WO2012132118A1 - Procédé de fabrication d'une cellule de batterie solaire avec carte de câblage, et procédé de fabrication d'un module de batterie solaire - Google Patents

Procédé de fabrication d'une cellule de batterie solaire avec carte de câblage, et procédé de fabrication d'un module de batterie solaire Download PDF

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Publication number
WO2012132118A1
WO2012132118A1 PCT/JP2011/078069 JP2011078069W WO2012132118A1 WO 2012132118 A1 WO2012132118 A1 WO 2012132118A1 JP 2011078069 W JP2011078069 W JP 2011078069W WO 2012132118 A1 WO2012132118 A1 WO 2012132118A1
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WO
WIPO (PCT)
Prior art keywords
adhesive
resin
solar cell
wiring
wiring board
Prior art date
Application number
PCT/JP2011/078069
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English (en)
Japanese (ja)
Inventor
今瀧　智雄
隆行 山田
朋代 白木
安紀子 常深
真介 内藤
正朝 棚橋
晃司 福田
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シャープ株式会社
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Publication of WO2012132118A1 publication Critical patent/WO2012132118A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0224—Electrodes
    • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0236—Special surface textures
    • H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/061—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being of the point-contact type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
    • H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
    • H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/547—Monocrystalline silicon PV cells

Definitions

  • the present invention relates to a method for manufacturing a solar cell with a wiring board and a method for manufacturing a solar cell module.
  • solar cells that convert solar energy into electrical energy have been rapidly expected as next-generation energy sources.
  • solar cells such as those using compound semiconductors and those using organic materials, but currently, solar cells using silicon crystals are the mainstream.
  • the most manufactured and sold solar cells have an n-electrode formed on the surface on which sunlight is incident (light-receiving surface), and a p-electrode on the surface opposite to the light-receiving surface (back surface). It is a double-sided electrode type solar cell having the formed structure.
  • the back electrode solar cell and the wiring substrate are bonded to each other in a process in which solder and an adhesive installed between the back electrode solar cell and the wiring substrate are vacuum-bonded. It is crushed by the pressure applied during Therefore, the space between the back electrode type solar cell and the wiring board tends to be narrow.
  • the filler applied to the cell edge portion is at least partially cured before the step of sealing in the sealing material, in the cell edge portion, the back electrode type solar cell and the wiring substrate The interval between them is difficult to change.
  • the distance between the back electrode type solar cell and the wiring substrate is maintained at the cell edge portion, while the back surface is inside the cell edge portion. Since the gap between the electrode type solar battery cell and the wiring board becomes narrow, the gap between the back electrode type solar battery cell and the wiring board cannot be made uniform.
  • the back electrode solar cell is warped and sealed in a transparent resin, resulting in poor connection between the electrode of the back electrode solar cell and the wiring of the wiring board, and the reliability of the solar cell module
  • the performance decreased.
  • connection failure is likely to occur due to the generation of a gap between the electrode of the back electrode type solar cell and the wiring of the wiring board.
  • the reliability of the solar cell module is lowered.
  • an object of the present invention is to provide a method for manufacturing a solar cell with a wiring board and a method for manufacturing a solar cell module, which can suppress a decrease in reliability.
  • the present invention provides a solar cell with a wiring board, comprising: a solar battery cell having an electrode provided on the back surface opposite to the light-receiving surface; and a wiring board provided with a wiring on one surface of an insulating substrate.
  • a step of disposing a first adhesive on at least a part between the back surface of the solar battery cell and the front surface of the wiring board, and wiring on the electrode on the back surface of the solar battery cell and the wiring board A step of disposing a conductive adhesive containing a conductive substance on at least one of the above, a step of aligning the electrode and the wiring with the back surface of the solar battery cell facing the front surface of the wiring substrate, A step of temporarily fixing the solar cell and the wiring substrate by curing the adhesive, and a step of permanently fixing the solar cell and the wiring substrate by solidifying after heating and melting the conductive material.
  • the first adhesive is cured Even after, the first resin that is softened by heating to a temperature equal to or higher than the glass transition point is included, and the glass transition point of the first resin is lower than the melting point of the conductive material. It is a manufacturing method of a battery cell.
  • the step of arranging the first adhesive material includes a step of arranging the first adhesive material on the peripheral edge of the solar cell.
  • the manufacturing method of the photovoltaic cell with a wiring board of this invention includes the process of arrange
  • the adhesive material includes a second resin that is cured in the step of permanently fixing the solar battery cell and the wiring substrate, and the glass transition point of the second resin is higher than the glass transition point of the first resin. Is preferred.
  • the manufacturing method of the photovoltaic cell with a wiring board of this invention is after the process of arrange
  • the first adhesive material includes a photocurable resin
  • the step of temporarily fixing the photovoltaic cell and the wiring substrate is performed on the first adhesive material. It is preferable to include a step of curing the first adhesive by irradiating light.
  • the first adhesive material includes a thermosetting resin
  • the step of temporarily fixing the solar cell and the wiring substrate includes the first adhesive material. It is preferable to cure the first adhesive by heating to a temperature below the glass transition point of the first resin.
  • the conductive substance contains solid solder and the conductive adhesive contains solder in the third resin.
  • the step of permanently fixing the solar cell and the wiring substrate includes a step of curing the third resin, and the glass transition point of the third resin is It is preferably higher than the glass transition point of the first resin.
  • the step of permanently fixing the solar battery cell and the wiring board is performed by applying pressure in a direction in which the distance between the solar battery cell and the wiring board is reduced. It is preferable to include the process of adding.
  • the step of applying pressure in a direction in which the distance between the solar battery cell and the wiring board is narrowed is such that the heating temperature of the conductive material is the first. It is preferably performed before the temperature reaches the glass transition point or higher of the resin.
  • the present invention includes the above-described method for manufacturing a solar cell with a wiring board, the step of temporarily fixing the solar battery cell and the wiring board, and the direction in which the distance between the solar battery cell and the wiring board is reduced.
  • the step of applying the pressure in the direction in which the mutual distance is narrowed includes the step of pressing the wiring board in the direction of the translucent support member.
  • the step of pressing the wiring board in the direction of the translucent support member is performed in a vacuum atmosphere.
  • the present invention it is possible to provide a method for manufacturing a solar cell with a wiring board and a method for manufacturing a solar cell module that can suppress a decrease in reliability.
  • FIG. (A)-(f) is typical sectional drawing illustrating the manufacturing method of the photovoltaic cell with a wiring board of Embodiment 1.
  • FIG. It is a figure which shows an example of the relationship between the viscosity change of the 1st adhesive material in the process of this Embodiment 1, the viscosity change of a 2nd adhesive material, the change of heating temperature, and elapsed time.
  • 3 is a schematic plan view of a solar cell with a wiring board according to Embodiment 1.
  • FIG. 3 is a schematic cross-sectional view of an end portion of the solar cell module according to Embodiment 1.
  • FIG. (A)-(g) is typical sectional drawing illustrated about an example of the manufacturing method of the back electrode type photovoltaic cell used in Embodiment 1.
  • FIG. It is a typical top view of an example when the back surface electrode type photovoltaic cell used in Embodiment 1 is seen from the back surface side. It is a schematic plan view of another example when the back surface electrode type solar cell used in Embodiment 1 is viewed from the back surface side.
  • FIG. 6 is a schematic plan view of still another example when the back electrode type solar battery cell used in Embodiment 1 is viewed from the back surface side.
  • 2 is a schematic plan view of a wiring board used in Embodiment 1.
  • FIG. (A)-(f) is typical sectional drawing illustrating the manufacturing method of the photovoltaic cell with a wiring board of Embodiment 2.
  • FIG. It is a figure which shows an example of the relationship between the viscosity change of the 1st adhesive material, the viscosity change of 3rd resin, the change of heating temperature, and elapsed time in the main fixing process of Embodiment 2.
  • Embodiment 1 With reference to the schematic cross-sectional views of FIGS. 1 (a) to 1 (f), manufacture of a solar cell with a wiring board according to Embodiment 1, which is an example of a method for manufacturing a solar battery with a wiring board according to the present invention. A method will be described.
  • a step of arranging a first adhesive 31 on the surface of the wiring board 10 is performed.
  • the wiring substrate 10 includes an insulating base material 11, and an n-type wiring 12 and a p-type wiring 13 provided on one surface of the insulating base material 11.
  • the 1st adhesive material 31 is arrange
  • FIG. The first adhesive 31 is disposed in an uncured state, for example.
  • the first adhesive 31 is a resin having a glass transition point, and includes a first resin that is once cured and then softened again by being heated to a temperature equal to or higher than the glass transition point. If there is no particular limitation, it can be used.
  • the first resin preferably contains a photocurable resin and / or a thermosetting resin.
  • the first resin contains a photo-curing resin
  • the first resin includes a photocurable resin
  • the first resin includes a thermosetting resin
  • the first resin can be partially heated, heating to the back electrode type solar cell is suppressed, so that the first resin includes a photocurable resin as in the case where the first resin includes a photocurable resin. It tends to be possible to effectively prevent damage and deformation to the back electrode type solar battery cell due to.
  • thermosetting resin a resin curable by heating can be used.
  • a thermosetting resin containing at least one selected from the group consisting of an epoxy resin, an acrylic resin, and a urethane resin as a resin component is used. Can do.
  • the glass transition point of the first resin included in the first adhesive 31 is set lower than the melting point of the conductive substance included in the conductive adhesive described later.
  • the first adhesive 31 As a method for arranging the first adhesive 31, for example, a method such as screen printing, dispenser coating, or ink jet coating can be used. Among these, it is preferable to use screen printing. When screen printing is used, the first adhesive 31 can be disposed simply and at low cost and in a short time.
  • first adhesive 31 is disposed on the surface of the insulating base material 11 of the wiring substrate 10
  • 1 adhesive material 31 may be disposed, or the first adhesive material 31 may be disposed both on the back surface of a back electrode type solar cell described later and on the surface of the insulating substrate 11 of the wiring substrate 10. Good.
  • the first adhesive 31 may be arranged so as to straddle the back surface of the back electrode type solar battery cell and the surface of the insulating base material 11 after the alignment step described later.
  • a method such as dispenser coating or inkjet coating as a method for arranging the first adhesive 31.
  • the first adhesive 31 is disposed on the peripheral edge of the back electrode type solar cell.
  • the first adhesive 31 tends to be easily disposed after the alignment step described later.
  • the 1st adhesive material 31 is exposed, in the process of temporary fixing mentioned later, when irradiating light to the 1st adhesive material 31 and hardening the 1st adhesive material 31, light is efficient. There is a tendency that the first adhesive 31 can be cured in a short time by being well irradiated.
  • the first adhesive 31 when the first adhesive 31 is heated to cure the first adhesive 31, the first adhesive 31 is exposed, and the first adhesive 31 Since only this can be heated, there is a tendency that damage and deformation to the back electrode type solar cell due to heat can be prevented.
  • the first adhesive 31 since the first adhesive 31 is deformed by pressurization in the final fixing step described later, when the electrodes of the back electrode type solar cells and the wiring of the wiring substrate 10 are arranged in the vicinity of the first adhesive 31. The deformed first adhesive 31 may hinder the electrical connection between the electrode of the back electrode solar cell and the wiring of the wiring board 10.
  • the back electrode type solar cell 8 includes the semiconductor substrate 1 and also has an n-type electrode 6 and a p-type electrode 7 provided on the back surface which is one surface of the semiconductor substrate 1.
  • the n-type electrode 6 and the p-type electrode 7 are electrodes having different polarities.
  • the second adhesive 34 is also arranged in an uncured state, for example.
  • n-type impurity diffusion region 2 and a p-type impurity diffusion region 3 are formed on the back surface of the semiconductor substrate 1, respectively.
  • the n-type electrode 6 and the p-type electrode 7 are respectively connected to the n-type impurity diffusion region 2 and the p-type. It is formed so as to be in contact with the impurity diffusion region 3.
  • the n-type electrode 6 and the p-type electrode 7 are respectively formed on the n-type impurity diffusion region 2 and the p-type impurity diffusion region 3 in the opening of the passivation film 4 formed on the back surface of the semiconductor substrate 1. Yes.
  • a texture structure is formed on the light receiving surface opposite to the back surface of the semiconductor substrate 1, and an antireflection film 5 is formed on the texture structure.
  • the second adhesive 34 is formed on the back surface region of the back electrode type solar cell 8 between the adjacent n type electrode 6 and the p type electrode 7.
  • the second adhesive 34 is formed on the back surface region of the back electrode type solar cell 8 between the adjacent n type electrode 6 and the p type electrode 7.
  • it is not limited to arrange
  • the second adhesive 34 is not particularly limited as long as the second adhesive 34 includes a second resin that is a resin that is cured in a final fixing step described later.
  • the second resin included in the second adhesive 34 is, for example, A resin that can be in a B-stage state is preferable.
  • the B stage state is a state in which the second resin maintains its shape like a solid while being uncured.
  • a volatile solvent is mixed in the resin, and the viscosity is increased while the resin is not subjected to a curing reaction by volatilizing the solvent after coating.
  • the glass transition point of the second resin is preferably higher than the glass transition point of the first resin.
  • the first adhesive 31 is softened by being heated to a temperature equal to or higher than the glass transition point of the first resin contained in the first adhesive 31.
  • the glass fixing point of the second resin contained in the second adhesive 34 is fixed by making it higher than the glass transition point of the first resin contained in the first adhesive 31.
  • a rapid increase in the viscosity of the second adhesive 34 due to the curing reaction of the second resin during the process can be promoted. Thereby, the stability of the electrical connection between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 is improved, and the mechanical connection between the back electrode type solar cell 8 and the wiring substrate 10 is improved. It tends to be efficient.
  • the glass transition point of the second resin is more preferably higher than the temperature at which the second resin is heated in the final fixing step described later. In this case, it is possible to prevent an increase in the viscosity of the second adhesive 34 due to the curing reaction of the second resin in the final fixing step, which will be described later. 34 tends to be cured.
  • the second adhesive material 34 for example, a method such as screen printing, dispenser coating, or ink jet coating can be used. Among them, it is preferable to use screen printing. When screen printing is used, the second adhesive 34 can be disposed simply, at low cost, and in a short time.
  • the second adhesive 34 is disposed on the back surface of the back electrode type solar cell 8
  • the second adhesion is performed on the insulating base material 11 of the wiring substrate 10.
  • the material 34 may be disposed, and the second adhesive material 34 may be disposed on both the back surface of the back electrode type solar battery cell 8 and the surface of the insulating base material 11 of the wiring substrate 10.
  • the step of temporarily curing the second adhesive 34 includes a step of bringing the second resin in the second adhesive 34 into a B-stage state.
  • the second adhesive 34 is temporarily cured by bringing the second resin into the B-stage state, the second resin is in an uncured state. Is cured, the reliability of the mechanical connection between the back electrode type solar cell 8 and the wiring board 10 tends to be improved.
  • the second resin tends to be softened even when the second resin is heated to a temperature lower than the glass transition point.
  • the second resin can be used without impairing the original fluidity and adhesive strength of the second resin in the final fixing step described later.
  • the back electrode type solar cell 8 and the wiring substrate 10 tend to be firmly fixed by the second adhesive 34.
  • the conductive adhesive 30 preferably includes a solid conductive material 32, and the conductive material 32 is preferably contained in the third resin 33.
  • the conductive adhesive 30 can be disposed without melting the conductive substance 32, and it is not necessary to heat to the melting point of the conductive substance 32. There exists a tendency which can prevent the damage and deformation
  • the conductive adhesive 30 is disposed, for example, in a state where the third resin 33 is uncured.
  • the conductive substance 32 can be used without particular limitation as long as it is a conductive material.
  • solid solder or the like can be used.
  • solder for example, solder having at least one shape selected from the group consisting of granular, flaky, and powdery can be used.
  • the third resin 33 is not particularly limited as long as it is a resin that cures in the final fixing step described later.
  • at least one selected from the group consisting of an epoxy resin, an acrylic resin, and a urethane resin is used as the third resin 33.
  • a thermosetting resin and / or a photocurable resin included as a component, or a resin that can be in a B-stage state can be used.
  • the conductive adhesive 30 is temporarily cured with the third resin 33 in a B-stage state after the conductive adhesive 30 is arranged. It is preferable.
  • the third resin 33 is placed between the back electrode solar cell 8 and the wiring substrate during the alignment between the electrode of the back electrode solar cell 8 and the wiring of the wiring substrate 10 in the alignment step described later. 10, the positioning operation is hindered and the third resin 33 tends to be prevented from sticking to a portion other than an appropriate position.
  • the glass transition point of the third resin 33 included in the conductive adhesive 30 is preferably higher than the glass transition point included in the first adhesive 31.
  • the first adhesive 31 is heated to a temperature equal to or higher than the glass transition point of the first resin contained in the first adhesive 31 and softens.
  • the glass fixing point of the third resin 33 included in the conductive adhesive 30 is fixed by making the glass transition point of the first resin included in the first adhesive 31 higher. A rapid increase in viscosity due to the curing reaction of the third resin 33 during the process can be promoted.
  • a method for arranging the conductive adhesive 30 for example, a method such as screen printing, dispenser coating, or ink jet coating can be used. Among these, it is preferable to use screen printing. When screen printing is used, the conductive adhesive 30 can be disposed simply, at low cost, and in a short time.
  • the conductive adhesive 30 is disposed on the electrode of the back electrode type solar cell 8 in the present embodiment.
  • the conductive adhesive 30 is disposed on the wiring of the wiring substrate 10.
  • the conductive adhesive 30 may be disposed both on the electrode of the back electrode type solar cell 8 and on the wiring of the wiring substrate 10.
  • positioning the electroconductive adhesive material 30 is not specifically limited, For example, these at least 2 processes are performed. It may be performed in parallel.
  • the electrodes of the back electrode type solar cells 8 and the wiring of the wiring substrate 10 are arranged with the back surface of the back electrode type solar cells 8 facing the surface of the wiring substrate 10.
  • the step of aligning is performed.
  • the process of aligning the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 is, for example, such that the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 face each other. Can be done.
  • the back surface is so arranged that the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 face each other. Positioning of the electrode of the electrode type solar cell 8 and the wiring of the wiring board 10 can be performed. Thereby, the reliability of the electrical connection between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 and the reliability of the mechanical connection between the back electrode type solar cell 8 and the wiring substrate 10 are improved. be able to.
  • the back electrode type solar cell 8 and the wiring substrate 10 are temporarily set by curing the first adhesive 31 to form a cured first adhesive 31a.
  • a fixing step is performed.
  • the step of temporarily fixing is performed by irradiating the first adhesive 31 with light and / or heating to cure the first adhesive 31 to form a cured first adhesive 31a. This can be done by fixing the positional relationship between the battery cell 8 and the wiring substrate 10.
  • the entire first adhesive 31 may be cured, but it is preferable to partially cure the first adhesive 31. In this case, it is only necessary to partially cure the first adhesive 31 by irradiating light and / or heating only a necessary portion of the first adhesive 31, and for the same reason as described above.
  • the manufacturing efficiency of the solar cell with the wiring board tends to be improved.
  • when hardening the 1st adhesive material 31 by heating it exists in the tendency which can prevent effectively the damage and deformation
  • the main fixing step includes, for example, pressing the back electrode type solar cell 8 and the wiring substrate 10 to reduce the distance between the back electrode type solar cell 8 and the wiring substrate 10, and the first adhesive material. This can be done by heating 31a, second adhesive 34 and conductive adhesive 30.
  • a step of applying pressure in a direction in which the distance between the back electrode type solar cell 8 and the wiring substrate 10 is reduced is performed.
  • the back electrode type solar cell 8 is moved relative to the wiring substrate 10 in the direction of the arrow 40 by pressurization.
  • a step of heating the temporarily fixed back electrode type solar cell 8 and the wiring substrate 10 may be performed.
  • the first adhesive 31a, the second adhesive 34, and the conductive adhesive 30 It is preferable to perform the step of applying the pressure at a stage where the temperature is lower than the glass transition point of the first resin contained in the first adhesive 31a.
  • the first adhesive 31a is not softened, the relative movement of the back electrode type solar cell 8 with respect to the wiring substrate 10 by the pressurization is restricted. Thereby, in the process to be described later, it is possible to soften and deform the first adhesive 31 a while fixing the relative position of the back electrode type solar cell 8 with respect to the wiring substrate 10.
  • the temperature of these adhesives is included in the first adhesive 31a.
  • the step of heating to a temperature equal to or higher than the glass transition point of the resin.
  • the viscosity of the first resin contained in the first adhesive 31a is lowered, and the first adhesive 31 in the softened state in which the first adhesive 31a can be deformed is obtained.
  • the second adhesive 34 is heated to a temperature lower than the glass transition point of the second resin contained in the second adhesive 34. Thereby, while the viscosity of the 1st adhesive material 31a is reduced and the 1st adhesive material 31a is used as the 1st adhesive material 31 of the softened state which can be deformed, the viscosity of the 2nd adhesive material 34 is quick. It can encourage a rise.
  • the conductive adhesive 30 is heated to a temperature lower than the glass transition point of the third resin 33 included in the conductive adhesive 30. Thereby, it is possible to promote a rapid increase in viscosity due to the curing reaction of the third resin 33.
  • the back electrode type solar battery cell 8 Since the back electrode type solar battery cell 8 is moved in the direction of the wiring substrate 10 due to the deformation of the first adhesive 31, the back electrode type solar battery cell 8 The distance between the back surface of the back electrode type solar cell 8 and the surface of the wiring substrate 10 can be reduced over the entire back surface. Thereby, the space
  • the temperature of these adhesive materials is changed to the solid state contained in the conductive adhesive material 30.
  • a process of cooling after heating to a temperature equal to or higher than the melting point of the conductive material 32 is performed.
  • the solid conductive material 32 melts and aggregates between the electrodes of the back electrode type solar cells 8 and the wiring of the wiring substrate 10 as shown in FIG.
  • the molten conductive material 32 aggregated between them solidifies to electrically connect the electrodes of the back electrode solar cell 8 and the wiring of the wiring board 10.
  • the first resin is cured to become a cured first adhesive 31a
  • the second resin is cured to become a cured second adhesive 34a
  • the third resin 33 is cured and cured.
  • the third resin 33a is in a state.
  • the back electrode type solar cells 8 and the wiring board 10 are mechanically connected by these cured resins.
  • back electrode type solar cell 8 and wiring substrate 10 are permanently fixed, and the solar cell with the wiring substrate of the first embodiment is manufactured.
  • the heating temperature of the second adhesive 34 is preferably a temperature lower than the glass transition point of the second resin contained in the second adhesive 34.
  • the second adhesive 34 can be in a cured state during pressurization and heating, and the relative position of the back electrode solar cell 8 with respect to the wiring substrate 10 during cooling or release of pressurization. Can be prevented from shifting.
  • the heating temperature of the conductive adhesive 30 is preferably a temperature lower than the glass transition point of the third resin 33 included in the conductive adhesive 30. In this case, the third resin 33 can be cured while the conductive material 32 is melted by heating.
  • the cured third resin 33 is adjacent to the conductive material 32 aggregated between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 in a molten state.
  • the conductive material 32 can be prevented from spreading again when the conductive material 32 is solidified by cooling.
  • FIG. 2 shows an example of the relationship between the change in the viscosity of the first adhesive, the change in the viscosity of the second adhesive, the change in the heating temperature, and the elapsed time in the main fixing process of the first embodiment.
  • a one-dot chain line indicates a change in the viscosity of the first adhesive with respect to the elapsed time
  • a two-dot chain line indicates a change in the viscosity of the second adhesive with respect to the elapsed time
  • a solid line indicates heating with respect to the elapsed time. It shows the change in temperature.
  • the time point (a) on the horizontal axis in FIG. 2 indicates the time point before the back electrode type solar cells 8 temporarily fixed to the wiring substrate 10 by the first adhesive 31 are fixed.
  • the second resin contained in the second adhesive is in a B-stage state, and the second adhesive 34 is in an uncured state but in a high viscosity state. Yes.
  • the time point (c) on the horizontal axis in FIG. 2 is the time point when the heating temperature of the first adhesive material 31, the second adhesive material 34, and the conductive adhesive material 30 is equal to or higher than the glass transition point of the first resin. Show. At the time of (c), the 1st adhesive material 31 softens and a viscosity falls. The viscosity of the second adhesive decreases as the heating temperature increases. Since the back electrode type solar cell 8 and the wiring substrate 10 are pressurized in a direction in which the distance is narrowed, the first adhesive 31 having a reduced viscosity is crushed so that the thickness is reduced by this pressure, The gap between the back electrode type solar cell 8 and the wiring board 10 is narrowed.
  • the time point (d) on the horizontal axis in FIG. 2 indicates the time point when the heating temperature of the first adhesive material 31, the second adhesive material 34, and the conductive adhesive material 30 is equal to or higher than the melting point of the conductive material 32. Yes.
  • the conductive material 32 soldder or the like contained in the conductive adhesive 30 is melted, so that the surface of the electrode of the back electrode type solar cell 8 and the surface of the wiring of the wiring substrate 10 are separated. It spreads wet. Moreover, the gap between the back electrode type solar cell 8 and the wiring substrate 10 is further narrowed by the change in state of the conductive material 32 from solid to liquid.
  • the viscosity of the first adhesive 31 and the viscosity of the second adhesive 34 are low, respectively, so that the pressure between the back electrode solar cell 8 and the wiring substrate 10 is low. Since the first adhesive 31 is further crushed so as to reduce the thickness, and the second adhesive 34 is also deformed, the gap between the back electrode solar cell 8 and the wiring substrate 10 is further narrowed. .
  • the time point (e) on the horizontal axis in FIG. 2 starts from the time point (d) and the heating temperature of the first adhesive material 31, the second adhesive material 34 and the conductive adhesive material 30 is equal to or higher than the melting point of the conductive material 32. It shows the time when the temperature has been maintained.
  • the time of (e) since the glass transition point of the second resin contained in the second adhesive 34 is higher than the temperature heated in the main fixing step, the curing reaction of the second resin As the process progresses, the second adhesive 34 gradually cures and its viscosity increases.
  • the time point (f) on the horizontal axis in FIG. 2 indicates the time point when the curing reaction of the second adhesive 34 has progressed to reach a desired viscosity.
  • the pressurization in the direction in which the distance is reduced is stopped and returned to the normal pressure state.
  • the first adhesive 31 also returns to the cured state before heating.
  • the adhesive 31 is cured again in a crushed state.
  • the first adhesive 31 is softened.
  • the back electrode type solar cell 8 is firmly fixed to the wiring substrate 10.
  • temporary fixing is performed by curing the first adhesive 31 in a state where the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 are aligned, and then the back electrode type solar cell.
  • the first adhesive 31 can be softened and deformed by heating the first adhesive 31 to a temperature equal to or higher than the glass transition point of the first resin contained in the first adhesive 31. .
  • the entire back electrode type solar cell 8 is relatively moved in a direction facing the wiring substrate 10 while maintaining the alignment of the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10. It can be made to move and the clearance gap between the back surface electrode type photovoltaic cell 8 and the wiring board 10 can be narrowed. As a result, the uniformity of the size of the gap between the back electrode type solar cell 8 and the wiring substrate 10 can be improved. Thereby, it is possible to suppress mechanical stress such as warpage of the back electrode type solar cell 8 from being applied to the back electrode type solar cell 8.
  • the back electrode type solar battery cell 8 and the wiring board 10 are pressed in such a direction that the distance between the back electrode type solar battery cell 8 and the wiring board 10 becomes narrow, and the entire back surface of the back electrode type solar battery cell 8 and the wiring board 10 are sufficiently bonded. Since these can be fixed in the state of being made, the reliability of the mechanical connection between the back surface electrode type photovoltaic cell 8 and the wiring board 10 can be improved. Moreover, by fixing these in a state where the entire back surface of the back electrode type solar cell 8 and the wiring substrate 10 are sufficiently pressed, the gap between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 is fixed.
  • connection failure due to the generation of the gap is less likely to occur, the reliability of the electrical connection between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 can be improved, and the back electrode The reliability of the mechanical connection between the solar cell 8 and the wiring board 10 can be improved.
  • the glass transition point of the first resin included in the first adhesive 31 is lower than the melting point of the conductive substance 32 included in the conductive adhesive 30
  • the conductive material 32 is melted after narrowing the gap between the electrode and the wiring while maintaining the alignment of the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10.
  • the molten conductive material spreads on the surfaces of the electrodes and the wirings, and the electrodes and the wirings are intimately connected, and then cooled and solidified, whereby the electrodes of the back electrode type solar cells 8 and the wiring substrate 10 are obtained. Are electrically and mechanically connected.
  • the adhesiveness of the back surface electrode type solar cell 8 and the wiring board 10 can fully be improved, the electrical connection between the electrode of the back surface electrode type solar cell 8 and the wiring of the wiring substrate 10 is possible. The reliability of the mechanical connection between the back electrode type solar cells 8 and the wiring board 10 can be further improved.
  • FIG. 3 the typical top view of the photovoltaic cell with a wiring board of Embodiment 1 is shown.
  • the back surface which is the surface on the electrode installation side of the back electrode type solar cell 8
  • the surface on the wiring installation side of the wiring substrate 10 face each other.
  • the back electrode type solar cells 8 and the wiring substrate 10 are arranged.
  • 16 back electrode type solar cells 8 are arranged on one wiring substrate 10, but it is needless to say that the present invention is not limited to this configuration. It is good also as a structure which has arrange
  • FIG. 4 is a schematic cross-sectional view of the end portion of the solar cell module according to the first embodiment.
  • the solar battery cell with the wiring board according to the first embodiment is sealed in the light-transmitting sealing material 18 between the light-transmitting support member 17 and the back surface protective material 19. It is comprised by.
  • the solar cell module shown in FIG. 4 can be manufactured, for example, as follows. First, a translucent support member 17 such as glass, a translucent sealing material 18 such as ethylene vinyl acetate (EVA), a solar cell with a wiring board, a translucent sealing material 18, a polyester film, and the like Are laminated in this order. Then, heating is performed while pressurizing between the translucent support member 17 and the back surface protective material 19, and the translucent sealing material 18 is melted and then cured, integrated, and sealed. Can do.
  • EVA ethylene vinyl acetate
  • the back electrode type solar battery cell 8 and the wiring substrate 10 after being temporarily fixed by curing of the first adhesive 31 are sandwiched between the translucent sealing materials 18, and the light receiving surface (electrode) of the back electrode type solar battery cell 8.
  • a translucent support member 17 is laminated on the translucent sealing material 18 on the side opposite to the back surface on the forming side, and the back surface on the translucent encapsulating material 18 on the side opposite to the light receiving surface side.
  • the protective material 19 is laminated to form a laminate. Therefore, the laminated body is formed by laminating the back surface protective material 19, the translucent sealing material 18, the wiring substrate 10, the back electrode type solar cell 8, the translucent sealing material 18, and the translucent support member 17 in this order. Configured.
  • a solar cell module can be manufactured by sealing.
  • the back electrode type solar cell 8 and the translucent seal are provided.
  • a process of laminating the material 18 and the translucent support member 17 in order, and heating and pressurizing the same with a laminator or the like is generally used.
  • the main fixing step can be included in the step of heating and pressurizing with the laminator described above.
  • the whole surface of the back electrode type solar cell 8 can be uniformly pressurized while being heated to a predetermined temperature, the adhesion between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 is improved. Thus, an electrical and mechanical connection can be obtained.
  • the back electrode type solar cells 8 connected to the wiring substrate 10 can be sealed with the translucent support member 17 and the translucent sealing material 18. For these reasons, a highly reliable solar cell module can be manufactured by performing the main fixing step at the time of sealing in the translucent sealing material 18.
  • the pressurization between the translucent support member 17 and the back surface protective material 19 is performed in a vacuum atmosphere.
  • the gap between the back electrode type solar cell 8 and the wiring substrate 10 is narrowed by applying pressure between the translucent support member 17 and the back surface protective material 19 to the above laminate in a vacuum atmosphere. It can be sealed in the translucent sealing material 18 so that no gap remains between the back electrode type solar cell 8 and the wiring substrate 10.
  • the solar cell module of Embodiment 1 includes a back surface protective material 19, a translucent sealing material 18, a wiring substrate 10, a back electrode type solar cell 8, a translucent sealing material 18, and a translucent support member. 17 are laminated in this order. However, the back surface protection material 19 and the translucent sealing material 18 disposed between the back surface protection material 19 and the wiring substrate 10 are omitted, and the wiring substrate 10 is protected from the back surface. The material 19 may also be used. In this case, pressure is applied between the translucent support member 17 and the wiring board 10.
  • back electrode type solar cell 8 for example, the back electrode type solar cell 8 manufactured as follows can be used.
  • an example of a method for manufacturing the back electrode type solar cell 8 used in Embodiment 1 will be described with reference to the schematic cross-sectional views of FIGS. 5 (a) to 5 (g).
  • a semiconductor substrate 1 having a slice damage 1a formed on the surface of the semiconductor substrate 1 is prepared, for example, by slicing from an ingot.
  • the semiconductor substrate for example, a silicon substrate made of polycrystalline silicon, single crystal silicon, or the like having either n-type or p-type conductivity can be used.
  • the slice damage 1a on the surface of the semiconductor substrate 1 is removed.
  • the removal of the slice damage 1a is performed, for example, when the semiconductor substrate 1 is made of the above silicon substrate, the surface of the silicon substrate after the above slice is mixed with an aqueous solution of hydrogen fluoride and nitric acid, sodium hydroxide, or the like. It can be performed by etching with an alkaline aqueous solution or the like.
  • the size and shape of the semiconductor substrate 1 after removal of the slice damage 1a are not particularly limited, but the thickness of the semiconductor substrate 1 can be set to 50 ⁇ m or more and 400 ⁇ m or less, for example.
  • an n-type impurity diffusion region 2 and a p-type impurity diffusion region 3 are formed on the back surface of the semiconductor substrate 1, respectively.
  • the n-type impurity diffusion region 2 can be formed, for example, by a method such as vapor phase diffusion using a gas containing n-type impurities
  • the p-type impurity diffusion region 3 uses, for example, a gas containing p-type impurities. It can be formed by a method such as vapor phase diffusion.
  • the n-type impurity diffusion region 2 and the p-type impurity diffusion region 3 are each formed in a strip shape extending to the front surface side and / or the back surface side of FIG. Are alternately arranged at predetermined intervals on the back surface of the semiconductor substrate 1.
  • the n-type impurity diffusion region 2 is not particularly limited as long as it includes an n-type impurity and exhibits n-type conductivity.
  • an n-type impurity such as phosphorus can be used.
  • the p-type impurity diffusion region 3 is not particularly limited as long as it includes a p-type impurity and exhibits p-type conductivity.
  • a p-type impurity such as boron or aluminum can be used.
  • n-type impurity a gas containing an n-type impurity such as phosphorus such as POCl 3 can be used.
  • a gas containing a p-type impurity a p-type such as boron such as BBr 3 is used.
  • a gas containing impurities can be used.
  • a passivation film 4 is formed on the back surface of the semiconductor substrate 1.
  • the passivation film 4 can be formed by a method such as a thermal oxidation method or a plasma CVD (Chemical Vapor Deposition) method.
  • the passivation film 4 for example, a silicon oxide film, a silicon nitride film, or a stacked body of a silicon oxide film and a silicon nitride film can be used, but is not limited thereto.
  • the thickness of the passivation film 4 can be, for example, 0.05 ⁇ m or more and 1 ⁇ m or less, and particularly preferably about 0.2 ⁇ m.
  • an uneven structure such as a texture structure is formed on the entire light receiving surface of the semiconductor substrate 1, and then an antireflection film 5 is formed on the uneven structure.
  • the texture structure can be formed, for example, by etching the light receiving surface of the semiconductor substrate 1.
  • the semiconductor substrate 1 is a silicon substrate
  • the semiconductor is used by using an etching solution in which a solution obtained by adding isopropyl alcohol to an alkaline aqueous solution such as sodium hydroxide or potassium hydroxide is heated to 70 ° C. or higher and 80 ° C. or lower, for example. It can be formed by etching the light receiving surface of the substrate 1.
  • the antireflection film 5 can be formed by, for example, a plasma CVD method.
  • a silicon nitride film or the like can be used, but is not limited thereto.
  • a part of the passivation film 4 on the back surface of the semiconductor substrate 1 is removed to form a contact hole 4a and a contact hole 4b.
  • the contact hole 4a is formed so as to expose at least part of the surface of the n-type impurity diffusion region 2, and the contact hole 4b exposes at least part of the surface of the p-type impurity diffusion region 3. Formed.
  • the contact hole 4a and the contact hole 4b are formed after a resist pattern having openings at portions corresponding to the formation positions of the contact hole 4a and the contact hole 4b is formed on the passivation film 4 by using, for example, photolithography technology.
  • the back electrode type solar battery cell 8 can be manufactured.
  • FIG. 6 shows a schematic plan view of an example when the back electrode type solar cell 8 manufactured as described above is viewed from the back side.
  • the n-type electrode 6 and the p-type electrode 7 are each formed in a comb shape, and the portion corresponding to the comb teeth of the comb-shaped n-type electrode 6 and the comb-shaped p-type electrode
  • the n-type electrode 6 and the p-type electrode 7 are arranged so that the portions corresponding to the comb teeth of the electrode 7 are alternately meshed one by one.
  • a portion corresponding to the comb teeth of the comb-shaped n-type electrode 6 and a portion corresponding to the comb teeth of the comb-shaped p-type electrode 7 are alternately arranged at predetermined intervals. Will be.
  • the shape and arrangement of the n-type electrode 6 and the p-type electrode 7 on the back surface of the back electrode type solar cell 8 are not limited to the configuration shown in FIG. Any shape and arrangement that can be electrically connected to the mold wiring 13 are acceptable.
  • FIG. 8 shows a schematic plan view of still another example when the back electrode type solar battery cell 8 is viewed from the back surface side.
  • the n-type electrode 6 and the p-type electrode 7 are each formed in a dot shape, and a row of dot-shaped n-type electrodes 6 (extending in the vertical direction in FIG. 8) and a dot shape.
  • the rows of p-type electrodes 7 (extending in the vertical direction in FIG. 8) are alternately arranged one by one on the back surface of the semiconductor substrate 1.
  • FIG. 9 shows a schematic plan view of the wiring board used in the first embodiment.
  • the wiring substrate 10 has an insulating base material 11, a comb-shaped n-type wiring 12 provided on one surface of the insulating base material 11, a comb-shaped p-type wiring 13, And a strip-shaped connection wiring 14.
  • each of the n-type wiring 12 and the p-type wiring 13 has a comb shape, and there is one portion corresponding to the comb teeth of the n-type wiring 12 and one portion corresponding to the comb teeth of the p-type wiring 13.
  • An n-type wiring 12 and a p-type wiring 13 are arranged so as to alternately mesh with each other.
  • the portions corresponding to the comb teeth of the n-type wiring 12 and the portions corresponding to the comb teeth of the p-type wiring 13 are alternately arranged at predetermined intervals.
  • the comb-shaped n-type wiring 12 and the comb-shaped p-type wiring 13 which face each other in the longitudinal direction of the comb teeth are electrically connected by a band-shaped connection wiring 14.
  • the wiring board 10 can be manufactured as follows, for example. First, an insulating substrate 11 such as a PEN film is prepared, and a conductive material such as a metal foil or a metal plate is bonded to the entire surface of one surface of the insulating substrate 11. For example, a roll of the insulating base material 11 cut to a predetermined width is pulled out, an adhesive is applied to one surface of the insulating base material 11, and the metal foil is cut slightly smaller than the width of the insulating base material 11, for example It can be bonded by applying pressure and heating by superposing rolls of conductive materials such as.
  • a conductive material such as a metal foil or a metal plate
  • a part of the conductive material bonded to the surface of the insulating base material 11 is removed by photoetching or the like, and the conductive material is patterned, so that the back electrode type is formed on the surface of the insulating base material 11.
  • Wirings including an n-type wiring 12, a p-type wiring 13 and a connection wiring 14 made of a conductive material patterned in accordance with the shape of the electrode of the solar battery cell 8 are formed. Thereby, the wiring board 10 can be manufactured.
  • the material of the insulating substrate 11 can be used without particular limitation as long as it is an electrically insulating material.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PET polyphenylene sulfide
  • a material containing at least one resin selected from the group consisting of PPS (Polyphenylene sulfide), polyvinyl fluoride (PVF) and polyimide (Polyimide) can be used.
  • the thickness of the insulating substrate 11 is not particularly limited, and can be, for example, 25 ⁇ m or more and 150 ⁇ m or less.
  • the insulating substrate 11 may have a single-layer structure composed of only one layer or a multi-layer structure composed of two or more layers.
  • any conductive material can be used without particular limitation.
  • a metal including at least one selected from the group consisting of copper, aluminum, and silver can be used.
  • the thickness of the wiring is not particularly limited, and can be, for example, 10 ⁇ m or more and 50 ⁇ m or less.
  • the shape of the wiring is not limited to the shape described above, and can be set as appropriate.
  • the wiring may also have a single-layer structure consisting of only one layer or a multi-layer structure consisting of two or more layers.
  • a step of placing the first adhesive 31 on the surface of the wiring board 10 is performed.
  • the conductive adhesive 30 is disposed on the surface of the n-type electrode 6 and the surface of the p-type electrode 7 on the back surface of the back electrode type solar cell 8. Perform the process.
  • the third resin 33 of the conductive adhesive 30 it is preferable to perform a step of temporarily curing the third resin 33 of the conductive adhesive 30.
  • the third resin 33 becomes the back electrode type solar during the alignment of the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 in the alignment step described later.
  • adhesion between the battery cell 8 and the wiring substrate 10 can be inhibited to hinder the alignment operation, and that the third resin 33 can be prevented from adhering to a portion other than an appropriate position.
  • the step of temporarily curing the third resin 33 includes a step of bringing the third resin 33 into a B-stage state.
  • the third resin 33 is temporarily cured by setting the third resin 33 to the B stage state, the third resin 33 is in an uncured state.
  • the reliability of the mechanical connection between the back electrode type solar cell 8 and the wiring substrate 10 tends to be improved.
  • the third resin 33 tends to be softened even when the third resin 33 is heated to a temperature lower than the glass transition point.
  • the electrodes of the back electrode type solar cells 8 and the wiring of the wiring substrate 10 are arranged so that the back surface of the back electrode type solar cells 8 faces the surface of the wiring substrate 10.
  • the step of aligning is performed.
  • the temperature of the first adhesive 31a and the conductive adhesive 30 reaches a temperature equal to or higher than the glass transition point of the first resin contained in the first adhesive 31, FIG.
  • the back electrode type solar cell 8 is moved relative to the wiring substrate 10 in the direction of the arrow 40 by pressurization.
  • the temperature of these adhesives is equal to or higher than the glass transition point of the first resin contained in the first adhesive 31a. The process of heating to the temperature of is performed.
  • the temperature of these adhesives is equal to or higher than the melting point of the solid conductive substance 32 included in the conductive adhesive 30.
  • the process of cooling after heating to this temperature is performed.
  • the solid conductive material 32 is melted and aggregated between the electrodes of the back electrode solar cell 8 and the wiring of the wiring board 10 as shown in FIG.
  • the molten conductive material 32 aggregated between them solidifies to electrically connect the electrodes of the back electrode solar cell 8 and the wiring of the wiring board 10.
  • the first resin is cured to become a cured first adhesive 31a
  • the third resin 33 is cured to become a cured third resin 33a.
  • the back electrode type solar cells 8 and the wiring board 10 are mechanically connected by these cured resins.
  • back electrode type solar cell 8 and wiring substrate 10 are permanently fixed, and the solar cell with the wiring substrate of the second embodiment is manufactured.
  • the heating temperature of the conductive adhesive 30 is preferably a temperature lower than the glass transition point of the third resin 33 included in the conductive adhesive 30.
  • the third resin 33 can be cured during pressurization and heating, and can be cooled or heated. It is possible to prevent the relative position of the back electrode type solar cell 8 with respect to the wiring substrate 10 from being shifted when the pressure is released.
  • the third resin 33 can be in a cured state while the conductive substance 32 is melted, the gap between the electrode of the back electrode type solar cell 8 and the wiring of the wiring substrate 10 in the molten state.
  • the third resin 33 in a cured state is adjacent to the aggregated conductive material 32, and the conductive material 32 is prevented from spreading again when the conductive material 32 is solidified by cooling. it can.
  • the time point (a) on the horizontal axis in FIG. 11 shows the time point before the back electrode type solar cells 8 temporarily fixed to the wiring substrate 10 by the first adhesive 31 are fixed.
  • the third resin 33 is in a B-stage state, and the third resin 33 is in an uncured state but in a high viscosity state.
  • the time point (b) on the horizontal axis in FIG. 11 indicates the time point of the temperature before the heating temperature of the first adhesive 31 and the conductive adhesive 30 reaches the glass transition point of the first resin.
  • pressurization is started in the direction in which the distance between the back electrode type solar cell 8 and the wiring substrate 10 is reduced from the normal pressure state.
  • the time point (c) on the horizontal axis in FIG. 11 indicates the time point when the heating temperature of the first adhesive 31 and the conductive adhesive 30 is equal to or higher than the glass transition point of the first resin.
  • the 1st adhesive material 31 softens and a viscosity falls.
  • the viscosity of the third resin 33 decreases with increasing heating temperature. Since the back electrode type solar cell 8 and the wiring substrate 10 are pressurized in a direction in which the distance is narrowed, the first adhesive 31 having a reduced viscosity is crushed so that the thickness is reduced by this pressure, The gap between the back electrode type solar cell 8 and the wiring board 10 is narrowed.
  • the time point (d) on the horizontal axis in FIG. 11 indicates the time point when the heating temperature of the first adhesive 31 and the conductive adhesive 30 is equal to or higher than the melting point of the conductive substance 32.
  • the conductive material 32 soldder or the like contained in the conductive adhesive 30 is melted, so that the surface of the electrode of the back electrode type solar cell 8 and the surface of the wiring of the wiring substrate 10 are separated. It spreads wet.
  • the gap between the back electrode type solar cell 8 and the wiring substrate 10 is further narrowed by the change in state of the conductive material 32 from solid to liquid.
  • the viscosity of the first adhesive 31 and the viscosity of the third resin 33 are both low, so the first pressure due to the pressure between the back electrode solar cell 8 and the wiring substrate 10 is The first adhesive 31 is further crushed so as to reduce the thickness, and the gap between the back electrode solar cell 8 and the wiring substrate 10 is further narrowed.
  • the time point (e) on the horizontal axis in FIG. 11 has elapsed from the time point (d) while maintaining the heating temperature of the first adhesive 31 and the conductive adhesive 30 at a temperature equal to or higher than the melting point of the conductive substance 32. Shows the time.
  • the curing reaction of the third resin 33 proceeds and gradually cures. The viscosity increases.
  • a time point (f) on the horizontal axis in FIG. 11 indicates a time point when the curing reaction of the third resin 33 proceeds and a desired viscosity is reached.
  • the distance between the back electrode solar cell 8 and the wiring substrate 10 is reduced. Stop pressurization and return to normal pressure.
  • the first adhesive 31 also returns to the cured state before heating.
  • the third resin 33 is already cured and the back electrode type solar cell 8 is fixed to the wiring substrate 10, The adhesive 31 is cured again in a crushed state.
  • the first adhesive 31 is softened.
  • the back electrode type solar cell 8 is firmly fixed to the wiring substrate 10.
  • a wiring board in which a comb-shaped n-type wiring, a comb-shaped p-type wiring, and a strip-shaped connection wiring were formed on an insulating base made of PEN was produced.
  • the n-type wiring, the p-type wiring, and the connection wiring were each copper wiring.
  • a temporary fixing adhesive made of an ultraviolet curable epoxy resin (hard lock manufactured by Denki Kagaku Kogyo Co., Ltd.) was disposed on the surface of the insulating base material of the wiring board by applying a dispenser.
  • the temporary fixing adhesive was disposed at a position where a part of the peripheral edge of the back electrode type solar cell described later and the wiring board were temporarily fixed.
  • each of the n-type electrode and the p-type electrode was an Ag electrode, and the distance between the adjacent n-type electrode and the p-type electrode was 750 ⁇ m.
  • the width of each of the n-type electrode and the p-type electrode was 50 ⁇ m to 150 ⁇ m, and the height of each of the n-type electrode and the p-type electrode was 3 ⁇ m to 13 ⁇ m.
  • the n-type electrode and the p-type electrode were not formed in a partial region of the peripheral portion of the back electrode type solar cell temporarily fixed by the temporary fixing adhesive.
  • a first made of an uncured thermosetting epoxy resin (DENATEITE manufactured by Nagase ChemteX Corporation) between the n-type electrode and the p-type electrode adjacent to each other on the back surface of the back electrode type solar battery cell.
  • Insulating adhesive was installed by screen printing. Thereafter, the first insulating adhesive material was heated to a temperature at which the epoxy resin did not undergo a crosslinking reaction to be in a B stage state (temporary curing).
  • solder bonding material Super Alzelite manufactured by Tamura Corporation
  • the solder bonding material used here is a solder bonding material in which Sn—Bi solder particles (conductive adhesive) are dispersed in a thermosetting epoxy resin (second insulating adhesive), and the width is approximately 150 ⁇ m. The height was set to approximately 30 ⁇ m.
  • the back electrode type solar cell is formed on the wiring substrate so that the n type electrode and the p type electrode on the back surface of the back electrode type solar cell face the n type wiring and the p type wiring of the wiring substrate, respectively. Positioning was performed after overlapping the battery cells.
  • 16 back electrode type solar cells were installed on one wiring board so that the 16 back electrode type solar cells were electrically connected in series. .
  • the temporary fixing adhesive was cured by irradiating the temporary fixing adhesive with ultraviolet rays (wavelength 365 nm) to temporarily fix the back electrode type solar cell and the wiring board.
  • the ultraviolet rays were applied to a region where the back surface of the back electrode type solar battery cell and the surface of the wiring substrate face each other.
  • the back electrode solar cell and the wiring substrate after temporary fixing are put into a vacuum laminator with the back electrode solar cell side as the lower side, and heated and pressurized to seal the solar cell with the wiring substrate.
  • a solar cell module of Example 1 sealed in a stopper was produced.
  • the back electrode type solar cell after temporary fixing and the wiring board are sealed with a sealing material (light receiving surface side sealing) made of sheet-like EVA so that the back electrode type solar cell is on the upper side.
  • a sealing material (back surface side sealing material) made of another sheet-like EVA and a glass substrate are stacked in this order on the glass substrate and the light receiving surface side seal.
  • a laminate composed of a stopping material, a back electrode type solar cell, a wiring board, and a back surface side sealing material was produced.
  • the laminated body is turned upside down so that the glass substrate becomes the lowermost layer, and then a back surface protective film having a laminated structure containing a PET resin is further stacked on the back surface side sealing material.
  • solder particles were melted, heating and pressurization were maintained, and the first insulating adhesive and the second insulating adhesive in the solder bonding material were cross-linked and cured. Then, after the first insulating adhesive and the second insulating adhesive in the solder bonding material were cured to a desired level, heating and pressurization were released, and the solder was solidified.
  • the electrode of the back electrode type solar cell and the wiring of the wiring substrate are electrically connected by solder, and the n-type silicon substrate of the back electrode type solar cell and the insulating base material of the wiring substrate are Implementation in which solar cells with wiring board that are permanently fixed and mechanically connected with the temporary fixing adhesive, the first insulating adhesive, and the second insulating adhesive are sealed in the sealing material
  • the solar cell module of Example 1 was produced.
  • Example 2 Except for using a resin that can be in a B-stage state for the second insulating adhesive contained in the solder bonding material without using the first insulating adhesive, the same as in Example 1, A solar cell module of Example 2 was produced.
  • Example 1 A solar cell module of a comparative example was produced in the same manner as in Example 1 except that the first insulating adhesive material of Example 1 was used as the temporary fixing adhesive material and was cured by a curing reaction in the temporary fixing process. did.
  • the solar cell modules of Example 1 and Example 2 each have problems such as cracking of the back electrode type solar cell and lower output compared to the solar cell module of the comparative example. It was confirmed that it can be suppressed.
  • the solar cell modules of Example 1 and Example 2 can suppress a decrease in reliability as compared with the solar cell module of the comparative example.
  • the reason for this is that the solar cell modules of Example 1 and Example 2 have the back electrode while softening the cured portion of the temporary fixing adhesive partially cured in the temporary fixing step and deforming the temporary fixing adhesive.
  • the gap between the back electrode type solar cell and the wiring substrate at each of the end portion and the center portion of the back electrode type solar cell is manufactured by performing the process of narrowing the interval between the solar cell type and the wiring substrate. Is more uniform than the solar cell module of the comparative example, and it is considered that the back electrode type solar cell is less likely to be warped.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Photovoltaic Devices (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une cellule de batterie solaire avec une carte de câblage qui consiste notamment à fixer temporairement une cellule de batterie solaire (8) et une carte de câblage (10) en durcissant un premier adhésif (31), et fixer totalement la cellule de batterie solaire (8) et la carte de câblage (10) en chauffant et en faisant fondre un matériau conducteur (32) puis en solidifiant le matériau conducteur (32). Le premier adhésif (31) comprend une première résine qui se ramollit quand elle est chauffée à une température égale ou supérieure à la température de transition vitreuse même après avoir été durcie, la température de transition vitreuse de la première résine étant inférieure au point de fusion du matériau conducteur (32). L'invention concerne également un procédé de fabrication d'un module de batterie solaire.
PCT/JP2011/078069 2011-03-30 2011-12-05 Procédé de fabrication d'une cellule de batterie solaire avec carte de câblage, et procédé de fabrication d'un module de batterie solaire WO2012132118A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-074461 2011-03-30
JP2011074461A JP5123409B2 (ja) 2011-03-30 2011-03-30 配線基板付き太陽電池セルの製造方法および太陽電池モジュールの製造方法

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WO2012132118A1 true WO2012132118A1 (fr) 2012-10-04

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Cited By (1)

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CN104576821B (zh) * 2013-10-24 2017-04-05 台湾积体电路制造股份有限公司 太阳能电池的背面接触设计及其制造方法

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JP6047389B2 (ja) * 2012-12-07 2016-12-21 シャープ株式会社 太陽電池およびその製造方法

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JPH05218137A (ja) * 1992-02-05 1993-08-27 Toshiba Corp 半導体装置の製造方法
JP2003152002A (ja) * 2001-11-16 2003-05-23 Fujitsu Ltd 電子デバイス及び電子デバイス封止方法及び電子デバイス接続方法
WO2006064831A1 (fr) * 2004-12-17 2006-06-22 Matsushita Electric Industrial Co., Ltd. Composition de resine pour conditionnement de puce a protuberances et composition de resine pour former une bosse
JP2010050341A (ja) * 2008-08-22 2010-03-04 Sharp Corp 太陽電池モジュールおよびその製造方法
JP2010092981A (ja) * 2008-10-06 2010-04-22 Sharp Corp 太陽電池、裏面電極型太陽電池、配線基板および太陽電池の製造方法
WO2010082594A1 (fr) * 2009-01-16 2010-07-22 シャープ株式会社 Module de cellule solaire et son procede de fabrication

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JPH05218137A (ja) * 1992-02-05 1993-08-27 Toshiba Corp 半導体装置の製造方法
JP2003152002A (ja) * 2001-11-16 2003-05-23 Fujitsu Ltd 電子デバイス及び電子デバイス封止方法及び電子デバイス接続方法
WO2006064831A1 (fr) * 2004-12-17 2006-06-22 Matsushita Electric Industrial Co., Ltd. Composition de resine pour conditionnement de puce a protuberances et composition de resine pour former une bosse
JP2010050341A (ja) * 2008-08-22 2010-03-04 Sharp Corp 太陽電池モジュールおよびその製造方法
JP2010092981A (ja) * 2008-10-06 2010-04-22 Sharp Corp 太陽電池、裏面電極型太陽電池、配線基板および太陽電池の製造方法
WO2010082594A1 (fr) * 2009-01-16 2010-07-22 シャープ株式会社 Module de cellule solaire et son procede de fabrication

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104576821B (zh) * 2013-10-24 2017-04-05 台湾积体电路制造股份有限公司 太阳能电池的背面接触设计及其制造方法

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