WO2013011674A1 - 半導体発光素子 - Google Patents
半導体発光素子 Download PDFInfo
- Publication number
- WO2013011674A1 WO2013011674A1 PCT/JP2012/004523 JP2012004523W WO2013011674A1 WO 2013011674 A1 WO2013011674 A1 WO 2013011674A1 JP 2012004523 W JP2012004523 W JP 2012004523W WO 2013011674 A1 WO2013011674 A1 WO 2013011674A1
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- WO
- WIPO (PCT)
- Prior art keywords
- layer
- refractive index
- light emitting
- index transparent
- transparent
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/10—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
Abstract
Description
実施の形態1に係る半導体発光素子を図面に基づいて説明する。図1に示す発光素子は、バンプを介在させて実装基板にフリップチップ実装されるLEDチップである。
実施の形態1に係る半導体発光素子を、図5に示す条件に基づいて、シミュレーションを行った。
本発明の実施の形態2に係る半導体発光素子を図面に基づいて説明する。なお、図8においては、図6と同じ構成のものは同符号を付して説明を省略する。
実施の形態2に係る半導体発光素子を、図9に示す条件に基づいて、シミュレーションを行った。図9に示す条件は、透明導電層13側に低屈折率透明層142が増えた以外は、図5に示す実施の形態1における条件と同じである。
本発明の実施の形態3に係る半導体発光素子を図面に基づいて説明する。なお、図11においては、図6と同じ構成のものは同符号を付して説明を省略する。
実施の形態3に係る半導体発光素子を、図12に示す条件に基づいて、シミュレーションを行った。図12に示す条件は、透明導電層13側に誘電体層19が増えた以外は、図5に示す実施の形態1における条件と同じである。
本発明の実施の形態4に係る半導体発光素子を図面に基づいて説明する。なお、図14においては、図11と同じ構成のものは同符号を付して説明を省略する。
実施の形態4に係る半導体発光素子を、図15に示す条件に基づいて、シミュレーションを行った。図15に示す条件は、透明導電層13側に低屈折率透明層142が増え、透明導電層13側に誘電体層19が増えた以外は、図5に示す条件と同じである。
12 半導体層
13 透明導電層
14、14a 多層反射層
15 金属反射層
16 バリアメタル層
17 n電極
18 p電極
19 誘電体層
121 n型半導体層
122 発光層
123 p型半導体層
141 高屈折率透明層(第1屈折率透明層)
142 低屈折率透明層(第2屈折率透明層)
C1 周縁部
C2 格子部
R1 反射領域
Claims (7)
- 光透過性を有する基板と、
前記基板に積層されたn型半導体層、発光層およびp型半導体層を備えた半導体層と、
前記半導体層の上に設けられた透明導電層と、
前記透明導電層の上面を、前記発光層からの光を反射させるための領域である反射領域とそれ以外の導通領域とに分けて、前記反射領域に積層された多層反射層と、
前記導通領域、および前記多層反射層を覆って設けられた金属反射層とを備え、
前記多層反射層は、屈折率がn1である第1屈折率透明層と、屈折率がn1よりも小さいn2である第2屈折率透明層とが交互にそれぞれ1層以上積層されてなり、
前記多層反射層において前記金属反射層側の最外層が前記第2屈折率透明層であることを特徴とする半導体発光素子。 - 前記第1屈折率透明層の層厚みは、λ/4n1であり、
前記第2屈折率透明層の層厚みは、λ/4n2である、請求項1記載の半導体発光素子(但し、λは前記発光層から発せられる光の波長である)。 - 前記多層反射層と前記透明導電層との間には、前記第2屈折率透明層より屈折率が低く、層厚がλ/4よりも厚い誘電体層が設けられている、請求項2記載の半導体発光素子。
- 前記多層反射層において、前記発光層側の最外層は前記第1屈折率透明層である、請求項1から3のいずれかの項に記載の半導体発光素子。
- 前記多層反射層において、前記発光層側の最外層は前記第2屈折率透明層である、請求項1から3のいずれかの項に記載の半導体発光素子。
- 前記p型半導体層の屈折率はn2よりも大きい、請求項1から5のいずれかの項に記載の半導体発光素子。
- 前記第2屈折率透明層はAl2O3からなり、
前記金属反射層はAgからなる、請求項1から6のいずれかの項に記載の半導体発光素子。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12814347.6A EP2733750A4 (en) | 2011-07-15 | 2012-07-12 | SEMICONDUCTOR LIGHT-EMITTING ELEMENT |
US14/129,899 US20140138731A1 (en) | 2011-07-15 | 2012-07-12 | Semiconductor light emitting element |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011156415 | 2011-07-15 | ||
JP2011-156415 | 2011-07-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013011674A1 true WO2013011674A1 (ja) | 2013-01-24 |
Family
ID=47557875
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/004523 WO2013011674A1 (ja) | 2011-07-15 | 2012-07-12 | 半導体発光素子 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20140138731A1 (ja) |
EP (1) | EP2733750A4 (ja) |
JP (1) | JPWO2013011674A1 (ja) |
WO (1) | WO2013011674A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103078023A (zh) * | 2013-01-31 | 2013-05-01 | 武汉迪源光电科技有限公司 | 一种双反射发光二极管 |
EP2887248A1 (en) | 2013-12-20 | 2015-06-24 | Orange | Method of authentication of at least one user with respect to at least one electronic apparatus, and a device therefor |
WO2016002800A1 (ja) * | 2014-07-01 | 2016-01-07 | 株式会社タムラ製作所 | 発光素子 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101784849B1 (ko) * | 2013-01-04 | 2017-10-13 | 삼성전자주식회사 | 다층 투명 전극을 갖는 발광 소자 및 그 제조 방법 |
KR102302592B1 (ko) * | 2017-07-18 | 2021-09-15 | 삼성전자주식회사 | 반도체 발광 소자 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007258276A (ja) | 2006-03-20 | 2007-10-04 | Matsushita Electric Works Ltd | 半導体発光素子 |
JP2009088299A (ja) * | 2007-09-29 | 2009-04-23 | Nichia Corp | 発光素子及びこれを備える発光装置 |
JP2010087282A (ja) | 2008-09-30 | 2010-04-15 | Panasonic Electric Works Co Ltd | 半導体発光素子 |
JP2010199247A (ja) * | 2009-02-24 | 2010-09-09 | Panasonic Electric Works Co Ltd | 発光装置 |
WO2011071100A1 (ja) * | 2009-12-11 | 2011-06-16 | 昭和電工株式会社 | 半導体発光素子、半導体発光素子を用いた発光装置および電子機器 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100631840B1 (ko) * | 2004-06-03 | 2006-10-09 | 삼성전기주식회사 | 플립칩용 질화물 반도체 발광소자 |
US20060208364A1 (en) * | 2005-03-19 | 2006-09-21 | Chien-Jen Wang | LED device with flip chip structure |
JP2009200178A (ja) * | 2008-02-20 | 2009-09-03 | Hitachi Cable Ltd | 半導体発光素子 |
KR101666442B1 (ko) * | 2010-03-25 | 2016-10-17 | 엘지이노텍 주식회사 | 발광 다이오드 및 이를 포함하는 발광 소자 패키지 |
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2012
- 2012-07-12 JP JP2013524604A patent/JPWO2013011674A1/ja active Pending
- 2012-07-12 EP EP12814347.6A patent/EP2733750A4/en not_active Withdrawn
- 2012-07-12 US US14/129,899 patent/US20140138731A1/en not_active Abandoned
- 2012-07-12 WO PCT/JP2012/004523 patent/WO2013011674A1/ja active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007258276A (ja) | 2006-03-20 | 2007-10-04 | Matsushita Electric Works Ltd | 半導体発光素子 |
JP2009088299A (ja) * | 2007-09-29 | 2009-04-23 | Nichia Corp | 発光素子及びこれを備える発光装置 |
JP2010087282A (ja) | 2008-09-30 | 2010-04-15 | Panasonic Electric Works Co Ltd | 半導体発光素子 |
JP2010199247A (ja) * | 2009-02-24 | 2010-09-09 | Panasonic Electric Works Co Ltd | 発光装置 |
WO2011071100A1 (ja) * | 2009-12-11 | 2011-06-16 | 昭和電工株式会社 | 半導体発光素子、半導体発光素子を用いた発光装置および電子機器 |
Non-Patent Citations (1)
Title |
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See also references of EP2733750A4 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103078023A (zh) * | 2013-01-31 | 2013-05-01 | 武汉迪源光电科技有限公司 | 一种双反射发光二极管 |
EP2887248A1 (en) | 2013-12-20 | 2015-06-24 | Orange | Method of authentication of at least one user with respect to at least one electronic apparatus, and a device therefor |
WO2016002800A1 (ja) * | 2014-07-01 | 2016-01-07 | 株式会社タムラ製作所 | 発光素子 |
JP2016015375A (ja) * | 2014-07-01 | 2016-01-28 | 株式会社タムラ製作所 | 発光素子 |
Also Published As
Publication number | Publication date |
---|---|
US20140138731A1 (en) | 2014-05-22 |
EP2733750A4 (en) | 2014-12-03 |
JPWO2013011674A1 (ja) | 2015-02-23 |
EP2733750A1 (en) | 2014-05-21 |
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