WO2013069919A1 - Panneau d'affichage et dispositif d'affichage présentant ledit panneau - Google Patents

Panneau d'affichage et dispositif d'affichage présentant ledit panneau Download PDF

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Publication number
WO2013069919A1
WO2013069919A1 PCT/KR2012/009030 KR2012009030W WO2013069919A1 WO 2013069919 A1 WO2013069919 A1 WO 2013069919A1 KR 2012009030 W KR2012009030 W KR 2012009030W WO 2013069919 A1 WO2013069919 A1 WO 2013069919A1
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WO
WIPO (PCT)
Prior art keywords
display panel
substrate
modulus
core material
particulate core
Prior art date
Application number
PCT/KR2012/009030
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English (en)
Korean (ko)
Inventor
정경택
고정주
곽병도
기승범
김원중
김정섭
박용완
Original Assignee
제일모직 주식회사
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Application filed by 제일모직 주식회사 filed Critical 제일모직 주식회사
Publication of WO2013069919A1 publication Critical patent/WO2013069919A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/06—Electrode terminals

Definitions

  • the present invention relates to a display panel and a display device including the same. More specifically, the present invention relates to a display panel including an anisotropic conductive film and a substrate and a display apparatus including the same, which are capable of preventing separation of the conductive particles when pressing the anisotropic conductive film formed on the substrate and eliminating the problem of lowering the conductivity. It is about.
  • the conductive adhesive includes an isotropic conductive adhesive and an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • monodisperse electroconductive particle is contained in the form disperse
  • the electroconductive particle contains the monodisperse polymer particle (henceforth a core material) comprised from polystyrene, polymethylmethacrylate, and an amino resin polymer.
  • Japanese Patent Application Laid-open No. Hei 16-123842 discloses a process of producing an initial condensate, which is an amino resin precursor, by reacting an amino compound with formaldehyde, dyeing, emulsifying and curing to prepare colored amino resin crosslinked particles. Described.
  • This core material is coated with a conductive material.
  • electroless plating is mainly used as a method of plating metal materials (Ni and Au).
  • a process of pretreating the polymer particles to be plated in a state suitable for plating is important. This pretreatment process consists of etching, conditioning, sensitization, activation, and predeposition processes in that order.
  • anisotropically conductive films containing conductive particles containing core materials such as polystyrene-based resins, poly (meth) acrylate-based resins, amino resins, polyurethane-based resins, etc. are applied to glass substrates, commercial PCBs and the like, there is no particular problem.
  • high strength polymer materials have advantages of being relatively hard or having few deformations, but problems such as high initial resistance or breakage or cracking of particles occur.
  • the polymer composite particles are relatively soft and easily deformable polymer such as acrylic resin or polyurethane resin, the initial conductivity is good but easily deformed and excessively crushed, so that the conductive particles undergo plastic deformation during thermocompression. There is a problem.
  • Another object of the present invention is to provide a display device including the display panel.
  • Display panel is a substrate; And an anisotropic conductive film formed on the substrate, wherein the anisotropic conductive film comprises: a particulate core material; And conductive particles including a conductive layer formed on the surface of the particulate core material, wherein a modulus ratio (B / A) of the modulus (B) of the particulate core material to the modulus (A) of the substrate may be less than about 1 have.
  • the substrate may include one or more of glass, silicone, acrylic resin, epoxy resin, polyester resin, polyethersulfone resin, polyarylate resin, polycarbonate resin, and polyimide resin.
  • the modulus of the particulate core material may be about 0.1 MPa-1.0 GPa.
  • the modulus of the substrate can be about 0.1 MPa-75 GPa.
  • the substrate is a glass substrate, and the modulus ratio may be about 0.15 x 10 -5-0.01 .
  • the substrate may be a silicon-based substrate having a modulus of about 0.1 MPa-15 MPa.
  • the particulate core material may include a silicone-based resin.
  • the silicone resin may include one or more of polyalkylsiloxane, polyarylsiloxane, polyalkylarylsiloxane, silicone rubber.
  • the particulate core material is styrene-butadiene rubber (SBR), butadiene-based rubber, isoprene-based rubber, chloroprene, neoprene rubber, ethylene-propylene-diene terpolymer, styrene-ethylene-butylene-styrene (SEBS) block copolymer, styrene Ethylene-propylene-styrene (SEPS) block copolymers, acrylonitrile-butadiene rubber (NBR), hydrogenated nitrile rubber (HNBR), or fluorinated rubber It may further include the above.
  • SBR styrene-butadiene rubber
  • HNBR hydrogenated nitrile rubber
  • fluorinated rubber It may further include the above.
  • the particulate core material may have a particle diameter of about 2 ⁇ m-20 ⁇ m.
  • the conductive layer may include at least one of a conductive polymer layer and a metal layer.
  • the conductive layer may be one in which the metal layer is sequentially stacked on the conductive polymer layer.
  • the conductive polymer layer may include one or more of polypyrrole, polyaniline, polythiophene, and derivatives thereof.
  • the conductive polymer layer may have a thickness of about 1 nm to 500 nm.
  • the metal layer may include at least one of Ni, Au, Ag, Cu, Zn, Cr, Al, Co, Sn, Pt, and Pd.
  • the metal layer may have a thickness of about 10 nm to 300 nm.
  • the metal layer may be a single layer or a multilayer.
  • a display device may include the display panel.
  • the present invention provides a display panel which prevents conductive particles from being separated from the anisotropic conductive film even when the anisotropic conductive film is pressed onto the substrate.
  • FIG. 1 is a cross-sectional view of a display panel of one embodiment of the present invention.
  • FIG. 2 is a conceptual diagram of a state before pressing the driver IC to the display panel.
  • FIG. 3 is a conceptual diagram of a state in which a driver IC is pressed on the display panel.
  • FIG. 5 is a schematic cross-sectional view of the conductive particles of one embodiment of the present invention.
  • FIG. 6 is a schematic cross-sectional view of conductive particles of another embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view of conductive particles of yet another embodiment of the present invention.
  • modulus means storage modulus, and modulus is a value measured under a frequency of about 0.01 Hz to 100 Hz in a bending mode, a constant load up to about 16 N, and a strain amplitude of about 0.1 to 240 ⁇ m. It may mean.
  • Display panel is a substrate; And an anisotropic conductive film formed on the substrate, wherein the anisotropic conductive film comprises: a particulate core material; And a conductive layer formed on the surface of the particulate core material, wherein the modulus ratio (B / A) of the modulus (B) of the particulate core material to the modulus (A) of the substrate may be less than about 1.
  • the conductive particles included in the anisotropic conductive film may be separated from the anisotropic conductive film to the substrate, or the connection between the bump of the driver IC and the substrate electrode may be difficult.
  • the connection between the bump of the driver IC and the substrate electrode may be difficult.
  • the display panel of the present invention may include an anisotropic conductive film containing conductive particles such that the above-described separation problem or connection problem does not occur. This may be due to making the modulus of the particulate core material of the present invention smaller than the modulus of the substrate.
  • the modulus ratio is 1 or more, when the anisotropic conductive film containing the conductive particles is pressed onto the substrate, the conductive particles may be separated from the anisotropic conductive film or the conductivity may not be easily secured.
  • the modulus ratio may be about 0.4 or more and less than one.
  • FIG. 1 is a cross-sectional view of a display panel of one embodiment of the present invention.
  • the display panel 100 may have a structure in which an anisotropic conductive film 5 including conductive particles 4 is stacked on a substrate 10 on which electrodes 9 are formed.
  • 2 and 3 respectively show a state before and after the driver IC 20 in which the bumper 8 is formed on the display panel of one embodiment of the present invention is pressed.
  • 2 and 3 when the driver IC 20 having the bumper 8 is compressed, excessive or insufficient conductivity between the bumper 20 of the driver IC 20 and the conductive particles 4 in the substrate 10 is reduced. You can control the connection. That is, the display may be realized by minimizing a defect such as an electrical short generated when an abnormal connection between the bumper and the bumper of the driver IC and the substrate electrode to be connected to the driver IC or other substrate electrodes occurs. According to FIG. 3, even when compressed, the conductive particles are densely concentrated in the bumps as compared with FIG. 2 without being separated from the anisotropic conductive film, thereby minimizing a poor electrical conduction.
  • the substrate may include both a glass substrate and a flexible substrate.
  • the substrate is one of a polyester resin, a polyether sulfone resin, a polyarylate resin, a polycarbonate resin, a polyimide resin, including a glass, a silicone, an acrylic resin, an epoxy resin, a polyethylene terephthalate, a polyethylene naphthalate, and the like. It may contain the above.
  • the modulus of the substrate can be about 0.1 MPa-75 GPa.
  • the substrate may be a silicon-based substrate having a modulus of about 0.1 MPa-15 MPa.
  • the substrate can be a glass substrate having a modulus of about 65 GPa-75GPa.
  • the modulus ratio may be less than about 1.
  • the substrate can be a glass substrate, wherein the ratio of the modulus can be less than about 1, preferably about 0.15 x 10 -5-0.01 .
  • the substrate may be a flexible substrate including silicon-based or the like, wherein the ratio of the modulus may be less than about 1, preferably about 0.4 or more and less than 1.
  • the substrate may have a thickness of about 30 ⁇ m-200 ⁇ m.
  • An electrode may be formed on the substrate surface to connect the driver IC and the bumper to the substrate.
  • the anisotropic conductive film can contain the said electroconductive particle.
  • the anisotropic conductive film 5 comprises a matrix 6; And conductive particles 4 included in the matrix 6.
  • the conductive particles are fine particle core; And a conductive layer formed on the surface of the particulate core material, wherein the conductive layer may include at least one of a conductive polymer layer and a metal layer.
  • the particulate core material may have a modulus of about 0.1 Mpa-1.0 GPa, preferably about 1 Mpa-10 MPa. Within this range, the conductive particles can be prevented from being separated from the anisotropic conductive film or the conductivity deteriorated in the process of pressing the anisotropic conductive film containing the conductive particles onto the substrate.
  • the particulate core material may be monodisperse. That is, the particle size distribution of the electroconductive particle containing a particulate core material can be uniform. When the particle size distribution is uniform, it is excellent in electrical conductivity.
  • the particulate core material may have an average particle diameter of about 2 ⁇ m to 20 ⁇ m, preferably about 2 ⁇ m to 7 ⁇ m. Within this range, the function as conductive particles may not be lost, and short circuits between adjacent electrodes may not occur.
  • the particulate core material may include particles including a silicone-based resin.
  • the conductive particles can be efficiently compressed onto the substrate, and by controlling the ratio between the conductive particles and the modulus of the substrate through the interconnection between the conductive particles, the conductive layer is appropriately connected during the compression to form the conductive particles. It is possible to solve the problem of the deterioration of conductivity caused by the departure and the potential failure.
  • the silicone resin may include at least one of polyalkylsiloxane, polyarylsiloxane, polyalkylarylsiloxane, and silicone rubber including polydimethylsiloxane.
  • the particulate core material includes styrene-butadiene rubber (SBR), butadiene rubber, isoprene rubber, chloroprene rubber, neoprene rubber, ethylene-propylene-diene terpolymer, styrene-ethylene-butylene-styrene (SEBS ) Block copolymers, styrene-ethylene-propylene-styrene (SEPS) block copolymers, acrylonitrile-butadiene rubber (NBR), hydrogenated nitrile rubber (HNBR) and florinated rubber It may further include one or more of Fluorinated Rubber.
  • SBR styrene-butadiene rubber
  • isoprene rubber chloroprene rubber
  • neoprene rubber ethylene-propylene-diene terpolymer
  • SEBS styrene-ethylene-butylene-styrene
  • SEBS sty
  • the shape of the particulate core material is not limited, but may be spherical.
  • a conductive layer may be stacked on the particulate core material to impart conductivity.
  • the conductive layer may include at least one of a conductive polymer layer and a metal layer.
  • 5 to 7 are schematic cross-sectional views of the conductive particles of the embodiment of the present invention.
  • the electroconductive particle 4 is the fine particle core 1; And it may include a conductive polymer layer (2) formed on the particulate core material (1).
  • the electroconductive particle 4 is the fine particle core 1; And a metal layer 3 formed on the particulate core material 1.
  • the conductive layer may be formed of a conductive polymer layer and a metal layer sequentially. That is, as shown in FIG. 7, the conductive particles 4 include the fine particle core 1; And a conductive polymer layer (2) formed on the particulate core material (1); And a metal layer 3 formed on the conductive polymer layer 2.
  • the conductive polymer layer may include one or more of polypyrrole, polyaniline, polythiophene, and derivatives thereof.
  • the conductive polymer layer may have a thickness of about 1 nm to 500 nm, preferably about 10 nm to 200 nm. Within the above range, conductivity can be imparted and can be used for an anisotropic conductive film.
  • the metal layer may include at least one of Ni, Au, Ag, Cu, Zn, Cr, Al, Co, Sn, Pt, and Pd.
  • the metal layer may have a thickness of about 10 nm to 300 nm, preferably about 80 nm to 200 nm. Within the above range, conductivity can be imparted and can be used for an anisotropic conductive film.
  • the conductive polymer layer or the metal layer may have a single layer structure or a multilayer structure of two or more layers of different kinds of metals.
  • the metal layer is a single layer or continuous multilayer structure of a dissimilar metal material, for example, Ni / Au alloy, the coating property on the surface of the particulate core material, the stability of the metal material and the conductivity thereof may be improved.
  • the shape of the conductive particles is not limited, but may be spherical particles.
  • the said electroconductive particle can be manufactured by a conventional method. For example, (a) forming a particulate core material using a composition comprising a silicone-based resin; And (b) forming a conductive layer including at least one of a conductive polymer layer and a metal layer on the surface of the particulate core material.
  • Step (a) may be to form a monodisperse crosslinked particulate core material by suspension polymerization, precipitation polymerization, dispersion polymerization, seed polymerization, multistage seed polymerization or direct molding.
  • the direct molding method may mean a molding method that is not made in a solution.
  • Step (b) may be to form a conductive polymer layer on the surface of the particulate core material by dispersing the particulate core material in a dispersion solvent together with a dispersion stabilizer, by adding a monomer and an initiator for the conductive polymer to react.
  • the dispersion stabilizer of step (b) serves to stabilize the dispersion of the polymer particles in a dispersion solvent, polyvinylpyrrolidone, polyvinyl alcohol, ionic or nonionic interface having water dispersibility or alcohol dispersibility
  • a dispersion solvent an alcohol solvent or water can be used, and as an initiator, APS ((NH 4 ) 2 S 2 O 8 ), KSP (K 2 S 2 O 8 ), FeCl 3 and the like can be used.
  • a metal catalyst may be deposited on the surface of the conductive polymer layer and then electroless plated to form a metal layer.
  • Pd catalyst is preferably used as the metal catalyst.
  • Pd particles may be deposited on the surface and subjected to metal electroless plating to form a metal layer.
  • the conductive particles may be included in about 1-5% by weight of the anisotropic conductive film. Within this range, it is possible to maintain the insulating properties and to maintain the circuit-to-circuit connection performance, which is the original role of the conductive particles.
  • the matrix of the anisotropic conductive film may include a resin that is commonly used in manufacturing an anisotropic conductive film.
  • the matrix of the anisotropic conductive film may include an epoxy-based, (meth) acrylate-based, and the like.
  • the thickness of the anisotropic conductive film may be about 10 ⁇ m-40 ⁇ m.
  • Another aspect of the invention may include a display panel.
  • the device is not particularly limited as long as the device may include the display panel.
  • the device may include a display device (eg, a flexible display device).
  • a conductive polymer layer made of polythiophene was formed on the particulate core material of Table 1 to prepare particles having a particle diameter of 3-4 ⁇ m.
  • Ni coating was applied to the surface of the particles to form a Ni coating at a thickness of 100 ⁇ 10 nm, and then Au was coated at a thickness of 50 ⁇ 5 nm to prepare conductive particles.
  • Anisotropic conductivity by curing a composition comprising conductive particles, acrylic copolymer, acrylate modified urethane resin, acrylonitrile butadiene copolymer, isocyanuric acid ethylene oxide modified diacrylate, silica particles and lauroyl peroxide A film was prepared.
  • the anisotropic conductive film was crimped
  • a substrate on which an anisotropic conductive film was formed was prepared in the same manner as in Example 1, except that the particulate core material of Table 1 and the substrate of Table 1 were used.
  • the force was measured at 185 ° C. for 5 seconds at 5 MPa to measure conductivity.
  • a substrate on which an anisotropic conductive film was formed was prepared in the same manner as in Example 1, except that the particulate core material of Table 1 and the substrate of Table 1 were used. Conductivity was measured by applying a force at 185 ° C. at 20 MPa for 5 seconds.
  • a substrate on which an anisotropic conductive film was formed was prepared in the same manner as in Example 1, except that the particulate core material of Table 1 and the substrate of Table 1 were used. Conductivity was measured by applying a force at 185 ° C. at 20 MPa for 5 seconds.
  • the modulus (storage modulus) of the particulate core and the substrate was measured using DMA 242C, and the modulus was measured under a frequency of 0.01 to 100 Hz, constant load up to 16 N, and strain amplitude of 0.1 to 240 ⁇ m in bending mode.
  • Example 1 Example 2
  • Example 3 Comparative Example 1 Particulate heartwood Silicone Silicone Silicone Polycarbonate Modulus of particulate core material (B) 2 MPa 2 MPa 10 MPa 50 MPa Board Glass Silicone Silicone Silicone Modulus (A) of the board 70 GPa 5 MPa 12 MPa 10 MPa Modulus Ratio (B / A) 2.86 x 10 -5 0.4 0.83 5 Conductivity 3-5 m 3-5 m 6-12 m ⁇ Not detectable

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

La présente invention concerne un panneau d'affichage et un dispositif d'affichage présentant ledit panneau. Plus particulièrement, la présente invention concerne un panneau d'affichage comprenant : un substrat ; et un film conducteur anisotrope disposé sur le substrat, le film conducteur anisotrope comprenant un matériau central particulaire, et des particules conductrices comprenant une couche conductrice disposée sur une surface du matériau central particulaire, un rapport de module (B/A) d'un module (B) du matériau central particulaire à un module (A) du substrat étant inférieur à 1. L'invention concerne également un dispositif d'affichage présentant ledit panneau.
PCT/KR2012/009030 2011-11-09 2012-10-31 Panneau d'affichage et dispositif d'affichage présentant ledit panneau WO2013069919A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0116621 2011-11-09
KR20110116621 2011-11-09

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WO2013069919A1 true WO2013069919A1 (fr) 2013-05-16

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KR (1) KR20130051426A (fr)
TW (1) TW201324536A (fr)
WO (1) WO2013069919A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11652052B2 (en) 2021-03-29 2023-05-16 Tpk Advanced Solutions Inc. Contact structure and electronic device having the same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005317500A (ja) * 2004-04-26 2005-11-10 Joinset Co Ltd 導電性シリコンパウダーとその製造方法、並びにこれを適用した異方導電性フィルム及び導電性ペースト
KR20060058856A (ko) * 2004-11-26 2006-06-01 제일모직주식회사 고분자-금속 복합입자 시스템 및 이를 이용한 이방 도전성필름
KR100882313B1 (ko) * 2006-03-09 2009-02-10 주식회사 엘지화학 도전성 미립자 도전볼 및 그의 제조방법
KR100913686B1 (ko) * 2001-11-28 2009-08-24 다우 코닝 도레이 캄파니 리미티드 이방성 전기 전도성 접착 필름, 이의 제조방법 및 이를 포함하는 반도체 장치
KR20110034606A (ko) * 2008-07-24 2011-04-05 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 도전성 입자, 이방성 도전 필름, 접합체 및 접속 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100913686B1 (ko) * 2001-11-28 2009-08-24 다우 코닝 도레이 캄파니 리미티드 이방성 전기 전도성 접착 필름, 이의 제조방법 및 이를 포함하는 반도체 장치
JP2005317500A (ja) * 2004-04-26 2005-11-10 Joinset Co Ltd 導電性シリコンパウダーとその製造方法、並びにこれを適用した異方導電性フィルム及び導電性ペースト
KR20060058856A (ko) * 2004-11-26 2006-06-01 제일모직주식회사 고분자-금속 복합입자 시스템 및 이를 이용한 이방 도전성필름
KR100882313B1 (ko) * 2006-03-09 2009-02-10 주식회사 엘지화학 도전성 미립자 도전볼 및 그의 제조방법
KR20110034606A (ko) * 2008-07-24 2011-04-05 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 도전성 입자, 이방성 도전 필름, 접합체 및 접속 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11652052B2 (en) 2021-03-29 2023-05-16 Tpk Advanced Solutions Inc. Contact structure and electronic device having the same

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KR20130051426A (ko) 2013-05-20
TW201324536A (zh) 2013-06-16

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