WO2013004083A1 - 一种基于柔性基板封装的屏蔽结构及其制作工艺 - Google Patents

一种基于柔性基板封装的屏蔽结构及其制作工艺 Download PDF

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Publication number
WO2013004083A1
WO2013004083A1 PCT/CN2012/071127 CN2012071127W WO2013004083A1 WO 2013004083 A1 WO2013004083 A1 WO 2013004083A1 CN 2012071127 W CN2012071127 W CN 2012071127W WO 2013004083 A1 WO2013004083 A1 WO 2013004083A1
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Prior art keywords
flexible substrate
chip
package
component
shielding
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PCT/CN2012/071127
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English (en)
French (fr)
Inventor
李君�
万里兮
曹立强
陶文君
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中国科学院微电子研究所
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Publication of WO2013004083A1 publication Critical patent/WO2013004083A1/zh

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    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
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    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Definitions

  • the invention relates to a shielding structure based on a flexible substrate package and a manufacturing process thereof, in particular to a shielding structure for a single chip package and a system level package (S iP ) and a manufacturing process thereof, and belongs to the technical field of microelectronic packaging. Background technique
  • EMI Electromagnetic compatibility
  • Flexible substrate applications are mainly in the three aspects of flexible displays, thin film solar cells and electronic skin.
  • E-Ink and Br idges tone respectively showed rollable electronic books and rollable electronic paper
  • Sony and LG Phi l ips LCD exhibited flexible 0LED displays.
  • Thin film battery products have been successfully developed and marketed, and electronic skin is also in the research and development stage.
  • CN200910143507. 1 shows a conventional electronic component system shielding structure including a substrate, an electronic component and a shielding device. In order to reduce the interference between the electronic components in the same shield, an electromagnetic bandgap structure is added on top of the shield structure.
  • this type of shielding structure is suitable for the packaged component system, and the size of the entire system is large.
  • CN200410081686. 8, CN200810082225. 0 and other patents protect a specific shielded flexible circuit board structure. This type of structure is only shielded for the substrate, that is, it can only shield the internal circuit of the flexible substrate, and cannot solve the EMI problem of the components in the package.
  • this type of patent protects a specific shielded flexible substrate structure, which is not unique, that is, a flexible substrate having shielding properties can be realized by a conventional method and other special structures.
  • the present invention provides a shielding structure based on a flexible substrate package and a manufacturing process thereof for the EMI problem after miniaturization of the module.
  • a shielding structure based on a flexible substrate package includes a flexible substrate, the flexible substrate is coated on the component, and the flexible substrate and the component are filled with a potting glue, The flexible substrate is coated with at least one shielding layer, and the shielding layer is connected Or a power supply, the outer surface of the flexible substrate with the shielding layer is provided with a plurality of package pins, the package pins and the flexible substrate are electrically connected, and the flexible substrate passes through the package pins and the printed circuit board Interconnected between.
  • the present invention can also be improved as follows.
  • the component comprises at least one chip, a passive component or a packaged chip
  • the package pin is a solder ball of a ball grid array, a pin-shaped pin of a pin array or a metal contact of a planar grid array.
  • the component is a chip
  • the chip and the flexible substrate are interconnected by flip chip bonding, and the chip is fixed on the flexible substrate by a plurality of flip-chip bumps, The bottom of the flip-chip bump is filled with an underfill; or the chip and the flexible substrate are interconnected by wire bonding, and the chip is fixed on the flexible substrate by an adhesive, the chip Electrical connection between the wire bonding wires and the flexible substrate.
  • the component is a passive component or a packaged chip
  • the passive component or the packaged chip is interconnected with the flexible substrate in a surface mount manner.
  • the flexible substrate with the shielding layer covers the component in a single layer coating manner, and the single layer coating structure is formed by disposing at least one component on the flexible substrate, and then folding the flexible substrate to make the flexible layer
  • the substrate is formed by covering the components.
  • a plurality of components are stacked on top of each other and then disposed on the flexible substrate, or a plurality of components are sequentially laid on the flexible substrate.
  • the flexible substrate with the shielding layer covers the component by a multi-layer coating
  • the multi-layer cladding structure is formed by disposing a plurality of components on the flexible substrate, and then folding the flexible substrate multiple times.
  • the flexible substrate is formed into a multilayer structure and the components are covered.
  • At least one component is disposed in each layer structure.
  • a plurality of components are disposed, a plurality of components are stacked on top of each other and disposed on the flexible substrate, or a plurality of components are sequentially disposed on the left and right sides.
  • the shielding layer is a metal film or a conventional shielding glue or a special shielding glue containing iron, cobalt, nickel or alloy particles.
  • a manufacturing process of a shielding structure based on a flexible substrate package includes the following steps:
  • Step 1 processing the flexible substrate, and forming a shielding layer on the flexible substrate;
  • Step two coating the flexible substrate on the component, and interconnecting the component and the flexible substrate;
  • the component is a chip
  • the chip and the flexible substrate are interconnected by flip-chip bonding
  • the chip is fixed on the flexible substrate by flip-chip solder bumps by using a reflow soldering process. And filling an underfill around the flip-chip bump to protect the flip-chip bump;
  • the component is a chip
  • the chip and the flexible substrate are interconnected by wire bonding
  • the chip is bonded to the flexible substrate by using an adhesive, and the wire bonding process is adopted.
  • the wire bonding wire is connected between the chip and the flexible substrate; when the mounted chip is surface-mounted and interconnected with the flexible substrate, the passive component or the packaged chip is fixed on the flexible substrate by a reflow soldering process. ;
  • Step 3 Folding the flexible substrate, wrapping the flexible substrate with the component, filling the potting glue between the flexible substrate and the component, and fixing the flexible substrate to form and protect the component;
  • Step 4 Fix the package pin on the flexible substrate with the shielding layer, and interconnect the flexible substrate through the package pin and the printed circuit board.
  • the package pin is a solder ball of the ball grid array. Pin-shaped pins of the foot array or metal contacts of a planar grid array.
  • the shielding structure based on the flexible substrate package provided by the invention fully utilizes the flexibility and shielding property of the flexible substrate, and realizes shielding between modules and shielding between chips inside the module in an efficient and convenient manner; 2.
  • the shielding structure based on the flexible substrate package provided by the invention can adopt the controllable transmission line such as microstrip line, strip line and coplanar waveguide on the flexible substrate, the signal transmission quality is guaranteed, and the line is fine, and high density can be realized. wiring;
  • the shielding structure based on the flexible substrate package provided by the present invention, the chip in the shielding structure can be any packaging manner;
  • the shielding structure based on the flexible substrate package provided by the invention has a thin flexible substrate and is easy to dissipate heat
  • the shielding structure based on the flexible substrate package provided by the invention has good reliability and mechanical properties of the flexible substrate, can be bent, and realizes three-dimensional packaging;
  • the shielding structure based on the flexible substrate package provided by the present invention is mature in the manufacturing process and light in package, which is advantageous for miniaturization of the packaging system.
  • FIG. 1 is a cross-sectional view showing a single-layer shield structure based on a flexible substrate package according to a first embodiment of the present invention
  • FIG. 2 is a cross-sectional view showing a single-layer shielding structure based on a flexible substrate package according to a second embodiment of the present invention
  • FIG. 3 is a cross-sectional view showing a single-layer shielding structure based on a flexible substrate package according to a third embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing a single-layer shielding structure based on a flexible substrate package according to a fourth embodiment of the present invention.
  • Figure 5 is a cross-sectional view showing a multilayer shield structure based on a flexible substrate package in accordance with a first embodiment of the present invention
  • FIG. 6 is a cross section of a multilayer shield structure based on a flexible substrate package according to a second embodiment of the present invention. detailed description
  • FIG. 1 is a cross-sectional view showing a single-layer shield structure based on a flexible substrate package in accordance with a first embodiment of the present invention.
  • the chip 103 is bonded to the flexible substrate 101 by Fl ip-chip, and the 107 underfill is used to protect the Fl ip-Chip bump 104.
  • the shield layer 102 is located on the flexible substrate 101 and is connected to the substrate ground/power circuit through conductive vias or directly to the ground/power ball grid array solder balls 105.
  • the shielding material is a metal film such as copper or a shielding glue.
  • the shielding rubber includes a common shielding gel and a new type of colloid containing high magnetic permeability and high conductivity microparticles such as iron, cobalt, nickel or the corresponding alloy.
  • a potting compound 106 such as a plastic sealant is filled between the folded flexible substrate 101 and the chip 103 to function to fix the flexible substrate to form and protect the chip.
  • FIG. 2 is a cross-sectional view showing a single-layer shield structure based on a flexible substrate package in accordance with a second embodiment of the present invention.
  • the chip 203 is fixed on the chip 208 by an adhesive 209, and the chip 208 is fixed on the flexible substrate 201 by an adhesive.
  • the shielding layer 202 is located on the flexible substrate 201 and passes through the conductive through holes.
  • the substrate ground/power circuit is connected or directly connected to the ground/power ball grid array solder balls 205.
  • the shielding material is a metal film such as copper or a shielding glue.
  • the shielding rubber includes common shielding glue and a new colloid containing high magnetic permeability and high conductivity micro particles such as iron, cobalt, nickel or the corresponding alloy.
  • a potting compound 206 such as a molding compound is filled between the folded flexible substrate 201 and the chip 203, 208 to function to fix the flexible substrate and protect the chip.
  • the chips 203, 208 are electrically connected between the Wi rebond line 210 and the flexible substrate.
  • Third embodiment 3 is a cross-sectional view showing a single-layer shield structure based on a flexible substrate package in accordance with a third embodiment of the present invention.
  • the chips 301 and 311 are bonded to the flexible substrate 301 by using an Fl ip-chip method, and 307 underfill is used to protect the Fl ip-Chi p bump 304, and the chip 308 is fixed by the adhesive 309.
  • the shielding layer 302 is placed on the flexible substrate 301 and connected to the substrate ground/power circuit through conductive vias or directly to the ground/power ball grid array solder balls 305.
  • the shielding material is a metal film such as copper or a shielding glue.
  • the shielding rubber includes a common shielding glue and a novel colloid containing high magnetic permeability and high conductivity micro particles such as iron, cobalt, nickel or a corresponding alloy.
  • the potting compound 306 such as plastic encapsulant is filled between the folded flexible substrate 301 and the chip 303, 308, 311 to fix the flexible substrate and to protect the chip.
  • the chip 308 is electrically connected between the Wi rebond line 310 and the flexible substrate.
  • FIG. 4 is a cross-sectional view showing a single-layer shield structure based on a flexible substrate package in accordance with a fourth embodiment of the present invention.
  • the chip 403, 408 is bonded to the flexible substrate 401 by the Fl ip-chip method, and the 407 underfill is used to protect the Fl ip-Chi p bump 404.
  • the shield layer 402 is located on the flexible substrate 401 and is connected to the substrate ground/power circuit through conductive vias or directly to the ground/power ball grid array solder balls 405.
  • the shielding material is a metal film such as copper or a shielding glue.
  • the shielding rubber includes common shielding glue and a new colloid containing high magnetic permeability and high conductivity micro particles such as iron, cobalt, nickel or the corresponding alloy.
  • the encapsulant 406 such as plastic encapsulant is filled between the folded flexible substrate 401 and the chips 403 and 408 to fix the flexible substrate and to protect the chip.
  • FIG. 5 is a cross-sectional view showing a multilayer shield structure based on a flexible substrate package in accordance with a first embodiment of the present invention.
  • the chip 503, 508 is bonded to the flexible substrate 501 by the Fl ip-chip method, and the 507 underfill is used to protect the Fl ip-Chi p bump 504.
  • the shielding layer 502 is located on the flexible substrate 501 and is connected to the substrate ground/power circuit through the conductive via or directly to the ground/power source
  • the ball grid array solder balls 505 are connected.
  • the shielding material is a metal film such as copper or a shielding glue.
  • the shielding rubber includes a common shielding glue and a novel colloid containing high magnetic permeability and high conductivity micro particles such as iron, cobalt, nickel or a corresponding alloy.
  • a potting compound 506 such as a molding compound is filled between the folded flexible substrate 501 and the chip 503, 508 to fix the flexible substrate and to protect the chip.
  • the chips 503, 508 are respectively located on the upper and lower surfaces of the flexible substrate.
  • Figure 6 is a cross-sectional view showing a multilayer shield structure based on a flexible substrate package in accordance with a second embodiment of the present invention.
  • the chips 603, 608, and 61 1 are bonded to the flexible substrate 601 by F l i p-chi p, and the underfill 607 is used to protect the F l i p-Chi p bumps 604.
  • the shield layer 602 is located on the flexible substrate 601 and is connected to the substrate ground/power circuit through conductive vias or directly to the ground/power ball grid array solder balls 605.
  • the shielding material is a metal film such as copper or a shielding rubber.
  • the shielding rubber includes a common shielding glue and a new colloid containing high magnetic permeability and high conductivity micro particles such as iron, cobalt, nickel or a corresponding alloy.
  • a potting compound 606 such as a molding compound is filled between the folded flexible substrate 601 and the chip 603 to fix the flexible substrate and to protect the chip.
  • the substrate-fixed bonding agent 612 is applied to the folded portion of the substrate to function as a substrate.
  • the chips 603, 608, 61 1 are all located on the upper surface of the flexible substrate.
  • the chip may be located on the upper surface of the flexible substrate at the same time, or may be located on the lower surface of the flexible substrate at the same time, or may be located on the upper surface of the flexible substrate, and another part is located under the flexible substrate. As long as the flexible substrate is folded, the components are covered.
  • Step 1 Flexible substrate processing using a conventional flexible substrate processing process.
  • one layer of the copper clad plate can be made into a shielding layer through the conductive via grounding/connecting power source.
  • a similar shielding layer can be one or more layers.
  • one or two layers are common. Shield.
  • an insulating layer is formed on the outermost layer of the flexible substrate.
  • Other special methods can also be used to implement a shielding layer with shielding properties.
  • the optional shielding material is a metal film such as copper or a shielding glue.
  • the shielding glue includes common shielding glue and a new type of colloid containing high magnetic permeability and high conductivity micro particles such as iron, cobalt, nickel or the corresponding alloy.
  • Step 2 Fixing components and bonding:
  • the bonding function is used.
  • the adhesive bonds the chip to the flexible substrate.
  • the conventional wire bonding process including thermocompression bonding, ultrasonic bonding, thermosonic bonding, etc., completes the interconnection of the chip and the flexible substrate, and the lead material includes metal wires such as gold, copper, aluminum, and silver.
  • the chip bump is fixed to the flexible substrate by a reflow soldering process, and the underfill is used to protect the chip bump.
  • the chips can be mounted on the same side or on both sides of the substrate.
  • the component is a passive component or a packaged chip
  • the passive component or the packaged chip is fixed on the flexible substrate by a reflow process.
  • Step 3 Fixing: The flexible substrate extension is folded into a single-layer or multi-layer fully-coated or semi-clad component, and the potting glue is filled in the folded state by a special mold and a plastic sealing process such as hot pressing. Between the flexible substrate and the chip, the flexible substrate is fixed and the chip is protected.
  • Step 4 Add Package Pins: Use ball bumping to secure the ball grid array solder balls to the flexible substrate.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

提供一种基于柔性基板封装的屏蔽结构及其制作工艺。屏蔽结构包括柔性基板（101），柔性基板包覆在元器件上，柔性基板和元器件之间填充有灌封胶（106），柔性基板包覆有至少一层屏蔽层（102），屏蔽层接地或者接电源，带有屏蔽层的柔性基板外表面设有多个封装引脚，封装引脚和柔性基板之间电连接，柔性基板通过封装引脚和印制电路板之间进行互连。提供的基于柔性基板封装的屏蔽结构，所使用的制造工艺基本成熟且封装重量轻，能够有效提高小型化封装系统的灵敏度。

Description

一种基于柔性基板封装的屏蔽结构及其制作工艺
技术领域
本发明涉及一种基于柔性基板封装的屏蔽结构及其制作工艺， 尤其涉及 一种用于单芯片封装和系统级封装（S iP ) 的屏蔽结构及其制作工艺， 属于 微电子封装技术领域。 背景技术
随着通讯电子的兴起， 对小型化和高灵敏度模块或系统的需求越来越 高，对信号质量的要求也越来越严格。一般通讯系统的灵敏度都在 - l OOdBm, GPS (全球定位系统） 的灵敏度甚至低于 - 148dBm, —些收发模块的灵敏度 要求也很高， 电磁兼容（EMI )成了系统小型化封装中的一个非常重要的问 题。 EMI问题主要有外界磁场对模块芯片的干扰， 模块对外辐射干扰其它敏 感源以及模块内部芯片之间的电磁干扰问题， 包含封装基板线路屏蔽以及元 器件屏蔽两个层面的内容。
以系统级封装（S iP ) 为代表的新型封装技术， 一些新型材料和技术的 应用为小型化带来契机， 成为系统或模块小型化的有效实现方式之一。 柔性 电子技术是一门新型的科学技术， 其中柔性基板与传统硬质基板相比更具柔 韧性、 薄膜性， 而且保留了硬质基板绝缘性、 较高强度等特点。
柔性基板应用主要在柔性显示器、 薄膜太阳能电池和电子皮肤三个方 面。 2007年举办的 SID大会上， E-Ink和 Br idges tone分别展示了可卷曲电 子书和可卷曲电子纸， Sony与 LG Phi l ips LCD则分别展出柔性 0LED显示器。 薄膜电池产品已经研发成功并面向市场销售， 电子皮肤也处于研发阶段。 这 些应用充分利用了柔性基板柔韧性和薄膜性的特点。
利用柔性基板实现小型化、 3D封装的研究也是柔性基板主要研究方向之 一。 US0066000222B US20050224993A1和 US20040212063A1等专利利用柔 性基板柔韧性实现三维堆叠， 提高封装密度。 这些研究集中在系统的三维封 装结构上并未涉及屏蔽设计。 US006121676A中除了实现柔性基板的三维封装 之外， 还采用外部金属框起到固定和散热的作用。 虽然金属框也可以起到一 定的屏蔽效果， 但对系统内部器件的辐射干扰并不能抑制。 另外， 采用较厚 的金属外框固定成形也增加了封装的体积。
CN200910143507. 1 显示了一种传统的电子元件系统屏蔽结构， 包括基 底， 电子元件以及屏蔽装置。 为了降低相同屏蔽罩内电子元件之间的干扰， 在屏蔽结构顶部添加电磁带隙结构。但该类屏蔽结构适用于封装后的元器件 系统， 而且整个系统的尺寸较大。 CN200410081686. 8、 CN200810082225. 0 等专利保护了特定的屏蔽型柔性电路板结构。 该类结构仅针对基板屏蔽， 即 仅能屏蔽柔性基板内部电路， 不能解决封装中元器件的 EMI问题。 并且该类 专利中保护了特定的屏蔽型柔性基板结构， 不具有唯一性， 即采用常规方法 和其它特殊结构也能实现具有屏蔽性能的柔性基板。
基于上述对屏蔽技术和柔性基板的探讨，针对模块小型化系统封装解决 方案中的三个主要 EMI问题， 即外界磁场对模块芯片的干扰， 模块对外辐射 干扰其它敏感源以及模块内部芯片之间的电磁干扰问题，作为新型屏蔽结构 的研究方向。 发明内容
本发明为满足对小型化和高灵敏度模块或系统的需求越来越高，针对模 块小型化后的 EMI问题，本发明提供了一种基于柔性基板封装的屏蔽结构及 其制作工艺。
本发明解决上述技术问题的技术方案如下： 一种基于柔性基板封装的屏 蔽结构包括柔性基板， 所述柔性基板包覆在元器件上， 所述柔性基板和元器 件之间填充有灌封胶， 所述柔性基板包覆有至少一层屏蔽层， 所述屏蔽层接 地或者接电源， 所述带有屏蔽层的柔性基板外表面设有多个封装引脚， 所述 封装引脚和柔性基板之间电连接， 所述柔性基板通过封装引脚和印制电路板 之间进行互连。
在上述技术方案的基础上， 本发明还可以做如下改进。
进一步，所述元器件包括至少一个棵芯片、无源元件或者封装后的芯片， 所述封装引脚为球栅阵列的焊球、 引脚阵列的针状插脚或者平面栅格阵列的 金属触点。
进一步， 所述元器件为棵芯片时， 所述棵芯片和柔性基板之间采用倒装 焊的形式进行互连， 所述棵芯片通过多个倒装焊凸点固定在柔性基板上， 所 述倒装焊凸点的周围填充有底部填充胶； 或者所述棵芯片和柔性基板之间采 用引线键合的形式进行互连， 所述棵芯片通过粘结剂固定在柔性基板上， 所 述芯片通过引线键合线和柔性基板之间电连接。
进一步， 所述元器件为无源元件或者封装后的芯片时， 所述无源元件或 者封装后的芯片采用表面贴装的形式与柔性基板互联。
进一步， 所述带有屏蔽层的柔性基板包覆元器件的方式为单层包覆， 该 单层包覆结构是通过将至少一个元器件设置于柔性基板上，再将柔性基板折 叠后使柔性基板将元器件包覆在内而形成的。
进一步， 所述元器件为多个时， 多个元器件上下堆叠在一起后设置于柔 性基板上， 或者多个元器件左右平铺依次设置在柔性基板上。
进一步， 所述带有屏蔽层的柔性基板包覆元器件的方式为多层包覆， 该 多层包覆结构是通过将多个元器件设置于柔性基板上，再将柔性基板折叠多 次后使柔性基板形成多层结构并将元器件包覆在内而形成的。
进一步， 所述每层结构内设有至少一个元器件， 当设有多个元器件时， 多个元器件上下堆叠在一起后设置于柔性基板上，或者多个元器件左右平铺 依次设置在柔性基板上。 进一步， 所述屏蔽层为金属薄膜或者常规屏蔽胶或者含铁、 钴、 镍或者 合金颗粒的特殊屏蔽胶。
本发明还提供一种解决上述技术问题的技术方案如下： 一种基于柔性基 板封装的屏蔽结构的制作工艺包括以下步骤：
步骤一： 加工柔性基板， 并在柔性基板上制作屏蔽层；
步骤二： 将柔性基板包覆在元器件上， 并将元器件和柔性基板之间进行 互连；
当所述元器件为棵芯片时，且所述棵芯片和柔性基板之间采用倒装焊的 形式进行互连时，采用回流焊工艺将棵芯片通过倒装焊凸点固定在柔性基板 上， 并在所述倒装焊凸点的周围填充底部填充胶以保护倒装焊凸点；
当所述元器件为棵芯片时，且所述棵芯片和柔性基板之间采用引线键合 的形式进行互连时， 使用粘结剂将棵芯片贴合于柔性基板上， 采用引线键合 工艺将引线键合线连接在棵芯片和柔性基板之间； 装好的芯片采用表面贴装的方式与柔性基板互连时， 采用回流焊工艺将无源 元件或者封装好的芯片固定在柔性基板上；
步骤三： 将柔性基板折叠， 使柔性基板包覆元器件， 将灌封胶填充于柔 性基板和元器件之间， 起到固定柔性基板成型和保护元器件的作用；
步骤四： 将封装引脚固定在带有屏蔽层的柔性基板上， 使柔性基板通过 封装引脚和印制电路板之间进行互连， 所述封装引脚为球栅阵列的焊球、 引 脚阵列的针状插脚或者平面栅格阵列的金属触点。
本发明的有益效果是：
1、 本发明提供的基于柔性基板封装的屏蔽结构， 充分利用柔性基板的 柔韧性和屏蔽性， 以一种高效、 便利的方法实现模块之间的屏蔽， 模块内部 芯片之间的屏蔽； 2、 本发明提供的基于柔性基板封装的屏蔽结构， 在柔性基板上可采用 微带线， 带状线， 共面波导等可控传输线， 信号传输质量有保证， 而且线条 很细， 可实现高密布线；
3、 本发明提供的基于柔性基板封装的屏蔽结构， 屏蔽结构中的芯片可 以是任意封装方式；
4、 本发明提供的基于柔性基板封装的屏蔽结构， 使用的柔性基板很薄， 易于散热；
5、 本发明提供的基于柔性基板封装的屏蔽结构， 使用的柔性基板的可 靠性和机械性能都较好， 可弯曲， 实现三维封装；
6、 本发明提供的基于柔性基板封装的屏蔽结构， 所使用的制造工艺基 本成熟且封装重量轻， 有利于封装系统的小型化。 附图说明
图 1 为本发明第一实施例的基于柔性基板封装的单层屏蔽结构的剖面 图；
图 2 为本发明第二实施例的基于柔性基板封装的单层屏蔽结构的剖面 图；
图 3 为本发明第三实施例的基于柔性基板封装的单层屏蔽结构的剖面 图；
图 4 为本发明第四实施例的基于柔性基板封装的单层屏蔽结构的剖面 图；
图 5 为本发明第一实施例的基于柔性基板封装的多层屏蔽结构的剖面 图；
图 6 为本发明第二实施例的基于柔性基板封装的多层屏蔽结构的剖面 具体实施方式
以下结合附图对本发明的原理和特征进行描述，所举实例只用于解释本 发明， 并非用于限定本发明的范围。
下面对本发明基于柔性基板封装的单层屏蔽结构对进一步详细的描述。 第一实施例
图 1 是本发明第一实施例的基于柔性基板封装的单层屏蔽结构的剖面 图。 如图 1所示， 棵芯片 103采用 Fl ip-chip方式键合在柔性基板 101上， 107底部填充胶用于保护 Fl ip-Chip凸点 104。屏蔽层 102位于柔性基板 101 上， 并通过导电性通孔与基板接地 /电源电路相连或直接与接地 /电源球栅阵 列焊球 105相连。 屏蔽层材料是铜等金属薄膜或涂覆屏蔽胶， 屏蔽胶包括常 见屏蔽胶以及含铁、 钴、 镍或相应合金等高导磁率、 高导电率微颗粒的新型 胶体。塑封胶等灌封胶 106填充于折叠后的柔性基板 101与棵芯片 103之间， 起到固定柔性基板成形和保护棵芯片的作用。
第二实施例
图 2 是本发明第二实施例的基于柔性基板封装的单层屏蔽结构的剖面 图。如图 2所示，棵芯片 203通过粘结剂 209固定在芯片 208上，棵芯片 208 通过粘结剂固定在柔性基板 201上， 屏蔽层 202位于柔性基板 201上， 并通 过导电性通孔与基板接地 /电源电路相连或直接与接地 /电源球栅阵列焊球 205相连。 屏蔽层材料是铜等金属薄膜或涂覆屏蔽胶， 屏蔽胶包括常见屏蔽 胶以及含铁、 钴、 镍或相应合金等高导磁率、 高导电率微颗粒的新型胶体。 塑封胶等灌封胶 206填充于折叠后的柔性基板 201与棵芯片 203、 208之间， 起到固定柔性基板成形和保护芯片的作用。 棵芯片 203、 208 均通过引线键 合（Wi rebond )线 210和柔性基板之间电连接。
第三实施例 图 3 是本发明第三实施例的基于柔性基板封装的单层屏蔽结构的剖面 图。 如图 3所示， 棵芯片 301、 311采用 Fl ip-chip方式键合在柔性基板 301 上， 307底部填充胶用于保护 Fl ip-Chi p凸点 304 , 棵芯片 308通过粘结剂 309固定在柔性基板 301上， 屏蔽层 302位于柔性基板 301上， 并通过导电 性通孔与基板接地 /电源电路相连或直接与接地 /电源球栅阵列焊球 305 相 连。 屏蔽层材料是铜等金属薄膜或涂覆屏蔽胶， 屏蔽胶包括常见屏蔽胶以及 含铁、 钴、 镍或相应合金等高导磁率、 高导电率微颗粒的新型胶体。 塑封胶 等灌封胶 306填充于折叠后的柔性基板 301与棵芯片 303、 308、 311之间， 起到固定柔性基板成形和保护棵芯片的作用。 棵芯片 308 均通过引线键合 ( Wi rebond )线 310和柔性基板之间电连接。
第四实施例
图 4 是本发明第四实施例的基于柔性基板封装的单层屏蔽结构的剖面 图。 如图 4所示， 棵芯片 403、 408采用 Fl ip-chip方式键合在柔性基板 401 上， 407底部填充胶用于保护 Fl ip-Chi p凸点 404。 屏蔽层 402位于柔性基 板 401上， 并通过导电性通孔与基板接地 /电源电路相连或直接与接地 /电源 球栅阵列焊球 405相连。 屏蔽层材料是铜等金属薄膜或涂覆屏蔽胶， 屏蔽胶 包括常见屏蔽胶以及含铁、 钴、 镍或相应合金等高导磁率、 高导电率微颗粒 的新型胶体。 塑封胶等灌封胶 406 填充于折叠后的柔性基板 401 与棵芯片 403、 408之间， 起到固定柔性基板成形和保护棵芯片的作用。
下面对本发明基于柔性基板封装的多层屏蔽结构对进一步详细的描述。 第一实施例
图 5 是本发明第一实施例的基于柔性基板封装的多层屏蔽结构的剖面 图。 如图 5所示， 棵芯片 503、 508采用 Fl ip-chip方式键合在柔性基板 501 上， 507底部填充胶用于保护 Fl ip-Chi p凸点 504。 屏蔽层 502位于柔性基 板 501上， 并通过导电性通孔与基板接地 /电源电路相连或直接与接地 /电源 球栅阵列焊球 505相连。 屏蔽层材料是铜等金属薄膜或涂覆屏蔽胶， 屏蔽胶 包括常见屏蔽胶以及含铁、 钴、 镍或相应合金等高导磁率、 高导电率微颗粒 的新型胶体。 塑封胶等灌封胶 506 填充于折叠后的柔性基板 501 与棵芯片 503、 508之间， 起到固定柔性基板成形和保护棵芯片的作用。 棵芯片 503、 508分别位于柔性基板的上表面和下表面。
第二实施例
图 6 是本发明第二实施例的基于柔性基板封装的多层屏蔽结构的剖面 图。 如图 6所示， 棵芯片 603、 608、 61 1采用 F l i p-chi p方式键合在柔性基 板 601上， 607底部填充胶用于保护 F l i p-Chi p凸点 604。 屏蔽层 602位于 柔性基板 601 上， 并通过导电性通孔与基板接地 /电源电路相连或直接与接 地 /电源球栅阵列焊球 605相连。屏蔽层材料是铜等金属薄膜或涂覆屏蔽胶， 屏蔽胶包括常见屏蔽胶以及含铁、 钴、 镍或相应合金等高导磁率、 高导电率 微颗粒的新型胶体。 塑封胶等灌封胶 606填充于折叠后的柔性基板 601与棵 芯片 603之间， 起到固定柔性基板成形和保护棵芯片的作用。 基板固定的粘 结剂 612涂覆于基板折叠部分起到基板成形的作用。 棵芯片 603、 608、 61 1 均位于柔性基板的上表面。
在基于柔性基板封装的多层屏蔽结构中，棵芯片可以同时位于柔性基板 的上表面， 也可以同时位于柔性基板的下表面， 也可以一部分位于柔性基板 的上表面， 另外一部分位于柔性基板的下表面， 只要使柔性基板折叠后将元 器件包覆在内即可。
为突出本发明结构筒单、 易加工的特点， 下面进一步介绍本发明提供的 这种基于柔性基板封装的屏蔽结构的制作工艺， 具体工艺步骤如下：
步骤 1 : 柔性基板加工， 使用常规柔性基板加工工艺。 柔性基板制造过 程中可将其中一层覆铜板通过导电过孔接地 /接电源做成屏蔽层。 类似的屏 蔽层可以为一层或多层， 为了保持柔性基板的柔韧性， 常见的为一层或两层 屏蔽层。 为了防止柔性基板上的电路氧化和柔性基板折叠时电路发生短路， 在柔性基板最外层制作一层绝缘层。也可以使用其它特殊方法实现具有屏蔽 性能屏蔽层。 可选的屏蔽材料为铜等金属薄膜或涂覆屏蔽胶， 屏蔽胶包括常 见屏蔽胶以及含铁、 钴、 镍或相应合金等高导磁率、 高导电率微颗粒的新型 胶体。
步骤 2 : 固定元器件和键合： 当所述元器件为棵芯片时， 且所述棵芯片 采用引线键合的方法互联时， 首先通过共晶和环氧两种方式， 使用具有粘接 作用的粘结剂将棵芯片贴合于柔性基板上。 使用常规引线键合工艺， 包括热 压键合、 超声键合、 热超声键合等完成棵芯片和柔性基板的互联， 引线材料 包括有金、 铜、 铝、 银等金属丝。 当所述元器件为棵芯片时， 且所述棵芯片 采用倒装焊的方法互联时， 使用回流焊工艺将芯片凸点与柔性基板固定， 并 填入底部填充胶保护芯片凸点。 根据不同的 3D多层包覆结构， 棵芯片可固 定在基板的同侧或两侧。 当所述元器件为无源元件或者封装好的芯片时， 且 用回流焊工艺将无源元件或者封装好的芯片固定在柔性基板上。
步骤 3: 固定成形： 将柔性基板延长部分折叠成单层或多层的全包覆或 半包覆元器件， 并利用特殊的模具， 采用热压等塑封工艺将灌封胶填充于折 叠后的柔性基板与棵芯片之间， 起到固定柔性基板成形和保护棵芯片的作 用。
步骤 4 : 添加封装引脚： 使用植球的方法将球栅阵列焊球固定在柔性基 板上。
以上所述仅为本发明的较佳实施例， 并不用以限制本发明， 凡在本发明 的精神和原则之内， 所作的任何修改、 等同替换、 改进等， 均应包含在本发 明的保护范围之内。

Claims

权利要求书
1. 一种基于柔性基板封装的屏蔽结构， 其特征在于， 所述屏蔽结构包 括柔性基板， 所述柔性基板包覆在元器件上， 所述柔性基板和元器件之间填 充有灌封胶， 所述柔性基板包覆有至少一层屏蔽层， 所述屏蔽层接地或者接 电源， 所述带有屏蔽层的柔性基板外表面设有多个封装引脚， 所述封装引脚 和柔性基板之间电连接，所述柔性基板通过封装引脚和印制电路板之间进行 互连。
2. 根据权利要求 1所述的基于柔性基板封装的屏蔽结构，其特征在于， 所述元器件包括至少一个棵芯片、 无源元件或者封装后的芯片， 所述封装引 脚为球栅阵列的焊球、 引脚阵列的针状插脚或者平面栅格阵列的金属触点。
3. 根据权利要求 2所述的基于柔性基板封装的屏蔽结构，其特征在于， 所述元器件为棵芯片时，所述棵芯片和柔性基板之间采用倒装焊的形式进行 互连， 所述棵芯片通过多个倒装焊凸点固定在柔性基板上， 所述倒装焊凸点 的周围填充有底部填充胶； 或者所述棵芯片和柔性基板之间采用引线键合的 形式进行互连， 所述棵芯片通过粘结剂固定在柔性基板上， 所述芯片通过引 线键合线和柔性基板之间电连接。
4. 根据权利要求 2所述的基于柔性基板封装的屏蔽结构，其特征在于， 所述元器件为无源元件或者封装后的芯片时， 所述无源元件或者封装后的芯 片采用表面贴装的形式与柔性基板互联。
5. 根据权利要求 1所述的基于柔性基板封装的屏蔽结构，其特征在于， 所述带有屏蔽层的柔性基板包覆元器件的方式为单层包覆， 该单层包覆结构 是通过将至少一个元器件设置于柔性基板上，再将柔性基板折叠后使柔性基 所述元器件为多个时， 多个元器件上下堆叠在一起后设置于柔性基板上， 或 者多个元器件左右平铺依次设置在柔性基板上。
7. 根据权利要求 1所述的基于柔性基板封装的屏蔽结构，其特征在于， 所述带有屏蔽层的柔性基板包覆元器件的方式为多层包覆， 该多层包覆结构 是通过将多个元器件设置于柔性基板上，再将柔性基板折叠多次后使柔性基 板形成多层结构并将元器件包覆在内而形成的。
8. 根据权利要求 7所述的基于柔性基板封装的屏蔽结构，其特征在于， 所述每层结构内设有至少一个元器件， 当设有多个元器件时， 多个元器件上 下堆叠在一起后设置于柔性基板上，或者多个元器件左右平铺依次设置在柔 性基板上。
9. 根据权利要求 1所述的基于柔性基板封装的屏蔽结构，其特征在于， 所述屏蔽层为金属薄膜或者常规屏蔽胶或者含铁、 钴、 镍或者合金颗粒的特 殊屏蔽胶。
10.—种基于柔性基板封装的屏蔽结构的制作工艺， 其特征在于， 包括 以下步骤：
步骤一： 加工柔性基板， 并在柔性基板上制作屏蔽层；
步骤二： 将柔性基板包覆在元器件上， 并将元器件和柔性基板之间进行 互连；
当所述元器件为棵芯片时，且所述棵芯片和柔性基板之间采用倒装焊的 形式进行互连时，采用回流焊工艺将棵芯片通过倒装焊凸点固定在柔性基板 上， 并在所述倒装焊凸点的周围填充底部填充胶以保护倒装焊凸点；
当所述元器件为棵芯片时，且所述棵芯片和柔性基板之间采用引线键合 的形式进行互连时， 使用粘结剂将棵芯片贴合于柔性基板上， 采用引线键合 工艺将引线键合线连接在棵芯片和柔性基板之间； 装好的芯片采用表面贴装的方式与柔性基板互连时， 采用回流焊工艺将无源 元件或者封装好的芯片固定在柔性基板上；
步骤三： 将柔性基板折叠， 使柔性基板包覆元器件， 将灌封胶填充于柔 性基板和元器件之间， 起到固定柔性基板成型和保护元器件的作用；
步骤四： 将封装引脚固定在带有屏蔽层的柔性基板上， 使柔性基板通过 封装引脚和印制电路板之间进行互连， 所述封装引脚为球栅阵列的焊球、 引 脚阵列的针状插脚或者平面栅格阵列的金属触点。
PCT/CN2012/071127 2011-07-01 2012-02-14 一种基于柔性基板封装的屏蔽结构及其制作工艺 WO2013004083A1 (zh)

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