WO2013009065A3 - 엘이디 부품의 3차원비전검사장치 및 비전검사방법 - Google Patents

엘이디 부품의 3차원비전검사장치 및 비전검사방법 Download PDF

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Publication number
WO2013009065A3
WO2013009065A3 PCT/KR2012/005442 KR2012005442W WO2013009065A3 WO 2013009065 A3 WO2013009065 A3 WO 2013009065A3 KR 2012005442 W KR2012005442 W KR 2012005442W WO 2013009065 A3 WO2013009065 A3 WO 2013009065A3
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WO
WIPO (PCT)
Prior art keywords
unit
led component
inspection
height
fluorescent substance
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Application number
PCT/KR2012/005442
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English (en)
French (fr)
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WO2013009065A2 (ko
Inventor
박찬화
김성현
Original Assignee
주식회사 미르기술
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Application filed by 주식회사 미르기술 filed Critical 주식회사 미르기술
Publication of WO2013009065A2 publication Critical patent/WO2013009065A2/ko
Publication of WO2013009065A3 publication Critical patent/WO2013009065A3/ko

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/08—Testing mechanical properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

본 발명에 따른 엘이디 부품의 3차원비전검사장치는 엘이디 부품을 카메라로 촬영하여 양호 또는 불량을 판별하기 위한 엘이디 부품의 비전검사장치로서, 상기 엘이디 부품을 검사위치에 고정 또는 이송시키는 스테이지부와, 상기 스테이지부의 상부에 위치하며, 상기 엘이디 부품에 조명을 제공하는 조명부와, 상기 조명부의 중심에 위치되어 엘이디 부품의 2차원 형상을 획득하기 위한 중앙카메라부와, 상기 중앙카메라부의 측부에 배치되는 측부카메라부와, 상기 중앙카메라부의 측부에 배치되는 격자무늬조사부와, 상기 중앙카메라부에서 촬영된 영상을 판독하여 상기 엘이디 부품의 높이를 측정하기 위한 격자비전처리부와, 상기 엘이디 부품의 실제 높이를 측정하기 위한 실제높이측정부와, 상기 격자비전처리부와 실제높이측정부로부터의 측정 결과로부터 부품의 양불량을 판단하는 양불량판단부와, 상기 각 구성들을 제어하기 위한 제어부를 포함한다. 본 발명에 의해, 엘이디 부품에 도포된 반투명 재질의 형광체 표면 높이를 정확히 측정할 수 있다. 또한, 형광체 표면 높이를 신속히 검사가능하며, 형광체의 농도가 달라질 경우에도 형광체의 높이를 정확하고도 신속하게 측정할 수 있다.
PCT/KR2012/005442 2011-07-13 2012-07-10 엘이디 부품의 3차원비전검사장치 및 비전검사방법 WO2013009065A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0069196 2011-07-13
KR1020110069196A KR101269976B1 (ko) 2011-07-13 2011-07-13 엘이디 부품의 3차원비전검사장치 및 비전검사방법

Publications (2)

Publication Number Publication Date
WO2013009065A2 WO2013009065A2 (ko) 2013-01-17
WO2013009065A3 true WO2013009065A3 (ko) 2013-04-11

Family

ID=47506688

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/005442 WO2013009065A2 (ko) 2011-07-13 2012-07-10 엘이디 부품의 3차원비전검사장치 및 비전검사방법

Country Status (3)

Country Link
KR (1) KR101269976B1 (ko)
TW (1) TWI507660B (ko)
WO (1) WO2013009065A2 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG2013084975A (en) * 2013-11-11 2015-06-29 Saedge Vision Solutions Pte Ltd An apparatus and method for inspecting asemiconductor package
KR101657982B1 (ko) 2014-09-15 2016-09-30 (주)자비스 엘이디 패키지의 엑스레이 검사 장치
KR20160118722A (ko) 2015-04-03 2016-10-12 유종재 3d 비전검사 시스템
KR20170006385A (ko) 2015-07-08 2017-01-18 최보윤 구이판
KR101784987B1 (ko) * 2015-08-26 2017-10-12 (주)제이티 비전검사모듈 및 그를 가지는 소자검사시스템
CN107037378A (zh) * 2017-05-12 2017-08-11 广东天圣高科股份有限公司 一种红外感应灯具检测装置
CN112683190B (zh) * 2020-10-27 2022-10-04 广东奥普特科技股份有限公司 一种透明体内置物深度检测方法及其检测系统
CN112540093A (zh) * 2020-11-10 2021-03-23 河北光兴半导体技术有限公司 玻璃类产品深度信息的精确定位装置及其方法
CN112461503A (zh) * 2020-11-15 2021-03-09 珠海速乐科技有限公司 一种led灯板视觉检测装置及检测方法
KR20240061385A (ko) 2022-10-31 2024-05-08 주식회사 미르기술 그림자식 미니엘이디 본딩자세 측정장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007327836A (ja) * 2006-06-07 2007-12-20 Olympus Corp 外観検査装置及び方法
KR20090110495A (ko) * 2008-04-18 2009-10-22 주식회사 미르기술 비전 검사 시스템
KR20100090234A (ko) * 2010-07-23 2010-08-13 삼성엘이디 주식회사 Ｌｅｄ 검사 장치 및 그 방법
JP2011064482A (ja) * 2009-09-15 2011-03-31 Kurabo Ind Ltd 高速三次元計測装置及び高速三次元計測方法

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FR2914422B1 (fr) * 2007-03-28 2009-07-03 Soitec Silicon On Insulator Procede de detection de defauts de surface d'un substrat et dispositif mettant en oeuvre ledit procede.
KR100839167B1 (ko) * 2007-09-18 2008-06-17 주식회사 엔씨비네트웍스 모아레 무늬 발생기를 적용한 위상천이 영사식 3차원형상측정장치 및 그 방법
KR101251372B1 (ko) * 2008-10-13 2013-04-05 주식회사 고영테크놀러지 3차원형상 측정방법
JP5256251B2 (ja) * 2009-07-03 2013-08-07 コー・ヤング・テクノロジー・インコーポレーテッド 測定対象物の検査方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007327836A (ja) * 2006-06-07 2007-12-20 Olympus Corp 外観検査装置及び方法
KR20090110495A (ko) * 2008-04-18 2009-10-22 주식회사 미르기술 비전 검사 시스템
JP2011064482A (ja) * 2009-09-15 2011-03-31 Kurabo Ind Ltd 高速三次元計測装置及び高速三次元計測方法
KR20100090234A (ko) * 2010-07-23 2010-08-13 삼성엘이디 주식회사 Ｌｅｄ 검사 장치 및 그 방법

Also Published As

Publication number Publication date
TW201315965A (zh) 2013-04-16
KR20130008694A (ko) 2013-01-23
TWI507660B (zh) 2015-11-11
KR101269976B1 (ko) 2013-06-05
WO2013009065A2 (ko) 2013-01-17

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