WO2012172709A1 - 導電テープ及びその製造方法 - Google Patents
導電テープ及びその製造方法 Download PDFInfo
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- WO2012172709A1 WO2012172709A1 PCT/JP2011/079255 JP2011079255W WO2012172709A1 WO 2012172709 A1 WO2012172709 A1 WO 2012172709A1 JP 2011079255 W JP2011079255 W JP 2011079255W WO 2012172709 A1 WO2012172709 A1 WO 2012172709A1
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- Prior art keywords
- yarn
- conductive
- mesh fabric
- conductive tape
- monofilament
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- MKPZDBNKUJHYCK-UHFFFAOYSA-N CC1N(C)CC1 Chemical compound CC1N(C)CC1 MKPZDBNKUJHYCK-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0009—Casings with provisions to reduce EMI leakage through the joining parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/02—Single bars, rods, wires, or strips
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/206—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer comprising non-adhesive protrusions
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1462—Polymer derived from material having at least one acrylic or alkacrylic group or the nitrile or amide derivative thereof [e.g., acrylamide, acrylate ester, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/10—Scrim [e.g., open net or mesh, gauze, loose or open weave or knit, etc.]
- Y10T442/102—Woven scrim
- Y10T442/109—Metal or metal-coated fiber-containing scrim
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T442/00—Fabric [woven, knitted, or nonwoven textile or cloth, etc.]
- Y10T442/20—Coated or impregnated woven, knit, or nonwoven fabric which is not [a] associated with another preformed layer or fiber layer or, [b] with respect to woven and knit, characterized, respectively, by a particular or differential weave or knit, wherein the coating or impregnation is neither a foamed material nor a free metal or alloy layer
- Y10T442/2418—Coating or impregnation increases electrical conductivity or anti-static quality
Definitions
- the present invention relates to a conductive tape and a manufacturing method thereof.
- it is related with the electrically conductive tape which has double-sided adhesiveness, and its manufacturing method.
- Conductive tape is used as an electromagnetic shielding gasket that is attached to a case such as an electronic device to shield electromagnetic waves. Further, in the field of portable electronic devices typified by mobile phones such as smartphones and electronic devices such as personal computers, miniaturization and higher performance are progressing. As an electromagnetic wave shielding gasket in these electronic devices, high adhesiveness and excellent grounding characteristics are required, and a thinner conductive tape is required.
- an adhesive layer in which a conductive filler is dispersed is laminated on both surfaces of a fabric such as a metal foil as a base material or a conductive nonwoven fabric.
- a fabric such as a metal foil as a base material or a conductive nonwoven fabric.
- the thickness of the adhesive layer must be reduced.
- the pressure-sensitive adhesive layer sinks into the unevenness of the base material, and the adhesiveness decreases.
- the latter conductive tape is easy to thin because it does not use a base material, but it has a problem that the filler alone is insufficient in electrical conductivity and is easily broken in handling.
- the grounding characteristics greatly depend on the exposed state of the conductive filler contained in the adhesive layer and the contact state with the substrate. For this reason, there was also a problem that stable grounding characteristics could not be obtained depending on the pasting conditions and the like. Further, in the case of a conductive tape including a base material, it is conceivable to make the base material itself thin. However, when the nonwoven fabric or the like is thinned, the tensile strength is remarkably lowered, and there is a problem that the conductive tape is cut by handling when being attached. When using metal foil as a base material, there existed a problem that an adhesion layer will peel by deformation
- Patent Document 2 discloses an adhesive sheet in which an adhesive layer is formed on at least one surface of a conductive base material and a part of the base material protrudes from the adhesive layer.
- Patent Document 3 discloses an electromagnetic wave shield in which a conductive sheet formed in a woven, knitted or net shape using metal is embedded in an elastomer base material, and the conductive sheet is exposed on both the front and back surfaces of the elastomer base material. A tape is disclosed.
- the present invention has been made in view of such problems, and as a conductive tape used to shield electromagnetic waves in electronic equipment, it is thinner, has excellent grounding characteristics and high adhesiveness, and is attached.
- An object of the present invention is to provide a conductive tape that is excellent in handling properties during attachment work.
- the conductive tape according to the first aspect of the present invention is: A conductive mesh fabric having a metal coating on the surface; An adhesive film made of an adhesive formed only in the opening of the conductive mesh fabric; Have The metal coating is exposed on both sides of the conductive mesh fabric without being covered with the adhesive film, A thermoplastic synthetic fiber monofilament yarn is included in at least a part of the yarn constituting the conductive mesh fabric,
- the value of M obtained by the following formula 1 is in the range of 0.05 to 0.45.
- B 1 Average yarn diameter of monofilament in the thickness direction of the conductive tape other than the intersection point
- B 2 Average yarn diameter of the yarn crossing the monofilament in the thickness direction of the conductive tape other than the intersection point
- C Other monofilament Conductive tape thickness at the intersection with the yarn
- thermoplastic synthetic fiber monofilament yarn has an average flatness within a range of 1.1 to 3.0 in a cross-sectional shape.
- the opening ratio of the conductive mesh fabric is in the range of 45 to 90%.
- the method for producing a conductive tape comprises: Providing a conductive mesh fabric having a metal coating on the surface and having a thermoplastic synthetic fiber monofilament yarn as at least a part of the component; Applying a fluid pressure-sensitive adhesive on the release sheet to form a pressure-sensitive adhesive layer having a thickness in the range of 50 to 90% of the maximum thickness of the conductive mesh fabric; Laminating the conductive mesh fabric on the pressure-sensitive adhesive layer, and further laminating another laminate sheet thereon; Aging and curing the pressure-sensitive adhesive layer to form a pressure-sensitive adhesive film,
- the value of M obtained by the following formula 1 is in the range of 0.05 to 0.45.
- B 1 Average yarn diameter of monofilament in the thickness direction of the conductive tape other than the intersection point
- B 2 Average yarn diameter of the yarn crossing the monofilament in the thickness direction of the conductive tape other than the intersection point
- C Other monofilament Conductive tape thickness at the intersection with the yarn
- the adhesive film is formed only on the opening of the conductive mesh fabric, it is possible to achieve both excellent grounding characteristics and strong adhesiveness, and to make the thickness of the conductive tape extremely thin. Can do. Further, since the value of M obtained by the above mathematical formula 1 is in the range of 0.05 to 0.45, the smoothness of the surface of the conductive tape is ensured, and sufficient grounding characteristics and adhesiveness can be obtained. At the same time, the conductive tape has a sufficient strength and an excellent handling property.
- FIG. 2 is a schematic longitudinal sectional view showing a cross section taken along line X2-X2 in FIG.
- FIG. 2 is a schematic longitudinal sectional view showing a YY section in FIG. 1.
- FIG. 2 is a schematic longitudinal sectional view showing a cross section taken along line X1-X1 in FIG.
- FIG. 2 is a schematic longitudinal sectional view showing an X1-X1 cross section when the warp is a multifilament yarn in FIG. 1.
- FIG. 2 is a schematic longitudinal sectional view showing a YY section when the warp is a multifilament yarn in FIG. 1.
- the conductive mesh fabric used in the embodiment of the present invention is a vapor deposition method, sputtering, or the like, which is a well-known technique, on the surface of a mesh fabric including at least a part of a thermoplastic synthetic fiber monofilament yarn.
- a metal film is formed by a method, an electroplating method, an electroless plating method, or the like.
- polyester polyethylene terephthalate, polybutylene terephthalate, etc.
- polyamide nylon 6, nylon 66, etc.
- polyolefin polyethylene, polypropylene, etc.
- polyacrylonitrile A polyvinyl alcohol type, a polyurethane type, etc.
- polyester fibers are preferable in consideration of processability and durability.
- the fiber material is not particularly limited, and natural fibers and semi-synthetic fibers can be used in addition to synthetic fibers.
- the structure of the mesh fabric is not particularly limited, and examples thereof include plain weave, satin weave, twill weave, etc. Plain weave is preferable in terms of high warp and weft binding force and excellent strength.
- the thermoplastic synthetic fiber yarn used for part of the warp and / or the weft of the mesh fabric is a monofilament yarn.
- the monofilament yarn is preferably a flat yarn.
- the flatness is preferably in the range of 1.1 to 3.0, more preferably in the range of 1.1 to 2.5.
- the flatness refers to a value obtained by dividing the long side a of the rectangle by the short side b when drawing a rectangle circumscribing the cross-sectional shape of the monofilament. If the flatness is less than 1.1, the surface of the yarn is poorly smooth and the contact area with the housing is reduced, so that stable grounding characteristics may not be obtained. When the aspect ratio exceeds 3.0, the strength of the monofilament yarn may be reduced. Moreover, it becomes difficult to ensure the opening rate of the mesh fabric, and as a result, the adhesiveness of the conductive tape may be reduced.
- the monofilament yarn may be a flat yarn from the time the yarn is formed, or may be a flat yarn by processing after forming a mesh fabric.
- a stress that promotes deformation is applied in a state where the monofilament yarn is heated to a temperature at which plasticity is exhibited. Specifically, it is pressed with a heated metal plate or the like, or compressed by being sandwiched between superheated rolls or the like. It can also be transformed into a flat yarn by applying tension in the warp and weft directions of the mesh fabric in the heated state.
- the monofilament yarn may be a heat fusion yarn.
- the heat-sealing yarn is a yarn composed of fibers having a lower melting point than general synthetic fibers. It behaves as if it melts under the heat treatment conditions in normal fiber processing and deforms or melts and sticks to other yarns.
- the monofilament yarn may have a core-sheath structure, and only the sheath portion may be a partially heat-sealed yarn made of a heat-sealing component.
- Mesh fabric is a fabric having more openings than a general fabric.
- the warp yarns and the weft yarns constituting the fabric are arranged with a predetermined distance therebetween. Therefore, as long as it is a woven fabric, there always exist intersections of warps and wefts (intersection and overlap), but there are many portions where warps and wefts do not intersect (do not overlap) as compared with general fabrics.
- the mesh fabric used for the conductive tape of the present invention preferably has an opening ratio of 45 to 90%, more preferably 60 to 85%. When the sheet-like mesh fabric is projected on a plane, the aperture ratio refers to the ratio of the area of the opening portion per unit area.
- the open area ratio exceeds 90%, the area where the mesh fabric surface comes into contact with the housing is reduced, so that sufficient grounding characteristics may not be obtained. In addition, the electromagnetic wave shielding itself may be insufficient. Furthermore, the strength of the mesh fabric may be reduced, and handling properties may be deteriorated. On the other hand, if the aperture ratio is less than 45%, sufficient adhesion may not be obtained. In addition, it becomes difficult to push the pressure-sensitive adhesive into the opening, which may cause a difference in adhesive strength between the front and back sides.
- the pressure-sensitive adhesive used for the conductive tape is not particularly limited, but a commonly used known acrylic pressure-sensitive adhesive or rubber-based pressure-sensitive adhesive can be used as a base polymer, and various additives and the like can be blended and used.
- Acrylic adhesives include methyl methacrylate, ethyl methacrylate, propyl methacrylate, n-butyl methacrylate, 2-ethylhexyl methacrylate, isooctyl methacrylate, nonyl methacrylate, isononyl methacrylate And other monomers containing functional groups such as methacrylic acid, crotonic acid, fumaric acid, itaconic acid, maleic anhydride, vinyl acetate, acrylonitrile styrene, 2-methacrylic acid 2-
- a known acrylic pressure-sensitive adhesive obtained by copolymerizing hydroxyethyl and 2-methylolethylacrylamide as required can be used.
- the rubber-based pressure-sensitive adhesive examples include rosin resins for one or a combination of two or more elastomer components such as natural rubber, styrene butadiene rubber, butyl rubber, isoprene rubber, butadiene rubber, and styrene isoprene block copolymer. , Tempel resin, aliphatic petroleum resin, aromatic petroleum, copolymer petroleum resin, alicyclic petroleum resin, coumarone / indene resin, pure monomer resin, phenol resin, xylene resin, etc. A pressure-sensitive adhesive obtained by doing so can be used.
- the adhesive does not need to contain a conductive filler.
- a conductive filler may be contained as a role to assist the conductive mesh fabric.
- the conductive filler include metal fillers such as nickel powder, silver powder, copper powder, and silver-coated copper powder, carbon, and the like.
- the value of M obtained by the following mathematical formula 1 needs to be in the range of 0.05 to 0.45.
- B 1 Average yarn diameter of monofilament in the thickness direction of the conductive tape other than the intersection point
- B 2 Average yarn diameter of the yarn crossing the monofilament in the thickness direction of the conductive tape other than the intersection point
- C Other monofilament Conductive tape thickness at the intersection with the yarn
- FIG. 1 is a plan view of a conductive tape 10 based on a conductive mesh fabric using the same monofilament for both warp and weft.
- the warps 1 and the wefts 2 are arranged at a predetermined interval, and an opening is formed by this interval.
- An adhesive film 3 is formed in the opening.
- FIG. 2 is a longitudinal sectional view showing the X2-X2 cross section of FIG. In this part, the warp 1 and the weft 2 do not intersect.
- Monofilament (warp 1) in this portion the average yarn diameter in the thickness direction of the conductive tape 10 and B 1.
- 3 is a longitudinal sectional view showing a YY section of FIG. The average yarn diameter of the conductive tape thickness direction of the weft 2 in this portion corresponds to B 2 of formula 1.
- FIG. 4 is a longitudinal sectional view taken along the line X1-X1 of FIG. The intersection of the warp 1 and the weft 2 is included, and the thickness of the conductive tape 10 at this intersection is C.
- FIG. 5 is a longitudinal sectional view showing the X1-X1 cross section when the warp 1 is a multifilament yarn.
- the value of C is the thickness of the conductive tape 10 at the intersection of the warp 1 (multifilament yarn) and the weft 2 (monofilament).
- FIG. 6 is a longitudinal sectional view showing a YY section when the warp 1 is a multifilament yarn. In this case, it corresponds to a yarn multifilament yarn intersects the monofilament, giving a value of B 2.
- the arrangement of the single yarns constituting the yarn is not constant, and the average average yarn diameter is not determined to be a specific value. Therefore, the average yarn diameter of each single yarn constituting the multifilament yarn and B 2.
- a single yarn several species constituting the multifilament yarn, if their average fiber diameter is different, and B 2 have the largest average fiber diameter.
- a conductive mesh fabric That is, a mesh fabric is woven from fiber yarns by a normal method, and a metal film is formed thereon by a known method.
- a method for forming the metal film as described above, a vapor deposition method, a sputtering method, an electroplating method, an electroless plating method, or the like can be used.
- an adhesive is applied on the release sheet to form an adhesive layer.
- a coating method or an extrusion method can be used.
- the thickness D of the adhesive layer is formed to be in the range of 50 to 90% with respect to the maximum thickness of the prepared conductive mesh fabric. More preferably, it is in the range of 65 to 85%. If the thickness D of the pressure-sensitive adhesive layer is less than 50% of the maximum thickness of the conductive mesh fabric, sufficient adhesion may not be obtained. On the other hand, when the thickness D of the adhesive layer exceeds 90% of the maximum thickness of the conductive mesh fabric, the surface of the conductive mesh fabric is covered with the adhesive film, and the housing side metal layer and the conductive mesh fabric There is a risk that the contact of the.
- the contact resistance value becomes high, and sufficient grounding characteristics cannot be obtained.
- heating and drying can be performed using a drying furnace or the like, and the pressure-sensitive adhesive layer can be semi-cured and used for the next step.
- the next step is a step in which a conductive mesh fabric is arranged so as to be laminated on the adhesive layer obtained in the above step, and another release sheet is further laminated thereon to laminate the whole.
- Lamination can be performed continuously with a laminator roll.
- the temperature of the laminator roll may be normal temperature, but may be heated to 70 to 110 ° C. in order to improve the penetration of the adhesive into the opening of the conductive mesh fabric.
- the aging step is carried out, for example, by allowing to stand at a temperature of 40 ° C. for 72 to 120 hours.
- the pressure-sensitive adhesive layer is cured and becomes a pressure-sensitive adhesive film.
- Thickness measurement Measured with a digital upright gauge R1-205 (manufactured by Ozaki Mfg. Co., Ltd.) according to JIS Z 0237.
- a conductive tape was sandwiched between two gold-plated copper plates having a size of 25 mm ⁇ 25 mm, and a weight of 500 gf was placed thereon. The resistance value between the two copper plates was measured with a milliohm high tester 3540 (manufactured by Hioki Electric Co., Ltd.).
- Adhesive strength According to JIS Z 0237, a universal tensile tester STA-1225 (manufactured by Orientec Co., Ltd.) was used, and the adhesive strength of the conductive tape to the SUS plate was measured under the following conditions.
- Substrate SUS304 Adhesive tape size: 25mm x 120mm
- Tensile speed 300 mm / min.
- Tensile direction 180 ° peel peeling
- a mesh plain woven fabric composed of polyethylene terephthalate monofilament yarns having a diameter of 27 ⁇ m (fineness: 8 dtex) for both the warp and weft yarns and having a warp density and a weft density of 132 yarns / inch was preset at 190 ° C. Thereafter, calendering was performed at a temperature of 150 ° C. and a linear pressure of 30 kg / cm. This mesh plain fabric was immersed in an aqueous solution at 40 ° C.
- the nickel was immersed in an electric nickel plating solution containing nickel sulfamate 300 g / L, boric acid 30 g / L, nickel chloride 15 g / L, pH 3.7, 35 ° C. for 10 minutes at a current density of 5 A / dm 2. After laminating, it was washed with water.
- the obtained conductive mesh fabric had a maximum thickness of 32 ⁇ m and an aperture ratio of 65%.
- Hariacron 508EX 100 parts (acrylic adhesive, solid content 46%, manufactured by Harima Chemical Co., Ltd.)
- Bansenate B-82 1.5 parts (isocyanate-based curing agent manufactured by Harima Chemicals Co., Ltd.) The mixed solution having the above composition was stirred for 15 minutes to prepare an adhesive coating solution.
- the roll obtained above was aged for 3 days under the condition of 40 ° C. to cure the adhesive layer.
- the warp flatness was 1.50
- the weft flatness was 1.30
- the M value was 0.41.
- the contact resistance value is 5.4 m ⁇
- the adhesive strength is 7.28 N / inch on the A side (adhesive layer introduction side), and 4.31 N / inch on the B side (adhesion layer exudation side), both of which are good. Met.
- the strength was sufficient without the conductive tape being cut when being applied.
- Adhesive coating process Using a comma direct coater, adjust the clearance between the release sheet (SLK-80KCT: manufactured by Sumika Kogyo Co., Ltd.) and the comma head to 110 ⁇ m, and apply the same adhesive coating solution as in Example 1 uniformly. did. And the inside of 120 degreeC dryer was passed, and the 40-micrometer-thick adhesion layer was obtained.
- the produced conductive mesh fabric and another release sheet (EKR90R: manufactured by Lintec Corporation) were laminated on this adhesive layer. Furthermore, it bonded together with the temperature of 90 degreeC and the pressure of 3 kg / cm ⁇ 2 > with the laminator roll, and wound up.
- the roll obtained above was aged for 3 days under the condition of 40 ° C. to cure the adhesive layer.
- the flatness of warp and weft was 1.10 and the value of M was 0.09.
- the contact resistance value was 3.1 m ⁇
- the adhesive strength was 8.83 N / inch for the A side and 8.37 N / inch for the B side, both of which were favorable.
- the strength was sufficient without the conductive tape being cut when being applied.
- the plain fabric was preset at 190 ° C. Next, calendering was performed at a temperature of 90 ° C. and a linear pressure of 30 kg / cm. Thereafter, the mesh plain fabric was plated by the same method as in Example 1.
- the obtained conductive mesh fabric had a maximum thickness of 28 ⁇ m and an aperture ratio of 80%.
- Adhesive coating process Using a comma direct coater, adjust the clearance between the release sheet (SLK-80KCT: manufactured by Sumika Kogyo Co., Ltd.) and the comma head to 60 ⁇ m, and apply the same adhesive coating solution as in Example 1 uniformly. did. And the inside of 120 degreeC dryer was passed, and the adhesion layer with a thickness of 23 micrometers was obtained. The produced conductive mesh fabric and another release sheet (EKR90R: manufactured by Lintec Corporation) were laminated on this adhesive layer. Furthermore, it bonded together with the temperature of 90 degreeC and the pressure of 3 kg / cm ⁇ 2 > with the laminator roll, and wound up.
- SK-80KCT manufactured by Sumika Kogyo Co., Ltd.
- the roll obtained above was aged for 3 days under the condition of 40 ° C. to cure the adhesive layer.
- the obtained conductive tape had a warp flatness of 1.63, a weft flatness of 1.56, and an M value of 0.37.
- the contact resistance value was 3.5 m ⁇ , and the adhesive strength was 8.91 N / inch for the A side and 8.66 N / inch for the B side, both of which were favorable.
- the strength was sufficient without the conductive tape being cut when being applied.
- Example 1 (Production of conductive mesh fabric)
- Adhesive coating process Using a comma direct coater, adjust the clearance between the release sheet (SLK-80KCT: manufactured by Sumika Kogyo Co., Ltd.) and the comma head to 120 ⁇ m, and apply the same adhesive coating solution as in Example 1 uniformly. did. And the inside of 120 degreeC dryer was passed, and the 45-micrometer-thick adhesion layer was obtained. On this adhesive layer, the conductive mesh fabric having the maximum thickness of 51 ⁇ m and the opening ratio of 72% and another release sheet (EKR90R: manufactured by Lintec Corporation) were laminated. Furthermore, it bonded together with the temperature of 90 degreeC and the pressure of 3 kg / cm ⁇ 2 > with the laminator roll, and wound up.
- SK-80KCT manufactured by Sumika Kogyo Co., Ltd.
- the roll obtained above was aged for 3 days under the condition of 40 ° C. to cure the adhesive layer.
- the flatness of warps and wefts was 1.1, and the value of M was 0.04.
- the contact resistance value was 21.6 m ⁇ , and the grounding characteristics were low.
- the adhesive strength was 9.70 N / inch on the A side and 1.91 N / inch on the B side, and the adhesive strength on the B side was insufficient.
- the plain fabric was preset at 190 ° C.
- calendering was performed at a temperature of 160 ° C. and a linear pressure of 30 kg / cm. Thereafter, plating was performed in the same manner as in Example 1.
- the obtained conductive mesh fabric had a maximum thickness of 23 ⁇ m and an aperture ratio of 81%.
- Adhesive coating process Using a comma direct coater, adjust the clearance between the release sheet (SLK-80KCT: manufactured by Sumika Kogyo Co., Ltd.) and the comma head to 50 ⁇ m, and apply the same adhesive coating solution as in Example 1 uniformly. did. And the inside of 120 degreeC dryer was passed, and the 20-micrometer-thick adhesion layer was obtained.
- the produced conductive mesh fabric and another release sheet (EKR90R: manufactured by Lintec Corporation) were laminated on this adhesive layer. Furthermore, it bonded together with the temperature of 90 degreeC and the pressure of 3 kg / cm ⁇ 2 > with the laminator roll, and wound up.
- the roll obtained above was aged for 3 days under the condition of 40 ° C. to cure the adhesive layer.
- the warp flatness was 2.41
- the weft flatness was 2.37
- the M value was 0.33.
- the contact resistance value was 2.8 m ⁇
- the adhesive strength was 9.56 N / inch on the A side and 9.16 N / inch on the B side, both of which were favorable.
- the handling property the strength was sufficient without the conductive tape being cut when being applied.
- Example 2 (Production of conductive mesh fabric)
- a mesh plain fabric composed of polyethylene terephthalate monofilament yarns having a diameter of 27 ⁇ m (fineness: 8 dtex) for both warp and weft yarns and having a warp density and a weft density of 132 yarns / inch is the same as in Example 1 without being preset.
- the plating process was performed by the method of.
- the obtained conductive mesh fabric had a maximum thickness of 51 ⁇ m and an aperture ratio of 72%.
- Adhesive coating process Using a comma direct coater, adjust the clearance between the release sheet (SLK-80KCT: manufactured by Sumika Kogyo Co., Ltd.) and the comma head to 120 ⁇ m, and apply the same adhesive coating solution as in Example 1 uniformly. did. And the inside of 120 degreeC dryer was passed, and the 45-micrometer-thick adhesion layer was obtained. The produced conductive mesh fabric and another release sheet (EKR90R: manufactured by Lintec Corporation) were laminated on this adhesive layer. Furthermore, the temperature 60 ° C. The laminator rolls, subjected to bonding at a pressure 2 kg / cm 2, was wound up.
- SK-80KCT manufactured by Sumika Kogyo Co., Ltd.
- the roll obtained above was aged for 3 days under the condition of 40 ° C. to cure the adhesive layer.
- the warp flatness was 1.06
- the weft flatness was 1.08
- the value of M was 0.04.
- the contact resistance value was 24.3 m ⁇ , and the grounding characteristics were low.
- the adhesive strength was 8.80 N / inch for the A side and 1.32 N / inch for the B side, and the adhesive strength on the B side was insufficient.
- a mesh composed of a polyethylene terephthalate monofilament yarn having a diameter of 27 ⁇ m (fineness 8 dtex) and a weft yarn having a diameter of 27 ⁇ m (fineness 8 dtex) and a polyethylene terephthalate monofilament fused yarn having a warp density and a weft density of 100 yarns / inch.
- the plain fabric was preset at 190 ° C.
- This mesh plain fabric was plated by the same method as in Example 1.
- the obtained conductive mesh fabric had a maximum thickness of 44 ⁇ m and an opening ratio of 82%.
- Adhesive coating process Using a comma direct coater, adjust the clearance between the release sheet (SLK-80KCT: manufactured by Sumika Kogyo Co., Ltd.) and the comma head to 100 ⁇ m, and apply the same adhesive coating solution as in Example 1 uniformly. did. And it passed through the inside of 120 degreeC dryer, and the 37-micrometer-thick adhesion layer was obtained.
- the produced conductive mesh fabric and another release sheet (EKR90R: manufactured by Lintec Corporation) were laminated on this adhesive layer. Furthermore, it bonded together with the temperature of 90 degreeC and the pressure of 3 kg / cm ⁇ 2 > with the laminator roll, and wound up.
- the roll obtained above was aged for 3 days under the condition of 40 ° C. to cure the adhesive layer.
- the flatness of warp and weft was 1.1, and the value of M was 0.20.
- the contact resistance value was 2.0 m ⁇ , and the adhesive strength was 10.80 N / inch on the A side and 8.50 N / inch on the B side, both of which were favorable.
- the strength was sufficient without the conductive tape being cut when being applied.
- Example 3 (Production of conductive mesh fabric) A mesh plain woven fabric composed of polyethylene terephthalate monofilament yarns with a diameter of 49 ⁇ m (fineness: 26 dtex) for both warp and weft yarns having a warp density and a weft density of 200 yarns / inch is the same as in Example 1 without being preset. The plating process was performed by the method of. The obtained conductive mesh fabric had a maximum thickness of 94 ⁇ m and an aperture ratio of 37%.
- Adhesive coating process Using a comma direct coater, adjust the clearance between the release sheet (SLK-80KCT: manufactured by Sumika Kogyo Co., Ltd.) and the comma head to 210 ⁇ m, and apply the same adhesive coating solution as in Example 1 uniformly. did. And the inside of 120 degreeC dryer was passed, and the 78-micrometer-thick adhesion layer was obtained. The produced conductive mesh fabric and another release sheet (EKR90R: manufactured by Lintec Corporation) were laminated on this adhesive layer. Furthermore, the temperature 60 ° C. The laminator rolls, subjected to bonding at a pressure 2 kg / cm 2, was wound up.
- SK-80KCT manufactured by Sumika Kogyo Co., Ltd.
- the roll obtained above was aged for 3 days under the condition of 40 ° C. to cure the adhesive layer.
- the obtained conductive tape had a warp flatness of 1.05, a weft flatness of 1.06, and an M value of 0.04.
- the contact resistance value was not measurable (infinite), and it was not possible to obtain continuity rather than grounding characteristics.
- Adhesive strength was 19.63 N / inch for side A and 6.65 N / inch for side B.
- Table 1 summarizes the above Examples 1 to 5 and Comparative Examples 1 to 3.
- the measured value of the adhesive force is large on both the A side and the B side, and the double-sided adhesiveness is excellent.
- Example 1 in which the average flatness of the thermoplastic synthetic fiber monofilament yarn is 1.50 with the warp 1.30, Example 2 with the warp 1.10 and Example 1 with the warp 1.10, warp 1.
- Example 3 weft 1.56, weft 2.41, weft 2.41, weft 2.37, Example 4, warp 1.10 and weft 1.10, Example 5, all have small contact resistance values and grounding characteristics. Is excellent.
- the measured value of the adhesive force is large on both the A side and the B side, and the double-sided adhesiveness is excellent.
- Comparative Example 2 having an average flatness of 1.06 warp and 1.08 weft has a large contact resistance value of 24.3 m ⁇ , and has a lower grounding characteristic than Comparative Example 1. Also, the measured value of the adhesive force is as small as 1.32 N / inch on the B surface, and the adhesive strength on the B surface side is insufficient as compared with Comparative Example 1. Comparative Example 3 with an average flatness of warp 1.05 and weft 1.06 is inferior to Comparative Examples 1 and 2 because the contact resistance value is too large to be measured and does not function as a conductive tape.
- thermoplastic synthetic fiber monofilament yarn preferably has an average flatness in the range of 1.1 to 3.0 in cross-sectional shape.
- the average aspect ratio is more preferably in the range of 1.1 to 2.5.
- the opening ratio of the conductive mesh fabric gradually increases between Example 1 and Example 5.
- the adhesive force gradually increases as a whole, but the contact resistance value is kept low, indicating excellent grounding characteristics.
- Comparative Example 3 in which the opening ratio of the conductive mesh fabric is 37% cannot be measured because the contact resistance value is too large, and does not function as a conductive tape. This is because the pressure-sensitive adhesive cannot sufficiently penetrate due to the small opening ratio, and the excessive pressure-sensitive adhesive covers the surface of the conductive tape, and the metal film is not sufficiently exposed.
- the opening ratio of the conductive mesh fabric is preferably in the range of 45 to 90%.
- the opening ratio of the conductive mesh fabric is more preferably in the range of 60 to 85%.
- the conductive tape of the present invention can be used as an ultra-thin electromagnetic shielding gasket for electronic equipment.
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
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Abstract
Description
表面に金属被膜を有する導電性メッシュ織物と、
該導電性メッシュ織物の開口部のみに形成された粘着剤からなる粘着膜と、
を有し、
前記導電性メッシュ織物の両面において前記金属被膜が前記粘着膜で被覆されずに露出しており、
前記導電性メッシュ織物を構成する糸条の少なくとも一部に熱可塑性合成繊維モノフィラメント糸を含み、
下記の数式1で得られるMの値が0.05~0.45の範囲内である。
B2:モノフィラメントと交差する糸条の、交点以外での導電テープ厚さ方向の平均糸径
C:モノフィラメントが他の糸条と交差する交点における導電テープ厚さ)
表面に金属被膜を有し、熱可塑性合成繊維モノフィラメント糸を構成要素の少なくとも一部とする導電性メッシュ織物を準備する工程と、
離型シート上に流動性を有する粘着剤を塗布し、厚さが前記導電性メッシュ織物の最大厚さの50~90%の範囲内となる粘着剤層を形成する工程と、
前記粘着剤層の上に前記導電性メッシュ織物を積層し、さらにその上にもう一枚の離型シートを積層してラミネートする工程と、
エージングを行い前記粘着剤層を硬化させて粘着膜を形成する工程とを有し、
下記の数式1で得られるMの値が0.05~0.45の範囲内である。
B2:モノフィラメントと交差する糸条の、交点以外での導電テープ厚さ方向の平均糸径
C:モノフィラメントが他の糸条と交差する交点における導電テープ厚さ)
アクリル系粘着剤としては、メタアクリル酸メチル、メタアクリル酸エチル、メタアクリル酸プロピル、メタアクリル酸n-ブチル、メタアクリル酸2-エチルヘキシル、メタアクリル酸イソオクチル、メタアクリル酸ノニル、メタアクリル酸イソノニル等のメタアクリル酸エステルモノマーを主成分とし、これにメタアクリル酸、クロトン酸、フマル酸、イタコン酸、無水マレイン酸等の官能基を含むモノマーや酢酸ビニル、アクリルニトリルスチレン、メタアクリル酸2-ヒドロキシエチル、2-メチロールエチルアクリルアミドを必要に応じて共重合させることによって得られる公知のアクリル系粘着剤を用いることができる。
B2:モノフィラメントと交差する糸条の、交点以外での導電テープ厚さ方向の平均糸径
C:モノフィラメントが他の糸条と交差する交点における導電テープ厚さ)
粘着層の厚さDが、導電性メッシュ織物の最大厚さの50%未満の場合には、十分な接着性が得られないおそれがある。一方、粘着層の厚さDが、導電性メッシュ織物の最大厚さの90%を超える場合には、導電性メッシュ織物の表面が粘着膜で覆われ、筐体側金属層と導電性メッシュ織物との接触が阻害されるおそれがある。このような状態になると、接触抵抗値が高くなってしまい、十分なグラウンディング特性が得られない。粘着層を形成した後、乾燥炉等を用いて加熱・乾燥を行い、粘着層を半硬化状態として次の工程に供することもできる。
被着体・・・SUS304
接着用導電テープサイズ・・・25mm×120mm
引張速度・・・300mm/min.
引張方向・・・180°ピール剥離
経糸、緯糸ともに直径27μm(繊度8dtex)のポリエチレンテレフタレート製モノフィラメント糸から構成された、経糸密度、緯糸密度がともに132本/インチであるメッシュ平織物を、190℃でプレセットした。その後、温度150℃、線圧30kg/cmでカレンダー加工を行った。このメッシュ平織物を、塩化パラジウム0.3g/L、塩化第一錫30g/L、36%塩酸300ml/Lを含む40℃の水溶液に2分間浸漬後、水洗した。続いて、酸濃度0.1N、30℃のホウフッ化水素酸に5分間浸漬後、水洗した。次に、硫酸銅7.5g/L、37%ホルマリン30ml/L、ロッシェル塩85g/Lを含む30℃の無電解銅メッキ液に5分間浸漬後、水洗した。続いて、スルファミン酸ニッケル300g/L、ホウ酸30g/L、塩化ニッケル15g/Lを含む、pH3.7、35℃の電気ニッケルメッキ液に10分間、電流密度5A/dm2で浸漬しニッケルを積層させた後、水洗した。得られた導電性メッシュ織物の最大厚さは32μmであり、その開口率は65%であった。
ハリアクロン508EX :100部
(アクリル系粘着剤、固型分46% ハリマ化成株式会社製)
バンセネートB-82 :1.5部
(イソシアネート系硬化剤 ハリマ化成株式会社製)
上記配合の混合液を15分攪拌し、粘着剤塗布液を作製した。
コンマダイレクトコーターを使用し、離型シート(SLK-80KCT:住化加工紙株式会社製)とコンマヘッドのクリアランスを60μmに調整し、粘着剤を均一に塗工した。そして、120℃の乾燥機内を通過させ、厚さ23μmの粘着層を得た。この粘着層に、作製した導電性メッシュ織物及び別の離型シート(EKR90R:リンテック株式会社製)を積層した。さらに、ラミネーターロールにより温度90℃、圧力3kg/cm2で貼り合せを行い、巻き取った。
上記で得られたロールを、そのまま40℃の条件下で3日間エージングを行い、粘着層を硬化させた。得られた導電テープについて、経糸の扁平率は1.50、緯糸の扁平率は1.30、Mの値は0.41であった。接触抵抗値は5.4mΩ、接着力はA面(粘着層導入側の面)が7.28N/インチ、B面(粘着層滲出側の面)が4.31N/インチであり、いずれも良好であった。また、ハンドリング性に関しても、貼り付ける際に導電テープが切断されるようなこともなく、強度は十分であった。
経糸、緯糸ともに直径27μm(繊度8dtex)のポリエチレンテレフタレート製モノフィラメント糸から構成された、経糸密度、緯糸密度がともに132本/インチであるメッシュ平織物を、190℃でプレセットした。そして、実施例1と同様の方法でメッキ加工を行った。得られた導電性メッシュ織物の最大厚さは47μmであり、その開口率は72%であった。
コンマダイレクトコーターを使用し、離型シート(SLK-80KCT:住化加工紙株式会社製)とコンマヘッドのクリアランスを110μmに調整し、実施例1と同様の粘着剤塗工液を均一に塗工した。そして、120℃の乾燥機内を通過させ、厚さ40μmの粘着層を得た。この粘着層に、作製した導電性メッシュ織物及び別の離型シート(EKR90R:リンテック株式会社製)を積層した。さらに、ラミネーターロールにより温度90℃、圧力3kg/cm2で貼り合せを行い、巻き取った。
上記で得られたロールを、そのまま40℃の条件下で3日間エージングを行い、粘着層を硬化させた。得られた導電テープについて、経糸及び緯糸の扁平率はともに1.10、Mの値は0.09であった。接触抵抗値は3.1mΩ、接着力はA面が8.83N/インチ、B面が8.37N/インチであり、いずれも良好であった。また、ハンドリング性に関しても、貼り付ける際に導電テープが切断されるようなこともなく、強度は十分であった。
経糸が直径27μm(繊度8dtex)のポリエチレンテレフタレート製モノフィラメント糸、緯糸が直径27μm(繊度8dtex)のポリエチレンテレフタレート製モノフィラメント融着糸から構成された、経糸密度、緯糸密度がともに100本/インチであるメッシュ平織物を、190℃でプレセットした。次に、温度90℃、線圧30kg/cmでカレンダー加工を行った。その後、このメッシュ平織物に、実施例1と同様の方法でメッキ加工を行った。得られた導電性メッシュ織物の最大厚さは28μmであり、その開口率は80%であった。
コンマダイレクトコーターを使用し、離型シート(SLK-80KCT:住化加工紙株式会社製)とコンマヘッドのクリアランスを60μmに調整し、実施例1と同様の粘着剤塗工液を均一に塗工した。そして、120℃の乾燥機内を通過させ、厚さ23μmの粘着層を得た。この粘着層に、作製した導電性メッシュ織物及び別の離型シート(EKR90R:リンテック株式会社製)を積層した。さらに、ラミネーターロールにより温度90℃、圧力3kg/cm2で貼り合せを行い、巻き取った。
上記で得られたロールを、そのまま40℃の条件下で3日間エージングを行い、粘着層を硬化させた。得られた導電テープについて、経糸の扁平率は1.63、緯糸の扁平率は1.56、Mの値は0.37であった。接触抵抗値は3.5mΩ、接着力はA面が8.91N/インチ、B面が8.66N/インチであり、いずれも良好であった。また、ハンドリング性に関しても、貼り付ける際に導電テープが切断されるようなこともなく、強度は十分であった。
(導電性メッシュ織物の作製)
経糸、緯糸ともに直径27μm(繊度8dtex)のポリエチレンテレフタレート製モノフィラメント糸から構成された、経糸密度、緯糸密度がともに132本/インチであるメッシュ平織物に対して、プレセットせずに、実施例1と同様の方法でメッキ加工を行った。得られた導電性メッシュ織物の最大厚さは51μmであり、その開口率は72%であった。
コンマダイレクトコーターを使用し、離型シート(SLK-80KCT:住化加工紙株式会社製)とコンマヘッドのクリアランスを120μmに調整し、実施例1と同様の粘着剤塗工液を均一に塗工した。そして、120℃の乾燥機内を通過させ、厚さ45μmの粘着層を得た。この粘着層に、上記最大厚さ51μm、開口率72%の導電性メッシュ織物及び別の離型シート(EKR90R:リンテック株式会社製)を積層した。さらに、ラミネーターロールにより温度90℃、圧力3kg/cm2で貼り合せを行い、巻き取った。
上記で得られたロールを、そのまま40℃の条件下で3日間エージングを行い、粘着層を硬化させた。得られた導電テープについて、経糸及び緯糸の扁平率はともに1.1、Mの値は0.04であった。接触抵抗値は21.6mΩで、グラウンディング特性が低かった。接着力はA面が9.70N/インチ、B面が1.91N/インチであり、B面側の接着強度が不十分であった。
経糸が直径27μm(繊度8dtex)のポリエチレンテレフタレート製モノフィラメント糸、緯糸が直径27μm(繊度8dtex)のポリエチレンテレフタレート製モノフィラメント融着糸から構成された、経糸密度、緯糸密度がともに100本/インチであるメッシュ平織物を、190℃でプレセットした。次に、温度160℃、線圧30kg/cmでカレンダー加工を行った。その後、実施例1と同様の方法でメッキ加工を行った。得られた導電性メッシュ織物の最大厚さは23μmであり、その開口率は81%であった。
コンマダイレクトコーターを使用し、離型シート(SLK-80KCT:住化加工紙株式会社製)とコンマヘッドのクリアランスを50μmに調整し、実施例1と同様の粘着剤塗工液を均一に塗工した。そして、120℃の乾燥機内を通過させ、厚さ20μmの粘着層を得た。この粘着層に、作製した導電性メッシュ織物及び別の離型シート(EKR90R:リンテック株式会社製)を積層した。さらに、ラミネーターロールにより温度90℃、圧力3kg/cm2で貼り合せを行い、巻き取った。
上記で得られたロールを、そのまま40℃の条件下で3日間エージングを行い、粘着層を硬化させた。得られた導電テープについて、経糸の扁平率は2.41、緯糸の扁平率は2.37、Mの値は0.33であった。接触抵抗値は2.8mΩ、接着力はA面が9.56N/インチ、B面が9.16N/インチであり、いずれも良好であった。また、ハンドリング性に関しても、貼り付ける際に導電テープが切断されるようなこともなく、強度は十分であった。
(導電性メッシュ織物の作製)
経糸、緯糸ともに直径27μm(繊度8dtex)のポリエチレンテレフタレート製モノフィラメント糸から構成された、経糸密度、緯糸密度がともに132本/インチであるメッシュ平織物を、プレセットせずに、実施例1と同様の方法でメッキ加工を行った。得られた導電性メッシュ織物の最大厚さは51μmであり、その開口率は72%であった。
コンマダイレクトコーターを使用し、離型シート(SLK-80KCT:住化加工紙株式会社製)とコンマヘッドのクリアランスを120μmに調整し、実施例1と同様の粘着剤塗工液を均一に塗工した。そして、120℃の乾燥機内を通過させ、厚さ45μmの粘着層を得た。この粘着層に、作製した導電性メッシュ織物及び別の離型シート(EKR90R:リンテック株式会社製)を積層した。さらに、ラミネーターロールにより温度60℃、圧力2kg/cm2で貼り合せを行い、巻き取った。
上記で得られたロールを、そのまま40℃の条件下で3日間エージングを行い、粘着層を硬化させた。得られた導電テープについて、経糸の扁平率は1.06、緯糸の扁平率は1.08、Mの値は0.04であった。接触抵抗値は24.3mΩで、グラウンディング特性が低かった。接着力はA面が8.80N/インチ、B面が1.32N/インチであり、B面側の接着強度が不十分であった。
経糸に直径27μm(繊度8dtex)のポリエチレンテレフタレート製モノフィラメント糸、緯糸に直径27μm(繊度8dtex)のポリエチレンテレフタレート製モノフィラメント融着糸から構成された、経糸密度、緯糸密度がともに100本/インチであるメッシュ平織物を、190℃でプレセットした。このメッシュ平織物に、実施例1と同様の方法でメッキ加工を行った。得られた導電性メッシュ織物の最大厚さは44μmであり、その開口率は82%であった。
コンマダイレクトコーターを使用し、離型シート(SLK-80KCT:住化加工紙株式会社製)とコンマヘッドのクリアランスを100μmに調整し、実施例1と同様の粘着剤塗工液を均一に塗工した。そして、120℃の乾燥機内を通過させ、厚さ37μmの粘着層が得られた。この粘着層に、作製した導電性メッシュ織物及び別の離型シート(EKR90R:リンテック株式会社製)を積層した。さらに、ラミネーターロールにより温度90℃、圧力3kg/cm2で貼り合せを行い、巻き取った。
上記で得られたロールを、そのまま40℃の条件下で3日間エージングを行い、粘着層を硬化させた。得られた導電テープについて、経糸及び緯糸の扁平率はともに1.1、Mの値は0.20であった。接触抵抗値は2.0mΩ、接着力はA面が10.80N/インチ、B面が8.50N/インチであり、いずれも良好であった。また、ハンドリング性に関しても、貼り付ける際に導電テープが切断されるようなこともなく、強度は十分であった。
(導電性メッシュ織物の作製)
経糸、緯糸ともに直径49μm(繊度26dtex)のポリエチレンテレフタレート製モノフィラメント糸から構成された、経糸密度、緯糸密度がともに200本/インチであるメッシュ平織物を、プレセットせずに、実施例1と同様の方法でめっき加工を行った。得られた導電性メッシュ織物の最大厚さは94μmであり、その開口率は37%であった。
コンマダイレクトコーターを使用し、離型シート(SLK-80KCT:住化加工紙株式会社製)とコンマヘッドのクリアランスを210μmに調整し、実施例1と同様の粘着剤塗工液を均一に塗工した。そして、120℃の乾燥機内を通過させ、厚さ78μmの粘着層を得た。この粘着層に、作製した導電性メッシュ織物及び別の離型シート(EKR90R:リンテック株式会社製)を積層した。さらに、ラミネーターロールにより温度60℃、圧力2kg/cm2で貼り合せを行い、巻き取った。
上記で得られたロールを、そのまま40℃の条件下で3日間エージングを行い、粘着層を硬化させた。得られた導電テープについて、経糸の扁平率は1.05、緯糸の扁平率は1.06、Mの値は0.04であった。接触抵抗値は測定不能(無限大)で、グラウンディング特性どころか、導通性が得られなかった。接着力はA面が19.63N/インチ、B面が6.65N/インチであり良好であった。
以上の結果より、優れた特性を有する導電テープを得るためには、数式1で表されるMの値が0.05~0.45の範囲内であることが必要である。
以上の結果より、優れた特性を有する導電テープを得るためには、熱可塑性合成繊維モノフィラメント糸が、断面形状において平均扁平率が1.1~3.0の範囲内であることが好ましい。そして、平均扁平率が1.1~2.5の範囲内であることが、より好ましい。
以上の結果より、優れた特性を有する導電テープを得るためには、導電性メッシュ織物の開口率が45~90%の範囲内であることが好ましい。そして、導電性メッシュ織物の開口率が60~85%の範囲内であることが、より好ましい。
2 緯糸
3 粘着膜
10 導電テープ
Claims (4)
- 表面に金属被膜を有する導電性メッシュ織物と、
該導電性メッシュ織物の開口部のみに形成された粘着剤からなる粘着膜と、
を有し、
前記導電性メッシュ織物の両面において前記金属被膜が前記粘着膜で被覆されずに露出しており、
前記導電性メッシュ織物を構成する糸条の少なくとも一部に熱可塑性合成繊維モノフィラメント糸を含み、
下記の数式1で得られるMの値が0.05~0.45の範囲内である導電テープ。
B2:モノフィラメントと交差する糸条の、交点以外での導電テープ厚さ方向の平均糸径
C:モノフィラメントが他の糸条と交差する交点における導電テープ厚さ) - 前記熱可塑性合成繊維モノフィラメント糸が、断面形状において平均扁平率が1.1~3.0の範囲内である請求項1に記載の導電テープ。
- 前記導電性メッシュ織物の開口率が45~90%の範囲内である請求項1または2に記載の導電テープ。
- 表面に金属被膜を有し、熱可塑性合成繊維モノフィラメント糸を構成要素の少なくとも一部とする導電性メッシュ織物を準備する工程と、
離型シート上に流動性を有する粘着剤を塗布し、厚さが前記導電性メッシュ織物の最大厚さの50~90%の範囲内となる粘着剤層を形成する工程と、
前記粘着剤層の上に前記導電性メッシュ織物を積層し、さらにその上にもう一枚の離型シートを積層してラミネートする工程と、
エージングを行い前記粘着剤層を硬化させて粘着膜を形成する工程とを有し、
下記の数式1で得られるMの値が0.05~0.45の範囲内である導電テープの製造方法。
B2:モノフィラメントと交差する糸条の、交点以外での導電テープ厚さ方向の平均糸径
C:モノフィラメントが他の糸条と交差する交点における導電テープ厚さ)
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