WO2012122712A1 - 液冷led照明灯 - Google Patents

液冷led照明灯 Download PDF

Info

Publication number
WO2012122712A1
WO2012122712A1 PCT/CN2011/071891 CN2011071891W WO2012122712A1 WO 2012122712 A1 WO2012122712 A1 WO 2012122712A1 CN 2011071891 W CN2011071891 W CN 2011071891W WO 2012122712 A1 WO2012122712 A1 WO 2012122712A1
Authority
WO
WIPO (PCT)
Prior art keywords
silicone oil
lamp
liquid
wick
post
Prior art date
Application number
PCT/CN2011/071891
Other languages
English (en)
French (fr)
Inventor
陈锡然
段志勇
Original Assignee
Chen Xiran
Duan Zhiyong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chen Xiran, Duan Zhiyong filed Critical Chen Xiran
Priority to RU2013142337/12A priority Critical patent/RU2542569C1/ru
Priority to EP11861219.1A priority patent/EP2688097A4/en
Priority to BR112013023806A priority patent/BR112013023806A2/pt
Priority to JP2013558284A priority patent/JP5726339B2/ja
Priority to PCT/CN2011/071891 priority patent/WO2012122712A1/zh
Priority to CN201180069343.8A priority patent/CN103597592B/zh
Priority to AU2011362557A priority patent/AU2011362557B8/en
Priority to CA2830284A priority patent/CA2830284C/en
Publication of WO2012122712A1 publication Critical patent/WO2012122712A1/zh
Priority to US14/028,532 priority patent/US9338835B2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506—Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30—Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]

Definitions

  • the invention relates to the field of LED illumination, and in particular to a liquid-cooled LED illumination lamp. Background technique
  • LEDs are energy-saving, environmentally friendly, long-lived, and small, and can be widely used in various fields such as indication, display, decoration, backlight, general lighting, and urban night scenes.
  • the application of LED lighting products is attracting the attention of the world.
  • LED is bound to be the future development trend. In the 21st century, it will enter the era of new lighting sources represented by LED.
  • the LED light-emitting chip emits light through electronic recombination.
  • the heat generated is small.
  • the main factor affecting the LED light-emitting chip is the temperature (the operating temperature of the PN junction).
  • the operating temperature of the PN junction is generally not higher than 120 degrees, preferably around 100 degrees.
  • the temperature of the PN junction rises by 10 degrees, the luminous flux is attenuated.
  • the dominant wavelength of the light will drift by 1 nm and the lifetime will decrease. Therefore, heat dissipation is a problem that must be considered in LED lighting.
  • the size of the LED light-emitting chip is very small, it is point light, and has high directivity (the light emitted by the LED light-emitting chip is straight, and the divergence is not good), which directly leads to a relatively small illumination angle, and the light is quickly deviated from the angle. Weakened, unable to adapt to the needs of large-area lighting.
  • the lamp type LED illumination is used, the lamps are arranged too densely, the design cost is too high, the heat dissipation effect is poor, and the energy saving effect is lost.
  • a liquid-cooled LED illuminating lamp provided for the purpose of the present invention includes: a lamp cap, a wick and a lamp housing; the illuminating lamp housing is disposed at a periphery of the wick and the cavity of the illuminating lamp housing is filled with a silicone oil for heat conduction One end of the wick is immersed in the silicone oil for heat conduction; at the other end of the wick, the lamp housing is sealedly connected to the lamp cap.
  • the silicone oil has a viscosity coefficient of 5 to 8 million cPa s.
  • the silicone oil has a viscosity coefficient of from 5 to 5000 cPa.s.
  • the silicone oil comprises a mercapto silicone oil, an ethyl silicone oil, a phenyl silicone oil, a mercapto hydrogen silicone oil, a mercaptophenyl silicone oil, a mercapto chlorophenyl silicone oil, a mercapto ethoxy silicone oil, a mercapto trifluoropropyl silicone oil, Mercapto vinyl silicone oil, mercaptohydroxy silicone oil, ethyl hydrogen silicone oil, hydroxyl hydrogen silicone oil and cyanide containing silicone oil.
  • the liquid-cooled LED lighting lamp of the present invention has:
  • FIG. 1 is a schematic structural view of a liquid-cooled LED illumination lamp according to Embodiment 1 of the present invention.
  • FIG. 2 is a schematic view showing a wick of a liquid-cooled LED lighting lamp according to Embodiment 1 of the present invention
  • Figure 3 is a cross-sectional view of a liquid-cooled LED lighting lamp according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural view of a high-angle LED light source of a liquid-cooled LED illumination lamp according to Embodiment 2 of the present invention
  • FIG. 5 is a schematic view of a conductive support of a liquid-cooled LED illumination lamp according to Embodiment 2 of the present invention
  • Figure 6 is a cross-sectional view showing a conductive holder of a liquid-cooled LED lighting lamp according to Embodiment 2 of the present invention.
  • FIG. 7 is an installation diagram of an LED light-emitting chip of a high-angle LED light source of a liquid-cooled LED illumination lamp according to an embodiment of the present invention.
  • FIG. 8 is an LED light-emitting of a high-angle LED light source of a liquid-cooled LED illumination lamp according to an embodiment of the present invention. Mounting top view of the chip;
  • 9-12 are schematic diagrams showing the assembly of a wick of a liquid-cooled LED illumination lamp according to Embodiment 2 of the present invention.
  • FIG. 13-17 are assembled diagrams of a liquid-cooled LED illumination lamp according to Embodiment 2 of the present invention.
  • 611 positive support 6111 support cylinder, 6112 straight prismatic head;
  • 612 negative pole support 6121 straight prismatic mounting post: 61221 lens mounting groove;
  • liquid-cooled LED illumination lamp of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
  • a liquid-cooled LED lighting lamp comprises a lamp cap 1 , a wick 1 and a lamp housing 3 ; the lamp housing 3 is covered on the periphery of the wick 1 and the cavity of the lamp housing 3 is filled with heat conduction.
  • the silicone oil 4 is used, and one end of the wick 1 is immersed in the silicone oil 4 for heat conduction.
  • the illuminating lamp housing 3 is sealingly connected to the lamp cap 1.
  • the silicone oil has a viscosity coefficient of from 5 to 8 million cPas.
  • the silicone oil has a viscosity coefficient of from 5 to 5000 cPa ⁇ s.
  • the silicone oil comprises mercapto silicone oil, ethyl silicone oil, phenyl silicone oil, mercapto hydrogen silicone oil, mercaptophenyl silicone oil, mercapto chlorophenyl silicone oil, mercapto ethoxy silicone oil, mercapto trifluoropropane Base silicone oil, mercapto ethyl silicone oil, mercaptohydroxy silicone oil, ethyl hydrogen silicone oil, hydroxyl hydrogen silicone oil and cyanide containing silicone oil.
  • the wick 1 comprises a multi-sided lamp post 21 and a connecting member 22;
  • the multi-sided lamp post 21 is a multi-sided lamp post surrounded by an aluminum-based circuit board;
  • the top surface of each of the ends of the column 21 and each of the side arrays have a plurality of LED light-emitting chips;
  • the other end of the multi-sided lamp post is connected to the connecting member 22; and
  • the connecting member 22 is sealingly connected with the lamp cap 1.
  • the aluminum-based circuit board has excellent thermal conductivity, so the multi-edge lamp post has good thermal conductivity. The heat generated by the LED light-emitting chips is transmitted to the multi-sided lamp post.
  • the temperature is different to form convection, and the convection takes away the heat of the multi-sided lamp post; at the same time, the lamp housing and the outside world are illuminated.
  • the contact surface of the air is large and it is also good for heat dissipation.
  • the multi-sided lamp post 21 is a hollow multi-sided lamp post, and a plurality of holes are arranged on each side of the multi-sided lamp post.
  • the heat generated by the plurality of LED light-emitting chips is transmitted to the prismatic lamp post, which causes the temperature of the silicone oil on the outer side and the hollow portion of the multi-sided lamp post to be different, and the convection of the silicone oil on the outer side and the hollow portion of the multi-sided lamp post is realized through a plurality of holes. , speed up the heat dissipation.
  • the polygonal lamp post 21 is partially or completely immersed in the silicone oil 4.
  • Embodiment 2 is
  • the liquid-cooled LED lighting lamp of the embodiment of the present invention comprises a lamp cap 1, a wick 2, a lamp housing 3, a silicone oil 4 for heat conduction, and a driving power source receiving body 5;
  • the lamp housing 3 is covered in the wick
  • the periphery of the illuminating lamp housing 3 is filled with a silicone oil 4 for heat conduction; one end of the wick 1 is immersed in the silicone oil 4 for heat conduction, and the other end of the wick 1 is connected to the lamp cap 1 by the driving power source accommodating body 5;
  • the lighting lamp housing 3 is fixedly connected to the driving power source housing 5 .
  • the silicone oil has a viscosity coefficient of from 5 to 8 million cPas.
  • the silicone oil has a viscosity coefficient of from 5 to 5000 cPa ⁇ s.
  • the silicone oil comprises mercapto silicone oil, ethyl silicone oil, phenyl silicone oil, mercapto hydrogen silicone oil, mercaptophenyl silicone oil, mercapto chlorophenyl silicone oil, mercapto ethoxy silicone oil, mercapto trifluoropropane Base silicone oil, mercapto-based silicone oil, mercapto-hydroxy silicone oil, ethyl hydrogen-containing silicone oil, hydroxyl-containing silicone oil and cyanide-containing silicone oil.
  • the wick 1 includes a large angle LED light source 6, as shown in Fig. 4, including a conductive bracket 61, a lens 62, an LED light emitting chip, and a bonding wire 63.
  • the conductive support 61 includes a positive electrode support body 611 and a negative electrode support base 612.
  • the positive electrode support body 611 and the negative electrode support base 612 are filled with an insulating and thermally conductive plastic, that is, a positive electrode support body 611 and a negative electrode support base 612. They are electrically conductive, and the positive electrode support 611 and the negative electrode support base 612 are insulated and thermally conductive.
  • the positive electrode support 611 is connected to the positive electrode of the circuit, and the negative electrode support base 612 is connected to the negative electrode of the circuit.
  • the positive electrode support body 611 includes a support cylinder 6111 and a right prismatic head portion 6112 provided at one end of the support cylinder, wherein the bottom surface of the straight prism of the head portion 6112 is a regular octagon.
  • the radius of the straight prismatic head portion 6112 is larger than the radius of the supporting cylinder 6111, and the length of the supporting cylinder 6111 is greater than the length of the negative electrode supporting base 612.
  • the negative electrode support base 612 is provided with a right prism-shaped mounting post 6121 from the top to the bottom, a positioning cylinder 6122 (which functions as described below) and a threaded post 6123 (which functions as described below).
  • the bottom surface of the straight prism of the mounting post 6121 is a regular octagon; the radius of the threaded post 6123 is the smallest, the radius of the straight prismatic mounting post 6121 is centered, and the radius of the positioning cylinder 6122 is the largest.
  • the negative electrode support base 612 is provided with a cylindrical hollow passage 6124 extending longitudinally through the center of the negative electrode support base 612, and the radius of the hollow passage 6124 is slightly larger than the radius of the support cylinder 6111, and is larger than the straight prismatic head portion 6112. The radius is small.
  • the upper surface of the positioning cylinder 6122 is provided with an annular lens mounting groove 61221, and the lens 62 is fixed in the lens mounting groove 61221.
  • the support cylinder 6111 of the positive electrode support body 611 passes through the hollow passage 6124, and is caught above the straight prism-shaped mounting post 6121 through the straight prism-shaped head portion 6112, and the support cylinder 6111 protrudes from the lower end of the negative electrode support base 612.
  • an LED light-emitting chip is fixed on the upper surface of the right-angled cylindrical head portion 6112 and each side surface of the right-angled prism-shaped mounting post 6121.
  • the positive (negative) poles of the LED light-emitting chip are respectively connected to the positive electrode support body 611 (negative electrode support base 612) by a bonding wire 63.
  • the positioning cylinder 6122 provides an area where torque can be applied for easy clamping and installation.
  • the high-angle LED light source of the embodiment encapsulates an LED light source with a spherical illumination of more than 270 degrees of illumination angle, and the illumination effect is similar to that of a conventional incandescent light bulb, and can replace the traditional incandescent lamp; but it is 90% more energy-efficient than the conventional incandescent lamp.
  • a conventional LED light source including a light-emitting chip located on a polygonal surface forms a butterfly-like spot due to only the side light-emitting chips.
  • the large-angle LED light source of this embodiment has an LED light-emitting chip on the upper surface of the right-sided prism-shaped head portion 6112 and a multi-faceted LED light-emitting chip such that it emits light in a spherical shape.
  • a sealant is added to the lens mounting groove 61221, and the lens is mounted by mechanical pressing to achieve a high degree of sealing of the high angle LED light source.
  • the application of mechanical compression to the sealing of the LED field greatly improves the sealing effect.
  • the LED light-emitting chip uses a blue light chip, and a phosphor for exciting white light is added to the lens 62, and the proportion of the phosphor does not exceed 10%.
  • a phosphor for exciting white light is added to the lens 62, and the proportion of the phosphor does not exceed 10%.
  • the phosphor is added to the lens 62 for exciting white light, which reduces the step of fluorescent glue on the surface of the blue LED light-emitting chip, thereby greatly improving the production efficiency and reducing the defective rate, so that the batch color coordinate error is extremely small. And avoiding the drawback that the blue light of the blue LED light-emitting chip cannot be effectively excited into white light due to the light decay of the phosphor.
  • the positive electrode support 611 and the negative electrode support 612 are assembled by strip molding.
  • Injection molding is a plastic injection molding process. It refers to the injection molding of plastic between two or more parts. It is a one-piece injection molding process for multiple parts.
  • the positive electrode support 611 and the negative electrode support base 612 are made of metal copper as a raw material, and the surface thereof is plated with pure tantalum or pure gold to increase its electrical conductivity.
  • the right prism of the right-sided cylindrical head portion 6112 may be any one of 3-10 edges.
  • the wick 1 includes the above-mentioned large-angle LED light source 6, and further includes a metal tube 7 and a wick column 8; the metal tube 7 and the wick column 8 are insulated; the metal tube 7 is connected to the positive electrode support 611 The wick post 8 is connected to the negative pole support 612.
  • the inner wall of the 8th end of the wick column is provided with a thread, and the outer end of the outer wick of the other end is provided with a wick groove.
  • the metal tube 7 is sleeved with the supporting cylinder 6111, and the wick column 8 is tightly connected with the threaded post 6123 coated with the heat conductive sealant.
  • the metal tube 7 and the wick post 8 are filled with a heat conductive sealant, that is, the metal tube 7 and the circuit.
  • the positive poles are connected and the wick post 8 is connected to the negative pole of the circuit.
  • the tail of the wick is tightly sealed with the mouth of the lamp housing, so that the silicone oil 4 for heat conduction is sealed in the lamp housing 3.
  • Liquid cooling LED lighting is manufactured as follows:
  • the metal pipe 7 is sleeved on the outer side of the supporting cylinder 6111 by the method of compacting and reducing the diameter; That is, the metal tube and the positive electrode support 611 form a positive electrode;
  • Step 2 As shown in FIG. 10 and FIG. 11, the wick post 8 is tightly connected with the threaded post 6123 coated with the heat conductive sealant, and the heat sealant is filled between the metal tube ⁇ and the wick post 8; that is, the wick post 8 Forming a negative electrode with the negative electrode support 612, and insulating and conducting between the positive electrode and the negative electrode;
  • the third step as shown in Fig. 12, the bottom of the wick 2 is sealed with a sealant;
  • Step 4 As shown in Fig. 13, a certain amount of high thermal conductivity silicone oil is filled from the mouth of the lamp housing 3;
  • Step 5 As shown in Figures 14 and 15, the wick 2 is placed in the illuminating lamp housing 3, and the wick recess is tightly sealed with the rim of the illuminating lamp housing 3 by the sealing device, so that the thermal conductive silicone oil is sealed in the illuminating lamp.
  • the large-angle LED light source is completely immersed in the highly thermally conductive silicone oil, and since the lens 62 is mechanically pressed, the large-angle LED light source does not enter the silicone oil;
  • Step 6 As shown in Fig. 16, the driving power source housing 5 and the lighting lamp housing 3 are connected by a bayonet, and the positive and negative poles of the wick 2 are connected to the positive and negative poles of the driving power source;
  • Step 7 As shown in Fig. 17, the driving power source housing 5 is connected to the lamp cap 1, and the positive and negative poles of the driving power source are connected to the positive and negative poles of the lamp cap 1.
  • the liquid-cooled LED illuminator is assembled.
  • the heat generated by the LED light-emitting chip included in the liquid-cooled LED illuminator is dissipated by the following means: For the LED light-emitting chip located on each side of the right-sided prism-shaped mounting post, the heat generated is transmitted through the straight prism-shaped mounting post To the positioning cylinder, the heat is transferred to the heat-conducting silicone oil by the positioning cylinder, thereby achieving heat dissipation; for the LED light-emitting chip located on the upper surface of the straight prism-shaped head, the heat generated is partially passed through the positive support and the long metal tube. Heat dissipation; part of the heat is transmitted to the positioning cylinder through the straight prismatic mounting post, and is transmitted to the heat transfer silicone oil through the positioning cylinder to achieve heat dissipation.
  • the liquid-cooled LED lighting lamp of the invention has the advantages of simple structure, easy manufacture and manufacture, large irradiation angle, good heat dissipation performance and energy saving.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)

Description

液冷 LED照明灯
技术领域
本发明涉及 LED照明领域， 特别是涉及一种液冷 LED照明灯。 背景技术
在当前全球能源短缺的忧虑再度升高的背景下， 节约能源是我们未来面临的重要的问 题。 LED被称为第四代照明光源或绿色光源， 具有节能、 环保、 寿命长、 体积小等特点， 可以广泛应用于各种指示、 显示、 装饰、 背光源、 普通照明和城市夜景等领域。 在照明领 域， LED发光产品的应用正吸引着世人的目光， LED作为一种新型的绿色光源产品， 必然 是未来发展的趋势， 二十一世纪将进入以 LED为代表的新型照明光源时代。
LED发光芯片通过电子复合而发光， 当在小电流的情况下， 产生热量很小， 但在大功 率的 LED照明灯中， 特别是照明领域的应用， 需要较大的电流， 会产生大量的热量， 使工 作温度升高。 而影响 LED发光芯片的主要因素就是温度（ P-N结的工作温度）， P-N结工作 温度一般不要高于 120度， 最好在 100度左右， P-N结的温度每上升 10度， 光通量就会衰 减 W , 发光的主波长就会漂移 lnm, 寿命也随着降低。 因此， 散热是 LED照明灯所必须考 虑的问题。
另外， LED发光芯片的体积非常的小， 是点发光， 具有指向性高 （LED发光芯片发出 的光是直线， 发散性不好）， 这样就直接导致照射角度比较小， 偏离该角度后光线迅速减 弱， 无法适应大面积照明的需要。 为解决照射角度比较小的问题， 现有技术中釆用灯管型 LED照明， 其灯具排列过密， 设计成本过高及散热效果欠佳， 失去节能效果。 发明内容
本发明的目的在于提供一种液冷 LED照明灯， 其具有散热性能好和结构简单的特点。 为实现本发明目的而提供的液冷 LED照明灯， 其特征在于： 包括灯头， 灯芯和照明灯 壳； 所述照明灯壳罩在灯芯的外围且照明灯壳的空腔内填充有导热用硅油， 所述灯芯的一 端浸没在导热用硅油内； 所述灯芯的另一端， 所述照明灯壳与灯头密封连接。
上述目的还可以通过下述技术方案进一步完善。
所述硅油的粘度系数为 5 -800万厘帕斯卡 .秒。
所述硅油的粘度系数为 5 -5000厘帕斯卡 .秒。 所述硅油包括曱基硅油、 乙基硅油、 苯基硅油、 曱基含氢硅油、 曱基苯基硅油、 曱基 氯苯基硅油、 曱基乙氧基硅油、 曱基三氟丙基硅油、 曱基乙烯基硅油、 曱基羟基硅油、 乙 基含氢硅油、 羟基含氢硅油和含氰硅油。
本发明的有益效果是： 本发明的液冷 LED照明灯， 具有：
1、 结构简单， 易于生产制造；
2、 散热性能好， 节能的特点。 附图说明
图 1是本发明实施例一的液冷 LED照明灯的结构示意图；
图 2是本发明实施例一的液冷 LED照明灯的灯芯的示意图；
图 3是本发明实施例.二的液冷 LED照明灯的剖视图；
图 4是本发明实施例.二的液冷 LED照明灯的大角度 LED光源的结构示意图； 图 5是本发明实施例.二的液冷 LED照明灯的导电支架的示意图；
图 6是本发明实施例.二的液冷 LED照明灯的导电支架的剖视图；
图 7是本发明实施例.二的液冷 LED照明灯的大角度 LED光源的 LED发光芯片的安装示 图 8是本发明实施例.二的液冷 LED照明灯的大角度 LED光源的 LED发光芯片的安装俯 视图；
图 9-12是本发明实施例二的液冷 LED照明灯的灯芯组装示意图；
图 13-17是本发明实施例二的液冷 LED照明灯的组装示意图。
其巾，
1灯头：
2灯芯：
21多棱灯柱， 11连接件；
6大角度 LED光源：
61导电支架：
611正极支撑体： 6111支撑圆柱， 6112直棱柱形头部；
612负极支撑座： 6121直棱柱形安装柱： 61221透镜安装槽；
6122定位圆柱， 6123螺纹柱， 6124圆柱形中空通道; 62透镜， 63焊线； 7金属管； 8灯芯柱；
3照明灯壳； 4硅油； 5驱动电源容纳体。 具体实施方式
为了使本发明的目的、 技术方案及优点更加清楚明白， 以下结合附图及实施例， 对本 发明的液冷 LED照明灯进行进一步详细说明。 应当理解， 此处所描述的具体实施例仅仅用 以解释本发明， 并不用于限定本发明。
实施例一
如图 1所示， 一种液冷 LED照明灯， 包括灯头 1 , 灯芯 1和照明灯壳 3 ; 所述照明灯 壳 3罩在灯芯 1的外围且照明灯壳 3的空腔内填充有导热用硅油 4 , 所述灯芯 1的一端浸 没在导热用硅油 4内。 所述灯芯 1的另一端， 所述照明灯壳 3与灯头 1密封连接。
优选的， 所述硅油的粘度系数为 5 -800万厘帕斯卡 ·秒。
优选的， 所述硅油的粘度系数为 5 -5000厘帕斯卡 ·秒。
优选的， 所述硅油包括曱基硅油， 乙基硅油， 苯基硅油， 曱基含氢硅油， 曱基苯基硅 油， 曱基氯苯基硅油， 曱基乙氧基硅油， 曱基三氟丙基硅油， 曱基乙婦基硅油， 曱基羟基 硅油， 乙基含氢硅油， 羟基含氢硅油和含氰硅油。
优选的， 如图 1所示， 所述灯芯 1包括多棱灯柱 21和连接件 22 ; 所述多棱灯柱 21是 铝基电路板围成的多棱灯柱； 在所述多棱灯柱 21—端的顶面和每个侧面阵列有多颗 LED 发光芯片； 所述多棱灯柱另一端与连接件 22连接； 所述连接件 22与灯头 1密封连接。 铝 基电路板具有卓越的导热性， 那么多棱灯柱导热性很好。 多颗 LED发光芯片产生的热量传 导至的多棱灯柱， 因为硅油距离多棱灯柱的远近不同， 导致温度不同形成对流， 对流将多 棱灯柱的热量带走； 同时照明灯壳与外界空气的接触面很大， 也有利于散热。
优选的， 所述多棱灯柱 21是空心的多棱灯柱， 在所述多棱灯柱每个侧面上设置有多 个孔。 多颗 LED发光芯片产生的热量传导至的多棱灯柱， 导致多棱灯柱的外侧和空心部分 的硅油的温度不同， 通过多个孔实现多棱灯柱的外侧和空心部分的硅油的对流， 加快散热 的速度。
优选的， 所述多棱灯柱 21部分或全部浸没在所述硅油 4内。 实施例二
如图 3所示， 作为一种可实施方式， 本发明实施例的液冷 LED照明灯， 包括灯头 1 , 灯芯 2 , 照明灯壳 3 , 导热用硅油 4和驱动电源容纳体 5 ; 其中， 所述照明灯壳 3罩在灯芯 2的外围且照明灯壳 3的空腔内填充有导热用硅油 4;所述灯芯 1的一端浸没在导热用硅油 4内， 灯芯 1的另一端通过驱动电源容纳体 5与灯头 1相连； 所述照明灯壳 3与驱动电源 容纳体 5固定连接。
优选的， 所述硅油的粘度系数为 5 -800万厘帕斯卡 ·秒。
优选的， 所述硅油的粘度系数为 5 -5000厘帕斯卡 ·秒。
优选的， 所述硅油包括曱基硅油、 乙基硅油、 苯基硅油、 曱基含氢硅油、 曱基苯基硅 油、 曱基氯苯基硅油、 曱基乙氧基硅油、 曱基三氟丙基硅油、 曱基乙婦基硅油、 曱基羟基 硅油、 乙基含氢硅油、 羟基含氢硅油和含氰硅油。
所述灯芯 1包括一大角度 LED光源 6， 如图 4所示， 包括在导电支架 61、透镜 62、 LED 发光芯片和焊线 63。
如图 5和图 6所示， 导电支架 61包括正极支撑体 611和负极支撑座 612 , 正极支撑体 611和负极支撑座 612之间填充有绝缘导热塑料， 即正极支撑体 611和负极支撑座 612分 别是导电的， 且正极支撑体 611与负极支撑座 612之间是绝缘导热的。 正极支撑体 611与 电路的正极相连， 负极支撑座 612与电路的负极相连。
其中，正极支撑体 611包括支撑圆柱 6111和设在支撑圆柱一端的直棱柱形头部 6112, 其中，头部 6112的直棱柱的底面是正八边形。直棱柱形头部 6112的半径大于支撑圆柱 6111 的半径， 支撑圆柱 6111的长度大于负极支撑座 612的长度。
负极支撑座 612的从上到下依次设有直棱柱形安装柱 6121 , 定位圆柱 6122 (其作用在 下文描述）和螺纹柱 6123 (其作用在下文描述）。 其中， 安装柱 6121的直棱柱的底面是正八 边形； 螺纹柱 6123的半径最小， 直棱柱形安装柱 6121的半径居中， 定位圆柱 6122的半 径最大。 负极支撑座 612设有一个圆柱形中空通道 6124 , 该中空通道 6124纵向贯穿负极 支撑座 612的中心处， 且中空通道 6124的半径比支撑圆柱 6111的半径略大， 且比直棱柱 形头部 6112的半径小。 其中， 在定位圆柱 6122的上表面设有环形的透镜安装槽 61221 , 透镜 62固定在透镜安装槽 61221内。
正极支撑体 611的支撑圆柱 6111穿过中空通道 6124 ,通过直棱柱形头部 6112卡在直 棱柱形安装柱 6121的上方， 支撑圆柱 6111从负极支撑座 612下端伸出。
如图 7和图 8所示， 在直棱柱形头部 6112的上表面和直棱柱形安装柱 6121的各个侧 面上固定有 LED发光芯片。 LED发光芯片的正（负）极通过焊线 63分别与正极支撑体 611 (负极支撑座 612 )相连。 在固定 LED发光芯片和使用大角度 LED光源时， 定位圆柱 6122 提供一个可以施加扭力的区域， 方便装夹和安装。 本实施例的大角度 LED光源封装出大于 270度照射角度球形发光的 LED光源， 其发光 效果与传统的白炽灯泡近似， 可以替代传统白炽灯； 但比传统白炽灯节能百分之九十。 现 有的包括位于多棱面的发光芯片的 LED光源， 由于只有侧面的发光芯片，形成蝴蝶状光斑。 本实施例的大角度 LED光源具有位于直棱柱形头部 6112的上表面的 LED发光芯片和多棱 面的 LED发光芯片， 使得其球形发光。
作为一种优选的实施方式， 在透镜安装槽 61221内增加密封胶， 釆用机械压合的方式 安装透镜， 从而实现大角度 LED光源的高度密封性。 将机械压合应用到 LED领域的密封， 大大提高了密封的效果。
作为一种优选的实施方式， LED发光芯片釆用蓝光芯片， 且在透镜 62中加入激发白光 用的荧光粉， 荧光粉所占比例不超过 10%。 当蓝光穿过透镜时， 被激发出白光。 将荧光粉 加入到透镜 62中以用来激发白光， 减少了在蓝光 LED发光芯片表面点荧光胶的步骤， 从 而大幅提高了生产效率和降低了次品率， 使得批次的色坐标误差极小， 且避免了因荧光粉 的光衰， 蓝光 LED发光芯片的蓝光无法被有效激发成白光的弊端。
作为一种优选的实施方式， 通过带件注塑组装正极支撑体 611和负极支撑座 612。 带 件注塑是一种塑料注塑的工艺， 是指在两个以上零件之间注塑塑料， 是多个零件形成一个 整体的注塑加工手段。
作为一种优选的实施方式， 正极支撑体 611和负极支撑座 612釆用金属铜作为原料加 工而成， 其表面镀纯艮或纯金， 用来增加其导电性能。
作为一种可实施方式， 直棱柱形头部 6112的直棱柱可以是 3-10棱中的任意一种。 所述灯芯 1包括上述大角度 LED光源 6 , 还包括金属管 7和灯芯柱 8 ; 所述金属管 7 和灯芯柱 8之间是绝缘的； 所述金属管 7和所述正极支撑体 611相连， 所述灯芯柱 8和所 述负极支撑座 612相连。
灯芯柱 8—端的内壁设有螺纹， 另一端的外侧灯芯尾部设有灯芯凹槽。 金属管 7与支 撑圆柱 6111套接， 灯芯柱 8通过螺纹与涂有导热密封胶的螺纹柱 6123紧密连接， 金属管 7与灯芯柱 8之间填充有导热密封胶， 即金属管 7与电路的正极相连， 灯芯柱 8与电路的 负极相连。 灯芯尾部与照明灯壳的瓶口压紧密封， 这样导热用硅油 4被密封在照明灯壳 3 内。
灯芯的正负极与驱动电源的正负极相连， 驱动电源的正负极与灯头 1的正负极相连。 液冷 LED照明灯的制造方法如下：
第一步： 如图 9所示， 釆用压紧缩径的方法 金属管 7套接在支撑圆柱 6111的外侧； 即金属管 Ί和正极支撑体 611形成正极；
第二步： 如图 10和图 11所示， 灯芯柱 8通过螺纹与涂有导热密封胶的螺纹柱 6123 紧密连接， 在金属管 Ί和灯芯柱 8之间填充导热密封胶； 即灯芯柱 8和负极支撑座 612形 成负极， 且正极和负极之间是绝缘导热的；
第三步： 如图 12所示， 在灯芯 2凹槽内用密封胶打底；
至此， 灯芯 1组装完毕；
第四步： 如图 13所示， 从照明灯壳 3的瓶口填充一定量的高导热的硅油；
第五步： 如图 14和 15所示， 将灯芯 2放入照明灯壳 3 , 用封口器将灯芯凹槽与照明 灯壳 3的瓶口压紧密封， 这样导热用硅油被密封在照明灯壳 3内； 此时大角度 LED光源完 全浸没在高导热的硅油内， 由于透镜 62釆用机械压合的方式进行安装， 因此大角度 LED 光源不会有硅油进入；
至此， 完成灯芯 1与照明灯壳 3的组装；
第六步： 如图 16所示， 驱动电源容纳体 5与照明灯壳 3用卡口的方式连接， 灯芯 2 的正负极与驱动电源的正负极相连；
第七步： 如图 17所示， 驱动电源容纳体 5与灯头 1相连， 驱动电源的正负极与灯头 1 的正负极相连。
液冷 LED照明灯组装完毕。
液冷 LED照明灯内包括的 LED发光芯片所产生的热量是通过如下途径散热的： 对于位于直棱柱形安装柱的各个侧面的 LED发光芯片而言， 其产生的热量通过直棱柱 形安装柱传递到定位圆柱， 通过定位圆柱传递到导热用硅油， 从而实现了散热； 对于位于 直棱柱形头部的上表面的 LED发光芯片而言， 其产生的热量一部分通过正极支撑体和长长 的金属管散热； 一部分通过直棱柱形安装柱传递到定位圆柱， 通过定位圆柱传递到导热用 硅油， 从而实现了散热。
本发明的液冷 LED照明灯， 具有结构简单， 易于生产制造； 照射角度大、散热性能好， 节能的特点。
最后应当说明的是， 很显然， 本领域的技术人员可以对本发明进行各种改动和变型而 不脱离本发明的精神和范围。 这样， 倘若本发明的这些修改和变型属于本发明权利要求及 其等同技术的范围之内， 则本发明也意图包含这些改动和变型。

Claims

权利要求
1、 一种液冷 LED照明灯， 其特征在于：
包括灯头 （ 1 ), 灯芯 （ 2 )和照明灯壳 （ 3 ); 所述照明灯壳 （ 3 )罩在灯芯 （ 1 ) 的外 围且照明灯壳 （3) 的空腔内填充有导热用硅油 （4), 所述灯芯 （2) 的一端浸没在导热用 硅油 （4) 内； 所述灯芯 （2) 的另一端， 所述照明灯壳 （3) 与灯头 （1) 密封连接。
1、 根据权利要求 1所述的液冷 LED照明灯， 其特征在于：
所述硅油的粘度系数为 5 -800万厘帕斯卡 '秒。
3、 根据权利要求 1所述的液冷 LED照明灯， 其特征在于：
所述硅油的粘度系数为 5 -5000厘帕斯卡 .秒。
4、 根据权利要求 1所述的液冷 LED照明灯， 其特征在于：
所述硅油包括曱基硅油， 乙基硅油， 苯基硅油， 曱基含氢硅油， 曱基苯基硅油， 曱基 氯苯基硅油， 曱基乙氧基硅油， 曱基三氟丙基硅油， 曱基乙烯基硅油， 曱基羟基硅油， 乙 基含氢硅油， 羟基含氢硅油和含氰硅油。
5、 根据权利要求 1所述的液冷 LED照明灯， 其特征在于：
所述灯芯 （ 1 ) 包括多棱灯柱（ 21 )和连接件 ( 22 ); 所述多棱灯柱（ 21 )是铝基电路 板围成的多棱灯柱； 在所述多棱灯柱（ 21 )一端的顶面和每个侧面阵列有多颗 LED发光芯 片； 所述多棱灯柱另一端与连接件 (22)连接； 所述连接件 (22) 与灯头 （1) 密封连接。
6、 根据权利要求 5所述的液冷 LED照明灯， 其特征在于：
所述多棱灯柱（21)是空心的多棱灯柱， 在所述多棱灯柱每个侧面上设置有多个孔。
7、 根据权利要求 5所述的液冷 LED照明灯， 其特征在于：
所述多棱灯柱（21)部分或全部浸没在所述硅油 （4) 内。
8、 根据权利要求 1、 2、 3或 4所述的液冷 LED照明灯， 其特征在于：
所述灯芯 （ 1 ) 包括一大角度 LED光源 （ 6 ); 所述大角度 LED光源 （ 6 ) 包括导电支架 (61)、 多个 LED发光芯片和焊线 （63), 所述 LED发光芯片通过所述焊线 （63)与导电支 架（61)相连；
所述导电支架 （ 61 ) 包括正极支撑体（ 611 )和负极支撑座（ 612 ), 所述正极支撑体 (611)和所述负极支撑座（ 612 )之间是绝缘的；
所述正极支撑体（611) 包括直棱柱形头部 （6112), 在所述直棱柱形头部 （6112) 的 上表面固定有所述 LED发光芯片；
所述负极支撑座（612) 包括直棱柱形安装柱（6121), 在所述直棱柱形安装柱（6121) 的各个侧面固定有所述 LED发光芯片。
9、 根据权利要求 8所述的液冷 LED照明灯， 其特征在于： 所述大角度 LED光源（ 6 )还包括透镜（ 62 ),所述负极支撑座（ 612 )包括定位柱（ 6122 ), 在所述定位柱（6122) 的上表面设有透镜安装槽 (61221), 釆用机械压合的方式将所述透 镜（62) 固定在所述透镜安装槽（61221)。
10、 根据权利要求 8所述的液冷 LED照明灯， 其特征在于： 还包括驱动电源容纳体（5); 所述灯芯 （2) 的一端通过所述驱动电源容纳体（5)与 灯头 （ 1 )相连。
11、 根据权利要求 8所述的液冷 LED照明灯， 其特征在于：
所述灯芯 （ 1 )还包括金属管 （ 7 )和灯芯柱（ 8 ); 所述金属管 （ 7 )和灯芯柱（ 8 )之 间是绝缘的； 所述金属管 （ 7 )和所述正极支撑体（ 611 )相连， 所述灯芯柱（ 8 )和所述 负极支撑座（612)相连。
12、 根据权利要求 8所述的液冷 LED照明灯， 其特征在于：
所述正极支撑体（ 611 )和所述负极支撑座（ 612 )之间是釆用带件注塑的方式组装使 其绝缘的。
13、 根据权利要求 8所述的液冷 LED照明灯， 其特征在于：
所述直棱柱形安装柱（6121) 的直棱柱是 3-10棱中的任意一种直棱柱。
14、 根据权利要求 8所述的液冷 LED照明灯， 其特征在于：
所述正极支撑体（ 611 )还包括支撑柱（ 6111 ); 所述负极支撑座（ 612 )设有中空通 道（6124); 所述支撑柱（6111)穿过所述中空通道（6124),通过所述直棱柱形头部（ 6112) 卡在所述直棱柱形安装柱（61 ) 的上方， 所述支撑柱（6111 )从所述负极支撑座（612) 下端伸出。
15、 根据权利要求 9所述的液冷 LED照明灯， 其特征在于：
所述透镜（62) 为加入至多 10%的激发白光用荧光粉的透镜。
PCT/CN2011/071891 2011-03-17 2011-03-17 液冷led照明灯 WO2012122712A1 (zh)

Priority Applications (9)

Application Number Priority Date Filing Date Title
RU2013142337/12A RU2542569C1 (ru) 2011-03-17 2011-03-17 Светодиодная осветительная лампа с жидкостным охлаждением
EP11861219.1A EP2688097A4 (en) 2011-03-17 2011-03-17 LIQUID COOLED LED LIGHT
BR112013023806A BR112013023806A2 (pt) 2011-03-17 2011-03-17 iluminação led lamp com refrigeração líquida
JP2013558284A JP5726339B2 (ja) 2011-03-17 2011-03-17 液冷式ｌｅｄ照明灯
PCT/CN2011/071891 WO2012122712A1 (zh) 2011-03-17 2011-03-17 液冷led照明灯
CN201180069343.8A CN103597592B (zh) 2011-03-17 2011-03-17 液冷led照明灯
AU2011362557A AU2011362557B8 (en) 2011-03-17 Liquid-cooled LED illuminating lamp
CA2830284A CA2830284C (en) 2011-03-17 2011-03-17 Liquid-cooled led illuminating lamp
US14/028,532 US9338835B2 (en) 2011-03-17 2013-09-16 Liquid-cooled LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2011/071891 WO2012122712A1 (zh) 2011-03-17 2011-03-17 液冷led照明灯

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/028,532 Continuation-In-Part US9338835B2 (en) 2011-03-17 2013-09-16 Liquid-cooled LED lamp

Publications (1)

Publication Number Publication Date
WO2012122712A1 true WO2012122712A1 (zh) 2012-09-20

Family

ID=46830036

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2011/071891 WO2012122712A1 (zh) 2011-03-17 2011-03-17 液冷led照明灯

Country Status (8)

Country Link
US (1) US9338835B2 (zh)
EP (1) EP2688097A4 (zh)
JP (1) JP5726339B2 (zh)
CN (1) CN103597592B (zh)
BR (1) BR112013023806A2 (zh)
CA (1) CA2830284C (zh)
RU (1) RU2542569C1 (zh)
WO (1) WO2012122712A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103162277A (zh) * 2013-03-08 2013-06-19 北京优格莱照明科技有限公司 导光散热液在液冷led照明灯中的使用方法以及用途

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204005422U (zh) * 2014-08-18 2014-12-10 何凯 一种液冷灯
EP3195711A4 (en) 2014-09-15 2018-08-29 D'Onofrio, Nicholas, Michael Liquid cooled metal core printed circuit board
US9401468B2 (en) 2014-12-24 2016-07-26 GE Lighting Solutions, LLC Lamp with LED chips cooled by a phase transformation loop
TWI563211B (en) * 2015-02-03 2016-12-21 Kaistar Lighting Xiamen Co Ltd Integrated led light module, fabrication method thereof and led light bulb
CN106402681A (zh) * 2016-10-17 2017-02-15 漳州立达信光电子科技有限公司 发光二极管照明装置
TWI678495B (zh) 2017-03-31 2019-12-01 液光固態照明股份有限公司 發光二極體燈具
CN110553163A (zh) * 2019-10-17 2019-12-10 湖南匡楚科技有限公司 一种高导热的led灯丝灯及其制造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101298903A (zh) * 2008-06-12 2008-11-05 符建 一种光束可调的大功率led光源
CN101457918A (zh) * 2008-12-25 2009-06-17 英飞特电子（杭州）有限公司 液冷led灯
CN101627251A (zh) * 2006-05-02 2010-01-13 舒伯布尔斯公司 用于led灯泡的散热设计
CN101655189A (zh) * 2009-07-16 2010-02-24 艾迪光电（杭州）有限公司 中空式液冷led条形灯
CN101666439A (zh) * 2009-09-16 2010-03-10 鹤山丽得电子实业有限公司 一种液冷led灯具
US20100177522A1 (en) * 2009-01-15 2010-07-15 Yeh-Chiang Technology Corp. Led lamp
CN101881380A (zh) * 2009-05-06 2010-11-10 张栋楠 一种用于led芯片的散热结构

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5262675A (en) * 1988-08-21 1993-11-16 Cray Research, Inc. Laser diode package
US5890794A (en) * 1996-04-03 1999-04-06 Abtahi; Homayoon Lighting units
TW518775B (en) * 2002-01-29 2003-01-21 Chi-Hsing Hsu Immersion cooling type light emitting diode and its packaging method
EP1568254B1 (en) * 2002-11-19 2008-02-20 Dan Friis Lighting body or source of light based on light-emitting diodes
US7182484B2 (en) * 2003-03-07 2007-02-27 Fiberstars, Inc. Light appliance and cooling arrangement
JP4735794B2 (ja) * 2003-06-30 2011-07-27 信越半導体株式会社 発光モジュール
US6880956B2 (en) * 2003-07-31 2005-04-19 A L Lightech, Inc. Light source with heat transfer arrangement
JP2006244725A (ja) * 2005-02-28 2006-09-14 Atex Co Ltd Ｌｅｄ照明装置
US7922359B2 (en) * 2006-07-17 2011-04-12 Liquidleds Lighting Corp. Liquid-filled LED lamp with heat dissipation means
US20090001372A1 (en) * 2007-06-29 2009-01-01 Lumination Llc Efficient cooling of lasers, LEDs and photonics devices
CN201078608Y (zh) * 2007-09-20 2008-06-25 济南立昂科技有限责任公司 一种可二次光重组的led路灯
WO2009045438A1 (en) * 2007-10-03 2009-04-09 Superbulbs, Inc. Glass led light bulbs
EP2399070B1 (en) * 2009-02-17 2017-08-23 Epistar Corporation Led light bulbs for space lighting
CN101832482A (zh) * 2009-12-16 2010-09-15 张旭 大角度led光源和大角度高散热led照明灯
RU101270U1 (ru) * 2010-05-04 2011-01-10 Михаил Юрьевич Валенцов Светодиодная лампа
RU100587U1 (ru) * 2010-07-12 2010-12-20 Государственное образовательное учреждение профессионального образования "Уральский государственный университет им. А.М. Горького" Светодиодное осветительное устройство
US20120026723A1 (en) * 2011-02-01 2012-02-02 Switch Bulb Company, Inc. Omni-directional channeling of liquids for passive convection in led bulbs
US8226274B2 (en) * 2011-03-01 2012-07-24 Switch Bulb Company, Inc. Liquid displacer in LED bulbs
US8282230B2 (en) * 2011-03-23 2012-10-09 Switch Bulb Company, Inc. Liquid displacement beads in LED bulbs

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101627251A (zh) * 2006-05-02 2010-01-13 舒伯布尔斯公司 用于led灯泡的散热设计
CN101298903A (zh) * 2008-06-12 2008-11-05 符建 一种光束可调的大功率led光源
CN101457918A (zh) * 2008-12-25 2009-06-17 英飞特电子（杭州）有限公司 液冷led灯
US20100177522A1 (en) * 2009-01-15 2010-07-15 Yeh-Chiang Technology Corp. Led lamp
CN101881380A (zh) * 2009-05-06 2010-11-10 张栋楠 一种用于led芯片的散热结构
CN101655189A (zh) * 2009-07-16 2010-02-24 艾迪光电（杭州）有限公司 中空式液冷led条形灯
CN101666439A (zh) * 2009-09-16 2010-03-10 鹤山丽得电子实业有限公司 一种液冷led灯具

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103162277A (zh) * 2013-03-08 2013-06-19 北京优格莱照明科技有限公司 导光散热液在液冷led照明灯中的使用方法以及用途
WO2014135105A1 (zh) * 2013-03-08 2014-09-12 北京优格莱照明科技有限公司 导光散热液在液冷led照明灯中的使用方法以及用途

Also Published As

Publication number Publication date
EP2688097A1 (en) 2014-01-22
US20140015397A1 (en) 2014-01-16
RU2542569C1 (ru) 2015-02-20
CA2830284C (en) 2016-04-12
CN103597592A (zh) 2014-02-19
JP5726339B2 (ja) 2015-05-27
JP2014508389A (ja) 2014-04-03
AU2011362557A1 (en) 2013-10-03
CN103597592B (zh) 2016-10-05
EP2688097A4 (en) 2014-09-24
US9338835B2 (en) 2016-05-10
AU2011362557B2 (en) 2015-12-10
CA2830284A1 (en) 2012-09-20
BR112013023806A2 (pt) 2017-08-08
AU2011362557A8 (en) 2015-12-17

Similar Documents

Publication Publication Date Title
WO2012122712A1 (zh) 液冷led照明灯
CN103016987A (zh) Led灯泡
US20110232886A1 (en) Heat dissipation housing for led lamp
CN101832482A (zh) 大角度led光源和大角度高散热led照明灯
JP2011228300A (ja) 大角度ｌｅｄ光源及び大角度高放熱性ｌｅｄ照明灯
US20140153259A1 (en) Led lamp
CN201555069U (zh) 高效散热型led灯具
CN202074270U (zh) 360度发光的led灯
CN201844222U (zh) 半导体光源及其发光结构
CN202032358U (zh) Led灯泡
CN201724009U (zh) 大角度led光源和大角度高散热led照明灯
CN104896329B (zh) 快速散热的大功率led灯泡
US20130099668A1 (en) Led lamp with an air-permeable shell for heat dissipation
AU2011362557B8 (en) Liquid-cooled LED illuminating lamp
TWM266548U (en) Light emitting diode lamp
CN212430620U (zh) 一种led明装筒灯
US20080272390A1 (en) Led apparatus
CN202349760U (zh) 高散热大功率led射灯
CN214535732U (zh) 一种加速热量传导扩散的新型led灯
CN216743888U (zh) 一体式led陶瓷灯
CN217057184U (zh) 一种新型led灯结构
CN103208574A (zh) Led封装结构
TWM367297U (en) Light emitting diode lamp
CN101893177A (zh) 半导体光源及其发光结构
TWI402461B (zh) Led照明燈具

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11861219

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2830284

Country of ref document: CA

ENP Entry into the national phase

Ref document number: 2013558284

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 112013023857

Country of ref document: BR

ENP Entry into the national phase

Ref document number: 2011362557

Country of ref document: AU

Date of ref document: 20110317

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2011861219

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 2013142337

Country of ref document: RU

Kind code of ref document: A

REG Reference to national code

Ref country code: BR

Ref legal event code: B01A

Ref document number: 112013023806

Country of ref document: BR

ENP Entry into the national phase

Ref document number: 112013023806

Country of ref document: BR

Kind code of ref document: A2

Effective date: 20130917

REG Reference to national code

Ref country code: BR

Ref legal event code: B01A

Ref document number: 112013023857

Country of ref document: BR

ENPW Started to enter national phase and was withdrawn or failed for other reasons

Ref document number: 112013023857

Country of ref document: BR

Free format text: PEDIDO RETIRADO COM BASE NO ART. 216, INCISO 2O DA LPI, POIS O DOCUMENTO DE PROCURACAO NAO FOI PROTOCOLADO EM SESSENTA DIAS CONTADOS DA PRATICA DO PRIMEIRO ATO DA PARTE NO PROCESSO E NAO HOUVE INTERPOSICAO DE RECURSO DO REQUERENTE FRENTE A PUBLICACAO DO ARQUIVAMENTO DA PETICAO NA RPI 2648 DE 05/08/2021.