WO2012176752A1 - Procédé de fabrication de panneau à cristaux liquides et panneau à cristaux liquides - Google Patents

Procédé de fabrication de panneau à cristaux liquides et panneau à cristaux liquides Download PDF

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Publication number
WO2012176752A1
WO2012176752A1 PCT/JP2012/065576 JP2012065576W WO2012176752A1 WO 2012176752 A1 WO2012176752 A1 WO 2012176752A1 JP 2012065576 W JP2012065576 W JP 2012065576W WO 2012176752 A1 WO2012176752 A1 WO 2012176752A1
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Prior art keywords
insulating layer
colored
layer
liquid crystal
yellow
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PCT/JP2012/065576
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English (en)
Japanese (ja)
Inventor
達朗 黒田
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シャープ株式会社
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Publication of WO2012176752A1 publication Critical patent/WO2012176752A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136222—Colour filters incorporated in the active matrix substrate

Definitions

  • the present invention relates to a method for manufacturing a liquid crystal panel and a liquid crystal panel. Specifically, the present invention relates to a method of manufacturing a liquid crystal panel that can be used as a color filter by mixing a pigment in an interlayer insulating film.
  • the present application claims priority based on Japanese Patent Application No. 2011-137644 filed on June 21, 2011, the entire contents of which are incorporated herein by reference. .
  • the liquid crystal display device includes a liquid crystal panel in which liquid crystal is sealed between a pair of translucent substrates, and a backlight device arranged on the back side of the panel.
  • the light emitted from the light source of the backlight device is irradiated from the back side of the liquid crystal panel, whereby the image displayed on the liquid crystal panel becomes visible.
  • the liquid crystal panel is composed of a pair of translucent substrates, that is, an array substrate on which thin film transistors (TFTs) are formed, and a color filter substrate including a color filter layer.
  • TFTs thin film transistors
  • the array substrate and the color filter substrate are respectively formed on separate substrates, and are bonded to each other after the liquid crystal material is dropped. In this way, the liquid crystal panel is manufactured.
  • Patent Document 1 a structure in which an interlayer insulating film in an array substrate is colored and used as a color filter layer has been proposed (for example, Patent Document 1).
  • FIG. 13 shows a configuration of the liquid crystal panel 1000 disclosed in Patent Document 1.
  • FIG. 13A is a plan view showing a pixel for one pixel in the liquid crystal panel 1000.
  • FIG. 13B is a cross-sectional view around the thin film transistor (TFT) 420 in FIG.
  • TFT thin film transistor
  • the liquid crystal panel 1000 shown in FIG. A liquid crystal layer 444 is provided between the first substrate 441 and the second substrate 442.
  • polarizing plates 443 a and 443 b are provided outside the first substrate 441 and the second substrate 442.
  • a thin film transistor (TFT) 420 is formed over the first substrate 441.
  • the thin film transistor 420 includes a gate electrode layer 401, a gate insulating layer 402, a semiconductor layer 403 made of an oxide semiconductor, source / drain electrode layers 405a and 405b, and the like.
  • An insulating film 407 that is in contact with the semiconductor layer 403 is provided so as to cover the TFT 420, and an interlayer film 413 is provided over the insulating film 407.
  • an electrode layer (pixel electrode layer) 446 having an opening pattern is formed. The electrode layer 446 is connected to the drain electrode layer 405b of the TFT 420.
  • a chromatic translucent resin layer 417 is used for the interlayer film 413.
  • the visible light transmittance of the chromatic color translucent resin layer 417 is lower than the visible light transmittance of the semiconductor layer 403 made of an oxide semiconductor.
  • the chromatic translucent resin layer 417 as the interlayer film 413 can function as a color filter layer.
  • the interlayer film 417 is directly formed on the element substrate side as a color filter layer, it is possible to control the formation region more precisely, and as a result, it is possible to deal with fine pattern pixels.
  • the interlayer film 417 and the color filter layer are also used as the same insulating layer, the process can be simplified, and as a result, a liquid crystal panel can be manufactured at low cost.
  • the inventor of the present application examined a liquid crystal panel using a colored interlayer film (interlayer insulating film) as a color filter, and found the following problems. That is, when a colored interlayer insulating film is manufactured, a photolithography process is required for each color of RGB (red, green, and blue), and therefore, the number of photomasks increases accordingly. An increase in the photomask is not preferable because it leads to an increase in the manufacturing cost of the liquid crystal panel.
  • RGB red, green, and blue
  • the colored interlayer insulating film it is necessary to develop the colored interlayer insulating film so that the respective RGB (red, green, and blue) areas do not overlap.
  • color mixing and color bleeding occur.
  • FIG. 14A when the areas of the colored interlayer insulating films 115R (red layer), 115G (green layer), and 115B (blue layer) do not overlap on the substrate 110, the substrate 110 is clean. Functions as a color filter layer.
  • a part of the interlayer insulating film 115R (red layer) overlaps with the interlayer insulating film 115G (green layer) on the substrate 110. In some cases, color mixing or color bleeding occurs.
  • the present invention has been made in view of such a point, and a main object thereof is to provide a manufacturing method capable of easily manufacturing a liquid crystal panel using a colored insulating layer as a color filter.
  • the present invention provides a method for manufacturing a liquid crystal panel including the following steps. That is, the method for manufacturing a liquid crystal panel according to the present invention includes a step (a) of preparing an array substrate on which a thin film transistor is formed, and a first colored insulating layer made of a first colored material on the array substrate. A step (b) of forming, a step (c) of forming a second colored insulating layer made of a second colored material on the array substrate, and the first colored insulating layer on the array substrate. And (d) depositing a third coloring material so as to cover the second coloring insulating layer, and etching the surface of the deposited third coloring material to form the third coloring material. Forming a third colored insulating layer (e).
  • a first colored insulating layer for example, a red insulating layer
  • a second colored insulating layer for example, a blue insulating layer
  • the third coloring material for example, the green coloring material
  • the third colored insulating layer made of the third coloring material is etched by etching the surface of the deposited third coloring material.
  • the manufacturing cost of the liquid crystal panel can be reduced.
  • the manufacturing cost of the liquid crystal panel can be reduced.
  • the manufacturing method which can manufacture simply the liquid crystal panel which uses a colored insulating layer as a color filter can be provided.
  • the first colored insulating layer and the second colored insulating layer are formed by ashing the surface of the third colored material deposited in the step (e). To expose the surface.
  • the second colored insulating layer is formed such that a part of the second colored insulating layer overlaps the first colored insulating layer. Is formed on the array substrate, and in the step (e), a part of the second colored insulating layer and the deposited third colored material are polished by a grindstone.
  • a rib is defined on the first colored insulating layer, the second colored insulating layer, and the third colored insulating layer after the step (e). Performing a step of forming a photoresist, and using the photoresist as a mask, forming a rib by ashing the surface of the first colored insulating layer, the second colored insulating layer, and the third colored insulating layer; Execute.
  • the first colored material and the second colored material are formed on the surfaces of the first colored insulating layer and the second colored insulating layer.
  • a step of forming an etching stopper layer made of a material different from the third coloring material and in the step (e), the surface of the deposited third coloring material is exposed until the etching stopper layer is exposed.
  • An ashing process is executed.
  • etching stopper layer is performed in addition to the ashing step.
  • a step of forming a pixel electrode on the first colored insulating layer, the second colored insulating layer, and the third colored insulating layer is executed.
  • the array substrate prepared in the step (a) includes a glass substrate on which the thin film transistor is formed, and a transparent resin layer formed on the surface of the glass substrate. And a lens layer having a lens function, which is formed on the surface of the transparent resin layer, and the first colored insulating layer is formed on the surface of the lens layer.
  • the array substrate prepared in the step (a) includes a glass substrate on which the thin film transistor is formed, and a parallax barrier layer formed on the surface of the glass substrate. And a transparent resin layer formed on the surface of the glass substrate so as to cover the parallax barrier layer.
  • the parallax barrier layer independently views the right-eye pixels and the left-eye pixels.
  • the first colored insulating layer is formed on the surface of the transparent resin layer.
  • the present invention provides a method of manufacturing a liquid crystal panel that performs color display with four primary colors, including the following steps. That is, another method for manufacturing a liquid crystal panel according to the present invention includes a step of preparing an array substrate on which a thin film transistor is formed, and a step of forming a yellow insulating layer made of a yellow coloring material on the array substrate. And a step of forming a red insulating layer composed of a red coloring material.
  • the yellow insulating layer formed in the step of forming the yellow insulating layer includes a yellow pixel region defining a yellow pixel and a green pixel region defining a green pixel, and the green pixel in the yellow insulating layer The thickness of the part corresponding to the region is thinner than the thickness of the part corresponding to the yellow pixel region.
  • a step of depositing a blue coloring material on the array substrate so as to cover the yellow insulating layer and the red insulating layer is performed, and a surface of the deposited blue coloring material is formed. Etching is performed to form a blue insulating layer and a green insulating layer generated by color mixture of the blue coloring material and the yellow coloring material in the green pixel region.
  • a green insulating layer generated by a color mixture of a blue coloring material and a yellow coloring material is formed in a green pixel region.
  • a green coloring material that constitutes the green insulating layer is generated by mixing the blue coloring material and the yellow coloring material. There is no need to do. Therefore, even when color display with four primary colors is realized, it is only necessary to prepare coloring materials for the three primary colors, so that the material cost can be reduced.
  • the step of forming the yellow insulating layer is performed using a halftone mask that reduces the thickness of a portion corresponding to the green pixel region.
  • a step of forming a pixel electrode on a portion of the yellow pixel region in the red insulating layer, the green insulating layer, the blue insulating layer, and the yellow insulating layer Is executed.
  • the array substrate prepared in the step (a) includes a glass substrate on which the thin film transistor is formed, and a transparent resin layer formed on the surface of the glass substrate. And a lens layer having a lens function formed on the surface of the transparent resin layer, and the yellow insulating layer is formed on the surface of the lens layer.
  • the array substrate prepared in the step (a) includes a glass substrate on which the thin film transistor is formed, and a parallax barrier layer formed on the surface of the glass substrate. And a transparent resin layer formed on the surface of the glass substrate so as to cover the parallax barrier layer.
  • the parallax barrier layer independently views the right-eye pixels and the left-eye pixels. It has a convex portion for entering the visual field of the viewer, and the yellow insulating layer is formed on the surface of the transparent resin layer.
  • a liquid crystal panel provided by the present invention includes an array substrate on which a thin film transistor is formed, a counter substrate facing the array substrate, and a liquid crystal layer disposed between the array substrate and the counter substrate.
  • a first colored insulating layer composed of a first colored material
  • a second colored insulating layer composed of a second colored material
  • a third colored insulating material composed of a third colored material.
  • a layer is formed.
  • the first colored insulating layer, the second colored insulating layer, and the third colored insulating layer function as a color filter layer.
  • the first colored insulating layer and the second colored insulating layer are formed by a photolithography process.
  • the third colored insulating layer is formed by depositing the third colored material on the array substrate so as to cover the first colored insulating layer and the second colored insulating layer, and etching the surface of the deposited third colored material.
  • a pixel electrode is formed on the first colored insulating layer, the second colored insulating layer, and the third colored insulating layer.
  • the array substrate includes a glass substrate on which the thin film transistor is formed, a transparent resin layer formed on the surface of the glass substrate, and a surface of the transparent resin layer. And a lens layer having a lens function, and the color filter layer is formed on a surface of the lens layer.
  • the array substrate covers the glass substrate on which the thin film transistor is formed, a parallax barrier layer formed on a surface of the glass substrate, and the parallax barrier layer.
  • a transparent resin layer formed on the surface of the glass substrate, the parallax barrier layer is a convex for independently entering the right-eye pixel and the left-eye pixel into the viewer's field of view.
  • the color filter layer is formed on the surface of the transparent resin layer.
  • Another liquid crystal panel provided by the present invention is a liquid crystal panel that performs color display using four primary colors, an array substrate on which a thin film transistor is formed, a counter substrate facing the array substrate, the array substrate and the counter substrate, And a liquid crystal layer disposed between the two.
  • a red insulating layer made of a red coloring material, a yellow insulating layer made of a yellow coloring material, and a blue insulating layer made of a blue coloring material are formed on the array substrate.
  • the yellow insulating layer includes a yellow pixel region that defines a yellow pixel and a green pixel region that defines a green pixel, and a thickness of a portion corresponding to the green pixel region in the yellow insulating layer is the yellow pixel region.
  • the blue coloring material is provided on the green pixel region in the yellow insulating layer, and the green insulating layer is formed by a color mixture of the blue coloring material and the yellow coloring material in the green pixel region.
  • the yellow pixel region portion in the red insulating layer, the green insulating layer, the blue insulating layer, and the yellow insulating layer functions as a color filter layer.
  • a pixel electrode is disposed on a portion of the yellow pixel region in the red insulating layer, the green insulating layer, the blue insulating layer, and the yellow insulating layer. Is formed.
  • the array substrate includes a glass substrate on which the thin film transistor is formed, a transparent resin layer formed on the surface of the glass substrate, and a surface of the transparent resin layer. And a lens layer having a lens function, and the color filter layer is formed on a surface of the lens layer.
  • the array substrate covers the glass substrate on which the thin film transistor is formed, a parallax barrier layer formed on a surface of the glass substrate, and the parallax barrier layer.
  • a transparent resin layer formed on the surface of the glass substrate, the parallax barrier layer is a convex for independently entering the right-eye pixel and the left-eye pixel into the viewer's field of view.
  • the color filter layer is formed on the surface of the transparent resin layer.
  • FIGS. 1 to (d) are process cross-sectional views showing how a colored insulating layer (for example, a red insulating layer) is formed by a photoresist process.
  • (A) to (e) are process cross-sectional views illustrating a method for manufacturing the array substrate 200 in the liquid crystal panel 100 according to one embodiment of the present invention.
  • (A) to (e) are process cross-sectional views illustrating a method for manufacturing the array substrate 200 in the liquid crystal panel 100 according to one embodiment of the present invention.
  • FIGS. 4A to 4D are process cross-sectional views illustrating a method for manufacturing the array substrate 210 in the liquid crystal panel 100 according to an embodiment of the present invention.
  • FIG. 6 is a top view schematically showing a top surface configuration of the array substrate 210 shown in FIG. (A) to (f) are process cross-sectional views illustrating a method of manufacturing the array substrate 220 in the liquid crystal panel 100 according to one embodiment of the present invention.
  • FIGS. 4A to 4D are process cross-sectional views illustrating a method for manufacturing the array substrate 230 in the liquid crystal panel 100 according to an embodiment of the present invention. It is sectional drawing which shows typically the structure of the array substrate 300 which concerns on one Embodiment of this invention.
  • FIGS. 4A to 4F are process cross-sectional views illustrating a method for manufacturing an array substrate 300 according to an embodiment of the present invention. It is sectional drawing which shows typically the structure of the array board
  • FIGS. 4A to 4E are process cross-sectional views illustrating a method for manufacturing an array substrate 310 according to an embodiment of the present invention.
  • (A) And (b) is the top view and sectional drawing which show the structure of the conventional liquid crystal panel 1000, respectively.
  • (A) And (b) is sectional drawing in which the colored interlayer insulation film 115 (R * G * B) was formed on the board
  • FIG. 1 is a cross-sectional view schematically showing a configuration of a liquid crystal panel 100 according to an embodiment of the present invention.
  • symbol is attached
  • the dimensional relationship (length, width, thickness, etc.) in each drawing does not necessarily accurately reflect the actual dimensional relationship.
  • hatching in the drawing is given mainly for the purpose of easy understanding of the constituent elements, and does not necessarily represent the elements of the material.
  • the “front side” or “front side” refers to the side facing the viewer (viewer) in the liquid crystal panel 100 (that is, the counter substrate 20 side), and “back side” or “back side”. Is the side of the liquid crystal panel 100 that does not face the viewer (that is, the array substrate 10 side).
  • the liquid crystal panel 100 of this embodiment includes an array substrate 10 on which a thin film transistor (TFT) 30 is formed and a counter substrate 20 facing the array substrate 10.
  • a liquid crystal layer 40 is disposed between the substrate 20.
  • the liquid crystal panel of the present embodiment is a so-called active matrix type (TFT type) liquid crystal panel.
  • a sealing material (not shown) for sealing the liquid crystal layer 40 is formed on the periphery of the array substrate 10 and the counter substrate 20.
  • the liquid crystal layer 40 is made of a liquid crystal material containing liquid crystal molecules 42, and the liquid crystal material is optically controlled by the alignment of the liquid crystal molecules 42 being applied with an electric field applied between the array substrate 10 and the counter substrate 20. The characteristics change.
  • the array substrate 10 is composed of a translucent substrate (glass substrate).
  • a TFT 30 is formed on the array substrate 10 for each pixel.
  • the gate wiring 32 is formed on the array substrate 10, and the gate insulating film 33 is formed on the array substrate 10 so as to cover the gate wiring 32.
  • a semiconductor layer 36 is formed on the gate wiring (gate electrode) 32 via a gate insulating film 33.
  • a source wiring 34 s and a drain wiring 34 d are connected to the semiconductor layer 36.
  • the TFT 30 is constructed by the gate wiring (gate electrode) 32, the gate insulating film 33, the semiconductor layer 36, the source wiring 34s and the drain wiring 34d.
  • an insulating film for example, a passivation film or a protective film
  • a passivation film or a protective film is formed on the array substrate 10 (more precisely, on the gate insulating film 33) so as to cover the source wiring 34s and the drain wiring 34d.
  • a colored insulating layer 15 is formed on the array substrate 10. Specifically, on the array substrate 10, a first colored insulating layer 15 (for example, a red insulating layer 15R) made of a first colored material (for example, a red colored material) and a second colored material (for example, a red colored material) , A blue colored material), a second colored insulating layer 15 (for example, a blue colored insulating layer 15B), and a third colored insulating layer 15 (for example, a green colored material) (for example, green colored material).
  • An insulating layer 15G: not shown) is formed.
  • the colored insulating layer 15 of each color is formed on the insulating film 35.
  • a pixel electrode (transparent electrode) 12 is formed on the colored insulating layer 15 (for example, 15R, 15B).
  • the pixel electrode 12 is made of, for example, ITO (Indium Tim Oxide) and has a vertically long rectangular shape. A part of the pixel electrode 12 is connected to the drain wiring 34 d of the TFT 30.
  • the pixel electrode 12 is formed on the surface of the red insulating layer 15 ⁇ / b> R, but the pixel electrode 12 is also formed on the other colored insulating layer 15.
  • An alignment film (not shown) that determines the alignment direction of the liquid crystal molecules 42 in the liquid crystal layer 40 is formed on the pixel electrode 12.
  • the counter substrate 20 is composed of a translucent substrate (glass substrate).
  • a pixel electrode (transparent electrode) 22 is formed on the counter substrate 20 on the liquid crystal layer 40 side.
  • the pixel electrode 22 is made of, for example, ITO (Indium Tim Oxide).
  • An alignment film (not shown) that determines the alignment direction of the liquid crystal molecules 42 in the liquid crystal layer 40 is formed on the liquid crystal layer 40 side of the pixel electrode 22.
  • the colored insulating layers 15 (15R, 15B, and 15G) for each color function as color filter layers.
  • the colored insulating layers 15 (15R, 15B, 15G) for each color are made of a light-transmitting resin containing a pigment for each color.
  • a photoresist material such as a photosensitive acrylic resin ( For example, the product name JAS)) manufactured by JSR Corporation.
  • the color insulating layer (15R, 15B, 15G) that functions as a color filter layer is formed on the array substrate 10, and therefore the color filter layer is disposed on the counter substrate 20 side. Absent. Note that polarizing plates (not shown) are attached to the outer surfaces of the array substrate 10 and the counter substrate 20, respectively.
  • the colored insulating layer 15 of the present embodiment serves as an interlayer insulating film located between the pixel electrode 12 and the source electrode 34s. More specifically, when only a relatively thin insulating film (passivation film) 35 exists between the pixel electrode 12 and the source electrode 34s, the pixel electrode is affected by the electric field generated around the source electrode 34s. As a result, the voltage of 12 rises, which may cause a problem that the alignment state of the liquid crystal molecules 42 changes at an unintended timing. As in the configuration of the present embodiment, by providing a colored insulating layer (interlayer insulating film) 15 thicker than the insulating film 35 between the pixel electrode 12 and the source electrode 34s, the source electrode 34s is surrounded by the surroundings. The influence of the generated electric field can be reduced, and as a result, a problem that the alignment state of the liquid crystal molecules 42 changes at an unintended timing can be prevented.
  • the two colored insulating layers 15 (for example, the red insulating layer 15R and the blue insulating layer 15B) constituting the three primary colors are formed by a photolithography process, but the remaining 1
  • the colored colored insulating layer 15 (for example, the green insulating layer 15G) is formed without using a photolithography process.
  • a method for producing the colored insulating layer 15 (15R, 15B, 15G) of the present embodiment will be described later.
  • the thickness of the colored insulating layer 15 (15R, 15B, 15G) is, for example, 1 to 3 ⁇ m, but is not limited to that value.
  • the thickness of the translucent substrate (glass substrate) constituting the main body of the array substrate 10 and the counter substrate 20 of the present embodiment is, for example, 0.5 to 1 mm.
  • the array substrate 10 and the counter substrate 20 may be in the form of a mother glass (large substrate) that can take a liquid crystal panel in multiple planes, or may be a substrate having a size of one liquid crystal panel.
  • the semiconductor layer 36 constituting the TFT 30 is a silicon layer made of silicon (for example, amorphous silicon), but a semiconductor layer made of another semiconductor material can be used.
  • the semiconductor layer 36 may be an oxide semiconductor layer made of an oxide semiconductor material.
  • the wiring layers such as the gate wiring 32, the source wiring 34s and the drain wiring 34d are composed of a conductive layer such as a metal layer.
  • the gate wiring 32 is composed of a metal layer such as aluminum or copper, but a multilayer film may be used.
  • Each of the gate wiring 32, the source wiring 34s, and the drain wiring 34d may be composed of the same conductive layer, or may be made of different conductive layers.
  • the gate insulating film 33 is made of, for example, silicon nitride.
  • the insulating film (passivation film) 35 is made of, for example, nitride (silicon nitride or the like). The thicknesses and materials of the various layers are appropriately selected according to the manufacturing apparatus and manufacturing process, and are not particularly limited.
  • the array substrate 10 including the colored insulating layer 15 (15R, 15B, 15G) of the present embodiment will be described.
  • the formation of the colored insulating layer 15 on the array substrate 10 is performed as shown in FIGS.
  • a glass substrate constituting the array substrate 10 is prepared, and a coloring material 14 (for example, a red coloring material 14R) is deposited on the surface thereof.
  • a coloring material 14 for example, a red coloring material 14R
  • the array substrate (glass substrate) 10 prepared here the one on which the TFT 30 is formed is used.
  • a coating film made of the red coloring material 14R is formed on the entire surface of the glass substrate 10 by applying the red coloring material 14R on the glass substrate 10.
  • a photomask 50 having an opening 52 that defines the position and shape of the first colored insulating layer 15 (red insulating layer 15 ⁇ / b> R) is disposed above the glass substrate 10. To do. Then, the portion 16 (16R) to be the red insulating layer 15R is exposed by irradiating the coating film made of the red coloring material 14R with irradiation light (typically ultraviolet rays) through the photomask 50.
  • irradiation light typically ultraviolet rays
  • the coating film made of the red coloring material 14R is developed in order to remove the portions other than the exposed portion 16 (16R). More specifically, this developing process leaves an exposed portion 16 (16R) that becomes the red insulating layer 15R on the glass substrate 10.
  • the exposed portion 16 (16R) is cured to form a red insulating layer 15R.
  • the exposed portion 16 (16R) formed on the glass substrate 10 is baked to form the red insulating layer 15R.
  • the second colored insulating layer 15 (for example, blue insulating layer 15B) is formed.
  • the first colored insulating layer 115 red insulating layer 115R
  • the second colored insulating layer 115 for example, the blue insulating layer 115B
  • Each of the colored insulating layers 115 is formed by a photolithography process, and specifically, is formed by repeating a coating process, an exposure process, a development process, and the like.
  • the first colored insulating layer 15 (for example, the red insulating layer 15R) and the second colored insulating layer 15 (for example, the blue insulating layer 15B) are manufactured by a photolithography process.
  • the remaining third colored insulating layer 15 of one color (for example, the green insulating layer 15G) is manufactured without using a photolithography process.
  • FIGS. 3A to 3E are cross-sectional views for explaining a method for manufacturing the array substrate 10 including the colored insulating layer 15 in the present embodiment.
  • a first colored insulating layer 15 (here, a red insulating layer) is formed on the glass substrate 10 as shown in FIG. 15R).
  • a TFT 30 is formed on the glass substrate 10.
  • the second colored insulating layer 15 (here, the blue insulating layer 15B) is formed on the glass substrate 10 on which the red insulating layer 15R is formed.
  • the blue insulating layer 15B can be formed by executing the steps shown in FIGS.
  • a blue coloring material is applied on the glass substrate 10 shown in FIG. 3A so as to cover the red insulating layer 15R.
  • a photomask 50 having an opening 52 that defines the position and shape of the blue insulating layer 15B is disposed above the glass substrate 10.
  • a coating film made of a blue coloring material is exposed through the photomask 50 to obtain a portion (exposure portion) 16 that becomes the blue insulating layer 15B.
  • the exposed portion 16 that becomes the blue insulating layer remains on the glass substrate 10.
  • the exposed portion 16 is cured to obtain the blue insulating layer 15B.
  • the third colored insulating layer 15 (green insulating layer 15G) is colored on the glass substrate 10 so as to cover the red insulating layer 15R and the blue insulating layer 15B.
  • Deposit material 17 (green colored material 17G).
  • a coating film made of the green coloring material 17G is formed on the entire surface of the glass substrate 10 by applying the green coloring material 17G on the glass substrate 10.
  • the green coloring material 17G is cured.
  • the green coloring material 17G is baked and hardened by baking the green coloring material 17G.
  • the coating film made of the cured green coloring material 17G is etched (see arrow 55). Specifically, the cured green coloring material 17G is etched until the surfaces of the red insulating layer 15R and the blue insulating layer 15B are exposed.
  • the green coloring material 17G is etched by ashing (ashing) the cured green coloring material 17G.
  • etching is performed by ashing a layer (resin layer) made of a resin material, for example, by plasma treatment or the like.
  • the photoresist material is removed by plasma treatment or the like.
  • a process Specifically, the ashing of the present embodiment is performed so that the red insulating layer and the blue insulating layer are exposed and the entire color filter is smoothed.
  • the green insulating layer is combined with the red insulating layer 15R and the blue insulating layer 15B. 15G is obtained.
  • the array substrate 200 including the red insulating layer 15R, the blue insulating layer 15B, and the green insulating layer 15G can be obtained by executing the steps shown in FIGS.
  • overetching of the green coloring material 17G is further performed. (Additional ashing) may be executed.
  • the manufacturing method of this embodiment it is necessary to execute three photolithography processes to form the first to third colored insulating layers.
  • the number of executions of the photolithography process is more than that. Can be reduced. That is, the two colored insulating layers 15 of the first colored insulating layer (for example, the red insulating layer 15R) and the second colored insulating layer (for example, the blue insulating layer 15B) are manufactured using a photolithography process.
  • the remaining third colored insulating layer of one color (for example, the green insulating layer 15G) is formed by depositing (for example, applying) a third coloring material (for example, green coloring material 17G) and etching (for example, ashing).
  • the third colored insulating layer for example, the green insulating layer 15G
  • the third colored insulating layer can be formed without using the photolithography step.
  • the number of masks to be used can be reduced by reducing the number of photolithography processes, so that the manufacturing cost of the liquid crystal panel 100 can be reduced.
  • the number of times of the photolithography process it is possible to reduce the occurrence rate of development failure of the colored insulating layer 15, and thus the yield can be improved.
  • the manufacturing method of the present embodiment it is possible to easily manufacture the liquid crystal panel 100 that uses the colored insulating layer (interlayer insulating film) 15 as a color filter.
  • the colored insulating layer (interlayer insulating film) 15 made of a translucent resin material functions as a color filter layer
  • the color filter layer is provided on the counter substrate side. Compared with the case of, the problem of misalignment of bonding with the counter substrate can be avoided. That is, in the liquid crystal panel 100 of the present embodiment, the colored insulating layer 15 that functions as a color filter layer is formed on the array substrate 10 side, so that a more precise control of the formation region can be performed, and as a result, fine pattern pixels can be formed. Can also respond.
  • the color filter layer is produced by forming the insulating layer (interlayer insulating film) 15 in the array substrate 10. The process can be simplified, and as a result, a liquid crystal panel can be manufactured at low cost.
  • the first colored insulating layer 15 is the red insulating layer 15R
  • the second colored insulating layer 15 is the blue insulating layer 15B
  • the third colored insulating layer 15 is the green insulating layer 15G.
  • the first colored insulating layer 15 may be the green insulating layer 15G or the blue insulating layer 15B.
  • the third colored insulating layer 15 may be the red insulating layer 15R or the blue insulating layer 15B instead of the green insulating layer 15G.
  • the second colored insulating layer 15 may be replaced with the red insulating layer 15R or the green insulating layer 15G instead of the blue insulating layer 15B.
  • FIGS. 4A to 4E are process cross-sectional views for explaining a manufacturing method according to the second embodiment of the present invention.
  • the green colored material 17G is etched by ashing the green colored material (third colored material) 17G.
  • Etching of the green coloring material 17G may be performed using an etchant that can control the etching of the green coloring material 17G.
  • the green coloring material 17G can be etched by physically removing the green coloring material 17G using a polishing tool such as a grindstone.
  • a polishing tool such as a grindstone.
  • a red insulating layer 15R (first colored insulating layer) is formed on a glass substrate (array substrate) 10.
  • the formation method of the red insulating layer 15R can be the same as the method of the first embodiment.
  • the red insulating layer 15R can be formed using a photolithography process.
  • a blue insulating layer 15B (second colored insulating layer) is formed on the glass substrate 10. Specifically, the blue insulating layer 15B is formed using a photolithography process.
  • the blue insulating layer 15B is formed on the glass substrate 10 so that a part 15e (B) of the blue insulating layer 15B overlaps the red insulating layer 15R. That is, the blue insulating layer 15B is formed such that a part (end portion) 15e of the blue insulating layer 15B overlaps with an end portion of the red insulating layer 15R. More precisely, although it is desirable that the blue insulating layer 15B be accurately formed at a position adjacent to the red insulating layer 15R, in this example, a part of the blue insulating layer 15B ( The blue insulating layer 15B may be formed so that the end portion 15e overlaps the end portion of the red insulating layer 15R.
  • a green coloring material 17G constituting the green insulating layer 15G is deposited on the glass substrate 10 so as to cover the red insulating layer 15R and the blue insulating layer 15B. Specifically, a coating film made of the green coloring material 17G is formed on the entire surface of the glass substrate 10 by applying the green coloring material 17G on the glass substrate 10. Thereafter, the green coloring material 17G is cured. Specifically, the green coloring material 17G is baked and hardened by baking the green coloring material 17G.
  • the coating film made of the hardened green coloring material 17G is etched by the grindstone 60 (see arrow 65). Specifically, the surface of the cured green coloring material 17G is scraped off so that the surfaces of the red insulating layer 15R and the blue insulating layer 15B are exposed. At this time, a part 15e (B) of the blue insulating layer 15B can also be scraped (removed) by the grindstone 60. That is, by polishing and removing the grindstone 60, the surface of the cured green coloring material 17G is scraped until the surfaces of the red insulating layer 15R and the blue insulating layer 15B are exposed. At that time, the overlapping portion 15e of the blue insulating layer 15B is removed. Can also be removed.
  • the grindstone 60 of this embodiment is comprised from a diamond, a silica, etc., for example.
  • the array substrate 200 including the red insulating layer 15R, the blue insulating layer 15B, and the green insulating layer 15G can be obtained.
  • the excess overlap portion 15 e can be removed by the grindstone 60, so that in the formation of the colored insulating layer 15 It is possible to slightly increase the tolerance of positional deviation.
  • physical damage to the colored insulating layer 15 (15R, 15B, 15G) can be reduced as compared with the removal of the ashing process in the first embodiment described above. In other words, when the ashing process is performed, there is a possibility that physical damage such as surface roughness due to plasma, and alteration / discoloration due to substrate heating may be given to the colored insulating layer 15.
  • the colored insulating layer 15 (15R, 15B, 15G) is formed not by the ashing process but by polishing removal with the grindstone 60, so that damage as in the ashing process is avoided. Can do.
  • the number of executions of the photolithography process can be reduced also in the manufacturing method of the second embodiment. Since the number of masks to be used can be reduced by reducing the number of photolithography processes, the manufacturing cost of the liquid crystal panel 100 can be reduced. In addition, by reducing the number of times of the photolithography process, it is possible to reduce the occurrence rate of development failure of the colored insulating layer 15, and thus the yield can be improved.
  • FIGS. 5A to 5D are process cross-sectional views for explaining the manufacturing method according to the third embodiment of the present invention.
  • FIG. 6 schematically shows the upper surface configuration of the array substrate 210 shown in FIG.
  • ribs (convex portions) 75 that regulate the alignment of the liquid crystal molecules 42 are formed on the surface of the array substrate 200 obtained in the first and second embodiments described above. it can.
  • a photoresist 70 is applied on the red insulating layer 15R, the blue insulating layer 15B, and the green insulating layer 15G. .
  • a photomask 80 having openings 82 that define the positions and shapes of the ribs 75 is disposed above the array substrate 200 to which the photoresist 70 is applied.
  • irradiation light typically ultraviolet rays
  • the photoresist 70 is developed so as to remove the photoresist 70 in other portions while leaving the exposed resist pattern 72 portion. More specifically, this development process leaves a resist pattern 72 defining ribs 75 on the red insulating layer 15R, the blue insulating layer 15B, and the green insulating layer 15G.
  • the surfaces of the red insulating layer 15R, the blue insulating layer 15B, and the green insulating layer 15G are scraped off by ashing.
  • the region immediately below the resist pattern 72 is not subjected to ashing, while the surface of the other region is scraped, so that a rib (convex portion) 75 can be formed.
  • ribs 75 are formed on the surfaces of the red insulating layer 15R, the blue insulating layer 15B, and the green insulating layer 15G, as shown in FIG. Become.
  • the rib 75 has a pattern of vertical alignment ribs that defines the vertical alignment of the liquid crystal molecules 42 as shown in FIG. In this way, the array substrate 210 including the red insulating layer 15R, the blue insulating layer 15B, and the green insulating layer 15G on which the ribs 75 are formed can be obtained.
  • the rib 75 defining the alignment of the liquid crystal molecules 42 is formed on the surfaces of the red insulating layer 15R, the blue insulating layer 15B, and the green insulating layer 15G by executing the ashing process. be able to. Therefore, in the manufacturing method of the third embodiment, the rib 75 can be formed on each colored insulating layer 15 itself in the red insulating layer 15R, the blue insulating layer 15B, and the green insulating layer 15G. There is no need to do.
  • a photoresist mask is prepared on the coating film by a photolithography process, and then the coating film is etched using the photoresist mask as a mask. After that, the photoresist mask needs to be removed by ashing. Therefore, the yield can be improved and the process can be reduced as compared with the case where it is separately manufactured.
  • FIG. 7A to 7F are process cross-sectional views for explaining a manufacturing method according to the fourth embodiment of the present invention.
  • etching for example, ashing
  • etching stopper layer 19 is formed on the surfaces of the red insulating layer 15R and the blue insulating layer 15B, and the etching end point can be detected by the etching stopper layer 19.
  • a red insulating layer 15R (first colored insulating layer) is formed on a glass substrate (array substrate) 10.
  • a blue insulating layer 15 ⁇ / b> B (second colored insulating layer) is formed on the glass substrate 10.
  • the red insulating layer 15R and the blue insulating layer 15B can be formed using a photolithography process as described above.
  • an etching stopper layer 19 is formed on the red insulating layer 15R and the blue insulating layer 15B. Specifically, an etching stopper layer 19 is deposited on the glass substrate 10 so as to cover the red insulating layer 15R and the blue insulating layer 15B. The thickness of the etching stopper layer 19 is, for example, 100 to 1000 mm.
  • the etching stopper layer 19 is made of a material different from the material constituting the red insulating layer 15R and the blue insulating layer 15B.
  • the etching stopper layer 19 of the present embodiment is, for example, a nitride film (for example, a silicon nitride film).
  • the etching stopper layer 19 includes a material that detects the end of etching. More specifically, since the material constituting the etching stopper layer 19 emits an emission spectrum different from the emission spectrum of the plasma generated when the colored insulating layer 15 is ashed, the etching (here, the emission spectrum is detected). It can be used to detect the end point of ashing.
  • a green coloring material 17G constituting the green insulating layer 15G (third colored insulating layer) is deposited on the surface of the etching stopper layer 19. Specifically, a green coloring material 17G is applied on the glass substrate 10 so as to cover the red insulating layer 15R and the blue insulating layer 15B on which the etching stopper layer 19 is formed. Thereafter, the green coloring material 17G is cured. Specifically, the green coloring material 17G is baked and hardened by baking the green coloring material 17G.
  • the coating film made of the cured green coloring material 17G is etched (see arrow 55). Specifically, the cured green coloring material 17G is etched until the etching stopper layer 19 formed on the surfaces of the red insulating layer 15R and the blue insulating layer 15B is exposed.
  • ashing of the green coloring material 17G is performed while ashing the cured green coloring material 17G until an emission spectrum (that is, an etching termination spectrum) generated by the material constituting the etching stopper layer 19 is generated.
  • an emission spectrum that is, an etching termination spectrum
  • ashing of the green coloring material 17G is stopped.
  • the green insulating layer 15G is obtained together with the red insulating layer 15R and the blue insulating layer 15B as shown in FIG.
  • the etching stopper layer 19 should be removed if it is better to remove the etching stopper layer 19 while including the etching stopper layer 19.
  • the array substrate 220 including the red insulating layer 15R, the blue insulating layer 15B, and the green insulating layer 15G can be obtained.
  • the etching stopper layer 19 may be left, in order to reduce the possibility of color bleeding caused by the remaining green coloring material 17, the etching stopper layer 19 and the green coloring material 17 ⁇ / b> G are further overloaded. Etching (additional ashing) may be performed.
  • the etching accuracy of the colored insulating layer 15 can be improved by forming the etching stopper layer 19. Therefore, the management accuracy of the color reproducibility of the color filter layer can be improved. As a result, the effects of improving the display quality of the liquid crystal panel 100, reducing production variations, and improving production reproducibility can be obtained.
  • FIG. 8A to 8D are process cross-sectional views for explaining a manufacturing method according to the fifth embodiment of the present invention.
  • the liquid crystal panel 100 of the above-described embodiment includes the colored insulating layers 15 (15R, 15G, and 15B) made of the three primary colors of red (R), green (G), and blue (B).
  • the liquid crystal panel 100 includes a colored insulating layer 15 composed of four primary colors of red (R), green (G), blue (B), and yellow (Y).
  • a color filter layer composed of four primary colors a wider color reproduction range can be displayed compared to a color filter layer composed of three primary colors.
  • the manufacturing method according to the embodiment of the present invention described above after performing the photolithography process three times, the colored insulating layer 15 is not used for the remaining one color colored insulating layer 15 without using the photolithography process. Can be formed.
  • green is generated by mixing yellow and blue, thereby generating four colors of colored insulating layers 15 (15R, 15G, 15B, and 15Y) using three colors of coloring materials.
  • the colored insulating layer 15 (15R, 15G, 15B, 15Y) of 4 colors is formed using two photolithographic processes.
  • a yellow insulating layer 15Y is formed on a glass substrate (array substrate) 10.
  • the yellow insulating layer 15Y shown in FIG. 8A includes a yellow pixel region 15y that defines a yellow pixel and a green pixel region 15g that defines a green pixel. Therefore, the yellow insulating layer 15Y shown in FIG. 8A has a size of two pixel areas, that is, a yellow pixel area 15y and a green pixel area 15g.
  • the thickness of the portion 15f (Y) corresponding to the green pixel region 15g is smaller than the thickness of the portion corresponding to the yellow pixel region 15y.
  • the thickness of the portion corresponding to the green pixel region 15g is approximately half the thickness of the portion corresponding to the yellow pixel region 15y.
  • the thickness of the portion 15f (Y) corresponding to the green pixel region 15g is 0.5 to 1.5 ⁇ m.
  • the thickness of the portion 15f (Y) corresponding to the green pixel region 15g is 40 to 60, for example.
  • a portion 15f (Y) corresponding to the green pixel region 15g in the yellow insulating layer 15Y shown in FIG. 8A is a region (90) formed by halftone exposure. More specifically, the yellow insulating layer 15Y is produced by a photolithography process using a halftone mask (or a gray tone mask).
  • the halftone mask is a mask having a semi-transmissive portion in which the exposure amount is partially controlled in the photomask of the photolithography process, and a layer having an intermediate film thickness is formed using the halftone mask. It becomes possible.
  • the semi-transmissive portion of the halftone mask can be constructed by a film having an arbitrary transmittance, a slit, or the like.
  • a red insulating layer 15R is formed on the glass substrate 10 on which the yellow insulating layer 15Y is formed.
  • the red insulating layer 15R can be formed by performing the steps shown in FIGS.
  • a blue coloring material 17B is deposited on the glass substrate 10 so as to cover the yellow insulating layer 15Y and the red insulating layer 15R.
  • the blue coloring material 17B is applied on the glass substrate 10 on which the yellow insulating layer 15Y and the red insulating layer 15R are formed.
  • the portion 15f (Y) corresponding to the green pixel region 15g in the yellow insulating layer 15Y is filled with the blue coloring material 17B.
  • the blue coloring material 17B is cured.
  • the blue coloring material 17B is baked and hardened by baking the blue coloring material 17B.
  • the coating film made of the cured blue coloring material 17B is etched. Specifically, the hardened blue coloring material 17B is ashed until the surface of the portion corresponding to the yellow pixel region 15y in the yellow insulating layer 15Y and the surface of the red insulating layer 15R are exposed. Then, as shown in FIG. 8D, a blue insulating layer 15B is obtained. Then, together with the red insulating layer 15R and the blue insulating layer 15B, there are a green insulating layer 15G formed by color mixture and a portion of the yellow pixel region 15y in the yellow insulating layer 15Y (may be referred to as the yellow insulating layer 15Y again). Produced.
  • the green insulating layer 15G of the present embodiment is green when the blue filling portion 15f (B) and the portion 15f (Y) corresponding to the green pixel region 15g in the yellow insulating layer 15Y are mixed, as viewed from the direction of the arrow 95. It has become. Therefore, in developing the green color of the green insulating layer 15G, the transmittance, the type / content of pigment, and the film thickness of the blue filling portion 15f (B) and the portion 15f (Y) corresponding to the green pixel region 15g, respectively. A suitable thing is prescribed
  • the array substrate 230 in the fifth embodiment that is, the portion of the yellow pixel region 15y (yellow insulating layer 15Y) in the red insulating layer 15R, the blue insulating layer 15B, the green insulating layer 15G, and the yellow insulating layer 15Y is colored.
  • An array substrate 230 serving as a filter layer can be obtained.
  • the color insulating layers 15 (15R, 15G, 15B, and 15Y) of four colors are formed of three color materials by generating green by mixing yellow and blue. Can be formed. Therefore, since the green insulating layer 15G can be manufactured without using a green coloring material, it is possible to realize a cost reduction associated with the removal of one coloring material.
  • the array substrate 230 can be manufactured by two photolithography steps, whereas it is originally necessary to perform four photolithography steps. Therefore, the number of masks (photomasks) to be used can be reduced by reducing the number of photolithography processes, and thus the manufacturing cost of the liquid crystal panel 100 can be reduced. In addition, by reducing the number of times of the photolithography process, it is possible to reduce the occurrence rate of development failure of the colored insulating layer 15, and thus the yield can be improved.
  • FIG. 9 is a cross-sectional view schematically showing the configuration of the array substrate 300 according to the sixth embodiment of the present invention.
  • FIGS. 10A to 10F are process cross-sectional views for explaining the manufacturing method according to the sixth embodiment of the present invention.
  • the array substrate 300 shown in FIG. 9 has a colored insulating layer 15 (15R, 15G, 15B) on a glass substrate 10 (that is, an array substrate on which TFTs are formed or a translucent substrate on which TFTs are formed).
  • the colored insulating layer 15 can be manufactured by the method described in the first to fifth embodiments.
  • the array substrate 300 of this embodiment is a 3D (three-dimensional) display substrate, and in particular, a viewer (viewer) 350 of the liquid crystal panel can see 3D display with the naked eye.
  • the array substrate 300 is disposed on the side facing the viewer (viewer) 350.
  • a transparent resin portion (transparent resist portion) 90 having a curved portion (lens defining portion) 90 a that defines a lens shape is formed on the surface of the glass substrate 10.
  • the surface of the transparent resin portion (transparent resin film) 90 is made of a material having a refractive index different from that of the transparent resin portion 90 (for example, a transparent resin material such as a resist material or polyimide), and has a lens layer 95 having a lens function. Is formed.
  • a colored insulating layer 15 (15R, 15G, 15B) is formed on the surface of the lens layer 95.
  • the lens array constructed from the lens layer 95 allows the viewer (viewer) 350 to independently view the right-eye pixels for the right eye and the left-eye pixels for the left eye. Can enter the field of view of the person 350. That is, the parallax image can be presented to the viewer 350 by the lens array including the lens layer 95. And according to the structure of this embodiment, the advantage that the number of parts for implement
  • the lens array (95) can be formed together with the colored insulating layer (color filter layer) 15, the realization of the naked eye 3D can be easily achieved even for a high-precision display. Can do. That is, when the lens array is configured by another member, there is a problem that an accurate 3D image cannot be presented when the lens array is misaligned.
  • the lens array ( 95) is integrally formed with the colored insulating layer (color filter layer) 15, so that such a problem can be avoided.
  • a transparent resist 91 is applied on a glass substrate (array substrate) 10, and the transparent resist 91 is cured.
  • the etching region 91a is exposed using a mask (photomask) 92 having an opening 92a for defining the lens shape.
  • the etching region 91 of the resist film 91 is removed by development to form a lens pattern 91c.
  • dry ashing is performed to adjust the corners of the lens pattern 91c, and the transparent resin portion 90 having a suitable lens shape 90a is formed. If the transparent resin portion 90 having a suitable lens shape 90a can be formed only by a photolithography process without performing dry ashing, such a process may be performed.
  • a transparent resist (or transparent resin) having a refractive index different from that of the transparent resin portion 90 is applied to the surface of the transparent resin portion 90 having the lens shape 90a. Is cured. Then, a lens layer 95 having a lens function is formed. Thereafter, as shown in FIG. 10F, when the colored insulating layer 15 (15R, 15G, 15B) is formed on the surface of the lens layer 95, the array substrate 300 of this embodiment is completed.
  • the colored insulating layer 15 can be manufactured by the method described in the first to fifth embodiments.
  • the colored insulating layer 15 can also be made of four primary color insulating layers of red (R), green (G), blue (B), and yellow (Y).
  • the array substrate 310 shown in FIG. 11 is a parallax barrier type 3D (three-dimensional) display substrate, and can particularly provide a naked-eye 3D display.
  • the array substrate 310 is disposed on the side facing the viewer (viewer) 350, and the right eye pixel and the left eye pixel of the left eye are independently viewed by the viewer 350.
  • a parallax barrier layer 96 having convex portions that can enter the field of view of 350 is formed on the surface of the glass substrate 10.
  • a transparent resin portion 97 (for example, a transparent resin material such as a resist material or polyimide) is formed on the surface of the parallax barrier layer 96.
  • a colored insulating layer 15 (15R, 15G, 15B) is formed on the surface of the transparent resin portion 97.
  • the colored insulating layer 15 can be produced by the method described in the first to fifth embodiments.
  • the parallax barrier layer 96 allows the right eye pixel of the viewer (viewer) 350 and the left eye pixel of the left eye to be independently viewed by the viewer 350. Can be put. That is, the parallax image can be presented to the viewer 350 by the parallax image convex portion in the parallax barrier layer 96. And according to the structure of this embodiment, the advantage that the number of components for implement
  • the parallax barrier layer 96 can be formed together with the colored insulating layer (color filter layer) 15, so that realization of the naked eye 3D can be easily achieved even for a high-precision display. it can. That is, when the parallax barrier layer is configured by a separate member, there is a problem in that an accurate 3D image cannot be presented when the position shift of the parallax barrier layer occurs. Since the barrier layer 96 is integrally formed with the colored insulating layer (color filter layer) 15, such a problem can be avoided.
  • a transparent resist 98 is applied on a glass substrate (array substrate) 10, and the transparent resist 98 is cured.
  • the projection 98a of the parallax barrier layer remains using a mask (photomask) 99 having an opening 99a for defining the projection of the parallax barrier layer 96.
  • the exposure is performed as follows.
  • the exposure pattern (opening 99a) is reversed depending on whether the transparent resist 98 is positive or negative.
  • a parallax barrier layer 96 is formed.
  • a transparent resin portion (transparent resin layer) 97 is formed on the surface of the glass substrate 10 so as to cover the parallax barrier layer 96.
  • the transparent resin portion 97 functions as a spacer layer for taking an appropriate distance between the parallax barrier layer 96 and the colored insulating layer (color filter layer) 15.
  • the colored insulating layer 15 15R, 15G, 15B
  • the colored insulating layer 15 can be manufactured by the method described in the first to fifth embodiments.
  • the colored insulating layer 15 can also be made of four primary color insulating layers of red (R), green (G), blue (B), and yellow (Y).
  • the technology described in the claims includes various modifications and changes of the specific examples illustrated above.
  • the elements of the above-described embodiments can be applied to each other.
  • the polishing technique of the second embodiment can be applied to other embodiments
  • the rib forming technique of the third embodiment can be applied to other embodiments.
  • the technique of the etching stopper layer of the fourth embodiment can be applied to the configuration of the fifth embodiment, for example.
  • the lens layer 95 and the parallax barrier layer 96 in the sixth embodiment are exemplifications, and any other structure can be adopted as long as the layer capable of realizing the naked eye 3D can be integrally formed on the array substrate. It is.
  • the present invention it is possible to provide a manufacturing method capable of easily manufacturing a liquid crystal panel using a colored insulating layer as a color filter.

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Abstract

L'invention concerne un panneau à cristaux liquides, qui utilise une couche isolante colorée comme un filtre coloré, qui est facilement fabriqué. Ce procédé de fabrication d'un panneau à cristaux liquides comprend les étapes suivantes. Après préparation d'un substrat réseau (10) qui comprend un transistor en couches minces (30), une première couche isolante colorée (15R) qui est formée d'une première matière colorée (14R) est formée sur le substrat réseau (10). Ensuite, une deuxième couche isolante colorée (15B) qui est formée d'une deuxième matière colorée est formée sur le substrat réseau (10). Après ceci, une troisième matière colorée (17G) est déposée sur le substrat réseau (10) de façon à couvrir la première couche isolante colorée (15R) et la deuxième couche isolante colorée (15B). Une troisième couche isolante colorée (15G) qui est formée de la troisième matière colorée (17G) est formée par gravure de la surface de la troisième matière colorée déposée (17G).
PCT/JP2012/065576 2011-06-21 2012-06-19 Procédé de fabrication de panneau à cristaux liquides et panneau à cristaux liquides WO2012176752A1 (fr)

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JP2011-137644 2011-06-21

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11242225A (ja) * 1997-06-12 1999-09-07 Fujitsu Ltd 液晶表示装置
JP2005078094A (ja) * 2003-08-30 2005-03-24 Sharp Corp マルチプルビュー方向性ディスプレイ
JP2005301284A (ja) * 2004-04-13 2005-10-27 Lg Phillips Lcd Co Ltd 液晶表示パネルおよびその製造方法
JP2007248662A (ja) * 2006-03-15 2007-09-27 Sharp Corp カラーフィルタの形成方法、カラーフィルタ、固体撮像素子および液晶駆動素子
JP2007256795A (ja) * 2006-03-24 2007-10-04 Toshiba Matsushita Display Technology Co Ltd カラーフィルタ基板の製造方法
JP2008176016A (ja) * 2007-01-18 2008-07-31 Dainippon Printing Co Ltd カラーフィルタの製造方法およびカラーフィルタ
JP2008292629A (ja) * 2007-05-23 2008-12-04 Fujifilm Corp カラーフィルタの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11242225A (ja) * 1997-06-12 1999-09-07 Fujitsu Ltd 液晶表示装置
JP2005078094A (ja) * 2003-08-30 2005-03-24 Sharp Corp マルチプルビュー方向性ディスプレイ
JP2005301284A (ja) * 2004-04-13 2005-10-27 Lg Phillips Lcd Co Ltd 液晶表示パネルおよびその製造方法
JP2007248662A (ja) * 2006-03-15 2007-09-27 Sharp Corp カラーフィルタの形成方法、カラーフィルタ、固体撮像素子および液晶駆動素子
JP2007256795A (ja) * 2006-03-24 2007-10-04 Toshiba Matsushita Display Technology Co Ltd カラーフィルタ基板の製造方法
JP2008176016A (ja) * 2007-01-18 2008-07-31 Dainippon Printing Co Ltd カラーフィルタの製造方法およびカラーフィルタ
JP2008292629A (ja) * 2007-05-23 2008-12-04 Fujifilm Corp カラーフィルタの製造方法

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