WO2012081864A3 - 반도체 검사 장치 - Google Patents
반도체 검사 장치 Download PDFInfo
- Publication number
- WO2012081864A3 WO2012081864A3 PCT/KR2011/009524 KR2011009524W WO2012081864A3 WO 2012081864 A3 WO2012081864 A3 WO 2012081864A3 KR 2011009524 W KR2011009524 W KR 2011009524W WO 2012081864 A3 WO2012081864 A3 WO 2012081864A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tested
- components
- circuit board
- printed circuit
- signal
- Prior art date
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15172—Fan-out arrangement of the internal vias
- H01L2924/15174—Fan-out arrangement of the internal vias in different layers of the multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
최근접으로 배치되어야 할 부품들이 검사대상의 단자들과 가장 가깝게 배치될 수 있도록 한 반도체 검사 장치를 제시한다. 제시된 장치는 인쇄회로기판 및 인쇄회로기판의 상면에 장착되어 검사대상과 인쇄회로기판과의 신호연결 경로를 형성하는 테스트 소켓을 포함하는 반도체 검사 장치에서, 인쇄회로기판의 상면에 칩 형태의 캐패시터가 장착되고, 테스트 소켓에는 캐패시터와의 접촉을 회피하는 간섭회피 공간부가 형성되되 간섭회피 공간부는 캐패시터의 장착위치에 대향되는 위치에 형성되고, 캐패시터와 테스트 소켓은 간섭회피 공간부에 의해 서로 비접촉된다. 종래의 방식과 다르게 DUT PCB상측에 부품을 장착하되 그 장착된 부품과 기구적인 간섭이 발생하지 않도록 테스트 소켓의 기구설계 구조를 변경함으로써, DUT PCB 상측에 최근접 배치가 되어야 할 부품의 장착이 가능하게 하여 반도체 테스트 환경을 혁신적으로 개선할 수 있게 된다. 한편, 검사대상과 DUT PCB 사이에 중간 PCB를 구현함으로써 검사대상을 검사하기 위한 신호를 최적화하기 위해 사용되는 신호개선용 부품들의 장착공간이 늘어나는 효과가 있다.또한, 신호를 전달하는 선로 사이에 구성되는 신호개선용 부품이 검사대상의 단자와 최근접 배치가 용이한 효과를 갖는다.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/994,074 US20130257470A1 (en) | 2010-12-16 | 2011-12-12 | Semiconductor testing apparatus |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20-2010-0013001 | 2010-12-16 | ||
KR20100013001 | 2010-12-16 | ||
KR10-2011-0109192 | 2011-10-25 | ||
KR1020110109192A KR101131105B1 (ko) | 2010-12-16 | 2011-10-25 | 반도체 검사 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012081864A2 WO2012081864A2 (ko) | 2012-06-21 |
WO2012081864A3 true WO2012081864A3 (ko) | 2012-10-18 |
Family
ID=46142910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/009524 WO2012081864A2 (ko) | 2010-12-16 | 2011-12-12 | 반도체 검사 장치 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20130257470A1 (ko) |
KR (1) | KR101131105B1 (ko) |
TW (1) | TWI448707B (ko) |
WO (1) | WO2012081864A2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10446335B2 (en) * | 2013-08-08 | 2019-10-15 | Zhuhai Access Semiconductor Co., Ltd. | Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor |
TWI579951B (zh) * | 2015-11-17 | 2017-04-21 | 京元電子股份有限公司 | 半導體元件翻面裝置及其測試設備 |
CN107729581B (zh) * | 2016-08-10 | 2021-03-09 | 苏州韬盛电子科技有限公司 | 一种基于fea仿真设计芯片测试插座结构的方法及其应用 |
US10128592B1 (en) * | 2017-05-12 | 2018-11-13 | Northrop Grumman Systems Corporation | Integrated circuit interface and method of making the same |
KR101975836B1 (ko) * | 2017-08-11 | 2019-08-28 | 리노공업주식회사 | 검사장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070009091A (ko) * | 2005-07-15 | 2007-01-18 | 삼성전자주식회사 | 반도체 칩의 테스트 소켓 장치 |
KR20090126755A (ko) * | 2008-06-05 | 2009-12-09 | 이용준 | 반도체 소자 테스트용 콘택터 및 그 제조방법 |
JP2010043874A (ja) * | 2008-08-08 | 2010-02-25 | Yokowo Co Ltd | コネクト基板及びこれを用いた電子部品検査装置 |
KR20110090298A (ko) * | 2010-02-03 | 2011-08-10 | (주)티에스이 | 피치변환가능 테스트 소켓 |
Family Cites Families (11)
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JPS616846A (ja) * | 1984-06-21 | 1986-01-13 | Nec Corp | コンデンサ付プラグインパツケ−ジ |
JPH02216467A (ja) * | 1989-02-17 | 1990-08-29 | Tokyo Electron Ltd | プローバ |
US5502397A (en) * | 1992-11-12 | 1996-03-26 | Advanced Micro Devices, Inc. | Integrated circuit testing apparatus and method |
US5500605A (en) * | 1993-09-17 | 1996-03-19 | At&T Corp. | Electrical test apparatus and method |
US5869961A (en) * | 1995-07-31 | 1999-02-09 | Spinner; Howard D. | Smart IC-test receptacle having holes adapted for mounting capacitors arranged adjacent to pin positions |
US5859538A (en) * | 1996-01-31 | 1999-01-12 | Hewlett-Packard Company | Method and apparatus for connecting a ball grid array device to a test instrument to facilitate the monitoring of individual signals or the interruption of individual signals or both |
US6819127B1 (en) * | 1999-02-19 | 2004-11-16 | Micron Technology, Inc. | Method for testing semiconductor components using interposer |
US6621012B2 (en) * | 2001-02-01 | 2003-09-16 | International Business Machines Corporation | Insertion of electrical component within a via of a printed circuit board |
TW586205B (en) * | 2001-06-26 | 2004-05-01 | Intel Corp | Electronic assembly with vertically connected capacitors and manufacturing method |
TWI227099B (en) * | 2003-03-31 | 2005-01-21 | Siliconware Precision Industries Co Ltd | Chip carrier for testing electric performance of passive components and method for testing same |
JP4863130B2 (ja) * | 2009-05-22 | 2012-01-25 | 山一電機株式会社 | 基板接続用コネクタ、それを備える半導体装置用ソケット、ケーブル用コネクタ、および、ボードツーボードコネクタ |
-
2011
- 2011-10-25 KR KR1020110109192A patent/KR101131105B1/ko active IP Right Grant
- 2011-12-12 US US13/994,074 patent/US20130257470A1/en not_active Abandoned
- 2011-12-12 WO PCT/KR2011/009524 patent/WO2012081864A2/ko active Application Filing
- 2011-12-14 TW TW100146149A patent/TWI448707B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20070009091A (ko) * | 2005-07-15 | 2007-01-18 | 삼성전자주식회사 | 반도체 칩의 테스트 소켓 장치 |
KR20090126755A (ko) * | 2008-06-05 | 2009-12-09 | 이용준 | 반도체 소자 테스트용 콘택터 및 그 제조방법 |
JP2010043874A (ja) * | 2008-08-08 | 2010-02-25 | Yokowo Co Ltd | コネクト基板及びこれを用いた電子部品検査装置 |
KR20110090298A (ko) * | 2010-02-03 | 2011-08-10 | (주)티에스이 | 피치변환가능 테스트 소켓 |
Also Published As
Publication number | Publication date |
---|---|
TWI448707B (zh) | 2014-08-11 |
TW201226944A (en) | 2012-07-01 |
KR101131105B1 (ko) | 2012-04-03 |
WO2012081864A2 (ko) | 2012-06-21 |
US20130257470A1 (en) | 2013-10-03 |
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