WO2012063405A1 - Retaining jig, handling jig, set of retaining jigs, and adhered material retaining device - Google Patents

Retaining jig, handling jig, set of retaining jigs, and adhered material retaining device Download PDF

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Publication number
WO2012063405A1
WO2012063405A1 PCT/JP2011/005727 JP2011005727W WO2012063405A1 WO 2012063405 A1 WO2012063405 A1 WO 2012063405A1 JP 2011005727 W JP2011005727 W JP 2011005727W WO 2012063405 A1 WO2012063405 A1 WO 2012063405A1
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WIPO (PCT)
Prior art keywords
jig
holding
elastic member
holding jig
adhered
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Application number
PCT/JP2011/005727
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French (fr)
Japanese (ja)
Inventor
俊明 初見
浩一 木暮
Original Assignee
信越ポリマー株式会社
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Application filed by 信越ポリマー株式会社 filed Critical 信越ポリマー株式会社
Priority to JP2012542792A priority Critical patent/JP5936230B2/en
Priority to CN201180050918.1A priority patent/CN103180923B/en
Priority to KR1020137013609A priority patent/KR101853806B1/en
Publication of WO2012063405A1 publication Critical patent/WO2012063405A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/04—Mountings specially adapted for mounting on a chassis

Definitions

  • the present invention relates to a holding jig, a handling jig, a set of holding jigs, and an adherend holding device, and more specifically, although the adherend can be adhesively held as desired, the adhesive is held.
  • the present invention relates to a holding jig, a handling jig, a set of holding jigs, and a to-be-adhered object holding device capable of easily removing almost all of the objects to be adhered.
  • the holding jig described in Patent Document 1 is characterized in that “at least the surface portion is formed of a rubber elastic material having adhesiveness, and the adhesive force can hold a small component on the elastic material surface. (See claim 1 of Patent Document 1).
  • the small part is subjected to various manufacturing processes in a state in which the small part is adhesively held by the holding jig as an adherend. Then, the small parts and the like manufactured in a state where they are adhesively held by the holding jig are removed from the holding jig.
  • Patent Document 2 describes that “a plurality of electronic components are held by adhesion in an adhesive layer of an electronic component holder having a support and an adhesive layer formed on one surface of the support.
  • the method of handling an electronic component comprising the step of releasing the electronic component from the adhesive layer by the above-mentioned method "(see claim 4 etc.).
  • Patent Document 2 As shown in FIG. 3 of Patent Document 2, the method described in Patent Document 2 is “by denting the adhesive layer with the tip of the blade and moving the blade relative to the surface of the adhesive layer in that state”. Since the electronic component 2 is tilted and removed, the electronic component will fall down unless the dimensions of the electronic component, the recessed state of the adhesive layer, the adhesive force of the adhesive layer, the moving speed of the blade, etc. are set appropriately. May re-adhere to the surface of the adhesive layer and cannot be removed as desired from the adhesive layer.
  • Patent Document 3 discloses a step of preparing a holding means including an adhesive material layer and a non-adhesive portion or a low adhesive portion having a lower adhesive strength than the adhesive material layer; A step of adhering one end surface of the electronic component to the material layer to hold the electronic component, and a scraping means along the surface of the adhesive material layer, and the non-adhesive portion or the low adhesive portion is terminated in the moving direction. And a method of handling the electronic component, which includes a step of scraping the electronic component from the adhesive material layer ”(refer to claim 8). Even if the small component scraping member is slid on the surface of the elastic material as in the method described in Patent Document 3, the adherend falls down and is again adhered to the surface of the adhesive layer. Sometimes it cannot be removed.
  • the present invention provides a holding jig, a handling jig, and a set of holdings capable of easily detaching almost all of the objects to be adhered, which can be adhered and retained as desired. It is an object to provide a jig and an adherend holding device.
  • the inventors of the present application highly advanced the adhesive surface that adheres and holds the adherend in a holding jig that presses and adheres the adherend to the elastic member and presses the adherend to the side to release it. If the surface of the adhesive surface is roughened to a certain degree contrary to the conventional technical common sense that the object to be adhered cannot be held in the desired manner unless it is flattened, it will be strong if it is not pressed even if it is brought into contact with the adhesive surface. In spite of the fact that the object to be adhered is not held in contact with the adhesive surface, pressing the object to the adhesive surface produces an adhesive force almost equal to that of a flat adhesive surface, allowing the object to be adhered to be adhesively retained, and maintaining the adhesion as desired. The present invention was completed by newly discovering that almost all of them could be easily detached by simply pressing the adherend to the side.
  • the inventors of the present invention can achieve a high level of both high adhesive force when pressing the adherend and the ability to detach the adherend at a high level by roughening the surface of the sticky surface.
  • the present invention was completed by newly discovering that it exhibits high releasability that cannot be obtained by simply adjusting the adhesive force.
  • a holding jig according to the present invention which is a first means for solving the above-described problems, is provided on a jig body and the surface of the jig body, and has a maximum roughness Ry (JIS B 0601-1994) of 1. And an elastic member having a thickness of 0.0 to 6.0 ⁇ m.
  • the elastic member has an average unevenness interval Sm (JIS B0601-1994) of 5.0 to 15.0 ⁇ m.
  • the handling jig according to the present invention which is a second means for solving the above-mentioned problems, moves relative to the holding jig according to the present invention and moves along the surface of the elastic member in the holding jig. And a detaching tool for detaching the object to be adhered.
  • a set of holding jigs according to the present invention which is a third means for solving the above problems, includes a first jig body and a first elastic member provided on the surface of the first jig body.
  • a first holding jig Comprising a first holding jig, a second holding jig comprising a second jig body and a second elastic member provided on a surface of the second jig body, the first holding jig, At least one of the second holding jigs is a holding jig according to the present invention, and the second elastic member has an adhesive force larger than that of the first elastic member.
  • the second holding jig is the holding jig according to the present invention.
  • the adherend holding apparatus according to the present invention which is a fourth means for solving the above-mentioned problems, is characterized by comprising a set of holding jigs according to the present invention.
  • the holding jig includes a jig body and an elastic member provided on the surface of the jig body and having a maximum roughness Ry of 1.0 to 6.0 ⁇ m.
  • the contact surface of the adherend adheres to the surface of the elastic member, and the adherend is adhered to the elastic member.
  • the adherend is pressed from the side, the contact surface of the adherend is The object to be adhered is detached from the elastic member by peeling off from the surface of the elastic member.
  • the handling jig according to the present invention includes the holding jig according to the present invention, and the set of holding jigs according to the present invention includes at least one holding jig according to the present invention.
  • the to-be-adhered article holding device according to the present invention includes a set of holding jigs according to the present invention.
  • a holding jig, a handling jig which can easily remove almost all of the objects to be adhered, which can be easily adhered, even though the object to be adhered can be adhered and held as desired.
  • a set of holding jigs and an object to be adhered holding device can be provided.
  • FIG. 1 is a schematic perspective view showing a holding jig which is an example of a holding jig according to the present invention.
  • FIG. 2 is a schematic front view showing a handling jig as an example of the handling jig according to the present invention.
  • FIG. 3 is a schematic view showing a set of holding jigs as an example of a set of holding jigs according to the present invention.
  • FIG. 4 is a schematic explanatory view showing an adherend holding device which is an example of an adherend holding device according to the present invention.
  • FIG. 1 is a schematic perspective view showing a holding jig which is an example of a holding jig according to the present invention.
  • FIG. 2 is a schematic front view showing a handling jig as an example of the handling jig according to the present invention.
  • FIG. 3 is a schematic view showing a set of holding jigs as an example of a set of holding jigs according
  • FIG. 5 is a schematic explanatory view showing a state in which the chip capacitor main body is suspended and held by the first holding jig in the adherend holding device which is an example of the adherend holding device according to the present invention.
  • FIG. 6 is a schematic explanatory view showing a state in which a chip capacitor body in which an electrode is formed on a first holding jig is suspended and held in an adherend holding apparatus which is an example of an adherend holding apparatus according to the present invention.
  • FIG. 7 is a schematic illustration showing a state in which the chip capacitor body suspended from the first holding jig is pressed against the second holding jig in the adherend holding apparatus which is an example of the adherend holding apparatus according to the present invention.
  • FIG. 8 is a schematic view showing a state in which a chip capacitor formed by coating electrodes on both ends is suspended and held by a second holding jig in an adherend holding device which is an example of an adherend holding device according to the present invention. It is explanatory drawing.
  • the holding jig according to the present invention, the handling jig, the set of holding jigs, and the adherend to be adhered to the adherend holding apparatus can produce the adherend that needs to be adhered and held by them.
  • a member for an object to be adhered include a member for a small instrument, a member for a small machine element, a member for a small electronic component, and the like.
  • the adherend since the manufacture of the adherend includes a transporting process of the adherend, the adherend includes the adherend itself, for example, a small instrument, a small machine element, and a small electronic component.
  • the small electronic component and the small electronic component member include a capacitor chip (also referred to as a chip capacitor), an inductor chip, a resistor chip, an FPC, a finished product such as a wafer, an unfinished product, and the like.
  • a capacitor chip also referred to as a chip capacitor
  • an inductor chip also referred to as a resistor chip
  • an FPC a finished product such as a wafer
  • an unfinished product and the like.
  • a prism or cylinder, a prism or cylinder having ridges at one end, a prism or cylinder having ridges at both ends, and the like can be used.
  • a holding jig according to the present invention includes a jig body and an elastic member having an adhesive surface having a maximum roughness Ry within the above range, and adheres an object to be bonded to the adhesive surface of the elastic member as desired.
  • the adherend to be adhered and held on the elastic member can be easily removed when necessary.
  • the adherend is pressed against the adhesive surface of the elastic member.
  • the adhesive surface of the elastic member pressed by the contact surface of the to-be-adhered object will be elastically deformed, for example, the peak part which has the maximum roughness Ry, and a mountain-and-valley part will be flattened, and it will contact
  • the object to be adhered is pressed from the side so that the object to be adhered is inclined.
  • the elastically deformed peak portion is restored, and the adhesive surface becomes the maximum roughness Ry in the above range, and the contact surface of the adherend is easily peeled from the surface of the elastic member, so that the adherend is detached from the elastic member.
  • the adhesive surface of the elastic member has the maximum roughness Ry in the above range, contrary to the conventional technical common sense that the object to be adhered cannot be adhered and held unless the adhesive surface is made highly flat.
  • the holding jig 1 includes a jig body 2 and an elastic member 3 provided on the surface of the jig body 2 and having an adhesive surface capable of sticking and holding an adherend. I have.
  • the jig body 2 supports an elastic member 3 to be described later, as shown in FIG.
  • the jig body 2 only needs to have a smooth surface, and can have various forms based on various design changes as long as the elastic member 3 can be supported.
  • the jig body 2 is formed in a disk-shaped thin leaf body having a size larger than that of the elastic member 3 so that the vicinity of the edge protrudes from the edge of the elastic member 3. ing.
  • the jig body 2 may be formed in a disk-shaped thin leaf body having a square shape having substantially the same dimensions as the elastic member 3.
  • the jig body 2 only needs to be formed of a material capable of supporting the elastic member 3.
  • a metal plate such as stainless steel and aluminum, a metal foil such as an aluminum foil and a copper foil, polyester, polytetrafluoroethylene And resin films or resin plates such as polyimide, polyphenylene sulfide, polyamide, polycarbonate, polystyrene, polypropylene, polyethylene, and polyvinyl chloride.
  • the jig body 2 can be a laminated body formed by laminating a plurality of sheet-like materials.
  • the elastic member 3 is designed so as to be in contact with one surface of the object to be adhered and to hold a large number of objects to be adhered by adhesion. For example, as shown in FIG. It is formed into a disk-like body that forms a square that is slightly smaller than the tool body 2.
  • the elastic member 3 is formed of, for example, an adhesive material having an adhesive force described later or a cured product of the adhesive material, and the entire surface is an adhesive surface that can hold the object to be adhered.
  • the adhesive surface of the elastic member 3 is in contact with the surface of the object to be adhered and adheres and holds the object to be adhered, and therefore has an adhesive force capable of adhering and holding the object to be adhered.
  • the elastic member 3 usually has an adhesive force of 1 to 60 g / mm 2 and preferably has an adhesive force of 7 to 60 g / mm 2 .
  • the adhesive strength of the elastic member 3 is a value measured by the following “Shin-Etsu Polymer Method”.
  • a suction fixing device for example, trade name: electromagnetic chuck, KET-1530B, manufactured by Kanetech Co., Ltd.
  • a vacuum suction chuck plate for fixing the elastic member 3 horizontally, and a diameter of 10 mm at the distal end of the measurement unit
  • a load measuring device equipped with a digital force gauge (trade name: ZP-50N, manufactured by Imada Co., Ltd.) equipped with a stainless steel (SUS304) contactor having a cylindrical shape is prepared.
  • the elastic member 3 is fixed on the suction fixing device or the vacuum suction chuck plate, and the measurement environment is set to 21 ⁇ 1 ° C. and the humidity 50 ⁇ 5%.
  • the contact attached to the load measuring device is lowered until it contacts the part to be measured of the elastic member 3 at a speed of 20 mm / min, and then the contact is measured at a predetermined load on the part to be measured. Press vertically for 3 seconds against the part.
  • the predetermined load is set to 25 g / mm 2 .
  • the contact is pulled away from the site to be measured at a speed of 180 mm / min, and the pulling load measured by the digital force gauge at this time is read. This operation is performed at a plurality of measurement sites, and the obtained plurality of separation loads are arithmetically averaged, and the obtained arithmetic average value is used as the adhesive force of the elastic member 3.
  • the elastic member 3 has an adhesive surface maximum roughness Ry (JIS B 0601-1994) of 1.0 to 6.0 ⁇ m. If the maximum roughness Ry of the elastic member 3 is less than 1.0 ⁇ m, the peak portion having the maximum roughness is too small and is too close to the contact surface of the object to be adhered, so that the detachment property of the object to be adhered is poor, When the maximum roughness Ry of the elastic member 3 exceeds 6.0 ⁇ m, even if the peak portion having the maximum roughness is too large and the to-be-adhered object is pressed and the peak portion is elastically deformed, the flatness of the adhesive surface is inferior.
  • Ry adhesive surface maximum roughness
  • the adherend cannot be held with high adhesive strength, and in either case, high adhesive strength and detachability of the adherend cannot be achieved at a high level.
  • the maximum roughness Ry is 1.0 to 5.0 ⁇ m from the viewpoint that both high adhesive strength and releasability of the adherend can be achieved at a higher level and the object of the present invention can be achieved well. A thickness of 0.0 to 4.0 ⁇ m is particularly preferable.
  • the maximum roughness Ry is the maximum roughness Ry in a state where the adhesive surface does not hold the object to be adhered, and in accordance with JIS B 0601-1994, the cutoff is 0.8 mm, the measurement length is 2. Measure at least three places under the condition of 4 mm, etc., and make these arithmetic average values.
  • the maximum roughness Ry can be adjusted by a method described later.
  • the elastic member 3 preferably has an average interval Sm (JIS B0601-1994) of unevenness on the adhesive surface of 5.0 to 15.0 ⁇ m, and more preferably 5.0 to 11.0 ⁇ m. It is particularly preferably from 0 to 11.0 ⁇ m.
  • Sm Joint Industrial Standard
  • the average interval Sm of the unevenness on the adhesive surface is the average interval Sm of the unevenness in a state where the adhesive surface does not hold the object to be adhered, and basically according to the measurement method described in JIS B0601-1994. Measured.
  • the cutoff wavelength is 0.8 mm
  • the evaluation length is 2.4 mm
  • the cutoff type is Gaussian
  • an arithmetic average value at least at three points.
  • the average interval Sm of the unevenness on the adhesive surface can be adjusted by a method described later.
  • the elastic member 3 preferably has an adhesive surface centerline average roughness Ra (JIS B 0601-1994) of 0.1 to 0.5 ⁇ m in that the object of the present invention can be satisfactorily achieved. It is particularly preferable that the thickness is ⁇ 0.4 ⁇ m.
  • the centerline average roughness Ra of the adhesive surface is the centerline average roughness Ra when the adhesive surface does not hold the object to be adhered, and the cutoff is 0 according to JIS B 0601-1994. Measure at least three locations under the conditions of .8 mm, measurement length of 2.4 mm, etc., and use these arithmetic average values.
  • the center line average roughness Ra of the adhesive surface can be adjusted by a method described later.
  • the elastic member 3 preferably has a ten-point average roughness Rz (JIS B 0601-1994) of an adhesive surface of 1.0 to 5.0 ⁇ m in that the object of the present invention can be satisfactorily achieved. It is particularly preferred that the thickness is ⁇ 4.0 ⁇ m.
  • the ten-point average roughness Rz of the adhesive surface is the ten-point average roughness Rz in a state where the adhesive surface does not hold the object to be adhered, and has a cutoff of 0 in accordance with JIS B 0601-1994. Measure at least three locations under the conditions of .8 mm, measurement length of 2.4 mm, etc., and use these arithmetic average values.
  • the ten-point average roughness Rz of the adhesive surface can be adjusted by a method described later.
  • the elastic member 3 can adjust the maximum roughness Ry of the sticky surface, the average interval Sm of the unevenness, the center line average roughness Ra, and the ten-point average roughness Rz by the following methods. For example, a method of surface-treating the adhesive surface of the elastic member 3 by a known roughening treatment, for example, sand blasting or the like, and elasticity using a molding die having a cavity inner surface that has been surface-treated by a known roughening treatment. The method of shape
  • a method of incorporating a granular material into the elastic member 3 or the adhesive material forming the elastic member 3 (hereinafter referred to as a surface roughening method according to the present invention) will be briefly described. If the granular material used for the surface roughening method concerning this invention is a particle
  • Examples of the granular material satisfying such a standard include inorganic fillers such as silica-based fillers.
  • examples of the silica-based filler include silica synthesized by a dry method such as fumed silica and calcined silica, and silica synthesized by a wet method such as precipitated silica and silica gel. Among these, fumed silica and precipitated silica are preferable.
  • the organic substance covering the particulate matter may be a low molecular organic compound, but is preferably an organic resin from the viewpoint of dispersibility during mixing.
  • the organic resin include polyethylene, polypropylene, polystyrene, polyester, fluororesin (for example, polytetrafluoroethylene), polyimide, polyphenylene sulfide, polyamide, polycarbonate, and the like.
  • organic resins that exhibit high heat resistance and durability are preferable.
  • polyethylene covering silica etc. are mentioned, for example.
  • the granular material is a silica-based filler
  • the granular material is almost uniformly dispersed in the elastic member 3, and the maximum roughness Ry, the average interval Sm of unevenness, the centerline average roughness Ra, and the ten-point average
  • the average particle diameter is preferably 3 to 30 ⁇ m, more preferably 3 to 20 ⁇ m, and more preferably 5 to 10 ⁇ m in that at least the maximum roughness Ry of the roughness Rz can be adjusted to the above range. Is particularly preferred.
  • the measuring method of the average particle diameter is based on the secondary particle diameter d50 (laser method).
  • the granular material is a silica-based filler
  • the granular material is almost uniformly dispersed in the elastic member 3, and the maximum roughness Ry, the average interval Sm of unevenness, the centerline average roughness Ra, and the ten-point average It is contained in the elastic member 3 at a ratio of 1 to 25 parts by mass with respect to 100 parts by mass of rubber or resin forming the elastic member 3 in that at least the maximum roughness Ry of the roughness Rz can be adjusted to the above range. It is preferable that the elastic member 3 contains 3 to 25 parts by mass.
  • the method of adding a granular material to the adhesive material which forms the elastic member 3 etc. is mentioned to make this elastic material contain in the elastic member 3.
  • the elastic member 3 preferably has a sticky surface hardness (JIS K6253 [durometer A]) of 5 to 50, particularly preferably 30 to 50.
  • JIS K6253 [durometer A] a sticky surface hardness
  • the adhesive surface is within the above hardness range, when the object to be adhered is pressed and held on the adhesive surface, the adhesive surface, in particular, the crest portion thereof is easily elastically deformed so that the adhesive surface is more It is further flattened so that the contact surface of the adherend is more firmly adhered, and damage or breakage of the adherend can be prevented.
  • the hardness of the elastic member 3 can be adjusted with content of a granular material, etc.
  • the elastic member 3 preferably has a thickness of about 0.05 to 5 mm. If the thickness of the elastic member 3 is less than 0.05 mm, the mechanical strength of the elastic member 3 is lowered, and the durability of the elastic member 3 may not be sufficient. On the other hand, if the thickness exceeds 5 mm, the elastic member 3 May not be easily elastically deformed, and the adherend may not be easily removed from the elastic member 3 in some cases.
  • the elastic member 3 may be fixed to the surface of the jig body 2 by an adhesive layer or a primer layer, by the adhesive force of the elastic member 3, or by a fixture or the like. 3 is fixed to the surface of the jig body 2 via an adhesive layer or a primer layer.
  • the elastic member 3 only needs to be formed of an adhesive material capable of exerting the adhesive force or a cured product of this adhesive material.
  • the adhesive material include a fluorine resin, a fluorine rubber, and a fluorine resin.
  • addition reaction curable adhesive silicone compositions and peroxide curable adhesive silicone compositions containing silicone rubber and / or silicone rubber are preferred.
  • the addition reaction curable adhesive silicone composition include silicone raw rubber (a), crosslinking component (b), adhesion improver (c), and catalyst (d) described in JP-A-2008-091659.
  • a pressure-sensitive adhesive composition containing silica-based filler (e) examples include, for example, a silicone raw rubber (a), an adhesion improver (c), a silica filler (e), and an organic material described in JP-A-2008-091659. Mention may be made of an adhesive composition containing a peroxide (f).
  • the adhesive material is cured under appropriate conditions. In order to adjust the maximum roughness Ry within the above range by the surface roughening method according to the present invention, these adhesive materials contain a predetermined amount of particulate matter.
  • the holding jig 1 Since the adhesive surface of the elastic member 3 has the maximum roughness Ry in the above range, the holding jig 1 has a characteristic that is opposite to each other as described above.
  • the object of the present invention can be satisfactorily achieved while achieving both adhesive strength and detachability of the adherend.
  • the entire sticky surface of the holding jig 1 is sticky, and it is easy to stick and hold the adherend when necessary, so there is no need to position the sticking holding position of the sticky object with high precision. Excellent in productivity and handling.
  • a handling jig according to the present invention includes a holding jig according to the present invention, and a detaching tool for detaching an object to be adhered that is relatively moved along the surface of the elastic member in the holding jig. And.
  • the handling jig according to the present invention is preferably used when, for example, a plurality of objects to be adhered are temporarily adhered and held in order to manufacture, transport, store, or inspect, and then the objects to be adhered that are adhered are removed. Is done.
  • the holding jig in the handling jig according to the present invention is as described above, and examples thereof include the holding jig 1 and the like.
  • the detachment tool in the handling jig according to the present invention moves relative to the holding jig along the surface of the elastic member in the holding jig, and removes the object to be adhered and held on the holding jig. It only needs to have a form that can be detached, for example, a detachable tool having a collision part that can collide with an object to be adhered and held by a holding jig and press the object to be adhered. Are preferable. Such a detachable tool may be, for example, a triangular prism-shaped blade with its tip functioning as the impacted part, or a wire itself functioning as the impacted part. Also good.
  • the detachment tool in the handling jig according to the present invention relatively moves in a contact state or a non-contact state on the surface of the elastic member in the holding jig, and preferably moves relatively in a non-contact state.
  • a handling jig 4 which is an example of a handling jig according to the present invention includes a holding jig 1 and a detaching tool 5.
  • the holding jig 1 is as described above, and the detaching tool 5 is, for example, a blade that has a triangular prism shape that is overturned as shown in FIG. 2, and whose tip functions as the colliding part. .
  • the detaching tool 5 has a length in the extending direction, that is, a height of the triangular prism, detaches a plurality of objects to be adhered that are adhered and held in a row on the elastic member 3 of the holding jig 1 at a time.
  • the length of the elastic member 3 is longer than that of the elastic member 3. Since the tip of the detachment tool 5 functions as a collision target that collides with the adherend, it may be formed or covered with an elastic material for the purpose of preventing damage to the adherend.
  • This one handling method includes a detaching step of removing the object to be adhered by moving the detachment tool relatively along the adhesive surface of the holding jig 1 on which the object to be adhered is adhesively held.
  • the adhesion process is a process of pressing and holding an object to be adhered to the adhesive surface of the elastic member 3 for adhesion.
  • a plurality of adherends are arranged in a predetermined pattern on the elastic member 3, and the bottom surface is held on the holding jig 1. Is pressed against the adhesive surface of the elastic member 3. Then, the bottom surface of the adherend is pressed against the adhesive surface, and as described above, the crest portion of the elastic member 3 is elastically deformed and the adhesive surface is flattened.
  • the pressure-sensitive adhesive is held on the elastic member 3 by sticking.
  • Examples of the method for sticking and holding the adherend in this way include the method described in Japanese Patent Application Laid-Open No. 2008-091659. Specifically, in a state in which the standing arrangement plate having a thickness thinner than the axial length of the adherend and having a plurality of arrangement holes through which the adherend can pass is placed on the elastic member 3. When the adherend is inserted into the arrangement hole and then the free end of the adherend is pressed toward the elastic member 3 using, for example, a flat plate-like member, the adherend is applied to the elastic member 3. Adhesion is retained.
  • the removal tool 5 in order to remove the object to be adhered and held by the holding jig 1, the removal tool 5 is relatively moved along the adhesive surface of the holding jig 1 to move the object to be adhered to the side. Press toward. Specifically, the detachment tool 5 is disposed in the vicinity of the adhesive surface of the holding jig 1 so as to be non-contact. At this time, even if the detaching tool 5 is not brought into contact with the surface of the holding jig 1, the adherend can be detached as desired with the holding jig according to the present invention. The detachment tool 5 arranged in this way is moved relatively forward along the adhesive surface, that is, moved to the adherend side.
  • the tip of the detachment tool 5 comes into contact with the side surface of the object to be adhered, and the object to be adhered is pressed and inclined in the above-mentioned direction, that is, the side.
  • the contact surface of the adherend is peeled off from the adhesive surface of the elastic member 3 at the maximum roughness Ry in the above range.
  • the adherend pressed by the removal tool 5 is detached from the elastic member 3 of the holding jig 1.
  • almost all of the adherend to be adhered can be detached.
  • Patent Document 2 is a method of “depressing the adhesive layer with the tip of the blade and moving the blade relative to the surface of the adhesive layer in that state”
  • Patent Document 3 A method of scraping the electronic component from the adhesive material layer by moving the scraping means along the surface of the adhesive material layer and moving the non-adhesive part or the low adhesive part to the end of the moving direction.
  • the scraping member when the scraping member is slid on the surface of the elastic material, the scraping member is slid by pressing strongly against the surface of the elastic material, particularly for the purpose of reliably removing the adherend. If the surface of the elastic material is slid on the elastic material surface, the elastic material surface may be damaged by the small component scraping member.
  • the handling jig according to the present invention since the handling jig according to the present invention includes the holding jig according to the present invention having excellent detachability, even if the adherend falls down, it re-adheres unless it is strongly pressed against the adhesive surface.
  • the handling jig according to the present invention can highly prevent damage to the elastic member, particularly the adhesive surface, caused by the detachment tool.
  • the holding jig according to the present invention and the handling jig according to the present invention can adhere and hold a large number of objects to be adhered as desired, and most of the objects to be adhered which are adhered to the holding jig. All can be easily desorbed. Therefore, the holding jig according to the present invention and the handling jig according to the present invention are suitably used for, for example, a manufacturing process of an adherend and a recovery of scattered adherends.
  • a set of holding jigs according to the present invention includes a first holding jig including a first jig main body and a first elastic member provided on a surface of the first jig main body, and a second jig main body. And a second holding jig comprising a second elastic member provided on the surface of the second jig main body, and at least one of the first holding jig and the second holding jig is the holding according to the present invention.
  • the second elastic member is a jig and has an adhesive force larger than that of the first elastic member.
  • the second holding jig is preferably the holding jig according to the present invention. It is particularly preferable that both of the second holding jigs are the holding jigs according to the present invention.
  • the first holding jig and the second holding jig may be basically configured similarly except for adhesive force.
  • a set of holding jigs according to the present invention includes, for example, a substrate that is adhesively held on one holding jig in order to manufacture an object to be bonded by sequentially performing predetermined processing on both ends of a plurality of objects to be bonded. It is preferably used when the transferred object is removed after the adhesive is transferred to the other holding jig.
  • a set of holding jigs 6 as an example of a set of holding jigs according to the present invention is provided on the surface of the first jig main body 2A and the first jig main body 2A.
  • the first holding jig 1A and the second holding jig 1B are basically configured in the same manner as the holding jig 1.
  • the first elastic member 3A and the second elastic member 3B are capable of adhering and holding an adherend, usually 1 to 60 g / mm 2. It is preferable to have an adhesive strength of 7 to 60 g / mm 2 (according to the “Shin-Etsu Polymer Method”).
  • the 2nd elastic member 3B in the 2nd holding jig 1B has a larger adhesive force than the adhesive force of the 1st elastic member 3A. Since the first elastic member 3A and the second elastic member 3B have such an adhesive force relationship, the first elastic member 3A in the first holding jig 1A is changed to the second elastic member 3B in the second holding jig 1B. The adherend can be transferred.
  • the adhesive force between the first elastic member 3A and the second elastic member 3B (referred to as “Shin-Etsu Polymer”) can be smoothly transferred from the first elastic member 3A to the second elastic member 3B without dropping off.
  • the difference of “by method” is preferably 15 to 43 g / mm 2 , more preferably 18 to 35 g / mm 2 , and particularly preferably 20 to 30 g / mm 2 .
  • the adhesive strength of each of the first elastic members 3A and 3B can be adjusted by the content of the adhesive strength improver, the content of granular materials, and the like.
  • the first holding jig 1 ⁇ / b> A and the second holding jig 1 ⁇ / b> B are both the holding jig 1, in other words, the first elastic member 3 ⁇ / b> A and the second elastic member 3 ⁇ / b> A in the first holding jig 1 ⁇ / b> A.
  • Each of the second elastic members 3B in the holding jig 1B has the maximum roughness Ry in the above range.
  • An adherend holding device according to the present invention includes a set of holding jigs according to the present invention.
  • An adherend holding apparatus which is an example of an adherend holding apparatus according to the present invention will be described with reference to the drawings.
  • the adherend holding device 10 includes a set of holding jigs including a first holding jig 1 ⁇ / b> A and a second holding jig 1 ⁇ / b> B. This is an apparatus capable of transferring an object to be adhered from the holding jig 1A to the second holding jig 1B.
  • the set of holding jigs included in the adherend holding apparatus 10 is configured in the same manner as the set of holding jigs 6.
  • the adherend holding device 10 is configured so that the first holding jig 1A and the second holding jig 1B face each other so that the first elastic member 3A and the second elastic member 3B face each other. It can be placed. Thereby, the to-be-adhered object adhesively held by the 1st holding jig 1A can be transferred to the 2nd holding jig 1B, for example, maintaining the standing state.
  • Such an arrangement of the first elastic member 3A and the second elastic member 3B may be realized by a displacement means having a mechanical configuration, or may be realized manually.
  • the first holding jig 1 ⁇ / b> A has a support arm 13 in which the surface side of the jig main body 2 ⁇ / b> A where the first elastic member 3 ⁇ / b> A is not formed extends downward from the holding jig displacing means 12. It is fixed to a support member 14 provided at the tip and supported by the holding jig displacement means 12.
  • the holding jig displacing means 12 is attached to the rail 11, is configured to be movable in the horizontal direction along the rail 11, and is configured to be able to move the support arm 13 in the vertical direction. Therefore, the first holding jig 1A supported by the holding jig displacing means 12 can be freely moved in the horizontal direction and the vertical direction by the holding jig displacing means 12.
  • the first holding jig 1A having the first elastic member 3A for hanging and holding the adherend is, for example, above the conductive paste bath or from an appropriate position other than above the conductive paste bath, for example, It can be transferred to a position above the second holding jig 1B, is lowered toward the second holding jig 1B, and an adherend is applied to the second elastic member 3B of the second holding jig 1B. After the holding is changed, the first holding jig 1A can be raised from the second holding jig 1B.
  • the holding jig displacing means 12 is configured to be capable of rotating around the axis with the rail 11 as the central axis.
  • the state of the first holding jig 1A is the same as the state in which the object to be adhered is suspended by the first elastic member 3A, and the object to be adhered is the first.
  • the elastic member 3 ⁇ / b> A can be changed to a state of being held upright as desired.
  • the second holding jig 1 ⁇ / b> B extends upward from the holding jig displacing means 16 on the surface side of the second jig main body 2 ⁇ / b> B where the second elastic member 3 ⁇ / b> B is not formed. It is fixed to a support member 18 provided at the tip of the support arm 17 and supported by the holding jig displacement means 16.
  • the holding jig displacing means 16 is attached to a rail 15 that is substantially orthogonal to the rail 11 and is basically formed in the same manner as the holding jig displacing means 12. Therefore, the second holding jig 1B supported by the holding jig displacing means 16 can be moved freely in the horizontal direction and the vertical direction by the holding jig displacing means 16, and the axis with the rail 15 as the central axis. It can rotate around.
  • the movement mechanism in the holding jig displacing means 12 and the holding jig displacing means 16 is not particularly limited.
  • a driving means that generates a driving force for example, a motor, and the output of the motor 11 or 15, and
  • Examples of the movement mechanism include transmission means for transmitting to the support arm 13 or 17, for example, a gear, a wire, and the like.
  • This motion mechanism may be controlled by a normal personal computer or manually.
  • the adherend holding apparatus 10 includes a first holding jig 1A and a second holding jig 1B, and a first elastic member 3A and a second elastic member 3B in the vicinity of a position where the rail 11 and the rail 15 intersect. It can be arranged so as to face each other. Thereby, the adherend to which the first holding jig 1A is adhesively held can be transferred to the second holding jig 1B.
  • the chip capacitor body 7 has a quadrangular prism body.
  • the chip capacitor 9 has electrodes 8 formed at both ends of the chip capacitor body 7. Become.
  • the chip capacitor body 7 is adhesively held on the first elastic member 3 ⁇ / b> A.
  • the holding jig displacing means 12 is rotationally moved around the axis with the rail 11 as the central axis, and the first holding jig 1A is arranged with the first elastic member 3A facing upward, for example, As described above, the chip capacitor body 7 is pressed against the first elastic member 3A using the upright arrangement plate. Then, the first elastic member 3A is elastically deformed and flattened by the chip capacitor body 7, and the chip capacitor body 7 is adhered and held by the first elastic member 3A.
  • the holding jig displacing means 12 is rotated around the rail 11 as the central axis, the first elastic member 3A is moved. A large number of chip capacitor bodies 7 are suspended and held.
  • the holding jig displacing means 12 (not shown) is moved horizontally along the rails 11 (not shown) to suspend and hold a large number of chip capacitor bodies 7 suspended in a conductive paste bath (not shown). .) Is moved horizontally, and the support arm 13 is moved downward to immerse the lower end portion of the chip capacitor body 7 in the conductive paste bath. After a while, the support arm 13 is moved upward to dry the conductive paste applied to the chip capacitor body 7.
  • an electrode 8 having a substantially uniform size is formed at the lower end portion of each chip capacitor body 7 suspended and held by the first elastic member 3 ⁇ / b> A.
  • the object to be adhered is adhered and held in the first elastic member 3A as desired, so that when the object is dipped in the conductive paste and pulled up from the conductive paste, it may fall off from the first elastic member 3A. There is no inclination.
  • the holding jig displacing means 12 is moved horizontally along the rail 11 to move the first holding jig 1A horizontally above the second holding jig 1B, and as shown in FIG. 13 is moved downward to lower the first holding jig 1A toward the second holding jig 1B.
  • the first holding jig 1A is further lowered, and the lower end portion of the chip capacitor body 7 adhered and held by the first holding jig 1A is brought into pressure contact with the second elastic member 3B of the second holding jig 2A.
  • the second elastic member 3B is elastically deformed and flattened by the chip capacitor main body 7, and exhibits a larger adhesive force than the first elastic member 3A.
  • the chip capacitor main body that is adhesively held by the first elastic member 3A 7 is adhered to the second elastic member 3B with a large adhesive force.
  • the second elastic member 3B expresses a desired adhesive force, and the second elastic member 3B is the first elastic member. Since the adhesive strength is larger than the adhesive strength with 3A, the chip capacitor body 7 is firmly adhered to the second elastic member 3B via the electrode 8, and the first elasticity in the first holding jig 1A is obtained.
  • the chip capacitor body 7 leaves the member 3A with almost no remaining. In this way, a large number of chip capacitor bodies 7 can be transferred from the first holding jig 1A to the second holding jig 1B as desired without dropping off or falling down.
  • the holding jig displacing means 16 (not shown) is rotated around the axis with the rail 15 (not shown) as the central axis, and the chip capacitor body 7 is suspended and held by the second holding jig 1B. It will be in the state. Thereafter, a conductive paste is applied to the lower end portion of the chip capacitor body 7 suspended and held in the same manner as described above and dried to form the electrode 8.
  • the second elastic member 3B of the second holding jig 1B has a chip in which the electrodes 8 having substantially equal sizes are formed on both ends of the chip capacitor body 7 as shown in FIG. Adhesion is held in a state where the capacitor 9 is suspended. Then, the chip capacitor 9 that is adhesively held by the second holding jig 1B is pressed laterally by, for example, the detaching tool 5 that relatively moves along the adhesive surface of the second holding jig 1B. Thus, the elastically deformed second elastic member 3B is restored and easily detached from the second elastic member 3B and dropped.
  • the set of holding jigs 6 and the object to be adhered holding device according to the present invention a large number of objects to be adhered can be adhered to one holding jig as desired in a standing state. It is possible to hold and effectively prevent the adherend from being left in one holding jig and falling over when transferring the adherend from one holding jig to the other holding jig. Thus, a large number of objects to be adhered can be transferred from one holding jig to the other holding jig while maintaining the standing state. That is, if the set of holding jigs and the object to be adhered holding device according to the present invention are used, the object to be adhered can be manufactured with high productivity.
  • the holding jig, the handling jig, the set of holding jigs, and the adherend holding apparatus according to the present invention are not limited to the above examples, and various types can be used as long as the object of the present invention can be achieved. Can be changed.
  • the entire surface of the elastic member 3 is an adhesive surface.
  • the elastic member has an adhesive surface if at least a part of its surface is an adhesive surface. Good.
  • the jig main body 2 and the elastic member 3 are both formed in a rectangular shape, but the jig main body and the elastic member may have any shape suitable for manufacturing a small part,
  • the shape is arbitrary according to the shape of the object, the shape of the adherend holding device, the manufacturing process, workability, and the like.
  • the holding jig includes a plate-like body such as a polygon such as a square, a rectangle, a pentagon, and a hexagon, a circle, an ellipse, an indeterminate shape, or a combination thereof.
  • one surface side in which the elastic member 3 in the jig body 2 is not formed may be a planar shape or a three-dimensional shape such as a semi-cylindrical body.
  • the holding jig 1 includes a plate-shaped jig body 2 having a square shape
  • a supporting member may be formed on a part of the elastic member.
  • this support member may be formed with the material which has flexibility with an elastic member.
  • the holding jig 1 forms a square plate-like body.
  • the holding jig is an endless belt-like, thick plate-like body, sheet body, or long body depending on the application. It can be suitably formed in such a form.
  • the holding jig formed in an endless belt shape is basically formed in the same manner as the holding jig 1 except that the entire holding jig is formed in an endless belt shape. Therefore, the holding jig includes a support member formed in an endless belt shape and an elastic member laminated on the surface of the support member so as to be in an endless belt shape.
  • the handling jig 4 includes a holding jig and a detaching tool.
  • the handling jig is a member or element other than these, for example, a storage member for an adherend, a driving of the detaching tool.
  • Means, and a standing arrangement plate described in Japanese Patent Application Laid-Open No. 2008-091659, for example, the standing arrangement plate, and an object to be adhered inserted into the arrangement hole of the standing arrangement plate, are used as the first holding jig. You may provide the press board etc. which are pressed toward.
  • the set of holding jigs 6 includes a first holding jig 1A and a second holding jig 1B.
  • the set of holding jigs includes the first holding jig and the first holding jig.
  • other members or elements for example, a third holding jig, the detaching tool, and the like may be provided.
  • the adherend holding apparatus 10 includes the first holding jig 1A and the second holding jig 1B.
  • the adherend holding apparatus includes the first holding jig and the second holding jig.
  • other members or elements for example, a third holding jig, the detaching tool, and the like may be provided.
  • the first elastic member 3A and the second elastic member 3B are formed of the same adhesive material, but different adhesive materials. It may be formed.
  • the holding jig displacement means 12 and 16 are comprised so that rotation around the axis
  • the first holding member in which the chip capacitor body is adhered and held on the first elastic member may be supported by the holding jig displacement means, and the second holding in which the chip capacitor is adhered and held on the second elastic member.
  • the jig may be removed from the holding jig displacing means and the chip capacitor may be removed from the second elastic member.
  • Example 1 A square plate-like body having a side length of 120 mm was cut out from a stainless steel plate (made of SUS304, thickness 0.5 mm). After degreasing one surface of the disc-shaped body with acetone, a silicone rubber adhesion primer (trade name “X-33-156-20”, manufactured by Shin-Etsu Chemical Co., Ltd.) is applied to the elastic member forming region (long side length). An appropriate amount was applied to a square having a length of 110 mm, and the center of the square and the center of the plate-like body coincided with each other, and dried in an environment at 23 ° C. to form a primer layer (thickness 3 ⁇ m). In this way, the jig body 2 was produced.
  • a silicone rubber adhesion primer trade name “X-33-156-20”, manufactured by Shin-Etsu Chemical Co., Ltd.
  • An addition reaction curable adhesive silicone composition having the following composition was prepared as an adhesive material for forming the elastic member 3.
  • a silicone rubber composition containing a silicone raw rubber (a), a crosslinking component (b), an adhesion improver (c), and a catalyst (d) (trade name “X-34-632 A / B”, Shin-Etsu Chemical Co., Ltd.) 90 parts by mass, average particle size of 10 ⁇ m silica whose surface is coated with polyethylene 10 parts by mass (converted content when silicone raw rubber (a) is 100 parts by mass (expressed as converted content in Table 1) .) Is 13 parts by mass)
  • the prepared jig body 2 is housed in a mold, and the prepared addition reaction curable adhesive is prepared in a cavity (a rectangular parallelepiped having a side length of 110 mm and a thickness of 0.8 mm) formed on the elastic member forming region.
  • the conductive silicone composition is injected, transfer molded at 120 ° C. and 10 MPa, and then further cured at 200 ° C. for 4 hours to form the elastic member 3 on the surface of the jig body 2.
  • a holding jig 1 was manufactured.
  • Example 2 A holding jig 1 was manufactured basically in the same manner as in Example 1 except that the average particle diameter of the silica was changed to 6 ⁇ m.
  • Example 5 The content of the silica is 3 parts by mass (conversion content when the silicone raw rubber (a) is 100 parts by mass is 4 parts by mass), 7 parts by mass (conversion when the silicone raw rubber (a) is 100 parts by mass) The content was basically the same as that of Example 1 except that the content was changed to 9 parts by mass) and 14 parts by mass (the converted content when the silicone raw rubber (a) was 100 parts by mass was 18 parts by mass). A holding jig 1 was manufactured.
  • Comparative Examples 1 and 2 Basically the same as in Example 1 except that the silica content was changed to 0 parts by mass and 21 parts by mass (the converted content when the silicone raw rubber (a) was 100 parts by mass was 27 parts by mass).
  • the holding jig was manufactured.
  • Table 1 shows the results obtained by measuring the maximum roughness Ry of the adhesive surface, the average interval Sm of the unevenness, the adhesive force and the hardness in the holding jigs manufactured in each Example and each Comparative Example based on the measurement method. Show.
  • the holding jigs of Examples 1 to 5 were able to remove all the objects to be adhered and retained without damaging the elastic member 3, and exhibited high releasability.
  • the holding jigs of Comparative Examples 1 and 2, particularly the holding jig of Comparative Example 1 are to be attached to the object to be adhered unless the polyacetal blade is moved in contact with or pressed against the adhesive surface.
  • the elastic member in the holding jig of Example 3 was brought into contact with the upper ends of a large number of rectangular parallelepiped objects to be erected on the surface of the elastic member in the holding jig of Example 5.
  • the holding jig of Example 3 was moved upward by 180 mm / min. It was lifted at a speed of and pulled away from the holding jig of Example 5.
  • the number of rectangular solid objects to be left in the holding jig of Example 5 was 0.5 with respect to the whole. %, Indicating high transferability.
  • the holding jig, the handling jig, the set of holding jigs, and the adherend holding device according to the present invention can be suitably used for manufacturing, transporting, storing, or inspecting the adherend such as small parts. .

Abstract

The present invention treats as a problem the provision of a retaining jig, a handling jig, a set of retaining jigs, and a retaining device for adhered material, with which it is possible to easily detach almost all of the adhered materials which are adhesively retained regardless of it being possible for the adhered materials to be adhesively retained as desired. The invention of the present application which is intended to solve the problem relates to: a retaining jig (1) comprising a jig main body (2) and an elastic member (3) which is disposed on the obverse face of the main body (2) and which has a maximum roughness Ry (JIS B-0601-1994) of 1.0-6.0 μm; a handling jig comprising the retaining jig (1) and a detaching tool; a set of retaining jigs comprising at least one retaining jig (1); and a retaining device for adhered material comprising the set of retaining jigs.

Description

保持治具、取扱治具、一組の保持治具及び被粘着物保持装置Holding jig, handling jig, a set of holding jig, and adherend holding device
　この発明は、保持治具、取扱治具、一組の保持治具及び被粘着物保持装置に関し、さらに詳しくは、被粘着物を所望のように粘着保持できるにもかかわらず、粘着保持された被粘着物のほとんどすべてを容易に離脱させることのできる保持治具、取扱治具、一組の保持治具及び被粘着物保持装置に関する。 The present invention relates to a holding jig, a handling jig, a set of holding jigs, and an adherend holding device, and more specifically, although the adherend can be adhesively held as desired, the adhesive is held. The present invention relates to a holding jig, a handling jig, a set of holding jigs, and a to-be-adhered object holding device capable of easily removing almost all of the objects to be adhered.
　従来、例えば、チップコンデンサ等の小型部品等を製造する際等に、この小型部品等を製造可能な小型部品用部材等をその表面に粘着保持可能な保持治具が用いられている。例えば、特許文献１に記載の保持治具は、「少なくとも表面部が粘着性を有するゴム弾性材で形成され、その粘着力により小型部品をその弾性材表面において密着保持可能であることを特徴とする」（特許文献１の請求項１参照）。このような保持治具を用いて小型部品等を製造等するには、小型部品は被粘着物として保持治具に粘着保持された状態で各種の製造工程等に供される。そして、保持治具に粘着保持された状態で製造等された小型部品等は保持治具から取り外される。 Conventionally, for example, when manufacturing a small component such as a chip capacitor, a holding jig capable of sticking and holding a small component member or the like capable of manufacturing the small component on the surface thereof has been used. For example, the holding jig described in Patent Document 1 is characterized in that “at least the surface portion is formed of a rubber elastic material having adhesiveness, and the adhesive force can hold a small component on the elastic material surface. (See claim 1 of Patent Document 1). In order to manufacture a small part or the like using such a holding jig, the small part is subjected to various manufacturing processes in a state in which the small part is adhesively held by the holding jig as an adherend. Then, the small parts and the like manufactured in a state where they are adhesively held by the holding jig are removed from the holding jig.
　保持治具から小型部品等を取り外す方法として、例えば、スクレイパー等の小型部品掻き取り部材を弾性材表面上に摺動させて、粘着保持された小型部品等を取り外す方法がある。このような方法として、具体的には、特許文献２には「支持体と支持体の一面に形成された粘着層とを有する電子部品保持具の該粘着層に複数の電子部品を粘着により保持する工程と、前記粘着層に保持されている電子部品に所定の処理を施す工程と、前記ブレードの先端により粘着層を凹ませ、その状態でブレードを粘着層表面方向に相対的に移動させることにより電子部品を粘着層から離脱させる工程とを備える、電子部品の取扱い方法。」が記載されている（請求項４等参照。）。 As a method of removing a small part or the like from the holding jig, for example, there is a method of sliding a small part scraping member such as a scraper on the surface of the elastic material to remove the small part or the like that is adhered and held. As such a method, specifically, Patent Document 2 describes that “a plurality of electronic components are held by adhesion in an adhesive layer of an electronic component holder having a support and an adhesive layer formed on one surface of the support. Performing a predetermined process on the electronic component held on the adhesive layer, and denting the adhesive layer with the tip of the blade, and moving the blade relative to the surface of the adhesive layer in that state The method of handling an electronic component, comprising the step of releasing the electronic component from the adhesive layer by the above-mentioned method "(see claim 4 etc.).
　特許文献２に記載の方法は、「ブレードの先端により粘着層を凹ませ、その状態でブレードを粘着層表面方向に相対的に移動させる」ことによって、特許文献２の図３に示されるように、電子部品２を傾斜させて離脱させる方法であるから、電子部品の寸法、粘着層の凹ませ状態、粘着層の粘着力、ブレードの移動速度等を適切に設定しないと、電子部品が転倒して粘着層表面に再粘着し、粘着層から所望のように取り外せないことがある。 As shown in FIG. 3 of Patent Document 2, the method described in Patent Document 2 is “by denting the adhesive layer with the tip of the blade and moving the blade relative to the surface of the adhesive layer in that state”. Since the electronic component 2 is tilted and removed, the electronic component will fall down unless the dimensions of the electronic component, the recessed state of the adhesive layer, the adhesive force of the adhesive layer, the moving speed of the blade, etc. are set appropriately. May re-adhere to the surface of the adhesive layer and cannot be removed as desired from the adhesive layer.
　また、別の方法として、特許文献３には「粘着材層と、非粘着部分又は粘着材層よりも粘着力の小さい低粘着部分とを備える保持手段を準備するステップと、前記保持手段の粘着材層に電子部品の一端面を粘着させて該電子部品を保持するステップと、掻取り手段を前記粘着材層の表面に沿って、かつ、前記非粘着部分又は前記低粘着部分が移動方向終端にくるような方向に移動させ、電子部品を粘着材層から掻き取るステップと、を備えたことを特徴とする電子部品の取扱い方法」が記載されている（請求項８等参照。）。特許文献３に記載の方法のように、小型部品掻き取り部材を弾性材表面上に摺動させても、被粘着物が転倒して再度粘着層表面に粘着されてしまい、小型部品を容易に取り外すことができないことがある。 In addition, as another method, Patent Document 3 discloses a step of preparing a holding means including an adhesive material layer and a non-adhesive portion or a low adhesive portion having a lower adhesive strength than the adhesive material layer; A step of adhering one end surface of the electronic component to the material layer to hold the electronic component, and a scraping means along the surface of the adhesive material layer, and the non-adhesive portion or the low adhesive portion is terminated in the moving direction. And a method of handling the electronic component, which includes a step of scraping the electronic component from the adhesive material layer ”(refer to claim 8). Even if the small component scraping member is slid on the surface of the elastic material as in the method described in Patent Document 3, the adherend falls down and is again adhered to the surface of the adhesive layer. Sometimes it cannot be removed.
　特に小型部品等は、年々小型化されているので、小型部品等の寸法が小さくなるほど、前記したような小型部品等が再粘着してしまうという問題が生じやすくなっている。 In particular, since small parts and the like are miniaturized year by year, the smaller the size of the small parts and the like, the more likely that the above-mentioned small parts and the like are re-adhered.
特公平０７－９３２４７号公報Japanese Patent Publication No. 07-93247 特開２００３－７７７７２号公報Japanese Patent Laid-Open No. 2003-77772 特開２００４－１９３３６６号公報JP 2004-193366 A
　この発明は、被粘着物を所望のように粘着保持できるにもかかわらず、粘着保持された被粘着物のほとんどすべてを容易に離脱させることのできる保持治具、取扱治具、一組の保持治具及び被粘着物保持装置を提供することを、目的とする。 The present invention provides a holding jig, a handling jig, and a set of holdings capable of easily detaching almost all of the objects to be adhered, which can be adhered and retained as desired. It is an object to provide a jig and an adherend holding device.
　本願発明者らは、被粘着物を弾性部材に押圧して粘着保持させ、被粘着物を側方に押圧して離脱させる保持治具において、被粘着物を粘着保持する粘着性表面を高度に平坦にしなければ被粘着物を所望のように粘着保持できないという従来の技術常識に反して粘着性表面の表面をある程度粗くすると、被粘着物を粘着性表面に接触させても押圧しなければ強固に粘着保持されないにもかかわらず、被粘着物を粘着性表面に押圧すると平坦な粘着性表面とほぼ同等の粘着力を発現して被粘着物を粘着保持できるうえ、所望のように粘着保持された被粘着物を側方に押圧するだけでそのほとんどすべてを容易に離脱させることができることを、新たに見出して、本願発明を完成した。 The inventors of the present application highly advanced the adhesive surface that adheres and holds the adherend in a holding jig that presses and adheres the adherend to the elastic member and presses the adherend to the side to release it. If the surface of the adhesive surface is roughened to a certain degree contrary to the conventional technical common sense that the object to be adhered cannot be held in the desired manner unless it is flattened, it will be strong if it is not pressed even if it is brought into contact with the adhesive surface. In spite of the fact that the object to be adhered is not held in contact with the adhesive surface, pressing the object to the adhesive surface produces an adhesive force almost equal to that of a flat adhesive surface, allowing the object to be adhered to be adhesively retained, and maintaining the adhesion as desired. The present invention was completed by newly discovering that almost all of them could be easily detached by simply pressing the adherend to the side.
　このように、本願発明者らは、粘着性表面の表面をある程度粗くすると、被粘着物を押圧したときの高い粘着力と被粘着物の離脱性とを高い水準で両立でき、粘着性表面の単なる粘着力の調整では得られない高い離脱性を発揮することを新たに見出して、本願発明を完成した。 As described above, the inventors of the present invention can achieve a high level of both high adhesive force when pressing the adherend and the ability to detach the adherend at a high level by roughening the surface of the sticky surface. The present invention was completed by newly discovering that it exhibits high releasability that cannot be obtained by simply adjusting the adhesive force.
　前記課題を解決するための第１の手段であるこの発明に係る保持治具は、治具本体と、前記治具本体の表面に設けられ、最大粗さＲｙ（ＪＩＳ　Ｂ　０６０１－１９９４）が１．０～６．０μｍである弾性部材とを備えて成ることを特徴する。 A holding jig according to the present invention, which is a first means for solving the above-described problems, is provided on a jig body and the surface of the jig body, and has a maximum roughness Ry (JIS B 0601-1994) of 1. And an elastic member having a thickness of 0.0 to 6.0 μm.
　この保持治具における好適な一例は、前記弾性部材は、凹凸の平均間隔Ｓｍ（ＪＩＳ　Ｂ０６０１－１９９４）が５．０～１５．０μｍである。 As a preferred example of the holding jig, the elastic member has an average unevenness interval Sm (JIS B0601-1994) of 5.0 to 15.0 μm.
　前記課題を解決するための第２の手段であるこの発明に係る取扱治具は、この発明に係る保持治具と、前記保持治具における弾性部材の表面に沿って相対的に移動して粘着保持された被粘着物を脱離させる脱離具とを備えて成ることを特徴する。 The handling jig according to the present invention, which is a second means for solving the above-mentioned problems, moves relative to the holding jig according to the present invention and moves along the surface of the elastic member in the holding jig. And a detaching tool for detaching the object to be adhered.
　前記課題を解決するための第３の手段であるこの発明に係る一組の保持治具は、第１治具本体と前記第１治具本体の表面に設けられた第１弾性部材を備えて成る第１保持治具と、第２治具本体と前記第２治具本体の表面に設けられた第２弾性部材を備えて成る第２保持治具とを備え、前記第１保持治具及び前記第２保持治具の少なくとも一方はこの発明に係る保持治具であり、かつ、前記第２弾性部材は前記第１の弾性部材の粘着力よりも大きな粘着力を有していることを特徴する。 A set of holding jigs according to the present invention, which is a third means for solving the above problems, includes a first jig body and a first elastic member provided on the surface of the first jig body. Comprising a first holding jig, a second holding jig comprising a second jig body and a second elastic member provided on a surface of the second jig body, the first holding jig, At least one of the second holding jigs is a holding jig according to the present invention, and the second elastic member has an adhesive force larger than that of the first elastic member. To do.
　この一組の保持治具における好適な一例は、前記第２保持治具がこの発明に係る保持治具である。 In a preferred example of the set of holding jigs, the second holding jig is the holding jig according to the present invention.
　前記課題を解決するための第４の手段であるこの発明に係る被粘着物保持装置は、この発明に係る一組の保持治具を備えていることを特徴する。 The adherend holding apparatus according to the present invention, which is a fourth means for solving the above-mentioned problems, is characterized by comprising a set of holding jigs according to the present invention.
　この発明に係る保持治具は、治具本体と、この治具本体の表面に設けられ、最大粗さＲｙが１．０～６．０μｍである弾性部材とを備えているから、被粘着物を弾性部材に押圧すると被粘着物の接触面が弾性部材の表面に密着して被粘着物が弾性部材に粘着保持され、一方、被粘着物を側方から押圧すると被粘着物の接触面が弾性部材の表面から剥がれて被粘着物が弾性部材から離脱する。 The holding jig according to the present invention includes a jig body and an elastic member provided on the surface of the jig body and having a maximum roughness Ry of 1.0 to 6.0 μm. When the elastic member is pressed, the contact surface of the adherend adheres to the surface of the elastic member, and the adherend is adhered to the elastic member. On the other hand, when the adherend is pressed from the side, the contact surface of the adherend is The object to be adhered is detached from the elastic member by peeling off from the surface of the elastic member.
　また、この発明に係る取扱治具はこの発明に係る保持治具を備えており、この発明に係る一組の保持治具は少なくとも１つのこの発明に係る保持治具を備えており、この発明に係る被粘着物保持装置はこの発明に係る一組の保持治具を備えている。 The handling jig according to the present invention includes the holding jig according to the present invention, and the set of holding jigs according to the present invention includes at least one holding jig according to the present invention. The to-be-adhered article holding device according to the present invention includes a set of holding jigs according to the present invention.
　したがって、この発明によれば、被粘着物を所望のように粘着保持できるにもかかわらず、粘着保持された被粘着物のほとんどすべてを容易に離脱させることのできる保持治具、取扱治具、一組の保持治具及び被粘着物保持装置を提供することができる。 Therefore, according to the present invention, a holding jig, a handling jig, which can easily remove almost all of the objects to be adhered, which can be easily adhered, even though the object to be adhered can be adhered and held as desired. A set of holding jigs and an object to be adhered holding device can be provided.
図１は、この発明に係る保持治具の一例である保持治具を示す概略斜視図である。FIG. 1 is a schematic perspective view showing a holding jig which is an example of a holding jig according to the present invention. 図２は、この発明に係る取扱治具の一例である取扱治具を示す概略正面図である。FIG. 2 is a schematic front view showing a handling jig as an example of the handling jig according to the present invention. 図３は、この発明に係る一組の保持治具の一例である一組の保持治具を示す概略図である。FIG. 3 is a schematic view showing a set of holding jigs as an example of a set of holding jigs according to the present invention. 図４は、この発明に係る被粘着物保持装置の一例である被粘着物保持装置を示す概略説明図である。FIG. 4 is a schematic explanatory view showing an adherend holding device which is an example of an adherend holding device according to the present invention. 図５は、この発明に係る被粘着物保持装置の一例である被粘着物保持装置において第１保持治具によりチップコンデンサ本体を懸垂保持した状態を示す概略説明図である。FIG. 5 is a schematic explanatory view showing a state in which the chip capacitor main body is suspended and held by the first holding jig in the adherend holding device which is an example of the adherend holding device according to the present invention. 図６は、この発明に係る被粘着物保持装置の一例である被粘着物保持装置において第１保持治具に電極が形成されたチップコンデンサ本体を懸垂保持した状態を示す概略説明図である。FIG. 6 is a schematic explanatory view showing a state in which a chip capacitor body in which an electrode is formed on a first holding jig is suspended and held in an adherend holding apparatus which is an example of an adherend holding apparatus according to the present invention. 図７は、この発明に係る被粘着物保持装置の一例である被粘着物保持装置において第１保持治具に懸垂保持されたチップコンデンサ本体を第２保持治具に押圧した状態を示す概略説明図である。FIG. 7 is a schematic illustration showing a state in which the chip capacitor body suspended from the first holding jig is pressed against the second holding jig in the adherend holding apparatus which is an example of the adherend holding apparatus according to the present invention. FIG. 図８は、この発明に係る被粘着物保持装置の一例である被粘着物保持装置において両端部に電極を塗設して成るチップコンデンサが第２保持治具に懸垂保持された状態を示す概略説明図である。FIG. 8 is a schematic view showing a state in which a chip capacitor formed by coating electrodes on both ends is suspended and held by a second holding jig in an adherend holding device which is an example of an adherend holding device according to the present invention. It is explanatory drawing.
　この発明に係る保持治具、取扱治具、一組の保持治具及び被粘着物保持装置に粘着保持される被粘着物は、これらに粘着保持される必要性のある被粘着物を製造可能な被粘着物用部材、例えば、小型器具用部材、小型機械要素用部材及び小型電子部品用部材等が挙げられる。また、被粘着物の製造には被粘着物の搬送工程等も含まれるから、被粘着物は、被粘着物そのもの、例えば、小型器具、小型機械要素及び小型電子部品等も含まれる。したがって、この発明においては、被粘着物と被粘着物用部材とは明確に区別される必要はない。これら被粘着物の中でも、この発明に係る保持治具、取扱治具、一組の保持治具及び被粘着物保持装置に粘着保持されるのに好適な被粘着物として、小型電子部品及び／又は小型電子部品用部材等が挙げられる。小型電子部品及び小型電子部品用部材としては、例えば、コンデンサチップ（チップコンデンサとも称されることがある。）、インダクタチップ、抵抗体チップ、ＦＰＣ、ウエハー等の完成品若しくは未完成品等、及び／又は、これらを製造可能な例えば、角柱体若しくは円柱体、一端部に鍔を有する角柱体若しくは円柱体、両端部に鍔を有する角柱体若しくは円柱体等が挙げられる。 The holding jig according to the present invention, the handling jig, the set of holding jigs, and the adherend to be adhered to the adherend holding apparatus can produce the adherend that needs to be adhered and held by them. Examples of such a member for an object to be adhered include a member for a small instrument, a member for a small machine element, a member for a small electronic component, and the like. Further, since the manufacture of the adherend includes a transporting process of the adherend, the adherend includes the adherend itself, for example, a small instrument, a small machine element, and a small electronic component. Therefore, in this invention, it is not necessary to distinguish clearly the to-be-adhered object and the member for to-be-adhered objects. Among these objects to be adhered, small electronic components and / or adhesive objects suitable for being adhesively held by the holding jig, the handling jig, the set of holding jigs, and the adherend holding apparatus according to the present invention Or the member for small electronic components etc. are mentioned. Examples of the small electronic component and the small electronic component member include a capacitor chip (also referred to as a chip capacitor), an inductor chip, a resistor chip, an FPC, a finished product such as a wafer, an unfinished product, and the like. For example, a prism or cylinder, a prism or cylinder having ridges at one end, a prism or cylinder having ridges at both ends, and the like can be used.
　この発明に係る保持治具は、治具本体と前記範囲の最大粗さＲｙの粘着性表面を有する弾性部材とを備えて成り、弾性部材の粘着性表面で被粘着物を所望のように粘着保持する一方、必要時に弾性部材に粘着保持された被粘着物を容易に取り外すことができる。この発明に係る保持治具に被粘着物を粘着保持するには弾性部材の粘着性表面に被粘着物を押圧する。そうすると、被粘着物の接触面で押圧された弾性部材の粘着性表面は、例えばその最大粗さＲｙを有する山部分が弾性変形して山谷部分が平坦化され、被粘着物の接触面に密着するから、被粘着物が弾性部材に粘着保持される。一方、この発明に係る保持治具に粘着保持された被粘着物を取り外すには被粘着物を側方から被粘着物が傾斜するように押圧する。そうすると、弾性変形した山部分が復元して粘着性表面が前記範囲の最大粗さＲｙになり、被粘着物の接触面が弾性部材の表面から容易に剥がれるから、被粘着物が弾性部材から離脱する。このように、弾性部材の粘着性表面が前記範囲の最大粗さＲｙを有していると、粘着性表面を高度に平坦にしなければ被粘着物を粘着保持できないという従来の技術常識に反して、被粘着物を押圧したときの高い粘着力と被粘着物の離脱性とを高い水準で両立でき、その結果、被粘着物を所望のように粘着保持できるにもかかわらず、そのほとんどすべてを容易に離脱できる。 A holding jig according to the present invention includes a jig body and an elastic member having an adhesive surface having a maximum roughness Ry within the above range, and adheres an object to be bonded to the adhesive surface of the elastic member as desired. On the other hand, the adherend to be adhered and held on the elastic member can be easily removed when necessary. In order to adhere and hold the adherend to the holding jig according to the present invention, the adherend is pressed against the adhesive surface of the elastic member. If it does so, the adhesive surface of the elastic member pressed by the contact surface of the to-be-adhered object will be elastically deformed, for example, the peak part which has the maximum roughness Ry, and a mountain-and-valley part will be flattened, and it will contact | adhere Therefore, the adherend is held by the elastic member. On the other hand, in order to remove the object to be adhered and held by the holding jig according to the present invention, the object to be adhered is pressed from the side so that the object to be adhered is inclined. Then, the elastically deformed peak portion is restored, and the adhesive surface becomes the maximum roughness Ry in the above range, and the contact surface of the adherend is easily peeled from the surface of the elastic member, so that the adherend is detached from the elastic member. To do. In this way, when the adhesive surface of the elastic member has the maximum roughness Ry in the above range, contrary to the conventional technical common sense that the object to be adhered cannot be adhered and held unless the adhesive surface is made highly flat. In addition, it is possible to achieve both a high level of adhesive strength when pressing the adherend and the ability to release the adherend at a high level. Easy to leave.
　この発明に係る保持治具の一例である保持治具を、図面を参照して、説明する。この保持治具１は、図１に示されるように、治具本体２と、治具本体２の表面に設けられた、被粘着物を粘着保持可能な粘着性表面を有する弾性部材３とを備えている。 A holding jig which is an example of a holding jig according to the present invention will be described with reference to the drawings. As shown in FIG. 1, the holding jig 1 includes a jig body 2 and an elastic member 3 provided on the surface of the jig body 2 and having an adhesive surface capable of sticking and holding an adherend. I have.
　治具本体２は、図１に示されるように、後述する弾性部材３を支持する。この治具本体２は、平滑な表面を有していればよく、弾性部材３を支持することができる限り種々の設計変更に基づく各種の形態にすることができる。例えば、この治具本体２は、図１に示されるように、その端縁近傍が弾性部材３の端縁から突出するように、弾性部材３よりも大きな寸法を有する盤状薄葉体に形成されている。この治具本体２は弾性部材３とほぼ同じ寸法の方形を成す盤状薄葉体に形成されていてもよい。 The jig body 2 supports an elastic member 3 to be described later, as shown in FIG. The jig body 2 only needs to have a smooth surface, and can have various forms based on various design changes as long as the elastic member 3 can be supported. For example, as shown in FIG. 1, the jig body 2 is formed in a disk-shaped thin leaf body having a size larger than that of the elastic member 3 so that the vicinity of the edge protrudes from the edge of the elastic member 3. ing. The jig body 2 may be formed in a disk-shaped thin leaf body having a square shape having substantially the same dimensions as the elastic member 3.
　治具本体２は、弾性部材３を支持可能な材料で形成されていればよく、例えば、ステンレス鋼及びアルミニウム等の金属製プレート、アルミニウム箔及び銅箔等の金属箔、ポリエステル、ポリテトラフルオロエチレン、ポリイミド、ポリフェニレンスルフィド、ポリアミド、ポリカーボネート、ポリスチレン、ポリプロピレン、ポリエチレン及びポリ塩化ビニル等の樹脂フィルム又は樹脂板等を挙げることができる。さらに、治具本体２はシート状物を複数積層して成る積層体とすることもできる。 The jig body 2 only needs to be formed of a material capable of supporting the elastic member 3. For example, a metal plate such as stainless steel and aluminum, a metal foil such as an aluminum foil and a copper foil, polyester, polytetrafluoroethylene And resin films or resin plates such as polyimide, polyphenylene sulfide, polyamide, polycarbonate, polystyrene, polypropylene, polyethylene, and polyvinyl chloride. Furthermore, the jig body 2 can be a laminated body formed by laminating a plurality of sheet-like materials.
　弾性部材３は、被粘着物の一平面に接して多数の被粘着物を粘着により保持することができるように設計され、例えば、図１に示されるように、治具本体２の表面に治具本体２よりも一回り小さな方形を成す盤状体に成形されている。この弾性部材３は、例えば、後述する粘着力を有する粘着性材料又はこの粘着性材料の硬化物で形成されており、表面全体が被粘着物を粘着保持可能な粘着性表面になっている。 The elastic member 3 is designed so as to be in contact with one surface of the object to be adhered and to hold a large number of objects to be adhered by adhesion. For example, as shown in FIG. It is formed into a disk-like body that forms a square that is slightly smaller than the tool body 2. The elastic member 3 is formed of, for example, an adhesive material having an adhesive force described later or a cured product of the adhesive material, and the entire surface is an adhesive surface that can hold the object to be adhered.
　弾性部材３の粘着性表面は、被粘着物の表面に接触して被粘着物を粘着保持するから被粘着物を粘着保持することのできる粘着力を有している。具体的には、弾性部材３は、通常、１～６０ｇ／ｍｍ２の粘着力を有しているのがよく、７～６０ｇ／ｍｍ２の粘着力を有しているのがよい。弾性部材３の粘着力は下記「信越ポリマー法」によって測定された値である。この方法においては、弾性部材３を水平に固定する吸着固定装置（例えば、商品名：電磁チャック、ＫＥＴ－１５３０Ｂ、カネテック（株）製）又は真空吸引チャックプレート等と、測定部先端に、直径１０ｍｍの円柱を成したステンレス鋼（ＳＵＳ３０４）製の接触子を取り付けたデジタルフォースゲージ（商品名：ＺＰ－５０Ｎ、（株）イマダ製）とを備えた荷重測定装置を用意し、この荷重測定装置における吸着固定装置又は真空吸引チャックプレート上に弾性部材３を固定し、測定環境を２１±１℃、湿度５０±５％に設定する。次いで、２０ｍｍ／ｍｉｎの速度で弾性部材３の被測定部位に接触するまで前記荷重測定装置に取り付けられた前記接触子を下降させ、次いで、この接触子を被測定部位に所定の荷重で被測定部に対して垂直に３秒間押圧する。ここで、前記所定の荷重を２５ｇ／ｍｍ２に設定する。次いで、１８０ｍｍ／ｍｉｎの速度で前記接触子を被測定部位から引き離し、このときに前記デジタルフォースゲージにより測定される引き離し荷重を読み取る。この操作を、被測定部位の複数箇所で行い、得られる複数の引き離し荷重を算術平均し、得られる算術平均値を弾性部材３の粘着力とする。 The adhesive surface of the elastic member 3 is in contact with the surface of the object to be adhered and adheres and holds the object to be adhered, and therefore has an adhesive force capable of adhering and holding the object to be adhered. Specifically, the elastic member 3 usually has an adhesive force of 1 to 60 g / mm 2 and preferably has an adhesive force of 7 to 60 g / mm 2 . The adhesive strength of the elastic member 3 is a value measured by the following “Shin-Etsu Polymer Method”. In this method, a suction fixing device (for example, trade name: electromagnetic chuck, KET-1530B, manufactured by Kanetech Co., Ltd.) or a vacuum suction chuck plate for fixing the elastic member 3 horizontally, and a diameter of 10 mm at the distal end of the measurement unit A load measuring device equipped with a digital force gauge (trade name: ZP-50N, manufactured by Imada Co., Ltd.) equipped with a stainless steel (SUS304) contactor having a cylindrical shape is prepared. The elastic member 3 is fixed on the suction fixing device or the vacuum suction chuck plate, and the measurement environment is set to 21 ± 1 ° C. and the humidity 50 ± 5%. Next, the contact attached to the load measuring device is lowered until it contacts the part to be measured of the elastic member 3 at a speed of 20 mm / min, and then the contact is measured at a predetermined load on the part to be measured. Press vertically for 3 seconds against the part. Here, the predetermined load is set to 25 g / mm 2 . Next, the contact is pulled away from the site to be measured at a speed of 180 mm / min, and the pulling load measured by the digital force gauge at this time is read. This operation is performed at a plurality of measurement sites, and the obtained plurality of separation loads are arithmetically averaged, and the obtained arithmetic average value is used as the adhesive force of the elastic member 3.
　弾性部材３は、粘着性表面の最大粗さＲｙ（ＪＩＳ　Ｂ　０６０１－１９９４）が１．０～６．０μｍである。弾性部材３の最大粗さＲｙが１．０μｍ未満であると、最大粗さを有する山部分が小さすぎて被粘着物の接触面に密着しすぎるから被粘着物の離脱性が悪く、一方、弾性部材３の最大粗さＲｙが６．０μｍを超えると、最大粗さを有する山部分が大きすぎて被粘着物を押圧して山部分が弾性変形しても粘着性表面の平坦性に劣るから被粘着物を高い粘着力で粘着保持できず、いずれにおいても、高い粘着力と被粘着物の離脱性とを高い水準で両立できない。高い粘着力と被粘着物の離脱性とをより一層高い水準で両立でき、この発明の目的をよく達成できる点で、最大粗さＲｙは１．０～５．０μｍであるのが好ましく、２．０～４．０μｍであるのが特に好ましい。最大粗さＲｙは、粘着性表面が被粘着物を粘着保持していない状態における最大粗さＲｙであって、ＪＩＳ　Ｂ　０６０１－１９９４に準拠して、カットオフ０．８ｍｍ、測定長さ２．４ｍｍ等の条件で少なくとも３箇所測定し、これらの算術平均値とする。最大粗さＲｙは後述する方法等によって調整することができる。 The elastic member 3 has an adhesive surface maximum roughness Ry (JIS B 0601-1994) of 1.0 to 6.0 μm. If the maximum roughness Ry of the elastic member 3 is less than 1.0 μm, the peak portion having the maximum roughness is too small and is too close to the contact surface of the object to be adhered, so that the detachment property of the object to be adhered is poor, When the maximum roughness Ry of the elastic member 3 exceeds 6.0 μm, even if the peak portion having the maximum roughness is too large and the to-be-adhered object is pressed and the peak portion is elastically deformed, the flatness of the adhesive surface is inferior. Therefore, the adherend cannot be held with high adhesive strength, and in either case, high adhesive strength and detachability of the adherend cannot be achieved at a high level. It is preferable that the maximum roughness Ry is 1.0 to 5.0 μm from the viewpoint that both high adhesive strength and releasability of the adherend can be achieved at a higher level and the object of the present invention can be achieved well. A thickness of 0.0 to 4.0 μm is particularly preferable. The maximum roughness Ry is the maximum roughness Ry in a state where the adhesive surface does not hold the object to be adhered, and in accordance with JIS B 0601-1994, the cutoff is 0.8 mm, the measurement length is 2. Measure at least three places under the condition of 4 mm, etc., and make these arithmetic average values. The maximum roughness Ry can be adjusted by a method described later.
　弾性部材３は、粘着性表面における凹凸の平均間隔Ｓｍ（ＪＩＳ　Ｂ０６０１－１９９４）が５．０～１５．０μｍであるのが好ましく、５．０～１１．０μｍであるのがより一層好ましく、６．０～１１．０μｍであるのが特に好ましい。粘着性表面の凹凸の平均間隔Ｓｍが前記範囲にあると、山部分と山部分（又は、谷部分と谷部分）との間隔が所望の間隔になるので山部分の弾性変形による粘着性表面の平坦性がより一層高くなって、この発明の目的をよく達成できる。粘着性表面の凹凸の平均間隔Ｓｍは、粘着性表面が被粘着物を粘着保持していない状態における凹凸の平均間隔Ｓｍであって、基本的にはＪＩＳ　Ｂ０６０１－１９９４に記載された測定方法に従って測定される。このとき、カットオフ波長は０．８ｍｍ、評価長さは２．４ｍｍ、カットオフ種別はガウシアン、少なくとも３点における算術平均値である。粘着性表面の凹凸の平均間隔Ｓｍは後述する方法等によって調整することができる。 The elastic member 3 preferably has an average interval Sm (JIS B0601-1994) of unevenness on the adhesive surface of 5.0 to 15.0 μm, and more preferably 5.0 to 11.0 μm. It is particularly preferably from 0 to 11.0 μm. When the average interval Sm of the unevenness of the adhesive surface is in the above range, the interval between the peak portion and the peak portion (or the valley portion and the valley portion) becomes a desired interval. The flatness is further enhanced, and the object of the present invention can be well achieved. The average interval Sm of the unevenness on the adhesive surface is the average interval Sm of the unevenness in a state where the adhesive surface does not hold the object to be adhered, and basically according to the measurement method described in JIS B0601-1994. Measured. At this time, the cutoff wavelength is 0.8 mm, the evaluation length is 2.4 mm, the cutoff type is Gaussian, and an arithmetic average value at least at three points. The average interval Sm of the unevenness on the adhesive surface can be adjusted by a method described later.
　弾性部材３は、この発明の目的をよく達成できる点で、粘着性表面の中心線平均粗さＲａ（ＪＩＳ　Ｂ　０６０１－１９９４）が０．１～０．５μｍであるのが好ましく、０．２～０．４μｍであるのが特に好ましい。粘着性表面の中心線平均粗さＲａは、粘着性表面が被粘着物を粘着保持していない状態における中心線平均粗さＲａであって、ＪＩＳ　Ｂ　０６０１－１９９４に準拠して、カットオフ０．８ｍｍ、測定長さ２．４ｍｍ等の条件で少なくとも３箇所測定し、これらの算術平均値とする。粘着性表面の中心線平均粗さＲａは後述する方法等によって調整することができる。 The elastic member 3 preferably has an adhesive surface centerline average roughness Ra (JIS B 0601-1994) of 0.1 to 0.5 μm in that the object of the present invention can be satisfactorily achieved. It is particularly preferable that the thickness is ˜0.4 μm. The centerline average roughness Ra of the adhesive surface is the centerline average roughness Ra when the adhesive surface does not hold the object to be adhered, and the cutoff is 0 according to JIS B 0601-1994. Measure at least three locations under the conditions of .8 mm, measurement length of 2.4 mm, etc., and use these arithmetic average values. The center line average roughness Ra of the adhesive surface can be adjusted by a method described later.
　弾性部材３は、この発明の目的をよく達成できる点で、粘着性表面の十点平均粗さＲｚ（ＪＩＳ　Ｂ　０６０１－１９９４）が１．０～５．０μｍであるのが好ましく、２．０～４．０μｍであるのが特に好ましい。粘着性表面の十点平均粗さＲｚは、粘着性表面が被粘着物を粘着保持していない状態における十点平均粗さＲｚであって、ＪＩＳ　Ｂ　０６０１－１９９４に準拠して、カットオフ０．８ｍｍ、測定長さ２．４ｍｍ等の条件で少なくとも３箇所測定し、これらの算術平均値とする。粘着性表面の十点平均粗さＲｚは後述する方法等によって調整することができる。 The elastic member 3 preferably has a ten-point average roughness Rz (JIS B 0601-1994) of an adhesive surface of 1.0 to 5.0 μm in that the object of the present invention can be satisfactorily achieved. It is particularly preferred that the thickness is ˜4.0 μm. The ten-point average roughness Rz of the adhesive surface is the ten-point average roughness Rz in a state where the adhesive surface does not hold the object to be adhered, and has a cutoff of 0 in accordance with JIS B 0601-1994. Measure at least three locations under the conditions of .8 mm, measurement length of 2.4 mm, etc., and use these arithmetic average values. The ten-point average roughness Rz of the adhesive surface can be adjusted by a method described later.
　弾性部材３は、粘着性表面の最大粗さＲｙ、凹凸の平均間隔Ｓｍ、中心線平均粗さＲａ及び十点平均粗さＲｚそれぞれは次の方法で調整できる。例えば、弾性部材３の粘着性表面を公知の粗面化処理、例えば、サンドブラスト処理等で表面処理する方法、公知の粗面化処理で表面処理されたキャビティ内面を有する成形金型を用いて弾性部材３を成形する方法、弾性部材３又は弾性部材３を形成する粘着性材料に粒状物を含有させる方法等が挙げられる。 The elastic member 3 can adjust the maximum roughness Ry of the sticky surface, the average interval Sm of the unevenness, the center line average roughness Ra, and the ten-point average roughness Rz by the following methods. For example, a method of surface-treating the adhesive surface of the elastic member 3 by a known roughening treatment, for example, sand blasting or the like, and elasticity using a molding die having a cavity inner surface that has been surface-treated by a known roughening treatment. The method of shape | molding the member 3, the method of making the adhesive material which forms the elastic member 3 or the elastic member 3 contain a granular material, etc. are mentioned.
　弾性部材３又は弾性部材３を形成する粘着性材料に粒状物を含有させる方法（以下、この発明に係る表面粗面化方法と称する。）を簡単に説明する。この発明に係る表面粗面化方法に用いる粒状物は、粒子であればその形状、材質等は特に限定されず、例えば、公知の粒子状充填剤等が挙げられる。 A method of incorporating a granular material into the elastic member 3 or the adhesive material forming the elastic member 3 (hereinafter referred to as a surface roughening method according to the present invention) will be briefly described. If the granular material used for the surface roughening method concerning this invention is a particle | grain, the shape, material, etc. will not be specifically limited, For example, a well-known particulate filler etc. are mentioned.
　このような基準を満たす粒状物として、例えば、シリカ系充填材等の無機充填剤が挙げられる。シリカ系充填材としては、例えば、ヒュームドシリカ、焼成シリカ等の乾式法により合成されたシリカ、沈降シリカ、シリカゲル等の湿式法により合成されたシリカを挙げることができる。これらの中でも、ヒュームドシリカ、沈降シリカが好ましい。 Examples of the granular material satisfying such a standard include inorganic fillers such as silica-based fillers. Examples of the silica-based filler include silica synthesized by a dry method such as fumed silica and calcined silica, and silica synthesized by a wet method such as precipitated silica and silica gel. Among these, fumed silica and precipitated silica are preferable.
　粒状物は、シリカ系充填材であるか否かを問わず、その表面が有機物で被覆されているのが凝集しにくく弾性部材３中にほぼ均一に分散する点で、好ましい。粒状物を被覆する有機物は、低分子有機化合物でもよいが、混合時の分散性の点で有機樹脂であるのが好ましい。有機樹脂としては、例えば、ポリエチレン、ポリプロピレン、ポリスチレン、ポリエステル、フッ素樹脂（例えば、ポリテトラフルオロエチレン）、ポリイミド、ポリフェニレンスルフィド、ポリアミド、ポリカーボネート等が挙げられる。これらの中でも有機樹脂は高い耐熱性及び耐久性を発揮するものが好ましい。このような有機物被覆粒状物として、例えば、ポリエチレン被覆シリカ等が挙げられる。 Regardless of whether the particles are silica-based fillers, it is preferable that the surface thereof is coated with an organic material because it hardly aggregates and is dispersed almost uniformly in the elastic member 3. The organic substance covering the particulate matter may be a low molecular organic compound, but is preferably an organic resin from the viewpoint of dispersibility during mixing. Examples of the organic resin include polyethylene, polypropylene, polystyrene, polyester, fluororesin (for example, polytetrafluoroethylene), polyimide, polyphenylene sulfide, polyamide, polycarbonate, and the like. Among these, organic resins that exhibit high heat resistance and durability are preferable. As such an organic substance covering granular material, polyethylene covering silica etc. are mentioned, for example.
　粒状物は、シリカ系充填材であるか否かを問わず、弾性部材３中にほぼ均一に分散して、最大粗さＲｙ、凹凸の平均間隔Ｓｍ、中心線平均粗さＲａ及び十点平均粗さＲｚのうち少なくとも最大粗さＲｙを前記範囲に調整できる点で、その平均粒径が３～３０μｍであるのが好ましく、３～２０μｍであるのがより一層好ましく、５～１０μｍであるのが特に好ましい。平均粒径の測定方法は二次粒子径ｄ５０（レーザー法）に準拠する。 Regardless of whether the granular material is a silica-based filler, the granular material is almost uniformly dispersed in the elastic member 3, and the maximum roughness Ry, the average interval Sm of unevenness, the centerline average roughness Ra, and the ten-point average The average particle diameter is preferably 3 to 30 μm, more preferably 3 to 20 μm, and more preferably 5 to 10 μm in that at least the maximum roughness Ry of the roughness Rz can be adjusted to the above range. Is particularly preferred. The measuring method of the average particle diameter is based on the secondary particle diameter d50 (laser method).
　粒状物は、シリカ系充填材であるか否かを問わず、弾性部材３中にほぼ均一に分散して、最大粗さＲｙ、凹凸の平均間隔Ｓｍ、中心線平均粗さＲａ及び十点平均粗さＲｚのうち少なくとも最大粗さＲｙを前記範囲に調整できる点で、弾性部材３を形成するゴム又は樹脂１００質量部に対して、１～２５質量部の割合で弾性部材３に含有されているのが好ましく、３～２５質量部の割合で弾性部材３に含有されているのが特に好ましい。なお、この粒状物を弾性部材３に含有させるには弾性部材３を形成する粘着性材料に粒状物を添加させる方法等が挙げられる。 Regardless of whether the granular material is a silica-based filler, the granular material is almost uniformly dispersed in the elastic member 3, and the maximum roughness Ry, the average interval Sm of unevenness, the centerline average roughness Ra, and the ten-point average It is contained in the elastic member 3 at a ratio of 1 to 25 parts by mass with respect to 100 parts by mass of rubber or resin forming the elastic member 3 in that at least the maximum roughness Ry of the roughness Rz can be adjusted to the above range. It is preferable that the elastic member 3 contains 3 to 25 parts by mass. In addition, the method of adding a granular material to the adhesive material which forms the elastic member 3 etc. is mentioned to make this elastic material contain in the elastic member 3.
　弾性部材３は、その粘着性表面の硬度（ＪＩＳ　Ｋ６２５３［デュロメータＡ］）が５～５０であるのが好ましく、３０～５０であるのが特に好ましい。粘着性表面が前記硬度の範囲内にあると、粘着性表面に被粘着物を押圧して粘着保持させるときに、粘着性表面、特にその山部分が容易に弾性変形して粘着性表面がより一層平坦化され、被粘着物の接触面がより強固に密着されるうえ、被粘着物の損傷及び破損等を防止できる。なお、弾性部材３の硬度は粒状物の含有量等によって調整することができる。 The elastic member 3 preferably has a sticky surface hardness (JIS K6253 [durometer A]) of 5 to 50, particularly preferably 30 to 50. When the adhesive surface is within the above hardness range, when the object to be adhered is pressed and held on the adhesive surface, the adhesive surface, in particular, the crest portion thereof is easily elastically deformed so that the adhesive surface is more It is further flattened so that the contact surface of the adherend is more firmly adhered, and damage or breakage of the adherend can be prevented. In addition, the hardness of the elastic member 3 can be adjusted with content of a granular material, etc.
　弾性部材３は、０．０５～５ｍｍ程度の厚さを有するのが好ましい。この弾性部材３の厚さが０．０５ｍｍ未満であると、弾性部材３の機械的強度が低下し、弾性部材３の耐久性が十分でないことがあり、一方、５ｍｍを越えると、弾性部材３が弾性変形しにくくなり、被粘着物を弾性部材３から容易に取り外すことができなくなることがある。 The elastic member 3 preferably has a thickness of about 0.05 to 5 mm. If the thickness of the elastic member 3 is less than 0.05 mm, the mechanical strength of the elastic member 3 is lowered, and the durability of the elastic member 3 may not be sufficient. On the other hand, if the thickness exceeds 5 mm, the elastic member 3 May not be easily elastically deformed, and the adherend may not be easily removed from the elastic member 3 in some cases.
　弾性部材３は、接着剤層若しくはプライマー層によって、弾性部材３の粘着力によって、又は、固定具等によって、治具本体２の表面に固定されていればよく、保持治具１において、弾性部材３は接着剤層若しくはプライマー層を介して治具本体２の表面に固定されている。 The elastic member 3 may be fixed to the surface of the jig body 2 by an adhesive layer or a primer layer, by the adhesive force of the elastic member 3, or by a fixture or the like. 3 is fixed to the surface of the jig body 2 via an adhesive layer or a primer layer.
　弾性部材３は、前記粘着力を発揮することのできる粘着性材料又はこの粘着性材料の硬化物で形成されていればよく、粘着材料として、例えば、フッ素系樹脂又はフッ素系ゴム、フッ素系樹脂又はフッ素系ゴムを含有するフッ素系組成物、シリコーン樹脂又はシリコーンゴム、シリコーン樹脂又はシリコーンゴムを含有するシリコーン組成物、ウレタン系エラストマー、天然ゴム、スチレン－ブタジエン共重合エラストマー等の各種エラストマー等が挙げられる。この中でも、シリコーンゴム、及び／又は、シリコーンゴムを含有する付加反応硬化型粘着性シリコーン組成物及び過酸化物硬化型粘着性シリコーン組成物が好ましい。前記付加反応硬化型粘着性シリコーン組成物としては、例えば、特開２００８－０９１６５９号公報に記載の、シリコーン生ゴム（ａ）と架橋成分（ｂ）と粘着力向上剤（ｃ）と触媒（ｄ）とシリカ系充填材（ｅ）とを含有する粘着性組成物を挙げることができる。前記過酸化物硬化型粘着性シリコーン組成物としては、例えば、特開２００８－０９１６５９号公報に記載の、シリコーン生ゴム（ａ）と粘着力向上剤（ｃ）とシリカ系充填材（ｅ）と有機過酸化物（ｆ）とを含有する粘着性組成物を挙げることができる。粘着性材料は適宜の条件で硬化される。なお、この発明に係る表面粗面化方法によって最大粗さＲｙを前記範囲内に調整するには、これらの粘着性材料には粒状物が所定量含まれている。 The elastic member 3 only needs to be formed of an adhesive material capable of exerting the adhesive force or a cured product of this adhesive material. Examples of the adhesive material include a fluorine resin, a fluorine rubber, and a fluorine resin. Or a fluorine-containing composition containing a fluorine-based rubber, a silicone resin or silicone rubber, a silicone composition containing a silicone resin or a silicone rubber, a urethane-based elastomer, a natural rubber, various elastomers such as a styrene-butadiene copolymer elastomer, etc. It is done. Among these, addition reaction curable adhesive silicone compositions and peroxide curable adhesive silicone compositions containing silicone rubber and / or silicone rubber are preferred. Examples of the addition reaction curable adhesive silicone composition include silicone raw rubber (a), crosslinking component (b), adhesion improver (c), and catalyst (d) described in JP-A-2008-091659. And a pressure-sensitive adhesive composition containing silica-based filler (e). Examples of the peroxide curable adhesive silicone composition include, for example, a silicone raw rubber (a), an adhesion improver (c), a silica filler (e), and an organic material described in JP-A-2008-091659. Mention may be made of an adhesive composition containing a peroxide (f). The adhesive material is cured under appropriate conditions. In order to adjust the maximum roughness Ry within the above range by the surface roughening method according to the present invention, these adhesive materials contain a predetermined amount of particulate matter.
　この保持治具１は、弾性部材３の粘着性表面が前記範囲の最大粗さＲｙを有しているから、前記したように、互いにそう反する特性である、被粘着物を押圧したときの高い粘着力と被粘着物の離脱性とを両立して、この発明の目的をよく達成できる。また、保持治具１の粘着性表面はその全面が粘着性を有しており、必要時に被粘着物を容易に粘着保持するから被粘着物の粘着保持位置を高精度に位置決めする必要がなく、生産性及び取扱性に極めて優れる。 Since the adhesive surface of the elastic member 3 has the maximum roughness Ry in the above range, the holding jig 1 has a characteristic that is opposite to each other as described above. The object of the present invention can be satisfactorily achieved while achieving both adhesive strength and detachability of the adherend. In addition, the entire sticky surface of the holding jig 1 is sticky, and it is easy to stick and hold the adherend when necessary, so there is no need to position the sticking holding position of the sticky object with high precision. Excellent in productivity and handling.
　この発明に係る取扱治具について説明する。この発明に係る取扱治具は、この発明に係る保持治具と、この保持治具における弾性部材の表面に沿って相対的に移動して粘着保持された被粘着物を脱離させる脱離具とを備えている。この発明に係る取扱治具は、例えば、複数の被粘着物を製造、搬送、収納又は検査等するために一旦粘着保持し、その後、粘着保持された被粘着物を取り外すときに、好適に使用される。この発明に係る取扱治具における保持治具は前記した通りであり、例えば、保持治具１等が挙げられる。 The handling jig according to the present invention will be described. A handling jig according to the present invention includes a holding jig according to the present invention, and a detaching tool for detaching an object to be adhered that is relatively moved along the surface of the elastic member in the holding jig. And. The handling jig according to the present invention is preferably used when, for example, a plurality of objects to be adhered are temporarily adhered and held in order to manufacture, transport, store, or inspect, and then the objects to be adhered that are adhered are removed. Is done. The holding jig in the handling jig according to the present invention is as described above, and examples thereof include the holding jig 1 and the like.
　この発明に係る取扱治具における脱離具は、保持治具における弾性部材の表面に沿って保持治具に対して相対的に移動して、この保持治具に粘着保持された被粘着物を脱離させることができる形態を有していればよく、例えば、保持治具に粘着保持された被粘着物に衝突してこの被粘着物を押圧することができる被衝突部を有する脱離具が好適に挙げられる。このような脱離具として、例えば、その先端が前記被衝突部として機能する転倒配置された三角柱状のブレードであってもよく、また、自身が前記被衝突部として機能するワイヤー等であってもよい。この発明に係る取扱治具における脱離具は、保持治具における弾性部材の表面に接触状態又は非接触状態で相対的に移動し、好ましくは非接触状態で相対的に移動する。 The detachment tool in the handling jig according to the present invention moves relative to the holding jig along the surface of the elastic member in the holding jig, and removes the object to be adhered and held on the holding jig. It only needs to have a form that can be detached, for example, a detachable tool having a collision part that can collide with an object to be adhered and held by a holding jig and press the object to be adhered. Are preferable. Such a detachable tool may be, for example, a triangular prism-shaped blade with its tip functioning as the impacted part, or a wire itself functioning as the impacted part. Also good. The detachment tool in the handling jig according to the present invention relatively moves in a contact state or a non-contact state on the surface of the elastic member in the holding jig, and preferably moves relatively in a non-contact state.
　この発明に係る取扱治具の一例である取扱治具４は、保持治具１と脱離具５とを備えている。保持治具１は前記した通りであり、脱離具５は、例えば、図２に示されるように、転倒配置された三角柱状を成し、その先端が前記被衝突部として機能するブレードである。この脱離具５は、その延在方向の長さ、すなわち、三角柱の高さが、保持治具１の弾性部材３に一列に粘着保持された複数の被粘着物を一挙に脱離させることができる点で、弾性部材３の長さよりも長くなっているのがよい。なお、脱離具５の先端は被粘着物に衝突する被衝突部として機能するから、被粘着物への傷付き防止等を目的として弾性材料で形成又は被覆されてもよい。 A handling jig 4 which is an example of a handling jig according to the present invention includes a holding jig 1 and a detaching tool 5. The holding jig 1 is as described above, and the detaching tool 5 is, for example, a blade that has a triangular prism shape that is overturned as shown in FIG. 2, and whose tip functions as the colliding part. . The detaching tool 5 has a length in the extending direction, that is, a height of the triangular prism, detaches a plurality of objects to be adhered that are adhered and held in a row on the elastic member 3 of the holding jig 1 at a time. It is preferable that the length of the elastic member 3 is longer than that of the elastic member 3. Since the tip of the detachment tool 5 functions as a collision target that collides with the adherend, it may be formed or covered with an elastic material for the purpose of preventing damage to the adherend.
　この発明に係る取扱治具を用いて被粘着物を取扱う取扱方法の一例（以下、一取扱方法と称することがある。）を、取扱治具４を例にして、説明する。この一取扱方法は、被粘着物が粘着保持された保持治具１の粘着性表面に沿って脱離具を相対的に移動させて被粘着物を取り外す脱離工程を有し、好ましくは被粘着物を保持治具１における弾性部材３の粘着性表面に押圧して粘着保持させる保持工程を有する。すなわち、この一取扱方法は、被粘着物を粘着保持し、粘着保持した被粘着物を取り外す方法である。 An example of a handling method for handling an adherend using the handling jig according to the present invention (hereinafter sometimes referred to as one handling method) will be described by taking the handling jig 4 as an example. This one handling method includes a detaching step of removing the object to be adhered by moving the detachment tool relatively along the adhesive surface of the holding jig 1 on which the object to be adhered is adhesively held. A holding step of pressing and holding the pressure-sensitive adhesive against the adhesive surface of the elastic member 3 in the holding jig 1; That is, this one handling method is a method of sticking and holding the adherend and removing the sticky object that has been sticky-held.
　前記粘着工程は、被粘着物を弾性部材３の粘着性表面に押圧して粘着保持させる工程である。取扱治具４の保持治具１に被粘着物を起立状態に保持するには、弾性部材３上に複数の被粘着物を起立状態で所定のパターンに配列し、その底面を保持治具１における弾性部材３の粘着性表面に押圧する。そうすると、被粘着物の底面が粘着性表面に圧接して、前記したように、弾性部材３の山部分が弾性変形して粘着性表面が平坦化され、粘着性表面の粘着力で複数の被粘着物が弾性部材３に粘着保持される。被粘着物をこのようにして粘着保持する方法として、例えば特開２００８－０９１６５９号公報に記載された方法等が挙げられる。具体的には、被粘着物の軸線長さよりも薄い厚さを有し、被粘着物が通過可能な複数の配設孔が形成された立設配置板を弾性部材３に載置した状態で、配設孔に被粘着物を挿入し、次いで、例えば平坦な板状部材等を用いて、この被粘着物の自由端を弾性部材３に向けて押圧すると、被粘着物が弾性部材３に粘着保持される。 The adhesion process is a process of pressing and holding an object to be adhered to the adhesive surface of the elastic member 3 for adhesion. In order to hold the adherend in an upright state on the holding jig 1 of the handling jig 4, a plurality of adherends are arranged in a predetermined pattern on the elastic member 3, and the bottom surface is held on the holding jig 1. Is pressed against the adhesive surface of the elastic member 3. Then, the bottom surface of the adherend is pressed against the adhesive surface, and as described above, the crest portion of the elastic member 3 is elastically deformed and the adhesive surface is flattened. The pressure-sensitive adhesive is held on the elastic member 3 by sticking. Examples of the method for sticking and holding the adherend in this way include the method described in Japanese Patent Application Laid-Open No. 2008-091659. Specifically, in a state in which the standing arrangement plate having a thickness thinner than the axial length of the adherend and having a plurality of arrangement holes through which the adherend can pass is placed on the elastic member 3. When the adherend is inserted into the arrangement hole and then the free end of the adherend is pressed toward the elastic member 3 using, for example, a flat plate-like member, the adherend is applied to the elastic member 3. Adhesion is retained.
　この一取扱方法において、保持治具１に粘着保持された被粘着物を取り外すには、脱離具５を保持治具１の粘着性表面に沿って相対的に移動させて被粘着物を側方に押圧する。具体的には、脱離具５を保持治具１の粘着性表面近傍に非接触となるように配置する。このとき、脱離具５は保持治具１の表面に接触させなくても、この発明に係る保持治具であれば被粘着物を所望のように脱離させることができる。このように配置された脱離具５を粘着性表面に沿って相対的に前進移動すなわち被粘着物側に移動させる。そうすると、脱離具５は、その先端が被粘着物の側面に当接して、被粘着物を前記方向すなわち側方に押圧して傾斜させ、弾性変形した山部分が復元して粘着性表面が前記範囲の最大粗さＲｙになって、被粘着物の接触面が弾性部材３の粘着性表面から剥がれる。このようして、脱離具５で押圧された被粘着物は保持治具１の弾性部材３から脱離する。このようにして、取扱治具４によれば粘着保持した被粘着物のほとんどすべてを脱離させることができる。 In this one handling method, in order to remove the object to be adhered and held by the holding jig 1, the removal tool 5 is relatively moved along the adhesive surface of the holding jig 1 to move the object to be adhered to the side. Press toward. Specifically, the detachment tool 5 is disposed in the vicinity of the adhesive surface of the holding jig 1 so as to be non-contact. At this time, even if the detaching tool 5 is not brought into contact with the surface of the holding jig 1, the adherend can be detached as desired with the holding jig according to the present invention. The detachment tool 5 arranged in this way is moved relatively forward along the adhesive surface, that is, moved to the adherend side. Then, the tip of the detachment tool 5 comes into contact with the side surface of the object to be adhered, and the object to be adhered is pressed and inclined in the above-mentioned direction, that is, the side. The contact surface of the adherend is peeled off from the adhesive surface of the elastic member 3 at the maximum roughness Ry in the above range. In this way, the adherend pressed by the removal tool 5 is detached from the elastic member 3 of the holding jig 1. In this way, according to the handling jig 4, almost all of the adherend to be adhered can be detached.
　なお、特許文献２に記載の方法は「ブレードの先端により粘着層を凹ませ、その状態でブレードを粘着層表面方向に相対的に移動させる」方法であり、また、特許文献３に記載の方法は「掻取り手段を前記粘着材層の表面に沿って、かつ、前記非粘着部分又は前記低粘着部分が移動方向終端にくるような方向に移動させ、電子部品を粘着材層から掻き取る方法」であるが、小型部品掻き取り部材を弾性材表面上に摺動させても、被粘着物が転倒して再度粘着層表面に粘着されてしまい、小型部品を容易に取り外すことができないことがある。また、掻き取り部材を弾性材表面上に摺動させると、特に、被粘着物を確実に取り外す目的で、掻き取り部材を弾性材表面上に強く押し当てて摺動させ、又は、掻き取り部材を勢いよく弾性材表面上に摺動させると、小型部品掻き取り部材によって弾性材表面に傷が付き、損傷することがある。これに対して、この発明に係る取扱治具は離脱性に優れたこの発明に係る保持治具を備えているから、被粘着物が転倒したとしても粘着性表面に強く押圧されない限り再粘着することはなく、粘着保持されている被粘着物のほとんどすべてを再粘着させることなく容易に弾性部材３から離脱させることができるうえ、離脱具５を粘着性表面上を摺動させることも押し当てる必要もない。したがって、この発明に係る取扱治具は離脱具による弾性部材特に粘着性表面の損傷を高度に防止できる。 The method described in Patent Document 2 is a method of “depressing the adhesive layer with the tip of the blade and moving the blade relative to the surface of the adhesive layer in that state”, and the method described in Patent Document 3 "A method of scraping the electronic component from the adhesive material layer by moving the scraping means along the surface of the adhesive material layer and moving the non-adhesive part or the low adhesive part to the end of the moving direction." However, even if the small component scraping member is slid on the surface of the elastic material, the adherend falls down and is again adhered to the surface of the adhesive layer, and the small component cannot be easily removed. is there. Further, when the scraping member is slid on the surface of the elastic material, the scraping member is slid by pressing strongly against the surface of the elastic material, particularly for the purpose of reliably removing the adherend. If the surface of the elastic material is slid on the elastic material surface, the elastic material surface may be damaged by the small component scraping member. On the other hand, since the handling jig according to the present invention includes the holding jig according to the present invention having excellent detachability, even if the adherend falls down, it re-adheres unless it is strongly pressed against the adhesive surface. In addition, almost all of the objects to be adhered can be easily detached from the elastic member 3 without re-adhesion, and the detaching tool 5 is also pressed against the adhesive surface. There is no need. Therefore, the handling jig according to the present invention can highly prevent damage to the elastic member, particularly the adhesive surface, caused by the detachment tool.
　このように、この発明に係る保持治具、及び、この発明に係る取扱治具は、多数の被粘着物を所望のように粘着保持できるうえ、保持治具に粘着保持した被粘着物のほとんどすべてを容易に脱離させることができる。したがって、この発明に係る保持治具、及び、この発明に係る取扱治具は、例えば、被粘着物の製造工程、散在した被粘着物の回収等に好適に用いられる。 As described above, the holding jig according to the present invention and the handling jig according to the present invention can adhere and hold a large number of objects to be adhered as desired, and most of the objects to be adhered which are adhered to the holding jig. All can be easily desorbed. Therefore, the holding jig according to the present invention and the handling jig according to the present invention are suitably used for, for example, a manufacturing process of an adherend and a recovery of scattered adherends.
　この発明に係る一組の保持治具を、図を参照して、説明する。この発明に係る一組の保持治具は、第１治具本体と前記第１治具本体の表面に設けられた第１弾性部材を備えて成る第１保持治具と、第２治具本体と前記第２治具本体の表面に設けられた第２弾性部材を備えて成る第２保持治具とを備え、第１保持治具及び第２保持治具の少なくとも一方はこの発明に係る保持治具であり、かつ、第２弾性部材は第１の弾性部材の粘着力よりも大きな粘着力を有している。この発明に係る一組の保持治具において、第１保持治具及び第２保持治具のうち第２保持治具がこの発明に係る保持治具であるのが好ましく、第１保持治具及び第２保持治具の双方がこの発明に係る保持治具であるのが特に好ましい。この発明に係る一組の保持治具において第１保持治具及び第２保持治具は粘着力以外は基本的に同様に構成されていてもよい。この発明に係る一組の保持治具は、例えば、複数の被粘着物の両端部に順次所定の処理を施して被粘着物を製造等するために、一方の保持治具に粘着保持した被粘着物を他方の保持治具に移し替えた後、移し替えた被粘着物を取り外すときに、好適に使用される。 A set of holding jigs according to the present invention will be described with reference to the drawings. A set of holding jigs according to the present invention includes a first holding jig including a first jig main body and a first elastic member provided on a surface of the first jig main body, and a second jig main body. And a second holding jig comprising a second elastic member provided on the surface of the second jig main body, and at least one of the first holding jig and the second holding jig is the holding according to the present invention. The second elastic member is a jig and has an adhesive force larger than that of the first elastic member. In the set of holding jigs according to the present invention, of the first holding jig and the second holding jig, the second holding jig is preferably the holding jig according to the present invention. It is particularly preferable that both of the second holding jigs are the holding jigs according to the present invention. In the set of holding jigs according to the present invention, the first holding jig and the second holding jig may be basically configured similarly except for adhesive force. A set of holding jigs according to the present invention includes, for example, a substrate that is adhesively held on one holding jig in order to manufacture an object to be bonded by sequentially performing predetermined processing on both ends of a plurality of objects to be bonded. It is preferably used when the transferred object is removed after the adhesive is transferred to the other holding jig.
　この発明に係る一組の保持治具の一例である一組の保持治具６は、図３に示されるように、第１治具本体２Ａと、この第１治具本体２Ａの表面に設けられ、被粘着物を粘着保持可能な第１弾性部材３Ａを備えて成る第１保持治具１Ａと、第２治具本体２Ｂと、この第２治具本体２Ｂの表面に設けられ、被粘着物を粘着保持可能な第２弾性部材３Ｂを備えて成る第２保持治具１Ｂとを備えている。第１保持治具１Ａ及び第２保持治具１Ｂは保持治具１と基本的に同様に構成されている。 As shown in FIG. 3, a set of holding jigs 6 as an example of a set of holding jigs according to the present invention is provided on the surface of the first jig main body 2A and the first jig main body 2A. Provided on the surface of the first holding jig 1A, the second jig main body 2B, and the second jig main body 2B. And a second holding jig 1B including a second elastic member 3B capable of sticking and holding an object. The first holding jig 1A and the second holding jig 1B are basically configured in the same manner as the holding jig 1.
　第１保持治具１Ａ及び第２保持治具１Ｂにおいて、第１弾性部材３Ａと第２弾性部材３Ｂとは、被粘着物を粘着保持することのできる粘着力、通常、１～６０ｇ／ｍｍ２の粘着力（前記「信越ポリマー法」による）を有しているのがよく、７～６０ｇ／ｍｍ２の粘着力を有しているのがよい。 In the first holding jig 1A and the second holding jig 1B, the first elastic member 3A and the second elastic member 3B are capable of adhering and holding an adherend, usually 1 to 60 g / mm 2. It is preferable to have an adhesive strength of 7 to 60 g / mm 2 (according to the “Shin-Etsu Polymer Method”).
　そして、第２保持治具１Ｂにおける第２弾性部材３Ｂは、第１弾性部材３Ａの粘着力よりも大きな粘着力を有している。第１弾性部材３Ａ及び第２弾性部材３Ｂがこのような粘着力の関係を有することにより、第１保持治具１Ａにおける第１弾性部材３Ａから第２保持治具１Ｂにおける第２弾性部材３Ｂに被粘着物を移し替えることができる。第１弾性部材３Ａから第２弾性部材３Ｂに被粘着物を脱落することなくスムーズに移し替えることができる点で、第１弾性部材３Ａと第２弾性部材３Ｂとの粘着力（前記「信越ポリマー法」による）の差は１５～４３ｇ／ｍｍ２であるのが好ましく、１８～３５ｇ／ｍｍ２であるのがより一層好ましく、２０～３０ｇ／ｍｍ２であるのが特に好ましい。各第１弾性部材３Ａ及び３Ｂの粘着力は粘着力向上剤の含有量及び粒状物の含有量等によって調整することができる。 And the 2nd elastic member 3B in the 2nd holding jig 1B has a larger adhesive force than the adhesive force of the 1st elastic member 3A. Since the first elastic member 3A and the second elastic member 3B have such an adhesive force relationship, the first elastic member 3A in the first holding jig 1A is changed to the second elastic member 3B in the second holding jig 1B. The adherend can be transferred. The adhesive force between the first elastic member 3A and the second elastic member 3B (referred to as “Shin-Etsu Polymer”) can be smoothly transferred from the first elastic member 3A to the second elastic member 3B without dropping off. The difference of “by method” is preferably 15 to 43 g / mm 2 , more preferably 18 to 35 g / mm 2 , and particularly preferably 20 to 30 g / mm 2 . The adhesive strength of each of the first elastic members 3A and 3B can be adjusted by the content of the adhesive strength improver, the content of granular materials, and the like.
　一組の保持治具６において、第１保持治具１Ａ及び第２保持治具１Ｂはいずれも保持治具１とされ、換言すると、第１保持治具１Ａにおける第１弾性部材３Ａ及び第２保持治具１Ｂにおける第２弾性部材３Ｂのいずれも前記範囲の最大粗さＲｙを有している。第１保持治具１Ａ及び第２保持治具１Ｂのいずれも保持治具１であると、多数の被粘着物を所望のように粘着保持できるうえ、第１保持治具１Ａの第１弾性部材３Ａから第２保持治具１Ｂの第２弾性部材３Ｂへと、粘着保持されたほとんどすべての被粘着物をその粘着保持された起立状態を維持したままに、移し替えることができる。 In the set of holding jigs 6, the first holding jig 1 </ b> A and the second holding jig 1 </ b> B are both the holding jig 1, in other words, the first elastic member 3 </ b> A and the second elastic member 3 </ b> A in the first holding jig 1 </ b> A. Each of the second elastic members 3B in the holding jig 1B has the maximum roughness Ry in the above range. When both the first holding jig 1A and the second holding jig 1B are the holding jig 1, it is possible to stick and hold a large number of objects to be adhered as desired, and the first elastic member of the first holding jig 1A. From 3A to the second elastic member 3B of the second holding jig 1B, it is possible to transfer almost all of the objects to be adhered and maintained while maintaining the adhesively held upright state.
　この発明に係る被粘着物保持装置について説明する。この発明に係る被粘着物保持装置はこの発明に係る一組の保持治具を備えている。この発明に係る被粘着物保持装置の一例である被粘着物保持装置を、図を参照して、説明する。図４に示されるように、被粘着物保持装置１０は、第１保持治具１Ａ及び第２保持治具１Ｂを含む一組の保持治具を備え、被粘着物を粘着保持すると共に第１保持治具１Ａから第２保持治具１Ｂに被粘着物を移し替えることのできる装置である。被粘着物保持装置１０が備える一組の保持治具は一組の保持治具６と同様に構成されている。 The adherend holding device according to the present invention will be described. An adherend holding device according to the present invention includes a set of holding jigs according to the present invention. An adherend holding apparatus which is an example of an adherend holding apparatus according to the present invention will be described with reference to the drawings. As shown in FIG. 4, the adherend holding device 10 includes a set of holding jigs including a first holding jig 1 </ b> A and a second holding jig 1 </ b> B. This is an apparatus capable of transferring an object to be adhered from the holding jig 1A to the second holding jig 1B. The set of holding jigs included in the adherend holding apparatus 10 is configured in the same manner as the set of holding jigs 6.
　図４に示されるように、被粘着物保持装置１０は、第１保持治具１Ａと第２保持治具１Ｂとが、第１弾性部材３Ａと第２弾性部材３Ｂとが相対向するように配置可能に成っている。これにより、第１保持治具１Ａに粘着保持された被粘着物を、例えば、起立状態を維持したままに、第２保持治具１Ｂに移し替えることができる。このような第１弾性部材３Ａと第２弾性部材３Ｂとの配置は機械的構成からなる変位手段により実現されてもよく、手動により実現されてもよい。 As shown in FIG. 4, the adherend holding device 10 is configured so that the first holding jig 1A and the second holding jig 1B face each other so that the first elastic member 3A and the second elastic member 3B face each other. It can be placed. Thereby, the to-be-adhered object adhesively held by the 1st holding jig 1A can be transferred to the 2nd holding jig 1B, for example, maintaining the standing state. Such an arrangement of the first elastic member 3A and the second elastic member 3B may be realized by a displacement means having a mechanical configuration, or may be realized manually.
　図４に示されるように、第１保持治具１Ａは、治具本体２Ａにおける第１弾性部材３Ａが形成されていない表面側が、保持治具変位手段１２から下方に延在する支持アーム１３の先端に設けられた支持部材１４に固定され、保持治具変位手段１２に支持されている。 As shown in FIG. 4, the first holding jig 1 </ b> A has a support arm 13 in which the surface side of the jig main body 2 </ b> A where the first elastic member 3 </ b> A is not formed extends downward from the holding jig displacing means 12. It is fixed to a support member 14 provided at the tip and supported by the holding jig displacement means 12.
　この保持治具変位手段１２は、軌条１１に取り付けられ、この軌条１１に沿って水平方向に運動可能に構成されると共に支持アーム１３を上下方向に運動可能に構成されている。したがって、この保持治具変位手段１２に支持された第１保持治具１Ａは保持治具変位手段１２によって水平方向及び上下方向に自在に移動可能と成っている。すなわち、被粘着物を懸垂保持する第１弾性部材３Ａを有する第１保持治具１Ａは、例えば、導電ペースト浴の上方に、又はその位置から導電ペースト浴の上方以外の適宜の位置、例えば、第２保持治具１Ｂの上方の位置に移送されることができると共に、第２保持治具１Ｂに向けて下降させられ、また第２保持治具１Ｂの第２弾性部材３Ｂに被粘着物を保持させ替えた後、第１保持治具１Ａを第２保持治具１Ｂから上昇させることができる。 The holding jig displacing means 12 is attached to the rail 11, is configured to be movable in the horizontal direction along the rail 11, and is configured to be able to move the support arm 13 in the vertical direction. Therefore, the first holding jig 1A supported by the holding jig displacing means 12 can be freely moved in the horizontal direction and the vertical direction by the holding jig displacing means 12. That is, the first holding jig 1A having the first elastic member 3A for hanging and holding the adherend is, for example, above the conductive paste bath or from an appropriate position other than above the conductive paste bath, for example, It can be transferred to a position above the second holding jig 1B, is lowered toward the second holding jig 1B, and an adherend is applied to the second elastic member 3B of the second holding jig 1B. After the holding is changed, the first holding jig 1A can be raised from the second holding jig 1B.
　さらに、この保持治具変位手段１２は、軌条１１を中心軸にして軸回りに回転運動可能に構成されている。保持治具変位手段１２がこのように回転運動可能であると、第１保持治具１Ａの状態を、被粘着物を第１弾性部材３Ａにより懸垂保持する状態、及び、被粘着物を第１弾性部材３Ａにより立設保持する状態に所望のように変えることができるようになる。 Further, the holding jig displacing means 12 is configured to be capable of rotating around the axis with the rail 11 as the central axis. When the holding jig displacing means 12 is capable of rotational movement in this way, the state of the first holding jig 1A is the same as the state in which the object to be adhered is suspended by the first elastic member 3A, and the object to be adhered is the first. The elastic member 3 </ b> A can be changed to a state of being held upright as desired.
　また、図４に示されるように、第２保持治具１Ｂは、第２治具本体２Ｂにおける第２弾性部材３Ｂが形成されていない表面側が、保持治具変位手段１６から上方に延在する支持アーム１７の先端に設けられた支持部材１８に固定され、保持治具変位手段１６に支持されている。 As shown in FIG. 4, the second holding jig 1 </ b> B extends upward from the holding jig displacing means 16 on the surface side of the second jig main body 2 </ b> B where the second elastic member 3 </ b> B is not formed. It is fixed to a support member 18 provided at the tip of the support arm 17 and supported by the holding jig displacement means 16.
　この保持治具変位手段１６は、軌条１１とほぼ直交する軌条１５に取り付けられ、基本的に保持治具変位手段１２と同様に形成されている。したがって、この保持治具変位手段１６に支持された第２保持治具１Ｂは保持治具変位手段１６によって水平方向及び上下方向に自在に移動可能とされ、かつ、軌条１５を中心軸にして軸回りに回転運動可能になっている。 The holding jig displacing means 16 is attached to a rail 15 that is substantially orthogonal to the rail 11 and is basically formed in the same manner as the holding jig displacing means 12. Therefore, the second holding jig 1B supported by the holding jig displacing means 16 can be moved freely in the horizontal direction and the vertical direction by the holding jig displacing means 16, and the axis with the rail 15 as the central axis. It can rotate around.
　保持治具変位手段１２及び保持治具変位手段１６における運動機構は、特に限定されず、例えば、駆動力を発生する駆動手段、例えば、モータと、このモータの出力を軌条１１又は１５、及び、支持アーム１３又は１７に伝達する伝達手段、例えば、歯車、ワイヤー等とを備えた運動機構が挙げられる。この運動機構は、通常のパソコン等によって、制御しても、手動で制御してもよい。 The movement mechanism in the holding jig displacing means 12 and the holding jig displacing means 16 is not particularly limited. For example, a driving means that generates a driving force, for example, a motor, and the output of the motor 11 or 15, and Examples of the movement mechanism include transmission means for transmitting to the support arm 13 or 17, for example, a gear, a wire, and the like. This motion mechanism may be controlled by a normal personal computer or manually.
　この被粘着物保持装置１０は、軌条１１と軌条１５が交差する位置近傍で、第１保持治具１Ａと第２保持治具１Ｂとが、第１弾性部材３Ａと第２弾性部材３Ｂとが相対向するように配置可能に成っている。これにより、第１保持治具１Ａに粘着保持された被粘着物を第２保持治具１Ｂに移し替えることができる。 The adherend holding apparatus 10 includes a first holding jig 1A and a second holding jig 1B, and a first elastic member 3A and a second elastic member 3B in the vicinity of a position where the rail 11 and the rail 15 intersect. It can be arranged so as to face each other. Thereby, the adherend to which the first holding jig 1A is adhesively held can be transferred to the second holding jig 1B.
　次に、この被粘着物保持装置１０を用いて小型電子部品用部材の一つであるチップコンデンサ本体に電極を形成して小型電子部品であるチップコンデンサを製造する方法について説明し、併せてこの被粘着物保持装置１０の作用について説明する。図５に示されるように、このチップコンデンサ本体７は四角柱体を成し、例えば図９に示されるように、チップコンデンサ９はこのチップコンデンサ本体７の両端部それぞれに電極８が形成されて成る。 Next, a method for manufacturing a chip capacitor which is a small electronic component by forming electrodes on a chip capacitor body which is one of the members for small electronic components using the adherend holding apparatus 10 will be described. The operation of the adherend holding device 10 will be described. As shown in FIG. 5, the chip capacitor body 7 has a quadrangular prism body. For example, as shown in FIG. 9, the chip capacitor 9 has electrodes 8 formed at both ends of the chip capacitor body 7. Become.
　被粘着物保持装置１０を用いてチップコンデンサ本体７に電極８を形成するには、先ず、第１弾性部材３Ａにチップコンデンサ本体７を粘着保持する。具体的には、保持治具変位手段１２を軌条１１を中心軸にして軸回りに回転運動させて第１保持治具１Ａを第１弾性部材３Ａが上方になるように配置して、例えば前記したように、前記立設配置板を用いてチップコンデンサ本体７を第１弾性部材３Ａに押圧する。そうすると、チップコンデンサ本体７によって第１弾性部材３Ａが弾性変形して平坦化され、チップコンデンサ本体７が第１弾性部材３Ａに粘着保持される。 In order to form the electrode 8 on the chip capacitor body 7 using the adherend holding device 10, first, the chip capacitor body 7 is adhesively held on the first elastic member 3 </ b> A. Specifically, the holding jig displacing means 12 is rotationally moved around the axis with the rail 11 as the central axis, and the first holding jig 1A is arranged with the first elastic member 3A facing upward, for example, As described above, the chip capacitor body 7 is pressed against the first elastic member 3A using the upright arrangement plate. Then, the first elastic member 3A is elastically deformed and flattened by the chip capacitor body 7, and the chip capacitor body 7 is adhered and held by the first elastic member 3A.
　このようにしてチップコンデンサ本体７を粘着保持した後に、図５に示されるように、保持治具変位手段１２を軌条１１を中心軸にして軸回りに回転運動させると、第１弾性部材３Ａに多数のチップコンデンサ本体７が懸垂保持された状態になる。次いで、保持治具変位手段１２（図示せず。）を軌条１１（図示せず。）に沿って水平方向に運動させて懸垂保持された多数のチップコンデンサ本体７を導電ペースト浴（図示せず。）の上方に水平移動させ、支持アーム１３を下方向に運動させてチップコンデンサ本体７の下端部を導電ペースト浴に浸漬させる。しばらくの後に支持アーム１３を上方向に運動させて、チップコンデンサ本体７に塗布された導電ペーストを乾燥させる。そうすると、図６に示されるように、第１弾性部材３Ａに懸垂保持された各チップコンデンサ本体７の下端部にほぼ均等な大きさの電極８が形成される。このとき、被粘着物は、第１弾性部材３Ａに所望のように粘着保持されているから、導電ペーストに浸漬中及び導電ペーストから引上げるときに、第１弾性部材３Ａから脱落することも、傾斜することもない。 After sticking and holding the chip capacitor main body 7 in this way, as shown in FIG. 5, when the holding jig displacing means 12 is rotated around the rail 11 as the central axis, the first elastic member 3A is moved. A large number of chip capacitor bodies 7 are suspended and held. Next, the holding jig displacing means 12 (not shown) is moved horizontally along the rails 11 (not shown) to suspend and hold a large number of chip capacitor bodies 7 suspended in a conductive paste bath (not shown). .) Is moved horizontally, and the support arm 13 is moved downward to immerse the lower end portion of the chip capacitor body 7 in the conductive paste bath. After a while, the support arm 13 is moved upward to dry the conductive paste applied to the chip capacitor body 7. As a result, as shown in FIG. 6, an electrode 8 having a substantially uniform size is formed at the lower end portion of each chip capacitor body 7 suspended and held by the first elastic member 3 </ b> A. At this time, the object to be adhered is adhered and held in the first elastic member 3A as desired, so that when the object is dipped in the conductive paste and pulled up from the conductive paste, it may fall off from the first elastic member 3A. There is no inclination.
　次いで、保持治具変位手段１２を軌条１１に沿って水平方向に運動させて第２保持治具１Ｂの上方に第１保持治具１Ａを水平移動させ、図７に示されるように、支持アーム１３を下方向に運動させて第１保持治具１Ａを第２保持治具１Ｂに向かって降下させる。第１保持治具１Ａをさらに降下させて、第１保持治具１Ａに粘着保持されたチップコンデンサ本体７の下端部を第２保持治具２Ａの第２弾性部材３Ｂに圧接させる。そうすると、チップコンデンサ本体７によって第２弾性部材３Ｂが弾性変形して平坦化され、第１弾性部材３Ａよりも大きな粘着力を発揮するから、第１弾性部材３Ａに粘着保持されていたチップコンデンサ本体７は大きな粘着力で第２弾性部材３Ｂに粘着される。次いで、支持アーム１３を上方向に運動させて第１保持治具１Ａを上昇させると、第２弾性部材３Ｂは所望の粘着力を発現していると共に、第２弾性部材３Ｂは第１弾性部材３Ａとの粘着力よりも大きな粘着力を有しているから、チップコンデンサ本体７は電極８を介して第２弾性部材３Ｂに強固に粘着されており、第１保持治具１Ａにおける第１弾性部材３Ａにチップコンデンサ本体７がほとんど残存することなく離脱する。このようにして、第１保持治具１Ａから第２保持治具１Ｂに多数のチップコンデンサ本体７を脱落することも転倒することもなく所望のように移し替えることができる。 Next, the holding jig displacing means 12 is moved horizontally along the rail 11 to move the first holding jig 1A horizontally above the second holding jig 1B, and as shown in FIG. 13 is moved downward to lower the first holding jig 1A toward the second holding jig 1B. The first holding jig 1A is further lowered, and the lower end portion of the chip capacitor body 7 adhered and held by the first holding jig 1A is brought into pressure contact with the second elastic member 3B of the second holding jig 2A. Then, the second elastic member 3B is elastically deformed and flattened by the chip capacitor main body 7, and exhibits a larger adhesive force than the first elastic member 3A. Therefore, the chip capacitor main body that is adhesively held by the first elastic member 3A 7 is adhered to the second elastic member 3B with a large adhesive force. Next, when the support arm 13 is moved upward to raise the first holding jig 1A, the second elastic member 3B expresses a desired adhesive force, and the second elastic member 3B is the first elastic member. Since the adhesive strength is larger than the adhesive strength with 3A, the chip capacitor body 7 is firmly adhered to the second elastic member 3B via the electrode 8, and the first elasticity in the first holding jig 1A is obtained. The chip capacitor body 7 leaves the member 3A with almost no remaining. In this way, a large number of chip capacitor bodies 7 can be transferred from the first holding jig 1A to the second holding jig 1B as desired without dropping off or falling down.
　次いで、保持治具変位手段１６（図示せず。）を軌条１５（図示せず。）を中心軸にして軸回りに回転運動させ、第２保持治具１Ｂにチップコンデンサ本体７が懸垂保持された状態にされる。その後、前記と同様にして懸垂保持されたチップコンデンサ本体７の下端部に導電ペーストを塗布して乾燥させて電極８を形成する。 Next, the holding jig displacing means 16 (not shown) is rotated around the axis with the rail 15 (not shown) as the central axis, and the chip capacitor body 7 is suspended and held by the second holding jig 1B. It will be in the state. Thereafter, a conductive paste is applied to the lower end portion of the chip capacitor body 7 suspended and held in the same manner as described above and dried to form the electrode 8.
　このようにして第２保持治具１Ｂの第２弾性部材３Ｂには、図８に示されるように、チップコンデンサ本体７それぞれの両端部にほぼ均等な大きさの電極８が形成されて成るチップコンデンサ９が懸垂された状態で粘着保持されている。そして、この第２保持治具１Ｂに粘着保持されたチップコンデンサ９は、例えば、第２保持治具１Ｂの粘着性表面に沿って相対的に移動する脱離具５によって側方に押圧されることで、弾性変形した第２弾性部材３Ｂが復元して、第２弾性部材３Ｂから容易に脱離して落下する。 In this manner, the second elastic member 3B of the second holding jig 1B has a chip in which the electrodes 8 having substantially equal sizes are formed on both ends of the chip capacitor body 7 as shown in FIG. Adhesion is held in a state where the capacitor 9 is suspended. Then, the chip capacitor 9 that is adhesively held by the second holding jig 1B is pressed laterally by, for example, the detaching tool 5 that relatively moves along the adhesive surface of the second holding jig 1B. Thus, the elastically deformed second elastic member 3B is restored and easily detached from the second elastic member 3B and dropped.
　このように、この発明に係る一組の保持治具６、及び、被粘着物保持装置を用いることにより、多数の被粘着物を一挙に起立状態で一方の保持治具に所望のように粘着保持することができると共に、被粘着物を一方の保持治具から他方の保持治具に移し替える際に、被粘着物が一方の保持治具に取り残され、転倒することを効果的に防止して、多数の被粘着物を一方の保持治具から他方の保持治具に起立状態を維持したままに移し替えることができる。すなわち、この発明に係る一組の保持治具及び被粘着物保持装置を用いれば、被粘着物を生産性よく製造することができる。 As described above, by using the set of holding jigs 6 and the object to be adhered holding device according to the present invention, a large number of objects to be adhered can be adhered to one holding jig as desired in a standing state. It is possible to hold and effectively prevent the adherend from being left in one holding jig and falling over when transferring the adherend from one holding jig to the other holding jig. Thus, a large number of objects to be adhered can be transferred from one holding jig to the other holding jig while maintaining the standing state. That is, if the set of holding jigs and the object to be adhered holding device according to the present invention are used, the object to be adhered can be manufactured with high productivity.
　この発明に係る保持治具、取扱治具、一組の保持治具及び被粘着物保持装置は、前記例に限定されることはなく、本願発明の目的を達成することができる範囲において、種々の変更が可能である。例えば、前記保持治具１において、弾性部材３は、その表面全体が粘着性表面となっているが、この発明において、弾性部材は自身の表面の少なくとも一部が粘着性表面になっていればよい。 The holding jig, the handling jig, the set of holding jigs, and the adherend holding apparatus according to the present invention are not limited to the above examples, and various types can be used as long as the object of the present invention can be achieved. Can be changed. For example, in the holding jig 1, the entire surface of the elastic member 3 is an adhesive surface. In the present invention, the elastic member has an adhesive surface if at least a part of its surface is an adhesive surface. Good.
　前記保持治具１においては、治具本体２及び弾性部材３はいずれも矩形に形成されているが、治具本体及び弾性部材は、小型部品の製造に適した形状であればよく、被粘着物の形状、被粘着物保持装置の形状、製造工程、作業性等に応じて、任意の形状とされる。例えば、保持治具は、正方形、長方形、五角形、六角形等の多角形、円形、楕円形、不定形、又は、これらを組み合わせた形状等の板状体が挙げられる。また、治具本体２における弾性部材３が形成されない一方の面側は、平面形状であっても、半円筒体等の立体形状であってもよい。 In the holding jig 1, the jig main body 2 and the elastic member 3 are both formed in a rectangular shape, but the jig main body and the elastic member may have any shape suitable for manufacturing a small part, The shape is arbitrary according to the shape of the object, the shape of the adherend holding device, the manufacturing process, workability, and the like. For example, the holding jig includes a plate-like body such as a polygon such as a square, a rectangle, a pentagon, and a hexagon, a circle, an ellipse, an indeterminate shape, or a combination thereof. Moreover, one surface side in which the elastic member 3 in the jig body 2 is not formed may be a planar shape or a three-dimensional shape such as a semi-cylindrical body.
　前記保持治具１は方形を成す盤状体の治具本体２を備えているが、この発明において、保持治具は、弾性部材の一部に支持部材が形成されてもよい。また、この支持部材は弾性部材と共に屈曲性を有する材料で形成されていてもよい。 Although the holding jig 1 includes a plate-shaped jig body 2 having a square shape, in the present invention, a supporting member may be formed on a part of the elastic member. Moreover, this support member may be formed with the material which has flexibility with an elastic member.
　前記保持治具１は方形の盤状体を成しているが、この発明において、保持治具は、用途等に応じて、無端ベルト状、肉厚の板状体、シート体、長尺体等の形態に適宜に形成されることができる。例えば、無端ベルト状に形成された保持治具は、その全体が無端ベルト状に形成されていること以外は前記保持治具１と基本的に同様に形成されている。したがって、この保持治具は、無端ベルト状に形成された支持部材と、無端ベルト状になるように支持部材の表面に積層された弾性部材とから成る。 The holding jig 1 forms a square plate-like body. In this invention, the holding jig is an endless belt-like, thick plate-like body, sheet body, or long body depending on the application. It can be suitably formed in such a form. For example, the holding jig formed in an endless belt shape is basically formed in the same manner as the holding jig 1 except that the entire holding jig is formed in an endless belt shape. Therefore, the holding jig includes a support member formed in an endless belt shape and an elastic member laminated on the surface of the support member so as to be in an endless belt shape.
　前記取扱治具４は、保持治具及び脱離具を備えて成るが、この発明において、取扱治具は、これら以外の部材又は要素、例えば、被粘着物の収納部材、脱離具の駆動手段、また、特開２００８－０９１６５９号公報に記載された立設配置板例えば前記立設配置板、及び、立設配置板の配設孔に挿入された被粘着物を第１保持治具に向けて押圧するプレス板等を備えていてもよい。 The handling jig 4 includes a holding jig and a detaching tool. In the present invention, the handling jig is a member or element other than these, for example, a storage member for an adherend, a driving of the detaching tool. Means, and a standing arrangement plate described in Japanese Patent Application Laid-Open No. 2008-091659, for example, the standing arrangement plate, and an object to be adhered inserted into the arrangement hole of the standing arrangement plate, are used as the first holding jig. You may provide the press board etc. which are pressed toward.
　前記一組の保持治具６においては、第１保持治具１Ａと第２保持治具１Ｂとを備えているが、この発明において、一組の保持治具は、第１保持治具及び第２保持治具に加えて、他の部材又は要素、例えば、第３保持治具、前記脱離具等を備えていてもよい。 The set of holding jigs 6 includes a first holding jig 1A and a second holding jig 1B. In the present invention, the set of holding jigs includes the first holding jig and the first holding jig. In addition to the two holding jigs, other members or elements, for example, a third holding jig, the detaching tool, and the like may be provided.
　前記被粘着物保持装置１０においては、第１保持治具１Ａと第２保持治具１Ｂとを備えているが、この発明において、被粘着物保持装置は、第１保持治具及び第２保持治具に加えて、他の部材又は要素、例えば、第３保持治具、前記脱離具等を備えていてもよい。 The adherend holding apparatus 10 includes the first holding jig 1A and the second holding jig 1B. In the present invention, the adherend holding apparatus includes the first holding jig and the second holding jig. In addition to the jig, other members or elements, for example, a third holding jig, the detaching tool, and the like may be provided.
　また、前記一組の保持治具６及び前記被粘着物保持装置１０においては、第１弾性部材３Ａと第２弾性部材３Ｂとは同一の粘着性材料によって形成されていても異なる粘着性材料によって形成されてもよい。 In the set of holding jigs 6 and the adherend holding device 10, the first elastic member 3A and the second elastic member 3B are formed of the same adhesive material, but different adhesive materials. It may be formed.
　さらに、前記被粘着物保持装置１０においては、軌条１１と軌条１５とがほぼ直角に交差するように配設されているが、この発明において、軌条と軌条とは略平行に配設されていてもよい。 Furthermore, in the said to-be-adhered article holding | maintenance apparatus 10, although the rail 11 and the rail 15 are arrange | positioned so that it may cross | intersect at substantially right angle, in this invention, a rail and a rail are arrange | positioned substantially parallel. Also good.
　また、前記被粘着物保持装置１０においては、保持治具変位手段１２及び１６は軌条１１及び１５を中心軸にして軸回りに回転運動可能に構成されているが、これらの保持治具変位手段は回転運動不能に構成されてもよい。この場合には、第１弾性部材にチップコンデンサ本体を粘着保持させた第１保持治具を保持治具変位手段に支持させればよく、第２弾性部材にチップコンデンサを粘着保持した第２保持治具を保持治具変位手段から取り外してチップコンデンサを第２の弾性部材から取り外せばよい。 Moreover, in the said to-be-adhered article holding | maintenance apparatus 10, although the holding jig displacement means 12 and 16 are comprised so that rotation around the axis | shaft is carried out by the rails 11 and 15, these holding jig displacement means May be configured such that it cannot rotate. In this case, the first holding member in which the chip capacitor body is adhered and held on the first elastic member may be supported by the holding jig displacement means, and the second holding in which the chip capacitor is adhered and held on the second elastic member. The jig may be removed from the holding jig displacing means and the chip capacitor may be removed from the second elastic member.
（実施例１）
　ステンレス鋼板（ＳＵＳ３０４製、厚さ０．５ｍｍ）から一辺の長さが１２０ｍｍである正方形の盤状体を切り出した。この盤状体における一方の表面をアセトンで脱脂処理した後、シリコーンゴム接着用プライマー（商品名「Ｘ－３３－１５６－２０」、信越化学工業株式会社製）を弾性部材形成領域（一辺の長さが１１０ｍｍの正方形、この正方形の中心と盤状体の中心とは一致している）に適量塗布して、２３℃の環境中で乾燥し、プライマー層（厚さ３μｍ）を形成した。このようにして治具本体２を作製した。 Example 1
A square plate-like body having a side length of 120 mm was cut out from a stainless steel plate (made of SUS304, thickness 0.5 mm). After degreasing one surface of the disc-shaped body with acetone, a silicone rubber adhesion primer (trade name “X-33-156-20”, manufactured by Shin-Etsu Chemical Co., Ltd.) is applied to the elastic member forming region (long side length). An appropriate amount was applied to a square having a length of 110 mm, and the center of the square and the center of the plate-like body coincided with each other, and dried in an environment at 23 ° C. to form a primer layer (thickness 3 μm). In this way, the jig body 2 was produced.
　弾性部材３を形成する粘着性材料として下記組成を有する付加反応硬化型粘着性シリコーン組成物を準備した。
・シリコーン生ゴム（ａ）と架橋成分（ｂ）と粘着力向上剤（ｃ）と触媒（ｄ）とを含有するシリコーンゴム組成物（商品名「Ｘ－３４－６３２　Ａ／Ｂ」、信越化学工業株式会社製）９０質量部
・ポリエチレンで表面を被覆した平均粒径１０μｍシリカ　１０質量部（シリコーン生ゴム（ａ）を１００質量部としたときの換算含有量（第１表において換算含有量と表記する。）は１３質量部） An addition reaction curable adhesive silicone composition having the following composition was prepared as an adhesive material for forming the elastic member 3.
A silicone rubber composition containing a silicone raw rubber (a), a crosslinking component (b), an adhesion improver (c), and a catalyst (d) (trade name “X-34-632 A / B”, Shin-Etsu Chemical Co., Ltd.) 90 parts by mass, average particle size of 10 μm silica whose surface is coated with polyethylene 10 parts by mass (converted content when silicone raw rubber (a) is 100 parts by mass (expressed as converted content in Table 1) .) Is 13 parts by mass)
　作製した治具本体２を金型に収納して、その弾性部材形成領域上に形成されたキャビティ（一辺の長さが１１０ｍｍ、厚さ０．８ｍｍの直方体）に、準備した付加反応硬化型粘着性シリコーン組成物を注入し、１２０℃、１０ＭＰａの条件下、トランスファー成形し、次いで、２００℃、４時間の条件下、さらに硬化させて、治具本体２の表面に弾性部材３を形成して保持治具１を製造した。 The prepared jig body 2 is housed in a mold, and the prepared addition reaction curable adhesive is prepared in a cavity (a rectangular parallelepiped having a side length of 110 mm and a thickness of 0.8 mm) formed on the elastic member forming region. The conductive silicone composition is injected, transfer molded at 120 ° C. and 10 MPa, and then further cured at 200 ° C. for 4 hours to form the elastic member 3 on the surface of the jig body 2. A holding jig 1 was manufactured.
（実施例２）
　前記シリカの平均粒径を６μｍに変更したこと以外は実施例１と基本的に同様にして保持治具１を製造した。 (Example 2)
A holding jig 1 was manufactured basically in the same manner as in Example 1 except that the average particle diameter of the silica was changed to 6 μm.
（実施例３～５）
　前記シリカの含有量を３質量部（シリコーン生ゴム（ａ）を１００質量部としたときの換算含有量は４質量部）、７質量部（シリコーン生ゴム（ａ）を１００質量部としたときの換算含有量は９質量部）及び１４質量部（シリコーン生ゴム（ａ）を１００質量部としたときの換算含有量は１８質量部）にそれぞれ変更したこと以外は実施例１と基本的に同様にして保持治具１を製造した。 (Examples 3 to 5)
The content of the silica is 3 parts by mass (conversion content when the silicone raw rubber (a) is 100 parts by mass is 4 parts by mass), 7 parts by mass (conversion when the silicone raw rubber (a) is 100 parts by mass) The content was basically the same as that of Example 1 except that the content was changed to 9 parts by mass) and 14 parts by mass (the converted content when the silicone raw rubber (a) was 100 parts by mass was 18 parts by mass). A holding jig 1 was manufactured.
（比較例１及び２）
　前記シリカの含有量を０質量部及び２１質量部（シリコーン生ゴム（ａ）を１００質量部としたときの換算含有量は２７質量部）に変更したこと以外は実施例１と基本的に同様にして保持治具を製造した。 (Comparative Examples 1 and 2)
Basically the same as in Example 1 except that the silica content was changed to 0 parts by mass and 21 parts by mass (the converted content when the silicone raw rubber (a) was 100 parts by mass was 27 parts by mass). The holding jig was manufactured.
（粘着性表面の測定）
　各実施例及び各比較例でそれぞれ製造した保持治具における粘着性表面の最大粗さＲｙ、凹凸の平均間隔Ｓｍ、粘着力及び硬度それぞれを前記測定方法に基づいて測定した結果を第１表に示す。 (Measurement of adhesive surface)
Table 1 shows the results obtained by measuring the maximum roughness Ry of the adhesive surface, the average interval Sm of the unevenness, the adhesive force and the hardness in the holding jigs manufactured in each Example and each Comparative Example based on the measurement method. Show.
（粘着性評価）
　直方体状の被粘着物（縦０．３ｍｍ×横０．３ｍｍ×高さ０．６ｍｍ）約２５，０００個を一様に配列し、各被粘着物の頂面（縦０．３ｍｍ×横０．３ｍｍ）に各実施例及び各比較例でそれぞれ製造した保持治具における弾性部材の粘着性表面を押し当てて、被粘着物の粘着状態を評価した。その結果、実施例１～５の保持治具は大部分の被粘着物を粘着保持でき、特に実施例３及び４の保持治具はほとんどすべての被粘着物を粘着保持できた。一方、比較例１及び２の保持治具は大部分の被粘着物を粘着保持できなかった。 (Adhesion evaluation)
About 25,000 rectangular parallelepiped objects (length 0.3 mm x width 0.3 mm x height 0.6 mm) are uniformly arranged, and the top surface of each object to be adhered (length 0.3 mm x width 0) .3 mm) was pressed against the adhesive surface of the elastic member in the holding jig manufactured in each example and each comparative example, and the adhesion state of the adherend was evaluated. As a result, the holding jigs of Examples 1 to 5 were able to stick and hold most of the objects to be bonded, and in particular, the holding jigs of Examples 3 and 4 were able to stick and hold almost all of the objects to be bonded. On the other hand, the holding jigs of Comparative Examples 1 and 2 could not hold most of the objects to be bonded.
（離脱性評価）
　前記粘着性評価と基本的に同様にして、各実施例及び各比較例でそれぞれ製造した保持治具の弾性部材に、直方体状の被粘着物（縦０．３ｍｍ×横０．３ｍｍ×高さ０．６ｍｍ）約２５，０００個を起立状態となるように、粘着保持させた。なお、比較例１及び２の保持治具は、その弾性部材を被粘着物に強固に押し当てて強制的に粘着保持させた。このようにして被粘着物を起立状態に粘着保持させた後に弾性部材の粘着性表面に非接触となるようにポリアセタール製ブレードを粘着性表面に沿って移動させて被粘着物を掻きとった。その結果、実施例１～５の保持治具は、弾性部材３が損傷されることなく粘着保持されているすべての被粘着物を離脱させることができ、高い離脱性を示した。一方、比較例１及び２の保持治具、特に比較例１の保持治具は、ポリアセタール製ブレードを粘着性表面に接触又は押圧させた状態で移動させなければ粘着保持されている被粘着物を離脱させることができないうえ、一度離脱させた被粘着物が粘着性表面に再粘着することがあり、離脱性は十分ではなかった。 (Evaluation of withdrawal)
Basically in the same manner as the above-mentioned adhesive evaluation, the elastic member of the holding jig manufactured in each example and each comparative example was bonded to a rectangular parallelepiped object (length 0.3 mm × width 0.3 mm × height). (0.6 mm) About 25,000 pieces were adhered and held so as to stand upright. Note that the holding jigs of Comparative Examples 1 and 2 were forcibly held in an adhesive state by firmly pressing the elastic member against the adherend. After the object to be adhered was held in an upright state in this manner, the object to be adhered was scraped by moving the polyacetal blade along the adhesive surface so as not to contact the adhesive surface of the elastic member. As a result, the holding jigs of Examples 1 to 5 were able to remove all the objects to be adhered and retained without damaging the elastic member 3, and exhibited high releasability. On the other hand, the holding jigs of Comparative Examples 1 and 2, particularly the holding jig of Comparative Example 1, are to be attached to the object to be adhered unless the polyacetal blade is moved in contact with or pressed against the adhesive surface. In addition, it was not possible to detach, and the adherend once detached could re-adhere to the adhesive surface, and the detachability was not sufficient.
（転写性評価）
　実施例３で製造した保持治具と実施例５で製造した保持治具（弾性部材の粘着力の差は２２ｇ／ｍｍ２）とを用いて被粘着物の転写試験を行った。具体的には、前記粘着性評価と基本的に同様にして、実施例５で製造した保持治具の弾性部材に、直方体状の被粘着物（縦０．３ｍｍ×横０．３ｍｍ×高さ０．６ｍｍ）約２５，０００個を起立状態となるように、粘着保持させた。次いで、実施例３で製造した保持治具の弾性部材を実施例５の保持治具の上方に位置させ、静かに下降させた。実施例５の保持治具における弾性部材の表面に立設する多数の直方体状の被粘着物の上端部に、実施例３の保持治具における弾性部材を接触させた。次いで、接触後３秒が経過してから、実施例３の保持治具を上方に１８０ｍｍ／ｍｉｎ．の速度で持ち上げて実施例５の保持治具から引き離した。引き離された実施例３の保持治具における直方体状の被粘着物の保持状態を観察したところ、実施例５の保持治具に取り残された直方体状の被粘着物の数が全体に対して０．５％未満であり、高い転写性を示した。 (Transferability evaluation)
Using the holding jig manufactured in Example 3 and the holding jig manufactured in Example 5 (the difference in adhesive force of the elastic member is 22 g / mm 2 ), a transfer test of the adherend was performed. Specifically, in the same manner as the above-described adhesive evaluation, the elastic member of the holding jig manufactured in Example 5 was bonded to a rectangular parallelepiped object (length 0.3 mm × width 0.3 mm × height). (0.6 mm) About 25,000 pieces were adhered and held so as to stand upright. Next, the elastic member of the holding jig manufactured in Example 3 was positioned above the holding jig of Example 5 and gently lowered. The elastic member in the holding jig of Example 3 was brought into contact with the upper ends of a large number of rectangular parallelepiped objects to be erected on the surface of the elastic member in the holding jig of Example 5. Next, after 3 seconds had passed since the contact, the holding jig of Example 3 was moved upward by 180 mm / min. It was lifted at a speed of and pulled away from the holding jig of Example 5. When the holding state of the rectangular parallelepiped objects to be held in the holding jig of Example 3 that was pulled apart was observed, the number of rectangular solid objects to be left in the holding jig of Example 5 was 0.5 with respect to the whole. %, Indicating high transferability.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　この発明に係る保持治具、取扱治具、一組の保持治具及び被粘着物保持装置は、小型部品等の被粘着物を製造、搬送、収納又は検査等する際等に好適に利用できる。 The holding jig, the handling jig, the set of holding jigs, and the adherend holding device according to the present invention can be suitably used for manufacturing, transporting, storing, or inspecting the adherend such as small parts. .
１　保持治具
１Ａ　第１保持治具
１Ｂ　第２保持治具
２　治具本体
２Ａ　第１治具本体
２Ｂ　第２治具本体
３　弾性部材
３Ａ　第１弾性部材
３Ｂ　第２弾性部材
４　取扱治具
５　離脱具
６　一組の保持治具
７　チップコンデンサ本体
８　電極
９　チップコンデンサ
１０　被粘着物保持装置
１１、１５　軌条
１２、１６　保持治具変位手段
１３、１７　支持アーム
１４、１８　支持部材 DESCRIPTION OF SYMBOLS 1 Holding jig 1A 1st holding jig 1B 2nd holding jig 2 Jig main body 2A 1st jig main body 2B 2nd jig main body 3 Elastic member 3A 1st elastic member 3B 2nd elastic member 4 Handling jig 5 Detachment tool 6 A set of holding jig 7 Chip capacitor body 8 Electrode 9 Chip capacitor 10 Adhered object holding device 11, 15 Rail 12, 16 Holding jig displacement means 13, 17 Support arm 14, 18 Support member

Claims (6)

  1. 　治具本体と、前記治具本体の表面に設けられ、最大粗さＲｙ（ＪＩＳ　Ｂ　０６０１－１９９４）が１．０～６．０μｍである弾性部材とを備えて成る保持治具。 A holding jig comprising a jig main body and an elastic member provided on the surface of the jig main body and having a maximum roughness Ry (JIS B 0601-1994) of 1.0 to 6.0 μm.
  2. 　前記弾性部材は、凹凸の平均間隔Ｓｍ（ＪＩＳ　Ｂ０６０１－１９９４）が５．０～１５．０μｍである請求項１に記載の保持治具。 The holding jig according to claim 1, wherein the elastic member has an average spacing Sm (JIS B0601-1994) of 5.0 to 15.0 μm.
  3. 　請求項１又は２に記載の保持治具と、
    　前記保持治具における弾性部材の表面に沿って相対的に移動して粘着保持された被粘着物を脱離させる脱離具とを備えて成る取扱治具。     The holding jig according to claim 1 or 2,
    A handling jig comprising: a detaching tool for detaching an object to be adhered, which is relatively moved along the surface of the elastic member in the holding jig and is adhered and held.
  4. 　第１治具本体と前記第１治具本体の表面に設けられた第１弾性部材を備えて成る第１保持治具と、
    　第２治具本体と前記第２治具本体の表面に設けられた第２弾性部材を備えて成る第２保持治具とを備え、
    　前記第１保持治具及び前記第２保持治具の少なくとも一方は請求項１又は２に記載の保持治具であり、かつ、
    　前記第２弾性部材は前記第１の弾性部材の粘着力よりも大きな粘着力を有している一組の保持治具。     A first holding jig comprising a first jig body and a first elastic member provided on a surface of the first jig body;
    A second jig body, and a second holding jig comprising a second elastic member provided on the surface of the second jig body,
    At least one of the first holding jig and the second holding jig is the holding jig according to claim 1 or 2, and
    The second elastic member is a set of holding jigs having an adhesive force larger than that of the first elastic member.
  5. 　前記第２保持治具が請求項１又は２に記載の保持治具である請求項４に記載の一組の保持治具。 The set of holding jigs according to claim 4, wherein the second holding jig is the holding jig according to claim 1 or 2.
  6. 　請求項４又は５に記載の一組の保持治具を備えた被粘着物保持装置。 An adherend holding device provided with a set of holding jigs according to claim 4 or 5.
PCT/JP2011/005727 2010-11-09 2011-10-13 Retaining jig, handling jig, set of retaining jigs, and adhered material retaining device WO2012063405A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014143362A (en) * 2013-01-25 2014-08-07 Tdk Corp Detachment method of electronic component
JP2014203515A (en) * 2013-04-01 2014-10-27 日本ゼオン株式会社 Manufacturing method of sheet for lithium ion secondary battery electrode
JP2019189675A (en) * 2018-04-18 2019-10-31 信越ポリマー株式会社 Adhesive substrate and method for separating object from the adhesive substrate

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105321734A (en) * 2014-07-28 2016-02-10 黄武 Production method of micro part slice
JP2018078132A (en) * 2016-11-07 2018-05-17 信越ポリマー株式会社 Holding jig for precision part, and method for manufacturing the same
JP7180828B2 (en) * 2018-10-31 2022-11-30 信越ポリマー株式会社 holding jig
JP2022104308A (en) 2020-12-28 2022-07-08 エルジー ディスプレイ カンパニー リミテッド Transmission system, transmission cable, transmission method, and display device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077772A (en) * 2001-08-31 2003-03-14 Murata Mfg Co Ltd Device and method for handling electronic component
JP2008153310A (en) * 2006-12-14 2008-07-03 Shin Etsu Polymer Co Ltd Holding jig and device and method for forming electrode

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0793247B2 (en) * 1992-02-10 1995-10-09 株式会社村田製作所 Holding jig for small parts and holding method
JP4049545B2 (en) * 2001-03-22 2008-02-20 日本碍子株式会社 SiC heat treatment jig
JP4186611B2 (en) * 2002-12-11 2008-11-26 株式会社村田製作所 Electronic component holding jig and electronic component handling method
JP2004203465A (en) * 2002-12-26 2004-07-22 Shin Etsu Polymer Co Ltd Molding for use in miniature electronic component holding/conveying jig etc., miniature electronic component holding/conveying jig using the same, and manufacturing method therefor
JP4678784B2 (en) * 2006-12-28 2011-04-27 信越ポリマー株式会社 Holding jig, a set of holding jigs, and an adherend holding device
JP4418032B2 (en) * 2007-09-11 2010-02-17 キヤノンアネルバ株式会社 Electrostatic chuck
KR100977851B1 (en) * 2008-01-21 2010-08-24 주식회사 진우엔지니어링 An apparatus for forming a electrode
JP2010186982A (en) * 2009-01-13 2010-08-26 Shin Etsu Polymer Co Ltd Holding/removing jig and handling jig

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003077772A (en) * 2001-08-31 2003-03-14 Murata Mfg Co Ltd Device and method for handling electronic component
JP2008153310A (en) * 2006-12-14 2008-07-03 Shin Etsu Polymer Co Ltd Holding jig and device and method for forming electrode

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014143362A (en) * 2013-01-25 2014-08-07 Tdk Corp Detachment method of electronic component
JP2014203515A (en) * 2013-04-01 2014-10-27 日本ゼオン株式会社 Manufacturing method of sheet for lithium ion secondary battery electrode
JP2019189675A (en) * 2018-04-18 2019-10-31 信越ポリマー株式会社 Adhesive substrate and method for separating object from the adhesive substrate
JP7156755B2 (en) 2018-04-18 2022-10-19 信越ポリマー株式会社 Adhesive substrate and method for separating objects from the adhesive substrate

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