2 and grounded.
  • the temperature sensor 103 is coupled to the resonant circuit 102, and the AC voltage signal coupled from the inductor L2 in the resonant circuit 102 is used as its own operating voltage.
  • the measurement object of this embodiment is the internal core of the high voltage power cable, as shown in FIG.
  • the temperature sensor 103 is disposed on the inner wall of the high voltage power cable insulation layer, and is used for sensing the temperature of the inner core of the cable, and generates a temperature voltage signal corresponding to the core temperature to be coupled and transmitted to the resonant circuit 102; the temperature sensor 103 is adopted.
  • the series resonant circuit comprises a thermistor R1, a capacitor C1 and an inductor L1; wherein one end of the thermistor R1 is connected to one end of the capacitor C1, and the other end of the capacitor C1 is connected to one end of the inductor L1, the inductor L1 The other end is connected to the other end of the thermistor R1, and the inductor L1 is coupled to the inductor L2 of the resonant circuit 102.
  • the thermistor R1 is of the type PT100.
  • the signal detecting circuit 104 is connected to the resonant circuit 102, and collects the temperature and voltage signals received by the resonant circuit 102, and modulates and shapes the signal to output a detected voltage signal.
  • the signal detecting circuit 104 is composed of four resistors R3 ⁇ R6, a capacitor C3 and an operational amplifier U; wherein, one end of the resistor R3 is an input end of the signal detecting circuit 104 and is connected to one end of the inductor L2 in the resonant circuit 102 to collect the temperature voltage signal received by the resonant circuit 102,
  • the other end of the resistor R3 is connected to one end of the resistor R4 and the non-inverting input terminal of the operational amplifier U, the other end of the resistor R4 is connected to one end of the resistor R5 and grounded, and the other end of the resistor R5 is connected to the inverting input terminal of the operational amplifier U,
  • One end of the resistor R6 is connected to one end of the capacitor C3, the positive
  • the DSP is connected to the signal detecting circuit 104, and receives the detected voltage signal outputted by the signal detecting circuit 104, and calculates the temperature of the inner core of the cable according to the signal analysis; in this embodiment, the DSP uses the TMS320F28035 chip of Texas Instruments.
  • the DSP outputs a pair of complementary driving signals to the two M0S tubes 0 ⁇ 02 and the two M0S tubes QfQ2 in the switching circuit 101 through the driving circuit, so that the switching circuit 101 outputs a high-frequency square wave signal; the resonant circuit 102 converts the square wave signal into an alternating voltage signal, and then couples the alternating current voltage signal to the temperature sensor 103 through the inductor L2. After the temperature sensor 103 is normally stable, the DSP stops outputting the driving signal, and the capacitor C2 and the inductor L2 in the resonant circuit 102 Stop the oscillation and discharge quickly.
  • the temperature sensor 103 is coupled by the inductor L1 to obtain an AC voltage signal to form a current loop, and then starts to work.
  • the temperature sensor internally senses the temperature of the core wire through the thermistor R1, and generates a temperature and voltage signal corresponding to the core temperature.
  • the inductor L1 couples the temperature voltage signal to the resonant circuit 102; the resonant circuit 102 is acquired by the signal detecting circuit 104.
  • the temperature and voltage signals obtained by coupling the middle inductor L2 are conditioned and shaped to provide a corresponding detection voltage signal to the DSP.
  • the DSP first extracts the period of the detection voltage signal, and performs continuous A/D sampling on the detection voltage signal, and then extracts the peak points of the three consecutive periods of the detection voltage signal waveform as sampling points, as shown in FIG. 4;
  • the period of the voltage signal and the voltage values of the three sampling points are solved by the following formula to obtain the damping coefficient of the detected voltage signal;
  • the DSP solves the resistance value of the thermistor R1 in the temperature sensor 103 by the following formula, and further determines the temperature of the inner core of the cable according to the temperature resistance relationship of the thermistor R1;
  • R is the resistance of the thermistor R1 in the temperature sensor 103
  • L is the inductance of the inductor L1 in the temperature sensor 103.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
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Abstract

一种基于耦合的非接触式温度测量系统，包括控制器、与控制器相连的驱动电路、与驱动电路相连的开关电路、与开关电路相连的谐振电路、与谐振电路耦合的温度传感器，以及与谐振电路和控制器相连的信号检测电路。该非接触式温度测量系统将温度传感器与系统其他部件分离，通过电磁耦合实现物体的非接触式温度测量。该系统电路简单，成本较低，适合于小型化设计，可应用于多个场合。还提供一种基于耦合的非接触式温度测量系统的测量方法。该测量方法通过电磁耦合的形式实现温度信号的传递，根据温度信号进行计算分析，进而实现物体的非接触式温度测量，可适用于对高压电力电缆内部芯线的可靠温度测量。

Description

说 明 书 一种基于耦合的非接触式温度测量系统及其测量方法 技术领域
本发明属于测温技术领域，具体涉及一种基于耦合的非接触式温度测量系统及测量方法。 背景技术
在日常生活和工业生产过程中， 经常需要测量各种物体的温度。 温度在许多技术领域都 是一个非常重要的指标参数， 在工业、 医疗、 军事和生活等许多领域， 都需要用到测温装置 来监测温度。 温度的自动监测已经成为各行各业进行安全生产和减少损失采取的重要措施之 一。 特定场合下由于监测点比较分散、 偏远， 采用传统的温度测量方式周期长、 成本高， 而 且测量员必须到现场进行测量， 因此工作效率非常低。
测温技术分接触式测温和非接触式测温两大类。 接触式测温需要将传感器紧贴被测物体 表面， 同时测量电路和传感器之间有线路相连接。 常用的接触式测温技术有热电耦测温、 热 敏电阻测温、 半导体测温、 光纤测温等方法。 以光学测量技术为代表的非接触测量系统在灵 敏度、 精度、 稳定性和自动化程度等方面有大幅提高， 比较常见的几种光学测温技术为： 光 谱测温技术、 全息干涉测温技术、 基于 CCD的三基色测温技术和红外辐射 温技术。 非接触 式测温系统的测量电路与被测物体表面相分离， 适合于远距离测量或者一些特殊场合。
公开号为： US 2004/0066833 Al的专利申请公幵提出一种基于光学测试技术的非接触温 度测量装置， 该装置有一个与探测温度相对应的输出显示装置， 方便使用者使用。 公开号为： US2007/0019705 A1的专利申请公开提出一种具有非接触测温功能的风速计， 该装置包含有 一个基于光学测试技术的温度传感器。 公开号为： US005826980A的专利申请公开提出一种非 接触温度计， 其非接触测温原理是基于红外辐射测温技术。 公幵号为： US20050178199A1的 专利申请公开提出一种具有非接触测温技术的湿度仪表， 其非接触测温技术的原理是基于光 学测量技术。公开号为： US 20090210191A1的专利申请公开提出一种非接触测温系统和方法， 利用物体对外辐射数据来测量物体的温度。 现有技术中的非接触测温技术多是基于光学测量 技术。 ' '
但是， 对于待测物体与测量装置之间有障碍物的场合， 基于光学测量技术的非接触测温 技术受到限制。 例如高压电力电缆的内部芯线温度测量， 由于芯线外部有绝缘层保护， 红外 线无法穿透， 因此无法使用红外辐射测温技术。 由于绝缘保护层的存在， 光谱测温技术、 全 息干涉测温技术、基于 CCD的三基色测温技术也受到限制。 同时， 由于电缆芯线处于高电位， 人安全考虑也无法通过电路接触的方法直接测温。 而如果采用光纤测温的方式， 虽然解决了 电气隔离的问题， 但是在实际安装上非常困难。 因此， 目前针对高压电力电缆内部芯线的温 度测量， 急需一项可靠的测温技术及设备，其可以根据温度对相关应用进行安全措施的部署，
1 替换页 （细则第 26条） 说 明 书 使得采用高压电缆的电力设备不存在安全隐患。 这样的测温技术及设备将在全球范围内获得 广泛的市场。
发明内容
为了克服非接触测温技术在高压电力电缆电力设备应用的不足， 本发明提供了一种基于 电磁耦合的非接触式温度测量系统及其测量方法， 可以适用于待测物体与测量装置之间有障 碍的场合， 能够实现对高压电力电缆内部芯线的可靠温度测量。 按照本发明的非接触测温系 统电路简单， 成本较低， 适合于小型化设计， 可应用于多种场合。 并且其基于电磁耦合的非 接触测温技术物理原理区别于现有技术中的基于光学测量技术的非接触测温技术， 有望拓展 为一个新的非接触测温领域， 并在国际市场上取得巨大商业上的成功。 本发明采用了如下技 术方案。
一种基于耦合的非接触式温度测量系统， 包括- 控制器；
与控制器相连的驱动电路； 所述的驱动电路将控制器提供的两路驱动信号进行放大后输 出；
与驱动电路相连的开关电路； 所述的开关电路根据两路放大后的驱动信号， 输出方波信 号；
与开关电路相连的谐振电路； 所述的谐振电路将方波信号转换成交流电压信号； 与谐振电路耦合的温度传感器； 所述的温度传感器用于感应待测物体的温度， 其将所述 的交流电压信号作为工作电压，并产生与所述的温度相对应的温度电压信号传送给谐振电路; 与谐振电路相连的信号检测电路； 所述的信号检测电路采集谐振电路接收到的温度电压 信号， 并对该信号进行调理整形， 输出检测电压信号；
所述的控制器与信号检测电路相连； 其根据所述的检测电压信号， 分析计算出待测物体 的温度。
所述的温度传感器采用串联式谐振电路或并联式谐振电路，其中的谐振电阻为热敏电阻。 所述的开关电路由两个 M0S管 QfQ2和两个二极管 DfD2构成； 其中， M0S管 Q1的源 极接第一电源电压， 栅极为开关电路的第一输入端并接收驱动电路输出的第一驱动信号， 漏 极与二极管 D1的阳极相连； M0S管 Q2的源极接地， 栅极为开关电路的第二输入端并接收驱 动电路输出的第二驱动信号， 漏极与二极管 D2的阴极相连； 二极管 D1的阴极与二极管 D2的 阳极相连构成开关电路的输出端并输出方波信号。
所述的信号检测电路由四个电阻 R3〜R6、 一个电容 C3和一个运算放大器 U构成； 其中， 电阻 R3的一端为信号检测电路的输入端并采集谐振电路接收到的温度电压信号， 电阻 R3的 说 明 书 另一端与电阻 R4的一端和运算放大器 U的正相输入端相连，电阻 R4的另一端与电阻 R5的一 端相连并接地， 电阻 R5的另一端与运算放大器 U的反相输入端、 电阻 R6的一端和电容 C3的 一端相连， 运算放大器 U的正电源端接第二电源电压， 运算放大器 U的负电源端接第三电源 电压， 运算放大器 U的输出端与电阻 R6的另一端和电容 C3的另一端相连构成信号检测电路 的输出端并输出检测电压信号。
所述的谐振电路采用串联式谐振电路。
所述的控制器为 DSP (数字信号处理器）。
一种基于耦合的非接触式温度测量方法， 包括如下歩骤：
( 1 )利用控制器驱动开关电路输出方波信号，通过谐振电路将所述的方波信号转换成交 流电压信号， 进而将所述的交流电压信号耦合至温度传感器， 使温度传感器工作后控制器停 止驱动；
( 2 )温度传感器感应待测物体的温度， 并产生与所述的温度相对应的温度电压信号，进 而将所述的温度电压信号藕合至谐振电路； 利用信号检测电路采集谐振电路接收到的温度电 压信号， 经调理整形后向控制器提供对应的检测电压信号；
( 3 )控制器根据所述的检测电压信号， 分析计算出待测物体的温度。
所述的步骤 （3) 中， 控制器分析计算待测物体的温度的步骤为：
1 ) 提取所述的检测电压信号的周期；
2)对检测电压信号进行连续 A/D采样，提取检测电压信号波形中连续三个周期的波峰点 作为采样点；
3)根据检测电压信号的周期以及三个采样点的电压值， 通过以下公式， 求解出检测电压 信号的阻尼系数；
Figure imgf000005_0001
其中： Ul、 u2、 u3分别为三个采样点对应的电压值； Ul、 u2、 u3对应的时刻分别为 t,、 t2、 t3， t2= t^T, t3= t2+T， T为周期， α为阻尼系数；
4)根据所述的阻尼系数， 通过以下公式， 求解出温度传感器中热敏电阻的阻值， 进而根 据阻值分析求得待测物体的温度；
若温度传感器采用串联式谐振电路， 贝 1J :
R
( 2) 若温度传感器采用并联式谐振电路， 贝 1J : 说 明 书
其中： R为温度传感器中热敏电阻的阻值， C为温度传感器中谐振电容的电容值。
本发明测温方法使温度传感器与系统其他器件分离， 通过电磁耦合的形式实现温度信号 的传递， 根据温度信号进行计算分析， 进而实现物体的非接触式温度测量， 可适用于对高压 电力电缆内部芯线的可靠温度测量。 本发明测温系统电路简单， 成本较低， 适合于小型化设 计， 可应用于多种场合。
附图说明
图 1为按照本发明的基于耦合的非接触式温度测量系统的一优选实施例的结构示意图。 图 2为按照本发明的基于耦合的非接触式温度测量系统的优选实施例的电路原理图。 图 3为按照本发明的基于耦合的非接触式温度测量系统的温度传感器的一优选实施例的 设置示意图。
图 4为按照本发明的基于耦合的非接触式温度测量系统的信号检测电路采集的检测电压 信号的波形示意图。
其中： 1、 温度传感器， 2、 绝缘层， 3、 芯线。
具体实施方式
为了更为具体地描述本发明， 下面结合附图及具体实施方式对本发明的测量系统及其测 量方法进行详细说明。
如图 1和图 2所示， 一种基于耦合的非接触式温度测量系统， 包括： DSP、 驱动电路、开 关电路 101、 谐振电路 102、 信号检测电路 104和温度传感器 103。
驱动电路与 DSP相连， 其将 DSP提供的两路驱动信号进行放大后输出， 本实施例中， 驱 动电路采用 International Rectifier公司的 IRF2110芯片。
开关电路 101与驱动电路相连， 其根据驱动电路提供的两路放大后的驱动信号， 输出方 波信号； 本实施例中， 开关电路 101由两个 M0S管 Q1~Q2和两个二极管 D1~D2构成； 其中， M0S管 Q1的源极接 +12V的电源电压，栅极为开关电路 101的第一输入端并接收驱动电路输出 的第一驱动信号， 漏极与二极管 D1的阳极相连； M0S管 Q2的源极接地， 栅极为开关电路 101 的第二输入端并接收驱动电路输出的第二驱动信号， 漏极与二极管 D2的阴极相连； 二极管 D1的阴极与二极管 D2的阳极相连构成开关电路 101的输出端并输出方波信号。
谐振电路 102与开关电路 101相连， 其将方波信号转换成交流电压信号； 本实施例中， 谐振电路 102采用串联式谐振电路， 包括一个电阻 R2、 一个电容 C2和一个电感 L2 ; 其中， 电阻 R2的一端与电容 C2的一端相连构成谐振电路 102的输入端并接收开关电路 101输出的 说 明 书 方波信号， 电容 C2的另一端与电感 L2的一端相连， 电感 L2的另一端与电阻 R2的另一端相 连并接地。
温度传感器 103与谐振电路 102耦合，其将从谐振电路 102中的电感 L2上耦合得到的交 流电压信号作为自身的工作电压； 本实施例的测量对象为高压电力电缆内部芯线， 如图 3所 示， 温度传感器 103设于高压电力电缆绝缘层的内壁上， 其用于感应电缆内部芯线的温度， 并产生与芯线温度相对应的温度电压信号耦合传送给谐振电路 102 ; 温度传感器 103采用串 联式谐振电路， 包括一个热敏电阻 Rl、 一个电容 C1和一个电感 L1 ; 其中， 热敏电阻 R1的一 端与电容 C1的一端相连， 电容 C1的另一端与电感 L1的一端相连， 电感 L1的另一端与热敏 电阻 R1的另一端相连， 电感 L1与谐振电路 102中电感 L2相耦合； 本实施例中热敏电阻 R1 采用的型号为 PT100。
信号检测电路 104与谐振电路 102相连， 其采集谐振电路 102接收到的温度电压信号， 并对该信号进行调理整形， 输出检测电压信号； 本实施例中， 信号检测电路 104由四个电阻 R3〜R6、 一个电容 C3和一个运算放大器 U构成； 其中， 电阻 R3的一端为信号检测电路 104的 输入端且与谐振电路 102中的电感 L2的一端相连以采集谐振电路 102接收到的温度电压信 号， 电阻 R3的另一端与电阻 R4的一端和运算放大器 U的正相输入端相连， 电阻 R4的另一端 与电阻 R5的一端相连并接地， 电阻 R5的另一端与运算放大器 U的反相输入端、 电阻 R6的一 端和电容 C3的一端相连， 运算放大器 U的正电源端接 +5V的电源电压， 运算放大器 U的负电 源端接 -5V的电源电压， 运算放大器 U的输出端与电阻 R6的另一端和电容 C3的另一端相连 构成信号检测电路 104的输出端并输出检测电压信号。
DSP与信号检测电路 104相连， 其接收信号检测电路 104输出的检测电压信号， 并根据 该信号分析计算出电缆内部芯线的温度； 本实施例中， DSP采用 Texas Instruments公司的 TMS320F28035芯片。
本实施例的基于耦合的非接触式温度测量系统的测量方法， 包括如下步骤：
( 1 ) DSP通过驱动电路输出一对互补的驱动信号分别给开关电路 101中的两个 M0S管 0Γ02, 两个 M0S管 QfQ2互补开关动作， 使得开关电路 101输出高频的方波信号； 谐振电路 102将方波信号转换成交流电压信号， 进而通过电感 L2将交流电压信号耦合至温度传感器 103， 温度传感器 103正常工作稳定后， DSP停止输出驱动信号， 则谐振电路 102中的电容 C2 和电感 L2停止振荡并快速放电。
( 2 )温度传感器 103通过电感 L1耦合得到交流电压信号形成电流回路后开始工作， 其 通过热敏电阻 R1感应电缆内部芯线的温度， 并产生与芯线温度相对应的温度电压信号，进而 通过电感 L1将温度电压信号耦合至谐振电路 102; 利用信号检测电路 104采集谐振电路 102 中电感 L2耦合得到的温度电压信号， 经调理整形后向 DSP提供对应的检测电压信号。
( 3) DSP首先提取检测电压信号的周期， 并对检测电压信号进行连续 A/D采样， 然后提 取检测电压信号波形中连续三个周期的波峰点作为采样点， 如图 4所示； 根据检测电压信号 的周期以及三个采样点的电压值， 通过以下公式， 求解出检测电压信号的阻尼系数；
Figure imgf000008_0001
其中： Ul、 U2、 U3分别为三个采样点对应的电压值； Ul、 u2、 u3对应的时刻分别为 、 t2、 t3， t2= +Ί, t3= t2+T， T为周期， α为阻尼系数；
DSP根据阻尼系数， 通过以下公式， 求解出温度传感器 103中热敏电阻 R1的阻值， 进而 根据热敏电阻 R1的阻温关系， 求得电缆内部芯线的温度；
R
a =—— ( ) 其中： R为温度传感器 103中热敏电阻 R1的阻值， L为温度传感器 103中电感 L1的电感值。 本发明的技术范畴包括以上所述各部分任意组合。

Claims

权 利 要 求 书
1. 一种基于耦合的非接触式温度测量系统， 包含控制器， 驱动电路， 开关电路， 谐振电路， 温度传感器， 信号检测电路， 其特征在于： 驱动电路与控制器相连， 将控制器提供的两路驱 动信号进行放大后输出， 开关电路与驱动电路相连， 开关电路根据两路放大后的驱动信号， 输出方波信号， 谐振电路与开关电路相连， 谐振电路将方波信号转换成交流电压信号， 温度 传感器用于感应待测物体的温度， 与谐振电路耦合， 将谐振电路转换成的交流电压信号作为 工作电压， 并产生与待测物体温度相对应的温度电压信号， 将该信号传送给谐振电路， 信号 检测电路与谐振电路相连， 信号检测电路采集谐振电路接收到的温度电压信号， 并对该信号 进行调理整形， 输出检测电压信号， 控制器与信号检测电路相连， 根据检测电路输出的检测 电压信号， 分析计算出待测物体的温度， 从而使温度传感器与系统其他器件分离， 通过电磁 耦合的形式实现温度信号的传递， 根据温度信号进行计算分析， 进而实现物体的非接触式温 度测量， 所述温度传感器采用串联式谐振电路或并联式谐振电路， 其中的谐振电阻为热敏电 阻， 所述的开关电路由两个腸 S管 QfQ2和两个二极管 DfD2构成， 其中， M0S管 Q1的源极 接第一电源电压， 栅极为开关电路的第一输入端， 漏极与二极管 D1的阳极相连， M0S管 Q2 的源极接地， 栅极为开关电路的第二输入端， 漏极与二极管 D2的阴极相连， 二极管 D1的阴 极与二极管 D2的阳极相连构成开关电路的输出端， 所述的信号检测电路由四个电阻 R3〜R6、 一个电容 C3和一个运算放大器 U构成， 其中， 电阻 R3的一端为信号检测电路的输入端， 电 阻 R3的另一端与电阻 R4的一端和运算放大器 U的正相输入端相连，电阻 R4的另一端与电阻 5的一端相连并接地， 电阻 R5的另一端与运算放大器 U的反相输入端、 电阻 R6的一端和电 容 C3的一端相连， 运算放大器 U的正电源端接第二电源电压，运算放大器 U的负电源端接第 三电源电压， 运算放大器 U的输出端与电阻 R6的另一端和电容 C3的另一端相连构成信号检 测电路的输出端。
2. 根据权利要求 1所述的基于耦合的非接触式温度测量系统，其特征在于： 所述的谐振电路 采用串联式谐振电路。
3. 根据权利要求 1所述的基于耦合的非接触式温度测量系统，其特征在于： 所述的控制器为 DSP。
4. 一种基于耦合的非接触式温度测量系统的测量方法， 包括如下步骤：
( 1 )利用控制器驱动开关电路输出方波信号，通过谐振电路将所述的方波信号转换成交 流电压信号， 进而将所述的交流电压信号耦合至温度传感器， 使温度传感器工作后控制器停 止驱动，
( 2 )温度传感器感应待测物体的温度， 并产生与所述的温度相对应的温度电压信号，进 WO 2013/097336 权 利 要 求 书 PCT/CN2012/071580 而将所述的温度电压信号耦合至谐振电路， 利用信号检测电路采集谐振电路接收到的温度电 压信号， 经调理整形后向控制器提供对应的检测电压信号，
( 3) 控制器根据所述的检测电压信号， 提取所述的检测电压信号的周期，
对检测电压信号进行连续 A/D采样， 提取检测电压信号波形中连续三个周期的波峰点作为采 样点， 根据检测电压信号的周期以及三个采样点的电压值， 通过以下公式， 求解出检测电压 信号的阻尼系数，
Figure imgf000010_0001
其中： Ul、 U2、 U3分别为三个采样点对应的电压值， Ul、 u2、 u3对应的时刻分别为 、 t2、 t3， t2= t,+T, t3= t2+T， T为周期， α为阻尼系数， 根据所述的阻尼系数， 通过以下公式，求 解出温度传感器中热敏电阻的阻值， 进而根据阻值分析求得待测物体的温度，
若温度传感器采用串联式谐振电路， 贝 U:
若温度传感器采用并联式谐振电路， 则: a = ( 3)
2RC 其中： R为温度传感器中热敏电阻的阻值， C为温度传感器中谐振电容的电容值。
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