WO2013066162A1 - Procédé et dispositif d'encapsulation de composants électroniques au moyen d'un matériau de réduction qui subit un changement de phase - Google Patents

Procédé et dispositif d'encapsulation de composants électroniques au moyen d'un matériau de réduction qui subit un changement de phase Download PDF

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Publication number
WO2013066162A1
WO2013066162A1 PCT/NL2012/050724 NL2012050724W WO2013066162A1 WO 2013066162 A1 WO2013066162 A1 WO 2013066162A1 NL 2012050724 W NL2012050724 W NL 2012050724W WO 2013066162 A1 WO2013066162 A1 WO 2013066162A1
Authority
WO
WIPO (PCT)
Prior art keywords
mould cavity
encapsulating
reduction material
reduction
mould
Prior art date
Application number
PCT/NL2012/050724
Other languages
English (en)
Inventor
Joannes Leonardus Jurrian Zijl
Wilhelmus Gerardus Jozef Gal
Original Assignee
Fico B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico B.V. filed Critical Fico B.V.
Priority to CN201280050764.0A priority Critical patent/CN103874569B/zh
Priority to KR1020147012095A priority patent/KR102017672B1/ko
Priority to SG2014011431A priority patent/SG2014011431A/en
Priority to DE112012004392.8T priority patent/DE112012004392B4/de
Priority to JP2014537018A priority patent/JP6133879B2/ja
Priority to GB1407324.1A priority patent/GB2516148B/en
Publication of WO2013066162A1 publication Critical patent/WO2013066162A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/1701—Component parts, details or accessories; Auxiliary operations using a particular environment during moulding, e.g. moisture-free or dust-free
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/005—Using a particular environment, e.g. sterile fluids other than air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Definitions

  • the invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) placing an electronic component for encapsulating into a mould cavity connecting to the carrier, B) filling the mould cavity with liquid encapsulating material, and C) at least partially curing the encapsulating material in the mould cavity.
  • the invention also relates to a device for performing such a method.
  • encapsulation of electronic components more particularly the encapsulation of semiconductors mounted on a carrier (such as for instance a lead frame)
  • a carrier such as for instance a lead frame
  • semiconductors are interpreted broadly here such that, in addition to chips, they also include other electronic components such as for instance Light Emitting Diodes (LEDs).
  • the carrier with electronic components is clamped here between mould parts such that mould cavities are defined around the components for encapsulating. A liquid encapsulating material is fed into these mould cavities, after at least partial curing of which the mould parts are moved apart and the carrier with encapsulated electronic components is removed.
  • the encapsulating material usually consist of a thermocuring epoxy or resin incorporating a filler. Pressure is exerted on the encapsulating material, which is usually also heated, as a result of which heating the encapsulating material, to the extent it is not already liquid, does become liquid.
  • the liquid encapsulating material fills the (usually heated) mould cavity and the liquid encapsulating material cures at least partially in the mould cavity, for instance by means of chemical bonding (cross-linking).
  • a determined underpressure i.e. a gas pressure lower than the ambient air pressure
  • the mould cavity is here usually brought to underpressure through suction channels (ventings) which enable the discharge of gases during filling of the mould cavity.
  • Tt is of great importance to completely fill the mould cavity with encapsulating material.
  • a problem in the encapsulation of electronic components is that, depending on the specific conditions, the mould cavities are not always completely filled with encapsulating material, whereby openings (voids) remain in the
  • This phenomenon occurs particularly at the front of the flow front of the encapsulating material in the mould cavity, where (small) air bubbles or released gases may be enclosed in the encapsulating material.
  • the present invention has for its object to provide a method and device for
  • the present invention provides for this purpose a method of the type stated in the preamble, wherein a reduction material is introduced into the mould cavity before the mould cavity is wholly or partially filled with encapsulating material, which reduction material undergoes a phase change during filling of the mould cavity with the encapsulating material such that the volume of the reduction material decreases.
  • the reduction material it is possible here for the reduction material to at least condense from the gas phase during filling of the mould cavity with the encapsulating material, although it is also possible for the reduction material to transpose from the gas phase to the solid phase, or for the reduction material to condense as (optionally superheated) vapour or to transpose to a solid substance.
  • the reduction material can be carried actively into the mould cavity in gas phase and/or as mist, wherein a more specific option is to actively feed the reduction material as superheated steam. It is on the other hand also possible for the reduction material to be in liquid phase or in solid phase when it is actively carried into the mould cavity.
  • the reduction material has a relatively large volume (low mass density) and that, under the conditions in which the encapsulating process takes place, the reduction material undergoes a phase change.
  • the pressure increase also plays an important part since the temperature at which the phase change occurs is very much dependent on the pressure.
  • Encapsulation takes place in a temperature range of [1 50-200] ° C and at a pressure of [50-1 00] Bar, more particularly at [60-90] Bar.
  • the molecular weight of the reduction material is as small as possible.
  • the invention also provides a method wherein a film material is arranged between the carrier with electronic components and the mould cavity connecting to the carrier, the liquid encapsulating material is fed between the carrier and the film material and the reduction material is carried between the film and the mould cavity.
  • the reduction material is thus separated from the electronic components for encapsulating, from the carrier and from the encapsulating material.
  • the reduction material is in this way after all situated on the side of the film material facing away from the carrier with electronic components, while the carrier with electronic components (and later, during the encapsulating process, the encapsulating material as well) is on the contrary situated on the opposite side of the film (i.e.
  • An advantage of the encapsulation of electronic components, wherein a film material is applied in combination with application of a reduction material, is that the advantages of applying encapsulating material (for instance no chance of adhesion of the encapsulating material to the mould cavity) can thus be realized without structural measures having to be taken in order to enable degassing of the mould cavity. In the encapsulation with film material it is thus not necessary to make provision for preventing the buildup of overpressure in the mould cavity.
  • the overpressure can rise high, whereby the risk of damage to the film material (mini- cracks) increases.
  • Discharge channels are usually arranged for this purpose in the mould part in which the mould cavity (or the mould cavities) are arranged.
  • the presence of the reduction material makes such a provision unnecessary because a volume reduction occurs as a result of the phase change in the reduction material such that a degassing (venting) of the mould cavity or cavities has become unnecessary. Not only does this make the mould part with the mould cavity or cavities easier to manufacture but, perhaps more importantly, it thus also makes a simpler mould part less susceptible to malfunction during operation.
  • degassing provisions connecting to a mould cavity can become easily clogged with dirt or, for instance in the case that a film separation does not function properly, with encapsulating material. Cleaning such a mould part with clogged degassing provision is labour-intensive and can impede the progress of production.
  • Another advantage of the superfluity of a degassing provision is that it hereby becomes possible to apply smooth or even polished mould cavities for the purpose of manufacturing encapsulations with specific possible applications The invention makes it unnecessary to guide enclosed gas to a venting via surface roughness of the mould cavity. It thus becomes possible for instance to manufacture lenses using encapsulating material.
  • Yet another sought-after property of the reduction material is that it does not already undergo a reducing phase change before the pressure is increased; premature condensation of the reduction material for instance is in this way prevented. This is not only important because the desired effect (substantial volume reduction of the reduction material during the encapsulating process) no longer occurs in the case of for instance premature condensation; the condensate can also impede good encapsulation.
  • a phase change of the reduction material before the encapsulating process begins is however permitted if it is an expanding phase change. If a reduction material is introduced in for instance liquid phase or solid phase into the mould cavity but the reduction material expands before the actual encapsulating process takes place, this does not have to be a problem.
  • the volume reduction of the reduction material can be very
  • a further improvement of the desired effect is that an underpressure is applied in the mould cavity before or during filling of the mould cavity with encapsulating material as according to processing step B).
  • This refers to an underpressure relative to atmospheric pressure, or a pressure lower than 1 atmosphere.
  • An underpressure which can be realized in the mould cavity in simple manner amounts to 0.1 Bar absolute.
  • the reduction material can be added to the mould cavity separately of the encapsulating material, for instance by injecting or blowing in the reduction material, although feeding a (rapidly evaporating) small quantity of liquid (for instance liquid water) or a solid particle reduction material (ice) can likewise result in the desired conditioned starting position of the mould cavity before the actual encapsulation. It is however also possible for the reduction material to be fed in combination with the encapsulating material, this however such that the reduction material enters the mould cavity before the encapsulating material .
  • the encapsulating material can be conditioned for this purpose by for instance adding reduction material to the encapsulating material.
  • the encapsulating material can be fed to the mould cavity once this latter has been positioned during processing step A) relative to an electronic component for encapsulating. It is also possible to heat the encapsulating material before it is displaced to the mould cavity, and by means of exerting pressure on the encapsulating material it can be carried to the mould cavity. Particularly envisaged here is the so-called transfer moulding process, wherein the encapsulating material is urged to the mould cavity by one or more plungers.
  • the present invention can also be combined with other encapsulating processes, such as for instance also compressing the encapsulating material in the mould cavity using the closing pressure of the mould parts (compression moulding) or injecting encapsulating material into the mould cavity (injection moulding).
  • the application of reduction material in the mould cavity can result in the above stated advantages irrespective of the manner of feeding of the encapsulating material to the mould cavity.
  • the reduction material can be fed into the mould cavity through a suction opening for gases (ej ect air or venting) before the mould cavity is closed.
  • the reduction material (for instance in the form of steam) can thus be introduced into the mould cavity in a short time, for instance within 1 -3 seconds. Only then can the mould parts which define the mould cavity be brought to closing pressure.
  • the invention also provides a device for encapsulating electronic components mounted on a carrier, comprising: mould parts which are displaceable relative to each other and which, in a closed position, define at least one mould cavity for enclosing an electronic component, and feed means for liquid encapsulating material connecting to the mould cavity, wherein the device is also provided with feed means for a reduction material connecting to the mould cavity.
  • the feed means for the reduction material can comprise a heating element for bringing the reduction material to a desired condition for the purpose of feeding, and the feed means for the reduction material can for instance be formed by one or more nozzles connecting to the mould cavity.
  • An embodiment variant of the device according to the present invention is also provided with feed means for feeding a film material between the mould parts.
  • the feed means for a reduction material and the feed means for encapsulating material can be located here on opposite sides of the film fed by the feed means for film material.
  • the reduction material is also prevented from making contact with the electronic component for encapsulating. Because the reduction material in this embodiment variant does not come into contact with the electronic component for encapsulating and the carrier, the reduction material cannot therefore have any undesirable effect thereon. This increases the possibilities for the choice of a suitable reduction material. It should also be noted here that the encapsulating material also remains physically separated from the reduction material, which also prevents reduction material and encapsulating material influencing each other undesirably.
  • a simplified feed of the reduction material can be realized if the feed means for a reduction material are adapted to arrange the reduction material on a film material.
  • the reduction material then need no longer be introduced into a mould cavity by the feed means. It suffices for the reduction material to be arranged on the film material, which film material with adhering encapsulating material is then anyway placed between the mould parts.
  • the feed of the film material is thus also used to introduce the reduction material between the mould parts.
  • figure 1 shows a schematic perspective view of a part of a prior art device for encapsulating electronic components mounted on a carrier
  • FIGS. 2A and 2B show two different top views of a carrier with electronic components during successive phases of the prior art encapsulating process
  • figure 3 shows a schematic side view of a device for encapsulating electronic components mounted on a carrier according to the present invention
  • FIGS. 4A and 4B show schematic side views of a device for encapsulating electronic components mounted on a carrier according to the present invention, wherein the device is also provided with a feed for film material, and
  • FIG 5 shows a cross-section through a part of an embodiment variant of an encapsulating device according to the invention with a so-called "top edge” feed for the encapsulating material.
  • Figure 1 shows a cut-away cross-section through two mould parts 1, 2. Arranged in the lower mould part 2 is a recess 3 for receiving a carrier 4 (for instance a lead frame or a board) on which electronic components 5 are arranged. Via a channel 6 connecting to the mould cavity encapsulating material 7 is fed to the mould cavity as according to arrow Pi. In the shown situation mould cavity 3 is only partially filled with a carrier 4 (for instance a lead frame or a board) on which electronic components 5 are arranged. Via a channel 6 connecting to the mould cavity encapsulating material 7 is fed to the mould cavity as according to arrow Pi. In the shown situation mould cavity 3 is only partially filled with
  • encapsulating material 12 is fed by means of feed channels 11. From feed channels 11 the encapsulating material 12 flows to a distributing chamber 13, from which the encapsulating material 12 flows with a flow front 14 over a great width over the carrier (film gating) as according to arrows P 2 . Situated on carrier 10 are electronic components 15 which, because they protrude above the surface of carrier 10, produce a determined resistance to the flow of encapsulating material 12 over carrier 10. The result hereof is that the flow front does not flow in a straight line over carrier 10 but has a more complex shape which, as shown, can lag behind at the position of electronic components 15.
  • the encapsulating material flows between the electronic components with less resistance, which causes the risk of gas inclusions 16 at the position of (adjacently of) electronic components 15. This is undesirable because gas inclusions 16 can form openings in the final encapsulation of electronic components 15.
  • FIG. 3 shows a cut-away cross-section through two mould parts 20, 21 of an encapsulating device 22 according to the present invention.
  • a recess 23 for receiving a carrier 24 on which stacked electronic components 25 (flip chips) are arranged.
  • Encapsulating material 27 can be fed to mould cavity 28 via a runner 26 connecting to the mould cavity. The feed of encapsulating material 27 takes place here by means of a plunger 29 with which pressure can be exerted on encapsulating material 27.
  • Plunger 29 is displaceable for this purpose in a housing 30 into which the encapsulating material 27 is also carried.
  • a reduction material 31, for instance in the form of water vapour 32, can be introduced into mould cavity 26.
  • mould cavity 28 Before introducing encapsulating material 27 into the mould cavity it is for instance possible to "flush" mould cavity 28 with reduction material 31, 32.
  • An option here is to apply an underpressure in mould cavity 28 by a suction opening 33. Since a reservoir 34 with reduction material 31, 32 is in open connection with mould cavity 28, the vapour pressure will also decrease in reservoir 34, whereby the reduction material 31, 32 (for instance water) begins to boil.
  • the temperature of the reduction material in reservoir 34 is chosen for this purpose such that the desired boiling state of reduction material 31, 32 occurs precisely as a result of the reduced pressure.
  • the water vapour will flush through mould cavity 28 through a conduit 35 with the then opened valve 36 and (partly) disappear again through the suction opening.
  • Figure 4A shows a cross-section through an encapsulating device 37 according to an embodiment variant of the present invention provided with two mould parts 20, 21 connecting on opposite sides to a carrier 24 with electronic components 25.
  • the lower mould part 21 is likewise provided with a flat contact side 23 which supports carrier 24.
  • Mould part 20 is provided with a mould cavity 40 which encloses a plurality of electronic components.
  • a film material 38 which, following one or more process runs, is discharged again to a discharge roller 46.
  • the film material forms a separating layer, on one side of which encapsulating material can be fed between carrier 24 and film material 38 (see figure 4B herefor) by feed means for encapsulating material 42 which connect to an intermediate space 39 to be created between carrier 24 and film material 38.
  • Feed means 41 for reduction material are placed such that the reduction material can be fed onto film material 38 as according to arrow P5 before this latter is carried between mould parts 20, 21. During feed of film material 38 the reduction material is thus also fed at a location where mould cavity 40 is situated.
  • Liquid encapsulating material is then guided as according to arrow P4 between film material 38 and carrier 24 by means of feed means 42. Under the pressure of the encapsulating material and as a result of the phase change of the reduction material in mould cavity 40 film 38 will be displaced toward the walls of mould cavity 40 (see figure 4B). For the discharge of gases and possible surplus fed encapsulating material (arrow ⁇ ) a venting 43 is left clear by the mould parts.
  • Figure 5 shows a part of an encapsulating device 50 with an upper mould part 52 and a lower mould part 51 assembled from a plurality of relatively displaceable components.
  • a carrier 54 is clamped between a relatively displaceable support 55 and edge part 53 such that encapsulating material 60 can be fed through a feed channel 61 over the upper side of edge part 53 by means of a plunger 59.
  • One of the advantages of using edge part 53 is that an edge area of carrier 54 can thus be kept free of encapsulating material.
  • a second feed channel 56 for feeding a reduction material is opened, with the result that reduction material can be fed as according to arrow P 7 .
  • This reduction material penetrates here between a film 62 placed on carrier 54 with electronic components and the mould cavity 58 in upper mould part 52.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

L'invention concerne un procédé permettant d'encapsuler des composants électroniques montés sur un support, ledit procédé comprend les étapes de traitement, à savoir : A) placer un composant électronique à encapsuler dans une cavité de moule reliée au support, B) remplir la cavité de moule d'un matériau d'encapsulation liquide, et C) faire durcir au moins partiellement le matériau d'encapsulation dans la cavité de moule. On introduit un matériau de réduction lors de l'étape de traitement B. Ledit matériau subit un changement de phase lors de l'étape de traitement B, ce qui entraîne la diminution du volume du matériau de réduction. L'invention concerne également un dispositif conçu pour l'application de ce procédé.
PCT/NL2012/050724 2011-10-18 2012-10-18 Procédé et dispositif d'encapsulation de composants électroniques au moyen d'un matériau de réduction qui subit un changement de phase WO2013066162A1 (fr)

Priority Applications (6)

Application Number Priority Date Filing Date Title
CN201280050764.0A CN103874569B (zh) 2011-10-18 2012-10-18 用于使用经历相变的还原材料来封装电子元件的方法和设备
KR1020147012095A KR102017672B1 (ko) 2011-10-18 2012-10-18 상 변화를 겪는 변형 재료를 이용하여 전자 부품들을 캡슐화하기 위한 방법 및 장치
SG2014011431A SG2014011431A (en) 2011-10-18 2012-10-18 Method and device for encapsulating electronic components using a reduction material which undergoes a phase change
DE112012004392.8T DE112012004392B4 (de) 2011-10-18 2012-10-18 Verfahren und Vorrichtung zur Einkapselung elektronischer Bauteile mithilfe eines eine Phasenänderung durchlaufenden Reduktionsmaterials
JP2014537018A JP6133879B2 (ja) 2011-10-18 2012-10-18 相変化を生じる体積減少材を用いて電子部品を封止する方法および装置
GB1407324.1A GB2516148B (en) 2011-10-18 2012-10-18 Method and device for encapsulating electronic components using a reduction material which undergoes a phase change

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL2007614A NL2007614C2 (nl) 2011-10-18 2011-10-18 Werkwijze en inrichting voor het met behulp van een reductie-materiaal dat een faseovergang ondergaat omhullen van elektronische componenten.
NL2007614 2011-10-18

Publications (1)

Publication Number Publication Date
WO2013066162A1 true WO2013066162A1 (fr) 2013-05-10

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PCT/NL2012/050724 WO2013066162A1 (fr) 2011-10-18 2012-10-18 Procédé et dispositif d'encapsulation de composants électroniques au moyen d'un matériau de réduction qui subit un changement de phase

Country Status (9)

Country Link
JP (1) JP6133879B2 (fr)
KR (1) KR102017672B1 (fr)
CN (1) CN103874569B (fr)
DE (1) DE112012004392B4 (fr)
GB (1) GB2516148B (fr)
MY (1) MY165079A (fr)
NL (1) NL2007614C2 (fr)
SG (1) SG2014011431A (fr)
WO (1) WO2013066162A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
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WO2019057388A1 (fr) * 2017-09-21 2019-03-28 Robert Bosch Gmbh Dispositif et procédé de fabrication d'éléments de construction recouverts d'une matière de coulée au moins par endroits
TWI831752B (zh) * 2017-09-21 2024-02-11 德商羅伯特博斯奇股份有限公司 用於製造利用澆鑄複合物而覆蓋於某些區域的組件之裝置與方法

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JP6133879B2 (ja) 2017-05-24
GB2516148B (en) 2016-10-26
DE112012004392B4 (de) 2021-10-28
DE112012004392T5 (de) 2014-07-10
GB201407324D0 (en) 2014-06-11
SG2014011431A (en) 2014-06-27
JP2014530510A (ja) 2014-11-17
MY165079A (en) 2018-02-28
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KR102017672B1 (ko) 2019-09-03
GB2516148A (en) 2015-01-14

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