WO2012146066A1 - 布料电子化的产品及方法 - Google Patents
布料电子化的产品及方法 Download PDFInfo
- Publication number
- WO2012146066A1 WO2012146066A1 PCT/CN2012/000574 CN2012000574W WO2012146066A1 WO 2012146066 A1 WO2012146066 A1 WO 2012146066A1 CN 2012000574 W CN2012000574 W CN 2012000574W WO 2012146066 A1 WO2012146066 A1 WO 2012146066A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fabric
- transmission line
- conductive
- electronic component
- cloth
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
- A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
- A61B5/6802—Sensor mounted on worn items
- A61B5/6804—Garments; Clothes
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/02—Details
- A61N1/04—Electrodes
- A61N1/0404—Electrodes for external use
- A61N1/0472—Structure-related aspects
- A61N1/0484—Garment electrodes worn by the patient
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
- A61N1/00—Electrotherapy; Circuits therefor
- A61N1/16—Screening or neutralising undesirable influences from or using, atmospheric or terrestrial radiation or fields
-
- D—TEXTILES; PAPER
- D05—SEWING; EMBROIDERING; TUFTING
- D05B—SEWING
- D05B23/00—Sewing apparatus or machines not otherwise provided for
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2560/00—Constructional details of operational features of apparatus; Accessories for medical measuring apparatus
- A61B2560/04—Constructional details of apparatus
- A61B2560/0443—Modular apparatus
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/02—Details of sensors specially adapted for in-vivo measurements
- A61B2562/0219—Inertial sensors, e.g. accelerometers, gyroscopes, tilt switches
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/18—Shielding or protection of sensors from environmental influences, e.g. protection from mechanical damage
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
- A61B5/0205—Simultaneously evaluating both cardiovascular conditions and different types of body conditions, e.g. heart and respiratory condition
- A61B5/02055—Simultaneously evaluating both cardiovascular condition and temperature
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
- A61B5/024—Detecting, measuring or recording pulse rate or heart rate
- A61B5/02438—Detecting, measuring or recording pulse rate or heart rate with portable devices, e.g. worn by the patient
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/08—Detecting, measuring or recording devices for evaluating the respiratory organs
- A61B5/0816—Measuring devices for examining respiratory frequency
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
- A61B5/316—Modalities, i.e. specific diagnostic methods
- A61B5/389—Electromyography [EMG]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/40—Applying molten plastics, e.g. hot melt
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
- B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
- B29C65/62—Stitching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Definitions
- the present invention relates to a product and method for electronically distributing cloth, and more particularly to a product and method for electronically distributing cloth, which is separately produced and re-sewed together with an electronic component and a transmission line.
- the circuit substrate is a package cloth or a hot melt adhesive film; the electronic component or the transmission line is first sewed or attached to the substrate, and then the circuit board is sewn, glued or heated to be fixed on the clothing fabric to achieve electronic layout of the cloth.
- 6,493,393 discloses a package in which a conductive wire is formed on the conductive end of each electronic component to form a package, and the conductive wire and the bottom fabric are fixed by a conductive transmission line and the electronic component thereof.
- the conductive lines are connected to each other to insulate each of the conductive transmission lines of the electronic component to form a method of fabric circuit, but it is easy to make conductive transmission threads and electronic components as long as the cloth or electronic component is subjected to an external force.
- the conductive wires are broken apart separately.
- U.S. Patent No. 7,025,596 discloses the prior art of placing an electronic component on a carrier, with the wire passing through the body, a conductive area on the body, and a wire on the cloth for use between the two. Another wire is stitched to form a method of electronically forming the cloth, which is very complicated and is carried out on a carr ier and is therefore susceptible to external forces.
- U.S. Patent No. 12/787,376 also teaches the electronic formation of a cloth through a base while having two pins extending from the body and then communicating with the pins.
- U.S. Patent No. 6,672,025 is also a method of forming a circuit on a substrate and then fixing the substrate to the cloth to form an electronic device.
- U.S. Patent No. 7,592,276 discloses the provision of electronic components on the warp and weft of a fabric itself, and the connection of the electronic components to the signal wires is conducted by the intersection of the warp and the weft, which limits the insulation of the electronic components and the wires. The orientation between them, and when the electronic components and signal lines are broken or short-circuited, they cannot be replaced. In addition, it shuttles up and down the fabric through the conductive yarn 120, and The conductive electronic component is in contact with the functional yarn 150, and has no insulation design, and is susceptible to external interference. The method described in US Patent No.
- 2003/0212319A1 is to sew the transmission line on the cloth, and the conductive area of the electronic component is connected with the transmission line, but the transmission line 6, 7 (shown in FIG. 2) will be in contact with human skin, which will Causes the signal to be disturbed by the skin and vulnerable to external friction.
- the electronic component conductive region and the transmission line communication region of the US Patent No. 4,158,103 A and the Chinese Patent No. 1,016,057, A (US2003/0211797 A1) also have no package insulator.
- the existing fabrics can generally be cotton, polyester (polyes ter), nylon, plastic, etc., and can be divided into conductive cloth, semi-conductive cloth or non-conductive cloth, and the fabric can be formed into plain weaving, knitting, woven, Embroidery, weaving, etc.
- the components of the transmission line are usually made of metal fibers such as copper, gold, silver, nickel, aluminum, iron, stainless steel or nickel alloy.
- non-conductive fibers are embedded or coated with conductive components such as conductive carbon, nickel, copper, Gold, silver, titanium or conductive multi-molecular materials or wires, etc., for example, U.S. Patent No. 5,881,547, the disclosure of which is incorporated herein by reference.
- U.S. Patent No. 6,955,525 discloses a conductive yarn formed by a relatively high resistance yarn such as a stainless steel yarn having a relatively low resistance metal or alloy.
- a relatively high resistance yarn such as a stainless steel yarn having a relatively low resistance metal or alloy.
- the two wires are turned on at the intersection, but the connection to the electronic components is not described.
- the conduction between the transmission line and the electronic component is achieved without tin "welding", and the transmission line can use various wires.
- Transmission lines or electronic components "seam" There is no special method for fabrics, that is, general weaving, knitting, weaving, embroidery, etc.
- the conventional enameled wire is formed by applying an insulating paint film to the conductor and drying it, which is very difficult to use for the transmission line on the cloth.
- one or more strands of yarn are wound around the enameled wire as a protective layer, so that it can be "stitched” on the fabric, and when the fabric is subjected to an external force (washed by the washing machine), it is not easily broken.
- the method of electronically distributing cloth is mainly to use cloth or hot melt film as "circuit board” and various electronic Components (such as resistors, capacitors, inductors, switches, tubes, amplifiers, trees to / digital, digital / scale to converters, processors, batteries or sensors such as body temperature, breathing, heartbeat, electromyography, accelerometers, gyroscopes, Microphones, cameras, etc., or other components, such as instruments for the treatment of transcutaneous electrical nerve stimulation
- Various electronic components such as resistors, capacitors, inductors, switches, diodes, amplifiers, analog/digital, digital/modulars, processors, batteries or sensors such as body temperature, breathing, heartbeat, electromyography, accelerometers, gyros Instrument, microphone, camera, etc., or other components such as temperature sensor, chemical sensor, biosensor, force sensor, pressure, sound, electric field, magnetic field, light weight, acceleration and / or environmental conditions, source tension, force, heat, electromagnetic Radiation and / or sound, infrared and / or wireless transmitters and / or receivers, imagers, CCD imaging, thermoelectric sensors, coolers, heaters and / or generators, liquid crystal components, electroluminescent components, organic light Components, 0LED, Electrophoretic Elements, LED, Piezoelectric Components and / or Sensors, Microphone Speakers, Acoustic Sensors, Resistors, Processors, Digital Signal Processors, Microprocessors, Microcontrollers, CPUs, Analog-to-Digital
- the object of the present invention is to overcome the shortcomings of the existing products and methods for electronically distributing cloth, and to provide a new product and method for electronically distributing cloth.
- the technical problem to be solved is to make the traditional fabric and the traditional The combination of electronic components and today's wire technology, using cloth or hot melt film to set up electronic components and transmission lines on the board and on the fabric or hot melt film and then set it up. It is placed on textiles or clothing to make the cloth electronic, which is very suitable for practical use.
- Another object of the present invention is to provide a new product and method for electronically distributing cloth by overcoming the defects of the existing products and methods for electronically distributing cloth, and the technical problem to be solved is to make cloth electronic
- the process is simplified, the fabric is separated from the electronic components or the transmission line, and then integrated into one, and the electronic components are first combined with the transmission line, and then sewn into the cloth, and then the electronic fabric is sewn to another
- the cloth is sealed and insulated, that is, the electronic circuit is first placed on the package cloth, and the package cloth is sewn on the clothes or the electronic circuit is first set on the clothes and then covered with a package cloth to complete the packaging, insulation, Waterproof, typographical, to prevent damage caused by the outside world.
- it does not "weld” on the fabric, so it does not harm the environment and the human body, and does not damage the fabric, so that it is more suitable for practical use.
- a further object of the present invention is to provide a new product and method for electronically distributing cloth by overcoming the defects of the existing products and methods for electronically distributing cloth, and the technical problem to be solved is to utilize hot melt glue.
- the electronic component and the transmission line are fixed on the hot melt adhesive film, and then the hot melt adhesive film is dissolved into the clothing fabric or the package fabric to achieve the functions of packaging, insulation, waterproofing, typesetting, and external damage prevention, thereby further Suitable for practical use.
- Still another object of the present invention is to provide a new product and method for electronically distributing cloth by overcoming the defects of the existing products and methods for electronically distributing cloth, and the technical problem to be solved is to make it no matter what kind of use.
- Fabrics which weaving methods such as plain weaving, knitting, weaving, embroidery, etc., can be used to realize the electronicization of fabrics and the production of intelligent clothing, and can be maintained under different external force environments such as washing and washing. The integrity and function of the circuit is normal, making it more suitable for practical use.
- a fabric electronic product comprising: a cloth, at least one electronic component and at least one transmission line, the electronic component having a conductive area, wherein the conductive area of the electronic component is first connected to the transmission line and then sewn on the package cloth Then, it is sewn or attached to the clothing fabric, or the conductive area of the electronic component is first connected to the transmission line and then sewn on the clothing fabric, and then sewn or attached to the packaging cloth.
- the material comprising: a cloth, at least one electronic component and at least one transmission line, the electronic component having a conductive area, wherein the conductive area of the electronic component is first connected to the transmission line and then sewn on the package cloth Then, it is sewn or attached to the clothing fabric, or the conductive area of the electronic component is first connected to the transmission line and then sewn on the clothing fabric, and then sewn or attached to the packaging cloth.
- An electronically printed product comprises: a cloth, a hot melt film, at least one electronic component and a transmission line.
- the transmission line and the electronic component are fixed on the hot melt adhesive film to fix the transmission line and the electronic component on the hot melt adhesive film.
- the electronic component has a conductive area, wherein the conductive component of the electronic component and the transmission line is fixed on the hot melt adhesive film, and the electronic component The conductive area of the component is connected to the transmission line, and then the hot melt film is then incorporated into the package fabric or the apparel fabric.
- the object of the present invention and solving the technical problems thereof can be further realized by the following technical measures.
- the aforementioned electronically printed product in which the conductive region and the transmission line of the electronic component on the cloth, or the conductive region of the electronic component and the conductive region of another electronic component, or the connection between the transmission line and the transmission line are not used for soldering.
- the conductive region of the electronic component is first connected to the transmission line by mutual entanglement, knotting or spot welding, and then sewn on the cloth or disposed on the hot melt adhesive film.
- the above-mentioned electronically printed product wherein the transmission line is sewn on the cloth or the hot melt adhesive film, and the coagulation force, adhesion, pressure or tension generated by the adhesion between the transmission line and the cloth or the hot melt adhesive film causes the electronic component to be
- the conductive area is in communication with the transmission line.
- the transmission line in which the transmission line is sewn on the cloth, the pressure or tension generated by the adhesion between the transmission line and the cloth causes the conductive region of the electronic component placed between the two to communicate with the transmission line, and at the same time
- the clothing fabric itself has seams, so the electronic component itself and the conductive area are respectively located on different sides of the package or the clothing fabric, so there is a cloth on the upper and lower sides to complete the packaging of the entire electronic circuit.
- the above-mentioned electronically printed product wherein the transmission line is laid flat on the fabric, and the transmission line of one cloth or hot melt film is in a dot shape, and the point-shaped transmission line is pulled out of the cloth or the hot melt film to form a ring.
- the conductive area of the electronic component can be trapped.
- the above-mentioned cloth electronic product wherein the transmission line is knitted on the cloth or the hot melt film, and the ring is formed at the same point or near two points of the cloth or the hot melt film, so that the conductive area of the electronic component can be used. Set it up.
- the aforementioned electronically printed product wherein the transmission line is first sewn on the cloth or the hot melt adhesive film, the conductive area of the electronic component is placed on the transmission line, and the result of sewing the electronic component with the cloth or the hot melt adhesive film by using the yarn
- the conductive area of the electronic component is electrically connected to the transmission line.
- the transmission line is sewn on the cloth or the hot-melt adhesive film
- the transmission line is multi-strand, so that the conductive area of the electronic component is meshed.
- the aforementioned electronic products of cloth in which the way of net storage is a whole network and a part of the network.
- the aforementioned electronically printed product wherein some of the nets can be the upper and the side of the conductive area of the net electronic component, the lower side and the side, the front side and the j side or the back side
- the transmission line seam contacts the side of the conductive area on the cloth or the hot melt film, and clamps or blocks the electronic component to make both sides conductive.
- the conductive region of the electronic component does not have to be in direct contact with the transmission line.
- the above-mentioned electronically printed product in which a transmission line passing through or contacting a conductive silicone, a conductive rubber, a conductive sheet, a conductive cloth such as a fiber cloth, a conductive strip such as a stainless steel strip or a conductive multi-molecular material is sewn on a cloth or a hot melt adhesive.
- the conductive region or the transmission line of the electronic component is embedded or contacted with the conductive silica gel, the conductive rubber, the conductive sheet, the conductive cloth or the conductive strip or the conductive multi-molecular material.
- the aforementioned cloth is electronically produced in which the staple itself is electrically conductive.
- the aforementioned electronically printed product has a spare transmission line that communicates with the conductive area of the electronic component.
- the aforementioned electronically printed product can be used as a pressure or tension sensor by this method.
- the aforementioned electronically printed product in which an insulator on the periphery of a transmission line is embedded in an electronic component to fix the electronic component.
- the aforementioned electronically-distributed product, the object of the present invention and the technical problem of solving the problem of the conductive line and the transmission line of the electronic component are also achieved by the following technical solutions.
- the electronic product of the above-mentioned cloth is produced ⁇
- the electronic product of the cloth is to "sew" the transmission line and the electronic component on the cloth or the hot melt film and does not need to be welded on the cloth or the hot melt film to make the transmission line or the transmission line and the electronic component conductive.
- the first method is to "bond” the electronic component to the transmission line and then “sew” it on the fabric or hot melt film.
- Another method is to transfer the thread "sew” on the cloth or hot melt film, electronic components. Then connect to the transmission line.
- the quality of the production can be controlled, and the fabric and the circuit are produced separately.
- the product design is flexible and is not limited by the specific type of fabric.
- cloth or hot melt film is a "soft” platform
- electronic components are “hard” components
- transmission lines and electronic components can be “fixed” on the fabric or hot melt film and can withstand external forces without failure, at the same time
- the electronic circuit has a package fabric to ensure insulation and is free from external interference. For example, it can still operate normally after being pulled by the washing machine.
- the transmission line is short-circuited or broken and can be known immediately and can be processed.
- the present invention relates to a product and method for electronically distributing cloth.
- the electronically produced product must have at least one fabric, at least one electronic component such as a resistor, a microprocessor, a sensing component, etc., and at least one transmission line connected to the conductive area of the electronic component.
- the electronic component is first connected to the transmission line and then sewn to the fabric or the electronic component is connected to the transmission line during the process of the transmission line being sewn into the fabric.
- the joint of the electronic component is connected to the transmission line, and the whole process of sewing on the cloth is not welded, and the sewing method of the cloth and the transmission line or the electronic component can be done by plain weaving, knitting, woven, embroidery, or the like.
- Fabric is used as a process of writing and routing electronic components of a circuit board.
- Another invention relates to a product and method for electronically distributing cloth.
- the electronic product of the cloth must have at least one fabric, at least one electronic component such as a resistor, a microprocessor, a sensing component, etc., at least one hot melt film as a circuit board, and at least one conductive wire connected to the conductive component of the electronic component. Area.
- the invention is that the electronic component is first fixed on the hot melt adhesive film with the transmission line, so that the two are connected Then, then integrate into the package fabric or apparel fabric; or first fix the transmission line on the hot melt film, then integrate the hot melt film and electronic components into the package fabric or apparel fabric and connect the electronic components to the transmission line.
- the whole process does not need to be welded, and the sewing method of the hot melt film and the transmission line or the electronic component can be flat weaving, knitting, woven, embroidering, etc., or a bonding method to complete the hot melt film for the electronic version of the circuit board.
- the invention has significant progress in technology and has obvious positive effects, and is a novel, progressive and practical new design.
- Figure 1 is a schematic illustration of a method of electronically distributing cloth.
- Figures 2a through 2c are schematic views of electronic components and transmission lines.
- Figure 3 is a schematic view of the transmission line fixed to the cloth.
- Figure 4 is a schematic view of the electronic printing of the cloth.
- FIGS. 5a through 5b are schematic illustrations of the manner in which the transmission line is bonded to the electronic components.
- Figures 6a-6b are schematic illustrations of another manner of engagement of a transmission line with an electronic component.
- Figure 7 is a schematic illustration of the manner in which the transmission line is plain weave.
- Figure 8 is a schematic diagram showing the manner in which the transmission line and the conductive area are connected.
- 9a to 9b are schematic views showing the manner in which the transmission line and the conductive region are connected.
- Figures 10a through 10b are schematic views of a first preferred embodiment of a manner of connecting a transmission line to a conductive region.
- Figure 11 is a schematic illustration of a second preferred embodiment of the manner in which the transmission line is connected to the conductive region.
- Figure 12 is a schematic illustration of a third preferred embodiment of the manner in which the transmission line is connected to the conductive region.
- Figure 13 is a schematic illustration of a fourth preferred embodiment of the manner in which the transmission line is connected to the conductive region.
- 14a to 14b are schematic views showing a manner of connecting a transmission line to a conductive region.
- Figure 15 is a schematic illustration of the manner in which the thermistor and the enameled wire are sewn to the fabric.
- Figure 16 is a schematic illustration of another way in which the thermistor and enameled wire are sewn to the fabric.
- Figure 17 is a circuit diagram of a temperature garment.
- Figures 18a through 18b are schematic illustrations of digital respiratory detection bands.
- Figure 19 is a schematic illustration of a simulated respiratory detection zone.
- Figure 20 is a schematic diagram of the connection mode of the processor.
- Figure 21 is a schematic illustration of the manner in which the alternate transmission line is connected to the conductive area.
- Figure 22 is a schematic illustration of another connection of the alternate transmission line to the conductive area.
- Figure 23 is a schematic illustration of the manner in which the transmission line is connected to the conductive area.
- 24a to 24b are schematic views showing the overall structure of a hot melt adhesive film as a substrate for manufacturing a circuit board and then attached to a conventional textile.
- 25a to 25c are schematic views showing the fabrication of a hot melt adhesive film circuit board in which a transmission line and an electronic component are fixed on a hot melt adhesive film.
- Figures 26a to 26c are schematic views of the hot melt adhesive film circuit board attached to the cloth.
- Figure 27 is a schematic illustration of a hot melt adhesive film circuit, electronic components, cloth, and a simultaneous composite package.
- Figure 28 is a schematic illustration of the assembly of the unitary component and the electrically conductive textile to other lines.
- Figure 29 is a schematic illustration of the completion of the package using the same piece of cloth.
- Figures 30a to 30b are schematic views of the operation of the multilayer board structure.
- Figure 31a to Figure 31b are schematic views of a multilayer board with a heat dissipation structure.
- Figures 32a to 32b are schematic views of a partial multilayer board.
- Figure 33 is a schematic illustration of the actual use of various electronic components.
- Figure 34 is a schematic illustration of a crimp point reinforcement method.
- 35a to 35c are schematic views showing an example of an application method.
- Figures 36a through 36d are schematic views of the production equipment. The best way to achieve your invention
- FIG. 1 is a schematic illustration of a method of electronically distributing cloth.
- Electronic components 3 such as surface mount devices (SMD) or through-hole electronic components (such as s ingle - in- 1 ine or dua l-in-1 ine) Connected to transmission lines 2 and 4, the transmission line can be stainless steel wire (s teel f iber), stainless steel wire (steel wire).
- FIGS 2a to 2c are schematic views of the bonding of the electronic components to the transmission lines.
- the tin is not used at all, and then the electronic component 3 is sewn on the package fabric 1.
- the electronic component 3 is sewn on the package fabric 1 by using various wires such as the yarn 6, and the seam can be flat weave, knitted, Woven, embroidery, etc.
- the package fabric 1 can be cotton, nylon, lycra, plastic, burlap and other materials, and the weave of the package fabric does not affect the electronic components and transmission lines.
- the transmission line and the cloth fixing the transmission line and the electronic component can be combined and then fixed by "glue", such as hot melt adhesive or heat shrinkable sleeve, so that the electronic component pins 5 can be further
- the bonding with the transmission line 2 or 4 is more stable and insulated.
- the electronic packaging fabric such as a webbing, is sewn or attached to the apparel fabric to complete the electronic product of the fabric.
- the electronic printing of the cloth mainly uses the non-conductive wire material such as the yarn 6 to sew the electronic component 3 on the packaging cloth 1.
- the electronic component can be directly fixed by using the "glue" instead of the yarn stitching.
- the transmission line can be sewn on the fabric or adhered to the fabric.
- the seam can be sewn into the fabric 1 by the transmission line itself or by using a conductive or non-conductive wire such as the yarn 6 to sew the transmission line 2, such as Figure 3 is a schematic view showing the transmission line fixed to the cloth.
- the above is most suitable for leaded through hole electronic components (such as s ingle-in-l ine or dual-in-l ine).
- Fig. 4 is a schematic view showing the electronic printing of the cloth.
- the sewing line 2, 4 is first sewn on the clothing fabric 1' ⁇ , the process may be that the transmission line itself "sews" on the clothing fabric or uses a non-conductive material such as the yarn 6 to be sewn on the clothing fabric 1', and then The conductive region 5 of the electronic component 3 is connected to the transmission line.
- the manner in which the transmission line is sewn on the apparel fabric 1' may be plain weaving, knitting, woven, embroidery, etc., and the connection of the conductive region 5 of the electronic component 3 to the transmission lines 2, 4 may be sewn by the apparel fabric 1' and the transmission line 2.
- Fig. 5a to Fig. 5b are schematic views of the manner in which the transmission line and the electronic component are joined, that is, the conductive region 5 of the electronic component is embedded in the transmission line 2 and the apparel fabric 1'
- the pressure or tension generated by the adhesion between the transmission line 2 and the apparel fabric is such that the conductive region 5 of the electronic component is fixed to communicate with the transmission line.
- FIG. 6a to FIG. 6b are schematic diagrams showing another manner of joining the transmission line and the electronic component.
- the conductive region 5 of the electronic component 3 shown above, if it is a pin-pin structure, can be further fixed by being knotted or mutually entangled with the transmission line.
- the same can also be insulated with glue or heat shrink tubing.
- Fig. 7 is a schematic diagram of the way of the transmission line flat weaving, which is a transmission line 2 on the package or apparel cloth.
- the transmission line mainly takes the side of the package or the clothing fabric, and the electronic The component is placed on the other side of the package or apparel fabric.
- the same Both the upper and lower sides of the transmission line can be connected to the electronic components.
- the electronic component has a pin, it can be fixed with the transmission line knotted or mutually smashed.
- the same method of knitting can be passed at the same point or near two points of the cloth 1, as shown in Fig. 8.
- Fig. 8 is a schematic diagram of the connection mode of the transmission line and the conductive area, and can also produce the same "sleeve" electronic component. Effect. After the electronic component 3 is sheathed, the transmission line 2 is further knotted, self-twisted or fixed with glue to produce a more stable effect.
- Another method is to use the yarn 6 to sew the electronic component 3 on the package or apparel fabric 1 such that the conductive region 5 of the electronic component 3 is in contact with the transmission line 2 or 4, as shown in Figures 9a to 9b, Figures 9a to 9b.
- It is a schematic diagram of the connection mode between the transmission line and the conductive area, that is, the transmission line 2 is contacted with the conductive area 5 by the fixing of the electronic component 3 and the cloth 1, and if the conductive line such as stainless steel wire or silver yarn directly sews the conductive area 5 and the transmission line 2 Being together is another way.
- This method is most suitable for the electronic components of the pin pins.
- the same effect can be achieved by directly sewing the conductive regions 5 and the transmission wires 2 with non-conductive yarns.
- the transmission line is sewn on the cloth 1, the transmission line is a multi-strand line, so the conductive area 5 of the electronic component is meshed, and the method of meshing can be a whole network, a part of the network, for example, a mesh-based conductive
- the upper and side sides of the zone, the lower side and the side, the front and the side, the back and the side, or only the side conductive areas are clamped to the transmission line, as shown in Fig. 10a, for the whole net or the upper side and the side net.
- Figure 10a to Figure 10b is the first connection mode between the transmission line and the conductive area.
- FIG. 11 is a schematic view showing a preferred embodiment of the connection mode between the transmission line and the conductive region.
- a demon felt (not shown) can be used to seal the devil blanket 7 (loop), so it is more difficult to move the conductive area 5 and the transmission line 2, if it is a loop or an additional one. It is more effective that the devil is also electrically conductive. At this time, the devil or the hook is only in contact with the conductive area 5 of the electronic component 3.
- FIG. 12 is a schematic view of a third preferred embodiment of the manner in which the transmission line is connected to the conductive region.
- connection mode of the other transmission line 2 and the electronic component 3 can be made by the "staple 9" method, the transmission line 2 is brought into contact with the electronic component 3, and the stapler 9 is used instead of the yarn 6, and the "staplet" can be
- the non-conductive material as shown in Fig. 13, is a schematic view of a fourth preferred embodiment of the manner in which the transmission line and the conductive region are connected. If it is a conductive material such as stainless steel, the transmission line 1 is connected to the conductive region 5 of the electronic component 3 on the one hand, as shown in Fig. 14a. On the other hand, the electronic component 3 and the transmission line 2 can also be on different sides of the package or the apparel fabric. As shown in Figure 14b, 1 book at the same time
- the pin can also be connected to a plurality of electronic components or a plurality of transmission lines, and FIGS. 14a to 14b are schematic views showing a manner of connecting the transmission line to the conductive region.
- the conductive silicone or rubber 8 is first combined with the electronic component 3 and the transmission line 2 and then sewn on the package or the apparel fabric 1, and a transmission line 2 can have different ways and various types.
- the electronic component 3 is turned on.
- changing the "electronic component" to another "transmission line” becomes the connection between different transmission lines, for example, two transmission line "T” type connections, as long as the two transmission lines are knotted at the connection, mutual smashing, etc. That is to say, the connection manner of the "conducting area" and the transmission line in the above multiple manners is a method of connecting another transmission line to the original transmission line.
- the combination of the transmission line 2 and the electronic component 3 can also be used to join the electronic component with another electronic component, for example, a "T" type connection, which can represent the knotting and robbing between the three electronic components. And...etc.
- the "L" type connection method has a combination of two electronic components, and then another conductive area 5 of each electronic component is combined with the transmission line 2.
- the package or apparel fabric can be replaced by a hot melt adhesive film.
- the hot melt adhesive film as described below is provided on the circuit board with the electronic circuit, and then the hot melt adhesive film is integrated into the package fabric and the apparel fabric. In the middle, the function of packaging insulation is achieved, and the circuit board is integrated into the fabric without the original structure and thickness, resulting in a miniaturization effect.
- Fig. 15 is a schematic view showing the manner in which the thermistor and the enameled wire are sewn on the cloth.
- FIG. 17 is a schematic circuit diagram of the temperature clothing. If a thermistor is placed under the trousers, the user's "anal temperature" can be measured when the user is sitting. In short, the above-mentioned clothing fabrics are equipped with a package fabric.
- Application Example 2 is the detection of the breathing zone. First, there are two straps overlapping, and one end N of the two straps are fixed together, one of which consists of an elastic elastic band and a non-elastic length cloth, where the belt has a conductive material such as a buckle, and the other belt has four conductive The segments ai , a 2 , a 3 , a 4 are fixed on the strap, and the strap is not elastic.
- each of the four conductive segments has a resistance, R 2 , R 3 , R 4 .
- the result is that each of the four conductive segments is connected in parallel with a resistor Ri, R 2 , R 3 , 11 4 .
- each resistor R can also be replaced by capacitor C or inductor L or other electronic components such as diodes.
- a conductive material such as 10K ohm conductive material such as conductive silica gel V
- the resistance change can be measured due to the displacement of the convex buckle Mi when the call is sucked, as shown in Fig. 19, Fig. 19
- It is a schematic diagram of a simulated respiratory detection zone.
- 18a to 18b are schematic views of a digital respiratory detection zone.
- the general circuit is commonly used to three-pin electronic components such as transistors, thyristors, etc., so there are three conductive areas, then we can contact one conductive area with the transmission line circuit on the side of the package cloth or apparel fabric, the other two conductive Both the zone and the transmission line are in contact with the other side of the package fabric or apparel fabric so that the transmission line does not have the risk of overlapping and shorting.
- the processor has 8 pins, 16 pins, etc.
- the "loop" transmission line can be used, that is, the pin foot, that is, the conductive area passes through the cloth and then the transmission line is hooked, and each transmission line does not overlap with other pin feet.
- the connected transmission line has an opportunity to be contacted. As shown in FIG. 20, FIG.
- the adjacent transmission line is "on one go", that is, the transmission line of the pin is on the side of the package fabric or the clothing fabric, and the transmission line of the second pin is on the other side of the package fabric or the clothing fabric, then There is no chance of a short circuit.
- an alternate transmission line 2 there may be an alternate transmission line 2.
- the transmission line 1 is broken, since the conductive area 5 of the electronic component 3 simultaneously contacts the other transmission line 2', the entire circuit can still operate, as shown in Fig. 21, Fig. 21
- Fig. 21 It is a schematic diagram of the connection mode between the alternate transmission line and the conductive area. If the transmission line 2 is short-circuited with the other transmission line 4, it can work with the backup transmission line 2, because the backup transmission line 2' is on the other side of the cloth 1, that is, The surface different from the transmission line 2, as shown in Fig. 22, is a schematic diagram showing another connection manner of the alternate transmission line and the conductive area.
- FIG. 23 is a schematic diagram of a connection mode of the transmission line and the conductive region.
- the two insulators W1, W2 of the transmission line 2 The distance between them is close to the width of the electronic component 3, and the electronic component 3 is placed on the transmission line 2 so as to be embedded between the insulators W1, W2 without being easily moved, as shown in FIG. Since the insulators W1 and W2 are also elastic and 4-bladed, since the transmission line 2 itself is sewn on the cloth 1, the insulators W1, W2 can fix and conduct the conductive regions of the electronic component 3, and the electronic component 3 is just at the same time. Below the transmission line 2, if the electronic component 3 is above the transmission line 2, a further yarn 6 is fixed to the fabric 1, as shown in FIG.
- an electronic component is a resistor, a capacitor, an inductor, an amplifier, a switch, a thermistor, a microphone, an electrode, etc.
- the value of the output may have different results depending on the degree of adhesion of the conductive region of the electronic component to the transmission line 2, and is dense.
- the degree of integration is subject to changes in external pressure or tension, so it can be a pressure or tension sensor.
- the conductive area of the transmission line and the electronic component if there is an insulating outer layer, the insulating layer can be removed by chemical, mechanical or thermal means.
- a non-conductive yarn or material is applied between the conductive regions of the electronic component and the transmission line to increase the sensed value of the pressure or tension sensor.
- the stitching or pasting between the transmission line and the cloth can be used for weaving, kni tt ing, crochet ing, knot t ing, stitching (sti tching). ) and other methods.
- the way of routing can be straight, curved, serpentine, different fabric layers or the upper and lower layers of the same fabric layer.
- the packaged fabric 1 or the apparel fabric 1' originally had a one-piece transmission line, it can be used as the backup transmission line 2.
- the electronic component and the transmission line of the present invention are externally applied to the package fabric 1 or the apparel fabric 1', so that when the electronic component 3 or the transmission line 2 fails, the electronic component 3 or the transmission line 2 can be easily removed and replaced with a new electronic component 3 or transmission line 2. Instead of giving up completely, users can fix it themselves.
- the transmission line and the cloth fixing the transmission line and the electronic component can be combined and then fixed by "glue", such as hot melt adhesive or heat shrinkable sleeve, so that the electronic component pins 5 can be further
- the bonding with the transmission line 2 or 4 is more stable and insulated.
- the transmission line or the electronic component itself has elastic characteristics, for example, the insulating layer on the periphery of the transmission line is composed of an elastic material, the insulating layer is partially removed.
- the transmission line will have a better adhesion when it is joined to the conductive area of the electronic component.
- the conductive area or the surface of the transmission line of the electronic component is not smooth, the two are not easily separated when contacted.
- the surface of the conductive portion of the electronic component is concave, and the transmission line and the conductive area are embedded in the concave structure, resulting in stable Combined together.
- Another method of the present invention is to form a circuit board by forming a hot melt film as a substrate, a conductive region of at least one electronic component or at least one transmission line being sewn, glued or bonded to the hot melt film.
- the circuit board is formed on another hot-melt film that is heated to an electronic component or to a transmission line or paste.
- the transmission line on the hot melt adhesive film may be a conductive fabric, a conductive strip, a stainless steel wire, a conductive wire, a silver fiber, a polymer conductive material, an encapsulated wire, an enameled wire, etc., if there is an insulating layer such as an encapsulated wire, the contact electronic component
- the joint of the conductive area may be chemically or mechanically removed to remove the insulating layer of the joint.
- Figs. 24a to 24b are schematic diagrams showing the overall structure of a hot melt adhesive film as a manufacturing circuit board and then attached to a conventional textile.
- the electronic product of the cloth must have at least one fabric, at least one electronic component such as a resistor, a microprocessor, a sensing component, etc., at least one hot melt film as a circuit board, and at least one transmission line connected to the conductive area of the electronic component.
- the electronic component is first fixed on the hot melt film with the transmission line, and the two are connected, and then integrated into the package fabric (method 1 of Fig. 24a) or the clothing fabric (method 2 of Fig. 24a).
- the sewing method of the hot melt film and the transmission line or the electronic component may be plain weaving, knitting, woven or embroidery, or the heat-melt film is used as a circuit board in a fitting manner.
- the process of electronic component firing and routing. uses a hot melt adhesive film as a substrate, a circuit board, and then a conventional textile. It can be compounded on the package fabric, and then recombined (can also be finished by sewing, pasting or laminating) onto the apparel fabric (as in Method 1 of Figure 24A) or reversed ( Figure 2A, Method 2). ).
- the hot melt adhesive film is first composited with the apparel fabric, the electronic component and the transmission line are then fixed on the hot melt adhesive film, and then the packaged fabric is secondarily composited thereon (Fig. 24b).
- the method for electronically distributing cloth of the invention wherein the circuit trace layout of the circuit board can be printed on the hot melt film by thermal transfer, inkjet, etc., and then the transmission line is sewn, glued or fitted along the trace pattern.
- the transmission wire manually bonding the electronic components and the line transmission wires to the hot melt adhesive film, and finally recombining (can also be done by sewing, pasting or laminating) to the cloth to make the hot melt film circuit board It is located between the two layers of fabric so that it will not be exposed to complete the process of using the hot melt film for the electronic component of the circuit board and the wiring package.
- the circuit board is a a hot-melt adhesive film with a transmission line
- an electronic component is placed thereon, the conductive region of the electronic component is brought into contact with the conductive region of the transmission line, and then the circuit board for electrically connecting the electronic component and the transmission line is heated and fixed, and a circuit board can be added in the process.
- the hot melt film of the transmission line increases the insulation of the board.
- the electronic component requires better electrical conduction between the electronic component and the wire, it is seen that during the formation of the circuit board, the two installed hot melt adhesive films have transmission lines, electronic components are placed between the two, and the electronic components are placed. The conductive area of the component is in contact with the conductive area of the transmission line, and finally two heat-melt adhesive films are fixed, adhered, bonded or sewn, so that the generated circuit board can strengthen the strength of the transmission line and the electronic component.
- a method of fixing an electronic component and a transmission line to a hot melt for example, using a conductive sewing thread (or a conductive strip or an insulated wire or the like) to form a wiring board using a hot melt film as a substrate.
- a conductive sewing thread or a conductive strip or an insulated wire or the like
- the pre-arranged wiring diagram of the computer pattern car can be directly used to be mounted on the hot melt adhesive film by the sewing method to form the hot melt adhesive film PCB, and then the electronic component is placed on the drill rig.
- the hot melt adhesive film PCBA is realized at the corresponding position.
- a conductive strip it is necessary to print the lead pattern in advance at the running position, and then use a heating tool such as a heat gun to partially melt the film, and then manually arrange the wires along the printed wire pattern.
- a heating tool such as a heat gun
- the insulation layer should be removed from the component crimping position to expose it, and then the drilling rig should be used to place the electronic components in the corresponding position.
- the oil-repellent paper is placed on the upper and lower surfaces, and the hot-melt adhesive film is slightly melted, and the previously placed electronic components and wires are bonded to the hot-melt adhesive film, and finally the oil-repellent paper is removed (Fig. 25a).
- a one-layer or two-layer wire hot melt adhesive film can be used to increase the wire crimping surface, so that the electronic component and the wire are crimped to make the conduction better (Fig. 25b) ).
- a hot melt film may be added to the upper or lower layers to improve the package and insulation properties of the overall circuit (Fig. 25c).
- the types of hot melt adhesive film are as follows:
- PA polyamide hot melt adhesive film
- PET polyester hot melt adhesive film
- PU polyurethane hot melt
- polyolefin hot melt adhesive film P0
- EVA ethylene-vinyl acetate copolymer hot melt adhesive film
- PA, PET, PU hot melt adhesive film has good temperature resistance and high bonding strength
- PET hot melt adhesive film has good water wash resistance
- PA hot melt adhesive film is good for dry cleaning resistance
- PU hot melt adhesive film is suitable for leather and PVC; Table 1
- a above is for reference only. Different process conditions can be selected due to factors such as different materials to be bonded and different environments. The optimum process conditions can be determined by first testing. Among them, the relationship between temperature, pressure, and time can be appropriately changed depending on the situation.
- the hot melt adhesive film may be applied to the adherend, heated to the melting temperature, and then the adhesive surface of the other adherend is superposed, suitably pressurized, and cooled and solidified to complete the bonding.
- Hot pressing tools or heating bonding equipment can be selected from electric irons, bonding machines, pressing machines, ovens, special presses, molds, ultrasonic heating, electromagnetic induction heating, etc.
- d Pressing conditions include appropriate temperature, a certain pressure for each duration, and the pressing conditions are selected to be suitable, the bonding strength is high, and the clothing quality is good.
- the pressing temperature is higher than the melting point of the hot melt adhesive.
- Appearance Transparent film with a certain strength and elasticity, and lined with anti-stick paper. (The other is a mesh film, which is mainly used for hot-melt compounding of textile fabrics. After compounding, the product is soft and breathable).
- the temperature is between 100 and 110 when in use. C can effectively bond components and lines. Bonding chemical fiber fabric, need to be heated to 120-13 (TC, if the temperature is too high, it may burn the fabric, pay attention to temperature control. Or use ultrasonic or electromagnetic wave to melt the hot melt film at low temperature. If it is bonded with cotton cloth, it can be heated. To 120-150 ° C. The thickness of the hot melt adhesive film itself, the oil-repellent paper covered by heating, the heating time and the pressure will affect the bonding effect.
- the hot melt adhesive film circuit board is attached to the fabric by first heating and fixing the circuit board to the package fabric, and then sticking, sewing, attaching or heating to the clothing fabric; the circuit board can also be heated and fixed first.
- the apparel fabric is then glued, sewn, affixed or heated to the package fabric. At this time, the hot melt film penetrates into the package fabric or the apparel fabric to produce the electronic package structure of the cloth.
- the clamping force can be clamped, and the connection characteristics of the electronic component and the transmission line can be measured by using the characteristics of the electronic measuring component. Or use dripping water on the fabric to measure the characteristics of the electronic components to check the effect of the package insulation.
- the method for manufacturing a cloth electronic product by using a hot melt adhesive film circuit board is firstly made A good hot melt film circuit board is placed on the package fabric, and the oil-repellent paper is covered thereon so that the colloid dissolves and does not adhere to the heating device. Then, the side of the grease-proof paper is heated to melt the hot-melt adhesive film, and is bonded to the package fabric together with the transmission line and the electronic component. After the grease-proof paper is removed, it is placed on the preset packaging position on the apparel fabric. Secondary heating compounding, secondary compounding can also be done by sewing, pasting or glueing, laminating and the like. After the completion, the circuit board is located between the clothing fabric and the package fabric.
- the package Since the package is covered with the fabric, the circuit board itself is not exposed, which makes the appearance beautiful.
- the hot melt adhesive film will penetrate into the package fabric and the apparel fabric after melting.
- the overall structure formed by the hot melt adhesive film and the cloth will be very firm (Fig. 26a).
- the wire inside the package can be taken out, sandwiched in the conductor fixture, and tension is applied to both ends, and the conductor clamp is used as a detection interface to read the electronic signal inside the package for detection.
- water can also be dripped on the surface of the package to test its package insulation properties. ( Figure 26b).
- the test leads can be cut along the edge of the package, or the edges of the package can be cut together ( Figure 26c).
- Another method for fabricating a cloth electronic product by using a hot-melt adhesive film circuit board is a hot-melt adhesive film circuit, an electronic component, a cloth, and a composite package at the same time, wherein the circuit board is a hot-melt adhesive film with a transmission line.
- the electronic component is placed to make the conductive area of the electronic component contact with the conductive area of the transmission line, and then the package cloth or the clothing fabric is placed on or under the circuit board, and is heated and fixed to connect the electronic component to the transmission line, and the hot melt film penetrates into the package cloth or clothing. In the fabric, the packaging effect is produced.
- This method is to place the electronic component on the hot melt film with the wire sewn on the sewing machine, and then put it on the corresponding position of the clothing fabric, if the equipment conditions permit (requires computer pattern machine, row drilling machine).
- the packaged fabric is finally heated and composited, and all steps are completed in one step (Figure 27).
- This can greatly reduce manufacturing costs and time.
- the package is packaged and then fabricated on other circuits.
- the circuit board is a circuit board that includes one or a few electronic components. After heating and fixing the package fabric, a single package component is produced, and then on the clothing line. Sew the individual unit package components onto the transmission line to assemble the apparel line with all of the individual components to create a large circuit board.
- This method is because the circuit board is manufactured on the clothing. In actual use, if it is necessary to manufacture a circuit board having a large size or a large overall size, the above method is still used, and the semi-finished product in the manufacturing and packaging process is large in size. Undoubtedly, it will increase the difficulty and cost of production. It is made by separating the parts, using a conductive fabric to bond on the hot melt film, then placing the individual monomer components thereon, then adding the fabric up and down, heating and compounding to make the electronic components communicate with the conductive textiles. The formed circuit board is packaged between two layers of fabric, and then the conductive structure is used to pierce the structure, so that the package lines of the respective electronic components are connected to other lines (see Fig. 28).
- the advantage of this method is to reduce the package volume of the overall circuit.
- All plug-ins are modularly produced and installed. When an individual module is accidentally damaged, the entire board will not be scrapped. Only the damaged part will be replaced. Yes. This further increases the yield in mass production, thereby reducing production costs.
- the present invention can also be packaged using the same piece of cloth, the package fabric being part of the apparel fabric, that is, the apparel fabric itself is also used as the package fabric.
- This method is to match the traditional garment production process, and the garment fabric body can also be used as the packaging fabric.
- the melted circuit board is placed in the preset position of the clothing fabric after re-folding, and then the board can be mounted using only one heating composite (Figure 29).
- the invention can realize the application of the multi-layer board structure, wherein the hot-melt adhesive film produces more than one circuit board and can be overlapped up and down, and the connection points of the upper and lower layers are connected by the transmission line to generate the textile multilayer circuit board structure, and at the same time An insulating material can also be placed between the upper and lower layers.
- This method can be used in combination with the multi-layer board design in the traditional electronics industry.
- Place an insulating plastic mold in the middle of the upper and lower plates also available in fabric, grease-proof paper, hot melt adhesive film, rubber film, fiberglass cloth).
- the connection point of the lower board is such that the upper and lower layers are connected to form a multi-layer board structure diagram (Fig. 30a).
- the invention can manufacture a multi-layer board with a heat dissipation structure.
- a heat dissipation structure may be added to the line structure with a large power consumption.
- the grounded circuit board structure in Fig. 30b as an example, since the conductive textile itself has good thermal conductivity, the conductive textile area of the ground layer can be increased and made far beyond the board packaging area, so that the ground layer also has heat dissipation. The function of the layer.
- the upper layer of the package can also be covered with a heat-dissipating fabric (for example, the use of conductive textiles as a covered heat-dissipating fabric requires the addition of an insulating plastic film on the upper layer (also available as hot-melt film, cloth, grease-proof paper, rubber film, glass). Fiber cloth instead) to make it insulated ( Figure 31 a to 31b) 0
- the partial multi-layer board manufactured by the invention wherein the circuit board produced by the hot-melt adhesive film can be provided with a conductive fabric under the electromagnetic interference, and a conductive material layer between the conductive fabric and the circuit board, and a conductive layer The seam is sewn through the three layers to create electromagnetic protection.
- the present invention has practically used methods for various electronic components.
- electronic components such as chip-like components, plug-in components, transistor components (horizontal pins), and transistor components (vertical pins).
- the conductive fabric can be used as the crimping point, or the guiding sewing thread can be used as the crimping point for packaging as described in the above-mentioned 25a to 25c.
- a conductive adhesive or a low-temperature solder may be added by connecting a transmission line generated by the hot melt adhesive film to a conductive region of the electronic component.
- low-temperature solder firstly, the low-temperature tin-tin is heated and melted onto the conductive region of the electronic component, and then the electronic component of the solder paste and the transfer line of the hot-melt film, such as the conductive fabric, are heated and fixed, so that the low-temperature solder expands the penetration, so that The connection between the transmission line and the electronic component is strengthened; the above low-temperature solder can also be melted into the joint of the transmission line of the hot melt film, and the same effect can be produced by heating and fixing the electronic component.
- conductive paste it is more effective to add a transmission line to the conductive area of the electronic component when heating the package fabric or apparel fabric.
- the method has high requirements on the working environment of the electronic component.
- conductive glue or low-temperature solder may be added at the conductive area of the electronic component or the transmission line pin to make the conductive area of the electronic component or The pins are firmly bonded or welded to the textile circuit.
- the first is to add low-temperature solder on the conductive area (or the transmission line pin) of the electronic component and place it on the conductor cloth, and cover the oil-repellent paper up and down, heating to melt the solder and infiltrate the conductor cloth, so that the conductive area and the conductor cloth of the electronic component Firmly spliced together and then compounded to the hot melt film (Figure 34).
- conductive paste it can be added when heating and compounding to the package fabric.
- low temperature solder it must be soldered to the conductive fabric before entering the compounding step. Since the melting point of low temperature solder is 138 °C, in the pinging step, the temperature must be controlled at 140-150 °C, and the heating time is 5 seconds. If the heating time is too long or the temperature is too high, the conductor fabric will be burnt, such as If the temperature is less than 1 38 °C or the heating time is not enough, the low-temperature solder will not melt completely, which may result in weak soldering. In all subsequent heating steps, the temperature must be precisely controlled between 120-1 30 'C. It must not melt the solder while melting and melting.
- the cohesive force and surface tension in the liquid state are far less than the hot melt colloid melted at the same temperature, and the solder is discharged out of the conductive cloth penetrated in the previous step, causing poor contact of the components.
- the application method of the present invention is exemplified.
- the package fabric and the apparel fabric on the periphery of the package structure can be further sewn, pasted, laminated, and ultrasonic or electromagnetic waves are used to increase the package and resist external interference.
- a component package containing two resistors is fabricated by using the package structure of FIG. 28, and is reinforced by a common sewing thread on the periphery of the package, so that it is pulled by an external force.
- the protection circuit package is not subjected to tension inside. (Ultra ultrasound can also be used Wave bonding or electromagnetic wave bonding to achieve an equivalent protection mechanism). Then, the transmission line is used to break through the package and communicate with the line on the clothing, thereby realizing a conventional machine-washed textile circuit product.
- Figure 35b is the bare exposed package of the conductive textile surface.
- the connector may also be a conductive silicone, a conductive rubber, a conductive sheet, a conductive cloth such as a silver fiber cloth, a conductive strip such as a stainless steel strip or a conductive multi-molecular material, and is suitably applied to the control box interface portion as shown in Fig. 35a.
- Figure 35c shows the conductor exposed overall exposed package as a connector for a sewn conductive sewing thread to mount the entire exposed conductor textile to other lines. Considering that the fabric on the surface of the package is wet, it will connect the two connectors. Therefore, when using this structure, the shortest plane distance between the two connectors should not be less than 3cm.
- the apparatus which can be used in the mass production of all the above processes of the present invention is a computerized embroidery machine as shown in FIG. 36a, which can be used to sew a pre-designed circuit wiring diagram on a hot melt adhesive film or cloth using a transmission line such as a conductive sewing thread. Moreover, it is possible to sew at the same time with multiple noses. At present, this equipment has been widely used in the production of garments, and the technology is relatively mature.
- Figure 36b is an automatic drilling rig that was originally used to arrange a large number of hot drilling granules to form a decorative pattern.
- the present invention can use the device to automatically place electronic components (such as chip-type components) on the hot-melt film circuit board according to a preset program, and can operate at the same time with multiple heads.
- Fig. 36c and Fig. 36d are roller type heat laminating machines which use a heating roller and a feeding roller to heat and convey a hot melt film circuit board or a grease film, a fabric, etc., to realize heating encapsulation.
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Animal Behavior & Ethology (AREA)
- Biomedical Technology (AREA)
- Veterinary Medicine (AREA)
- Public Health (AREA)
- Radiology & Medical Imaging (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Physics & Mathematics (AREA)
- Pathology (AREA)
- Medical Informatics (AREA)
- Heart & Thoracic Surgery (AREA)
- Biophysics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Textile Engineering (AREA)
- Woven Fabrics (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Professional, Industrial, Or Sporting Protective Garments (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Measuring And Recording Apparatus For Diagnosis (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/114,700 US11006557B2 (en) | 2011-04-29 | 2012-04-28 | Cloth electronization product and method |
EP12776080.9A EP2727521A4 (en) | 2011-04-29 | 2012-04-28 | PRODUCT AND METHOD FOR ELECTRONIZING TISSUE |
CN201280021122.8A CN103717123B (zh) | 2011-04-29 | 2012-04-28 | 布料电子化的产品及方法 |
JP2014506726A JP2014527278A (ja) | 2011-04-29 | 2012-04-28 | クロース電子化の製品及び方法 |
Applications Claiming Priority (2)
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PCT/CN2011/000758 WO2012145865A1 (zh) | 2011-04-29 | 2011-04-29 | 布料电子化的产品及方法 |
CNPCT/CN2011/000758 | 2011-04-29 |
Publications (1)
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WO2012146066A1 true WO2012146066A1 (zh) | 2012-11-01 |
Family
ID=47071536
Family Applications (2)
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PCT/CN2011/000758 WO2012145865A1 (zh) | 2011-04-29 | 2011-04-29 | 布料电子化的产品及方法 |
PCT/CN2012/000574 WO2012146066A1 (zh) | 2011-04-29 | 2012-04-28 | 布料电子化的产品及方法 |
Family Applications Before (1)
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PCT/CN2011/000758 WO2012145865A1 (zh) | 2011-04-29 | 2011-04-29 | 布料电子化的产品及方法 |
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US (1) | US11006557B2 (zh) |
EP (1) | EP2727521A4 (zh) |
JP (2) | JP2014527278A (zh) |
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Also Published As
Publication number | Publication date |
---|---|
EP2727521A4 (en) | 2015-03-25 |
JP2017152700A (ja) | 2017-08-31 |
US20140084045A1 (en) | 2014-03-27 |
WO2012145865A1 (zh) | 2012-11-01 |
JP2014527278A (ja) | 2014-10-09 |
US11006557B2 (en) | 2021-05-11 |
EP2727521A1 (en) | 2014-05-07 |
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