WO2013001726A1 - Préimprégné, plaque stratifiée, emballage de semi-conducteur et procédé de fabrication d'une plaque stratifiée - Google Patents

Préimprégné, plaque stratifiée, emballage de semi-conducteur et procédé de fabrication d'une plaque stratifiée Download PDF

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WO2013001726A1
WO2013001726A1 PCT/JP2012/003671 JP2012003671W WO2013001726A1 WO 2013001726 A1 WO2013001726 A1 WO 2013001726A1 JP 2012003671 W JP2012003671 W JP 2012003671W WO 2013001726 A1 WO2013001726 A1 WO 2013001726A1
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prepreg
resin
base material
epoxy resin
fiber base
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PCT/JP2012/003671
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English (en)
Japanese (ja)
Inventor
光男 武谷
孝幸 馬塲
飛澤　晃彦
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住友ベークライト株式会社
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Priority to KR1020147001652A priority Critical patent/KR101574907B1/ko
Priority to CN201280032172.6A priority patent/CN103649185B/zh
Priority to JP2013522710A priority patent/JP5696786B2/ja
Publication of WO2013001726A1 publication Critical patent/WO2013001726A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers

Definitions

  • the present invention relates to a prepreg, a laminate, a semiconductor package, and a method for manufacturing the laminate.
  • Patent Document 3 Japanese Patent Application Laid-Open No. 2004-149577
  • the air permeability is set to 2 to 4 cm 3 / cm 2 / sec by applying at least one of flattening processing and fiber opening processing to a glass cloth.
  • a prepreg in which a base material is impregnated with a thermosetting resin composition and the thermosetting resin composition is in a B-stage state.
  • the laminate using such a prepreg improves the impregnation property of the thermosetting resin composition into the fiber substrate, the strength of the laminate is made uniform. Therefore, the inner wall of the hole formed by the drilling process can be formed smoothly, and the occurrence of ion migration can be suppressed even when the hole density is increased and the distance between the walls of the through hole is reduced. It is described. In addition, it is described that, by the fiber opening treatment, the glass fiber yarn spreads spatially, the impregnation into the glass fiber is improved, and voids are reduced, so that the occurrence of migration can be suppressed.
  • JP 2004-322364 A Japanese Patent Laid-Open No. 6-316643 Japanese Patent Laid-Open No. 2004-149577
  • the fiber base material when the above flattening process or fiber opening process is performed on a fiber base material such as a glass cloth, the fiber base material may become fuzzy.
  • fluff is generated on the fiber base material, the strength of the fiber base material is reduced, or the resin puddle is generated at the protruding portion of the fluff, and the surface of the prepreg is roughened.
  • an object of the present invention is to provide a prepreg having a good yield and a laminate having excellent insulation reliability.
  • the present inventors have intensively studied the mechanism of ion migration. As a result, it was found that when the nitrogen content in the prepreg is reduced to 0.10% by mass or less, the ion migration resistance is improved.
  • the nitrogen content in the prepreg is 0.10% by mass or less
  • a prepreg in which the air permeability of the fiber base material is 3.0 cm 3 / cm 2 / sec or more and 30.0 cm 3 / cm 2 / sec or less is provided.
  • the ion migration resistance of the laminate can be improved even when a fiber base material having the above air permeability is used. it can.
  • the fiber base material having the above air permeability has suppressed the occurrence of fuzz and can improve the yield of the prepreg.
  • a laminate including the cured product of the prepreg is provided.
  • a semiconductor package in which a semiconductor element is mounted on a circuit board obtained by processing a circuit of the laminated plate.
  • the theoretical nitrogen content in the resin varnish is 0.50% by mass or less
  • a method for producing a laminated board wherein the fiber base has an air permeability of 3.0 cm 3 / cm 2 / sec or more and 30.0 cm 3 / cm 2 / sec or less.
  • a laminate having excellent insulation reliability can be obtained, and a prepreg having a good yield can be provided.
  • FIG. 1 is a cross-sectional view showing an example of the configuration of a prepreg in the present embodiment.
  • the prepreg 100 is obtained by impregnating the fiber substrate 101 with a resin composition P containing (A) an epoxy resin and (B) an epoxy resin curing agent.
  • the nitrogen content in the prepreg 100 is 0.10% by mass or less, preferably 0.08% by mass or less, and more preferably 0.05% by mass or less.
  • the nitrogen content in the prepreg 100 is not more than the above upper limit value, the ion migration resistance of the laminate can be improved. Therefore, special processing treatments such as flattening processing and fiber opening processing performed on the fiber base material in order to improve ion migration resistance can be suppressed. Therefore, the occurrence of fluffing of the fiber base material is suppressed, and the yield of the prepreg can be improved.
  • the reason why the ion migration resistance of the laminate is improved is not necessarily clear, but is presumed as follows. When the nitrogen content in the prepreg 100 is reduced, the moisture resistance of the prepreg 100 is improved.
  • the nitrogen content in the prepreg 100 can be generally measured by a known method.
  • the prepreg is combusted and decomposed by using an organic element analyzer, the generated gas is converted to N 2 , and heat conduction is performed. It can be measured by a degree detector.
  • the air permeability of the fiber base material 101 in the prepreg 100 is 3.0 cm 3 / cm 2 / sec or more, more preferably 3.5 cm 3 / cm 2 / sec or more, and particularly preferably 4.0 cm. 3 / cm 2 / sec or more. Since the prepreg 100 in this embodiment has excellent ion migration resistance, a fiber base material having an air permeability equal to or higher than the lower limit value can be used. In other words, it is possible to suppress special processing such as flattening or fiber opening performed on the fiber base material in order to improve the ion migration resistance.
  • the air permeability of the fiber base material 101 is 30.0 cm 3 / cm 2 / sec or less, more preferably 20.0 cm 3 / cm 2 / sec or less, and further preferably 15.0 cm 3 / cm 2. / Sec or less, particularly preferably 12.0 cm 3 / cm 2 / sec or less.
  • the air permeability of the fiber base material 101 is not more than the above upper limit value, the impregnation property of the resin composition into the fiber base material is improved, so that the strength of the laminate can be made uniform.
  • the inner wall of the hole formed by drilling can be formed smoothly, and the occurrence of ion migration can be suppressed even if the hole density is increased and the distance between the walls of the through hole is reduced.
  • the air permeability of the fiber base material 101 can be adjusted, for example, by processing such as flattening or fiber opening.
  • the air permeability can be measured according to JIS R3420 method (Fragile method).
  • the prepreg 100 in this embodiment is a fiber obtained by impregnating a fiber base material 101 with a resin composition P containing (A) an epoxy resin and (B) an epoxy resin curing agent and then semi-curing the fiber.
  • This is a sheet-like material including a base material 101 and resin layers 103 and 104.
  • a sheet-like material having such a structure is preferable because it is excellent in various properties such as dielectric properties, mechanical and electrical connection reliability under high temperature and high humidity, and suitable for manufacturing a laminated board for a circuit board.
  • the resin composition P impregnated into the fiber base material 101 is not particularly limited as long as it contains (A) an epoxy resin and (B) an epoxy resin curing agent, but it has a low linear expansion coefficient and a high elastic modulus. It is preferable that it has excellent thermal shock reliability.
  • the epoxy resin is a compound having one or more glycidyl groups in the molecule, and is a compound that forms a three-dimensional network structure and cures when the glycidyl group reacts by heating.
  • the epoxy resin preferably contains two or more glycidyl groups in one molecule, but this does not show sufficient cured product properties even if the glycidyl group is reacted with only one compound. Because.
  • Specific examples of the (A) epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, bisphenol M type epoxy resin, bisphenol P type epoxy resin, and bisphenol Z.
  • Bisphenol type epoxy resins such as epoxy resins or derivatives thereof, phenol novolac type epoxy resins, novolac type epoxy resins such as cresol novolac type epoxy resins, arylalkylene type epoxy resins such as biphenyl type epoxy resins and biphenyl aralkyl type epoxy resins, Naphthalene type epoxy resin, anthracene type epoxy resin, phenoxy type epoxy resin, dicyclopentadiene type epoxy resin, norbornene type epoxy resin, Adamantane type epoxy resins, such as epoxy resins and fluorene type epoxy resins. One of these can be used alone, or two or more can be used in combination.
  • the content of the epoxy resin is not particularly limited, but is preferably 15% by mass or more and 80% by mass or less of the entire resin composition P. More preferably, it is 25 mass% or more and 60 mass% or less.
  • a liquid epoxy resin such as a liquid bisphenol A type epoxy resin or a bisphenol F type epoxy resin because the impregnation property to the fiber base material 101 can be improved.
  • the content of the liquid epoxy resin is more preferably 3% by mass or more and 30% by mass or less of the entire resin composition P.
  • adhesion to the conductor can be improved.
  • (B) Although it does not specifically limit as an epoxy resin hardening
  • a phenolic curing agent as an epoxy resin curing agent is a compound having two or more phenolic hydroxyl groups in one molecule. In the case of a compound having one phenolic hydroxyl group in one molecule, since a crosslinked structure cannot be taken, the cured product characteristics deteriorate and cannot be used.
  • the phenolic curing agent include known or commonly used phenol novolak resins, alkylphenol novolak resins, bisphenol A novolak resins, dicyclopentadiene type phenol resins, zylock type phenol resins, terpene-modified phenol resins, and polyvinylphenols. Two or more types can be used in combination.
  • the compounding amount of the phenol curing agent is preferably such that (A) the equivalent ratio with the epoxy resin (phenolic hydroxyl group equivalent / epoxy group equivalent) is 0.1 or more and 1.0 or less. As a result, there remains no unreacted phenol curing agent, and the moisture absorption heat resistance is improved.
  • the resin composition P uses an epoxy resin and a cyanate resin in combination, the range of 0.2 to 0.5 is particularly preferable. This is because the phenol resin not only acts as a curing agent but also promotes curing of the cyanate group and the epoxy group.
  • Acid anhydrides as epoxy resin curing agents include, for example, phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, endomethylenetetrahydrophthalic anhydride, dodecenyl succinic acid An anhydride, maleic anhydride, etc. are mentioned.
  • dihydrazide compound as the epoxy resin curing agent examples include carboxylic acid dihydrazides such as adipic acid dihydrazide, dodecanoic acid dihydrazide, isophthalic acid dihydrazide, and p-oxybenzoic acid dihydrazide.
  • the (C) curing catalyst is a catalyst that has a function of promoting the curing reaction between the (A) epoxy resin and the (B) epoxy resin curing agent, and is distinguished from the (B) epoxy resin curing agent. .
  • organic metal salts such as zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), trisacetylacetonate cobalt (III), triethylamine, tributylamine, diazabicyclo [2,2 , 2] tertiary amines such as octane, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, 2-ethyl-4-ethylimidazole, 2-phenyl-4-methyl Imidazoles such as imidazole, 2-phenyl-4-methyl-5-hydroxyimidazole, 2-phenyl-4,5-dihydroxyimidazole, phenolic compounds such as phenol, bisphenol A, nonylphenol, acetic acid, benzoic acid, salicylic acid And organic acids such as p
  • the content of the curing catalyst is not particularly limited as long as the nitrogen content in the obtained prepreg 100 does not exceed 0.10% by mass.
  • 0.010 mass% or more of the whole resin composition P is preferable, and 0.10 mass% or more is particularly preferable.
  • stimulates hardening can fully be acquired as content of a curing catalyst is more than the said lower limit.
  • the content of the (C) curing catalyst is preferably 5.0% by mass or less, and particularly preferably 2.0% by mass or less, based on the entire resin composition P.
  • the fall of the preservability of the prepreg 100 can be suppressed as content of a curing catalyst is below the said upper limit.
  • Resin composition P preferably further contains (D) an inorganic filler.
  • inorganic fillers include silicates such as talc, calcined clay, unfired clay, mica and glass, oxides such as titanium oxide, alumina, silica and fused silica, calcium carbonate, magnesium carbonate and hydrotalc.
  • Carbonate such as site hydroxide such as aluminum hydroxide, magnesium hydroxide, calcium hydroxide, sulfate or sulfite such as barium sulfate, calcium sulfate, calcium sulfite, zinc borate, barium metaborate, aluminum borate And borate salts such as calcium borate and sodium borate, nitrides such as aluminum nitride, boron nitride, silicon nitride and carbon nitride, titanates such as strontium titanate and barium titanate.
  • hydroxide such as aluminum hydroxide, magnesium hydroxide, calcium hydroxide, sulfate or sulfite
  • barium sulfate calcium sulfate
  • calcium sulfite calcium sulfite
  • zinc borate barium metaborate
  • aluminum borate And borate salts such as calcium borate and sodium borate
  • nitrides such as aluminum nitride, boron nitrid
  • silica is particularly preferable, and fused silica (especially spherical fused silica) is preferable in terms of excellent low thermal expansion.
  • fused silica especially spherical fused silica
  • the shape is crushed and spherical, but in order to reduce the melt viscosity of the resin composition P in order to ensure the impregnation of the fiber base material 101, a method of use that suits the purpose, such as using spherical silica, is adopted. Is done.
  • the average particle diameter of the inorganic filler is not particularly limited, but is preferably 0.01 ⁇ m or more and 3 ⁇ m or less, and particularly preferably 0.02 ⁇ m or more and 1 ⁇ m or less.
  • a varnish can be made low viscosity and the fiber base material 101 can be made to impregnate the resin composition P favorably.
  • sedimentation etc. of (D) inorganic filler can be suppressed in a varnish.
  • This average particle diameter can be measured by, for example, a particle size distribution meter (manufactured by Shimadzu Corporation, product name: laser diffraction particle size distribution measuring device SALD series).
  • the (D) inorganic filler is not particularly limited, but an inorganic filler having a monodispersed average particle diameter can be used, and an inorganic filler having a polydispersed average particle diameter can be used. Furthermore, one type or two or more types of inorganic fillers having an average particle size of monodisperse and / or polydisperse can be used in combination.
  • spherical silica (especially spherical fused silica) having an average particle size of 3 ⁇ m or less is preferable, and spherical fused silica having an average particle size of 0.02 ⁇ m or more and 1 ⁇ m or less is particularly preferable. Thereby, the filling property of (D) inorganic filler can be improved.
  • the content of the inorganic filler is not particularly limited, but is preferably 2% by mass or more and 70% by mass or less, and particularly preferably 5% by mass or more and 60% by mass or less of the entire resin composition P. When the content is within the above range, particularly low thermal expansion and low water absorption can be achieved.
  • the resin composition P is not particularly limited, but it is preferable to further include (E) a coupling agent.
  • E) Coupling agent improves (A) epoxy resin and (D) inorganic filling with respect to fiber base material by improving the wettability of the interface of (A) epoxy resin and (D) inorganic filler.
  • the material can be fixed uniformly, and the heat resistance, particularly the solder heat resistance after moisture absorption can be improved.
  • any commonly used coupling agent can be used. Specifically, epoxy silane coupling agents, cationic silane coupling agents, aminosilane coupling agents, titanate coupling agents, and silicone oil types. It is preferable to use one or more coupling agents selected from coupling agents. Thereby, (D) wettability with the interface of an inorganic filler can be made high, and thereby heat resistance can be improved more.
  • the addition amount of the coupling agent depends on the specific surface area of the (D) inorganic filler and is not particularly limited. However, (D) 0.05% by mass to 5% by mass with respect to 100 parts by mass of the inorganic filler. The following is preferable, and 0.1 mass% or more and 3 mass% or less are especially preferable.
  • the content By setting the content to 0.05% by mass or more, (D) the inorganic filler can be sufficiently covered, and the heat resistance can be improved. By setting the content to 5% by mass or less, the reaction proceeds satisfactorily and a decrease in bending strength or the like can be prevented.
  • the resin composition P may contain a thermosetting resin other than an epoxy resin such as a melamine resin, a urea resin, or a cyanate resin, and it is particularly preferable to use a cyanate resin in combination.
  • a thermosetting resin other than an epoxy resin such as a melamine resin, a urea resin, or a cyanate resin
  • a cyanate resin in combination with bisphenol-type cyanate resin, such as a novolak-type cyanate resin, bisphenol A-type cyanate resin, bisphenol E-type cyanate resin, tetramethylbisphenol F-type cyanate resin, etc.
  • phenol novolac type cyanate resin is preferable from the viewpoint of low thermal expansion.
  • other cyanate resins can be used alone or in combination of two or more, and are not particularly limited.
  • the cyanate resin is preferably 8% by mass or more and 20% by mass or less of the entire resin composition P.
  • the resin composition P includes a phenoxy resin, a polyimide resin, a polyamideimide resin, a polyamide resin, a polyphenylene oxide resin, a polyethersulfone resin, a polyester resin, a polyethylene resin, a polystyrene resin, and other thermoplastic resins, styrene-butadiene copolymer.
  • thermoplastic elastomers such as styrene-isoprene copolymers, thermoplastic elastomers such as polyolefin thermoplastics, polyamide elastomers, polyester elastomers, polybutadiene, epoxy-modified polybutadiene, acrylic-modified polybutadiene, methacryl-modified polybutadiene, etc.
  • diene elastomers may be used in combination.
  • heat-resistant polymer resins such as phenoxy resin, polyimide resin, polyamideimide resin, polyamide resin, polyphenylene oxide resin, and polyethersulfone resin are preferable.
  • the thickness uniformity of the prepreg 100 is excellent, and as a wiring board, the heat resistance and the insulating property of the fine wiring are excellent.
  • the resin composition P may contain additives other than the above components such as pigments, dyes, antifoaming agents, leveling agents, ultraviolet absorbers, foaming agents, antioxidants, flame retardants, and ion scavengers as necessary. Things may be added.
  • the fiber base material 101 impregnated with the resin composition P is not particularly limited, but glass fiber base materials such as glass cloth, glass woven fabric and glass nonwoven fabric, carbon fiber base materials such as carbon cloth and carbon fiber woven fabric, rock wool, etc.
  • a glass fiber base material is preferable. Thereby, a prepreg having low water absorption, high strength, and low thermal expansion can be obtained.
  • Examples of the glass constituting the glass fiber substrate include E glass, C glass, A glass, S glass, D glass, NE glass, T glass, and H glass. Among these, E glass or T glass is preferable. Thereby, the high elasticity of a prepreg can be achieved and the thermal expansion coefficient of a prepreg can be reduced.
  • the basis weight (weight of the fiber base material per 1 m 2) is of 145 g / m 2 or more 300 g / m 2 or less, more preferably 160 g / m 2 It is 230 g / m 2 or more, more preferably 190 g / m 2 or more and 205 g / m 2 or less.
  • the basis weight is less than or equal to the above upper limit, the impregnation property of the resin composition in the fiber base material is improved, and a decrease in strand voids and insulation reliability can be suppressed.
  • formation of a through hole with a laser such as carbon dioxide, UV, or excimer may be facilitated.
  • strength of a glass cloth or a prepreg improves that basic weight is more than the said lower limit. As a result, handling may be improved, prepregs may be easily manufactured, and the effect of reducing substrate warpage may be improved.
  • the thickness of the fiber substrate is not particularly limited, but is preferably 50 ⁇ m or more and 300 ⁇ m or less, more preferably 80 ⁇ m or more and 250 ⁇ m or less, and further preferably 100 ⁇ m or more and 200 ⁇ m or less.
  • the thickness of the fiber base material is not more than the above upper limit, the impregnation property of the resin composition in the fiber base material is improved, and the decrease in strand voids and insulation reliability can be suppressed.
  • formation of a through hole with a laser such as carbon dioxide, UV, or excimer may be facilitated.
  • strength of a glass cloth or a prepreg improves that basic weight is more than the said lower limit. As a result, handling may be improved, prepregs may be easily manufactured, and the effect of reducing substrate warpage may be improved.
  • the number of fiber base materials used is not limited to one, and a plurality of thin fiber base materials can be used in a stacked manner.
  • the total thickness only needs to satisfy the above range.
  • the prepreg 100 in the present embodiment is obtained by impregnating a fiber base material 101 with a resin composition P containing (A) an epoxy resin and (B) an epoxy resin curing agent, and then semi-curing it.
  • the method of impregnating the fiber base material 101 with the resin composition P is, for example, a method of preparing a resin varnish V using the resin composition P, immersing the fiber base material 101 in the resin varnish V, and a resin varnish V using various coaters.
  • coating, the method of spraying the resin varnish V by spray, the method of laminating the resin layer with a support base material on a fiber base material, etc. are mentioned.
  • the method of immersing the fiber substrate 101 in the resin varnish V and the method of laminating the resin layer with a supporting substrate on the fiber substrate are preferable.
  • the method of immersing the fiber base material 101 in the resin varnish V can improve the impregnation property of the resin composition P with respect to the fiber base material 101.
  • a normal impregnation coating equipment can be used.
  • the thickness of the fiber substrate 101 is 0.1 mm or less
  • a method of laminating a resin layer with a supporting substrate on the fiber substrate is preferable.
  • the impregnation amount of the resin composition P with respect to the fiber base material 101 can be adjusted freely, and the moldability of a prepreg can further be improved.
  • the solvent used in the resin varnish V desirably has good solubility in the resin component in the resin composition P, but a poor solvent may be used within a range that does not adversely affect the resin varnish V.
  • Solvents exhibiting good solubility include, for example, alcohols such as methanol and ethanol, toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, cyclopentanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, cellosolve type And carbitol series.
  • an organic compound that does not contain a nitrogen atom in the chemical formula is particularly preferable as a solvent, and alcohols, methyl ethyl ketone, and toluene are particularly preferable.
  • a prepreg having a nitrogen content of 0.10% by mass or less can be obtained more efficiently.
  • the solid content of the resin varnish V is not particularly limited, but the solid content of the resin composition P is preferably 20% by mass to 90% by mass, and particularly preferably 50% by mass to 80% by mass. Thereby, the impregnation property to the fiber base material 101 of the resin varnish V can further be improved.
  • the predetermined temperature which makes the fiber base material 101 impregnate the resin composition P is not specifically limited,
  • the prepreg 100 can be obtained by drying at 90 degreeC or more and 220 degrees C or less.
  • the thickness of the prepreg 100 is preferably 20 ⁇ m or more and 100 ⁇ m or less.
  • the theoretical nitrogen content in the resin varnish V is 0.50% by mass or less, preferably 0.20% by mass or less, and more preferably 0.10% by mass or less.
  • the theoretical nitrogen content in the resin varnish V is a value calculated on the assumption that the nitrogen contained in the resin varnish V is derived only from a component containing a nitrogen atom in the chemical formula. Specifically, the nitrogen content contained in each component is calculated from the molecular weight and the number of nitrogen atoms, the total weight is divided by the weight of the entire resin varnish, and the obtained value is expressed in%.
  • the thickness of the resin layer 103 and the resin layer 104 may be substantially the same or different with the fiber base 101 as the center, with the fiber base 101 as the center.
  • the center in the thickness direction of the fiber base material may be shifted from the center in the thickness direction of the prepreg.
  • the laminate in the present embodiment includes a cured body of prepreg obtained by curing the prepreg 100 described above.
  • the manufacturing method of the laminated board using the prepreg 100 obtained above is demonstrated.
  • the manufacturing method of the laminated board using a prepreg is not specifically limited, For example, it is as follows. Laminate one or more prepregs, overlap metal foils on both the top and bottom sides or one side of the outside, and join them under high vacuum conditions using a laminator or becquerel unit, or directly on top and bottom or both sides on the outside of the prepreg Stack metal foil.
  • a laminated plate can be obtained by heating and pressurizing a prepreg with a metal foil on a vacuum press or heating with a dryer.
  • the thickness of the metal foil is, for example, 1 ⁇ m or more and 35 ⁇ m or less.
  • the thickness of the metal foil is equal to or more than the lower limit, it is possible to sufficiently ensure the mechanical strength when manufacturing the laminated plate. Further, when the thickness is not more than the above upper limit value, it is possible to easily process and form a fine circuit.
  • the metal constituting the metal foil examples include copper and copper alloys, aluminum and aluminum alloys, silver and silver alloys, gold and gold alloys, zinc and zinc alloys, nickel and nickel alloys, tin and tin alloys. Alloy, iron and iron-based alloy, Kovar (trade name), 42 alloy, Fe-Ni based alloy such as Invar or Super Invar, W or Mo, and the like. Also, an electrolytic copper foil with a carrier can be used.
  • the method for the heat treatment is not particularly limited, and can be carried out using, for example, a hot air drying device, an infrared heating device, a heating roll device, a flat platen hot platen pressing device, or the like.
  • a hot-air drying device or an infrared heating device is used, the bonding can be carried out without substantially applying pressure to the joined ones.
  • a heating roll apparatus or a flat hot platen press apparatus it can implement by making predetermined
  • the temperature at the time of heat treatment is not particularly limited, but it is preferably a temperature range in which the resin used is melted and the resin curing reaction does not proceed rapidly.
  • the temperature at which the resin melts is preferably 120 ° C. or higher, more preferably 150 ° C. or higher.
  • the temperature at which the resin curing reaction does not proceed rapidly is preferably 250 ° C. or lower, more preferably 230 ° C. or lower.
  • the time for the heat treatment varies depending on the type of resin used and the like, it is not particularly limited.
  • the heat treatment can be performed by treating for 30 minutes to 300 minutes.
  • the pressure to pressurize is not particularly limited, but is preferably 0.2 MPa or more and 6 MPa or less, and more preferably 2 MPa or more and 5 MPa or less.
  • a film may be laminated on at least one surface of the laminate in the present embodiment.
  • the film include polyethylene, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyimide, and fluorine resin.
  • the obtained laminated plate can be used for a semiconductor package 200 as shown in FIG.
  • a manufacturing method of the semiconductor package 200 for example, there are the following methods.
  • a through hole 215 for interlayer connection is formed in the laminate 213, and a wiring layer is manufactured by a subtractive method, a semi-additive method, or the like.
  • build-up layers (not shown in FIG. 2) are stacked as necessary, and the steps of interlayer connection and circuit formation by the additive method are repeated.
  • the solder resist layer 201 is laminated
  • some or all of the buildup layers and the solder resist layer 201 may or may not include a fiber base material.
  • solder resist layer 201 After a photoresist is applied to the entire surface of the solder resist layer 201, a part of the photoresist is removed to expose a part of the solder resist layer 201. Note that a resist having a photoresist function may be used for the solder resist layer 201. In this case, the step of applying a photoresist can be omitted. Next, the exposed solder resist layer is removed to form the opening 209.
  • the semiconductor element 203 is fixed to the connection terminal 205 which is a part of the wiring pattern via the solder bump 207. Then, the semiconductor package 203 as shown in FIG. 2 is obtained by sealing the semiconductor element 203, the solder bump 207, etc. with the sealing material 211. Then, as shown in FIG.
  • the semiconductor package 200 can be used in a semiconductor device 300 as shown in FIG.
  • a method for manufacturing the semiconductor device 300 is not particularly limited, and examples thereof include the following methods.
  • solder bumps 301 are formed by supplying a solder paste to the opening 209 of the solder resist layer 201 of the obtained semiconductor package 200 and performing a reflow process.
  • the solder bump 301 can also be formed by attaching a solder ball prepared in advance to the opening 209.
  • the semiconductor package 200 is mounted on the mounting substrate 303 by joining the connection terminals 305 of the mounting substrate 303 and the solder bumps 301, and the semiconductor device 300 shown in FIG. 3 is obtained.
  • the prepreg 100 for the laminate 213 having excellent insulation reliability can be provided.
  • the circuit board using the laminated board 213 is excellent in insulation reliability. Therefore, the laminated board 213 in the present embodiment can be suitably used for applications that require further insulation reliability, such as printed wiring boards that require higher density and higher multilayer.
  • each thickness is represented by the average film thickness.
  • Example 1 The laminated board in this invention was produced using the following procedures.
  • the air permeability of the glass woven fabric is as follows: a sample is cut into 200 mm ⁇ 500 mm, and a Frazier measuring instrument (AP-360S manufactured by Daiei Scientific Co., Ltd.) is used. The amount of air passing through the cloth per second was obtained.
  • an electroless copper plating is formed to a thickness of 0.5 ⁇ m
  • a resist layer for electrolytic copper plating is formed to a thickness of 18 ⁇ m
  • pattern copper plating is performed.
  • the film was post-cured by heating at 200 ° C. for 60 minutes.
  • a solder resist (PSR4000 / AUS308 manufactured by Taiyo Ink Co., Ltd.) having a thickness of 20 ⁇ m was formed on the circuit surface to obtain a double-sided printed wiring board.
  • Examples 2 to 9 and Comparative Examples 1 to 8 A resin varnish was prepared in the same manner as in Example 1 except that a resin varnish was prepared according to the recipe shown in Table 1 and Table 2, and a prepreg, a laminate, and a printed wiring board were produced. In addition, the following evaluations were performed on the prepregs and printed wiring boards obtained in the examples and comparative examples. The evaluation results are shown in Table 1.
  • Comparative Example 1 used a glass woven fabric having a low air permeability, a resin pool was generated. Since Comparative Examples 2 and 3 used nitrogen as a solvent, solder heat resistance and migration resistance deteriorated. Since Comparative Examples 4, 6, and 7 used nitrogen containing curing agents, the migration resistance deteriorated. In Comparative Example 5, since a glass woven fabric having a low air permeability was used, a hardener containing nitrogen was used, but no migration occurred. However, since a glass woven fabric having a low air permeability was used, resin accumulation occurred. Since Comparative Example 8 used a glass woven fabric having an air permeability exceeding 30 cm 3 / cm 2 / sec, the migration resistance deteriorated.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)

Abstract

Ce préimprégné (100) est obtenu par imprégnation d'une matière à base de fibres (101) par une composition de résine comprenant une résine époxy et un agent de durcissement de résine époxy. La quantité d'azote contenu dans le préimprégné (100) est au plus de 0,10 % en masse et la perméabilité à l'air de la matière à base de fibres (101) est de 3,0-30,0 cm3/cm2/sec.
PCT/JP2012/003671 2011-06-28 2012-06-05 Préimprégné, plaque stratifiée, emballage de semi-conducteur et procédé de fabrication d'une plaque stratifiée WO2013001726A1 (fr)

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CN201280032172.6A CN103649185B (zh) 2011-06-28 2012-06-05 半固化片、层压板、半导体封装件及层压板的制造方法
JP2013522710A JP5696786B2 (ja) 2011-06-28 2012-06-05 プリプレグ、積層板、半導体パッケージおよび積層板の製造方法

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US10796998B1 (en) 2019-04-10 2020-10-06 Gan Systems Inc. Embedded packaging for high voltage, high temperature operation of power semiconductor devices
WO2021044946A1 (fr) * 2019-09-06 2021-03-11 パナソニックＩｐマネジメント株式会社 Composition de résine, préimprégné, film revêtu de résine, feuille métallique revêtue de résine, feuille stratifiée plaquée de métal, et carte de circuit imprimé
US11342248B2 (en) 2020-07-14 2022-05-24 Gan Systems Inc. Embedded die packaging for power semiconductor devices

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CN105006436A (zh) * 2015-06-05 2015-10-28 华进半导体封装先导技术研发中心有限公司 提高微凸点制备良率的装置及微凸点的制备工艺
JP7062331B2 (ja) * 2017-11-16 2022-05-06 株式会社ディスコ 芯材の製造方法及び銅張積層板の製造方法
CN111303788A (zh) * 2020-02-25 2020-06-19 深圳赛兰仕科创有限公司 高频复合材料及其制备方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10796998B1 (en) 2019-04-10 2020-10-06 Gan Systems Inc. Embedded packaging for high voltage, high temperature operation of power semiconductor devices
US11676899B2 (en) 2019-04-10 2023-06-13 Gan Systems Inc. Embedded packaging for high voltage, high temperature operation of power semiconductor devices
WO2021044946A1 (fr) * 2019-09-06 2021-03-11 パナソニックＩｐマネジメント株式会社 Composition de résine, préimprégné, film revêtu de résine, feuille métallique revêtue de résine, feuille stratifiée plaquée de métal, et carte de circuit imprimé
JP7489617B2 (ja) 2019-09-06 2024-05-24 パナソニックＩｐマネジメント株式会社 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板
US11342248B2 (en) 2020-07-14 2022-05-24 Gan Systems Inc. Embedded die packaging for power semiconductor devices
US11776883B2 (en) 2020-07-14 2023-10-03 Gan Systems Inc. Embedded die packaging for power semiconductor devices

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TW201315767A (zh) 2013-04-16
JP5696786B2 (ja) 2015-04-08
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CN103649185A (zh) 2014-03-19
KR20140027493A (ko) 2014-03-06
KR101574907B1 (ko) 2015-12-04

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