WO2012149698A1 - Led封装结构及液晶显示器 - Google Patents

Led封装结构及液晶显示器 Download PDF

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Publication number
WO2012149698A1
WO2012149698A1 PCT/CN2011/077013 CN2011077013W WO2012149698A1 WO 2012149698 A1 WO2012149698 A1 WO 2012149698A1 CN 2011077013 W CN2011077013 W CN 2011077013W WO 2012149698 A1 WO2012149698 A1 WO 2012149698A1
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WO
WIPO (PCT)
Prior art keywords
metal
package structure
led package
sidewall
lead frame
Prior art date
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Ceased
Application number
PCT/CN2011/077013
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English (en)
French (fr)
Inventor
张光耀
郑巍巍
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Application filed by Shenzhen China Star Optoelectronics Technology Co Ltd filed Critical Shenzhen China Star Optoelectronics Technology Co Ltd
Priority to US13/375,229 priority Critical patent/US20130010226A1/en
Publication of WO2012149698A1 publication Critical patent/WO2012149698A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

  • the present invention relates to the field of liquid crystal displays, and more particularly to an LED package structure of a backlight module.
  • LED is a kind of light-emitting diode, which is a common light source, which has the advantages of low power consumption and long service life, and is widely used in the fields of illumination, liquid crystal display and the like.
  • the LED package structure has an important influence on the improvement of the light output and heat dissipation of the LED.
  • FIG. 1 it is a schematic diagram of an LED package structure in which a lead frame is provided with a planar structure in the prior art.
  • the LED package structure 10 includes: an LED chip 11 and a lead frame (Lead Frame) 12. Shell 13.
  • the lead frame 12 is disposed in the housing of the outer casing 13, and the LED chip 11 is disposed on the surface of the lead frame 12.
  • the lead frame 12 includes two metal electrodes 12a and 12b. The two metal electrodes 12a and 12b are disconnected from each other, and the LED chip 11 is disposed on the metal electrode 12b of the lead frame 12 in an insulating manner.
  • the positive and negative electrodes of the LED chip 11 are respectively connected to the corresponding two metal electrodes 12a, 12b of the lead frame 12 through the two metal wires 14.
  • the outer casing 13 is for sealing the LED chip 11.
  • the sealing effect at the interface where the outer casing 13 is in contact with the lead frame 12 is not good, and the path in which the outside moisture reaches the closed space is short. Therefore, the moisture of the external environment is easily infiltrated into the closed LED space through the path pointed by the dotted line AA' arrow and the path indicated by the dotted line BB' arrow as shown in FIG. 1, affecting the performance of the LED package product, such as metal electrode vulcanization, etc. , which reduces the reliability of the product.
  • a transparent resin (not shown) is filled in the closed space formed by the outer casing 13 and the lead frame 12.
  • FIG. 2 it is a schematic diagram of an LED package structure in which a lead frame has a recess structure in the prior art.
  • the LED package structure 20 includes an LED chip 21, a lead frame 22, a case 23, and a transparent resin (not shown).
  • the LED chip 21 is provided on the surface of the depressed portion of the lead frame 22.
  • the lead frame 22 is disposed in the casing of the outer casing 23.
  • the lead frame 22 includes two metal electrodes 22a and 22b. The two metal electrodes 22a and 22b are disconnected from each other.
  • the LED chip 21 is disposed on the metal electrode 22a of the lead frame 22 in an insulated manner. on.
  • the positive and negative electrodes of the LED chip are respectively connected to the corresponding two metal electrodes 22a, 22b of the lead frame 22 through the two metal wires 24.
  • the outer casing 23 is for sealing the LED chip 21, and forms a closed space with the lead frame 22, and is filled with a transparent resin in the closed space.
  • the light emitted from the LED chip 21 is directly irradiated onto the metal sidewalls of the two metal electrodes 22a, 22b of the lead frame 22 which are recessed.
  • the metal material used usually absorbs part of the light due to the low reflectance, resulting in a decrease in the luminous flux emitted by the LED.
  • the LED package structure is compared with the LED package structure shown in FIG. 1 , although the path of external moisture reaching the enclosed space is extended, the path is simple, and the path length is still insufficient, and the moisture of the external environment can still be Pass the dotted line CC' as shown in Figure 2.
  • the path pointed by the arrow and the path pointed by the dotted line DD' arrow penetrate into the enclosed LED space, affecting the performance of the LED package product.
  • the present invention provides an LED package structure, including an LED chip, a lead frame, and a casing.
  • the lead frame is disposed in the casing of the outer casing, the lead frame includes a first metal sidewall, a second metal sidewall and a bottom surface, wherein the first metal sidewall and the second metal sidewall are respectively located On both sides of the bottom surface, the LED chip is disposed on the bottom surface, and the first metal sidewall surface and the second metal sidewall surface are provided with a plastic layer having high reflectivity, and the plastic layer is along the a first metal sidewall surface and a second metal sidewall surface extending away from the bottom surface and engaging the outer casing; the outer casing being a plastic housing and the outer casing and the first The metal sidewall surface and the plastic layer having a high reflectivity provided on the surface of the second metal sidewall are integrally formed.
  • the plastic layer having high reflectivity disposed on the first metal sidewall surface and the second metal sidewall surface is a polyphthalamide layer.
  • the outer casing is a casing made of a polyphthalamide material.
  • the plastic layer having high reflectivity disposed on the first metal sidewall surface and the second metal sidewall surface is a polyimide layer.
  • the outer casing is a casing made of a polyimide material.
  • the lead frame includes a first metal electrode and a second metal electrode, the first metal electrode and the second metal electrode are disconnected from each other, and are respectively connected to the positive and negative electrodes of the external power source, and the first The metal electrode and the second metal electrode are connected to the positive and negative electrodes of the LED chip through two metal wires.
  • the first metal electrode and the second metal electrode respectively have a meander shape.
  • the outer casing and the bottom surface of the lead frame form a closed space, and the closed space is filled with a transparent resin.
  • a metal plating layer having a high reflectivity is disposed on a side of the outer casing that is illuminated by light emitted from the LED chip.
  • the present invention also provides an LED package structure, including an LED chip, a lead frame, and an outer casing.
  • the lead frame is disposed in a casing of the outer casing, and the lead frame includes a first metal sidewall, a second metal sidewall, and a bottom surface.
  • the first metal sidewall and the second metal sidewall are respectively located at two sides of the bottom surface, and the LED chip is disposed on the bottom surface, the first metal sidewall surface and the second metal side
  • the wall surface is provided with a plastic layer having a high reflectivity, and the plastic layer extends away from the bottom surface along the first metal sidewall surface and the second metal sidewall surface and is engaged with the outer casing.
  • the outer casing is made of plastic having high reflectivity, and the outer casing is integrally formed with a plastic layer having high reflectivity provided on the first metal side wall surface and the second metal side wall surface.
  • the plastic layer having high reflectivity disposed on the surface of the first metal sidewall and the surface of the second metal sidewall is a plastic layer made of polyphthalamide.
  • the outer casing is a casing made of a polyphthalamide material, and the outer casing is provided with poly-o-xylene from the surface of the first metal sidewall and the surface of the second metal sidewall
  • the plastic layer made of amide is integrally formed.
  • the lead frame includes a first metal electrode and a second metal electrode, the first metal electrode and the second metal electrode are disconnected from each other, and are respectively connected to the positive and negative electrodes of the external power source, and the first The metal electrode and the second metal electrode are connected to the positive and negative electrodes of the LED chip through two metal wires.
  • the first metal electrode and the second metal electrode respectively have a meander shape.
  • the outer casing and the bottom surface of the lead frame form a closed space, and the closed space is filled with a transparent resin.
  • a metal plating layer having a high reflectivity is disposed on a side of the outer casing that is illuminated by light emitted from the LED chip.
  • the plastic layer having high reflectivity disposed on the first metal sidewall surface and the second metal sidewall surface is a plastic layer made of polyimide.
  • the first metal sidewall, the second metal sidewall and the bottom surface form a groove
  • the groove has a truncated cone shape, wherein the bottom surface is an upper bottom of a truncated cone,
  • the opening of the groove is the lower bottom of the truncated cone, and the length of the upper bottom of the truncated cone is smaller than the length of the lower bottom of the truncated cone.
  • the present invention also provides a liquid crystal display comprising a liquid crystal display panel and a backlight module, the backlight module comprising the LED package structure as described above.
  • the LED package structure and the liquid crystal display of the present invention by providing a plastic layer having high reflectivity on the metal sidewall of the lead frame, the loss of luminous flux caused by direct illumination of the LED on the metal sidewall is reduced.
  • FIG. 1 is a schematic view of an LED package structure in which a lead frame is provided with a planar structure in the prior art.
  • FIG. 2 is a schematic view of an LED package structure in which a lead frame has a recess structure in the prior art.
  • FIG 3 is a schematic view of a preferred embodiment of an LED package structure of the present invention.
  • FIG. 3 is a schematic diagram of a preferred embodiment of the LED package structure of the present invention.
  • the LED package structure 100 includes an LED chip 110, a lead frame 120, a housing 130, and a transparent resin (not shown).
  • the lead frame 120 is disposed in the casing of the outer casing 130, and the LED chip 110 is disposed on the surface of the lead frame 120.
  • the lead frame 120 includes a first metal electrode 120a and a second metal electrode 120b.
  • the first and second metal electrodes 120a and 120b are disconnected from each other and connected to the positive and negative electrodes of an external power source (not shown).
  • the first and second metal electrodes 120a, 120b of the lead frame 120 are electrically connected to the positive and negative electrodes of the LED chip 110 through the two metal wires 140.
  • Each of the first and second metal electrodes 120a and 120b has a meandering shape, and the path through which moisture is infiltrated is bent, so that it is difficult to penetrate into the LED package cavity.
  • the structure of the lead frame 120 includes a first metal sidewall 121, a second metal sidewall 122, and a bottom surface 123.
  • the first metal sidewall 121, the second metal sidewall 122, and the bottom surface 123 form a recess, and the first metal sidewall 121 And the second metal sidewalls 122 are respectively located on both sides of the bottom surface 123.
  • the LED chip 110 is disposed on the bottom surface 123.
  • the first metal sidewall 121 is disposed on the first metal electrode 120a
  • the second metal sidewall 122 is disposed on the first metal electrode 120b
  • the bottom surface 123 is bent at one end of the first and second metal electrodes 120a and 120b in the same plane.
  • the outer casing 130 is for sealing the LED chip 110, and forms a closed space with the bottom surface 123 of the lead frame 120, and is filled with a transparent resin in the closed space.
  • a plastic layer 131, 132 having a high reflectivity is disposed on a surface of the first metal sidewall 121 of the lead frame 120 and a surface of the second metal sidewall 122, and the plastic layers 131, 132 are along the surface of the first metal sidewall 121, and the second The surface of the metal sidewall 122 extends away from the bottom surface 123 and engages the outer casing 130.
  • the above-mentioned external moisture reaches the closed of the LED package structure.
  • the path of the space is longer than the path of the prior art, and the path is more tortuous. Therefore, it is difficult for the external moisture to enter the closed space, thereby effectively preventing the external moisture from infiltrating into the closed space and affecting the performance of the LED chip. Increased the reliability of LED package products.
  • the outer casing 130 is a plastic casing, and the outer casing 130 is made of plastic having high reflectivity, and the outer casing 130 and the surface of the first metal sidewall 121 covering the lead frame 120 and the second metal side.
  • the plastic layers 131 and 132 having high reflectivity on the surface of the wall 122 are integrally formed, which can improve the sealing performance of the enclosed space of the LED package structure, effectively prevent the intrusion of external moisture, and more effectively prevent external moisture from penetrating into the closed space.
  • the performance of LED chips has an impact and improves the reliability of LED package products.
  • the plastic layers 131, 132 having high reflectivity disposed on the surface of the first metal sidewall 121 of the lead frame 120 and the surface of the second metal sidewall 122 are made of polyphthalamide (PPA, Polyphthalamide). a finished plastic layer or a plastic layer made of polyimide.
  • the outer casing 130 is also a casing made of a polyphthalamide material.
  • the outer casing 130 is integrally formed with a plastic layer 131, 132 made of polyphthalamide covering the surface of the first metal side wall 121 of the lead frame 120 and the surface of the second metal side wall 122.
  • the outer casing 130 and the plastic layers 131, 132 made of polyphthalamide can be integrally formed by a common mold forming method, such as injection molding, to reduce the manufacturing cost of the product.
  • the LED package structure of the present invention is provided with plastic layers 131, 132 having high reflectivity on the surface of the first metal sidewall 121 of the lead frame 120 and the surface of the second metal sidewall 122.
  • the light emitted by the LED chip 110 directly illuminates the plastic layers 131, 132 having high reflectivity and is reflected out of the enclosed space of the LED package structure, thereby reducing the loss of luminous flux caused by the LED directly illuminating the metal sidewall.
  • the first metal sidewall 121, the second metal sidewall 122 and the bottom surface 123 form a groove, and the groove has a truncated cone shape, wherein the bottom surface 123 is the upper bottom of the circular table, and the opening of the groove is the lower bottom of the circular table.
  • the length of the upper bottom of the truncated cone is smaller than the length of the lower base of the truncated cone so that the light is easily emitted.
  • a high-reflectivity metal plating layer such as a silver plating layer, is disposed on the side of the outer casing that is illuminated by the light emitted by the LED chip.
  • the present invention also provides a liquid crystal display comprising a liquid crystal display panel and a backlight module, the backlight module comprising the LED package structure as described above, which will not be described in detail herein.

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Description

LED封装结构及液晶显示器
技术领域
本发明涉及液晶显示器领域，尤其涉及背光模组的LED封装结构。
背景技术
LED即发光二极管，是一种常见光源，其具有低功耗、使用寿命长等优点，广泛使用于照明、液晶显示器等领域。其中，LED封装结构对LED的出光和散热的提高具有重要的影响。
如图1所示，其为现有技术中导线框设有平面结构的LED封装结构的示意图。该LED封装结构10包括：LED芯片11、导线框（Lead Frame）12、外壳13。导线框12设于外壳13的壳体内，LED芯片11设于导线框12的表面。其中，导线框12包括二金属电极12a、12b，该二金属电极12a、12b彼此断开，LED芯片11以绝缘方式设于导线框12的金属电极12b上。LED芯片11的正、负电极分别通过二金属导线14连接到导线框12的相对应的二金属电极12a、12b。外壳13用于密封LED芯片11。但是，在这种LED封装结构中，在外壳13与导线框12接触的界面密封效果并不佳，且外界湿气到达封闭空间的路径较短。因此，外部环境的湿气易于通过如图1所示的虚线AA’箭头指向的路径和虚线BB’箭头指向的路径渗入到封闭的LED空间内，影响LED封装产品的性能，如金属电极硫化等，从而降低了产品的信赖度。
此外，在外壳13与导线框12形成封闭空间中填充透明树脂（图中未示出）。
如图2所示，其为现有技术中导线框具有凹部结构的LED封装结构的示意图。该LED封装结构20包括：LED芯片21、导线框22、外壳23和透明树脂（图未示）。LED芯片21设于导线框22的下凹部位的表面上。其中，导线框22设于外壳23的壳体内，导线框22包括二金属电极22a、22b，该二金属电极22a、22b彼此断开，LED芯片21以绝缘方式设于导线框22的金属电极22a上。LED芯片的正、负电极分别通过二金属导线24连接到导线框22的相对应的二金属电极22a、22b。外壳23用于密封LED芯片21，与导线框22形成封闭空间，在封闭空间中填充有透明树脂。但是，在这种将导线框22具有下凹结构的LED封装结构中，LED芯片21发出的光线会直接照射到导线框22的两金属电极22a、22b因下凹形成的金属侧壁上，而所采用的金属材料由于反射率不高，通常会吸收部分光线，导致LED射出的光通量降低。此外，该LED封装结构与如图1所示的LED封装结构相比，虽然外界湿气到达封闭空间的路径有所延长，但路径较简单，且路径长度仍不足，外部环境的湿气仍可通过如图2所示的虚线CC’ 箭头指向的路径和虚线DD’ 箭头指向的路径渗入到封闭的LED空间内，影响LED封装产品的性能。
发明内容
为解决现有技术的LED封装结构中，外部湿气渗入到LED芯片所在的封闭空间中影响LED封装产品性能的问题，本发明提供一种LED封装结构，包括LED芯片、导线框、外壳，所述导线框设于所述外壳的壳体内，所述导线框包括第一金属侧壁、第二金属侧壁及底面，所述第一金属侧壁和所述第二金属侧壁分别位于所述底面的两侧，所述LED芯片设于所述底面，所述第一金属侧壁表面和所述第二金属侧壁表面设有具有高反射率的塑料层，且所述塑料层沿所述第一金属侧壁表面和所述第二金属侧壁表面向远离所述底面方向延伸，并与所述外壳接合；所述外壳为塑料制成的壳体，且所述外壳与所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层一体成型。
优选地，在所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层为聚邻苯二甲酰胺层。
优选地，所述外壳为由聚邻苯二甲酰胺材料制成的壳体。
优选地，在所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层为聚酰亚胺层。
[根据细则91更正 16.08.2011]　
优选地，所述外壳为由聚酰亚胺材料制成的壳体。
优选地，所述导线框包括第一金属电极、第二金属电极，所述第一金属电极、所述第二金属电极彼此断开，分别连接到外部电源的正、负极，且所述第一金属电极、所述第二金属电极通过二金属导线连接所述LED芯片的正、负电极。
优选地，所述第一金属电极与所述第二金属电极分别呈蜿蜒状。
优选地，所述外壳与所述导线框的所述底面构成封闭空间，所述封闭空间内填充有透明树脂。
优选地，所述外壳的被LED芯片发出的光线照射的侧面上设置具有高反射率的金属镀层。
本发明还提供一种LED封装结构，包括LED芯片、导线框、外壳，所述导线框设于所述外壳的壳体内，所述导线框包括第一金属侧壁、第二金属侧壁及底面，所述第一金属侧壁和所述第二金属侧壁分别位于所述底面的两侧，所述LED芯片设于所述底面，所述第一金属侧壁表面和所述第二金属侧壁表面设有具有高反射率的塑料层，且所述塑料层沿所述第一金属侧壁表面和所述第二金属侧壁表面向远离所述底面方向延伸，并与所述外壳接合。
优选地，所述外壳采用具有高反射率的塑料制成，且所述外壳与所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层一体成型。
优选地，在所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层为由聚邻苯二甲酰胺制成的塑料层。
优选地，所述外壳为由聚邻苯二甲酰胺材料制成的壳体，所述外壳与所述第一金属侧壁表面和所述第二金属侧壁表面设置的由聚邻苯二甲酰胺制成的塑料层一体成型。
优选地，所述导线框包括第一金属电极、第二金属电极，所述第一金属电极、所述第二金属电极彼此断开，分别连接到外部电源的正、负极，且所述第一金属电极、所述第二金属电极通过二金属导线连接所述LED芯片的正、负电极。
优选地，所述第一金属电极、第二金属电极分别呈蜿蜒状。
优选地，所述外壳与所述导线框的所述底面构成封闭空间，所述封闭空间内填充有透明树脂。
优选地，所述外壳的被LED芯片发出的光线照射的侧面上设置具有高反射率的金属镀层。
优选地，在所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层为由聚酰亚胺制成的塑料层。
优选地，所述第一金属侧壁、所述第二金属侧壁和所述底面形成一凹槽，所述凹槽的形状为圆台形，其中，所述底面为圆台的上底，所述凹槽的开口为圆台的下底，所述圆台的上底长度小于所述圆台的下底长度。
本发明还提供一种液晶显示器，包括液晶显示面板和背光模组，所述背光模组包括如上所述的LED封装结构。
本发明的LED封装结构及液晶显示器，通过在导线框的金属侧壁设置具有高反射率的塑料层，减小了LED直接照射在金属侧壁造成的光通量的损失。
附图说明
图1是现有技术中导线框设有平面结构的LED封装结构的示意图。
图2是现有技术中导线框具有凹部结构的LED封装结构的示意图。
图3是本发明LED封装结构的较佳实施方式的示意图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
以下将结合附图及实施方式，对实现本发明目的的技术方案作详细说明。应当理解，此处所描述的具体实施方式仅仅用以解释本发明，并不用于限定本发明。
请参照图3，其为本发明LED封装结构的较佳实施方式的示意图。该LED封装结构100包括：LED芯片110、导线框120、外壳130和透明树脂（图未示）。导线框120设于外壳130的壳体内，LED芯片110设于导线框120表面。其中，导线框120包括第一金属电极120a、第二金属电极120b，该第一、第二金属电极120a、120b彼此断开，分别连接到外部电源（图中未示出）的正、负极。导线框120的第一、第二金属电极120a、120b通过二金属导线140与LED芯片110的正、负电极电连接。第一、第二金属电极120a、120b分别呈蜿蜒状，使湿气渗入的路径变曲折，从而难以渗入到LED封装腔内。
导线框120的结构包括第一金属侧壁121、第二金属侧壁122及底面123，第一金属侧壁121、第二金属侧壁122和底面123构成一个凹槽，第一金属侧壁121和第二金属侧壁122分别位于底面123的两侧。LED芯片110设于底面123上。 其中第一金属侧壁121设于第一金属电极120a，第二金属侧壁122设于第一金属电极120b，底面123由第一、第二金属电极120a、120b一端弯折在同一平面内相向延伸构成。外壳130用于密封LED芯片110，与导线框120的底面123形成封闭空间，在封闭空间中填充有透明树脂。
在导线框120的第一金属侧壁121表面、第二金属侧壁122表面设有具有高反射率的塑料层131、132，且塑料层131、132沿第一金属侧壁121表面、第二金属侧壁122表面向远离底面123方向延伸，并与外壳130接合。这样，如图3所示，虽然外界湿气仍有可能沿着虚线EE’箭头所指的路径和虚线FF’箭头所指的路径进入封闭空间内，但是上述外界湿气到达LED封装结构的封闭空间的路径比现有技术的路径更长，且路径更曲折，因而，外界湿气要进入封闭空间的难度较大，从而有效避免外界湿气渗入封闭空间内对LED芯片的性能带来影响，提高了LED封装产品的信赖度。
进一步地，外壳130为塑料制成的壳体，较由地，外壳130采用具有高反射率的塑料制成，且外壳130与覆盖导线框120的第一金属侧壁121表面、第二金属侧壁122表面的具有高反射率的塑料层131、132一体成型，可以提高LED封装结构的封闭空间的密封性能，有效地防止外界湿气的侵入，更有效地避免外界湿气渗入封闭空间内对LED芯片的性能带来影响，提高了LED封装产品的信赖度。
在一个实施例中，在导线框120的第一金属侧壁121表面、第二金属侧壁122表面设置的具有高反射率的塑料层131、132为由聚邻苯二甲酰胺（PPA，Polyphthalamide）制成的塑料层或由聚酰亚胺（polyimide）制成的塑料层。
进一步地，外壳130也是由聚邻苯二甲酰胺材料制成的壳体。外壳130与覆盖导线框120的第一金属侧壁121表面、第二金属侧壁122表面的由聚邻苯二甲酰胺制成的塑料层131、132一体成型。外壳130与由聚邻苯二甲酰胺制成的塑料层131、132可采用常见的模具成型方式一体成型，如采用射出成型的方式一体成型，这样可降低产品的制造成本。
因此，相较于现有技术，本发明的LED封装结构通过在导线框120的第一金属侧壁121表面、第二金属侧壁122表面设置具有高反射率的塑料层131、132， LED芯片110发出的光线直接照射到具有高反射率的塑料层131、132上，并被反射出LED封装结构的封闭空间外，减少了LED直接照射在金属侧壁上造成的光通量的损失。
当然，本发明并不局限于上述较佳实施方式所揭示的内容，例如，可对LED封装结构内部进行优化, 将第一金属侧壁121、第二金属侧壁122和底面123构成凹槽，该凹槽的形状为圆台形，其中，底面123为圆台的上底，凹槽的开口为圆台的下底，圆台的上底长度小于圆台的下底长度，以便光线易于射出。另外，又如在外壳的被LED芯片发出的光线照射的侧面上设置高反射率的金属镀层，如设置镀银层。
此外，本发明还提出一种液晶显示器，该液晶显示器包括液晶显示面板和背光模组，该背光模组包括如上所述的LED封装结构，在此不作详述。
凡是利用本发明说明书及附图内容所作的等效结构或流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种LED封装结构，包括LED芯片、导线框、外壳，所述导线框设于所述外壳的壳体内，所述导线框包括第一金属侧壁、第二金属侧壁及底面，所述第一金属侧壁和所述第二金属侧壁分别位于所述底面的两侧，所述LED芯片设于所述底面，其特征在于，所述第一金属侧壁表面和所述第二金属侧壁表面分别设有具有高反射率的塑料层，且所述塑料层沿所述第一金属侧壁表面和所述第二金属侧壁表面向远离所述底面方向延伸，并与所述外壳接合；所述外壳为塑料制成的壳体，且所述外壳与所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层一体成型。
  2. 根据权利要求1所述的LED封装结构，其特征在于，在所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层为聚邻苯二甲酰胺层。
  3. 根据权利要求2所述的LED封装结构，其特征在于，所述外壳为由聚邻苯二甲酰胺材料制成的壳体。
  4. 根据权利要求1所述的LED封装结构，其特征在于，在所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层为聚酰亚胺层。
  5. 根据权利要求4所述的LED封装结构，其特征在于，所述外壳为由聚酰亚胺材料制成的壳体。
  6. 根据权利要求1所述的LED封装结构，其特征在于，所述导线框包括第一金属电极、第二金属电极，所述第一金属电极、所述第二金属电极彼此断开，分别连接到外部电源的正、负极，且所述第一金属电极、所述第二金属电极通过二金属导线对应连接所述LED芯片的正、负电极。
  7. 根据权利要求6所述的LED封装结构，其特征在于，所述第一金属电极与所述第二金属电极分别呈蜿蜒状。
  8. 根据权利要求7所述的LED封装结构，其特征在于，所述外壳与所述导线框的所述底面构成封闭空间，所述封闭空间内填充有透明树脂。
  9. 根据权利要求1所述的LED封装结构，其特征在于，所述外壳的被LED芯片发出的光线照射的侧面上设置具有高反射率的金属镀层。
  10. 一种LED封装结构，包括LED芯片、导线框、外壳，所述导线框设于所述外壳的壳体内，所述导线框包括第一金属侧壁、第二金属侧壁及底面，所述第一金属侧壁和所述第二金属侧壁分别位于所述底面的两侧，所述LED芯片设于所述底面，其特征在于，所述第一金属侧壁表面和所述第二金属侧壁表面设有具有高反射率的塑料层，且所述塑料层沿所述第一金属侧壁表面和所述第二金属侧壁表面向远离所述底面方向延伸，并与所述外壳接合。
  11. 根据权利要求10所述的LED封装结构，其特征在于，所述外壳采用具有高反射率的塑料制成，且所述外壳与所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层一体成型。
  12. 根据权利要求11所述的LED封装结构，其特征在于，在所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层为由聚邻苯二甲酰胺制成的塑料层。
  13. 根据权利要求12所述的LED封装结构，其特征在于，所述外壳为由聚邻苯二甲酰胺材料制成的壳体。
  14. 根据权利要求10所述的LED封装结构，其特征在于，所述导线框包括第一金属电极、第二金属电极，所述第一金属电极、所述第二金属电极彼此断开，分别连接到外部电源的正、负极，且所述第一金属电极、所述第二金属电极通过二金属导线连接所述LED芯片的正、负电极。
  15. 根据权利要求14所述的LED封装结构，其特征在于，所述第一金属电极、第二金属电极呈蜿蜒状。
  16. 根据权利要求10所述的LED封装结构，其特征在于，所述外壳与所述导线框的所述底面构成封闭空间，所述封闭空间内填充有透明树脂。
  17. 根据权利要求16所述的LED封装结构，其特征在于，所述外壳的被LED芯片发出的光线照射的侧面上设置具有高反射率的金属镀层。
  18. 根据权利要求10所述的LED封装结构，其特征在于，在所述第一金属侧壁表面和所述第二金属侧壁表面设置的具有高反射率的塑料层为由聚酰亚胺制成的塑料层。
  19. 根据权利要求10所述的LED封装结构，其特征在于，所述第一金属侧壁、所述第二金属侧壁及所述底面构成一凹槽，所述凹槽的形状为圆台形，其中，所述底面为圆台的上底，所述凹槽的开口为圆台的下底，所述圆台的上底长度小于所述圆台的下底长度。
  20. 一种液晶显示器，包括液晶显示面板和背光模组，其特征在于，所述背光模组包括LED封装结构，所述LED封装结构包括LED芯片、导线框、外壳，所述导线框设于所述外壳的壳体内，所述导线框包括第一金属侧壁、第二金属侧壁及底面，所述第一金属侧壁和所述第二金属侧壁分别位于所述底面的两侧，所述LED芯片设于所述底面，其特征在于，所述第一金属侧壁表面和所述第二金属侧壁表面设有具有高反射率的塑料层，且所述塑料层沿所述第一金属侧壁表面和所述第二金属侧壁表面向远离所述底面方向延伸，并与所述外壳接合。
PCT/CN2011/077013 2011-05-03 2011-07-09 Led封装结构及液晶显示器 Ceased WO2012149698A1 (zh)

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