WO2012144435A1 - 導電部材への素子接続構造 - Google Patents

導電部材への素子接続構造 Download PDF

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Publication number
WO2012144435A1
WO2012144435A1 PCT/JP2012/060115 JP2012060115W WO2012144435A1 WO 2012144435 A1 WO2012144435 A1 WO 2012144435A1 JP 2012060115 W JP2012060115 W JP 2012060115W WO 2012144435 A1 WO2012144435 A1 WO 2012144435A1
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WIPO (PCT)
Prior art keywords
conductive member
conductive
connection structure
members
holding member
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PCT/JP2012/060115
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English (en)
French (fr)
Inventor
勇次郎 菅谷
山口　富三郎
鈴木　仁
光治 加藤
Original Assignee
イリソ電子工業株式会社
有限会社Ｍｔｅｃ
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Application filed by イリソ電子工業株式会社, 有限会社Ｍｔｅｃ filed Critical イリソ電子工業株式会社
Priority to US14/112,409 priority Critical patent/US20140038454A1/en
Priority to EP12774823.4A priority patent/EP2701242A4/en
Publication of WO2012144435A1 publication Critical patent/WO2012144435A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/6608—Structural association with built-in electrical component with built-in single component
    • H01R13/6625—Structural association with built-in electrical component with built-in single component with capacitive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/506—Bases; Cases composed of different pieces assembled by snap action of the parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/68—Structural association with built-in electrical component with built-in fuse
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/26—Connectors or connections adapted for particular applications for vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/24—Assembling by moulding on contact members

Definitions

  • the present invention relates to an element connection structure to a conductive member that is used for manufacturing various devices such as a pressure sensor and a rotary magnetic sensor for automobiles, and in which an element is connected to the conductive member for insert molding with resin. is there.
  • a resin molded product in which a plurality of conductive members to be terminals are insert-molded is incorporated in the sensor housing, and the pressure-sensitive element of the sensor and each conductive member are connected. ing. At that time, each conductive member is soldered with an element such as a capacitor in a housing (see, for example, Patent Document 1).
  • an adhesive such as conductive epoxy.
  • silver plating is used on the connection surface in order to increase conductivity. However, since silver plating tends to cause migration, it is necessary to fill the periphery of the element with an epoxy resin for sealing. There is.
  • the present invention has been made in view of the above-mentioned problems, and its object is to provide an element connection structure to a conductive member that can easily connect the element to the conductive member without using soldering or an adhesive. Is to provide.
  • the element connection structure to the conductive member holds the first conductive member by the insulating holding member and electrically connects one end of the element to the first conductive member.
  • the second conductive member that is conductive to the other end of the element is attached to the holding member, so that the element is held in a state of being conductive to the first conductive member and the second conductive member.
  • the element is held in a state of being electrically connected to the first conductive member and the second conductive member, so that no soldering or adhesive is used.
  • the element can be connected to the first and second conductive members.
  • the connection work can be performed very easily.
  • the element since the element is not fixed to the first and second conductive members, for example, even when heat from a high-temperature resin is applied during the secondary molding, due to the difference in coefficient of linear expansion between the element and the conductive member.
  • FIG. 1 to 4 show a first embodiment of the present invention.
  • the element connection structure shown in the figure is used for manufacturing various devices such as an automobile pressure sensor and a rotating magnetic sensor.
  • the plurality of first conductive members 1 that are spaced apart from each other in the width direction are held by the insulating holding member 2 and one end of each of the plurality of elements 3 is connected to each of the first members.
  • the first conductive member 1 and the second conductive member are connected to the holding member 2 by attaching the second conductive member 4 to the first conductive member 1 and to the other end of each element 3. 4 is held in a conductive state.
  • Each first conductive member 1 is made of a conductive metal extending in a flat plate shape, and is used as a terminal connected to a counterpart connection portion (not shown).
  • the holding member 2 includes a first divided member 2a and a second divided member 2b that can be coupled to each other, and each divided member 2a, 2b is formed of a molded product of a synthetic resin.
  • the first divided member 2a is formed in a horizontally long rectangular parallelepiped shape, and is arranged above each first conductive member 1.
  • the first dividing member 2a is provided with a plurality of component accommodation holes 2c as component accommodation portions for accommodating the respective elements 3, and the component accommodation holes 2c have upper and lower ends at the upper and lower surfaces of the first division member 2a.
  • the first split member 2a is vertically penetrated so as to open.
  • a pair of first engaging protrusions 2d with which the second conductive member 4 engages are provided on the front surface and the back surface of the first split member 2a one by one in the width direction, and each first engaging protrusion 2d is The upper end side is formed so as to form an inclined surface.
  • the 2nd engaging protrusion 2e with which the 2nd division member 2b engages each protrudes in the width direction both sides
  • the second split member 2b has a plurality of grooves 2f on the upper surface, which are engaged with the first conductive members 1, respectively, and is arranged below the first conductive members 1.
  • Side walls 2g extending upward are provided on both sides in the width direction of the second divided member 2b, and the respective second engaging projections 2e of the first divided member 2a are engaged with the respective side walls 2g.
  • a joint hole 2h is provided.
  • Each element 3 consists of electronic parts, such as a capacitor, resistance, a varistor, and an inductor, for example.
  • the element 3 includes a plate-shaped component main body 3a formed of a material having desired electrical characteristics, and a pair of electrodes 3b provided on both ends in the width direction of the component main body 3a. It is formed so as to cover both ends in the width direction of the component main body 3a.
  • the second conductive member 4 is made of a conductive metal plate and is formed so as to cover the upper surface, front surface, and back surface of the holding member 2.
  • the second conductive member 4 includes an upper wall portion 4a, a front wall portion 4b, and a rear wall portion 4c.
  • Each of the first engagement members of the first divided member 2a is engaged with the front wall portion 4b and the rear wall portion 4c.
  • a pair of engagement holes 4d with which the protrusions 2d engage is provided in pairs in the width direction.
  • each first conductive member 1 is disposed between the first divided member 2a and the second divided member 2b of the holding member 2, and the first divided member 2a. And the second divided member 2b are engaged with each other, whereby each first conductive member 1 is held by the holding member 2.
  • each first conductive member 1 is engaged with each groove 2f of the second divided member 2b, and when the first divided member 2a is inserted between the side wall portions 2g of the second divided member 2b, Each side wall 2g gets over each second engaging projection 2e of the first split member 2a while being elastically deformed, and each second engaging projection 2e becomes each engaging hole 2h of the second split member 2b. Engage with.
  • each element 3 is inserted from above into each component accommodation hole 2 c of the holding member 2 in such a direction that each electrode 3 b is positioned vertically.
  • a coiled spring 5 as a conductive elastic member is interposed between one end (lower electrode 3 b) of each element 3 and the first conductive member 1.
  • the second conductive member 4 is attached to the holding member 2.
  • the front wall portion 4b and the rear wall portion 4c are elastically deformed.
  • the first engagement protrusions 2d of the first split member 2a are overcome and the first engagement protrusions 2d engage with the engagement holes 4d of the second conductive member 4, respectively.
  • the second conductive member 4 contacts the other end (upper electrode 3 b) of the element 3 in each component housing hole 2 c, and the element 3 and the first conductive member 1
  • the spring 5 between them is compressed, and the restoring force of the spring 5 causes the upper electrode 3b of each element 3 to conduct while being pressed against the second conductive member 4, and the lower electrode 3b of each element 3 is connected to the first conductive member 4 respectively.
  • the conductive member 1 is conducted through a spring 5.
  • the plurality of first conductive members 1 that are spaced apart from each other in the width direction are held by the insulating holding member 2, and one end of each of the plurality of elements 3 is connected to each other.
  • Each element 3 is connected to the first conductive member 1 by connecting the first conductive member 1 to the first conductive member 1 and attaching the second conductive member 4 connected to the other end of each element 3 to the holding member 2. Since the conductive member 4 is held in a conductive state, each element 3 can be connected to the respective conductive members 1 and 4 without using soldering or an adhesive, and the connection work can be performed very easily. Can do.
  • each element 3 is not fixed to each conductive member 1, 4, even if heat from a high-temperature resin is applied during secondary molding, for example, linear expansion between element 3 and conductive member 1, 4 There is also an advantage that no peeling or cracking of the connection portion due to the difference in rate or damage to the element 3 occurs.
  • each of the plurality of elements 3 is electrically connected to the plurality of first conductive members 1 and the second conductive member 4 is electrically connected to the other end of each element 3, the plurality of elements 3 are connected to each other.
  • the conductive members 1 and 4 can be made conductive at the same time, and the connection work can be easily performed even when there are a plurality of counterpart connection portions.
  • the component housing part 2c for housing the element 3 is provided in the holding member 2, the element 3 can be reliably positioned on the holding member 2 and the assembly work can be easily performed.
  • the holding member 2 is formed by first and second divided members 2a and 2b that can be coupled to each other, and the respective first conductive members 1 are arranged between the divided members 2a and 2b, and the respective divided members 2a and 2b. Since each first conductive member 1 is held by the holding member 2 by coupling, the first conductive member 1 and the holding member 2 can be integrated by assembling the parts, Productivity can be improved.
  • the conductive spring 5 is interposed between the first conductive member 1 and the element 3 in a compressed state, the element 3 can be pressed against each of the conductive members 1 and 4 by the restoring force of the spring 5.
  • the element 3 and the conductive members 1 and 4 can be reliably conducted.
  • the spring 5 it is also possible to use another conductive elastic member such as a plate spring or a block-shaped conductive rubber.
  • the first engagement protrusion 2d and the engagement hole 4d that are engaged with each other are provided in the holding member 2 and the second conductive member 4, the mounting of the second conductive member 4 to the holding member 2 is screwed. This can be carried out without using stoppers and adhesion, which is extremely advantageous for improving the efficiency of assembly work.
  • the elements 3 using elements having a component body 3a formed of a material having desired electrical characteristics such as a capacitor, a resistor, a varistor, and an inductor are shown.
  • one of the elements is made of a conductive material 6, so that one first conductive member 1 is short-circuited to the second conductive member 4 by the element 6.
  • the first conductive member 1 can be used as a ground electrode.
  • each elastic piece portion 4e is formed by cutting and raising a part of the upper wall portion 4a downward.
  • the thickness of the second conductive member 4 is reduced to make the upper wall portion 4a itself elastic. You may make it deform
  • a part of the first conductive member 1 may be formed so as to be elastically deformable, and may be brought into pressure contact with the electrode 3 b below the element 3.
  • the holding member 2 is formed by the first and second divided members 2a and 2b.
  • the holding member 2 is formed integrally with each first conductive member 1 by synthetic resin insert molding, the first conductive member 1 and the holding member 2 are integrated when the holding member 2 is molded. And productivity can be improved.
  • the other structure of the holding member 2 in 3rd Embodiment is the same as that of 1st Embodiment except the 1st and 2nd division members 2a and 2b.
  • FIG. 10 shows an example of the configuration of an electronic circuit in the element connection structure of the present invention.
  • a capacitor is used for two elements 3 and the entire other one element is made of a conductive material.
  • the equivalent circuit diagram at the time of using the element 6 is shown.
  • FIG. 10 illustrates an example in which a capacitor is used as the element 3.
  • various types of materials formed of a material having an intended electrical characteristic such as a resistor, a varistor, and an inductor. Since elements can be used, various electronic circuits can be configured using a plurality of types of elements.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Details Of Resistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

　本発明は，ハンダ付けや接着剤を用いることなく，素子を導電部材に容易に接続することができる，導電部材への素子接続構造を提供する。互いに幅方向に間隔をおいて配置された複数の第１の導電部材（１）を絶縁性の保持部材（２）によって保持するとともに，複数の素子（３）の一端をそれぞれ各第１の導電部材（１）に導通させ，各第１の導電部材（１）の他端に導通する第２の導電部材（４）を保持部材（２）に装着することにより，各素子（３）が，第１の導電部材（１）と第２の導電部材（４）に導通した状態で保持されるようにした。こうすることで，ハンダ付けや接着剤を用いることなく各素子（３）を各導電部材（１，４）に接続することができる。

Description

導電部材への素子接続構造
　本発明は、例えば自動車用の圧力センサや回転磁気センサ等の各種機器の製造に用いられ、導電部材に素子を接続したものを樹脂でインサート成形するための導電部材への素子接続構造に関するものである。
　従来、例えば自動車用の圧力センサを製造する場合、端子となる複数の導電部材をインサート成形した樹脂成形品をセンサのハウジング内に組み込み、センサの感圧素子と各導電部材とを接続するようにしている。その際、各導電部材にはコンデンサ等の素子をハウジング内でハンダ付けしているが（例えば、特許文献１参照）、樹脂製のハウジング内ではハンダごてを使用することができないため、素子を導電性エポキシ等の接着剤で各導電部材に接続している。また、導電性エポキシで接続する場合は、導電性を高めるために接続面に銀メッキが用いられるが、銀メッキはマイグレーションを生じやすいため、素子の周囲に封止用のエポキシ樹脂を充填する必要がある。
特開２００４－１２８２７４号公報
　しかしながら、素子をハウジング内で接続する作業や封止用のエポキシ樹脂を充填する作業は煩雑であるとともに、エポキシ樹脂が硬化するまでに長時間を要するため、生産性を低下させるという問題点があった。
　本発明は前記問題点に鑑みてなされたものであり、その目的とするところは、ハンダ付けや接着剤を用いることなく素子を導電部材に容易に接続することのできる導電部材への素子接続構造を提供することにある。
　本発明に係る導電部材への素子接続構造は、前記目的を達成するために、第１の導電部材を絶縁性の保持部材によって保持するとともに、素子の一端を第１の導電部材に導通させ、素子の他端に導通する第２の導電部材を保持部材に装着することにより、素子が第１の導電部材と第２の導電部材に導通した状態で保持されるように構成している。
　これにより、第２の導電部材を保持部材に装着することにより、素子が第１の導電部材と第２の導電部材に導通した状態で保持されることから、ハンダ付けや接着剤を用いることなく素子を第１及び第２の導電部材に接続することができる。
　本発明によれば、ハンダ付けや接着剤を用いることなく素子を第１及び第２の導電部材に接続することができるので、接続作業を極めて容易に行うことができる。この場合、素子が第１及び第２の導電部材に固着されていないので、例えば二次成形の際に高温の樹脂からの熱が加わっても、素子と導電部材との線膨張率の差による接続部の剥離やクラック、或いは素子の破損を発生させることがないという利点もある。
本発明の第１の実施形態を示す素子接続構造の斜視図 素子接続構造の側面断面図 素子接続構造の組立工程を示す分解斜視図 素子接続構造の組立工程を示す分解斜視図 変形例を示す素子接続構造の組立工程の分解斜視図 本発明の第２の実施形態を示す素子接続構造の組立工程の分解斜視図 本発明の第３の実施形態を示す素子接続構造の斜視図 素子接続構造の側面断面図 素子接続構造の組立工程を示す分解斜視図 素子接続構造の電子回路の構成例を示す図
　図１乃至図４は本発明の第１の実施形態を示すものである。同図に示す素子接続構造は、例えば自動車用の圧力センサや回転磁気センサ等の各種機器の製造に用いられるものである。
　本実施形態の素子接続構造は、互いに幅方向に間隔をおいて配置された複数の第１の導電部材１を絶縁性の保持部材２によって保持するとともに、複数の素子３の一端をそれぞれ各第１の導電部材１に導通させ、各素子３の他端に導通する第２の導電部材４を保持部材２に装着することにより、各素子３が第１の導電部材１と第２の導電部材４に導通した状態で保持されるように構成されている。
　各第１の導電部材１は、平板状に延びる導電性の金属からなり、図示しない相手側接続部と接続される端子として用いられる。
　保持部材２は、互いに結合可能な第１の分割部材２ａ及び第２の分割部材２ｂからなり、各分割部材２ａ，２ｂはそれぞれ合成樹脂の成形品によって形成されている。
　第１の分割部材２ａは、横長の直方体状に形成され、各第１の導電部材１の上方に配置されるようになっている。第１の分割部材２ａには各素子３をそれぞれ収容する部品収容部としての複数の部品収容孔２ｃが設けられ、部品収容孔２ｃは上端及び下端を第１の分割部材２ａの上面及び下面に開口するように第１の分割部材２ａを上下方向に貫通している。第１の分割部材２ａの前面及び背面には、第２の導電部材４が係合する第１の係合突部２ｄが幅方向一対ずつ突設され、各第１の係合突部２ｄは上端側が傾斜面をなすように形成されている。また、第１の分割部材２ａの幅方向両側面には、第２の分割部材２ｂが係合する第２の係合突部２ｅがそれぞれ突設され、各第２の係合突部２ｅは下端側が傾斜面をなすように形成されている。
　第２の分割部材２ｂは、各第１の導電部材１がそれぞれ係合する複数の溝２ｆを上面に有し、各第１の導電部材１の下方に配置されるようになっている。第２の分割部材２ｂの幅方向両側には上方に延びる側壁部２ｇが設けられ、各側壁部２ｇには第１の分割部材２ａの各第２の係合突部２ｅがそれぞれ係合する係合孔２ｈが設けられている。
　各素子３は、例えばコンデンサ、抵抗、バリスタ、インダクタ等の電子部品からなる。素子３は、所期の電気的特性を有する素材によって形成された板状の部品本体３ａと、部品本体３ａの幅方向両端側にそれぞれ設けられた一対の電極３ｂとからなり、各電極３ｂは部品本体３ａの幅方向両端部を覆うように形成されている。
　第２の導電部材４は導電性の金属板からなり、保持部材２の上面、前面及び背面を覆うように形成されている。第２の導電部材４は、上壁部４ａ、前壁部４ｂ及び後壁部４ｃからなり、前壁部４ｂ及び後壁部４ｃには、第１の分割部材２ａの各第１の係合突部２ｄがそれぞれ係合する係合孔４ｄが幅方向一対ずつ設けられている。
　本実施形態においては、図３に示すように保持部材２の第１の分割部材２ａと第２の分割部材２ｂとの間に各第１の導電部材１を配置し、第１の分割部材２ａと第２の分割部材２ｂとを互いに係合することにより、各第１の導電部材１が保持部材２に保持される。その際、各第１の導電部材１を第２の分割部材２ｂの各溝２ｆに係合するとともに、第１の分割部材２ａを第２の分割部材２ｂの各側壁部２ｇ間に挿入すると、各側壁部２ｇが弾性変形しながら第１の分割部材２ａの各第２の係合突部２ｅを乗り越え、各第２の係合突部２ｅが第２の分割部材２ｂの各係合孔２ｈに係合する。次に、図４に示すように各素子３をそれぞれ各電極３ｂが上下に位置する向きで保持部材２の各部品収容孔２ｃに上方から挿入する。その際、各素子３の一端（下方の電極３ｂ）と第１の導電部材１との間に導電性の弾性部材としてのコイル状のスプリング５を介装する。続いて、保持部材２に第２の導電部材４を装着する。その際、第２の導電部材４の前壁部４ｂ及び後壁部４ｃの間に保持部材２の第１の分割部材２ａを挿入すると、前壁部４ｂ及び後壁部４ｃが弾性変形しながら第１の分割部材２ａの各第１の係合突部２ｄを乗り越え、各第１の係合突部２ｄが第２の導電部材４の各係合孔４ｄに係合する。これにより、図２に示すように第２の導電部材４が各部品収容孔２ｃ内の素子３の他端（上方の電極３ｂ）に当接するとともに、素子３と第１の導電部材１との間のスプリング５が圧縮され、スプリング５の復元力により、各素子３の上方の電極３ｂが第２の導電部材４に圧接しながら導通し、各素子３の下方の電極３ｂがそれぞれ各第１の導電部材１にスプリング５を介して導通する。
　このように、本実施形態によれば、互いに幅方向に間隔をおいて配置された複数の第１の導電部材１を絶縁性の保持部材２によって保持するとともに、複数の素子３の一端をそれぞれ各第１の導電部材１に導通させ、各素子３の他端に導通する第２の導電部材４を保持部材２に装着することにより、各素子３が第１の導電部材１と第２の導電部材４に導通した状態で保持されるようにしたので、ハンダ付けや接着剤を用いることなく各素子３を各導電部材１，４に接続することができ、接続作業を極めて容易に行うことができる。この場合、各素子３が各導電部材１，４に固着されていないので、例えば二次成形の際に高温の樹脂からの熱が加わっても、素子３と導電部材１，４との線膨張率の差による接続部の剥離やクラック、或いは素子３の破損を発生させることがないという利点もある。
　また、複数の素子３の一端をそれぞれ複数の第１の導電部材１に導通させるとともに、第２の導電部材４を各素子３の他端に導通させるようにしたので、複数の素子３を各導電部材１，４に同時に導通させることができ、相手側接続部が複数ある場合でも接続作業を容易に行うことができる。
　更に、保持部材２に素子３を収容する部品収容部２ｃを設けたので、素子３を保持部材２に確実に位置決めすることができ、組立作業を容易に行うことができる。
　また、保持部材２を互いに結合可能な第１及び第２の分割部材２ａ，２ｂによって形成し、各分割部材２ａ，２ｂ間に各第１の導電部材１を配置して各分割部材２ａ，２ｂを結合することにより、各第１の導電部材１が保持部材２に保持されるようにしたので、部品の組み立てによって各第１の導電部材１と保持部材２とを一体化することができ、生産性の向上を図ることができる。
　更に、第１の導電部材１と素子３との間に導電性のスプリング５を圧縮状態で介装したので、素子３をスプリング５の復元力によって各導電部材１，４に圧接することができ、素子３と各導電部材１，４とを確実に導通させることができる。尚、スプリング５に代えて、例えば板バネやブロック状の導電性ゴム等、他の導電性の弾性部材を用いることも可能である。
　また、保持部材２及び第２の導電部材４に互いに係合する第１の係合突部２ｄ及び係合孔４ｄを設けたので、保持部材２への第２の導電部材４の装着をネジ止めや接着を用いることなく行うことができ、組立作業の効率化に極めて有利である。
　尚、前記実施形態では、全ての素子３に、コンデンサ、抵抗、バリスタ、インダクタ等、所期の電気的特性を有する素材によって形成された部品本体３ａを有する素子を用いたものを示したが、図５に示すように各素子のうちの一つを全体が導電性材料からなる素子６を用いることにより、一つの第１の導電部材１を素子６によって第２の導電部材４に短絡させるようにすれば、その第１の導電部材１をアース電極として用いることができる。
　また、前記第１の実施形態では、スプリング５によって素子３を各導電部材１，４に圧接させるようにしたものを示したが、スプリング５を設ける代わりに、図６に示す第２の実施形態のように、第２の導電部材４の上壁部４ａに複数の弾性片部４ｅを設け、各弾性片部４ｅを素子３の上方の電極３ｂに圧接させるようにすれば、部品点数を少なくすることができる。この場合、各弾性片部４ｅは上壁部４ａの一部を下方に切り起こすことによって形成されているが、例えば第２の導電部材４の肉厚を薄くして上壁部４ａ自体が弾性変形するようにしてもよい。また、第１の導電部材１の一部を弾性変形可能に形成し、素子３の下方の電極３ｂに圧接させるようにしてもよい。
　更に、前記第１の実施形態では、保持部材２を第１及び第２の分割部材２ａ，２ｂによって形成したものを示したが、図７乃至図９に示す第３の実施形態のように、保持部材２を合成樹脂のインサート成形によって各第１の導電部材１と一体に形成するようにすれば、保持部材２の成形時に各第１の導電部材１と保持部材２とを一体化することができ、生産性の向上を図ることができる。尚、第３の実施形態における保持部材２の他の構成は、第１及び第２の分割部材２ａ，２ｂ以外は第１の実施形態と同様である。
　図１０は本発明の素子接続構造における電子回路の構成例を示すもので、例えば図５に示すように２つの素子３にコンデンサを用いるとともに、他の一つの素子として全体が導電性材料からなる素子６を用いた場合の等価回路図を示すものである。
　また、図１０では素子３にコンデンサを用いたものを例示したが、前述したように、コンデンサ以外にも、抵抗、バリスタ、インダクタ等、所期の電気的特性を有する素材によって形成された各種の素子を用いることができるので、複数種類の素子を用いて様々な電子回路を構成することができる。
　１…第１の導電部材、２…保持部材、２ｃ…部品収容孔、３…素子、４…第２の導電部材、４ｅ…弾性片部、５…スプリング、６…素子。

Claims (9)

  1. 　第１の導電部材を絶縁性の保持部材によって保持するとともに、
    　素子の一端を第１の導電部材に導通させ、
    　素子の他端に導通する第２の導電部材を保持部材に装着することにより、素子が第１の導電部材と第２の導電部材に導通した状態で保持されるように構成した
    　ことを特徴とする導電部材への素子接続構造。
  2. 　前記保持部材を互いに結合可能な複数の分割部材によって形成し、各分割部材間に第１の導電部材を配置して各分割部材を結合することにより、第１の導電部材が保持部材に保持されるように構成した
    　ことを特徴とする請求項１記載の導電部材への素子接続構造。
  3. 　前記保持部材を合成樹脂のインサート成形によって第１の導電部材と一体に形成した
    　ことを特徴とする請求項１記載の導電部材への素子接続構造。
  4. 　前記保持部材に素子を収容する部品収容部を設けた
    　ことを特徴とする請求項１、２または３記載の導電部材への素子接続構造。
  5. 　前記第１及び第２の導電部材の少なくとも一方と素子との間に導電性の弾性部材を圧縮状態で介装した
    　ことを特徴とする請求項１、２、３または４記載の導電部材への素子接続構造。
  6. 　前記第１及び第２の導電部材の少なくとも一方を素子に圧接するように弾性変形可能に形成した
    　ことを特徴とする請求項１、２、３または４記載の導電部材への素子接続構造。
  7. 　前記保持部材及び第２の導電部材に互いに係合する係合部を設けた
    　ことを特徴とする請求項１、２、３、４、５または６記載の導電部材への素子接続構造。
  8. 　複数の各素子の一端をそれぞれ複数の第１の導電部材に導通させるとともに、
    　第２の導電部材を各素子の他端に導通させた
    　ことを特徴とする請求項１、２、３、４、５、６または７記載の導電部材への素子接続構造。
  9. 　前記各素子のうちの一部の素子に、第１の導電部材と第２の導電部材とを短絡する素子を用いた
    　ことを特徴とする請求項８記載の導電部材への素子接続構造。
PCT/JP2012/060115 2011-04-18 2012-04-13 導電部材への素子接続構造 WO2012144435A1 (ja)

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