WO2012173379A2 - 반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓 - Google Patents
반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓 Download PDFInfo
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- WO2012173379A2 WO2012173379A2 PCT/KR2012/004638 KR2012004638W WO2012173379A2 WO 2012173379 A2 WO2012173379 A2 WO 2012173379A2 KR 2012004638 W KR2012004638 W KR 2012004638W WO 2012173379 A2 WO2012173379 A2 WO 2012173379A2
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- WIPO (PCT)
- Prior art keywords
- semiconductor chip
- contact
- contact terminal
- terminal
- test
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
Definitions
- the present invention relates to a semiconductor chip test pin and a semiconductor chip test socket including the same, and more particularly, a natural approach to the semiconductor chip and the contact with the test terminal is securely made to improve the test reliability, and the semiconductor chip terminal
- the pins for semiconductor chip test that can reduce the cost and reduce the number of parts and prevent the parts from being damaged by being able to turn over to the other contact terminal when the wear of one contact terminal is not only small.
- the present invention relates to a socket for testing a semiconductor chip.
- the semiconductor chip package is tested for electrical characteristics, functional characteristics, and product response speeds to determine whether the circuit of the semiconductor chip package is operating properly to select good or bad products of the semiconductor chip package.
- the testing process has become very important.
- an alignment plate 120 as shown in FIG. 1A is placed on a socket housing 110 as shown in FIG.
- the robot arm also referred to as a 'handler'
- a test installed in the base plate 111 of the socket housing 110. The test was conducted by bringing the pin 112 into contact with the input / output terminal L of the semiconductor chip S.
- the test pin 112 which is most used in the current market, has an approximately 'S' shape, and each of the bent portions (that is, the rotational center point) is made of an elastomer material.
- the test pin 112 is rotated while the coaxial 113 and 114 are supported, and the upper part contacts the input / output terminal L of the semiconductor chip S, and the lower part receives a test signal. The test was made by contacting the test terminal T to be applied.
- the test pin 112 is supported by two rotary shafts 113 and 114 made of an elastomer, and thus, when the rotary shafts 113 and 114 are pressed by the semiconductor chip S, the cross-sectional change is, of course, of course.
- the test pin 112 was supported to rotate in a state where a slight bending occurred, and when the pressing force by the semiconductor chip S disappeared, the test pin 112 was returned to its original state by the elastic restoring force of the elastomer.
- test pin 112 does not contact in the correct posture as the rotation shafts 113 and 114 are also deformed in a direction perpendicular to the rotation direction of the test pin 112, the contact of the test pin 112 does not occur or is targeted.
- a poor contact such as contacting the other input and output terminals (L) that do not, such a problem was more serious by using two rotary shafts (113, 114).
- the inner small circle (indicated by a solid line) of the two gardens is a pivot center circle supported by the rotating shaft 114, and the large large circle (indicated by a dashed line) on the outside is the test pin 112.
- the rotation radius when the test terminal (T) is in contact is shown, but the rotation radius is relatively small while the force is concentrated, the test pin 112 as well as the test terminal (T) has a problem that the wear is severe.
- the above problems not only accelerate the wear of the test pin 112 or the test terminal (T), but also relatively expensive and takes a lot of time to replace, compared to the thin cylindrical shape made of a small durability of the rotating shaft 113 , 114, as well as the damage of the base plate 111 on which the rotary shafts 113 and 114 are installed.
- semiconductor chip test sockets which must be used in high-performance semiconductor chip test processes, are mostly foreign-manufactured and depend entirely on imports. These semiconductor chip test sockets have a short life and damage to products used together despite being expensive. There was a problem.
- the present invention has been proposed to solve the above-mentioned problems, and the movement approaching the semiconductor chip is natural and the contact with the test terminal is made surely, thereby improving the test reliability, and the degree of wear occurring when the contact with the semiconductor chip terminal occurs.
- the contact terminal when one side of the contact terminal is worn out, it can be used as the other side of the contact terminal to reduce the cost, while providing a chip for the semiconductor chip test pin and a socket for the semiconductor chip test including the same to reduce the number of components and prevent damage to the components. I would like to.
- the semiconductor chip test pins according to the present invention each have a shape inclined toward an outer upper side thereof, so as to be in contact with a signal input / output terminal of a semiconductor chip placed thereon, the pair of first contact terminals; A second contact terminal disposed at a lower center between the pair of first contact terminals, the bottom surface of which is bent in a circumference shape and in contact with a test terminal; And a pair of connection frames configured to connect one end of the second contact terminal to the first contact terminal, and to connect the other end of the second contact terminal and the other of the second contact terminal.
- a circular groove is formed at the center of the upper surface of the second contact terminal so that the rotation center axis is fitted, and the rotation center axis is fixed to both upper ends of the circular groove, respectively, and the pair of first contact terminals. It is characterized in that the mounting groove for the installation of the elastic body to apply a tension (tension) to maintain the horizontal.
- the first contact terminal preferably has an inclination angle of 30 ° to 45 ° with respect to the horizontal plane.
- the width of the lower surface of the second contact terminal is narrower than the width between the ends of the pair of first contact terminals, the lower surface of the circumferentially curved second contact terminal as a support surface, It is preferable that the first contact terminal swings left and right about the rotation center axis.
- the radius of curvature of the lower surface of the second contact terminal is larger than the radius of curvature of the pivot center axis, the lower surface of the second contact terminal bent in the circumferential shape as a support surface, with respect to the pivot center axis
- the second contact terminal is rotated in an elliptical direction.
- the outer side of the seating groove is provided with a wall surface formed by the inner surface of the connecting frame, respectively, so that the bottom and side surfaces of the elastic body made of a square pillar shape is inserted into the space surrounded by the seating groove and the wall surface. desirable.
- a groove for increasing the rotational force in the circumferential shape is formed on the outer surface of the connecting frame.
- the pair of first contact terminals and the connection frame may be configured to be symmetrical to each other, and an identification part may be displayed on one of the first contact terminals, or an identification part may be displayed on one of the connection frames. It is preferable that it is done.
- the pair of first contact terminals have different shapes, or the connecting frame has different shapes.
- the semiconductor chip test socket according to the present invention is a semiconductor chip test pin made of a shape as described above; A pivot center shaft fitted into a circular groove formed on an upper surface of the second contact terminal and configured to have a circular column shape; And an elastic body fixed to an upper portion of the pivot center axis, placed in the seating groove, and having a square pillar shape.
- the rotational central axis is made of an engineering plastic material having a low surface resistance.
- the elastic body is preferably made of an elastomer (elastomer).
- the movement to approach the semiconductor chip is natural, and the contact with the test terminal is made securely to improve the test reliability.
- the wear rate generated when contacting the semiconductor chip terminal is small, and at the time of wear of one contact terminal, the other contact terminal can be used upside down, thereby reducing the cost.
- FIG. 1 shows a socket for a semiconductor chip test according to the prior art.
- FIG. 2 is a first operation state diagram of a socket for a semiconductor chip test according to the prior art.
- FIG. 3 is a second operation state diagram of a socket for a semiconductor chip test according to the prior art.
- FIG. 4 is a third operation state diagram of a socket for a semiconductor chip test according to the prior art.
- FIG. 5 is a front view showing a semiconductor chip test pin according to the present invention.
- FIG. 6 is a partial perspective view showing a socket for a semiconductor chip test according to the present invention.
- FIG. 7 is an operation state diagram of a socket for a semiconductor chip test according to the present invention.
- FIG. 8 is a first comparison diagram of a semiconductor chip test pin according to the present invention and the prior art.
- FIG. 9 is a second comparison diagram of the semiconductor chip test pin according to the present invention and the prior art.
- FIG. 10 is a front view showing a semiconductor chip test socket according to another embodiment of the present invention.
- first contact terminal 212 second contact terminal
- the semiconductor chip is provided as a package type as an example.
- the present invention is not limited thereto, and it may be obvious that the present invention may be applied to a semiconductor chip before the package if a test is required.
- an input / output pad (I / O pad) as an input / output terminal provided in the semiconductor chip will be described as an example, but the present invention includes a chip in the form of a lead or solder ball, and the like. As long as the test can be performed by touching, it is obvious that it can be applied to other types of terminals.
- the semiconductor chip described below will be mainly used in active devices including transistors, but can also be applied to passive devices including inductors, capacitors, or resistors, and further includes all that are referred to as integrated circuit (IC) chips. Will be self explanatory.
- the semiconductor chip test pin 210 is in contact with a data input / output terminal (hereinafter, referred to as an “input / output terminal”) L of a semiconductor chip S largely placed thereon.
- the first contact terminal 211 and the second contact terminal 212 and the first contact terminal 211 in contact with the test terminal (hereinafter referred to as a "test terminal") T for applying a test signal.
- the input / output terminal L of the semiconductor chip S is formed.
- the first contact terminal 211 of the present invention is pressed, the first contact terminal 211 integrally formed with the first contact terminal 211 and the second contact terminal 212 simultaneously rotate as a seesaw, and the first contact terminal 211 is The second contact terminal 212 is in contact with the input / output terminal L, and the second contact terminal 212 is in contact with the test terminal T to check the electrical characteristics, the functional characteristics, the response speed of the product, and the like.
- the first contact terminal 211 has a shape inclined toward the outer upper portion so as to be in contact with the input / output terminal L of the semiconductor chip S disposed thereon, and the second contact terminal ( 212 is formed as a pair spaced apart from each other and rotates to the left and right like a seesaw (ie, swinging) while contacting the input and output terminals (L).
- the first contact terminal 211 disposed on one side of the pair is worn, the first contact terminal 211 disposed on the other side can be used upside down, thereby increasing the service life at least twice.
- each of the first contact terminals 211 preferably has an inclination angle ⁇ of 30 ° to 45 ° with respect to the horizontal plane H, which means that the inclination angle ⁇ of the first contact terminal 211 is less than 30 °.
- it is difficult to guarantee the test reliability because the contact force with the input / output terminal L is small, and when it exceeds 45 °, the friction or the impact between the first contact terminal 211 and the input / output terminal L is large, so that the pin for the semiconductor chip test ( This is because the durability of 210 is lowered.
- the second contact terminal 212 is in contact with the test terminal T (also called 'PCB tracer') to transfer a test signal input through the test terminal T to the input / output terminal L of the semiconductor chip S.
- the lower contact center is disposed between the pair of first contact terminals 211, and the bottom surface thereof is curved in a circumference shape.
- the bottom surface of the curved second contact terminal 212 is supported as the support surface.
- the second contact terminal 212 contacts the test terminal T while rotating to the left and right (figure) based on the seesaw.
- the second contact terminal 212 may also be used by flipping to the bottom of the other side when the bottom of one side is worn on the basis of the center of the width direction, thereby doubling the life as described above.
- the width L1 of the lower surface of the second contact terminal 212 is preferably smaller than the width L2 between the ends of the pair of first contact terminals 211, which is the second contact terminal 212. If the lower surface width L1 of N is narrower, the center point of the force applied by the lowering of the semiconductor chip S (that is, the end of the first contact terminal) and the center point of the second contact terminal 212 are shifted from each other. This is because the movement in the rotational direction becomes more natural.
- connection frame 213 connects one end of the second contact terminal 212 to one of the pair of first contact terminals 211, and the other end of the second contact terminal 212 and the second contact terminal. By connecting the other one of the 212, the first contact terminal 211 and the second contact terminal 212 including the connection frame 213 are integrally formed.
- connection frame 213 is not particularly limited in its shape, but the outer surface of the connection frame 213 has a circumferential rotational force increasing groove 213a to form a semiconductor through the first contact terminal 211. It is preferable that the force applied from the chip S is well transmitted to the second contact terminal 212 so that the pin 210 for the semiconductor chip test can be smoothly rotated.
- circular grooves 212a into which the pivot center axis 221 is fitted are formed at the center of the upper surface of the second contact terminal 212 described above, and elastic members 222 are formed at both upper ends of the circular grooves 212a.
- a seating groove 212b in which the seat is formed is formed.
- the mounting groove 212b has a flat shape as shown in one example, and when the elastic body 222 has a square pillar shape, the mounting groove 212b may also be stably supported on the inner side surface of the connecting frame 213 so as to stably support the side of the elastic body 222.
- the flat wall surface 213c is formed so that the bottom and side surfaces of the elastic body 222 can be inserted and fixed in the space surrounded by the mounting groove 212b and the wall surface 213c.
- the pivotal central axis 221 and the elastic body 222 correspond to one configurations of the semiconductor chip test socket 220 according to the present invention, and the pivotal central axis 221 rotates the pin 210 for the semiconductor chip test. It serves as a visual center axis, and the elastic body 222 serves to apply a tension such that the pivot central axis 221 is fixed to the lower portion thereof and at the same time the pair of first contact terminals 211 are kept horizontal. Do it.
- the semiconductor chip test pin 210 rotates from side to side, and the elastic body 222 is deformed under pressure. On the other hand, when the rotation is stopped (that is, at the end of the test), the semiconductor chip test pin 210 is horizontal again by the elastic restoring force of the elastically deformed elastic body 222.
- FIG. 6 schematically illustrates a socket 220 for a semiconductor chip test according to the present invention.
- the array plate 120 and the socket housing 110 as described in FIG. include.
- the semiconductor chip test pin 210 of the present invention is arranged such that the first contact terminal 211 protrudes from the upper surface of the base plate 111 (also referred to as a 'Load Board') of the socket housing 110.
- the semiconductor chip S is inserted into the socket housing 110 through the inlet of the plate 120, the input / output terminal L contacts the first contact terminal 211.
- the remaining portion of the semiconductor chip test pin 210 except for the first contact terminal 211, the pivot center axis 221, the elastic body 222 and the test terminal T are disposed inside the base plate 111.
- the test terminal T is connected to a test signal source (not shown) through a printed circuit board (PCB). Since a single semiconductor chip S has a plurality of input / output terminals L, pins for testing a semiconductor chip ( Various configurations including the 210 may be provided in plural numbers in accordance with the number of input / output terminals L. FIG.
- FIG. 7 illustrates a semiconductor chip test pin 210 and a semiconductor chip test socket 220 including the same according to the present invention, as can be seen from FIG. 7, the semiconductor chip test pin according to the present invention.
- Denoted at 210 are first contact terminals 211 on the left and right sides with respect to the center line O indicated by a dotted line.
- the present invention uses the first contact terminal 211 on one side as the current contact terminal CT1, and the first contact terminal 211 on the other side is provided as a spare terminal CT2. Therefore, if one side of the first contact terminal 211 is worn due to frequent contact with the input and output terminal (L), it can be used by rotating the reference to the center line (O), so that what was previously provided as a spare terminal (CT2) The contact terminal CT2 can be used.
- the bottom of one side is used as the current contact surface CT3 based on the center line O, and the bottom of the other side is provided as the spare contact surface CT4 based on the center line.
- the bottom surface of one side of the second contact terminal 212 may be turned to be used on the other side surface.
- the present invention since the present invention only needs to include one pivotal central axis 221 on the center side of the semiconductor chip test pin 210, conventionally, two rotational shafts 113 and 114 made of an elastic material are required. In addition, by supporting the semiconductor chip test pins 210 stably and without shaking, the contact reliability is improved.
- the elastic body 222 also has a rectangular columnar shape to equally elastically support both sides of the semiconductor chip test pin 210 based on the center line O. FIG.
- the rotational central axis 221 is made of a solid engineering plastic material with a low surface resistance to prevent replacement due to wear of the rotational central axis 221 and at the same time prevent the rotation of the semiconductor chip test pin 210.
- the elastic body 222 is made of an elastomer so that the elastic body 222 can smoothly return by elastic restoring force without disturbing the rotation of the semiconductor chip test pin 210 with sufficient elasticity.
- Engineering plastics refers to special plastics that make processed products for industrial purposes, such as mechanical parts and structural materials, and include polyamide-based resins (nylon resins), polycarbonate resins, polyacetal resins, PBT resins, and modified PPO resins.
- Figure 8 (a) shows a semiconductor chip test pin 210 according to the present invention
- Figure 8 (b) is a semiconductor chip test according to the prior art described with reference to FIGS.
- the radius of curvature of the lower surface of the second contact terminal 212 is larger than the radius of curvature of the pivot center axis 221, unlike the related art.
- the rotation pattern of the 'S'-shaped pin 112 is close to the garden (C4) in the present invention
- the rotation pattern of the second contact terminal 212 is close to the elliptical (C2).
- the present invention is compared to the pressing force when the pressing force of the semiconductor chip S is applied to the second contact terminal 212 through the first contact terminal 211 as shown in FIG. Since the rotation is performed in a substantially vertical direction (ie, ellipsoid direction), the damage of the contact surface is minimized, and as the contact area decreases with a large contact area, the amount of current increases, thereby improving the large power characteristic.
- the pair of first contact terminals 211 and the connection frame 213 may be formed in symmetrical shapes with each other, as shown in the drawing. It may also have a shape.
- the identification unit 213b is displayed on any one of the first contact terminals 211 for the purpose of the division.
- the identification unit 213b may be displayed on any one of the connection frames 213.
- the identification unit 213b As the identification unit 213b, a specially selected mark may be printed or engraved in an engraved or embossed manner. However, as illustrated in FIG. 5, the identification unit 213b may be additionally added to one side of the connection frame 213. Further provision may also be used.
- FIG. 10 illustrates a semiconductor chip test pin 210 according to another embodiment of the present invention. Although the shape thereof is slightly different from the embodiment of the present invention described above, this also includes a deer horn shape as a whole.
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- Computer Hardware Design (AREA)
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- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
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- Connecting Device With Holders (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
Claims (11)
- 각각 외측 상부를 향해 경사진 형상으로 이루어져 있어서 상부에 놓인 반도체 칩(S)의 신호 입출력 단자(L)와 접촉하되, 한 쌍으로 이루어진 제1 컨택 단자(211)와;
상기 한 쌍으로 이루어진 제1 컨택 단자(211)들 사이의 하부 중심에 배치되고, 밑면은 원주(circumference) 형상으로 굴곡져 있으며, 테스트 단자(T)와 접촉하는 제2 컨택 단자(212); 및
상기 제2 컨택 단자(212)의 일단부와 상기 제1 컨택 단자(211) 중 어느 하나를 연결하고, 상기 제2 컨택 단자(212)의 타단부와 상기 제2 컨택 단자(212) 중 다른 하나를 연결하도록 한 쌍으로 이루어진 연결 프레임(213);을 포함하며,
상기 제2 컨택 단자(212)의 상면 중심측에는 회동 중심축(221)이 끼워지도록 원형 홈(212a)이 형성되어 있고, 상기 원형 홈(212a)의 상단 양측부에는 각각 상기 회동 중심축(221)을 고정함과 동시에 상기 한 쌍의 제1 컨택 단자(211)가 수평을 유지하도록 텐션(tension)을 가해주는 탄성체(222)의 설치를 위한 안착 홈(212b)이 형성되어 있는 것을 특징으로 하는 반도체 칩 테스트용 핀.
- 제1항에 있어서,
상기 제1 컨택 단자(211)는 수평면에 대해 30° 내지 45°의 경사각을 갖는 것을 특징으로 하는 반도체 칩 테스트용 핀. - 제1항에 있어서,
상기 제2 컨택 단자(212)의 하부면의 폭은 상기 한 쌍으로 이루어진 제1 컨택 단자(211)들의 단부 사이의 폭보다 좁고, 상기 원주 형상으로 굴곡진 제2 컨택 단자(212)의 하부면을 지지면으로 하며, 상기 회동 중심축(221)을 중심으로 하여 상기 제1 컨택 단자(211)가 좌우로 요동치는 것을 특징으로 하는 반도체 칩 테스트용 핀. - 제1항에 있어서,
상기 제2 컨택 단자(212)의 하부면의 곡률 반경은 상기 회동 중심축(221)의 곡률 반경보다 더 크고, 상기 원주 형상으로 굴곡진 제2 컨택 단자(212)의 하부면을 지지면으로 하며, 상기 회동 중심축(221)을 중심으로 하여 상기 제2 컨택 단자(212)가 타원형 방향으로 회동되는 것을 특징으로 하는 반도체 칩 테스트용 핀. - 제1항에 있어서,
상기 안착 홈(212b)의 외측부에는 각각 상기 연결 프레임(213)의 내측면에 의해 이루어진 벽면(213c)을 구비하고 있어서, 사각 기둥 형상으로 이루어진 상기 탄성체(222)의 밑면과 측면이 상기 안착 홈(212b)과 벽면(213c)에 의해 둘러싸인 공간에 삽입 설치되는 것을 특징으로 하는 반도체 칩 테스트용 핀. - 제1항에 있어서,
상기 연결 프레임(213)의 외측면에는 원주 형상의 회동력 증가용 홈(213a)이 형성되어 있는 것을 특징으로 하는 반도체 칩 테스트용 핀. - 제1항에 있어서,
상기 한 쌍으로 이루어진 제1 컨택 단자(211)와 연결 프레임(213)은 각각 서로 대칭된 형상으로 이루어져 있으며, 상기 제1 컨택 단자(211) 중 어느 하나에는 식별부(213b)가 표시되어 있거나, 혹은 상기 연결 프레임(213) 중 어느 하나에는 식별부(213b)가 표시되어 있는 것을 특징으로 하는 반도체 칩 테스트용 핀. - 제1항에 있어서,
상기 한 쌍으로 이루어진 제1 컨택 단자(211)는 서로 다른 형상으로 이루어져 있거나, 혹은 상기 연결 프레임(213)은 서로 다른 형상으로 이루어져 있는 것을 특징으로 하는 반도체 칩 테스트용 핀. - 상기 제1항 내지 제8항 중 어느 하나와 같은 반도체 칩 테스트용 핀과;
상기 제2 컨택 단자(212)의 상면에 형성된 원형 홈(212a)에 끼워지며 원 기둥 형상으로 이루진 회동 중심축(221); 및
상기 회동 중심축(221)의 상부에 고정되고, 상기 안착 홈(212b)에 놓여지며, 사각 기둥 형상으로 이루어진 탄성체(222);를 포함하는 것을 특징으로 하는 반도체 칩 테스트용 소켓. - 제9항에 있어서,
상기 회동 중심축(221)은 견고하면서 표면 저항이 작은 엔지니어링 플라스틱 재질로 이루어져 있는 것을 특징으로 하는 반도체 칩 테스트용 소켓. - 제9항에 있어서,
상기 탄성체(222)는 탄성 중합체(elastomer)로 이루어져 있는 것을 특징으로 하는 반도체 칩 테스트용 소켓.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2014515725A JP2014518382A (ja) | 2011-06-13 | 2012-06-13 | 半導体チップのテスト用ピンおよびそれを用いた半導体チップのテスト用ソケット |
US14/125,585 US20140134899A1 (en) | 2011-06-13 | 2012-06-13 | Pin for a semiconductor chip test, and socket for a semiconductor chip test including same |
Applications Claiming Priority (2)
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KR2020110005208U KR200455379Y1 (ko) | 2011-06-13 | 2011-06-13 | 반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓 |
KR20-2011-0005208 | 2011-06-13 |
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WO2012173379A2 true WO2012173379A2 (ko) | 2012-12-20 |
WO2012173379A3 WO2012173379A3 (ko) | 2013-03-07 |
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PCT/KR2012/004638 WO2012173379A2 (ko) | 2011-06-13 | 2012-06-13 | 반도체 칩 테스트용 핀 및 그를 포함한 반도체 칩 테스트용 소켓 |
Country Status (5)
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US (1) | US20140134899A1 (ko) |
JP (1) | JP2014518382A (ko) |
KR (1) | KR200455379Y1 (ko) |
TW (1) | TWI470243B (ko) |
WO (1) | WO2012173379A2 (ko) |
Families Citing this family (5)
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KR101594993B1 (ko) * | 2014-10-10 | 2016-02-17 | 정요채 | 반도체 패키지용 테스트 소켓 |
US9343830B1 (en) * | 2015-06-08 | 2016-05-17 | Xcerra Corporation | Integrated circuit chip tester with embedded micro link |
CN111141938B (zh) * | 2018-11-02 | 2021-10-29 | 旺矽科技股份有限公司 | 适用于具有倾斜导电接点的多待测单元的探针模块 |
TWI704358B (zh) * | 2019-09-16 | 2020-09-11 | 旺矽科技股份有限公司 | 適用於具有傾斜導電接點之多待測單元的探針模組 |
KR102339111B1 (ko) * | 2020-06-15 | 2021-12-15 | 배명철 | 반도체 패키지 테스트용 소켓 |
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- 2012-06-13 TW TW101121258A patent/TWI470243B/zh not_active IP Right Cessation
- 2012-06-13 US US14/125,585 patent/US20140134899A1/en not_active Abandoned
- 2012-06-13 JP JP2014515725A patent/JP2014518382A/ja active Pending
- 2012-06-13 WO PCT/KR2012/004638 patent/WO2012173379A2/ko active Application Filing
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KR100308123B1 (ko) * | 1998-12-29 | 2001-11-02 | 김영환 | 반도체 테스트용 핸들러의 큐·에프·피 소켓 |
KR100999574B1 (ko) * | 2007-12-06 | 2010-12-08 | 주식회사 오킨스전자 | 비지에이 패키지 테스트 소켓용 프로브 접촉자 및 이를포함하는 비지에이 패키지 테스트 소켓 |
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Also Published As
Publication number | Publication date |
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JP2014518382A (ja) | 2014-07-28 |
KR200455379Y1 (ko) | 2011-09-01 |
TWI470243B (zh) | 2015-01-21 |
US20140134899A1 (en) | 2014-05-15 |
TW201305576A (zh) | 2013-02-01 |
WO2012173379A3 (ko) | 2013-03-07 |
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