WO2012108483A1 - 印刷半田検査装置 - Google Patents
印刷半田検査装置 Download PDFInfo
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- WO2012108483A1 WO2012108483A1 PCT/JP2012/052912 JP2012052912W WO2012108483A1 WO 2012108483 A1 WO2012108483 A1 WO 2012108483A1 JP 2012052912 W JP2012052912 W JP 2012052912W WO 2012108483 A1 WO2012108483 A1 WO 2012108483A1
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- solder
- imaging
- illumination
- inspection apparatus
- slit
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Definitions
- the present invention relates to a printed solder inspection apparatus that illuminates and images a substrate and inspects solder printed on the substrate.
- a two-dimensional (hereinafter referred to as 2D) inspection of solder printed on a substrate can be performed by an inspection apparatus having an area camera, ring-shaped multistage illumination, and an image processing apparatus.
- solder printing refers to a process of transferring paste-like solder (cream solder) onto a substrate pad through an opening provided in a thin metal plate called a metal mask. Therefore, cream solder printed on a substrate usually has a thickness of about 100 ⁇ m to 150 ⁇ m.
- 3D three-dimensional
- 3D measurement is a technique that measures the height of the object to be measured, and does not identify the difference in the materials that make up the height. Therefore, printing called “bleeding” in which cream solder spreads thinly on the pad There is a limit that it is difficult to detect defects.
- 2D measurement is a method of identifying cream solder and pad or substrate surface by brightness difference, color difference, surface condition difference by optimizing the illumination color and illumination irradiation direction. It has complementarity to 3D measurement that can extract cream solder that spreads thinly.
- Patent Document 2 discloses that 2D or 3D inspection of solder printed on a substrate is possible by an inspection apparatus having an area camera, ring-shaped multistage illumination, slit light illumination, and an image processing apparatus. Yes. Further, in Patent Document 3, the slit light is irradiated obliquely, and the unevenness information of the slit light trace generated by the unevenness of the substrate is imaged by an imaging device installed directly above, whereby the solder printed on the substrate is detected. It is disclosed that 3D inspection is possible.
- both 2D inspection and 3D inspection are performed by mounting a multi-stage ring illumination for 2D inspection and slit illumination for 3D inspection in one optical system.
- 3D inspection is a method of imaging by continuously scanning the inspection object while irradiating slit light
- 2D inspection is a method of irradiating multistage ring illumination and imaging a stationary inspection object.
- the simultaneous execution was difficult because the operations were different. Therefore, even if a shared optical system configuration is adopted, 3D inspection and 2D inspection must be performed separately.
- the substrate to be inspected must be inspected twice. There was a problem in the inspection time that it would not be.
- illumination is performed so as to face each other from two directions, such as 3D illumination 11a and 11b, 2D illumination 21a and 21b, 31a and 31b, and 41a and 41b in FIG.
- the present applicant has proposed a printed solder inspection apparatus in which the center in the long axis direction is arranged so as to pass through the optical axes of the imaging lens 60 and the camera 50 in a straight line (Japanese Patent Laying-Open No. 2009-36736). reference).
- the irradiation from these two directions is intended to irradiate the entire circumference of the solder A, which is the object to be irradiated, by scanning as shown in FIG.
- the irradiation from only these two directions causes a spot where the blind spot or illuminance falls to a brightness that is difficult to image in a three-dimensional object such as solder A, resulting in a lack of captured images and imaging of the correct shape of the solder. An unusable case occurred.
- the slit illumination minor axis direction can irradiate all the front and rear with respect to the scanning direction by scanning the line illumination that is a facing pair.
- the long axis direction is irradiated with light from a light source having a width shorter than the irradiation width. Therefore, a spread angle is generated in the irradiated light, and the three-dimensional object such as solder A has a long axis direction of slit illumination.
- this phenomenon has a different aspect ratio such as a rectangle or an ellipse, and is remarkable in a solid object such as a solder having a straight line or a long side close to a straight line, and the area detected by the substrate angle of the solder substrate is large. It may be different.
- the detected area differs between the substrate angle rotation of 0 ° in FIG. 18A and the substrate angle rotation of 90 ° in FIG. 18B.
- the central axis a1 in the longitudinal direction of the irradiation light L in FIG. 18A and the central axis a2 in the short direction such as a rectangle or ellipse of the solder A are parallel, the irradiation light L in FIG.
- the place where the brightness falls becomes very long. is there.
- the illustrated point portion b2 is a point.
- the time required for data transfer from the imaging camera to the data processing device in the inspection tact is determined by the number of pixels (data transfer amount) of the light receiving element 70 of the camera 50. That is, as shown in FIG. 19, the arrangement of the imaging area of the imaging device 70 of the camera 50 that has been used for simultaneous 2D and 3D imaging so far is red (Red), green (Green), For lighting of the three primary colors (RGB) of blue (Blue), each line (total 3 lines) 71R, 71G, 71B, 3D inspection, 40 lines (total 80 lines) 72, 73 for back and front Yes.
- an image can be captured in one line to capture an image, but in the imaging area for 3D inspection, the imaging area irradiated to the imaging area for height measurement by the light cutting method Since the data of the displacement amount in the continuous short axis direction of the line illumination light crossing the long axis direction is required, the width of 40 lines is required. As a result, the data transfer amount is significantly increased compared to the imaging area for 2D inspection.
- the present invention has been made in view of the above-described problems, and an object of the present invention is to provide a printed solder inspection apparatus capable of eliminating a lack of a captured image of solder.
- Another object is to provide a printed solder inspection apparatus capable of reducing the data transfer amount of captured images.
- the printed solder inspection apparatus of the present invention is a printed solder inspection apparatus that inspects the solder printed on the substrate by illuminating and imaging the substrate, the image sensor being arranged with respect to the perpendicular in the scanning direction.
- the angle formed is tilted so that the angle formed is greater than 0 degrees and less than 90 degrees, and irradiation is performed so that the longitudinal direction of the imaging region and the longitudinal direction of the slit illumination are parallel to each other.
- the rotation angle of the solder such as a non-existing rectangle or ellipse is set.
- the brightness of the first imaging region that is inclined with respect to the center in the direction orthogonal to the operation direction of the image sensor using two sets of the imaging region and slit illumination group of the optical system for simultaneous 2D / 3D imaging.
- the acquired image data is added in one scan It is characterized in that imaging data is obtained by substantially all-round irradiation of the solder.
- the lighting can always be turned on and the continuous line scanning method enables easy diversion to tablet inspection.
- the slit illumination is tilted outward with respect to the optical axis of the imaging lens.
- the 3D inspection unit is characterized by adopting height measurement by phase shift method.
- the optical system for simultaneous imaging of 2D / 3D, one of them is illuminated with red to infrared long wavelength light and the other is illuminated with ultraviolet to blue short wavelength light,
- the location of the film or layer formed on the substrate is specified in advance in the 2D image, the height of the lower layer of the film or layer is measured with one illumination, and the film or layer with the other illumination is measured using the height as a reference for the height. It is characterized by measuring the height of the upper surface of the layer and measuring the thickness of the film or layer.
- FIG. 1 shows the effect
- 2nd figure which shows the effect
- 3rd figure which shows the effect
- 1st figure which shows the effect
- 2nd figure which shows the effect
- 2nd figure which shows the effect
- another slit illumination It is a figure which shows the effect
- Method 1 As shown in FIG. 1, the image sensor 70 is tilted so that the angle ⁇ formed with respect to the perpendicular in the scanning direction is “greater than 0 degree and less than 90 degrees”. Even if the solder is rotated about the optical axis of the imaging system, it can be rotated by setting the angle ⁇ at that time to the rotation angle of a solder such as a rectangle or an ellipse with a low or no existence rate. A captured image equivalent to that before the acquisition can be obtained. As shown in FIG. 2, Method 1 reduces the places where the brightness of imaging in the major axis direction falls by irradiating slit illuminations L1 and L2 in two major axis directions. As a result, a highly accurate inspection result can be obtained, and even if the solder is rotated about the optical axis of the imaging system, a captured image equivalent to that before the rotation can be obtained.
- Method 1 is particularly effective for a three-dimensional object such as a solder having a different aspect ratio, such as a rectangle or an ellipse, and having a straight line or a long side close to a straight line.
- a three-dimensional object such as a solder having a different aspect ratio, such as a rectangle or an ellipse, and having a straight line or a long side close to a straight line.
- the rotation angle between the illumination and the image sensor in FIG. 2 is 45 degrees.
- a problem will occur. If there are many types of solder A, 30 degrees rotated, 45 degrees rotated, and no rotation, if the rotation angle ⁇ of the image sensor 70 in FIG. Since it is not parallel to the central axis in the short direction, the phenomenon that the place where the brightness falls becomes very long does not occur.
- the illumination is irradiated so that the longitudinal direction of the imaging region of the image sensor 70 and the longitudinal direction of the illumination are parallel, when the rotation angle ⁇ of the image sensor 70 in FIG. It is not parallel to the short axis of the solder A.
- One side of the 2D illumination is irradiated so that the major axis direction of the illumination light L1 is parallel to the major axis direction of the first type of the 2D imaging regions of the hatching portions 71R, 71G, and 71B in FIG.
- the opposite side of the 2D illumination is irradiated so that the major axis direction of the illumination light L2 is parallel to the major axis direction of the second type of the 2D imaging region of the hatching portions 71R, 71G, 71B.
- the first and second formulas in the 2D imaging area of the hatched portion are in a parallel relationship. Therefore, the first and second types of the imaging region are in parallel with each other on the opposite side of the 2D illumination light.
- a pair of illuminations facing each other is a set of illuminations.
- the irradiation image from the rear (in this case diagonally backward) on the one side and the irradiation image from the front (in this case diagonally forward) on the other side Can be acquired.
- a portion parallel to the longitudinal central axis of the slit irradiation light is a place where brightness falls.
- the slit illumination light is light La in the longitudinal central axis direction (does not intersect (do not irradiate) with a plane parallel to the lateral central axis a2 to be irradiated) and the long axis.
- the light La in the longitudinal center axis direction and the light Lc spreading in the minor axis direction of the slit illumination light on the opposite side intersect (irradiate) the right side surface of the solder A. Also, by scanning, one side can illuminate the left half from the center of the solder A, and the other side can irradiate the right side from the center of the solder A. It becomes.
- Method 2 is effective for solid objects such as solder of any shape regardless of the shape.
- two sets of slit illumination are used.
- the image is irradiated and imaged with the second type of slit illumination L1, L2 that is inclined at an angle at which the brightness falls at a place different from the place where the brightness of the first type of slit illumination L1, L2 falls.
- L1, L2 the second type of slit illumination
- L1 and L2 By summing up the obtained image data, it is possible to capture a small brightness drop-off place c3 generated in each of the slit illuminations L1 and L2, with a stable brightness, and a color information disappearance place d1 due to saturation.
- D2 can be interpolated to obtain a captured image that has been irradiated substantially all around (see FIG. 8).
- the FPG program of the image pickup camera is changed, and the 2D / 3D as shown in FIG. It is necessary to create two sets of imaging areas 71R, 71G, 71B, 72, and 73 for simultaneous imaging in an inclined state.
- two types of slit illumination used for simultaneous 2D / 3D imaging are used, and the center in the major axis direction of the imaging regions 71R, 71G, 71B, 72, 73 and the center in the major axis direction of the slit illumination light are parallel.
- the slit illumination light is applied to the imaging region.
- the inclinations of the imaging areas 71R, 71G, 71B, 72, and 73 of the first set are such that the angle ⁇ formed with respect to the Y-axis center of the image sensor 70 is “greater than 0 degree and less than 90 degrees”.
- the second imaging areas 71R, 71G, 71B, 72, 73 are provided so that the blind spot of the image becomes an angle at which the imaging can be performed.
- the 2D imaging regions 71R, 71G, and 71B are respectively in the hatched portions. There should be only one set.
- FIG. 9 As described above, the two image pickup devices 70 are mounted on one camera 50, and the arrangement of the image pickup areas 71R, 71G, 71B, 72, 73 of the method 2 can be realized.
- Method 3 is effective for solid objects such as solder A of all shapes regardless of the shape.
- the method 3 is used, and the spread angle of irradiation is a.
- the left side on the side and irradiating the right side on the b side it is possible to eliminate the irradiation dead angle in the major axis direction (see FIG. 11).
- the slit illumination lights L1 and L2 are arranged so that the longitudinal center axis on the a side is at the left end of the imaging region and the longitudinal center axis on the b side is at the right end of the imaging region. That is, the effective line length of each slit illumination light L1, L2 needs to be at least twice as long as the imaging region. Further, the reflection intensity of the side surface of the solder A can be increased by shifting the optical axis and tilting the slit illuminations on both sides a and b with respect to the imaging lens optical axis LA as shown in FIG. . In addition, it is possible to prevent erroneous determination of light and dark images due to uneven illumination by adopting image recognition that aligns the irradiation angles in RGB, faithfully reproduces the color of solder A, and uses both hue data and light and dark.
- Phase shift method By changing the method of measuring the height of 3D inspection to the phase shift method (see Japanese Patent Application Laid-Open No. 2003-121115), which requires four lines for the imaging area, the amount of data transfer compared to the current method Is significantly reduced (see FIG. 13).
- the FPG program of the imaging camera is changed, and 4 lines each for 3D-1 and 3D-2
- the imaging areas 72 and 73 can be created. Further, it is necessary to replace the slit illuminations 10a and 10b in FIG. 15 with phase slit illumination.
- the irradiation position of the phase slit illumination irradiates different imaging areas, so that irradiation from two opposite directions can be performed, so that 3D inspection of the entire circumference can be performed by one imaging operation.
- the image data for 2D and 3D can be acquired by the above, and an operation for acquiring an image separately is not required for the processing for specifying the location of the resist layer R.
- the height of the lower layer R1 of the resist layer R is measured with the slit illumination 11a, the height is a reference for the height (height 0), and the height of the upper surface R2 of the resist layer R is measured with the slit illumination 11b.
- the thickness Rh of R can be measured (see FIG. 14).
- the position to be irradiated when the height of the imaging object of red to infrared long wavelength light is 0 is determined.
- the optical system is assembled on the basis of a position where the imaging lens is focused on a plane parallel to the imaging surface (hereinafter referred to as an assembly reference surface).
- a flat plate such as a ceramic plate is prepared, and the upper surface thereof is installed so that its height is 0 with respect to the assembly reference surface.
- the line 11a is installed so as to irradiate the 212th pixel of the captured image.
- the 812st pixel may be irradiated. Accordingly, when the height of the imaging target changes, for example, the irradiation position of 11a moves to the 204th pixel, and the irradiation position of 11b moves to the 820th pixel.
- the height can be measured from the amount of movement of the irradiation position based on the irradiation angle and the distance per pixel.
- the red to infrared light source and the ultraviolet to blue light source are light sources that irradiate the respective wavelengths, but the light of the light source having a plurality of wavelengths such as white is used to filter the red to infrared or ultraviolet to ultraviolet light. Irradiate only blue light.
- a method of transmitting and receiving only red to infrared or ultraviolet to blue wavelengths using a filter on the imaging camera side is also possible.
- the position to be irradiated when the height of the imaging target of ultraviolet to blue short wavelength light is 0 is determined.
- the height is calculated from the position shift amount of the long wavelength light from red to infrared at the position of the resist layer determined earlier. For example, 40 ⁇ m. 4).
- the height is calculated from the position shift amount of the short wavelength light of ultraviolet to blue at the position of the resist layer determined earlier. For example, it is 100 ⁇ m. 5. Since the height of 40 ⁇ m is measured for red to infrared long-wavelength light, this substrate is raised by 40 ⁇ m at this point. Therefore, if the height of ultraviolet to blue short-wavelength light is subtracted from 100 ⁇ m to 40 ⁇ m, The thickness of the resist is 60 ⁇ m.
- the above-described technique for measuring the height of a film or layer formed on a substrate includes not only a resist layer applied to an electronic substrate, but also a film made of a material that does not transmit ultraviolet to blue and transmits red to infrared. Or if it is a layer, the thickness of the film
- a transparent or semi-transparent coating layer may be applied to the finished substrate after reflow for the purpose of reinforcing the rigidity and protecting the substrate such as moisture.
- the measured thickness is the combined thickness of the resist layer and the coating layer. Therefore, if it is necessary to manage the thickness of only the coating layer, the previous process (for example, printing with this technology installed) is required. It is necessary to acquire the thickness information of the resist layer of the solder inspection apparatus), and to obtain a value obtained by subtracting the thickness of the resist layer from the measured thickness. However, since the part where the management of the coating state of the coating layer after reflow is important is the opening where the resist is cut off, such as the rib part of the chip, it is only necessary to measure the thickness of the coating layer at that part. Information on the thickness of the resist layer in the previous process is not necessary. As described above, the technique for measuring the height of a film or layer formed on a substrate can measure the thickness of a film or layer made of a material that does not transmit ultraviolet to blue but transmits red to infrared. I can do it.
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Abstract
Description
しかしながら3D測定は、測定対象の高さを計測する技術であって、その高さを構成する材料の違いを識別するものではなく、よって、クリーム半田がパッド上に薄く広がる「にじみ」と呼ばれる印刷不良の検出が困難であるという限界を抱えている。一方、2D測定は、照明色と照明の照射方向の最適化により、クリーム半田とパッドあるいは基板面とを輝度の違い、色の違い、表面状態の違いで識別するという手法であり、パッド上に薄く広がったクリーム半田を抽出できるという3D測定に対する補完性を持っている。
図1に示すように、撮像素子70を走査方向の垂線に対してなす角θが「0度を超え90度未満」となるように傾ける。そのときの角度θを、存在率の低いもしくは存在しない、長方形や楕円形等の半田の回転角度に設定することにより、実用上、半田を撮像系の光軸を軸に回転しても、回転する前と同等な撮像画像を得ることができる。 手法1は、図2に示すように、スリット照明L1,L2の長軸方向の照射を2方向にすることにより、長軸方向の撮像の明るさが落ち込む場所を減少させる。その結果、高精度な検査結果を得ることができ、また、半田を撮像系の光軸を軸に回転しても、回転する前と同等な撮像画像を得ることができる。
具体的には、図18に示す半田Aが、仮に45度回転したものが多数を占めた場合、図2の照明と撮像素子の回転角度(なす角)を45度にしてしまうと図18の問題が発生してしまう。半田Aとして、仮に30度回転したもの、45度回転したもの、回転無しの3種類が多く存在している場合は、図1の撮像素子70の回転角度θを20度にすれば、半田Aの短手方向中心軸と平行にはならないので、明るさが落ち込む場所が非常に長くなる現象は起きなくなる。
3D撮像については、撮像領域2箇所(1式)と照明1式なので、もとより一方側で後方(この場合斜め後方)からの照射画像、反対側で前方(この場合斜め前方)からの照射画像を取得することができる。
スリット照射光の長手方向中心軸と平行となる部分が明るさの落ち込む場所となる。その理由は、図4のように、スリット照明光は、長手方向中心軸方向の光La(照射対象の短手方向中心軸a2と平行な面と交わることはない(照射しない))と長軸方向の外側に向かう光Lb(照射対象の短手方向中心軸a2と平行な面と交わることはない(照射しない))と短軸方向に広がる光Lc(照射対象の短手方向中心軸a2と平行な面と交わることはない(照射しない))の成分しか存在しない。したがって、走査させてもスリット照射光の長手方向中心軸と平行になる半田Aの短手方向中心軸と平行な面に向かう向きの光が存在しないため、明るさが落ち込む場所となる。
図6のように、短軸方向に広がる光Lcは、長手方向全体に存在するため、長手方向中心軸から離れた位置に半田Aがある場合でも、長手側中心軸と同様の効果が得られる。
手法2は、形状に関係なく、全ての形状の半田などの立体物に有効である。
手法2では、スリット照明を2式使用する。1式目のスリット照明L1,L2の明るさの落ち込むところと異なる場所で、明るさが落ち込むような角度で傾斜された2式目のスリット照明L1,L2にて照射し撮像する。それらの得られた画像データを合算することにより、それぞれのスリット照明L1,L2で発生する、小さな明るさの落ち込む場所c3を更に、安定した明るさで撮像でき、サチレーションによる色情報の消失場所d1,d2を補間しあうことにより、実質全周照射された撮像画像を得ることができる(図8参照)。
なお、図8で説明したように、サチレーションによる色情報の消失場所d1,d2を補間しあうことができるので、図9に示すように、それぞれのハッチング部において2D撮像領域71R,71G,71Bは1式あればよい。
なお、図9のような撮像素子70の向きで、斜めの撮像領域71R,71G,71B,72,73を確保することは、撮像素子70の設計が必要となるため、代替案として図10のように2個の撮像素子70を1つのカメラ50に実装し、手法2の撮像領域71R,71G,71B,72,73の配置を実現できる。
手法3は、形状に関係なく、全ての形状の半田Aなどの立体物に有効である。
手法3とし、向き合う1式のスリット照明L1,L2の長手方向中心軸をa側とb側で、撮像レンズ光軸LAを軸とし線対称となるようにずらすことにより、照射の広がり角でa側は左サイドを照射し、b側は右サイドを照射するようにすることにより、長軸方向の照射死角を無くすことができる(図11参照)。
また、この光軸をずらすと共に、図12のようにa,b側両方のスリット照明を撮像レンズ光軸LAに対し、外側に傾けることにより、半田Aの側面の反射強度を上あげることができる。
また、RGBで照射角度を揃え、半田Aの色を忠実に再現し、色相データと明暗を共に使用する画像認識を採用することにより、照度ムラによる明暗の画像の誤判定を防ぐことができる。
3D検査の高さ測定の手法を撮像領域が4ラインですむ位相シフト法(特開2003-121115号公報参照)に変更することにより、現行の方式に比べ、データ転送量を大幅に削減する(図13参照)。上記手法を実現するに当たり必要となる、現行の2D・3D同時撮像半田印刷検査装置の改造内容として、撮像カメラのFPGプログラム等を変更し、3D-1,3D-2用に、各4ラインの撮像領域72,73を作れるようにする。また、図15のスリット照明10a,10bを位相スリット照明へ置き換えることが必要である。上記手法により、位相スリット照明の照射位置が、それぞれ別の撮像領域を照射するため、向き合った2方向からの照射が行えるため、一回の撮像動作にて、全周の3D検査が行えるようになる。
3D計測用照明にて、「赤色~赤外の長波長光はレジストを透過する」、「紫外~青色の短波長光はレジストを透過しない」という特性が記載されている(特許第3878165号公報参照)。この特性から、図15のスリット照明11aを赤色~赤外の長波長光、スリット照明11bを紫外~青色の短波長光の照明にすることにより、2D画像であらかじめレジスト層Rの場所を特定しておく。撮像自体は3D画像取得と同時も可能である。すなわち、同一撮像素子にて2D用、3D用の撮像領域を設けており、走査させながら画像データを2D用と3D用が1対1となるように取得しているため、1回の走査動作にて2D用、3D用の画像データの取得が可能であり、レジスト層Rの場所を特定する処理の専用に、別途画像を取得する動作は不要である。スリット照明11aでレジスト層Rの下層R1の高さを計測し、その高さを高さの基準(高さ0)、スリット照明11bでレジスト層Rの上面R2の高さを計測し、レジスト層Rの厚さRhを測定することができる(図14参照)。
1.赤色~赤外の長波長光の撮像対象の高さが0のとき照射されるポジションを決めておく。ポジションの決定方式について、光学系は、撮像面に平行な平面(以後組立基準面という)で撮像レンズの焦点が合うところを基準として組み立てる。セラミック板などのようなフラットな板を用意し、その上面が組立基準面に対し高さが0となるように設置する。その状態でフラットな板を照射したときに、たとえば、11aのラインが、撮像画像の212画素目を照射するように設置する。また、11bにおいては812画素目を照射するように設置する。それにより、撮像対象の高さが変わると、たとえば11aの照射位置が204画素目、11bの照射位置が820画素目に移動する。照射角度と1画素あたりの距離をもとに照射ポジションの移動量から高さが測定できる。赤色~赤外の光源と紫外~青色の光源は、それぞれの波長を照射する光源であるが、白色のような複数波長からなる光源の光を使用しフィルタを用いて赤色~赤外もしくは紫外~青色のみを透過させ照射をする。もしくは、撮像カメラ側でフィルタを用いて赤色~赤外もしくは紫外~青色の波長のみを透過させ受光させる方法も可能である。
3.先に割り出したレジスト層の位置にて赤色~赤外の長波長光のポジション移動量から高さを算出する。たとえば、40μmである。
4.先に割り出したレジスト層の位置にて紫外~青色の短波長光のポジション移動量から高さを算出する。たとえば、100μmである。
5.赤色~赤外の長波長光において、40μmの高さが測定されていることから、この基板はこの地点では40μm盛り上がっているため、紫外~青色の短波長光の高さ100μmから40μmを引くとレジストの厚さ60μmがわかる。
例として、リフロー後の完成基板に、剛性強化と防湿等の基板保護を目的とした透明または半透明なコーティング層が施される場合がある。本技術が搭載された装置を電子基板生産工程のコーティング工程の下流に設置することにより、上記コーティング層の2次元的な有無、塗りムラの他、厚さ測定を基にした検査のため、厚みのムラや、コーティング層のゴミ埋もれ、厚みの管理が可能である。
この例の場合、測定される厚さはレジスト層とコーティング層の合算された厚みとなるため、コーティング層のみの厚さの管理が必要な場合は、前工程(たとえば本技術が搭載された印刷半田検査装置)のレジスト層の厚さ情報を取得し、測定された厚さからレジスト層の厚さを引いた値をコーティング層の厚さとすることが必要である。
但し、リフロー後のコーティング層の塗布状況の管理が重要となる部分は、チップのリブの部分等のレジストが切り取られた開口部になるため、その部分のみのコーティング層の厚みの測定であれば、前工程のレジスト層の厚さの情報は必要なくなる。
以上のように、基板に形成された膜または層の高さの測定技術は、紫外~青色を透明せず、赤色~赤外を透過する材質からなる膜または層の厚さを測定することが出来る。
Claims (7)
- 基板に対し照明し撮像して前記基板に印刷された半田を検査する印刷半田検査装置であって、
撮像素子を走査方向の垂線に対してなす角が0度を超え90度未満となるように傾け、その撮像領域の長手方向とスリット照明の長手方向が平行となるように照射し走査させ、そのときの角度を存在率の低いもしくは存在しない長方形や楕円形等の前記半田の回転角度に設定することを特徴とする印刷半田検査装置。 - 2次元・3次元同時撮像用光学系の撮像領域とスリット照明群を2式使用し、撮像素子の操作方向と直交する方向の中心に対し、傾斜をつけた1式目の撮像領域の明るさが落ち込む場所やサチレーションにより色情報等を消失する部分を撮像できる角度に傾斜させた2式目の撮像領域で撮像して走査させ、取得した画像データを合算することにより、1回の走査にて前記半田の実質全周照射での撮像データを得ることを特徴とする印刷半田検査装置。
- 2次元・3次元同時撮像用光学系の向き合った対のスリット照明で前記半田の走査方向の前後を照射し、前記2次元・3次元同時撮像用光学系の向き合った対のスリット照明の長手方向中心軸を撮像レンズの走査方向の光軸を軸に線対称となるようにずらし、広がりを持つスリット照明光の長軸方向の光軸から右側の照射成分で、前記半田の中心から左側を照射し、長軸方向の光軸から左側の照射成分で、前記半田の中心から右側を照射することにより、走査させ撮像し、取得した画像データを合算することにより、2つのスリット照明で、前記半田の実質全周照射での撮像データを得ることを特徴とする印刷半田検査装置。
- スリット照明を撮像レンズ光軸に対し外側に傾けることを特徴とする請求項3に記載の印刷半田検査装置。
- 3次元検査部に、位相シフト法による高さ測定を採用することを特徴とする請求項1~4の何れか一項に記載の印刷半田検査装置。
- 異なった2箇所の撮像領域を、向き合った2方向からの位相スリット照明で照射することにより、1回の撮像動作にて、全周の3D検査を行い、同時にRGB画像を取得し、それらを合算して実質カラー画像を取得することを特徴とする請求項1~4の何れか一項に記載の印刷半田検査装置。
- 2次元・3次元同時撮像用光学系の撮像領域とスリット照明群を2式使用し、一方を赤色~赤外の長波長光、他方を紫外~青色の短波長光の照明にすることにより、2D画像であらかじめ、基板に形成された膜または層の場所を特定し、一方の照明で前記膜または層の下層の高さを計測し、その高さを高さの基準として他方の照明で前記膜または層の上面の高さを計測し、前記膜または層の厚さを測定することを特徴とする請求項1~4の何れか一項に記載の印刷半田検査装置。
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Also Published As
Publication number | Publication date |
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KR101877592B1 (ko) | 2018-07-11 |
CN103384812A (zh) | 2013-11-06 |
KR20140012984A (ko) | 2014-02-04 |
CN103384812B (zh) | 2017-07-21 |
JP5945386B2 (ja) | 2016-07-05 |
JP2012167967A (ja) | 2012-09-06 |
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