WO2012141544A3 - Tsv 측정용 간섭계 및 이를 이용한 측정방법 - Google Patents
Tsv 측정용 간섭계 및 이를 이용한 측정방법 Download PDFInfo
- Publication number
- WO2012141544A3 WO2012141544A3 PCT/KR2012/002843 KR2012002843W WO2012141544A3 WO 2012141544 A3 WO2012141544 A3 WO 2012141544A3 KR 2012002843 W KR2012002843 W KR 2012002843W WO 2012141544 A3 WO2012141544 A3 WO 2012141544A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tsv
- measurement
- beam splitter
- light
- interferometer
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Instruments For Measurement Of Length By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/111,197 US8873067B2 (en) | 2011-04-13 | 2012-04-13 | Interferometer for TSV measurement and measurement method using same |
CN201280018215.5A CN103460368B (zh) | 2011-04-13 | 2012-04-13 | Tsv检测用干涉仪以及利用该干涉仪的检测方法 |
JP2014505083A JP5751734B2 (ja) | 2011-04-13 | 2012-04-13 | Tsv測定用干渉計及びこれを用いた測定方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110034264A KR101186464B1 (ko) | 2011-04-13 | 2011-04-13 | Tsv 측정용 간섭계 및 이를 이용한 측정방법 |
KR10-2011-0034264 | 2011-04-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012141544A2 WO2012141544A2 (ko) | 2012-10-18 |
WO2012141544A3 true WO2012141544A3 (ko) | 2013-01-10 |
Family
ID=47009873
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2012/002843 WO2012141544A2 (ko) | 2011-04-13 | 2012-04-13 | Tsv 측정용 간섭계 및 이를 이용한 측정방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8873067B2 (ko) |
JP (1) | JP5751734B2 (ko) |
KR (1) | KR101186464B1 (ko) |
CN (1) | CN103460368B (ko) |
TW (1) | TWI442015B (ko) |
WO (1) | WO2012141544A2 (ko) |
Families Citing this family (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103063976B (zh) * | 2012-12-28 | 2016-12-28 | 中国科学院深圳先进技术研究院 | 一种采用二分法对硅通孔进行故障检测的方法和系统 |
KR101414255B1 (ko) * | 2013-03-29 | 2014-07-01 | 에스엔유 프리시젼 주식회사 | Tsv 측정장치 및 측정방법 |
CN104279978B (zh) * | 2013-07-12 | 2018-01-19 | 上海微电子装备(集团)股份有限公司 | 三维图形检测装置及测量方法 |
KR20160025425A (ko) * | 2014-08-27 | 2016-03-08 | 삼성전기주식회사 | 패키지 모듈 측정장치 및 측정방법 |
RU2717751C2 (ru) * | 2015-07-30 | 2020-03-25 | Конинклейке Филипс Н.В. | Лазерный датчик для обнаружения нескольких параметров |
TWI558976B (zh) * | 2015-09-02 | 2016-11-21 | 久元電子股份有限公司 | 導電結構製造方法及盲孔關鍵尺寸資訊檢測方法 |
TWI600876B (zh) * | 2015-11-23 | 2017-10-01 | 財團法人工業技術研究院 | 量測系統 |
US9709386B1 (en) * | 2016-04-05 | 2017-07-18 | Kla-Tencor Corporation | Apparatus and methods for measuring properties in a TSV structure using beam profile reflectometry |
US10410883B2 (en) | 2016-06-01 | 2019-09-10 | Corning Incorporated | Articles and methods of forming vias in substrates |
US10794679B2 (en) | 2016-06-29 | 2020-10-06 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
US10134657B2 (en) | 2016-06-29 | 2018-11-20 | Corning Incorporated | Inorganic wafer having through-holes attached to semiconductor wafer |
KR20230135690A (ko) * | 2016-10-04 | 2023-09-25 | 케이엘에이 코포레이션 | 반도체 디바이스 제조 중 분광 측정의 촉진 |
KR20180128647A (ko) | 2017-05-24 | 2018-12-04 | 삼성전자주식회사 | 광학 측정 방법 및 장치, 및 이를 이용한 반도체 장치의 제조 방법 |
US10580725B2 (en) | 2017-05-25 | 2020-03-03 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
US10527923B2 (en) * | 2018-02-07 | 2020-01-07 | Yazaki Corporation | Scanning projector transmissive screen, and scanning projector system |
US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
US11152294B2 (en) | 2018-04-09 | 2021-10-19 | Corning Incorporated | Hermetic metallized via with improved reliability |
US11796311B2 (en) * | 2018-07-27 | 2023-10-24 | Skyverse Technology Co., Ltd. | Light emitting device, optical detection system, optical detection device and optical detection method |
WO2020171940A1 (en) | 2019-02-21 | 2020-08-27 | Corning Incorporated | Glass or glass ceramic articles with copper-metallized through holes and processes for making the same |
US11476081B2 (en) * | 2019-09-04 | 2022-10-18 | Applied Materials Israel Ltd. | Evaluating an intermediate product related to a three-dimensional NAND memory unit |
KR102428402B1 (ko) * | 2020-08-18 | 2022-08-02 | (주)뮤텍코리아 | 마이크로 엘이디 검사 시스템 |
US11965731B2 (en) * | 2020-11-03 | 2024-04-23 | Taiwan Semiconductor Manufacturing Company Ltd. | Package structure and measurement method for the package structure |
KR102535055B1 (ko) | 2021-12-22 | 2023-05-30 | 재단법인 구미전자정보기술원 | Dhm을 이용한 깊이 측정 장치 |
EP4279860A1 (en) * | 2022-05-19 | 2023-11-22 | Unity Semiconductor | A method and a system for characterising structures through a substrate |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009036563A (ja) * | 2007-07-31 | 2009-02-19 | Lasertec Corp | 深さ測定装置及び深さ測定方法 |
KR20090097938A (ko) * | 2006-12-22 | 2009-09-16 | 지고 코포레이션 | 표면 특징물의 특성을 측정하기 위한 장치 및 방법 |
KR20100123519A (ko) * | 2009-05-15 | 2010-11-24 | 선문대학교 산학협력단 | 입체형상측정을 위한 광학시스템 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3517903B2 (ja) * | 1993-06-21 | 2004-04-12 | 株式会社ニコン | 干渉計 |
JP4157305B2 (ja) * | 2002-02-13 | 2008-10-01 | 株式会社ミツトヨ | テレセントリックレンズ系および画像測定装置 |
US7324214B2 (en) * | 2003-03-06 | 2008-01-29 | Zygo Corporation | Interferometer and method for measuring characteristics of optically unresolved surface features |
US8004688B2 (en) * | 2008-11-26 | 2011-08-23 | Zygo Corporation | Scan error correction in low coherence scanning interferometry |
TW201038917A (en) * | 2009-04-30 | 2010-11-01 | Univ Nat Taipei Technology | Method and system for lateral scanning interferometry |
-
2011
- 2011-04-13 KR KR1020110034264A patent/KR101186464B1/ko active IP Right Grant
-
2012
- 2012-04-13 JP JP2014505083A patent/JP5751734B2/ja not_active Expired - Fee Related
- 2012-04-13 WO PCT/KR2012/002843 patent/WO2012141544A2/ko active Application Filing
- 2012-04-13 CN CN201280018215.5A patent/CN103460368B/zh not_active Expired - Fee Related
- 2012-04-13 US US14/111,197 patent/US8873067B2/en not_active Expired - Fee Related
- 2012-04-13 TW TW101113395A patent/TWI442015B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090097938A (ko) * | 2006-12-22 | 2009-09-16 | 지고 코포레이션 | 표면 특징물의 특성을 측정하기 위한 장치 및 방법 |
JP2009036563A (ja) * | 2007-07-31 | 2009-02-19 | Lasertec Corp | 深さ測定装置及び深さ測定方法 |
KR20100123519A (ko) * | 2009-05-15 | 2010-11-24 | 선문대학교 산학협력단 | 입체형상측정을 위한 광학시스템 |
Also Published As
Publication number | Publication date |
---|---|
JP5751734B2 (ja) | 2015-07-22 |
TW201243272A (en) | 2012-11-01 |
CN103460368A (zh) | 2013-12-18 |
TWI442015B (zh) | 2014-06-21 |
CN103460368B (zh) | 2016-01-06 |
US20140036273A1 (en) | 2014-02-06 |
JP2014514559A (ja) | 2014-06-19 |
KR101186464B1 (ko) | 2012-09-27 |
WO2012141544A2 (ko) | 2012-10-18 |
US8873067B2 (en) | 2014-10-28 |
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