WO2013001832A1 - Dispositif de formation de motifs et procédé de fabrication de panneau électroluminescent organique utilisant celui-ci - Google Patents

Dispositif de formation de motifs et procédé de fabrication de panneau électroluminescent organique utilisant celui-ci Download PDF

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Publication number
WO2013001832A1
WO2013001832A1 PCT/JP2012/004229 JP2012004229W WO2013001832A1 WO 2013001832 A1 WO2013001832 A1 WO 2013001832A1 JP 2012004229 W JP2012004229 W JP 2012004229W WO 2013001832 A1 WO2013001832 A1 WO 2013001832A1
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WO
WIPO (PCT)
Prior art keywords
substrate
tape
ink
patterning apparatus
wiping
Prior art date
Application number
PCT/JP2012/004229
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English (en)
Japanese (ja)
Inventor
敬史 川口
山本　稔
義和 葛岡
西森　泰輔
井出　伸弘
展幸 宮川
隆雄 宮井
吉田　和司
Original Assignee
パナソニック株式会社
タツモ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社, タツモ株式会社 filed Critical パナソニック株式会社
Priority to KR1020137033821A priority Critical patent/KR20140015559A/ko
Priority to CN201280030189.8A priority patent/CN103609200A/zh
Publication of WO2013001832A1 publication Critical patent/WO2013001832A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing

Definitions

  • the present invention relates to a patterning apparatus for patterning an organic material on a substrate and a method for manufacturing an organic EL panel using the same.
  • an electroluminescence (EL) element In an electroluminescence (EL) element, a light emitting layer sandwiched between an anode and a cathode is formed on a transparent substrate, and when a voltage is applied between the electrodes, electrons and holes injected into the light emitting layer as carriers. It emits light by excitons generated by recombination of.
  • EL elements are roughly classified into an organic EL element using an organic substance as a fluorescent material of a light emitting layer and an inorganic EL element using an inorganic substance.
  • the organic EL element can emit light with high luminance at a low voltage, and various emission colors can be obtained depending on the type of fluorescent material.
  • various types of organic EL elements can be easily manufactured as a flat light-emitting panel. Used as a display device or a backlight. Furthermore, in recent years, a device corresponding to high luminance has been realized and attention has been paid to using it for a lighting fixture.
  • FIG. 10 shows a cross-sectional configuration of a general organic EL panel.
  • a light-transmitting anode layer 103 is provided on a light-transmitting substrate 102, and a hole injection layer 141, a hole transport layer 142, and a light emitting layer 143 are formed on the anode layer 103.
  • An organic layer 104 is provided.
  • a cathode layer 105 having light reflectivity is provided on the organic layer 104.
  • the layers constituting these organic EL panels 101 are generally formed by a film forming method such as vacuum deposition.
  • the hole transport layer 142 is formed by dispersing a low molecular material in a solvent. It can be formed by applying a solution (ink).
  • the coating does not require large-scale equipment as compared with vapor deposition and the like, so the manufacturing cost of the organic EL panel can be reduced, and the processing time is short. Therefore, the coating is excellent in productivity and suitable for mass production.
  • an electrode lead portion for electrical connection with an external drive circuit is formed in the peripheral portion of the substrate 102, and the hole transport layer 142 is formed in this lead portion. When the solution that constitutes is applied, good electrical connection may not be obtained.
  • an apparatus when forming the hole transport layer 142 or the like by coating, an apparatus is known that patterns the coating layer by covering the substrate 102 with a mask in advance so that the solution is not applied to a predetermined location (for example, Patent Document 1). Further, an apparatus is known in which a solution at a predetermined location is wiped with a wiping member made of a porous material such as a sponge member after the solution is applied (see, for example, Patent Document 2).
  • the present invention solves the above problems, and can efficiently form a coating layer having a desired shape, and can provide a highly reliable product with less substrate contamination and high productivity.
  • Another object of the present invention is to provide a method for producing an organic EL panel using the same.
  • the present invention provides a patterning apparatus for patterning ink containing an organic material on a substrate, comprising a wiping mechanism for removing ink at a predetermined location on the substrate, and the wiping mechanism Has a tape containing a solvent, a rotary reel that winds the tape, and a tape head that abuts the tape on the substrate, and the tape head contacts the substrate with the tape.
  • the ink on the substrate is attached to the tape by rotating the reel while being in contact with the tape.
  • the reel is rotated so that the tape is wound in a direction opposite to a relative traveling direction of the tape head with respect to a stage on which the substrate is set.
  • the wiping mechanism has a suction mechanism for sucking ink adhering to the tape.
  • the wiping mechanism has a replenishing mechanism for supplying a solvent to the tape.
  • the patterning apparatus preferably further includes a heating mechanism for heating the substrate.
  • the patterning apparatus further includes a transport mechanism that transports the substrate with the coating surface of the substrate facing downward.
  • the wiping mechanism removes ink on the substrate with the coating surface facing downward.
  • the patterning apparatus further includes a detection mechanism for detecting photoluminescence emission of the ink by irradiating the substrate from which ink has been removed by the wiping mechanism with ultraviolet rays.
  • the patterning apparatus further includes a measurement mechanism that measures contact resistance of the substrate surface from which ink has been removed by the wiping mechanism.
  • the tape head is configured so that a contact area between the tape and the substrate is variable.
  • the tape head is formed so that a surface in contact with the tape has a crown shape.
  • the patterning apparatus further includes a laser heating mechanism that irradiates a laser onto the substrate from which ink has been removed by the wiping mechanism and heats the ink remaining on the substrate.
  • a monitor mechanism that measures a pressurization amount when the tape head comes into contact with the substrate, and the substrate and the tape head so that the pressurization amount measured by the monitor mechanism is constant. It is preferable to further include an adjustment mechanism that adjusts the distance between them.
  • the patterning apparatus is preferably used in a method for producing an organic EL panel including a step of forming a hole transport layer on a substrate having a transparent electrode.
  • the wiping surface of the tape is always a new surface, the ink can be efficiently removed from the substrate, A coating layer having a desired shape can be efficiently formed on the substrate. Further, by sequentially supplying the tape, deterioration such as tape scraping is less likely to occur, so that contamination of the substrate is reduced and the reliability of the product can be improved. Moreover, since ink can be wiped off continuously, productivity can be improved.
  • FIG. 1 is a perspective view of a patterning apparatus according to a first embodiment of the present invention.
  • the sectional side view which shows the connection location of the wiping mechanism and replenishment mechanism in the apparatus.
  • the perspective view which looked at the patterning apparatus which concerns on the 2nd Embodiment of this invention from the downward direction.
  • the perspective view of the patterning apparatus which concerns on the 3rd Embodiment of this invention.
  • the perspective view of the patterning apparatus which concerns on the modification of the said embodiment.
  • the perspective view of the wiping mechanism used for the patterning apparatus which concerns on the 4th Embodiment of this invention.
  • (A) (b) is a perspective view of the tape head used for the patterning apparatus which concerns on the modification of the said embodiment, respectively.
  • the perspective view of the patterning apparatus which concerns on the 5th Embodiment of this invention.
  • the perspective view of the patterning apparatus which concerns on the 6th Embodiment of this invention.
  • the side sectional view showing the composition of a general organic electro
  • the patterning apparatus 1 is configured to pattern a functional layer constituting an organic EL panel composed of an organic electroluminescence element into a desired shape with an ink containing an organic material on a substrate.
  • an ink 30 is applied to the entire surface of the substrate 20 conveyed by the conveyance mechanism 2 by the application mechanism 3, and the ink 30 at a predetermined location on the substrate 20 to which the ink 30 is applied.
  • the wiping mechanism 4 is removed.
  • the wiping mechanism 4 can be used alone. In this case, the wiping mechanism 4 itself corresponds to the patterning device 1.
  • the patterning apparatus 1 may be constructed as a system that performs a series of patterning steps by combining the wiping mechanism 4 with the transport mechanism 2, the coating mechanism 3, and various mechanisms described below.
  • the transport mechanism 2 is configured such that a transport base 21 for transporting the substrate 20 is slidable along a rail (not shown) provided on a base (not shown) of the patterning apparatus 1.
  • the transport table 21 is provided with a drive mechanism (not shown). This drive mechanism can arbitrarily adjust the distance and positional relationship between the substrate 20 and the coating mechanism 3 and the wiping mechanism 4 by moving the transport table 21 on which the substrate 20 is placed three-dimensionally. it can.
  • a rigid transparent glass plate such as soda glass or non-alkali glass is used, but is not limited thereto.
  • a flexible transparent plastic plate such as polycarbonate or polyethylene terephthalate, a metal film made of Al, copper (Cu), stainless steel, or the like can be used.
  • a transparent electrode and a hole injection layer 141 to be the anode layer 103 are formed on the substrate 20 in advance.
  • the application mechanism 3 serves as a flow path for the ink 30, a slit nozzle 31 that ejects the ink 30, an ink tank 32 that stores the ink 30, a pump 33 that supplies the ink 30 in the ink tank 32 to the slit nozzle 31, and the ink 30. And a pipe 34.
  • the ink tank 32, the pump 33, and the pipe 34 are each sealed so that the ink 30 can be fed from the ink tank 32 to the slit nozzle 31 without touching the outside air.
  • the coating mechanism 3 may be configured such that the relative distance between the slit nozzle 31 and the substrate 20 can be made variable by an elevating member (not shown) that moves the slit nozzle 31 up and down.
  • the wiping mechanism 4 includes a tape 41 containing a solvent 40, a rotary reel 42 that winds up the tape 41, and a tape head 43 that makes the tape 41 abut on the substrate 20. That is, the patterning apparatus 1 according to the present embodiment attaches the ink 30 on the substrate 20 to the tape 41 by rotating the reel 42 while the tape 41 is brought into contact with the substrate 20 with the tape head 43. Further, the wiping mechanism 4 holds a reel drive unit 44 that rotates the reel 42, a holding member 45 that holds the reel drive unit 44, and a tape 41 that is locked to the tape head 43 and holds the tape head 43. A head unit 46. Further, the wiping mechanism 4 includes a replenishing mechanism 6 that supplies the solvent 40 to the tape 41 and a suction mechanism 5 that sucks dust and the like generated during wiping.
  • the slit nozzle 31 of the coating mechanism 3 includes a discharge port 31a formed in a slit shape, and a box-shaped nozzle storage unit 31b for storing a predetermined amount of liquid ink 30 above the discharge port 31a.
  • the width of the discharge port 31 a is set so as to match the width of the substrate 20.
  • An injection port 31c for the ink 30 is provided on the side of the nozzle storage unit 31b.
  • an outflow groove 31d for allowing the ink 30 to flow out to the discharge port 31a is formed in a slit shape having substantially the same shape as the discharge port 31a.
  • the outer shape from the nozzle storage portion 31b to the discharge port 31a is configured as an inclined surface that tapers toward the discharge port 31a.
  • the slit nozzle 31 when the ink 30 in the ink tank 32 is supplied from the injection port 31 c through the pipe 34 by the pressure of the pump 33, the ink 30 is filled in the nozzle storage portion 31 b. Is done.
  • the ink 30 continues to be supplied at a constant pressure, the ink 30 is discharged from the discharge port 31a through the outflow groove 31d.
  • the slit nozzle 31 can discharge the ink 30 onto the substrate 20 in a uniform amount (thickness) along the longitudinal direction of the slit-shaped discharge port 31a.
  • the ink 30 is generated by mixing a functional material for realizing the function of the formed coating layer and a solvent for dispersing the functional material.
  • the coating can be used regardless of the molecular weight of the material as compared with vapor deposition or the like, and the functional material used for the ink 30 of the present embodiment uses various materials from low molecular materials to high molecular materials. be able to.
  • the polymer refers to a molecule having two or more repeating units, and includes oligomers and the like.
  • a part or all of the liquid ink 30 applied on the substrate 20 is solidified by volatilization of the solvent and the like.
  • materials used for the ink 30 in the case where the coating layer to be manufactured is a hole injection / transport layer known as one of functional layers constituting the organic EL panel are shown below.
  • the low molecular weight material include ⁇ -NPD (4,4-bis [N- (2-naphthyl) -N-phenyl-amino] biphenyl, spiro- NPB (N, N′-bis [naphthalen-1-yl).
  • Inductors having an azatriphenylene skeleton represented by HAT-CN6 (1,4,5,8,9,12-hexaazatriphenylene-hexacarbonitrile) described in the publication Conductors, etc. can be used, and polymer materials include P3HT (poly-3-hexylthiophene), PEDOT / PSS (poly3,4-ethylenedioxythiophene / polystyrene sulfonic acid), MEH-PPV ( Poly- [2methoxy-5- (2-ethyl-hexyloxy) -1,4-phenylene-vinylene)], polyaniline, polypyrrole, PVK (polyvinylcarbazole), etc.
  • P3HT poly-3-hexylthiophene
  • PEDOT / PSS poly3,4-ethylenedioxythiophene / polystyrene sulfonic acid
  • MEH-PPV Poly- [2methoxy-5- (2-ethy
  • an electron accepting compound may be doped, although there is no particular limitation on the electron accepting compound, but ferric chloride, ferric bromide, which are described in JP-A-2003-272860, Ferric iodide, aluminum chloride, aluminum bromide, aluminum iodide, gallium chloride, gallium bromide, gallium iodide Inorganic compounds such as lithium, indium chloride, indium bromide, indium iodide, antimony pentachloride, arsenic pentafluoride, boron trifluoride, DDQ (dicyano-dichloroquinone), TNF (trinitrofluorenone), TCNQ (tetracyano) Quinodimethane), organic compounds such as F4-TCNQ (tetrafluoro-tetracyanoquinodimethane), etc.
  • examples of the solvent include water, IPA (isopropyl alcohol), butyl acetate, cyclohexanol, ethylene glycol, propylene.
  • Glycol, chloroform, chlorobenzene, dichloroethane, DMF (N-N dimethylformamide), DMSO (dimethyl sulfoxide), etc. can be used, and a mixed solvent in which the viscosity and surface energy are changed by appropriately mixing them can be used. Also Kill.
  • the tape 41 for example, a low dusting cloth tape woven from nylon or the like is used, and the thickness thereof is preferably 0.2 to 0.5 mm so that the solvent 40 can be impregnated.
  • the width of the tape 41 depends on the size and shape of the coating film formed on the substrate 20 or the size of the tape head 43, but is preferably 5 to 10 mm, for example. If the width of the tape 41 is too small, it is difficult to attach the ink 30, and if the width of the tape 41 is too large, it is difficult to remove the fine ink 30 on the substrate 20.
  • the reel 42 includes a feed reel 42 a around which a new tape 41 to which the ink 30 is not attached is wound, and a return reel 42 b that collects the used tape 41.
  • An auxiliary reel 42c is provided between the feed reel 42a and the tape head 43 and between the tape head 43 and the return reel 42b.
  • the moving speed of the tape 41 is set according to the moving speed of the substrate 20 by the transport mechanism 2 and the amount (thickness) of the ink 30 applied on the substrate 20.
  • the reel 42 increases the moving speed of the tape 41 when the moving speed of the substrate 20 is fast and when the amount of application onto the substrate 20 is large.
  • the moving speed of the tape 41 is preferably 10 to 100 mm / s.
  • the reel 42 rotates so that the tape 41 is wound up in the direction opposite to the relative traveling direction of the tape head 43 with respect to the stage (carrier 21) on which the substrate 20 is set. By doing so, the shear stress on the ink 30 on the substrate 20 increases, and the ink 30 can be wiped off efficiently.
  • the suction mechanism 5 is a vacuum pump and is connected to the head unit 46 via a pipe 51.
  • the tip of the pipe 51 is connected to the vicinity of the tape 41 sent after passing through the tape head 43 (not shown). According to this configuration, since dust or the like generated during wiping is sucked by the suction mechanism 5, it is possible to prevent the substrate 20 from being contaminated by dust or the like. Further, even when the amount of the ink 30 attached to the tape 41 is large, a part of the ink 30 is sucked from the tape 41 to reduce the amount of the ink 30 attached to the tape 41 sent to the return reel 42b. Can do. Therefore, it is possible to prevent the ink 30 from being squeezed out from the tape 41 wound around the return reel 42b and contaminating the substrate 20.
  • the replenishment mechanism 6 includes a solvent bottle 61 that stores the solvent 40, a pump 62 that supplies the solvent 40 in the solvent bottle 61 to the tape 41, and a pipe 63 that serves as a flow path for the solvent 40.
  • the solvent 40 an appropriate solvent is used depending on the type and composition of the ink 30. If the ink 30 is an aqueous solution, water or ethanol is used. If the ink 30 is an organic solution, organic solvents such as methanol and isopropyl alcohol are used. A solvent is used.
  • the distal end portion of the pipe 63 is connected to the vicinity of the tape 41 before being sent from the feed reel 42 a (see FIG. 1) to the tape head 43 in the head unit 46.
  • the supply amount of the solvent 40 varies depending on the moving speed of the tape 41, but is preferably 0.01 to 0.1 cc / min, for example. According to this configuration, the solvent 40 contained in the tape 41 can be appropriately adjusted, so that the ink 30 can be effectively adhered to the tape 41. Further, for example, even when the ink 30 applied on the substrate 20 by the application mechanism 3 is dry, the ink 30 can be attached to the tape 41 while the solvent 40 dissolves the ink 30 at the corresponding location. The suction mechanism 5 sucks not only the ink 30 but also the solvent 40 contained in the tape 41.
  • the substrate 20 on which the transparent electrode is formed is transported by the transport mechanism 2 directly below the slit nozzle 31 of the coating mechanism 3.
  • the ink 30 is supplied from the ink tank 32 to the slit nozzle 31, and the ink 30 is applied to the substrate 20.
  • the transport mechanism 2 moves the substrate 20 at a constant speed. Thereby, the ink 30 is uniformly applied over the entire top surface of the substrate 20.
  • the transport mechanism 2 transports the substrate 20 to a position where it contacts the tape 41 of the tape head 43. At this time, the contact pressure between the substrate 20 and the tape 41 is preferably about 10 MPa.
  • the reel drive unit 44 rotates the reel 42 so that the tape 41 moves in the direction opposite to the traveling direction of the substrate 20.
  • a predetermined amount of the solvent 40 is automatically supplied to the tape 41 from the pump 62.
  • the transport mechanism 2 further moves the substrate 20 in a state where the tape 41 is brought into contact with the substrate 20 by the tape head 43.
  • the reel driving unit 44 rotates the reel 42 and sequentially supplies new tapes 41 to the tape head 43.
  • the ink 30 adheres to the tape 41, and the ink 30 at a predetermined location on the substrate 20 can be efficiently removed.
  • the ink 30 adhering to the tape 41 is sucked and removed by the suction mechanism 5 in the head unit 46.
  • the ink 30 is applied on the entire surface of the substrate 20 using the coating mechanism 3, the ink 30 at a predetermined location is removed using the wiping mechanism 4.
  • a coating layer having a predetermined shape can be efficiently formed.
  • the patterning apparatus 1 preferably has a heating mechanism (not shown) for heating the substrate 20.
  • the heating mechanism include a configuration in which a sheathed heater is built in the transport table 21 or a heater that radiates heat rays such as infrared rays is provided on the upper surface of the substrate 20.
  • this heating mechanism for example, by heating the substrate 20 from which the ink 30 has been removed by the tape 41, even when the solvent 40 contained in the tape 41 adheres to the substrate 20, the solvent 40 can be quickly evaporated. Can do. By so doing, the solvent 40 does not erode the ink 30 (application layer) that is not the object of removal, and the boundary line between the application layer and the other portions can be accurately controlled.
  • the wiping surface of the tape 41 is always a new surface.
  • Ink 30 can be efficiently removed, and a coating layer having a desired shape can be obtained. Further, by sequentially supplying the tape 41, deterioration such as scraping of the tape 41 is less likely to occur, so that contamination of the substrate 20 due to such shavings can be suppressed, and a highly reliable product can be obtained.
  • the ink 30 can be removed continuously over a long period of time, and productivity can be improved.
  • the length of the tape 41 can be designed freely, for example, in mass production, it is sufficient to ensure a sufficient length according to the maintenance interval, and the degree of freedom of the production schedule can be increased. Further, if this patterning apparatus 1 is used for manufacturing an organic EL panel, for example, the hole transport layer 142 shown in FIG. 10 can be produced efficiently, and contamination of the substrate 20 or the like is caused in this step. Since the number of the organic EL panels is reduced, it is possible to obtain an organic EL panel with less defects such as short circuits.
  • the patterning apparatus 1 of this embodiment includes a transport mechanism 2 that transports the substrate 20 with the coating surface of the substrate 20 facing down, and the coating mechanism 3 applies the ink 30 to the substrate 20 with the coating surface facing down. Is done.
  • the wiping mechanism 4 is provided upside down with respect to the first embodiment so as to remove the ink 30 on the substrate 20 with the application surface facing downward.
  • the application mechanism 3 is provided upside down from the first embodiment so that the slit nozzle 31 faces upward.
  • the transport table 21 is provided with a holding mechanism (not shown) that holds the substrate 20 downward.
  • the ink 30 is applied to the substrate 20 with the application surface of the substrate 20 facing downward, dust or the like can be prevented from being mixed on the substrate 20 during application.
  • the wipes are less likely to fall on the substrate 20, and the production yield can be improved.
  • the solvent 40 used for wiping is less likely to fall on the substrate 20, so that the contamination of the substrate 20 can be more reliably suppressed, and the reliability can be improved. High product can be obtained.
  • the patterning apparatus 1 of this embodiment further includes a detection mechanism 71 that detects the photoluminescence emission of the ink 30 by irradiating the substrate 20 from which the ink 30 has been removed by the wiping mechanism 4 with ultraviolet rays.
  • a detection mechanism 71 a combination of an ultraviolet light source 71a and a CCD camera 71b that captures the surface of the substrate 20 is used.
  • the detection mechanism 71 is attached to the head unit 46 of the wiping mechanism 4 and continuously irradiates the substrate 20 with ultraviolet rays by wiping off the wiped ink 30, and photoluminescence emission of the ink 30 on the substrate 20. Is detected.
  • the substrate 20 after wiping is irradiated with ultraviolet rays from the ultraviolet light source 71a, and the surface of the substrate 20 is photographed by the CCD camera 71b. Compare Then, by checking whether or not the ink 30 remains in the wiped portion, it is possible to detect a defective product in which the ink 30 remains, and eliminate such defective product in-line. be able to. In-line removal of defective products can suppress the flow of defective products in subsequent manufacturing processes, so that waste of materials used in subsequent processes can be reduced, and productivity can be improved. .
  • the moving speed (wiping speed) of the tape 41 and the amount of the solvent 40 supplied to the tape 41 are fed back so that the ink 30 on the substrate 20 can be removed reliably. Can be controlled. Instead of using the CCD camera 71b, the operator may visually check the photoluminescence emission to eliminate defective products.
  • ultraviolet rays are irradiated and whether or not the ink 30 remains is detected based on the presence or absence of photoluminescence emission, so that it is performed without directly contacting a sensor or the like with the substrate 20.
  • Can do Since non-contact detection does not require the substrate 20 to be removed from the manufacturing process, for example, when the above-described wiping process of the ink 30 is performed continuously with a process performed in a vacuum or a nitrogen atmosphere, those atmospheres are changed. Inspection can be performed without breaking. Therefore, since it is not necessary to stop a series of processes, the productivity is good, and contamination by particles and moisture or oxygen at the time of inspection can be suppressed.
  • the patterning apparatus 1 of this embodiment includes a measurement mechanism 72 that measures the contact resistance of the surface of the substrate 20 from which the ink 30 has been removed by the wiping mechanism 4.
  • the measurement mechanism 72 is attached to the head unit 46 of the wiping mechanism 4 in the same manner as the detection mechanism 71.
  • the wiping mechanism 4 has a tape head 43 configured to change the contact area between the tape 41 and the substrate 20.
  • the head unit 46 in the above embodiment is taken out from the reel driving unit 44, and a head unit 46 'in which a tape head 43' that is elongated in the moving direction of the tape 41 is mounted is attached. That is, the contact area between the tape 41 and the substrate 20 can be made variable by appropriately switching the head units 46 and 46 ′ having different sizes of the tape heads 43 and 43 ′.
  • a plurality of tape heads are housed in the head unit 46, and the interval between these is variable in the moving direction of the tape 41, thereby reducing the contact area between the tape 41 and the substrate 20. It may be configured to be able to.
  • the removal efficiency can be further improved.
  • the tape head 43 is formed so that the surface in contact with the tape 41 has a crown shape, as shown in FIG. If this tape head 43 is used, the tape 41 can be brought into contact with the substrate 20 in a narrow area in the width direction of the tape 41, so that the ink 30 on the substrate 20 can be removed linearly, and the finer A coating layer can be formed. Further, since the pressure with which the tape 41 presses the substrate 20 is partially concentrated, the boundary between the portion where the ink 30 is removed and the portion where the ink 30 is not removed is divided, that is, the portion where the ink 30 is not removed, that is, the application The finish of the edge of the layer can be improved. Further, as shown in FIG. 7B, a wide tape head 43 can be used according to the size of the portion from which the ink 30 is removed.
  • the patterning apparatus 1 of this embodiment further includes a laser heating mechanism 8 that irradiates a laser onto the substrate 20 from which the ink 30 has been removed by the wiping mechanism 4 and heats the ink 30 remaining on the substrate 20.
  • the measurement mechanism 72 is attached to the head unit 46 of the wiping mechanism 4 in the same manner as the detection mechanism 71 or the measurement mechanism 72 in the third embodiment.
  • the evaporation mechanism 8 is preferably used in combination with the detection mechanism 71 and the like, and is configured to selectively irradiate a laser to the portion when the ink 30 remains on the substrate 20.
  • the patterning apparatus 1 of this embodiment includes a monitor mechanism (not shown) that measures the amount of pressure applied when the tape head 43 abuts against the substrate 20. Further, the patterning apparatus 1 includes an adjustment mechanism 22 that adjusts the distance between the substrate 20 and the tape head 43 so that the amount of pressurization measured by the monitor mechanism is constant.
  • a drive member that raises and lowers the transport table 21 on which the substrate 20 is placed is shown as the adjustment mechanism 22.
  • the adjusting mechanism 22 may move the tape head 43 up and down to the substrate 20 side.
  • the reel driving unit 44 adjusts the moving speed of the tape 41 by appropriately controlling the rotational speeds of the reels 42a and 42b so that the tape 41 is not loosened or excessively pulled in the tape head 43.
  • the pressure between the substrate 20 and the tape 41 can be feedback-controlled at any time while monitoring the amount of pressure in the removal process. Therefore, for example, even if the substrate 20 itself or the transparent electrode formed thereon has irregularities or inclinations, the ink 30 can be wiped with a certain degree of accuracy, and the yield can be improved.
  • the transport mechanism 2 and the coating mechanism 3 described above are driven and controlled by a control device (not shown) or the like together with the wiping mechanism 4 and operate based on predetermined software.
  • the patterning apparatus 1 includes an operation unit (not shown) for inputting the type of ink 30, the size and number of coating films to be produced, and the like.
  • the software is constructed so as to optimize driving of not only the wiping mechanism 4 but also the transport mechanism 2 and the coating mechanism 3 in accordance with the operation information input by the operation unit.
  • the step of forming the hole transport layer 142 of the organic EL panel has been exemplified.
  • the layer formed by coating is not limited to the hole transport layer 142, and the light emitting layer 143 or The present invention can also be applied to the production of an electron transport layer (not shown). Further, the present invention is not limited to the organic EL panel, and can be applied to the manufacture of a device having a plurality of functional layers such as an organic solar cell.

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  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Apparatus (AREA)

Abstract

L'objet de la présente invention est de pouvoir retirer l'encre de façon efficace à partir d'un substrat, supprimer la contamination du substrat ainsi qu'améliorer la productivité d'un dispositif de formation de motifs. La présente invention a trait à un dispositif de formation de motifs (1) qui est équipé d'un mécanisme d'effacement (4) qui supprime l'encre (30) à des emplacements prescrits sur un substrat (20). Ce mécanisme d'effacement (4) est doté d'un ruban (41) qui est conçu de manière à contenir un solvant (40), d'une bobine rotative (42) qui enroule le ruban (41), et d'une tête de ruban (43) qui permet au ruban (41) de venir en contact avec le substrat (20). Le ruban (41) vient en contact avec le substrat (20) grâce à la tête de ruban (43), et l'encre (30) sur le substrat (20) colle au ruban (41). Lorsque l'encre (30) est effacée par le ruban (41) par le biais de cet agencement, la surface d'effacement du ruban (41) est toujours une nouvelle surface ; par conséquent, l'encre (30) est supprimée de façon efficace et le ruban (41) ne se dégrade pas facilement. De plus, les raclures ne se produisent que très difficilement y compris en cas d'utilisation sur une longue durée ; par conséquent, il est possible d'éviter la contamination du substrat (20) et d'améliorer la productivité.
PCT/JP2012/004229 2011-06-29 2012-06-29 Dispositif de formation de motifs et procédé de fabrication de panneau électroluminescent organique utilisant celui-ci WO2013001832A1 (fr)

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KR1020137033821A KR20140015559A (ko) 2011-06-29 2012-06-29 패터닝 장치 및 이것을 사용한 유기 el 패널의 제조 방법
CN201280030189.8A CN103609200A (zh) 2011-06-29 2012-06-29 图案形成装置以及使用其的有机el面板的制造方法

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JP2011144353A JP2013012395A (ja) 2011-06-29 2011-06-29 パターニング装置及びそれを用いた有機ｅｌパネルの製造方法
JP2011-144353 2011-06-29

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WO (1) WO2013001832A1 (fr)

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JP6920849B2 (ja) * 2017-03-27 2021-08-18 株式会社荏原製作所 基板処理方法および装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378666A (en) * 1976-12-21 1978-07-12 Odensha Kk Paint wiping device
JP2006212501A (ja) * 2005-02-02 2006-08-17 Seiko Epson Corp 液滴吐出装置、液滴吐出装置におけるワイピング方法、電気光学装置の製造方法、電気光学装置および電子機器
WO2010004888A1 (fr) * 2008-07-08 2010-01-14 コニカミノルタホールディングス株式会社 Procédé de fabrication d’éléments électroluminescents organiques
JP2011040336A (ja) * 2009-08-18 2011-02-24 Konica Minolta Holdings Inc 有機エレクトロニクスパネルの製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5141342B2 (ja) * 2008-04-01 2013-02-13 日本放送協会 保護膜及び保護膜の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5378666A (en) * 1976-12-21 1978-07-12 Odensha Kk Paint wiping device
JP2006212501A (ja) * 2005-02-02 2006-08-17 Seiko Epson Corp 液滴吐出装置、液滴吐出装置におけるワイピング方法、電気光学装置の製造方法、電気光学装置および電子機器
WO2010004888A1 (fr) * 2008-07-08 2010-01-14 コニカミノルタホールディングス株式会社 Procédé de fabrication d’éléments électroluminescents organiques
JP2011040336A (ja) * 2009-08-18 2011-02-24 Konica Minolta Holdings Inc 有機エレクトロニクスパネルの製造方法

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