JP5240937B2 - Small parts handling jig and small parts handling equipment - Google Patents

Description

  TECHNICAL FIELD The present invention relates to a small part handling jig and a small part handling apparatus, and more specifically, a small part handling jig and a handling apparatus excellent in durability capable of removing a small part without damaging an elastic member. About.

  Conventionally, for example, when manufacturing a small component such as a chip capacitor, a holding jig capable of sticking and holding a member for small component capable of manufacturing the small component on the surface thereof has been used. For example, the holding jig described in Patent Document 1 is characterized in that “at least the surface portion is formed of a rubber elastic material having adhesiveness, and the adhesive force can hold a small component on the elastic material surface. (See claim 1 of Patent Document 1). A small component or the like manufactured using such a holding jig is removed from the holding jig.

  This Patent Document 1 includes a holding jig 13 (see the 0007 column, FIGS. 3 and 4, etc.) “a plurality of V-shaped grooves 14 are provided in parallel on the surface of a flat rubber elastic material”. , “A plurality of U-shaped grooves 17 provided in parallel on the surface of the flat rubber elastic material” holding jig 16 (see column 0007 and FIG. 5). In these holding jigs 13 and 16, it is described that “small parts having a shape that easily rolls can be stably held” by “fitting and holding small parts in the grooves 14 or 17”.

  By the way, as a method of removing a small part from a holding jig once held by adhesion, for example, a small part that is adhered and held by sliding a removal tool such as a blade on the elastic material surface to detach the small part. There is a method of removing the etc. Specifically, as such a method, Patent Document 2 discloses that “a plurality of electronic components are adhered to the adhesive layer of an electronic component holder having a support and an adhesive layer formed on one surface of the support by adhesion. A step of holding, a step of applying a predetermined process to the electronic component held on the adhesive layer, and the adhesive layer is recessed by the tip of the blade, and in this state, the blade is moved relative to the surface of the adhesive layer. The electronic component handling method includes a step of separating the electronic component from the adhesive layer by the above-mentioned method (refer to claim 4 etc.).

  As shown in FIG. 3 of Patent Document 2, the method described in Patent Document 2 is “by denting the adhesive layer with the tip of the blade and moving the blade relative to the surface of the adhesive layer in that state”. In this method, the electronic component 2 is inclined and separated. In this method, when the blade is slid on the surface of the adhesive layer, in particular for the purpose of surely removing the electronic component, the blade is strongly pressed against the surface of the adhesive layer or slid, or the blade is vigorously pressed. When slid on the surface, the surface of the adhesive layer may be scratched and damaged by the blade.

Japanese Patent Publication No. 07-93247 Japanese Patent Laid-Open No. 2003-77772

  It is an object of the present invention to provide a small component handling jig and a handling device that are excellent in durability and capable of removing a small component without damaging an elastic member.

As means for solving the problems,
The first aspect of the present invention has a flat adhesive portion whose surface has adhesive force and a protruding non-adhesive portion protruding from the surface, and the protruding non-adhesive portion protrudes 1 to 30 μm from the surface of the flat adhesive portion. The flat adhesive portion and the protruding non-adhesive portion both include an elastic member arranged so as to contact the adherend surface of the small component and hold the small component in an inclined state. A jig for handling small parts,
The second aspect of the present invention is the handling jig for small parts according to claim 1, wherein the protruding non-adhesive portions are ridges or columns arranged in a row.
A third aspect of the present invention is the handling jig for small parts according to claim 1, wherein the protruding non-adhesive portions are ridges or columns arranged in a matrix.
Claim 4 comprises a support member that supports the elastic member, and is a small component handling jig according to any one of claims 1 to 3,
A fifth aspect of the present invention provides a small component handling jig according to any one of the first to fourth aspects, and a small component that is relatively adhered and held along the surface of the small component handling jig. A device for handling small parts, characterized by comprising a detaching tool for detaching
A sixth aspect of the present invention includes a holding jig having an adhesive elastic member that adheres and holds a small component, and the adhesive elastic member has an adhesive force smaller than that of the flat adhesive portion. The device for handling small parts according to claim 5,
The seventh aspect includes a first holding jig and a second holding jig each having an adhesive elastic member for sticking and holding a small part, and the flat adhesive portion, the second holding jig, and the first holding jig. The jig according to claim 5, wherein the jig has an adhesive force that satisfies the following conditions.
Flat adhesive part> Second holding jig> First holding jig

  The jig for handling small parts according to the present invention includes an elastic member in which the flat adhesive portion and the protruding non-adhesive portion protruding from the surface of the flat adhesive portion are arranged as described above. In the small component handling jig according to the invention, the small component is adhered and held to the elastic member in contact with the flat adhesive portion and the protruding non-adhesive portion, and a removal tool such as a blade is attached to the surface of the elastic member. Even if the small component is not slid upward, the small component held by adhesion can be removed simply by pressing the small component with a detaching tool from the side of the small component. At this time, even if a small component pressed by the detaching tool falls on the surface of the elastic member, the protruding non-adhesive part protrudes more than the flat adhesive part, and thus falls on the surface of the elastic member. The small component does not come into contact with the flat adhesive portion and is not re-adhered and held by the elastic member.

  Further, in the small component handling jig according to the present invention, as described above, when the small component is removed, the elastic member can be used to remove the removal tool such as a blade only by pressing the small component from the side of the small component. Therefore, the surface of the elastic member is not damaged by sliding of the detachment tool.

  The small component handling apparatus according to the present invention comprises the small component handling jig according to the present invention and a detaching tool that moves relatively along the surface of the handling jig. Small parts can be easily removed without damaging the surface.

  Therefore, according to the present invention, it is possible to provide a small component handling jig and a handling device that are excellent in durability and capable of removing a small component without damaging the elastic member.

FIG. 1 is a schematic view showing a small component handling jig which is an embodiment of a small component handling jig according to the present invention, and FIG. 1 (a) shows a small component handling jig according to the present invention. It is a schematic top view which shows the handling jig | tool of the small components which is one Example, FIG.1 (b) is a schematic sectional drawing which shows the cross section of the AA line in Fig.1 (a). FIG. 2 is a schematic top view showing a small component handling jig which is another embodiment of the small component handling jig according to the present invention. FIG. 3 is a schematic top view showing a small component handling jig which is still another embodiment of the small component handling jig according to the present invention. FIG. 4 is a schematic view showing a state in which a small component is attached to and held by a small component handling jig, which is an embodiment of the small component handling jig according to the present invention. FIG. FIG. 4B is a schematic top view showing a state in which the small component is held on the small component handling jig, which is an embodiment of the small component handling jig according to FIG. It is a schematic sectional drawing which shows the cross section of the -A line. FIG. 5 is a schematic cross-sectional view showing a state in which a small part adhesively held by a small part handling jig, which is an embodiment of the small part handling jig according to the present invention, is pressed with a detaching tool. FIG. 6 is a schematic perspective view showing a holding jig provided in the small component handling apparatus which is an embodiment of the small component handling apparatus according to the present invention. FIG. 7 shows a small component handling apparatus as an embodiment of the small component handling apparatus according to the present invention and a state in which the small component is transferred from the holding jig to the small component handling jig in this handling apparatus. FIG. FIG. 8 shows a small component handling apparatus which is another embodiment of the small component handling apparatus according to the present invention, and a state where the small component is transferred from the first holding jig to the second holding jig in this handling apparatus. FIG.

  A small part handling jig according to the present invention (hereinafter sometimes simply referred to as a handling jig according to the present invention) includes a flat adhesive part having an adhesive surface and a protruding non-adhesive part protruding from the surface. And the flat adhesive portion and the protruding non-adhesive portion are both provided with an elastic member arranged so as to be in contact with the adherend surface of the small component.

  The small component according to the present invention is a small component member capable of manufacturing a small component that needs to be adhesively held by the small component handling jig according to the present invention, such as a small instrument member, a small machine element member, and the like. Examples include small electronic component members. In addition, since the manufacture of small parts includes a process of transporting small parts, the small parts include small parts themselves, for example, small appliances, small mechanical elements, and small electronic parts. Therefore, in the present invention, it is not necessary to clearly distinguish the small component from the small component member. Among these small components, a small electronic component and / or a member for a small electronic component are suitable as a small component suitable for the adhesive handling of the small component according to the present invention. As the small electronic component and the small electronic component member, for example, a finished product or an unfinished product such as a capacitor chip (also referred to as a chip capacitor), an inductor chip, a resistor chip, and / or the like. For example, a prism or cylinder, a prism or cylinder having ridges at one end, a prism or cylinder having ridges at both ends, and the like. Examples of such a small component include a small component having a prismatic body having an axial length of 1 mm or less, a width of 0.5 mm or less, and a thickness of 0.5 mm or less.

  A handling jig for small parts which is an embodiment of the handling jig according to the present invention will be described with reference to the drawings. As shown in FIG. 1, the handling jig 1 includes a support member 14 and an elastic member 11 provided on the surface of the support member 14.

  As shown in FIG. 1, the support member 14 supports the elastic member 11. The support member 14 only needs to have a smooth surface, and can have various forms based on various design changes as long as the elastic member 11 can be supported. The support member 14 is formed in a disk-like body having a larger square than the elastic member 11.

  The support member 14 only needs to be formed of a material capable of supporting the elastic member 11. For example, a metal plate such as stainless steel and aluminum, a metal foil such as an aluminum foil and a copper foil, polyester, polytetrafluoroethylene, Examples thereof include resin films or resin plates such as polyimide, polyphenylene sulfide, polyamide, polycarbonate, polystyrene, polypropylene, polyethylene, and polyvinyl chloride. Furthermore, the support member 14 can also be a laminated body formed by laminating a plurality of sheet-like materials.

  As shown in FIG. 1, the elastic member 11 is formed in a square plate-like body and has a flat adhesive portion 21 and a protruding non-adhesive portion 23. In other words, the elastic member 11 is composed of a rectangular plate-like body having a plate-like base having a flat surface having an adhesive force capable of sticking and holding a small component, and a protruding non-adhesive portion 23 formed protruding from the surface. The flat surface is a flat adhesive portion 21. Furthermore, the surface of the elastic member 11 has an uneven shape, the concave portion is the flat adhesive portion 21, and the convex portion is the protruding non-adhesive portion 23. Paying attention to the area where the small parts are adhered, the elastic member 11 is formed with a flat adhesive portion 21 and a protruding non-adhesive portion 23 protruding from the surface of the flat adhesive portion 21 in the area.

  The flat adhesive portion 21 is formed on the surface of the plate-like substrate, that is, on the surface of the elastic member 11 when it is assumed that the protruding non-adhesive portion 23 is not formed. It has flatness enough to hold the adhesive. For example, the flatness of the flat adhesive portion 21 is preferably such that the arithmetic average roughness Ra (JIS B 0601-1994) is 0.1 to 1 μm. The arithmetic average roughness Ra is measured under conditions such as a cutoff of 0.8 mm and a measurement length of 2.4 mm. The arithmetic average roughness Ra of the surface of the flat adhesive portion 21 can be adjusted, for example, by blasting a product portion forming surface in a mold used when the elastic member 11 is formed.

The flat adhesive portion 21 only needs to have an adhesive force capable of adhering and holding small parts, and this handling jig 1 is a small component handling apparatus according to the present invention (hereinafter referred to as the present invention). In order to utilize for this, it is important to have an adhesive force larger than the adhesive force of the holding jig which comprises this handling apparatus. Specifically, the flat adhesive portion 21 may generally be that has the adhesive force of 1~70g / mm ^2, it is preferable that a adhesive strength of 7~70g / mm ^2. Here, the adhesive strength of the flat adhesive portion 21 is a value measured by the following “Shin-Etsu Polymer Method”. In this method, a suction fixing device (for example, trade name: electromagnetic chuck, KET-1530B, manufactured by Kanetech Co., Ltd.) or a vacuum suction chuck plate for fixing the elastic member 11 horizontally, and a diameter of 10 mm at the tip of the measuring unit. A load measuring device equipped with a digital force gauge (trade name: ZP-50N, manufactured by Imada Co., Ltd.) with a contact made of stainless steel (SUS304) in the form of a cylinder is prepared. The elastic member 11 is fixed on a suction fixing device or a vacuum suction chuck plate, and the measurement environment is set to 21 ± 1 ° C. and humidity 50 ± 5%. Next, the contact attached to the load measuring device is lowered until it contacts the part to be measured of the elastic member 11 at a speed of 20 mm / min, and then the contact is measured at a predetermined load on the part to be measured. Press vertically for 3 seconds against the part. Here, the predetermined load is set to 25 g / mm ² . Next, the contact is pulled away from the site to be measured at a speed of 180 mm / min, and the pulling load measured by the digital force gauge at this time is read. This operation is performed at a plurality of locations of the measurement site, the plurality of separation loads obtained are arithmetically averaged, and the obtained arithmetic average value is used as the adhesive strength of the flat adhesive portion 21.

  The protruding non-adhesive portion 23 is formed on the surface of the elastic member 11 as shown in FIG. Specifically, the protruding non-adhesive portion 23 is a protruding body extending in one direction on the surface of the elastic member 11. The protrusions only need to protrude with respect to the surface of the elastic member 11, and the cross-sectional shape thereof is a shape in which the apex is chamfered even if it is a substantially triangular shape as shown in FIG. 1 (b). Etc.

  As shown in FIG. 1 (b), the protrusion is preferably flat because a part of a small component adhered and held by the flat adhesive portion 21 contacts or is pressed against the surface. That is, it is preferable that the protruding non-adhesive portion 23 protrudes from the surface of the elastic member 11 by 1 to 30 μm, and preferably protrudes by 5 to 10 μm. When the protruding amount of the protruding non-adhesive part 23 is within the above range, the adhesive surface can be brought into contact with the flat adhesive surface 10 by appropriately elastically deforming and holding the small component. The small parts can be held in a slightly inclined state without contacting all the surfaces with the flat adhesive surface 10. Therefore, according to the handling jig 1 including the elastic member 11 having the protruding non-adhesive portion 23 whose protruding amount is within the above range, the small component can be adhered and held as desired. When necessary, the object that the small component can be removed without damaging the elastic member can be sufficiently achieved.

The protruding non-adhesive portion 23 is substantially non-adhesive or weakly adhesive, and has, for example, a low adhesive strength that does not have an adhesive force or that cannot hold a small component. Has an adhesive strength of less than 1 g / mm ² according to the “Shin-Etsu Polymer Method”. That is, the protrusion non-adhesion part 23 can also be called a protrusion weak adhesion part or a protrusion non-adhesion part.

  As shown in FIG. 1, the elastic member 11 includes a plurality of flat adhesive portions 21 and a plurality of protruding non-adhesive portions 23 that are spaced apart from each other, that is, the flat adhesive portions 21 or the protruding non-adhesive portions. 23 are arranged in a row so as to be substantially parallel to each other. In other words, the flat adhesive portions 21 and the protruding non-adhesive portions 23 are alternately arranged so as to be striped.

  And both the flat adhesion part 21 and the protrusion non-adhesion part 23 are the surface (henceforth, the following) of the small component 41 which faces the elastic member 11 when it is adhesively hold | maintained at the elastic member 11, as shown with the broken line of FIG. It is arranged so as to contact the adherend surface 42). That is, the flat adhesion is performed so that the adherend surface 42 of the small component 41 adhered and held by the elastic member 11 contacts one flat adhesive portion 21 and one protruding non-adhesive portion 23 adjacent to the flat adhesive portion 21. The part 21 and the protruding non-adhesive part 23 are arranged.

  Specifically, the arrangement interval between the flat adhesive portion 21 and the protruding non-adhesive portion 23, that is, the length (width) in the direction perpendicular to the extending direction of the flat adhesive portion 21 and the protruding non-adhesive portion 23. Depending on the adhesive force and the surface area of the adherend surface 42, the surface area of the flat adhesive portion 21 and the protruding non-adhesive portion 23 that can contact the adherend surface 42 is determined. For example, as shown in FIG. 1, the arrangement interval between the flat adhesive portion 21 and the protruding non-adhesive portion 23 is preferably set to be smaller than one side length of the adherend surface 42. It is particularly preferable that the total width of 21 and the protruding non-adhesive portion 23 is set to be larger than the length of one side of the adherend surface 42. When the arrangement interval is adjusted to such an interval, even if a small component that is adhered and held falls down, it can be easily removed again without being adhered and held only by the flat adhesive portion 21. In the elastic member 11 in which the flat adhesive portions 21 and the protruding non-adhesive portions 23 are arranged in a row of stripes, for example, the arrangement interval is an interval smaller than the length of one side of the adherend surface 42, It is preferable that the total surface area of the flat adhesive portion 21 facing the adherend surface 42 is determined so as to be 50 to 99% with respect to the surface area of the adherend surface 42.

  In the elastic member 11 in which the flat adhesive portion 21 and the protruding non-adhesive portion 23 are arranged in this way, as shown in FIGS. 1 and 4, the small component is one flat adhesive portion 21 and the flat adhesive portion. The one non-adhesive portion 23 adjacent to the portion 21 is adhered and held.

  The elastic member 11 preferably has an elongation at break of 200 to 1000% (JIS K6249: tensile speed of 500 mm / min). When the elastic member 11 has an elongation at the time of cutting in the above range, the flat adhesive portion 21 and the protruding non-adhesive portion 23 also have an elongation at the time of cutting in the above range. When the adhesive portion 23 is elastically deformed, the adherend surface 42 of the small component and the flat adhesive portion 21 come into contact with each other, and the small component can be adhered and held.

  The elastic member 11 preferably has a hardness (JIS K6253 [durometer E]) of about 5 to 60. When the elastic member 11 is formed of a silicone rubber composition to be described later and is within the above hardness range, for example, when the small component is adhesively held or transferred to the elastic member 11, the dimensional error of the small component is absorbed. It is possible to hold or transfer almost all small parts without damaging and breaking them.

  It is preferable that the elastic member 11, that is, the flat adhesive portion 21 has a thickness of about 0.05 to 2 mm.

  The elastic member 11 only needs to be formed of an adhesive material capable of exhibiting the adhesive force or a cured product of this adhesive material. Examples of the adhesive material include a fluorine resin, a fluorine rubber, and a fluorine resin. Or, a fluorine-containing composition containing a fluorine-based rubber, a silicone resin or silicone rubber, a silicone composition containing a silicone resin or a silicone rubber, a urethane-based elastomer, a natural rubber, various elastomers such as a styrene-butadiene copolymer elastomer, etc. It is done. Among these, addition reaction curable adhesive silicone compositions and peroxide curable adhesive silicone compositions containing silicone rubber and / or silicone rubber are preferred. Examples of the addition reaction curable adhesive silicone composition include, for example, a silicone raw rubber (a), a crosslinking component (b), an adhesion improver (c), and a catalyst (d) described in JP-A-2008-091659. And a silica-based filler (e), and the peroxide curable adhesive silicone composition described in, for example, JP-A-2008-091659, Mention may be made of a pressure-sensitive adhesive composition containing a silicone raw rubber (a), an adhesive strength improver (c), a silica-based filler (e) and an organic peroxide (f).

  The protruding non-adhesive portion 23 is only required to be non-adhesive or weakly adhesive after being formed of the adhesive material or the like, and the non-adhesive material or weak adhesive material that does not exhibit adhesive force. What is necessary is just to be formed. Examples of the non-adhesive material or the weak adhesive material include a silicone resin, a fluorine resin, and a urethane resin.

  As shown in FIG. 2, the handling jig 2, which is another embodiment of the handling jig according to the present invention, includes a support member 14 and an elastic member 12 provided on the surface of the support member 14. The handling jig 2 is basically the same as the handling jig 1 except that the handling jig 2 is a ridge formed by arranging a plurality of protruding non-adhesive portions 23 in a matrix. In this handling jig 2, as shown by a broken line in FIG. 2, the small component includes one flat adhesive portion 21 surrounded by four protruding non-adhesive portions 23 arranged in a matrix, and the flat parts. The protruding non-adhesive portion 23 adjacent to the adhesive portion 21 is adhesively held. In the handling jig 2, the interval between the protruding non-adhesive portions 23 is longer than one side length of the adherend surface 42 in the small component 41 and shorter than the longest one side length in the small component 41. It is preferable to adjust the thickness.

  As shown in FIG. 3, a handling jig 3, which is another embodiment of the handling jig according to the present invention, is provided on a support member (not shown in FIG. 3) and on the surface of the support member. And an elastic member 11. The handling jig 3 is basically the same as the handling jig 1 except that a plurality of protruding non-adhesive portions 24 forming a cylindrical body are arranged in a matrix form in the form of dots instead of the protruding non-adhesive portions 23. The same as above. In the handling jig 3, as shown by a broken line in FIG. 3, the small component 41 is at a position where at least one, preferably two protruding non-adhesive portions 24 are in contact with the adherend surface 42 of the small component 41. Adhesive retention. The shape of the protruding non-adhesive portion 24 is not particularly limited, and examples thereof include a circle, a truncated cone, and an inverted truncated cone.

  The handling jig according to the present invention is manufactured by producing a molded body of the adhesive material by a known molding method or the like, and forming a protruding non-adhesive portion having a predetermined dimension on the molded body. For example, after forming an elastic member using a mold having a cavity whose surface can be formed into a concavo-convex shape, a method of making a convex part non-adhesive or weakly adhesive, flatness of a plate-like substrate formed of an adhesive material, etc. A non-adhesive layer made of a non-adhesive material or a weak adhesive material is laminated on the flat surface of a plate-like substrate formed of an adhesive material, etc. The method etc. which cut a part of non-adhesion layer until the said flat surface appears are mentioned.

  For example, (1) a masking member is placed on the flat adhesive portion to control the irradiation amount by forming the protruding non-adhesive portion by making the convex portion formed of an adhesive material or the like non-adhesive or weakly adhesive. Examples include a method of irradiating ultraviolet rays, (2) a method of applying a non-adhesive material or a weak adhesive material to the convex portions, and (3) a method of roughening the surface of the convex portions.

  In order to provide a support member on the elastic member, a support member made of the above material by a known molding method or the like may be laminated on the elastic member and bonded as desired.

  Next, a method for removing a small part from the handling jig according to the present invention will be described using the handling jig 1 and the small part 41 having a quadrangular prism shape. The handling jig according to the present invention adheres the adherend surface 42 of the small component 41 across the adjacent flat adhesive portion and the protruding non-adhesive portion. At this time, the small component 41 is pressed against the elastic member 11. Then, when the protruding non-adhesive portion is elastically deformed to reduce the protruding amount, the adherend surface 42 comes into contact with a wider surface of the flat adhesive portion and is adhered and held. Therefore, in order to stick and hold a small part on the handling jig according to the present invention and to remove the small part from the handling jig, the adjacent flat adhesive part and the protruding non-adhesive part are used.

  First, the small component 41 is adhesively held on the handling jig 1. In order to hold the small component 41 in the handling jig 1, for example, an alignment plate with a through hole that can accommodate the small component 41 is prepared, and the alignment plate is superimposed on the handling jig 1. The small component 41 is stored in each through hole of the alignment plate by applying appropriate means such as vibration. At this time, as shown in FIG. 4, the adherend surface 42 of the small component 41 accommodated in the through hole is provided with the flat adhesive portion 21 and one protruding non-adhesive disposed adjacent to one side of the flat adhesive portion 21. The alignment plate is arranged so as to straddle the portion 23. Next, when the small component 41 is pressed toward the handling jig 1, as shown in FIG. 4, the protruding non-adhesive portion 23 that is in contact with the adherend surface 42 of the small component 41 is elastically deformed and pressed by the pressing force. It is crushed and the to-be-adhered surface 42 contacts the wider surface of the flat adhesive part 21. Then, since the flat adhesive portion 21 has the adhesive force, the small component 41 can be adhered and held. Here, since the flat adhesive part 21 has a strong adhesive force, even if the protruding non-adhesive part 23 is restored to its original state by its restoring force, the small component 41 can be adhered and held. In this way, the small component 41 can be adhered and held.

  Next, as shown in FIG. 5 (the support member 14 is not shown), a detachment tool 7 described later is disposed in the vicinity of the surface of the handling jig 1. At this time, the detachment tool 7 can detach the small component 41 as desired without contacting the surface of the elastic member 10. The detachment tool 7 is moved toward the small component 41 relatively in a non-contact state with the elastic member 11 along the surface. Then, as shown in FIG. 5, the tip of the detachment tool 7 comes into contact with the side surface of the small component 41, and the small component 41 is inclined from the side, for example, in the direction inclined with respect to the axis of the small component 41 or It is pressed from the vertical direction. In this way, when the small component 41 is pressed, the small component 41 slides in the pressing direction, or, as shown in FIG. It falls as an axis, and the contact state between the adherend surface 42 and the flat adhesive portion 21 is released. As a result, the small component 41 is removed from the handling jig 1.

  By the way, even if the small component 41 once removed falls over the surface of the elastic member 11, the protruding non-adhesive portion 23 protrudes more than the flat adhesive portion 21, and preferably the protruding non-adhesive portion 23 and the flat at the arrangement interval. Since the adhesive portions 21 are arranged, the small component 41 existing on the surface of the elastic member 11 does not contact the flat adhesive portion 21 and is not re-adhered and held by the flat adhesive portion 21.

  In this way, almost all of the small parts 41 adhered and held by the handling jig 1 can be easily removed without damaging the elastic member 11.

  As described above, according to the handling jig according to the present invention, since it is not necessary to bring the detachment tool into contact with or press against the surface of the elastic member, the detachment tool does not damage the small component and the elastic member. It can be removed and the handling jig can be used for a long time.

  And, as described above, the handling jig according to the present invention can be adhesively held, preferably by pressing a small component, by the adjacent flat adhesive portion and the protruding non-adhesive portion, The held small part can be removed by pressing it from its side. Therefore, the handling jig according to the present invention is used as a holding jig for small parts when manufacturing or transporting small parts, as a detaching jig when removing manufactured small parts, and for scattered small parts. It can be suitably used as a collecting jig or the like.

  The handling jig according to the present invention is not limited to the above-described embodiments, and various modifications can be made within a range in which the object of the present invention can be achieved. For example, the flat adhesive portion and the protruding non-adhesive portion may be arranged so that both the flat adhesive portion and the protruding non-adhesive portion are in contact with the adherend surface of the small component, and the “row” shown in FIG. The arrangement is not limited to the “matrix shape” shown in FIG. 2 and the “matrix shape (dot shape)” shown in FIG. 3, and various arrangements are possible.

  In the handling jigs 1 to 3, the flat adhesive portions and the protruding non-adhesive portions are arranged at substantially the same arrangement interval. In this invention, the flat adhesive portions and the protruding non-adhesive portions are arranged at different arrangement intervals. The number of the flat adhesive portions and the protruding non-adhesive portions is appropriately determined according to the use of the handling jig, the dimensions of the small parts, and is adjusted to, for example, several to tens of thousands.

  The handling jig 1 has a rectangular plate-like body. In the present invention, the handling jig may be appropriately formed in the form of a sheet body, a long body, etc., depending on the application. it can.

  The handling jig 1 includes a disk-shaped support member having a square shape. However, in the present invention, the handling jig may be embedded in the elastic member, and may be part of the elastic member. The support member may be formed, or the support member may not be formed and may be composed of only the elastic member.

  The handling device according to the present invention comprises the handling jig according to the present invention and a detaching tool for detaching the small parts that are relatively moved along the surface of the handling jig and are adhesively held. . The handling jig provided in the handling device according to the present invention is as described above. The removal tool only needs to have a form that can relatively move along the surface of the handling jig 1 and remove the small parts that are adhered and held. For example, FIG. The blade may be a triangular prism-shaped blade arranged in a falling manner, or may be a wire or the like. The detaching tool 7 shown in FIG. 7 is capable of detaching a plurality of small parts 41 adhered and held by the handling jig 1 at a stretch, and the extending direction is a protrusion in the handling jig 1. It is good that it is longer than the extending length of the non-adhesive part 23. In addition, the said front-end | tip part may be formed or coat | covered with an elastic member for the purpose of the damage prevention etc. to a small component. The handling device according to the present invention can remove the small component without damaging the small component and the elastic member by the removing tool.

The handling apparatus according to the present invention can be provided with a holding jig in addition to the handling jig according to the present invention and the detachment tool, and examples thereof include the handling apparatus 5 shown in FIG. The holding jig provided in the handling device 5 only needs to have an adhesive elastic member capable of holding a small component by sticking. For example, the first holding jig 8 as a holding jig is: 6 and 7, the first adhesive elastic member 16 and the first reinforcing member 18 are provided. The first reinforcing member 18 is basically the same as the support member 14 of the handling jig 1. The first adhesive elastic member 16 is basically the same as the elastic member 11 of the handling jig 1 except that the protrusion non-holding portion 20 is not formed and has a predetermined adhesive force. The adhesive force of the first adhesive elastic member 16 only needs to have an adhesive force smaller than that of the flat adhesive portion 21, and the adhesive force of the flat adhesive portion 21 is 50 to 70 g / mm ^2. For example, it may have an adhesive strength of 10 to 45 g / mm ² (according to the “Shin-Etsu Polymer Method”).

  According to the handling device 5 including the first holding jig 8, the small part 41 that is adhesively held by the first holding jig 8 and subjected to a predetermined process or the like is handled from the first holding jig 8. By transferring to the tool 1, almost all the small parts 41 can be removed from the first holding jig 8 and the handling jig 1. For example, as shown in FIG. 7, the small component 41 that is adhesively held by the first adhesive elastic member 16 of the first holding jig 8 and has an electrode (not shown in FIG. 7) formed at its end, for example. When the other end is pressed against the handling jig 1 so as to be in contact with one flat adhesive portion 21 and one protruding adherend portion 23 adjacent thereto, the first adhesive elastic member 16 and the flat adhesive portion 21 are pressed. Almost all the small parts 41 can be transferred to the handling jig 1 due to the difference in adhesive strength between them. Thus, since the protrusion non-adhesion part 23 is pressed by the small component 41, the protrusion non-adhesion part 23 is compressed and deformed in the thickness direction, but in FIG. Is not shown. Next, when the detaching tool 7 is moved relative to the handling jig 1 as described above, almost all of the small parts 41 that are adhered and held by the flat adhesive portion 21 can be removed. An example of a method for holding an adhesive of a small part on the first holding jig 8 includes a method described in Japanese Patent Application Laid-Open No. 2008-091659.

  The handling device 5 including the first holding jig 8 is preferably used when, for example, a chip capacitor having an electrode on one end face is manufactured.

  Further, the handling device according to the present invention can be provided with two types of holding jigs, that is, a first holding jig and a second holding jig, in addition to the handling jig according to the present invention and the detaching tool 7. For example, the handling apparatus 6 shown by FIG. 8 is mentioned. These two types of holding jigs 8 and 9 only need to include the first adhesive elastic member 16 and the second adhesive elastic member 17 capable of holding small parts by adhesion. And basically the same. The first holding jig 8, the second holding jig 9, and the handling jig 1, which are these two types of holding jigs, have an adhesive force that satisfies the following conditions.

  Condition: flat adhesive part 21 of the handling jig 1> second adhesive elastic member 17 of the second holding jig 9> first adhesive elastic member 16 of the first holding jig 8

When the adhesive force of the first holding jig 8 and the second holding jig 9 and the adhesive force of the handling jig 1 satisfy the above conditions, the small component 41 that is adhesively held on the first holding jig 8 is The small part 41 can be detached from the handling jig 1 by being transferred to the holding jig 9 and then transferred from the second holding jig 9 to the handling jig 1. The adhesive force of the first holding jig 8 is, for example, 10 to 25 g / mm ² (according to the “Shin-Etsu Polymer Method”), and the adhesive force of the second holding jig 9 is, for example, 30 to 45 g / mm ^2. The adhesive strength of the flat adhesive portion 21 of the handling jig 1 is, for example, 50 to 70 g / mm ² (according to the “Shin-Etsu Polymer Method”).

  According to the handling device 6 including the first holding jig 8 and the second holding jig 9, the small component 41 that is adhesively held by these two kinds of holding jigs 8 and 9 and subjected to predetermined processing or the like is provided. These two types of holding jigs 8 and 9 can be transferred to the handling jig 1, and almost all small parts 41 can be removed from the holding jigs 8 and 9 and the handling jig 1. For example, as shown in FIG. 8, an electrode (not shown in FIG. 8) is formed on one end surface, and the chip capacitor member 41 a that is adhesively held by the first holding jig 8 is attached to the second holding jig 9. When pressed against the second adhesive elastic member 17, the chip capacitor member 41 a is transferred to the second adhesive elastic member 17 due to the adhesive force difference between the first adhesive elastic member 16 and the second adhesive elastic member 17. Next, almost all of the chip capacitor in which an electrode (not shown in FIG. 8) is formed on the other end surface of the chip capacitor member 41a adhered and held by the second holding jig 9 is handled as described above. After the transfer to 1, it can be removed from the handling jig 1 by the detaching tool 7. As a method for forming electrodes on both end surfaces of the chip capacitor member 41a using the first holding jig 8 and the second holding jig 9, for example, a method described in Japanese Patent Application Laid-Open No. 2008-091659 is available. Can be mentioned.

  The handling device 6 including the first holding jig 8 and the second holding jig 9 is preferably used, for example, when manufacturing a chip capacitor having electrodes on both end faces.

  As described above, according to the handling device according to the present invention having the above-described configuration, almost all small parts transferred from the holding jig and held on the flat adhesive portion as desired can be transferred to the small parts and the elastic parts by the removal tool. It can be removed without damaging the member and the handling device can be used for a long time.

  The handling device according to the present invention is not limited to the above-described embodiments, and various modifications can be made within a range in which the object of the present invention can be achieved. For example, the handling devices 5 and 6 include a handling jig, a removal tool, and a holding jig as required. In the present invention, the handling jig is a member or element other than these, for example, a small part. You may provide the accommodation member, the drive means of a removal tool, the standing arrangement | positioning board, the press board, etc. which were described in Unexamined-Japanese-Patent No. 2008-091659.

  The handling devices 5 and 6 may be used by being mounted on a support member in a small component holding device described in, for example, Japanese Patent Application Laid-Open No. 2008-091659. It may be used in combination with the indicated detachment tool.

1, 2, 3 Handling jig for small parts 5, 6 Handling device 7 Detachment tool
11, 12, 13 Elastic member 14 Support member
21 Flat adhesive parts 23, 24 Protruding non-adhesive part 41 Small component 41a Chip capacitor member 42 Adhesive surface

Claims (7)

The surface has a flat adhesive part having adhesive force and a protruding non-adhesive part protruding from the surface, and the protruding non-adhesive part protrudes from 1 to 30 μm with respect to the surface of the flat adhesive part, and the flat adhesive A small part handling comprising: an elastic member arranged so that the small part and the protruding non-adhesive part are in contact with the adherend surface of the small part and hold the small part in an inclined state jig.   2. The jig for handling small parts according to claim 1, wherein the protruding non-adhesive portions are ridges or pillars arranged in a line.   The jig for handling small parts according to claim 1, wherein the protruding non-adhesive portions are ridges or pillars arranged in a matrix.   The jig for handling small parts according to any one of claims 1 to 3, further comprising a support member that supports the elastic member. A handling jig for small parts according to any one of claims 1 to 4,
An apparatus for handling a small part, comprising: a detaching tool for detaching the small part that is relatively moved along the surface of the jig for handling the small part and is adhered and held. Provided with a holding jig having an adhesive elastic member that holds and holds small parts,
6. The apparatus for handling small parts according to claim 5, wherein the adhesive elastic member has an adhesive force smaller than that of the flat adhesive portion. A first holding jig and a second holding jig, each having an adhesive elastic member for sticking and holding a small part;
6. The apparatus for handling small parts according to claim 5, wherein the flat adhesive portion, the second holding jig, and the first holding jig have an adhesive force that satisfies the following conditions.
Flat adhesive part> Second holding jig> First holding jig

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