WO2013025832A1 - Réflecteur pour diode électroluminescente et logement associé - Google Patents

Réflecteur pour diode électroluminescente et logement associé Download PDF

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Publication number
WO2013025832A1
WO2013025832A1 PCT/US2012/050989 US2012050989W WO2013025832A1 WO 2013025832 A1 WO2013025832 A1 WO 2013025832A1 US 2012050989 W US2012050989 W US 2012050989W WO 2013025832 A1 WO2013025832 A1 WO 2013025832A1
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WIPO (PCT)
Prior art keywords
reflector
light
filler
emitting diode
fluororesin
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Application number
PCT/US2012/050989
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English (en)
Inventor
Pham Hoai Nam
Original Assignee
E. I. Du Pont De Nemours And Company
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Publication of WO2013025832A1 publication Critical patent/WO2013025832A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0808—Mirrors having a single reflecting layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a reflector for a light-emitting diode that has excellent heat resistance, UV stability, weather resistance, adhesivity to sealant, and has high reflectance of 85% or higher in the 400 nm to 700 nm wavelength range.
  • the present invention further relates to an LED housing containing this reflector.
  • Light-emitting diodes are compact and can be used for lighting for longer periods of time than filament bulbs, and are highly efficient in transforming electrical energy.
  • LEDs are widely utilized for home electric appliances, LED indicators, and illuminated operation switches.
  • LEDs are divided into general (visible wavelength) LEDs and ultraviolet LEDs according to the wavelengths used.
  • LEDs includes automobile dashboards, backlighting of display units of display devices (LCD displays, personal computer monitors, compact game devices, and portable telephone units), indoor illumination sources, indoor/outdoor display devices, and traffic display devices, for example.
  • display devices LCD displays, personal computer monitors, compact game devices, and portable telephone units
  • indoor illumination sources indoor/outdoor display devices
  • traffic display devices for example.
  • white LEDs combined with a fluorescent material for achieving a high level of color rendering property include: banknote identifying devices (light sources for banknote
  • identifying sensors air cleaners utilizing photocatalysts (for households, vehicles, refrigerators); contaminant treatments; fluorescent light sources for biological, medical, and analytical applications in the medical field; sterilization and retention of freshness of vegetables and food items in the foodstuff field; UV-setting light sources for electronic parts/inks; medical apparatuses; fluorescent-acryl-based illumination; UV light source motors; light sources for ultraviolet actinometers, spectroanalyses, and excitation of fluorescent agents; and sterilization light sources for medical
  • a conventional light-emitting device in which an LED chip is mounted is generally provided with a reflector (3) having a concave aperture part, a LED chip (2) mounted in the concave aperture part, and a curing resin mold (1 ) for sealing the aforementioned concave aperture part.
  • the reflector is mounted on a substrate to form a housing (5).
  • the reflector is a molded product that is obtained by, for example, molding ceramic or white reflecting resin.
  • Japanese patent no. 4576276 describes an LED housing formed of a porous alumina ceramic.
  • the porous alumina ceramic has excellent heat resistance, UV light stability, and weather resistance and can obtain high reflectance by controlling the pore diameter and the porosity.
  • the manufacture cost was high, and the productivity was poor.
  • thermoplastic resins have been used to lower the manufacture cost of the LED housing.
  • certain polyamide group resins do not melt even at 300°C.
  • Comparative example 1 because rutile-type titanium dioxide used as a filler has a refractive index of 2.7, it exhibits a high reflectance in the visible wavelength range, but its reflectance drops when the wavelength is 430 nm or less. Rutile-type titanium dioxide has a 3.0-eV band gap, and according to J. Phys. Chem. B, Vol. 107, pp. 5709-5716 (2003), this is believed to result in low reflectance at wavelengths of 430 nm or less. In addition, transformation of absorbed energy into heat and a photocatalytic action of the titanium dioxide are considered responsible for the progressive deterioration of the resin.
  • Fluororesins for example, such as polytetrafluoroethylene
  • PTFE tetrafluoroethylene-perfluoro(alkoxy vinyl ether) copolymer
  • PFA tetrafluoroethylene-perfluoro(alkoxy vinyl ether) copolymer
  • FEP tetrafluoroethylene-hexafluoropropylene copolymer
  • tetrafluoroethylene-hexafluoropropylene-perfluoro(alkoxy vinyl ether) copolymer are widely utilized for piping for transporting acidic and alkaline chemical solutions, solvents, and paints; such chemical industrial products as containers and tanks for storing chemical solutions; and such electrical industrial products as tubes, rollers, and electric wires due to their excellent characteristics such as heat resistance, light resistance, weather resistance, chemical resistance, high-frequency electric characteristics, and flame resistance. As such, they are considered for use as LED reflector resins.
  • an LED reflector and a housing containing said reflector that achieve a high reflectance with little drop in reflectance in the 400 nm to 700 nm wavelength range while exhibiting excellent heat resistance, light resistance, weather resistance, and adhesivity to a sealant is in demand.
  • the purpose of the present invention is to provide a reflector and a housing for an LED that achieves a high reflectance with little drop in reflectance in the 400 nm to 700 nm wavelength range while exhibiting excellent heat resistance, UV light stability, weather resistance, and adhesivity to sealants.
  • the present invention provides a reflector for a light-emitting diode that is obtained by molding a fluororesin containing a filler having an average particle size less than 1 .0 ⁇ and a band gap greater than 3.0 Ev.
  • the difference between the maximum value and the minimum value of the reflectance of the reflector in the 380 nm to 400 nm wavelength range is in excess of 25%.
  • the reflectance of the reflector over the wavelength range of 400 nm to 700 nm is 85% or greater.
  • the fluororesin is a homopolymer of tetrafluoroethylene or a copolymer comprising tetrafluoroethylene and at least one monomer selected from the group consisting of hexafluoropropylene, chlorotrifluoroethylene, perfluoro(a!koxy vinyl ether), vinyiidene fluoride, vinyl fluoride, ethylene, and propylene.
  • the filler has a refractive index of 1 .5 or greater. In one embodiment of the reflector for a light-emitting diode, the filler has an average particles size greater than 0.01 ⁇ but less than 1 .0 ⁇ .
  • the filler is at least one selected from the group consisting of metal oxide and metal sulfide.
  • the filler is selected from the group consisting of anatase-type titanium dioxide, tin dioxide, niobium pentoxide, and zinc sulfide.
  • the amount of filler is 0.1 to 50 weight percent based on the combined weights of said filler and said fluororesin.
  • the fluororesin composition further comprises an adhesion promoter.
  • the present invention provides a housing containing the above described reflector for a light-emitting diode.
  • the present invention provides a molded article containing a fluororesin and a filler having an average particle size less than 1 .0 ⁇ and a band gap greater than 3.0 eV.
  • the present invention provides a molded article that is obtained by molding a fluororesin containing a filler having an average particle size less than 1 .0 ⁇ and a band gap greater than 3.0 eV.
  • an LED reflector and a housing containing said reflector that achieve a high reflectance with little drop in reflectance in the 400 nm to 700 nm wavelength range while exhibiting excellent heat resistance, UV light stability, weather resistance, and adhesivity to a sealant are provided.
  • the present reflector provides a high reflectance of 85% or higher in the 400 nm to 700 nm wavelength range.
  • a filler having an average particle size less than 1 .0 ⁇ is dispersed evenly inside the reflector of the present invention, the reflectance is higher than ever can be achieved using a smaller amount of filler.
  • Figure 1 is a schematic diagram showing the housing having the reflector for LED.
  • 1 is the sealant
  • 2 is the LED chip
  • 3 is the reflector
  • 4 is the substrate
  • 5 is the housing.
  • Figure 2 is a schematic diagram showing the reflector for LED in a tape configuration.
  • 1 is the sealant
  • 2 is the LED chip
  • 3 is the reflector
  • 4 is the substrate
  • 6 is the gap.
  • Figure 3 is a graph showing the wavelength dependency of the reflectance of molded products over the wavelength range of 350 nm to 450 nm.
  • Figure 4 is a graph showing the wavelength dependency of the reflectance of molded products over the wavelength range of 350 nm to 700 nm.
  • Figure 5 is a photo obtained using an electron microscope of a fracture cross-section of the fluororesin composition of Application
  • Figure 6 is a photo obtained using an electron microscope of a fracture cross-section of the fluororesin composition of Comparative Example 2.
  • the fluororesin used in the present invention is a homopolymer of tetrafluoroethylene (TFE), in another embodiment the fluororesin is a copolymer (TFE copolymer) that comprises TFE and at least one kind of monomer (comonomer) copolymerizable with TFE.
  • TFE copolymer a copolymer that comprises TFE and at least one kind of monomer (comonomer) copolymerizable with TFE.
  • Fluororesin may be used alone or as a mixture comprising two or more fluororesins.
  • the comonomer is contained in the polymer at least in such a sufficient amount that the melting point of the fluororesin becomes substantially lower than the melting point of the TFE homopolymer (poly tetrafluoroethylene (PTFE)).
  • Fluororesin used in the present invention is preferably a melt-moldable fluororesin.
  • Melt molding refers to a molding method that utilizes a known conventional melt molding device; whereby, a molded product, for example, a film, fibers, or a tube, having sufficient levels of strength and durability to suit an intended purpose can be created from a molten substance by letting the polymer flow in its molten state.
  • the melt-moldable fluororesin used in the present invention is a copolymer comprising 40-98% of repeat unit arising from TFE and 2 to 60 mol% of comonomer that is copolymerizable with TFE.
  • comonomers include hexafluoropropylene (HFP), chlorotrifluoroethylene, perfluoroalkoxytrifluoroethylene, vinylidene fluoride, vinyl fluoride, ethylene, and propylene.
  • perfluoro(alkyl vinyl ether) having 1 to 6 carbon atoms are of utility as perfluoroalkoxytrifluoroethylenes.
  • perfluoro(alkyl vinyl ether) (PAVE) alkyl group has 1 to 5 carbon atoms, preferably, linear or branched alkyl group having 1 to 4 carbon atoms.
  • the TFE copolymer may be a copolymer comprising multiple kinds of PAVE monomers and TFE. The amount of repeating units arising from PAVE in the TFE/PAVE copolymer is from 1 to 20 wt%.
  • Example fluororesins include FEP (TFE-HFP copolymer), PFA (TFE-PAVE copolymer), TFE-HFP-PAVE copolymer wherein the PAVE comprises perfluoro(ethy! vinyl ether) (PEVE) and/or peril uoro(propyi vinyl ether), MFA (TFE-perfluoro(methyl vinyl ether)), (PMVE)-PAVE copolymer wherein the alkyl group of the PAVE has 2 or more carbon atoms, and THV (TFE-HFP-vinylidene fluoride (VF2) copolymer.
  • PFA (TFE-PAVE copolymer) is preferred.
  • Fluororesin can include one of the
  • TFE copolymers alone or a mixture comprising two or more such TFE copolymers.
  • a single TFE copolymer or two or more kinds of TFE copolymer can be mixed with a TFE homopolymer.
  • the TFE copolymer used in the present invention has a melt flow rate (MFR) of approximately 0.5 to 100 g/10 min., preferably, 0.5 to 50 g/10 min., when measured at the standard temperature of the specific TFE copolymer in accordance with ASTM D-1238.
  • MFR melt flow rate
  • the melt viscosity of the TFE copolymer used in the present invention is at least 10 2 Pa s, preferably 10 2 Pa s to 10 6 Pa s, and more preferably from 10 3 Pa s to 10 5 Pa s.
  • the content of the TFE copolymer in the fluororesin composition is 50-99.9 wt%, preferably, 60-99 wt%, or more preferably, 70-95 wt%.
  • melt- moldable fluororesin There is no special restriction imposed on the form of the melt- moldable fluororesin as long as it is suitable for melt molding; and a wide variety of forms, such as powder, a granular product of powder, flakes, pellets, and beads, are of utility.
  • the filler used in the present invention having an average particle size less than 1 .0 ⁇ is a light-reflecting compound that has a high refractive index and a high reflectance in the 400 nm to 700 nm
  • This light-reflecting compound has an average particle size less than 1 .0 ⁇ , preferably, greater than 0.01 ⁇ but less than 1 .0 ⁇ , more preferably, greater than 0.1 ⁇ but less than 1 .0 ⁇ , or even more preferably, greater than 0.2 ⁇ but less than 1 .0 ⁇ . It is not desirable for the average particle size of the light-reflecting compound to be 1 .0 ⁇ or greater because the light scattering effect is diminished and the reflectance drops.
  • the average particle diameter for example, can be measured by particle size analyzer (for example, made by CILAS Co., CILAS 990, CILAS 1090, and CILAS 1 190) according to the procedure of ISO 13320.
  • the filler used in the present invention has a band gap in excess of
  • the band gap can be measured, for example, using a UV-3101 PC recording spectrophotometer manufactured by Shimadzu Corporation, in accordance with the method described in Band Gap of Anatase T1O2 3.27 eV in Journal of Molecular Catalysis A Chemical 338, 18 (201 1 ).
  • the filler used in the present invention has a refractive index of 1 .5 or greater, preferably 2.0 or greater. It is not desirable for the refractive index to be lower than 1 .5 because a high reflectance can not be achieved.
  • Examples of fillers used in the present invention include metal oxides and metal sulfides. Metal oxides are preferred.
  • Example fillers include: anatase-type titanium dioxide ( ⁇ 2, reflectance: 2.5; band gap: 3.27 eV), tin dioxide (SnO2, reflectance: 2.0; band gap: 3.8eV), niobium pentoxide (Nb 2 O 5 , reflectance: 2.3; band gap: 3.4eV), zinc oxide (ZnO, reflectance: 2.0; band gap: 3.3eV) and zinc sulfide (ZnS, reflectance: 2.37; band gap: 3.6eV).
  • Anatase-type titanium dioxide is preferred and available commercially, for example, TA-300 manufactured by Fuji Titanium Industry Co., Ltd.
  • the dispersed condition of the filler in the molded product can be observed using a field-emission-type scanning electron microscope, for example, and S-4500 SEM manufactured by Hitachi, Ltd.
  • the amount of filler in the fluororesin composition is from 0.1 to 50 weight percent, preferably from 1 to 40 weight percent, and more preferably from 5 to 30 weight percent, based on the combined weight of filler and fluororesin. It is not desirable for the filler to be less than 0.1 wt% because the reflectance of the obtained reflector is poor. Also, it is not desirable for the amount of filler to exceed 50 wt% because injection molding of the fluororesin composition becomes difficult due to its high melt viscosity, and the strength and the durability of the obtained molded product will deteriorate.
  • the fluororesin of the present invention optionally further contains an adhesion promoter for the purpose of improving the adhesivity of the fluororesin composition to an LED sealant such as silicone, epoxy resin, or a mixture of these materials.
  • an adhesion promoter for the purpose of improving the adhesivity of the fluororesin composition to an LED sealant such as silicone, epoxy resin, or a mixture of these materials.
  • the adhesion promoter is an inorganic compound or an organic polymer.
  • the inorganic compound is hydrophilic in order to enhance the wettability of the fluororesin
  • the surface of the inorganic compound adhesion promoters can also include functional groups such as hydroxyl groups, vinyl groups, or silane groups (e.g., from silane coupling agents) that promote bonding with silicone or epoxy during curing.
  • Alumina is an example of an inorganic compound type adhesion promoter.
  • the organic polymer can be any polymer that shows high thermal resistance and adhesion to sealant such as silicone or epoxy.
  • Example such polymers include thermal resistant silicone powder, or polar polymers such as polyimide, Nafion®, PEI (polyetherimide), PES (polyethersulfone), and the like.
  • the amount of adhesion promoter in the fluororesin composition is from 0.1 to 20 weight percent, preferably from 0.5 to 10 weight percent, and more preferably from 1 to 5 weight percent, based on the combined weights of fluororesin, filler and adhesion promoter.
  • alumina is used as the adhesion promoter, if the alumina is less than 0.1 weight percent, a sufficient level of adhesivity of the fluororesin to the sealant can not be achieved. It is not desirable for the alumina to exceed 20 weight percent because the reflectance of the obtained reflector will decrease.
  • the fluororesin and the filler may be mixed either before the melt molding or simultaneously with the melt molding.
  • a commonly utilized mixing method can be used as a method for mixing them; and a known conventional disperser/blender, for example, a co-coagulation method as disclosed in Japanese Kokai Patent Application No. 2007- 1 19769, a planetary mixer, a high-speed impeller disperser, a rotary drum- type mixer, a screw-type mixer, a belt conveyor mixing method, a ball mill, a pebble mill, a sand mill, a roll mill, an attritor, and a bead mill, may be utilized for this purpose.
  • a device that is capable of evenly dispersing the fluororesin and the filler is preferred.
  • the fluororesin composition obtained by mixing the fluororesin and the filler before the melt molding may take a variety of forms, for example, a powdery material, a granular product of a powdery material, flakes, pellets, and beads.
  • a wet mixing of the kind described below is also of utility.
  • a fluororesin coated with a filler can be obtained by dissolving a filler into an aqueous solution or an organic solvent functioning as a carrier and then spraying the filler solution onto a fluororesin.
  • light drying is desirable in order to let the aforementioned aqueous solution or the organic solvent to evaporate.
  • methanol, ethanol, chloroform, and toluene for example, are of utility.
  • an organic solvent that allows the filler to be dissolved easily is desirable.
  • Any known conventional molding method may be used as a method for melt-molding the fluororesin composition.
  • Compression molding, extrusion molding, transfer molding, flow molding, injection molding, rotational molding, lining molding, foam extrusion molding, and film molding, are of utility. Extrusion molding and injection molding are preferred.
  • the molded product obtained through the aforementioned melt molding method has a high reflectance with little drop in reflectance in the 400 nm to 700 nm wavelength range, and exhibits excellent heat resistance, UV light stability, and weather resistance.
  • the molded product exhibits a reflectance of 85% or higher in the 400 nm to 700 nm
  • the reflector and therefor a light-emitting diode housing utilizing the reflector achieves a high reflectance of 85% or higher in the 400 nm to 700 nm wavelength range while exhibiting excellent heat resistance, US light stability, and weather resistance.
  • Reflectances of the molded products shown in Figure 3 in the 350 nm to 700 nm wavelength range can be obtained by measuring
  • a single layer of said reflector can be utilized also as a cover layer equipped with insulating, adhering, and reflecting functions in addition to the concave-shaped reflector shown in Figure 1 .
  • the housing of the present invention refers to a housing wherein a reflector mounted with an LED chip is attached to a substrate.
  • the LED chip is sealed off using a sealant.
  • a differential scanning calorimeter (Pyris 1 Type DSC manufactured by PerkinElmer, Inc.) was used. After approximately 10 mg of sample was weighed, put in a special aluminum pan, and crimped using a special crimper, the sample was placed in a DSC body and heated to 360 ° C from 150 ° C at the rate of 10 ° C/min. Its peak melting point (Tm) was obtained based on a melting curve obtained then.
  • a melt indexer equipped with a corrosion-resistant cylinder, a die, and a piston in compliance with D-1238-95 (manufactured by Toyo Seiki Co., Ltd.) was used. After 5 g of sample powders were filled in the cylinder that was maintained at 372 ⁇ 1 ° C and held for 5 minutes, they were extruded through a die orifice under the load of 5 kg (the piston and a weight); and the extrusion rate then (g/10 min.) was obtained as an MFR.
  • Reflectance of an approximately 1 .5-mm thick sample produced by means of melt compression molding was measured under the following condition.
  • a method in which light having a wavelength of 350 nm-700 nm was emitted to the reflective layer formed on the front surface of a sample at an incident angle of 10 ° , and the transmitted light was let go without providing any reflector on the back surface of the sample was used.
  • a spectral reflectance relative reflectance in contrast to a standard white board
  • a spectrophotometer having an integrating sphere mounted on a detector (U-4500 manufactured by Hitachi, Ltd.).
  • a fluororesin and a filler were melt-blended according to the composition shown in Table 1 at 350 ° C, which was approximately 40 ° C higher than the melting point (approximately 308 ° C) of the fluororesin, at 100 rpm for 5 minutes using a melt blender (KF-70V compact segment mixer manufactured by Toyo Seiki Co., Ltd.) in order to obtain a melt blender (KF-70V compact segment mixer manufactured by Toyo Seiki Co., Ltd.) in order to obtain a melt blender (KF-70V compact segment mixer manufactured by Toyo Seiki Co., Ltd.) in order to obtain a melt blender (KF-70V compact segment mixer manufactured by Toyo Seiki Co., Ltd.) in order to obtain a melt blender (KF-70V compact segment mixer manufactured by Toyo Seiki Co., Ltd.) in order to obtain a melt blender (KF-70V compact segment mixer manufactured by Toyo Seiki Co., Ltd.) in order to obtain a melt blender
  • Shear/bonding strength was measured (25 ° C, tension speed of
  • Niobium pentoxide Nb 2 O 5 powder from Kojundo Chemical Lab. Co., Ltd. (Average particle size 0.4 ⁇ )
  • Rutile-type titanium dioxide Rutile-type titanium dioxide.
  • Ti-Pure registered trademark
  • R-900 manufactured by E. I. DuPont de Nemours and Company (Average particle size 0.41 ⁇ )
  • Adhesion promoter a-alumina. A31 manufactured by Nippon Light Metal Co., Ltd.; average particle size 5.2 ⁇
  • LED sealant Silicone. ASP-1010 (A B) manufactured by
  • anatase-type titanium dioxide (TA-300 manufactured by Fuji Titanium Industry Co., Ltd) and 150 ml of pure water were put into a beaker (2L) and stirred at 150 rpm for 10 minutes using the downflow propeller-type 4-blade mixer. Then, 372.9 g of PFA aqueous dispersion obtained by means of emulsion polymerization was added so that the titanium dioxide content became 15 wt% with respect to
  • anatase-type titanium dioxide (TA-300 manufactured by Fuji Titanium Industry Co., Ltd) and 200 ml of pure water were put into a beaker (2L) and stirred at 150 rpm for 10 minutes using the downflow propeller-type 4-blade mixer. Then, 372.9 g of PFA aqueous dispersion obtained by means of emulsion polymerization was added such that the titanium dioxide content became 20 wt% with respect to
  • Niobium pentoxide particles (Nb 2 O 5 powder from Kojundo Chemical Lab. Co., Ltd.) and fluororesin PFA (PFA440HPJ manufactured by DuPont-Mitsui Fluorochemical Co., Ltd.) were melt-blended according to the composition shown in Table 1 at 350 ° C and 100 rpm for 5 minutes using the melt blender (KF-70V compact segment mixer manufactured by Toyo Seiki Co., Ltd.) in order to obtain a fluororesin composition.
  • the melt blender KF-70V compact segment mixer manufactured by Toyo Seiki Co., Ltd.
  • the niobium pentoxide particles were found to be dispersed evenly.
  • reflectances of an approximately 1 .5-mm thick sample which was produced from the fluororesin at 350 ° C by means of melt compression molding, were measured. The results obtained are summarized in Table 1 .
  • Zinc dioxide particles (FINEX-30 powder manufactured by Sakai Chemical Industry Co., Ltd.) and fluororesin PFA (PFA440HPJ manufactured by DuPont-Mitsui Fluorochemical Co., Ltd.) were melt- blended according to the composition shown in Table 1 at 350 ° C and 100 rpm for 5 minutes using the melt blender (KF-70V compact segment mixer manufactured by Toyo Seiki Co., Ltd.) in order to obtain a fluororesin composition. When the dispersion state of the zinc dioxide particles was checked in a fracture cross-section of the obtained fluororesin composition using an electron microscope, the zinc dioxide particles were found to be dispersed evenly. Also, reflectances of an approximately 1 .5-mm thick sample, which was produced from the fluororesin at 350 ° C by means of melt compression molding, were measured. The results obtained are summarized in Table 1 .
  • a-alumina (A31 manufactured by Nippon Light Metal Co., Ltd.) was added to the complex composition obtained in Application example 3 until the alumina content became 1 wt% with respect to fluororesin PFA and melt-blended at 350 ° C and 100 rpm for 5 minutes using the melt blender (KF-70V compact segment mixer manufactured by Toyo Seiki Co., Ltd.) in order to obtain a fluororesin composition.
  • Rutile-type titanium dioxide Ti-Pure® R-900 manufactured by E. I. DuPont de Nemours and Company
  • fluororesin PFA fluororesin
  • Comparative Example 2 After anatase-type titanium dioxide (TA-300 manufactured by Fuji Titanium Industry Co., Ltd.) and fluororesin PFA (PFA440HPJ manufactured by DuPont-Mitsui Fluorochemical Co., Ltd.) were put in a polyester bag and shaken for 5 minutes, and a sheet was created from the mixture by means of melt compression molding at 350 ° C, this sheet was cut into small pieces, and the same melt compression molding was carried out again in order to create an approximately 1 .5-mm thick sample.
  • TA-300 manufactured by Fuji Titanium Industry Co., Ltd.
  • fluororesin PFA PFA440HPJ manufactured by DuPont-Mitsui Fluorochemical Co., Ltd.
  • the present invention involves dispersing the anatase-type titanium dioxide evenly in its primary particle state such as by applying a shearing force during the melt blending, thereby resulting in high levels of reflection in the 400 nm-700 nm wavelength range.

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

L'invention concerne un réflecteur pour une diode électroluminescente, ainsi qu'un logement contenant ce réflecteur. Le réflecteur selon l'invention permet d'obtenir une réflectance élevée présentant une faible baisse sur la gamme de longueurs d'onde comprise entre 400 nm et 700 nm et il présente d'excellentes résistance thermique, stabilité aux rayons UV, résistance aux intempéries et adhésivité à des produits de scellement à base de silicone et d'époxy. Ledit réflecteur est obtenu par moulage d'une fluororésine contenant une charge présentant une taille moyenne de particules inférieure à 1 µm et une largeur de bande interdite supérieure à 3 eV. Le réflecteur selon l'invention présente une réflectance de 85% ou supérieure sur la gamme de longueurs d'onde comprise entre 400 nm et 700 nm.
PCT/US2012/050989 2011-08-16 2012-08-15 Réflecteur pour diode électroluminescente et logement associé WO2013025832A1 (fr)

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JP2011177904 2011-08-16

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017148905A1 (fr) * 2016-03-04 2017-09-08 Solvay Specialty Polymers Italy S.P.A. Composition de fluoropolymère pour composants d'appareils électroluminescents
US9899579B2 (en) 2013-11-07 2018-02-20 Koninklijke Philips N.V. Substrate for LED with total-internal reflection layer surrounding LED

Citations (8)

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US4380618A (en) 1981-08-21 1983-04-19 E. I. Du Pont De Nemours And Company Batch polymerization process
JP2002329895A (ja) * 2001-04-27 2002-11-15 Nichia Chem Ind Ltd 発光装置
JP2007119769A (ja) 2005-09-30 2007-05-17 Du Pont Mitsui Fluorochem Co Ltd 樹脂複合体組成物およびその製造方法
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