WO2013061695A1 - Fluide de coupe soluble dans l'eau pour une scie à fil hélicoïdal à grains abrasifs fixe, procédé de découpe l'utilisant et son procédé de recyclage - Google Patents

Fluide de coupe soluble dans l'eau pour une scie à fil hélicoïdal à grains abrasifs fixe, procédé de découpe l'utilisant et son procédé de recyclage Download PDF

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Publication number
WO2013061695A1
WO2013061695A1 PCT/JP2012/072878 JP2012072878W WO2013061695A1 WO 2013061695 A1 WO2013061695 A1 WO 2013061695A1 JP 2012072878 W JP2012072878 W JP 2012072878W WO 2013061695 A1 WO2013061695 A1 WO 2013061695A1
Authority
WO
WIPO (PCT)
Prior art keywords
water
cutting
wire saw
fixed abrasive
soluble
Prior art date
Application number
PCT/JP2012/072878
Other languages
English (en)
Japanese (ja)
Inventor
清史 鈴木
清斗 戸嶋
Original Assignee
パレス化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パレス化学株式会社 filed Critical パレス化学株式会社
Priority to JP2012553104A priority Critical patent/JP5207498B1/ja
Priority to CN201280029282.7A priority patent/CN103597585B/zh
Priority to KR1020137030403A priority patent/KR101506027B1/ko
Publication of WO2013061695A1 publication Critical patent/WO2013061695A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives

Definitions

  • the present invention relates to a water-soluble cutting solution for a fixed abrasive wire saw used for cutting a silicon ingot using a fixed abrasive wire saw, a cutting method using the same, and a recycling method thereof.
  • the present invention provides a water-soluble cutting solution for a fixed abrasive wire saw with less foaming and high cutting performance, a cutting method using the same, and a recycling method thereof.
  • the present inventors have conducted extensive research, and as a result, (a) terpene alkylene oxide block copolymer and (b) glycol, polyalkylene glycol, glycol ether, and polyalkylene glycol ether at least. It has been found that by using a water-soluble cutting liquid containing one type and (c) water, foaming is small and cutting performance is high even when used for a fixed abrasive wire saw. That is, the present invention includes (a) a terpene alkylene oxide block copolymer, (b) at least one of glycol, polyalkylene glycol, glycol ether and polyalkylene glycol ether, and (c) water. It is a water-soluble cutting solution for fixed abrasive wire saws.
  • the present invention provides an ingot cutting method characterized in that a silicon ingot is cut with a fixed abrasive wire saw using the above-mentioned water-soluble cutting solution for fixed abrasive wire saw, and the ingot is cut by the ingot cutting method. After the cutting, the water-soluble cutting liquid for fixed abrasive wire saw is separated from silicon by using a centrifuge or a filtration device.
  • the (a) terpene alkylene oxide block copolymer used in the water-soluble cutting liquid for fixed abrasive wire saws according to the present invention is a monoterpene (carbon number 10), sesquiterpene (carbon number 15) which is a hydrocarbon having isoprene as a structural unit. ), Diterpene (carbon number 20), sesterterpene (carbon number 25), triterpene (carbon number 30) and tetraterpene (carbon number 40) are copolymerized with at least one of ethylene oxide, propylene oxide and butylene oxide It is.
  • a copolymer of ethylene oxide and propylene oxide is preferable, and the ratio is preferably 3 to 30 mol of ethylene oxide and 3 to 20 mol of propylene oxide, respectively, with respect to 1 mol of the terpene.
  • the addition amount of (a) is preferably 0.01 to 5.0% by weight with respect to the entire cutting solution. When the added amount of (a) is less than 0.01% by weight, there is no defoaming effect, and there is no effect of dispersing and cleaning cutting waste generated during cutting, which is not preferable.
  • the defoaming effect and the effect of dispersing and cleaning cutting waste generated during cutting can be obtained without using a silicon-based antifoaming agent.
  • the cutting performance can be improved.
  • glycol may have two OH groups, for example, monoethylene glycol, diethylene glycol, triethylene glycol, monopropylene glycol, dipropylene glycol, Examples include tripropylene glycol and hexylene glycol.
  • the polyalkylene glycol include polyethylene glycol, polypropylene glycol, polyoxyethylene polyoxypropylene copolymer, polyoxyethylene polyoxybutylene copolymer, and the like.
  • the glycol ether include diethylene glycol monomethyl ether, diethylene glycol monobutyl ether, and diethylene glycol monohexyl ether.
  • polyoxyethylene glycol ether examples include polyoxyethylene methyl ether, butyl ether of polyoxyethylene polyoxypropylene glycol copolymer, and the like. These may be used individually by 1 type and may be used in combination of 2 or more type.
  • the weight average molecular weight of (b) is preferably 50 to 5,000. This is because if the weight average molecular weight of (b) exceeds 5,000, the viscosity is high and the cutting performance is affected.
  • the weight average molecular weight of (b) is more preferably 50 to 1,000.
  • the water-soluble cutting liquid for fixed abrasive wire saws can contain (d) a dispersant as required.
  • the dispersant used is a polycarboxylic acid obtained by graft polymerization of a polyoxyalkylene monoalkyl ether to an allyl alcohol / maleic anhydride copolymer or a salt thereof, an allyl alcohol / maleic anhydride / styrene copolymer.
  • examples include graft-polymerized polycarboxylic acids of alkylene monoalkyl ethers and salts thereof, naphthalenesulfonic acid condensates and salts thereof, and those generally sold as dispersants can be used.
  • the content of the (d) dispersant is preferably 0.1 to 5.0% by weight with respect to the entire cutting liquid. Less than 0.1% by weight is not preferable because the effect of the dispersant cannot be obtained. Moreover, even if it exceeds 5.0% by weight, there is no change in the dispersion effect as 5.0% by weight or less, and since the effect of the dispersant can be sufficiently obtained at 5.0% by weight or less, it is 5.0 from the viewpoint of cost reduction. % By weight or less is preferred. A more preferable content of (d) is 0.1 to 1.0% by weight.
  • (a), (b), (c) and (d) can be contained in any proportion, but preferred proportions are (a), ( The weight ratio of b) and (d) to (c) is 99: 1 to 50:50.
  • the weight ratio of b) and (d) to (c) is 99: 1 to 50:50.
  • (c) is less than 99: 1
  • the quality of the cut wafer is deteriorated by cutting heat generated during cutting.
  • (c) is more than 50:50, silicon scrap generated during cutting is removed from the cut wafer.
  • a more preferred weight ratio is 90:10 to 50:50.
  • the water-soluble cutting liquid for fixed abrasive wire saws may contain a rust preventive, preservative, fragrance, dye or the like, if necessary.
  • the water-soluble cutting liquid for a fixed abrasive wire saw uses a fixed abrasive wire saw as a cutting tool and a multi-wire saw as a cutting machine in the cutting of a silicon wafer that is a material for semiconductor elements and solar cells. be able to.
  • the water-soluble cutting liquid for a fixed abrasive wire saw according to the present invention can be cut and then separated from silicon and the water-soluble cutting liquid using a centrifuge and a filtration device and recycled.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention concerne : un fluide de coupe soluble dans l'eau pour une scie à fil hélicoïdal à grains abrasifs fixe, causant peu de moussage et atteignant une performance élevée de découpe ; un procédé de découpe l'utilisant ; et son procédé de recyclage. L'invention concerne un fluide de coupe soluble dans l'eau pour une scie à fil hélicoïdal à grains abrasifs fixe, caractérisé en ce qu'il comprend (a) un copolymère à blocs terpène-oxyde d'alkylène, (b) au moins un composant choisi parmi les glycols, les polyalkylène glycols, les glycol éthers et les polyalkylène glycol éthers et (c) de l'eau ; un procédé de découpe de lingot caractérisé par une découpe d'un lingot de silicium avec une scie à fil hélicoïdal à grains abrasifs fixe tout en appliquant le fluide de coupe soluble dans l'eau pour une scie à fil hélicoïdal à grains abrasifs fixe ; et un procédé de recyclage pour un fluide de coupe soluble dans l'eau pour une scie à fil hélicoïdal à grains abrasifs fixe.
PCT/JP2012/072878 2011-10-24 2012-09-07 Fluide de coupe soluble dans l'eau pour une scie à fil hélicoïdal à grains abrasifs fixe, procédé de découpe l'utilisant et son procédé de recyclage WO2013061695A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012553104A JP5207498B1 (ja) 2011-10-24 2012-09-07 固定砥粒ワイヤーソー用水溶性切断液、それを用いた切断方法及びそのリサイクル方法
CN201280029282.7A CN103597585B (zh) 2011-10-24 2012-09-07 固定研磨粒线锯用水溶性切割液、使用其的切割方法及其回收方法
KR1020137030403A KR101506027B1 (ko) 2011-10-24 2012-09-07 고정 지립 와이어 톱용 수용성 절단액, 그것을 이용한 절단 방법 및 그 리사이클 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-233196 2011-10-24
JP2011233196 2011-10-24

Publications (1)

Publication Number Publication Date
WO2013061695A1 true WO2013061695A1 (fr) 2013-05-02

Family

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Family Applications (1)

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PCT/JP2012/072878 WO2013061695A1 (fr) 2011-10-24 2012-09-07 Fluide de coupe soluble dans l'eau pour une scie à fil hélicoïdal à grains abrasifs fixe, procédé de découpe l'utilisant et son procédé de recyclage

Country Status (6)

Country Link
JP (1) JP5207498B1 (fr)
KR (1) KR101506027B1 (fr)
CN (1) CN103597585B (fr)
MY (1) MY156441A (fr)
TW (1) TW201317335A (fr)
WO (1) WO2013061695A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5802863B2 (ja) * 2013-04-05 2015-11-04 パレス化学株式会社 固定砥粒ワイヤーソー用水溶性切断液及びそれを用いたインゴットの切断方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI640619B (zh) * 2015-02-10 2018-11-11 達興材料股份有限公司 一種切割製程用的水性切割液的添加劑及其製備方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134371A (ja) * 2005-11-08 2007-05-31 Nikka Seiko Kk ウエ−ハの基準面形成方法及びその装置
JP2008290202A (ja) * 2007-05-25 2008-12-04 Daido Chem Ind Co Ltd 含水性スライシング用加工液組成物
JP2010278327A (ja) * 2009-05-29 2010-12-09 Shin Etsu Handotai Co Ltd シリコンインゴットの切断方法
JP2011005561A (ja) * 2009-06-23 2011-01-13 Shin Etsu Handotai Co Ltd シリコンインゴットの切断方法および切断システム

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
US20020035052A1 (en) * 1996-12-20 2002-03-21 Jean-Luc Joye Polyalkoxylated terpenic compounds, their process of preparation and their use as defoaming agents
JP4497767B2 (ja) 2001-09-06 2010-07-07 ユシロ化学工業株式会社 固定砥粒ワイヤソー用水溶性加工液組成物
US6784248B2 (en) * 2002-02-15 2004-08-31 Ppg Industries Ohio, Inc. Thermosetting compositions containing alternating copolymers of isobutylene type monomers
WO2009133612A1 (fr) * 2008-04-30 2009-11-05 パレス化学株式会社 Composition de fluide de coupe hydrosoluble, fluide de coupe hydrosoluble et procédé de découpe à l’aide dudit fluide
CN102686713B (zh) * 2009-11-12 2014-07-02 帕莱斯化学株式会社 固定研磨粒线锯用水溶性切割液、使用其的铸锭切割方法、其回收方法及切割所得的晶圆
CN102071090B (zh) * 2009-11-20 2014-12-03 安集微电子（上海）有限公司 一种用于太阳能硅片的线切割液

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007134371A (ja) * 2005-11-08 2007-05-31 Nikka Seiko Kk ウエ−ハの基準面形成方法及びその装置
JP2008290202A (ja) * 2007-05-25 2008-12-04 Daido Chem Ind Co Ltd 含水性スライシング用加工液組成物
JP2010278327A (ja) * 2009-05-29 2010-12-09 Shin Etsu Handotai Co Ltd シリコンインゴットの切断方法
JP2011005561A (ja) * 2009-06-23 2011-01-13 Shin Etsu Handotai Co Ltd シリコンインゴットの切断方法および切断システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5802863B2 (ja) * 2013-04-05 2015-11-04 パレス化学株式会社 固定砥粒ワイヤーソー用水溶性切断液及びそれを用いたインゴットの切断方法

Also Published As

Publication number Publication date
MY156441A (en) 2016-02-26
KR20130141702A (ko) 2013-12-26
CN103597585A (zh) 2014-02-19
JP5207498B1 (ja) 2013-06-12
TW201317335A (zh) 2013-05-01
JPWO2013061695A1 (ja) 2015-04-02
CN103597585B (zh) 2016-10-19
KR101506027B1 (ko) 2015-03-25

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