WO2013084413A1 - Appareil de traitement laser, procédé de traitement laser, substrat pour tête à jet d'encre et procédé de fabrication de tête à jet d'encre - Google Patents

Appareil de traitement laser, procédé de traitement laser, substrat pour tête à jet d'encre et procédé de fabrication de tête à jet d'encre Download PDF

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Publication number
WO2013084413A1
WO2013084413A1 PCT/JP2012/007283 JP2012007283W WO2013084413A1 WO 2013084413 A1 WO2013084413 A1 WO 2013084413A1 JP 2012007283 W JP2012007283 W JP 2012007283W WO 2013084413 A1 WO2013084413 A1 WO 2013084413A1
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Prior art keywords
laser light
pulsed laser
substrate
irradiation
pulsed
Prior art date
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PCT/JP2012/007283
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English (en)
Inventor
Kosuke Kurachi
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Canon Kabushiki Kaisha
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Application filed by Canon Kabushiki Kaisha filed Critical Canon Kabushiki Kaisha
Publication of WO2013084413A1 publication Critical patent/WO2013084413A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping

Definitions

  • the present invention relates to a laser processing apparatus which subjects the surface of a material to be processed to laser processing while scanning a pulsed laser light to move an irradiating position, a laser processing method, a substrate for an ink jet head which is subjected to laser processing by a laser processing method, and a manufacturing method of an ink jet head.
  • a laser processing apparatus in which a pulsed laser light output from a laser oscillator is moved relatively to a material to be processed, by use of a stage, a galvanometer scanner and the like, to process the material (see PTL 1).
  • the laser processing apparatus disclosed in PTL 1 is constituted of the laser oscillator, a processing head, an XY stage, and a control system.
  • the material to be processed is mounted on the XY stage, and the material to be processed is moved by the XY stage, to scan a processing position.
  • PTL 1 Japanese Patent Application Laid-Open No. H05-8072
  • PTL 2 Japanese Patent Application Laid-Open No. S61-20686
  • a scanning speed of a pulsed laser light is not always constant, and the scanning speed of the pulsed laser light is decreased to a speed lower than a predetermined speed sometimes.
  • the laser light is scanned at the constant scanning speed, but in a processing end portion of the material to be processed, the scanning speed of the laser light is decreased.
  • the surface of the material to be processed is irradiated with the pulsed laser light of a constant irradiation frequency, and hence an irradiation density of the pulsed laser light of the corresponding portion becomes higher than that of a portion of the material to be processed which is subjected to the laser processing without decreasing the speed.
  • a processing amount of the portion where the irradiation density is high becomes larger than that of another portion, and a processing accuracy is deteriorated.
  • a repetition frequency of a laser oscillator is changed in accordance with the scanning speed as in the above PTL 2.
  • the surface of the material to be processed can be irradiated with the pulsed laser light at the constant pitch, but when the repetition frequency of the laser oscillator is changed, an excitation time varies in accordance with a pulse, and hence pulse energy fluctuates. Therefore, when the processing accuracy is sensitively influenced by the pulse energy, it has been difficult to obtain a desirable processing accuracy.
  • an object of the present invention is to provide a laser processing apparatus which can irradiate a material to be processed with a pulsed laser light at predetermined intervals and can perform desirable processing with high accuracy while keeping a constant repetition frequency of a laser oscillator, and a laser processing method. Moreover, an object of the present invention is to provide a substrate for an ink jet head which is subjected to laser processing by the laser processing method, and a manufacturing method of an ink jet head.
  • a laser processing apparatus of the present invention is characterized by including a laser oscillator which emits a pulsed laser light at a constant repetition frequency; a laser light blocking/transmitting system which blocks or transmits the pulsed laser light emitted by the laser oscillator by a pulse unit; a scanning unit which scans an irradiation point of the pulsed laser light transmitted through the laser light blocking/transmitting system; and a control unit which obtains, from a scanning speed of the irradiation point of the pulsed laser light, an irradiation period of the pulsed laser light required to irradiate the surface of a material to be processed with the pulsed laser light at predetermined intervals, and controls switching of the blocking/transmitting of the pulsed laser light in the laser light blocking/transmitting system so that the surface of the material to be processed is irradiated with the pulsed laser light in this obtained irradiation period.
  • a laser processing method of the present invention using a laser oscillator which emits a pulsed laser light at a constant repetition frequency, a laser light blocking/transmitting system which blocks or transmits the pulsed laser light emitted by the laser oscillator by a pulse unit, and a scanning unit which scans an irradiation point of the pulsed laser light transmitted through the laser light blocking/transmitting system, to subject the surface of a material to be processed to laser processing, characterized by including: a step of obtaining, from a scanning speed of the pulsed laser light, an irradiation period of the pulsed laser light required to irradiate the surface of the material to be processed with the pulsed laser light at predetermined intervals; and a step of switching the blocking/transmitting of the pulsed laser light in the laser light blocking/transmitting system so that the surface of the material to be processed is irradiated with the pulsed laser light in this obtained irradiation period.
  • a manufacturing method of an ink jet head of the present invention in which a substrate is irradiated with a pulsed laser light in a constant irradiation period, and the laser light and the substrate are relatively reciprocated to process a groove, characterized by including irradiating the substrate with the pulsed laser light in the constant irradiation period in a center of the groove, and irradiating the substrate with the pulsed laser light in a period which is at least twice as long as the constant irradiation period in an end portion of the groove.
  • blocking/transmitting of a pulsed laser light in a laser light blocking/transmitting system is switched in accordance with a change of a scanning speed of the pulsed laser light, to change an irradiation period of the pulsed laser light with which the surface of a material to be processed is irradiated.
  • the repetition frequency of the laser oscillator is constant, energy of the pulsed laser light per pulse is stabilized.
  • the surface of the material to be processed can be irradiated with an irradiation point of the pulsed laser light having the stabilized energy at predetermined intervals, so that it is possible to decrease a fluctuation of an irradiation density of the pulsed laser light with which a processing portion of the surface of the material to be processed is irradiated, and it is possible to perform desirable laser processing with high accuracy.
  • FIG. 1 is an explanatory view showing a schematic constitution of a laser processing apparatus according to an embodiment of the present invention.
  • FIG. 2A is an explanatory view showing a schematic constitution of a laser irradiation control system in a case where the laser irradiation control system has an acoustooptic element.
  • FIG. 2B is an explanatory view showing a schematic constitution of the laser irradiation control system in a case where the laser irradiation control system has an electrooptic element.
  • FIG. 3 is a flowchart showing a control operation of a control device of a laser processing apparatus.
  • FIG. 1 is an explanatory view showing a schematic constitution of a laser processing apparatus according to an embodiment of the present invention.
  • FIG. 2A is an explanatory view showing a schematic constitution of a laser irradiation control system in a case where the laser irradiation control system has an acoustooptic element.
  • FIG. 2B is an explanatory view
  • FIG. 4A is an explanatory view showing a pulsed laser light transmitted through the laser irradiation control system in a case where the pulsed laser light is transmitted while keeping a repetition frequency of a laser oscillator.
  • FIG. 4B is an explanatory view showing the pulsed laser light transmitted through the laser irradiation control system in a case where the pulsed laser light is transmitted at an irradiation frequency which is 1/2 of the repetition frequency of the laser oscillator.
  • FIG. 1 is an explanatory view showing a schematic constitution of a laser processing apparatus according to an embodiment of the present invention.
  • a laser processing apparatus 100 shown in FIG. 1 focuses the pulsed laser light on a substrate 1 which is a material to be processed, to perform processing such as the forming of a hole or a groove, cut processing or spot welding.
  • the laser processing apparatus 100 includes a laser oscillator 4, a laser irradiation control system 7 which is a laser light blocking/transmitting system, a galvanometer scanner 6, a focusing lens 3, an X-Y stage 5, and a control device 8 as a control unit.
  • the substrate 1 is mounted on the X-Y stage 5.
  • an X-direction is a parallel direction to the surface of the substrate 1 on the side of the focusing lens 3 or the surface which faces the focusing lens 3 side.
  • a Z-direction is a normal direction to the surface of the substrate 1 on the side of the focusing lens 3 or the surface which faces the focusing lens 3 side. It can be considered that the Z-direction is a direction in which the substrate 1 faces the focusing lens 3.
  • a Y-direction is a perpendicular direction to the X-direction and the Z-direction.
  • the laser oscillator 4 As the laser oscillator 4, a YAG laser, a CO 2 laser, an excimer laser or the like is used.
  • the laser oscillator 4 is a pulse laser oscillator, and a repetition frequency thereof is set by the control device 8.
  • the laser oscillator 4 generates pulse oscillation at the set repetition frequency, and emits a pulsed laser light 2 of the repetition frequency.
  • This repetition frequency is the frequency of a pulse.
  • the repetition frequency is set to a constant frequency (e.g., 100 kHz).
  • the pulsed laser light 2 emitted by the laser oscillator 4 is incident.
  • the laser irradiation control system 7 receives the input of a control command from the control device 8, and blocks or transmits the incident pulsed laser light 2 by one pulse unit based on the input control command.
  • the laser irradiation control system 7 has an acoustooptic element 7a and a beam damper 7b. Furthermore, the laser irradiation control system 7 has a reflecting mirror 7c. Owing to an acoustooptic effect of the acoustooptic element 7a, a laser optical path is changed to transmit the pulsed laser light 2 to the galvanometer scanner 6 via the reflecting mirror 7c, or to irradiate the beam damper 7b with the light and block the light.
  • the acoustooptic element 7a there is selected an element having a response speed which is higher than the repetition frequency of the pulsed laser light 2 oscillated by the laser oscillator 4. In consequence, it can be determined that the pulsed laser light 2 is transmitted to the galvanometer scanner 6 or that the beam damper 7b is irradiated with the light to block the light, by the one pulse unit.
  • the laser irradiation control system 7 may be constituted of an electrooptic element 7d, a polarized beam splitter 7e and the beam damper 7b.
  • the electrooptic element 7d there is selected an element having a response speed which is higher than the repetition frequency of the pulsed laser light 2 oscillated by the laser oscillator 4.
  • the pulsed laser light 2 can change a polarizing direction thereof by the electrooptic element 7d, and the P-polarized or S-polarized pulsed laser light 2 transmitted through the electrooptic element 7d is selectively emitted.
  • the polarized beam splitter 7e having such optical characteristics as to substantially totally transmit the P-polarized light and substantially totally reflect the S-polarized light, the pulsed laser light 2 is transmitted or reflected in accordance with the polarizing direction.
  • the focusing lens 3 focuses the pulsed laser light 2 transmitted through the laser irradiation control system 7 and the galvanometer scanner 6 on the surface of the substrate 1.
  • the galvanometer scanner 6 On the galvanometer scanner 6, the pulsed laser light 2 transmitted through the laser irradiation control system 7 is incident. Then, the galvanometer scanner 6 irradiates the surface of the substrate 1 with the pulsed laser light 2 via the focusing lens 3 disposed in the subsequent stage.
  • the galvanometer scanner 6 is constituted of an unshown pair of galvanometer mirrors to scan, along the surface of the substrate 1, an irradiation point (the spot) of the pulsed laser light 2 which has passed through the focusing lens 3. Furthermore, the galvanometer scanner 6 has an unshown signal generating unit to generate a signal corresponding to a scanning speed of the irradiation point of the pulsed laser light 2 which has passed through the focusing lens 3 on the surface of the substrate 1.
  • the substrate 1 is mounted on the X-Y stage 5 so that the surface of the substrate is perpendicular to an axis of the focusing lens 3. On the X-Y stage 5, the substrate 1 is moved freely in an X-Y direction. Moreover, the X-Y stage 5 has an unshown signal generating unit to generate a signal corresponding to a moving speed of the substrate 1.
  • the X-Y stage 5 is moved, whereby the irradiation point of the laser light can be scanned along the surface of the substrate 1. That is, the galvanometer scanner 6 scans the irradiation point of the pulsed laser light 2 in the X-Y direction, and the X-Y stage 5 moves the substrate 1 which is the material to be processed in the X-Y direction. In consequence, the pulsed laser light 2 and the substrate 1 are moved relatively in the X-Y direction, and the pulsed laser light 2 transmitted through the laser irradiation control system 7 is scanned along the surface of the substrate 1.
  • the pulsed laser light 2 is scanned along the surface of the substrate 1 by the galvanometer scanner 6 and the X-Y stage 5, but the pulsed laser light 2 may be scanned only by the galvanometer scanner 6. Moreover, the pulsed laser light 2 may be scanned only by the X-Y stage 5. That is, in the present embodiment, both the galvanometer scanner 6 and the X-Y stage 5 function as scanning units, but one of the galvanometer scanner 6 and the X-Y stage 5 may function as the scanning unit. In this case, the other one of the galvanometer scanner 6 and the X-Y stage 5 can be omitted.
  • the control device 8 acquires one or both of the signal corresponding to the scanning speed of the galvanometer scanner 6 and the signal corresponding to the moving speed of the substrate 1, to obtain the scanning speed of the irradiation point of the pulsed laser light 2 relative to the surface of the substrate 1. Moreover, the control device 8 controls the switching of the blocking/transmitting of the pulsed laser light 2 in the laser irradiation control system 7 in accordance with the scanning speed. That is, the control device 8 outputs, to the laser irradiation control system 7, a control command which is a blocking/transmitting command of the pulsed laser light 2.
  • the leading groove of the substrate for the ink jet head is formed so that an etching liquid enters the groove during anisotropic etching in a post-step of the laser processing step, whereby an anisotropic etching time is shortened, and a width of an ink supply port is further decreased.
  • the pulsed laser light 2 of the constant repetition frequency is emitted by the laser oscillator 4.
  • the laser oscillator 4 is a nanosecond YAG laser, and oscillates the linearly polarized pulsed laser light 2 having a wavelength of 355 nm, a repetition frequency of 100 kHz and an output power of 10 W.
  • the laser oscillator 4 Since the laser oscillator 4 generates the pulse oscillation at the constant repetition frequency, an excitation time does not fluctuate, and unlike a case where the repetition frequency is variable, the oscillator is excellent in laser light output stability.
  • the pulsed laser light 2 emitted by the laser oscillator 4 is guided to the laser irradiation control system 7.
  • the laser irradiation control system 7 When the laser irradiation control system 7 has the acoustooptic element 7a and the beam damper 7b, there is selected the acoustooptic element 7a having the response speed which is higher than the repetition frequency of the laser light 2, for example, a response speed of 1 MHz. Moreover, when the laser irradiation control system 7 has the electrooptic element 7d, the polarized beam splitter 7e and the beam damper 7b, there is selected the electrooptic element 7d having the response speed which is higher than the repetition frequency of the laser light 2, for example, a response speed of 1 MHz.
  • the one pulse unit determines that the laser light 2 is transmitted to the galvanometer scanner 6, or that the beam damper 7b is irradiated with the laser light to block the laser light.
  • the pulsed laser light 2 transmitted through the laser irradiation control system 7 is guided to the galvanometer scanner 6, and transmitted through the focusing lens 3, to irradiate the surface of the substrate 1 with the light.
  • the laser irradiation control system 7 can switch the blocking/transmitting of the pulsed laser light 2 by the one pulse unit, it is possible to irradiate the substrate 1 with the pulsed laser light 2 at an irradiation frequency which is not higher than the repetition frequency of the laser oscillator 4. For example, when the blocking and the transmitting of the pulsed laser light 2 of a repetition frequency of 100 kHz is alternately switched by the laser irradiation control system 7 every pulse, the irradiation frequency of the pulsed laser light 2 transmitted through the laser irradiation control system 7 is 50 kHz. Furthermore, in the laser irradiation control system 7, the processing of the substrate 1 can be executed and stopped when the control device 8 executes the switching control of the blocking/transmitting.
  • the substrate 1 is the substrate for the ink jet head which is made of silicon with a (100) crystal plane.
  • the substrate 1 is provided with a heater and electric wiring, an etching stop layer or an etching protective film having an etching resistance, and the like as a system to discharge ink, a system for an etching step after the laser processing step of the present embodiment, and the like.
  • the substrate 1 is formed in a thickness of about 725 micrometers.
  • the substrate 1 is irradiated with the laser, and the laser and the substrate are relatively reciprocated until a desirable leading groove shape and depth are obtained.
  • the shape of the leading groove preferably has a width of 5 to 100 micrometers so that the etching liquid enters the groove during the anisotropic etching in the post-step, whereby the anisotropic etching time is shortened, and the width of the ink supply port is further decreased.
  • the depth of the leading groove is preferably from 600 to 710 micrometers.
  • a length of the groove varies in accordance with a size of the ink jet head, but is from about 5 to 50 mm.
  • the pulsed laser light 2 transmitted through the laser irradiation control system 7 passes through the galvanometer scanner 6 and the focusing lens 3, and is focused on the substrate 1.
  • the pulsed laser light 2 focused on the substrate 1 is scanned along the substrate 1 by one or both of the X-Y stage 5 and the galvanometer scanner 6, and the processing is performed at a focusing point (the irradiation point).
  • the scanning speed of the pulsed laser light 2 is not necessarily constant.
  • the laser is reciprocated relatively to a substrate by the X-Y stage 5 and/or the galvanometer scanner 6 to process the material until a desirable groove depth is obtained, and hence the laser has to be stopped in an end portion of the groove which is a returning portion.
  • the speed is lower than a predetermined speed.
  • an irradiation density of the pulsed laser light 2 becomes higher in the portion where the speed is low than in a portion where the speed is high, which makes a difference in processing amount, especially in processing depth.
  • the moving speed becomes low, and hence the irradiation density becomes high in the end portion of the groove which is the returning portion of the laser, as compared with the center of the groove where the laser can be moved at the constant speed.
  • the control device 8 executes the switching control of the blocking/transmitting of the pulsed laser light 2 in the laser irradiation control system 7, in accordance with the scanning speed of the pulsed laser light 2 on the surface of the substrate 1.
  • the control operation of the control device 8 will be described with reference to a flowchart shown in FIG. 3.
  • control device 8 receives information of the moving speed of the X-Y stage 5 as a signal from the X-Y stage 5, and receives information of the scanning speed of the galvanometer scanner 6 as a signal from the galvanometer scanner 6 (S1).
  • control device 8 calculates a scanning speed v of the pulsed laser light 2 relative to the substrate 1 (S2).
  • the control device 8 obtains an irradiation period T of the pulsed laser light required to irradiate the surface of the substrate 1 with the pulsed laser light at a predetermined interval d, by use of data of the scanning speed v of the pulsed laser light 2 on the surface of the substrate 1 which is obtained in the step S2 (S3).
  • the predetermined interval d preferably is not larger than a diameter of the laser light. In consequence, a processing efficiency is increased, and a portion which remains to be processed can be prevented from being left.
  • the irradiation frequency f may be obtained by substitution into the relational equation, or the irradiation frequency f may be obtained on the basis of the table data.
  • the control device 8 determines the irradiation period T. Then, the control device 8 outputs, to the laser irradiation control system 7, a control command based on the obtained irradiation period T, to control the switching of the blocking/transmitting of the pulsed laser light in the laser irradiation control system 7 so that the surface of the substrate 1 is irradiated with the pulsed laser light in the irradiation period T (S4).
  • the irradiation frequency f of the pulsed laser light 2 with which the substrate 1 is irradiated is set so as to be the repetition frequency of the laser oscillator 4.
  • the scanning speed is a predetermined speed, as shown in FIG. 4A
  • control is executed so that the pulsed laser light 2 is not cut, but is used as it is, to irradiate the surface of the substrate 1 with the pulsed laser light 2 at an irradiation frequency of 100 kHz, i.e., in an irradiation period of 10 microseconds.
  • the scanning speed is a speed which is 1/2 of the predetermined speed, as shown in FIG.
  • control is executed so that one pulse is cut every two pulses, to irradiate the surface of the substrate 1 with the pulsed laser light 2 at an irradiation frequency of 50 kHz which is 1/2 of the repetition frequency of the laser oscillator 4, i.e., in an irradiation period of 20 microseconds.
  • the substrate in the groove processing of the ink jet head, the substrate is irradiated with the pulsed laser light in the constant irradiation period in the center of the groove, and the substrate is irradiated in a period which is at least twice as long as the constant irradiation period in the end portion of the groove.
  • the pulsed laser light 2 is scanned along the surface of the substrate 1 at a predetermined speed of 100 mm/sec until the desirable processing of the substrate 1 is completed, to end the processing of the leading groove of the substrate 1 for the ink jet head.
  • a groove depth was in a range of 600 to 700 micrometers, and it was possible to obtain a preferable shape of the leading groove of the substrate 1 for the ink jet head.
  • control of blocking and transmitting in accordance with the speed was not executed by the laser irradiation control system 7, and processing of a groove having a width of 30 micrometers and a length of 20 mm was performed.
  • a groove depth was in a range of 600 to 725 micrometers (the groove extended through the substrate), and it was not possible to obtain the preferable shape of the leading groove of the substrate for the ink jet head.
  • the repetition frequency of the laser oscillator 4 is constant.
  • the control device 8 controls the switching of the blocking/transmitting of the pulsed laser light 2 in the laser irradiation control system 7 in accordance with the change of the scanning speed of the pulsed laser light 2, to change the irradiation period T of the pulsed laser light 2 with which the surface of the substrate 1 is irradiated.
  • the repetition frequency of the laser oscillator 4 is constant, the energy of the pulsed laser light 2 per pulse is stabilized.
  • the surface of the substrate 1 can be irradiated with the pulsed laser light 2 having the stabilized energy at the predetermined interval d, it is possible to decrease the fluctuation of the irradiation density of the pulsed laser light 2 with which the processing portion of the surface of the substrate 1 is irradiated, and desirable laser processing can be performed with high accuracy.
  • the substrate 1 is the substrate for the ink jet head, but the substrate 1 is not limited to the substrate for the ink jet head, and can be used to process another semiconductor material substrate, a glass substrate, a circuit substrate or the like.
  • the processing is not limited to the processing of a groove such as the leading groove, and processing such as reforming or joining can more uniformly be performed.
  • a specific application use is not limited to the processing of the leading groove of the ink jet head, and examples of the application use include the processing of the circuit substrate, scribing of a substrate for a solar battery, trimming of a resistance element, and seal welding of a battery case.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Lasers (AREA)

Abstract

Selon la présente invention, la surface d'une matière à traiter peut être irradiée avec une lumière laser pulsée à des intervalles prédéterminés tout en gardant une fréquence de répétition constante d'un oscillateur laser, et une précision élevée de traitement laser est atteinte. La présente invention porte également sur un appareil de traitement laser (100) qui comprend un dispositif de commande (8) qui commande la commutation d'un blocage/émission de la lumière laser pulsée (2) dans un système de commande d'irradiation laser (7). Le dispositif de commande (8) obtient, à partir d'une vitesse de balayage d'une lumière laser pulsée (2) sur la surface d'une matière à traiter, une période d'irradiation de la lumière laser pulsée nécessaire pour irradier la surface de la matière à traiter avec la lumière laser pulsée (2) à des intervalles prédéterminés. De plus, le dispositif de commande (8) commande le système de commande d'irradiation laser (7) de telle sorte que la surface de la matière à traiter est irradiée avec la lumière laser pulsée dans la période d'irradiation obtenue.
PCT/JP2012/007283 2011-12-08 2012-11-13 Appareil de traitement laser, procédé de traitement laser, substrat pour tête à jet d'encre et procédé de fabrication de tête à jet d'encre WO2013084413A1 (fr)

Applications Claiming Priority (2)

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JP2011268723A JP5967913B2 (ja) 2011-12-08 2011-12-08 レーザ加工装置、レーザ加工方法及びインクジェットヘッド基板
JP2011-268723 2011-12-08

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WO2013084413A1 true WO2013084413A1 (fr) 2013-06-13

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CN112139684A (zh) * 2019-06-28 2020-12-29 株式会社迪思科 激光加工装置

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WO2014080672A1 (fr) * 2012-11-26 2014-05-30 ビアメカニクス株式会社 Dispositif d'usinage laser et procédé d'usinage laser
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