TW201224029A - Reflective material composition, reflective body and semiconductor light-emitting device - Google Patents

Abstract

The present invention provides a reflective material composition, a reflective body and a semiconductor light-emitting device. The reflective material composition contains boron nitride particles or melamine cyanurate particles and heat-resistant binder. The reflective body is formed by molding the reflective material composition. There are optical semiconductor element and reflective on substrate of the semiconductor light-emitting device. The reflective body is set around the optical semiconductor element and reflects light from the optical semiconductor element to predetermined direction. At least one part of light reflecting surface of the reflective body is molded product of said reflective body composition.

Description

201224029 VI. Description of the Invention: TECHNICAL FIELD The present invention relates to a reflective material composition, a reflector using the reflective material composition, and a semiconductor light-emitting device. [Prior Art] A led device which is one of the semiconductor light-emitting devices has a small size and a long service life, and is excellent in power-saving property, and is widely used as a light source such as a display lamp. Further, in recent years, since it has been possible to manufacture LED elements having higher brightness at a lower cost, it has been studied to use a light source as an alternative to fluorescent lamps and incandescent electric balls. In the case of being suitable for such a light source, in order to obtain a large illuminance, a plurality of LED elements are disposed on a surface mount type LED package, that is, a metal substrate (a substrate for LED assembly) such as aluminum, and A reflector (reflector) that reflects light in a predetermined direction is disposed around each of the LED elements. However, since the LED element is in the hair of the hairdresser, the light of the LED lighting device in this way will rise and the brightness will decrease when the LED device emits light. The estimation of the LED component, U 1 dry (the use period is shortened, etc. Therefore, it is required to at least the heat resistance of the reflector, and it is better to have a good heat dissipation.) Therefore, in Patent Document 1, it is mentioned that荦 录 录 录 录 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The white thermosetting polyoxyl resin of the catalyst and the predetermined bismuth agent is composed of a warrior composition. In addition, in Patent Document 2, there is a pull-up containing a specific thermosetting resin and a & The packaged molded body' is a predetermined portion for coating the coated member of the light reflector 4 member

S -4- 201224029 [PRIOR ART DOCUMENT] Patent Document 1 Japanese Patent Laid-Open Publication No. H0 9 - 2 2 1 3 9 No. 3 Patent Publication No. 2005- 1 363 No. In order to solve the problem, in the case of the use of other pigments or inorganic members, the effect of using other pigments or inorganic members is not disclosed. effect. Moreover, it is expected that the ultraviolet light of a short wavelength can be improved by the combination of sterilizing or deodorizing fruit or a phosphor of various colors, and the color tone of a television or the like can be improved (e〇l〇r rendering pr) 〇perty- es) It is also necessary to increase the reflectance of ultraviolet light. In the case where titanium oxide is used as a pigment or an inorganic member, the rutile crystal system is also affected by the absorption of light at a wavelength of 3 87 nm in the anatase crystal, thereby hindering the reflection of light. Further, it is not practical to promote deterioration of the resin accompanying the action of the medium. The above-mentioned object of the present invention is to provide a reflecting material using a reflector of a far-reflecting material composition and a semiconductor emitting device. The reflecting material composition has a directional reflection characteristic to ultraviolet light having a wavelength of 400 nm or less, thereby producing high heat resistance. Reflector. [Means for Solving the Problem] In order to achieve the above object, Benjamin et al. have repeatedly studied the results of the research. First, it was found that the object can be achieved by the following invention. The present invention is as follows. Actually, the specific 欵 illumination, and the white is near, the light touches the light. It also has the power gp, 201224029 [] a kind of reflective material composition, which contains nitriding butterfly particles or uric acid trimeric urethane brewing particles, And heat resistant adhesive. [2] The reflective material composition of [1], which is substantially free of titanium oxide 0 [3] such as the reflective material composition of [1] or [2], wherein the heat-sensitive adhesive is polyoxynoxy resin Or a norbornene polymer. [4] The reflective material composition according to any one of [1] to [3], wherein the volume average particle diameter of the boron nitride is 〇" to 3 〇〇^m. The reflective material composition according to any one of (1) to [4] wherein the content of the nitriding side is from 10 to 300 parts by mass with respect to 100 parts by mass of the heat resistant adhesive. [6] The reflective material composition according to any one of the above [1] to [3], wherein the melamine cyanurate particles have an average particle diameter of from 5 to 4.0 μm. The composition of the reflective material [7] is as defined in any one of [1] to [3] and [6]. Wherein the heat-resistant adhesive di-cyanamide S-particles are in a range of 5 to 180 masses [8] with respect to 10 parts by mass of a reflector, which is as described in any one of the above π] to [7] The composition of the reflective material is formed. [9] A semiconductor light-emitting device having: an optical semiconductor element and a reflection If on the substrate, the reverse body system is placed on the periphery of the semiconductor element, and the light from the optical semiconductor element is directed Reflected in a predetermined direction, at least a portion of the light reflecting surface of the reflector is a molded article of the reflector composition according to any one of items (1) to [7].

-6 - Q ..201224029 [Effect of the Invention] According to the present invention, there is provided a reflective material composition using a reflector of the reflective material composition and a semiconductor light-emitting device having ultraviolet light having a wavelength of 400 nm or less It also has high reflection characteristics' and can produce reflectors with high heat resistance. Further, the present invention provides a reflective material composition which can produce a reflector having high heat dissipation properties in the case of using a nitrided butterfly particle. [Embodiment] [1. Reflective material composition] (1) First reflective material composition of the present invention: The first reflective material composition of the present invention comprises boron nitride particles and a heat resistant adhesive. The ultraviolet light having a wavelength of 4 〇〇ηη or less or more preferably having a wavelength of 250 to 40 nm is more preferable because of the presence of nitriding particles. Then, by including the boron nitride particles in the heat-resistant adhesive, the above characteristics can be favorably maintained even in a relatively high-temperature use region. As a result, tone correction can be improved by being applied to an anti-f body such as a lighting fixture or a television. Further, even if the boron nitride particles themselves fail to promote deterioration of the heat-resistant adhesive, the durability of the reflective material composition can be suppressed. Boron nitride particles can be applied to hexagonal crystal structure (h-BN), sphalerite structure (c-BN), wurtzite structure (W BN), and rhombohedron (rh〇). Mbohedral structure (r-BN), but from the viewpoint of heat resistance or cost, a scaly-like hexagonal crystal structure of nitride particles is suitable. 201224029 From the viewpoint of heat dissipation and (iv), the volume of nitriding (tetra) is preferably o.moo_, more preferably 〇1 to 12, and even more preferably 1 to 2μ1η. The volume average particle diameter ' can be obtained as a mass average value d50 in the particle size distribution measurement by the laser light diffraction method. The content of the nitrided shed particles is preferably 10 i by 300 parts by mass or more preferably 15 to 200 parts by mass, more preferably to 10 parts by mass, based on 100 parts by weight of the heat-resistant adhesive. Further, as long as the formability is not impaired, it may be filled in 300 parts or more. (2) The second reflective material composition of the present invention:

The second reflective material 纟B β A T composition of the present invention comprises melamine cyanurate particles and a heat-resistant adhesive. By the presence of melamine cyanurate particles, it is possible to set the ultraviolet light having a wavelength of 400 or less, more preferably the ultraviolet light having a wavelength of 25 Å to the range of the ultraviolet light. Further, by making the cyanuric acid urethane particles contain heat-resistant adhesives, it is possible to satisfy the above characteristics even in the area where the fox is used. As a result, it is suitable for use in lighting fixtures or televisions, etc. In addition, due to cyanuric acid cyanide poem W, ^ tone schooling. - The polymyramine particles themselves do not promote the deterioration of the heat-resistant adhesive, etc., so the "dish" ', the durability of the finished product is reduced. The thorn-reflecting material group here, the melamine cyanurate refers to the trimeric atmosphere. The acid molecule is represented by a nitrogen bond to form a planar oxyamine molecule and three C6H9N903, and is represented by a chemical formula of a compound such as the structural formula of the formula (2). Bu Fan (1) or Formula 5 -8 - 201224029

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Νη2 In the present invention, the melamine cyanurate particles can be produced by a conventional method without any particular method. For example, refer to Japanese Patent Laid-Open Publication No. Hei 7-7Μ9739, and It is produced by the description of the Japanese special issue. The production method of the melamine cyanurate particles is exemplified by adding a melamine acid to a device capable of mixing and stirring at a predetermined mixing ratio, mixing and heating to a predetermined temperature, and then adding water in the tank. A neutralization reaction is carried out to produce a white precipitate, which is dried and granulated to obtain a melamine ester particle. Further, cyanuric acid three can be obtained from a commercial product. The average particle diameter of the gas is preferably from the viewpoint of production and reflection characteristics. .丨 to ~,::: Good again 0.5 to 4μιη. The average particle diameter can be obtained as a mass average value D5 雷 in the laser particle size distribution measurement. If it is determined, it can be a method of the prior art No. 5-310, 716, which can be used for the powder and the cyanide surface. The inner temperature is gradually mixed, and the desired cyanuric acid polyaminamide particles of the cyanuric acid are filtered out from the precipitate of 0 · 5 to 2 0 μιη, caused by light diffraction -9 - 201224029 relative to 100 parts by mass In the heat-resistant adhesive, the content of the cyanuric acid triammine vinegar particles is preferably from 5 to 180 parts by mass, more preferably from 1 to 50 parts by mass, even more preferably from 5 to 11 parts by mass, particularly preferably 1〇 to ι〇〇 quality injury. Further, it is also possible to fill in more than 2 parts as long as it does not impair the formability. In the first and second reflective material compositions of the present invention (hereinafter referred to as "reflective material composition of the present invention"), the melamine cyanurate particles and the boron nitride particles may be improved from the viewpoint of improving dispersibility. Hydrophobization treatment is carried out. Representative examples of the hydrophobizing agent include a decane coupling agent, a polyoxyphthalic acid, a fatty acid, and a fatty acid metal salt. In these cases, the effect of improving the dispersibility is high. Therefore, it is preferred to use a decane coupling agent and a polyoxygenated oil. The scouring coupler is exemplified by dioxazane such as hexamethyldiazepine; cyclic decazane; trimethyl decane, trimethyl gas decane, dimethyl dichloro decane, sulfhydryl Chlorodecane, allyl dimercapto gas decane, benzyl dimethyl chloro decane, methyl trimethoxy decane, methyl triethoxy decane, isobutyl trimethoxy decane 'dimethyl dimethoxy decane, Dimethyldiethoxydecane, trimethylmethoxydecane, hydroxypropyltrimethoxydecane, stupidyltrimethoxysulfanyl, n-butyltrioxoxadecane, n-hexadecatrimethoxydecane, positive ten An alkyl decane compound such as octadecyloxane, ethylene trimethoxy decane, ethylene triethoxy decane, γ-methyl propylene oxy propyl trimethoxane, and ethylene triethoxy decane; γ-amine Propyl propyl triethyl fluorene, γ-(2-aminoethyl)aminopropyltrioxoxazepine, γ-(2-aminoethyl)aminopropylmethyldimethoxylate Home, phenyl_3_aminopropyltrioxoxadecane-(2-aminoethyl)3-aminopropyltrimethoxine

S -10- ^ methyl polyfluorene, and amine modified 201224029 alkane, and Ν-β-(Ν-vinylbenzylaminoethyl hydrazine ^ ^ ^ yu) - γ-aminopropane and other amine decane compounds Wait. The polyoxygenated oil may, for example, be a hydrogen polyoxyalkylene or a methylphenyl polyfluorene. These hydrophobizing agents may be used singly or in combination. In the method of treating the cyanuric acid cyanuric acid particles or the nitriding particles, as long as it is a conventional method, for example, a dry method or a wet method can be exemplified. Specifically, a method of rapidly stirring a melamine cyanurate particle or a side of a nitriding agent to drip or spray a hydrophobizing agent; dissolving the agent in an organic solvent while stirring the organic solvent, melamine cyanurate or nitriding Wet method of boron particles. Further, the composition of the reflective material of the present invention does not substantially contain a titanium oxide, and the violet ratio of 4 〇〇 nm or less can be made into a good state. Further, deterioration of the heat-resistant adhesive by the catalyst of titanium oxide can be prevented. Here, 'there is substantially no titanium oxide particles' means that the titanium oxide material is not formulated during the production of the reversed material, and the specific content of the titanium oxide in the composition of the upper material is 〇% by mass. The heat-bonding of the reflective material composition is the glass transfer after forming: R ^ danshan / dish and melting point are at least one of the above resins, preferably * ostrich ~ t J horse % milk resin, acrylate Resin ester resin 'Ju Shi Xia Qi I· compensation,; ^ _ Lishu knows polyoxyalkylene-organic block copolymer ^ three oxime oxime, alkane, methyl polyoxyl oil combination 2 kinds of hydrophobicity is not special For example, the particles are removed, and the titanium oxide is added to the surface of the hydrophobic portion. The use of external light to produce a blasting agent is a ruthenium agent, as long as 100 〇c, an amine phthalate, a polyfluorene 201224029 oxy-organic graft copolymer, and a carbon having reactivity with the S i thiol group. - a thermosetting resin such as an organic-inorganic hybrid resin having a carbon double bond, a cyanate resin, a phenol resin, a polyimide resin, or a bis-butylene diimide resin, or an acrylic resin or a polycarbonate a resin, a norbornene derivative, a ring-opening metathesis polymerization resin, a cycloolefin resin such as a hydrogenated product, an olefin-maleimide resin, or a polyfluorene Resin, poly; ε wind (p〇lySulfone) resin, polyphonic resin, polyoxypropylene sub-base resin, polyphenylene ether (p〇lyphenylene〇xide) resin, polyether sulfone tree ruthenium, polyphenylene sulfide (polyphenylene) Sulfide resin's polyether oxime ketone resin, polyether oxime imide resin, polyether ketone ketone resin, polyphenylene ether resin, poly retinal resin, polyamidamine amide resin, polyarylate resin 'polyethylene Acetal resin, polyethylene resin, polypropylene resin, polydecylpentene^ , A polystyrene resin, a polyamide resin, a wholly aromatic polyester resin (liquid crystal resin), as the vinyl monomer alone or by copolymerizing the resin, fluororesin, thermoplastic resin such as rubber-like resin. The thermosetting resin is preferably a polyoxyxylene resin (containing a polyoxymethylene resin), and a thermoplastic resin is preferably a norbornene polymer. - In the case of the above-mentioned polyoxyl resin, in the type of hardening, there is a type 1 poly-hu oxygen, a condensation type poly-crushed oxygen, and the structure may, for example, be dimethyl polyoxymethyl methyl stupid polyoxyl. . For example, the condensation type polyoxane refers to a hydrolysis reaction of mercapto trigas, methyltrimethoxazole, methyltriethoxylate, cyclohexanetetradecyloxydecane, tetraethoxydecane, and the like. Thermosetting organopolyoxane. Further, in terms of the polymer of the sputum-reducing sputum, for example, a ring-opening polymer having a norbornne-stomach-suppressing compound or a monomer having a reduced cerium structure and - 2 2 - 201224029 An addition polymer of a monomer or a monomer of the hydride or an addition polymer of a bovine urethane structural monomer, which is an early body and other hydrophobic. A hydride such as a distant material. In shape, heat resistance, low ° and wetness, dimensional stability, ;; t = from the point of formation, especially for the open loop of the monomer with the structure of the descending line? = observation. (',) t-hydrogen The reflective material composition of the present invention may be a nitrogen binder, or a urinary uric acid trimeric amine: particles and a heat-resistant agent, which are mixed at a predetermined ratio as described above. Thinking about heat resistance, it can be applied to two- or three-roller 'planet-type mixing and defoaming method. Mixer for dissolver, planetary mixer, etc.;

Labo plast mill and other melt kneaders such as system or white 夭 Q hand and ·. No. female rong-Τ' is carried out in any state of normal temperature, cooling state, heating state 'normal pressure, π ° state. /pressure state, pressurization

Further, 曰I is added as long as the effect of the present invention is not impaired. For example, based on improving the properties of the resin composition, various whiskers, polyfluorene powders, 'thermally formulated synthetic rubbers, fatty acid esters, glycerides, culverts, organic β ^zinc citrate' An additive such as an internal mold release agent such as calcium humate. The reflective material composition of the present invention as described above can be used as a composite material for forming a composite material or a reflective material composition coated on a substrate, and is suitable for various uses. For example, it can be applied as a reflective material for a light source for illumination or television, such as a light-reflecting sheet or LED of a solar cell. s -13- 201224029 [2. Reflector] <The reflective material group of the present invention The reflection system of the present invention is formed by molding a precursor. The conductor light-emitting device is used in combination, and the light-emitting device (the LED assembly base can also be used in combination with a +-conducting plate including other materials, which will be described later). In the reflector of the present invention, the main soil has a function of reflecting light from the LED element of the semiconductor light-emitting device toward the lens (the first part of the body). The details of the reflector are the same as those of the reflector of the semiconductor light-emitting device of the present invention (the reflector 19 described later) are the same, and therefore will not be described here. [3. Semiconductor light-emitting device] The semiconductor light-emitting device of the present invention has an optical semiconductor element (for example, a LED element η 〇 and a reflector 1 2), and a side reflector 1 2 is provided on the substrate 14 as exemplified in the drawings. The light semiconductor element 丨〇 is formed around the optical semiconductor element 反射, and the light from the optical semiconductor element 1 反射 is reflected in a predetermined direction. Then, at least a part of the light reflecting surface of the reflector 12 (all in the case of the first figure) is A molded article comprising the reflector composition of the present invention as described above. The optical semiconductor device 10 emits emitted light (generally UV or blue light in a white light LED), for example, a semiconductor wafer (illuminant). It has a d〇uble-hetereo structure in which an active layer containing AlGaAs, AlGalnP, GaP or GaN is sandwiched between n-type and p-type cladding layers, for example, a length of about 55 mm. The shape of the facet. Next, in the case of a wire bonding type, it is connected to an electrode (connection terminal) not shown via a lead wire 16.

S - 14 - 201224029 The shape of the reflector 12 is in accordance with the shape of the end portion (joining portion) of the lens 18, and is generally a cylindrical shape or a wheel shape such as a square, a circle, or an ellipse. In the schematic cross-sectional view of Fig. 1, the reflector 12 is a cylindrical body (all the end faces of the wheel-shaped reflector 12 are in contact with and fixed to the surface of the substrate 14. Further, in order to increase the light half from the inner surface of the reflector 12 The directionality of the nine may be tapered at the top (see Fig. 1). ', 砰, and the reflector 1 2 is viewed from the end of the lens 18 side as the shape of the lens 丨8. The barrier shape of the Iu powder processing can also play the role of the lens holder. The scoop person and the cymbal 12 series can also be made into the light reflection layer 1 of the reflective material composition only on the light reflection surface side as shown in Fig. 2 . 2a. In this case, the thickness of the first reflecting layer 12a is preferably δ and 5 〇〇μη or less, and more preferably 30 (^m or less). The member 12b which is raised/formed by the light-reflecting layer 12a can be formed of a heat-resistant resin. As described above, the lens 18 is provided on the reflector 12, and the system is made of a resin, which can be formed by a microscope. Coloring is performed. '", (4) The various types of knots can be: the space formed by the i-plate 14, the reflector 12, and the lens 18. Often filled with light transmissive and 7: gaps. The space part 'passing part, transparent in the snow && edge material, etc. 1 in the wire joint assembly, Lushan, gentleman The force, and the direct contact with the wire 1 ό, the component 1 is applied. The connection portion, and/or the electric double-shot 1 and the optical semiconductor are 'cut or shorted, thereby preventing 16 In addition, it protects the optical semiconductor at the same time: it maintains reliability for a long period of time, and the ι is protected from moisture and dust.

S •15- 201224029 In the provision of the light transmissive property; 5 materials} the material of the enamel edge (the transparent sealant composition is J Wan, usually can be exemplified by children's enamel resin, epoxy polyoxyl resin, ring milk Anthraquinone resin, a dienoic acid tree, a bismuth eucalyptus, a poly phthalimide resin, and a polycarbonate tree sap. 4. From the point of view of resistance to rolling, low shrinkage, and discoloration resistance. The method for producing the optical semiconductor device shown in Fig. 1 is as follows. f First, the resin composition of the reflective material of the present invention described above is used by using a pore space having a predetermined shape. The mold is transferred into a y-shaped reflector 1 2 by transfer molding, compression molding, or the like. Thereafter, the prepared optical semiconductor element is further formed by an adhesive or a bonding member. The electrode and the lead wire 16 are fixed to the substrate 14' to further fix the reflector 12 to the substrate 14. Then, a transparent sealing agent containing a polysulfide resin or the like is injected into the concave portion formed by the substrate 14 and the reflector 1 2 . Object, to heat, Drying or the like is cured to form a transparent closed portion. Thereafter, a lens 18 is disposed on the transparent closed portion to obtain the semiconductor light-emitting device shown in Fig. 1. Further, the transparent blocking agent composition may be in an unhardened state. After the lens 18 is downloaded, the composition is cured. [Examples] Next, the present invention will be described in further detail with reference to Examples A and B, but the present invention is not limited by the examples. The materials used in the examples are as follows.

-16- S 201224029 [Example A] (1) Financial adhesives: Thermosetting resin: Polyoxyxylene resin (OE-6336A and OE-63 3 6B mixed at a mass ratio of 1:1: both TORAY · Dow Corning Co., Ltd.) • Thermoplastic resin: decene-based polymer (ZEONOR 1 600: manufactured by Zeon Co., Ltd.) (2) Nitrided particles A: UHP-2 (Scales made by Showa Denko Co., Ltd.) Hexagonal shape. Crystal structure, volume average particle size 11 · (3) Titanium oxide particles: PFC · 1 0 7 (The volume average particle size of rutile structure made by Ishihara Sangyo Co., Ltd. is 0.25 μπι) (4) Magnesium oxide particles: and Wako Pure Chemical Industries Co., Ltd. Volume average particle size 0 · 2 μ m ) (5) Boron nitride particles B: UHP-EX (Graphic hexagonal crystal structure, volume average particle size 5〇μιη) (6) Nitride shed particle C: UHP-S1 (scale-like hexagonal crystal structure of Showa Denko Co., Ltd., volume average particle diameter of 15 μm) [Examples 1 to 1 1 and Comparative Examples 1 to 5] α 爿For a long time, the particles are blended and kneaded to obtain a reflective material composition. Further, in the blending, the volume fraction of each of the various particles is adjusted to be constant, and kneading is performed by a roll. ° These compositions are in the case of blending a thermosetting resin, in the case of BOX:, 00 seconds, 10 MPa, and in the case where the thermoplastic resin is contained in the system, at 230 ° C, 10 seconds, 20 MPa. Then, the first piece was subjected to press forming to a thickness of 750 mm x 750 mm x 1 mm, and the shape of the film was caused by the formation of the shape β 5 -17 - 201224029 The following characteristics were measured for the molded body. The results are shown in Tables 4 to 4 below. (A) Financial property (heat-resistant yellowing property) The molded body is at 150. (: 'Before placing it for 24 hours and after placing it, visually observe the change in surface color. If it is kept white before standing, it has good heat resistance. (B) Light reflectance The molded body is placed at 150 °C. 2 4 AB Yang Jie· λ After 24 hours, the light reflectance was measured at a wavelength of 23 〇 to 78 〇 nm t using a spectrophotometer UV-25S0 (manufactured by Shimadzu Corporation). The results of the wavelength at 38 〇 nm. The relationship between the light reflectance and the wavelength of the molded articles of Example 1 and Comparative Examples 丨 and 3 is shown in Fig. 3, and the molded bodies of Example 2 and Comparative Examples 2 and 4 are shown. The relationship between the light reflectance and the wavelength is as shown in Fig. 4 (before "24 hours at 150 ° C"). (C) Thermal conductivity Thermal conductivity, which is used for film measurement of automatic calculation software. The body (SOFT-QTM5W) was manufactured by Kyoto Electronics Industry Co., Ltd., QTM_5〇〇 (Xun Fan Thermal Conductivity Meter), and each molded body was measured. 201224029 Table 1 Composition (parts by mass) Example A Comparative Example A 1 2 3 1 2 3 4 5 Heat-resistant adhesive Thermosetting resin 100 100 100 100 Thermoplastic tree Grease 100 100 100 100 Particles Boron Nitride Particles A 26 26 60 Titanium Oxide Particles 46 46 10 Oxidized Town Particles 40 40 30 Evaluation Results and Inch Initiality a Appearance White White White White White White Gray White 150°C Appearance White White After 24 Hours White White White White Gray White Light Reflectance (450nm) Initial 535 % 87 87 86 99 99 83 45 97 150°C After 24 hours% 86 86 87 99 95 86 45 96 Light reflectance (380nm) Initial $ % 86 85 78 11 15 84 38 12 After 24 hours at 150°C% 81 79 75 11 15 81 36 12 ※ “Initial” means the meaning of being placed at 150 ° C for 24 hours (the same is true in Tables 2 and 3). Table 2 Composition (Quality) Part A 4 5 6 1 7 8 9 Heat-resistant adhesive Thermosetting resin 100 100 100 100 100 100 100 Particle gasification shed particles A 10 15 20 26 50 100 200 Evaluation results for thermal initial m Appearance white white white White White White White 150°C After 24 hours Appearance White White White White White White White Light Reflectance (450nm) Initial κ % 67 81 84 87 93 94 96 150°C24 After the hour % 70 82 86 86 93 95 96 Light reflectance (380 nm) Initial κ % 67 80 84 86 93 92 92 150 ° C after 24 hours % 70 83 85 81 90 92 93 Table 3 Composition (parts by mass) Example A 1 10 11 Heat-resistant adhesive Thermosetting resin 100 100 100 Particle boron nitride particles A (volume average particle diameter 11.8 μm) 26 Boron nitride particles B (volume average particle diameter 50//m) 26 Boron nitride particles C ( Volume average particle size 1.5//m) 26 Evaluation results Initial heat resistance 85 Appearance White White White 150°C After 24 hours Appearance White White White Light reflectance (450 nm) Initial s % 87 86 95 150 ° C After 24 hours % 86 85 9Ί Light reflectance (380nm) Initial κ % 86 85 91 150°C after 24 hours % 81 85 91

S -19- 201224029 Table 4

-------- υ.^0 It can be confirmed from Table 1 that the reflective material compositions of Examples i to u, even in the case of thermosetting resins and thermoplastic resins, are in the range of 250 to 780 nm. The region has a high reflectance, especially in the ultraviolet region. Further, it was confirmed that the composition of the reflective material was excellent in heat resistance. From Table 2, it was confirmed that the content of the boron nitride particles is useful in 15 to 2 parts by mass. It can be confirmed from Table 3 that the effect 1 depends on the boron nitride particles, and when the volume average particle diameter is 丨 to 2 μm, the reflectance is good. Further, from Table 4, it was confirmed that by containing boron nitride particles, a reflective material composition having high thermal conductivity can be obtained. From the above, it can be seen that the composition of the reflective material of the present invention is extremely useful for reflecting materials, reflectors for external lines, or reflective materials for semiconductor light-emitting devices. [Example Β] (1) Heat-resistant adhesive • Thermosetting resin: Polyfluorene resin (〇Ε·6336Α and ΟΕ-63 3 6Β mixed with a mass ratio of 1: i: all t〇ray· Dow

Corning Co., Ltd.) • Thermoplastic resin: decene-based polymer (ZE〇n〇R 1600: manufactured by Sakamoto Zeon Co., Ltd.) (2) Melamine cyanurate particles A : MC-6000 (Nissan Chemical Co., Ltd.) System, average particle size 2.0μιη) 201224029 There are uric acid melamine ester particles B: MC-4〇〇〇 (produced by Nissan Chemical Co., Ltd., shoulder, company, τ, clothing, average particle size 14μιη) Gold red titanium particles: PFCMG7 (Ishihara) Manufactured by the company's average particle size 〇·25μηι) (5丄Zinc oxide particles: Lp_ZINC2 (average particle size 2μιη made by Chemical Industry Co., Ltd.) (6) Magnesium oxide particles: Magnesium oxide (Wako Pure Chemical Industries, Ltd.) Co., Ltd., average particle size 0·2μιη) (7) Magnesium hydroxide particles: Magsseds Ν-6 (manufactured by Shendao Chemical Co., Ltd., average particle size 1.1 μιη), (8) calcium carbonate particles: WS_22〇〇 ( Manufactured by Takehara Chemical Industry Co., Ltd., average particle size 1.3 μιη) (9) Talc particles: High micronHE5 (manufactured by Takehara Chemical Industry Co., Ltd., average particle size 1.6 μιη) (1 〇) barium sulfate particles: barium sulfate W -1 (Takehara Chemical Industry Manufactured by Co., Ltd., average particle size: 1.5 μm) [Examples 1 to 9 and Comparative Examples 1 to 14] In the formulation shown in Tables 5 to 7, the heat-resistant adhesive and various particles were blended and kneaded to obtain a reflective material composition. In addition, the volume fraction of various particles is adjusted to be constant in the blending, and the kneading is carried out by a roll. For these compositions, the thermosetting resin is blended at i 5 ° C, 60 seconds, 1 OMPa. In the case of blending a thermoplastic resin, the molded product was formed into a molded body at a temperature of 230 ° C, 1 sec, and 20 MPa, and formed into a molded body of 750 mm × 750 mm × 1 mm. The following characteristics were measured for the molded body. Tables 5 to 7. -2 1 - 201224029 (A) Heat resistance (heat-resistant yellowing property) After the molded body was placed at 150 ° C for 24 hours and placed, the surface color change was visually observed. The white color before placement has good thermal compatibility. (B) The light reflectance molded body (at 150 ° C, placed 24 hours before and after placement) in the wavelength range of 230 to 780 nm, using a spectrophotometer UV-2550 ( Measured by the Shimadzu Corporation) Tables 5 to 7 show the results of the case of the wavelength of 450 nm and the wavelength of 3 8 Onm. Further, the relationship between the light reflectance and the wavelength of the molded bodies of Examples 1 and 2 is shown in Fig. 5, and the formation of Comparative Examples 1 to 4 The relationship between the light reflectance of the body and the wavelength is shown in Fig. 6. The relationship between the light reflectance and the wavelength of the molded articles of Comparative Examples 5 to 7 is shown in Fig. 7 (both before "24 hours at 15 °C, 24 hours" ). Table 5 Composition (parts by mass) Example B Comparative Example B 1 1 2 3 4 5 6 7 Thermoplastic binder Thermoplastic resin 100 100 100 100 100 100 100 100 Particle melamine cyanurate particles A 19 Titanium oxide particles 47 Zinc oxide particles 63 Magnesium Oxide Particles 41 Magnesium Hydroxide Particles 27 Carbonic Acid Mother Particles 31 Talc Particles 31 Sulfuric Acid Locking Particles 51 Evaluation Results Fiscal Heat Initiality $ Appearance White White Yellow White Gray Milky White Milky White White 150. . Appearance after 24 hours White White Yellow White Gray Milky White Milky White White Light Reflectance (450nm) Initial 38% 90 99 56 45 27 51 28 71 150°C After 24 hours% 86 95 55 45 25 50 22 68 Light reflectance (380nm ) Initial 38 % 87 15 5 38 24 41 24 60 150°C After 24 hours % 80 15 5 36 20 39 17 56 * "Initial" means the meaning of being placed at 150 ° C for 24 hours (in Tables 6 and 7) The same).

-22- S 201224029 Table 6 Composition (parts by mass) Example B Comparative Example B 2 3 8 9 10 11 12 13 14 Thermal adhesive thermosetting resin 100 100 100 100 100 100 100 100 100 Particle melamine cyanurate particles A 19 melamine cyanurate particles B 19 titanium oxide particles 47 oxidized particles 63 magnesium oxide particles 41 magnesium hydroxide particles 27 carbonic acid particles 31 talc particles 31 barium sulfate particles 51 evaluation results early heat s appearance white white white white white white White white white 150 ° C 24 hours after the outer white white white white white white white white white light reflectance (450nm) first s % 90 89 99 81 83 -74 78 69 75 150 ° C after 24 hours % 93 91 99 81 86 71 76 67 76 Light reflectance initial & % 92 90 11 5 84 74 78 68 77 150 °C After 24 hours % 92 86 11 5 81 71 74 65 78 Table 7 Composition (parts by mass) Example B 4 5 6 2 8 9 and ten thermal adhesive thermosetting resin 100 100 100 100 100 100 particle cyanuric acid trimer Amine ester particles A (average particle diameter 2.0 " m) 7 9 11 19 50 100 Evaluation results Heat resistance initial m Appearance white white white white white white 150 ° C after 24 hours appearance white white white white white white light reflectance (450 nm) Initial s % 73 80 84 90 95 99 After 24 hours at 150 ° C% 76 79 87 93 97 99 Light reflectance (380 nm) Initial κ % ΊΊ 87 87 92 95 99 150 ° C after 24 hours % 79 82 89 92 97 98 5, 6 It can be confirmed that the use of melamine cyanurate particles in the region of 250 to 780 nm, especially in the ultraviolet region, shows good reflectance, even in the case of the composition of the thermosetting resin and the thermoplastic resin. It also occurs, and it is also confirmed that the composition of the reflective material maintains good heat resistance. From Table 6, it was confirmed that when the average particle diameter of melamine cyanurate was 2 μηη, the reflectance was good. It can be seen from Table 7 that λ -23-.201224029, the content of melamine cyanurate particles is useful in n to 1 part by mass. From the above, it is known that the reflective material composition of the present invention can also be used to reflect a reflector of ultraviolet light or a reflector for a semiconductor light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing an example of a semiconductor light-emitting device of the present invention. Fig. 2 is a schematic view showing an example of a semiconductor light-emitting device of the present invention. Fig. 3 is a graph showing the relationship between the light reflection wavelengths at the initial stage (just after production) of the molded article comprising the examples A-1 and Comparative Examples A-1 and A - 3 . Fig. 4 is a graph showing the relationship between the light reflection wavelengths at the initial stage (just after production) of the molded article comprising the composition of Example A-2, Comparative Example A-2, and A-4. Fig. 5 is a graph showing the relationship between the light reflectance at the initial stage (just after production) of the molded article comprising the reactant compositions of Example B-1 and Example B-2. Figure 6 shows the light reflectance and wavelength pattern of the initial stage (just after fabrication) of the molded article including the comparative material materials of Comparative Examples B-1 to B-4, and Fig. 7 shows the inclusion of Comparative Examples B-5 to B- 7 The reflection of the light reflectance and the wavelength of the initial shape of the formed material of the reflective material (after the production), the inverse ratio of the cross section of the shot material and the composition of the inverse rate and the composition of the wavelength of the shot.

S -24- 201224029 [Description of main components] 10 Optical semiconductor components 12 Reflector 12a Light reflecting layer 12b Member formed by light reflecting layer 12a 14 Substrate 16 Wire 18 Lens -25-

Claims (1)

201224029 VII. Patent application scope: 1 · A reflective material composition comprising boron nitride particles or melamine cyanurate particles, and a thermal adhesive. 2. A reflective material composition as claimed in claim 1 which is substantially free of titanium oxide. 3. The reflective material composition of claim 1 or 2, wherein the heat-curing adhesive is a polyoxynene resin or a norb〇rnene polymer. 4. The reflective material composition of any one of claims 1 to 3, wherein the volume average particle diameter of the boron nitride is 〇丨 to 3 Ο 0 μιη ° 5. The reflective material composition of any one of the items 4, wherein the boron nitride is contained in an amount of 10 to 300 parts by mass based on 1 part by mass of the heat resistant adhesive. 6. The reflective material composition according to any one of claims 3 to 3, wherein the melamine cyanurate particles have an average particle diameter of 0.5 to 4 · 0 μιη. 7. The reflective material composition of any one of claims 3 to 6 wherein the amount of the diurethane dihydrated granules is from 100 parts by mass of the heat resistant adhesive. 5 to 180 parts by mass. A reflective body formed by forming a reflective material composition according to any one of claims 1 to 7. A semiconductor light-emitting device having: an optical semiconductor element and a reflector on a substrate, the reflective system being disposed around the optical semiconductor element and reflecting light from the optical semiconductor element in a predetermined direction by 1 S -26- 201224029 At least a part of the light reflecting surface of the reflector is a molded article of the reflector composition according to any one of claims 1 to 7. S -27-