WO2013078923A1 - Led灯散热器及led灯具 - Google Patents
Led灯散热器及led灯具 Download PDFInfo
- Publication number
- WO2013078923A1 WO2013078923A1 PCT/CN2012/083033 CN2012083033W WO2013078923A1 WO 2013078923 A1 WO2013078923 A1 WO 2013078923A1 CN 2012083033 W CN2012083033 W CN 2012083033W WO 2013078923 A1 WO2013078923 A1 WO 2013078923A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat sink
- led lamp
- ribs
- rib
- heat
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
- F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the invention relates to an LED lamp radiator and an LED lamp. Background technique
- Embodiments of the present invention provide an LED light radiator and an LED lamp, which can improve the heat dissipation effect of the LED lamp.
- an LED lamp heat sink comprising: a hollow heat sink body; and a heat sink bottom plate disposed at one end of the heat sink body.
- a plurality of ribs may be disposed on the outer wall of the heat sink body.
- the thickness of the center of the heat sink bottom plate is greater than the thickness of the edge of the heat sink bottom plate.
- the ribs are at an angle to the outer wall of the heat sink body, the angle being less than 90°, preferably between 80 and 45. Within the range, more preferably between 80 and 60. In the range.
- the thickness of the portion of the rib adjacent the heat sink body is greater than the thickness of the portion of the rib away from the heat sink body.
- the height of the portion of the rib near the bottom plate of the heat sink may be greater than the height of the portion of the rib away from the bottom plate of the heat sink.
- the portion of the rib that is adjacent to the heat sink base is provided with a bifurcation.
- At least one opening corresponding to the LED single lamp may be disposed on the heat sink base plate.
- the average height H of the ribs is 3-4 times the distance d between the ribs.
- the average thickness C of the heat sink base plate is 2 - 3 times the average thickness m of the ribs.
- the heat sink base plate has an average thickness of 4.5 to 5.8 mm.
- the spacing d between the ribs is 3.3-4.5 mm
- the average thickness m of the ribs is 2.0-2.7 mm
- the average height H of the ribs is 6.5-9.0 mm
- the length 1 of the ribs is 40. -50mm.
- the number N of the ribs is, for example, 16, 18 or 20.
- an LED lamp comprising the LED lamp heat sink as described above and at least one LED single lamp located in the LED lamp heat sink.
- FIG. 1 is a schematic structural view of an LED lamp heat sink according to an embodiment of the present invention.
- FIG. 2 is a front elevational view of an LED lamp heat sink according to an embodiment of the present invention.
- FIG. 3 is a left side view of an LED lamp heat sink according to an embodiment of the present invention.
- FIG. 4 is a top plan view of an LED lamp heat sink according to an embodiment of the present invention.
- Figure 5 is a schematic diagram of the relationship between the maximum temperature of the LED lamp heat sink and the rib spacing
- Figure 6 is a schematic diagram of the relationship between the maximum temperature of the LED lamp heat sink and the thickness of the rib
- Figure 7 is the maximum temperature of the LED light radiator and the heat sink Schematic diagram of the relationship between the thickness of the base plate.
- an LED lamp heat sink includes: a hollow heat sink body 11 , the outer wall of the heat sink body 11 is provided with a plurality of ribs 12 ; and a cover for sealing the heat sink The heat sink bottom plate 13 at the bottom of the body 11.
- the heat sink body 11 may be cylindrical, and the heat sink bottom plate 13 may be circular.
- the thickness of the center of the heat sink base plate 13 is greater than the thickness of the edge of the heat sink base plate 13.
- the thickness of the heat sink base plate 13 may gradually decrease from the center to the edge, or may decrease from the center to the edge step.
- the rib 12 in the present invention is at an angle to the outer wall of the heat sink body 11, which is less than 90. . That is, the ribs in the present invention are designed as diagonal ribs. If the inclined ribs are used, although the heat storage effect is good and the heat exchange area is large, the flow inhibition coefficient will increase, and the difficulty in realizing the manufacturing process will be improved. If a straight rib is used, although the flow inhibition coefficient is small, the heat storage effect is not good and the heat exchange area is small. In the embodiment of the invention, the ribs are in the form of inclined ribs, which can ensure better heat storage effect, sufficient heat exchange area, and small flow inhibition coefficient.
- the thickness of the portion of the rib 12 near the heat sink body 11 may be greater than the thickness of the portion of the rib 12 away from the heat sink body 11.
- the height of the portion of the rib 12 adjacent to the heat sink base 13 may be greater than the height of the portion of the rib 12 away from the heat sink base 13.
- the thickness of the rib 12 in the present invention is gradually decreased from the bottom of the rib to the top of the rib, wherein the bottom of the rib is the portion of the rib 12 near the heat sink body 11, and the top of the rib is the rib 12 away from heat dissipation. Part of the body 11. Since the heat is transferred from the bottom to the top, not only heat dissipation but also heat storage at the bottom of the ribs is considered to prevent heat load shock. When the heat is dissipated upward while the heat is reduced, the thickness of the fins is gradually reduced. Alternatively, the thickness of the ribs 12 may also be stepped from the bottom of the ribs to the top of the ribs.
- the height of the rib 12 gradually decreases from the bottom end to the top end to 0, wherein the bottom end is the portion of the rib 12 adjacent to the heat sink bottom plate 13, and the top end is the portion of the rib 12 away from the heat sink bottom plate 13. Further, the height of the ribs 12 may also be reduced to zero from the bottom end to the top end step.
- a bifurcation 15 is provided at the bottom end of the rib 12 so as to increase the heat dissipating area when heat is introduced into the rib.
- At least one corresponding LED single is disposed on the heat sink base plate 13.
- the opening 14 of the lamp can increase the air convection and improve the heat dissipation effect.
- the LED lamp heat sink comprises a heat sink body and a heat sink base plate.
- a plurality of inclined ribs may be provided on the outer wall of the radiator body. The thickness of the ribs gradually decreases from the bottom of the rib to the top of the rib, and the height gradually decreases from zero to zero at the top end.
- a bifurcation is provided at the bottom end of the rib so that when the LED lamp is in operation, heat generated can be transmitted to the heat sink body and transmitted to the inclined rib by conduction, convection, radiation, or the like.
- the diagonal ribs increase the heat dissipation area, which can improve the heat dissipation of the LED lamp.
- the thickness of the heat sink bottom plate gradually decreases from the center to the edge, so that the heat generated by the heat source can be radiated from the middle to the periphery, which is favorable for heat conduction.
- the radiator base plate can also be provided with a plurality of openings corresponding to the LED single lamps, which can increase air convection and further improve the heat dissipation effect.
- the relevant parameters of the LED light radiator can be designed to further improve
- the heat dissipation effect of the LED light radiator mainly include the rib pitch d, the average thickness m of the ribs, the average height H of the ribs, the length of the ribs 1, and the thickness ⁇ of the heat sink bottom plate.
- Natural convection requires a certain rib spacing to meet the requirements of natural convection, otherwise the heat dissipation between the ribs will be affected by the vortex of heat. When forced convection, the rib spacing can be smaller.
- the ANSYS software simulation can be used to verify the influence of the fin spacing d on the maximum temperature of the LED lamp radiator.
- the set environmental parameters are: ⁇ Natural convection mode, convective heat transfer coefficient is 7.01W/M2.K; Ambient temperature is 25 °C; The heat flux density of the radiator is 1250W/M 2 ;
- the LED lamp radiator is made of aluminum extrusion or die-casting.
- Figure 5 shows the relationship between the maximum temperature of the LED lamp heat sink and the rib spacing d.
- the rib spacing d decreases, the number of ribs increases, increasing the heat dissipation surface area, so the maximum temperature of the LED lamp heat sink should theoretically be lower and lower.
- the maximum temperature decrease of the LED lamp heat sink is gradually flattened, so the pitch of the ribs is not as small as possible, and Need to choose the right spacing.
- the rib spacing d may have a value of 3.3-4.5 mm.
- Natural convection requires a certain rib thickness to increase the heat storage capacity of the LED lamp radiator and The buffering effect on the heat flow increases the heat capacity; when forced convection, the thickness of the ribs can be smaller.
- the ANSYS software simulation can be used to verify the effect of the average thickness m of the ribs on the maximum temperature of the LED lamp radiator.
- the set environmental parameters are: ⁇ natural convection, convection heat transfer coefficient is
- LED lamp heat sink is made of aluminum extrusion or die-casting.
- Figure 6 shows the relationship between the maximum temperature of the LED lamp heat sink and the average thickness m of the rib. It can be seen from Fig. 6 that when the value of m is small, the change of the maximum temperature of the LED lamp heat sink is not very obvious; when m is gradually increased, the maximum temperature of the LED lamp radiator is the lowest when it is increased to 2.56 mm; At the same time, the maximum temperature of the LED lamp radiator gradually rises because the heat dissipation area gradually decreases as the thickness of the rib increases. Therefore, it is necessary to select a suitable rib thickness m.
- the average thickness m of the ribs may be 2.0-2.7 mm.
- the height of the ribs can be large, but it is limited by the shape of the heat sink.
- the increase in the average height H of the ribs has a large effect on the natural convection heat loss.
- the average height H of the ribs does not exceed 3 to 4 times the distance d of the ribs. Otherwise, the arrangement density of the ribs is relatively large, which ultimately affects the heat reflow.
- the height of the ribs is generally as high as possible without affecting the heat backflow, which increases the heat dissipation surface area.
- the average height H of the ribs may be 3d - 4d. Specifically, the average height H of the ribs may be 6.5-9.0mm.
- the length of the rib is generally determined according to the volume shape of the LED lamp heat sink.
- the rib length 1 in order to achieve a better heat dissipation effect, can satisfy the following formula:
- I " 18 , ⁇ d ⁇ 6.5 the specific value of 1 can be 40-50mm.
- the thickness of the heat sink base plate When designing the thickness of the heat sink base plate, if the heat sink base plate is too thin, the thermal resistance can be reduced, but the heat storage effect is not good, and the heat sink design needs to take into account the steady-state buffering action of the heat flow to combat the transient heat load. If the heat sink base plate is too thick, the thermal resistance is large, and the weight and cost of the heat sink are increased. Therefore, the thickness of the heat sink base plate should be moderate.
- the ANS YS software simulation can be used to verify the influence of the average thickness C of the radiator base plate on the maximum temperature of the LED lamp radiator.
- the set environmental parameters are: ⁇ Natural convection mode, convective heat transfer coefficient is 7.01W/M2.K; Environment The temperature is 25 °C; the heat flux density of the radiator is 1250W/M 2 ; The LED lamp radiator is made of aluminum extrusion or die-casting.
- Figure 7 shows the relationship between the maximum temperature of the LED lamp heat sink and the average thickness C of the heat sink base. It can be seen that the maximum temperature change is not 4 ⁇ when the heat sink bottom plate is thin, and the LED is 5 when C is 5 mm. The maximum temperature of the lamp radiator is the lowest, and when the C is gradually increased, the maximum temperature of the LED lamp radiator gradually increases due to the gradual increase of the thermal resistance. Therefore, the heat sink base plate needs to choose the proper thickness.
- the average thickness C of the heat dissipation substrate may be 2 - 3 of the average thickness m of the ribs. Times.
- the value of specific C can be 4.5-5.8mm.
- the average height H and the average thickness m of the ribs can be determined according to the requirements for heat transfer efficiency and heat dissipation surface area. The higher the ribs, the thinner the ribs will heat up to the top of the ribs; the thicker and shorter the ribs will reduce the heat dissipation surface area.
- the average height H and the average thickness m of different ribs can be selected according to different average thicknesses of the radiator base plate C, as shown in Table 1:
- the average thickness C of the heat sink base plate in the embodiment of the present invention May be 4.8-5.5mm; inter-major d may be 3.5-4mm; rib average thickness m may be 2.5-2.7mm; rib average height H may be 7-8.96mm; rib length 1 may be 40-46mm; The number of ribs N may be 16, 18 or 20.
- the experimental environmental parameters are: ⁇ Natural convection mode, convective heat transfer coefficient is 7.01W /M2.K; The ambient temperature is 25 °C; the LED single lamp heat flux density is 13121.82W/M 2 , and the heat sink heat flux density is 1250W/ M 2 .
- the LED lamp pin temperature is up to 53.379 °C, and the LED lamp heatsink surface temperature is up to 50.684 °C; when the LED lamp heat sink is made by die casting The LED lamp pin temperature is 53.779 ° C, and the LED lamp heat sink surface temperature is 50.888 ° C.
- the heat sink of the LED lamp usually does not have a bottom plate, and the number of ribs disposed on the heat sink body is relatively large (30-45), and the spacing between the ribs is relatively small (1.0-2.0 mm), and the ribs are relatively small. Short (average height H is generally 2.5-5.0mm) and ribs are shorter ( 15-35mm).
- the above parameter design affects the heat storage effect of the heat sink and the steady state buffer of the heat flow, so that the heat dissipation effect of the LED lamp is not good.
- the measured pin temperature of the existing LED lamp with a total power of 6W is about 70 °C.
- the surface temperature of the heat sink is 60 ° C:. According to the above data, it can be seen that the LED lamp heat sink of the present invention has a remarkable heat dissipation effect.
- the embodiment of the invention further provides an LED lamp comprising an LED lamp heat sink as shown in Figures 1-4 and at least one LED single lamp located in the LED lamp heat sink.
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014543755A JP2015500549A (ja) | 2011-12-02 | 2012-10-16 | Ledランプ放熱器及びled照明器具 |
US13/805,720 US9182082B2 (en) | 2011-12-02 | 2012-10-16 | LED-light heatsink and LED lamp |
KR1020127031722A KR20130075742A (ko) | 2011-12-02 | 2012-10-16 | Led-라이트 히트싱크 및 led 램프 |
EP12791678.1A EP2789908B1 (en) | 2011-12-02 | 2012-10-16 | Led lamp heat radiator and led lamp |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110397971.0 | 2011-12-02 | ||
CN201110397971.0A CN102635839B (zh) | 2011-12-02 | 2011-12-02 | Led灯散热器及led灯具 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013078923A1 true WO2013078923A1 (zh) | 2013-06-06 |
Family
ID=46620342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2012/083033 WO2013078923A1 (zh) | 2011-12-02 | 2012-10-16 | Led灯散热器及led灯具 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2789908B1 (zh) |
JP (1) | JP2015500549A (zh) |
KR (1) | KR20130075742A (zh) |
CN (1) | CN102635839B (zh) |
WO (1) | WO2013078923A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016031371A1 (ja) * | 2014-08-26 | 2016-03-03 | 岩崎電気株式会社 | ランプ |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102635839B (zh) * | 2011-12-02 | 2015-04-01 | 京东方科技集团股份有限公司 | Led灯散热器及led灯具 |
US9182082B2 (en) | 2011-12-02 | 2015-11-10 | Boe Technology Group Co., Ltd. | LED-light heatsink and LED lamp |
JP7300849B2 (ja) * | 2019-03-05 | 2023-06-30 | 三菱電機株式会社 | ヒートシンク及び照明装置 |
JP7278107B2 (ja) * | 2019-03-05 | 2023-05-19 | 三菱電機株式会社 | ヒートシンク及び照明装置 |
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Also Published As
Publication number | Publication date |
---|---|
CN102635839B (zh) | 2015-04-01 |
KR20130075742A (ko) | 2013-07-05 |
EP2789908A1 (en) | 2014-10-15 |
JP2015500549A (ja) | 2015-01-05 |
EP2789908B1 (en) | 2017-01-11 |
CN102635839A (zh) | 2012-08-15 |
EP2789908A4 (en) | 2015-09-16 |
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