JP7180828B2 - holding jig - Google Patents

Description

TECHNICAL FIELD The present invention relates to a holding jig having an adhesive layer for holding electronic components and the like.

When forming external electrodes on the end face of a chip-type electronic component such as a multilayer capacitor, a method of holding the electronic component on the adhesive layer of an electronic component holder having an adhesive layer is widely known. In this method, first, while one end surface of the electronic component is held by the adhesive layer of the electronic component holder, a conductive paste is adhered to the other end surface and dried to form a first electrode, and then, After the first electrode is held by another electronic component holder having an adhesive surface having a stronger adhesive force than this electronic component holder and the electronic component is transferred, a second electrode is formed on one end face. , and finally, the electronic component is removed from the electronic component holder.

As a method for removing the electronic component, for example, Patent Document 1 discloses that the tip of the blade is depressed against the adhesive layer and the blade is moved relative to the adhesive layer along the surface direction of the adhesive layer. A method is disclosed for removing the electronic component from the adhesive layer by scraping it off. In such a method, the adhesive layer needs to be easily removable while holding the electronic component with a predetermined adhesive force. As a holding jig that facilitates detachment, for example, Patent Document 2 discloses a substrate and a substrate provided on the surface, having a maximum roughness Ry of 1.0 to 6.0 μm and an adhesive strength of 1 to 60 g/ mm ² and an adhesive layer with a hardness of 5-50.

Japanese Patent Application Laid-Open No. 2003-077772 Japanese Patent No. 5936230

However, in the holding jig provided with the adhesive layer as described in Patent Documents 1 and 2, by repeatedly pressing the electronic component adhered to the adhesive layer with a blade and relatively moving the component, wear may occur. The adhesive strength of the adhesive layer gradually decreases, making it difficult to hold the electronic component. When the adhesive strength is lowered, it becomes difficult to hold the electronic component upside down, and the electronic component is tilted, resulting in the problem that the electrodes are not formed at desired positions or the electronic component falls.
SUMMARY OF THE INVENTION It is an object of the present invention to provide a holding jig having an adhesive layer that holds an electronic component or the like with adhesive force, in which the abrasion resistance of the adhesive layer is improved. With the goal.

As a result of intensive studies, the present inventors have found that the wear resistance is improved when the adhesive layer has a predetermined surface state, and have completed the present invention.
That is, the present invention is a holding jig comprising a substrate and an adhesive layer provided on the surface of the substrate, the adhesive layer being made of silicone rubber, and the skewness Rsk on the surface of the adhesive layer being less than 0. .

The load length ratio Mr1 of the core portion on the surface of the adhesive layer is preferably 6% or more and 10% or less.

The load length ratio Rmr (50%) at a cut level of 50% on the surface of the adhesive layer is preferably 50% or more and 65% or less.

It is preferable that the average spacing Sm of the unevenness on the surface of the adhesive layer is 4 μm or more and 8 μm or less.

The silicone rubber of the adhesive layer preferably contains silica particles.

The average secondary particle size of silica particles is preferably 1 μm or more and 5 μm or less.

ADVANTAGE OF THE INVENTION According to this invention, the holding jig provided with the adhesion layer WHEREIN: The abrasion resistance of an adhesion layer can be improved.

1 is a schematic cross-sectional view showing one embodiment of a holding jig of the present invention; FIG. 1 is a schematic cross-sectional view showing a handling jig provided with a holding jig of the present invention; FIG. It is a schematic sectional drawing which shows a set of holding jig provided with the holding jig of this invention. 1 is a schematic cross-sectional view showing an adherend holding device provided with a holding jig of the present invention; FIG. It is a figure which shows the process of forming an electrode in an electronic component using the adherend holding|maintenance apparatus provided with the holding jig of this invention.

Embodiments of the present invention will be described in detail below, but the following embodiments are presented for the purpose of illustration, and the present invention is not limited to the embodiments shown below.
Examples of the adherend to be adhered and held by the holding jig of the present invention include electronic components and various members used for the electronic components. Examples of electronic components include capacitor chips (also called chip capacitors), inductor chips, resistor chips, FPCs (flexible printed circuit boards), and the like.

[Holding jig]
A holding jig 10 of the present invention comprises a substrate 11 and an adhesive layer 12 provided on the surface of the substrate 11, as shown in FIG. The adhesive layer 12 is made of silicone rubber, and the skewness Rsk on the surface 12a of the adhesive layer 12 is less than zero.
The method of using the holding jig 10 of the present invention will be described later in detail. The sticky substance is pressed and held. On the other hand, in order to remove the electronic component adhered and held by the holding jig 10 of the present invention, while pressing the surface 12a of the adhesive layer 12 with the removal tool, move it relative to the holding jig 10 to remove it. A release tool 20 is inserted between the surface 12a of the adhesive layer 12 and the electronic component 20 to scrape off the electronic component.

(substrate)
The substrate 11 supports an adhesive layer 12, which will be described later, as shown in FIG. The substrate 11 in this embodiment is a rectangular plate-like body. The substrate 11 may have any shape as long as it has a smooth surface and is capable of supporting the adhesive layer 12, and may have various shapes based on various design changes, such as rectangular, circular, elliptical, and polygonal. good. Further, as shown in FIG. 1, the substrate 11 may be formed into a disc-shaped thin sheet body having a dimension larger than that of the adhesive layer 12 so that the vicinity of the edge protrudes from the edge of the adhesive layer 12. Alternatively, the substrate 11 may be formed into a rectangular plate-like thin leaf body having approximately the same dimensions as the adhesive layer 12 .

The substrate 11 may be formed of a material capable of supporting the adhesive layer 12. Examples of the substrate 11 include metal plates such as stainless steel and aluminum, metal foils such as aluminum foil and copper foil, polyester, polytetrafluoroethylene, and polyimide. , polyphenylene sulfide, polyamide, polycarbonate, polystyrene, polypropylene, polyethylene, polyvinyl chloride, or the like, or a resin plate. Furthermore, the substrate 11 may be a laminate formed by laminating a plurality of sheet-like materials.

(adhesive layer)
The adhesive layer 12 is designed so that it can hold a large number of adherends by adhesion in contact with one plane of the adherends. The adhesive layer 12 is formed of, for example, an adhesive material having adhesive strength or a cured product of the adhesive material, which will be described later. .

The surface 12a of the adhesive layer 12 is in contact with the surface of the adherend and holds the adherend by adhesion, so that the surface 12a has adhesive strength capable of holding the adherend by adhesion. Specifically, the adhesive strength of the adhesive layer 12 is generally preferably 1 to 60 g/mm ² and more preferably 7 to 60 g/mm ² . The adhesive strength of the adhesive layer 12 is a value measured by the following "Shin-Etsu polymer method".

(Shin-Etsu Polymer Law)
A suction fixing device (for example, product name: electromagnetic chuck, KET-1530B, manufactured by Kanetec Co., Ltd.) or a vacuum suction chuck plate or the like for horizontally fixing the adhesive layer 12, and a cylinder with a diameter of 10 mm was formed at the tip of the measuring part. A load measuring device equipped with a digital force gauge (trade name: ZP-50N, manufactured by Imada Co., Ltd.) equipped with a stainless steel (SUS304) contactor was prepared, and an adsorption fixing device or a vacuum in this load measuring device was prepared. The adhesive layer 12 is fixed on the suction chuck plate, and the measurement environment is set to 21±1° C. and 50±5% humidity.
Next, the contact attached to the load measuring device is lowered at a speed of 20 mm/min until it contacts the part to be measured of the adhesive layer 12, and then the contact is placed on the part to be measured with a predetermined load. Press vertically against the part for 3 seconds. Here, the predetermined load is set to 25 g/mm ² . Next, the contact is pulled away from the site to be measured at a speed of 180 mm/min, and the pulling load measured by the digital force gauge is read at this time. This operation is performed at a plurality of locations of the measurement site, and the obtained plurality of separating loads are arithmetically averaged.

(Skewness Rsk)
The skewness Rsk on the surface 12a of the adhesive layer 12 is smaller than zero. When the skewness Rsk is less than 0, the surface 12a has improved wear resistance.
Here, the skewness Rsk is one of the parameters representing the strength of the surface roughness, and means the symmetry (skewness of unevenness) of peaks and valleys around the average line. It is represented by Formula (1).

When the skewness Rsk is greater than 0, the unevenness is biased downward with respect to the average line, and when it is less than 0, the unevenness is biased upward with respect to the average line. If it is less than 0, the surface 12a has a large proportion of flat surfaces, and is less susceptible to friction caused by the blade being pressed and moved. Therefore, it is considered that a holder having an adhesive layer with a skewness Rsk of less than 0 has improved wear resistance.
The skewness Rsk is more preferably -0.500 or more and less than 0, and more preferably -0.450 or more and -0.100 or less.
The skewness Rsk on the surface 12a is measured in accordance with the measuring method described in JIS B0601-2001 when the surface 12a of the adhesive layer 12 does not adhere and hold an adherend.

(Load length ratio of core portion Mr1)
The load length ratio Mr1 of the core portion on the surface 12a of the adhesive layer 12 is preferably 6% or more and 10% or less. The load length ratio Mr1 of the core portion means the ratio of the peak portion of the unevenness to the measurement area. Therefore, when the load length ratio Mr1 of the core portion is 6% or more and 10% or less, it means that there are few convex portions and a large proportion of flat portions. Even if it is worn, the unevenness of the surface changes little, and the adhesive strength of the adhesive layer 12 does not decrease much. Therefore, the wear resistance of the adhesive layer is improved.
The load length ratio Mr1 of the core portion on the surface 12a is measured in accordance with the measuring method described in JIS B0671-2 when the surface 12a of the adhesive layer 12 does not adhere and hold an adherend.

(Load length ratio Rmr (50%))
The load length ratio Rmr(50%) means the ratio of the load length Ml(50) of the profile curve element to the evaluation length ln at the cut level of 50%, and is expressed by the following formula (2). In formula (2), c indicates the cleavage level.

The load length ratio Rmr (50%) is preferably 50% or more and 65% or less, more preferably 52% or more and 60% or less. When the load length ratio Rmr (50%) is 50% or more and 65% or less, the wear resistance of the surface 12a of the adhesive layer 12 can be improved. More than half of the actual rubber is within 50% of the height of the unevenness of the surface, which is biased upward, improving the wear resistance.
The load length ratio Rmr (50%) on the surface 12a is measured in accordance with the measuring method described in JIS B0601-2001 when the surface 12a of the adhesive layer 12 does not adhere and hold an adherend.

(Average interval Sm of unevenness)
The average interval Sm of unevenness represents the average of the length Xs of the contour curve elements in the reference length, and is expressed by the following formula (3).

When the average interval Sm of the unevenness on the surface 12a is 4 μm or more and 8 μm or less, the interval between the peak portions (or the valley portions and the valley portions) of the unevenness on the surface 12a becomes a desired interval, so that the elasticity of the peak portions is increased. The flatness of the surface 12a of the adhesive layer 12 due to the deformation is further enhanced, and the abrasion resistance is improved.
The average spacing Sm of the irregularities on the surface 12a is measured in accordance with the measuring method described in JIS B0601-1994 when the surface 12a of the adhesive layer 12 does not adhere and hold an adherend. At this time, the cutoff wavelength is 0.8 mm, the evaluation length is 2.4 mm, the cutoff type is Gaussian, and the arithmetic mean value is obtained at least at three points. The average spacing Sm of the unevenness of the surface 12a of the adhesive layer 12 can be adjusted by a method or the like to be described later.

The skewness Rsk, the load length ratio Mr1 of the core portion, the load length ratio Rmr (50%), and the uneven average interval Sm of the adhesive layer 12 can be adjusted by the following methods. For example, the surface 12a of the adhesive layer 12 of the adhesive layer 12 is surface-treated by a known roughening treatment such as sandblasting, or a molding die having a cavity inner surface surface-treated by a known roughening treatment is used. A method of forming the adhesive layer 12 using the adhesive layer 12, a method of including the particulate matter in the adhesive layer 12 or the adhesive material forming the adhesive layer 12, and the like.

The adhesive layer 12 in the holding jig 10 of the present invention is made of adhesive rubber or resin containing particles.
The particles used in the surface roughening method are not particularly limited in terms of shape, material, etc., as long as they are particles, and examples thereof include known particulate fillers. Examples of particulate materials include inorganic fillers such as silica-based fillers. Examples of silica-based fillers include silica particles synthesized by a dry method such as fumed silica and pyrogenic silica, and silica particles synthesized by a wet method such as precipitated silica and silica gel. Among these, fumed silica and precipitated silica are preferred.

The granules preferably have an average secondary particle size of 1 to 4.5 μm, more preferably 1 to 3.5 μm, particularly preferably 1 to 2.5 μm. The method for measuring the average secondary particle size conforms to the secondary particle size d50 (laser method). The particles are dispersed almost uniformly in the adhesive layer 12, and at least the skewness Rsk among the skewness Rsk, the load length ratio Mr1 of the core portion, the load length ratio Rmr (50%), and the average interval Sm of the unevenness is set as above. Adjustable range.

Regardless of whether the particulate material is a silica-based filler or not, the particles are dispersed almost uniformly in the adhesive layer 12, and the skewness Rsk, the core portion load length ratio Mr1, and the load length ratio Rmr (50%) Among them, in that at least the skewness Rsk can be adjusted to the range of the present invention, it is contained in the adhesive layer 12 at a rate of 1 to 12 parts by mass with respect to 100 parts by mass of the rubber or resin forming the adhesive layer 12. It is more preferably contained in the adhesive layer 12 at a rate of 1 to 10 parts by mass, and particularly preferably contained in the adhesive layer 12 at a rate of 2 to 8 parts by mass. In addition, in order to include the particulate material in the adhesive layer 12, there is a method of adding the particulate material to the adhesive material forming the adhesive layer 12, and the like.

The surface 12a of the adhesive layer 12 preferably has a hardness (JIS K6253 [durometer A]) of 5-50, more preferably 30-50. When the surface 12a of the adhesive layer 12 has a hardness within the above range, the surface 12a of the adhesive layer 12, particularly the convex portions of the unevenness, are not smoothed when an object to be adhered is pressed against the surface 12a of the adhesive layer 12 and held thereon. The surface 12a of the adhesive layer 12 is easily elastically deformed, and the surface 12a of the adhesive layer 12 is further flattened, so that the contact surface of the adherend is more strongly adhered, and the damage and breakage of the adherend can be prevented. Incidentally, the hardness of the adhesive layer 12 can be adjusted by the content of the particulate matter or the like.

The adhesive layer 12 preferably has a thickness of approximately 0.05 to 5 mm. If the thickness of the adhesive layer 12 is less than 0.05 mm, the mechanical strength of the adhesive layer 12 may decrease and the durability of the adhesive layer 12 may be insufficient. is likely to be elastically deformed, and the adherend may not be easily removed from the adhesive layer 12 .

The adhesive layer 12 may be fixed to the surface of the substrate 11 by an adhesive layer or a primer layer, by the adhesive force of the adhesive layer 12, or by a fixture or the like. It is fixed to the surface of the substrate 11 via an adhesive layer or a primer layer.

The adhesive layer 12 may be formed of an adhesive material capable of exerting adhesive force or a cured product of an adhesive material. composition and the like. Of these, silicone rubber and/or addition reaction-curable adhesive silicone compositions containing silicone rubber and peroxide-curable adhesive silicone compositions are preferred. Examples of the addition reaction-curable adhesive silicone composition include a silicone raw rubber (a), a cross-linking component (b), an adhesive strength improver (c), and a catalyst (d) described in JP-A-2008-091659. An adhesive composition containing a silica-based filler (e) can be mentioned. As the peroxide-curable adhesive silicone composition, for example, as described in JP-A-2008-091659, silicone raw rubber (a), adhesion improver (c), silica-based filler (e) and organic peroxide. and an adhesive composition containing the oxide (f). The adhesive material is cured under suitable conditions.

[Jigs handled]
Next, a handling jig provided with the holding jig of the present invention will be described with reference to FIG.
As shown in FIG. 2, the handling jig 30 moves relative to the holding jig 10 along the surface 12a of the adhesive layer 12 of the holding jig 10 to detach the adhesively held adherent. A detachment tool 20 is provided. The handling jig 30 is used, for example, when a plurality of adherends are once adhered and held in order to manufacture, transport, store or inspect them, and then the adherends adhered and held are removed.

The detachment tool 20 in the handling jig 30 moves relative to the holding jig along the surface 12a of the adhesive layer 12 in the holding jig 10, and removes the adherend adhered and held by the holding jig. can be desorbed. By moving the holding jig 10 relative to the detachment tool 20 while pressing the surface 12a of the adhesive layer 12, the detachment tool 20 enters between the adhesive layer 12 and the adherend. to release the adherend from the adhesive layer 12 .
As the detachment tool 20, for example, a blade that is formed so that its thickness becomes thinner toward the tip is preferable.

The material constituting the detachment tool 20 is not particularly limited, and can be composed of metal such as stainless steel, or synthetic resin such as MC nylon. By moving the holding jig 10, the detaching tool 20 may move on the surface 12a of the adhesive layer 12 to scrape off the adherend. (not shown), the detachment tool 20 may move on the surface 12a of the adhesive layer to scrape off the adherend.
Further, below the tip of the detachment tool 20, an adherent recovery container (not shown) is arranged to collect the adherend that has been detached from the adhesive layer 12 and dropped. may

An example of a handling method for handling an adherend using the handling jig 30 (hereinafter sometimes referred to as a handling method) will be described using the handling jig 30 as an example. This one handling method includes a holding step of pressing the adherend onto the surface 12a of the adhesive layer 12 of the holding jig 10 to adhere and hold the adherend, and an adhesive holding step of the holding jig 10 to which the adherend is adhered and held. It has a detachment step of relatively moving the detachment tool 20 along the surface 12a of the layer 12 to detach the adherend.

The holding step is a step of pressing the adherend to the surface 12a of the adhesive layer 12 of the adhesive layer 12 to adhere and hold the object. In order to hold the adherends in an upright state on the holding jig 10 of the handling jig 30, a plurality of adherends are arranged in a predetermined pattern in an upright state on the adhesive layer 12, and the bottom surface thereof is held by the holding jig 10. is pressed against the surface 12a of the adhesive layer 12 in . As a result, the bottom surface of the adherend is pressed against the surface 12a of the adhesive layer 12, and the convex portions of the surface 12a of the adhesive layer 12 are elastically deformed to flatten the surface 12a of the adhesive layer 12. A plurality of adherends are adhered and held on the adhesive layer 12 by the adhesive force. As a method for holding an adherend in this way, for example, the method described in Japanese Patent Application Laid-Open No. 2008-091659 can be mentioned.

In this one handling method, in order to remove the adherend adhered to and held by the holding jig 10, the detachment tool 20 is inclined and pressed against the surface 12a of the adhesive layer 12 of the holding jig 10 to remove the adherend. The detachment tool 20 is inserted between the adhesive layer and is relatively moved along the surface 12a, so that the adherend 20 can be removed by scraping it off.

As described above, the holding jig of the present invention and the handling jig equipped with the holding jig can satisfactorily adhere and hold a large number of adherends. Since the abrasion resistance of the layer is high, the adhesive strength does not decrease due to repeated use, and the yield is high, so that high-quality workpieces can be obtained.

The handling jig 30 comprises the holding jig 10 and the detachment tool 20. In the present invention, the handling jig includes members or elements other than these, such as a storage member for the adherend and a detachment tool. A driving means, a standing arrangement plate described in Japanese Patent Application Laid-Open No. 2008-091659, and a press for pressing an adherend inserted into an arrangement hole of the standing arrangement plate toward the first holding jig. A plate or the like may be provided.

[a set of holding jigs]
Next, a set of holding jigs will be described with reference to FIG. As shown in FIG. 3, a set of holding jigs 40 includes a first holding jig 10A comprising a first substrate 11A and a first adhesive layer 12A provided on the surface of the first substrate 11A; It comprises a substrate 11B and a second holding jig 10B comprising a second adhesive layer 12B provided on the surface of the second substrate 11B. The second adhesive layer 12B in the second holding jig 10B has adhesive strength greater than the adhesive strength of the first adhesive layer 12A.

In the first holding jig 10A and the second holding jig 10B, the first adhesive layer 12A and the second adhesive layer 12B have an adhesive strength capable of holding the adherend, usually 1 to 60 g/mm ^{2 .} (according to the "Shin-Etsu Polymer Method"), and preferably has an adhesive strength of 7 to 60 g/mm ² .
Due to the difference in adhesive strength between the first adhesive layer 12A and the second adhesive layer 12B, the adherend adheres from the first adhesive layer 12A on the first holding jig 10A to the second adhesive layer 12B on the second holding jig 10B. can be transferred. In that the adherend can be smoothly transferred from the first adhesive layer 12A to the second adhesive layer 12B without falling off, the adhesive strength between the first adhesive layer 12A and the second adhesive layer 12B ("Shin-Etsu polymer method ) is preferably 15 to 43 g/mm ² , more preferably 18 to 35 g/mm ² , and particularly preferably 20 to 30 g/mm ² . The adhesive strength of the first adhesive layers 12A and 12B can be adjusted by the content of the adhesive strength improver, the content of the particulate matter, and the like.

In the set of holding jigs 40 of the present invention, one of the first holding jig and 10A and the second holding jig 10B may be the holding jig of the present invention. Both of the second holding jigs 10B may be the holding jigs of the present invention.
Further, the first adhesive layer 12A and the second adhesive layer 12B may be made of the same adhesive material or may be made of different adhesive materials.
Furthermore, in the set of holding jigs 40, the first holding jig 10A and the second holding jig 10B may be configured basically in the same manner except for adhesive force.

A set of holding jigs 40 according to the present invention is a set of adherends adhered and held by one of the holding jigs, for example, in order to manufacture adherends by sequentially applying a predetermined treatment to both ends of a plurality of adherends. It is preferably used when removing the transferred adherend after transferring the sticky substance to the other holding jig.

The set of holding jigs 40 includes the first holding jig 10A and the second holding jig 10B. In the present invention, the set of holding jigs 40 includes the first holding jig 10A and the In addition to the second holding jig 10B, other members or elements such as the third holding jig, the detachment device, etc. may be provided.

[Adhesive object holding device]
An adherend holding device using the holding jig of the present invention will be described with reference to FIG.
As shown in FIG. 4, the adherend holding device 50 is provided with a set of holding jigs including a first holding jig 10A and a second holding jig 10B, and adheres and holds the adherend as well as the first holding jig. This device is capable of transferring the adherend from the jig 10A to the second holding jig 10B. A set of holding jigs included in the adherend holding device 50 is configured in the same manner as the set of holding jigs 40 .

As shown in FIG. 4, the adherend holding device 50 is configured so that the first holding jig 10A and the second holding jig 10B are arranged so that the first adhesive layer 12A and the second adhesive layer 12B face each other. Placeable. As a result, the adherend adhered to and held by the first holding jig 10A can be transferred to the second holding jig 10B while maintaining the upright state, for example. Such arrangement of the first adhesive layer 12A and the second adhesive layer 12B may be realized by displacement means having a mechanical configuration, or may be realized manually.

As shown in FIG. 4, the first holding jig 10A is configured such that the surface side of the substrate 11A on which the first adhesive layer 12A is not formed is positioned at the tip of a supporting arm 53 extending downward from the holding jig displacement means 52. It is fixed to the provided support member 54 and supported by the holding jig displacement means 52 .

The holding jig displacing means 52 is attached to the rail 51 and is configured to be horizontally movable along the rail 51 and to vertically move the support arm 53 . Therefore, the first holding jig 10A supported by the holding jig displacement means 52 can be freely moved horizontally and vertically by the holding jig displacement means 52. As shown in FIG.

Further, the holding jig displacement means 52 is configured to be rotatable about the rail 51 as the central axis. When the holding jig displacing means 52 is rotatable in this manner, the state of the first holding jig 10A can be changed to a state in which the adherend is suspended by the first adhesive layer 12A and a state in which the adherend is held by the first adhesive layer 12A. The layer 12A can be in a state of standing and holding.

Further, as shown in FIG. 4, the second holding jig 10B is a holding jig in which the surface side of the second substrate 11B on which the second adhesive layer 12B is not formed extends upward from the holding jig displacement means 56. It is fixed to a support member 58 provided at the tip of the displacement means 57 and supported by the holding jig displacement means 56 .

The holding jig displacement means 56 is attached to a rail 55 substantially perpendicular to the rail 51 and is basically formed in the same manner as the holding jig displacement means 52 . Therefore, the second holding jig 10B supported by the holding jig displacement means 56 can be freely moved in the horizontal direction and the vertical direction by the holding jig displacement means 56, and the rail 55 is the central axis. It can rotate around.

The motion mechanism in the holding jig displacement means 52 and the holding jig displacement means 56 is not particularly limited. A motion mechanism equipped with transmission means, such as gears, wires, etc., for transmission to the support arm 53 or 57 can be used. This movement mechanism may be controlled by a normal personal computer or the like, or may be manually controlled.

In the adherend holding device 50, the first holding jig 10A and the second holding jig 10B, and the first adhesive layer 12A and the second adhesive layer 12B face each other in the vicinity of the position where the rail 51 and the rail 55 intersect. It can be arranged so as to face Thereby, the adherend adhered and held by the first holding jig 10A can be transferred to the second holding jig 10B.

Next, a method of manufacturing a chip capacitor by forming electrodes on a chip capacitor main body, which is one of electronic components, using the adherend holding apparatus 50 will be described with reference to FIG. The action of the holding device 50 will be described.
As shown in FIG. 5, the chip-capacitor body 61 has a rectangular prism shape, and electrodes 62 and 63 are formed at both ends of the chip-capacitor body 61, respectively.

In order to form the electrode 62 on the chip capacitor body 61 using the adherend holding device 50, first, as shown in FIG. Specifically, the holding jig displacing means 52 is rotated about the rail 51 as the central axis to dispose the first holding jig 10A so that the first adhesive layer 12A faces upward. As described above, the chip capacitor main body 61 is pressed against the first adhesive layer 12A using the erected arrangement plate. Then, the first adhesive layer 12A is elastically deformed and flattened by the chip-capacitor body 61, and the chip-capacitor body 61 is adhesively held by the first adhesive layer 12A.

After the chip capacitor bodies 61 are adhesively held in this manner, the holding jig displacement means 52 is rotated about the rail 51 as the central axis, and a large number of chip capacitor bodies 61 are suspended on the first adhesive layer 12A. be in a retained state. Next, the holding jig displacing means 52 (see FIG. 4) is horizontally moved along rails 51 (see FIG. 4) to move a number of suspended chip capacitor bodies 61 above a conductive paste bath (not shown). , and the support arm 53 is moved downward to immerse the lower end of the chip capacitor body 61 in the conductive paste bath. After a while, the support arm 53 is moved upward to dry the conductive paste applied to the chip capacitor body 61 . Then, as shown in FIG. 5(b), electrodes 62 having a substantially uniform size are formed at the lower ends of the respective chip capacitor bodies 61 suspended and held by the first adhesive layer 12A. At this time, since the chip capacitor main body 61 is adhered and held by the first adhesive layer 12A, it does not fall off or tilt from the first adhesive layer 12A during immersion in the conductive paste and when it is pulled up from the conductive paste. Nor.

Next, the holding jig displacing means 52 is horizontally moved along the rail 51 to horizontally move the first holding jig 10A above the second holding jig 10B, and as shown in FIG. 5(c), The support arm 53 is moved downward to lower the first holding jig 10A toward the second holding jig 10B. The first holding jig 10A is further lowered to press the lower end of the chip capacitor body 61 adhesively held by the first holding jig 10A against the second adhesive layer 12B of the second holding jig 10B. As a result, the second adhesive layer 12B is elastically deformed and flattened by the chip capacitor body 61, and exerts a greater adhesive force than the first adhesive layer 12A. 61 is adhered to the second adhesive layer 12B with a large adhesive force. Next, when the support arm 53 is moved upward to raise the first holding jig 10A, the second adhesive layer 12B develops a desired adhesive strength, and the adhesive strength with the first adhesive layer 12A increases. The chip capacitor main body 61 is strongly adhered to the second adhesive layer 12B through the electrode 62, and the chip capacitor main body is attached to the first adhesive layer 12A of the first holding jig 10A. 61 departs with little remaining. In this manner, a large number of chip capacitor bodies 61 can be transferred from the first holding jig 10A to the second holding jig 10B without dropping or overturning.

Next, the holding jig displacing means 56 (see FIG. 4) is rotated about the rail 15 (see FIG. 4) as the central axis, and the chip capacitor main body 61 is suspended and held by the second holding jig 10B. be made. After that, a conductive paste is applied to the lower end of the suspended chip capacitor body 61 in the same manner as described above and dried to form an electrode 63 .

In this manner, electrodes 62 and 63 of approximately equal size are formed on both ends of the chip capacitor body 61 on the second adhesive layer 12B of the second holding jig 10B, as shown in FIG. 5(d). A chip capacitor 60 is attached and held in a suspended state.

Finally, as shown in FIG. 5(e), the handling device 30 is used to press the detachment tool 20 against the surface 12a of the second adhesive layer 12B of the second holding jig 10B, thereby removing the holding jig 10B. , the detachment tool 20 is inserted between the second adhesive layer 12A and the chip capacitors 60, and the chip capacitors 60 are sequentially scraped off.

As described above, by using the adherend holding device 50 having the holding jig of the present invention, a large number of adherends can be adhered and held on one of the holding jigs in an upright state at once as desired. In addition, when transferring the adherend from one holding jig to the other holding jig, it is possible to effectively prevent the adherend from being left behind on one holding jig and tipping over. The object to be adhered can be transferred from one holding jig to the other holding jig while maintaining the upright state. By using this adherend holding device 50, the adherend can be manufactured with good productivity.

In addition, since the holding jig of the present invention is excellent in wear resistance, even if the scraping step shown in FIG. Since the state is maintained, it is possible to manufacture high-quality electronic components with a high yield.

The substrate 11 and the adhesive layer 12 may have any shape as long as they have a shape suitable for manufacturing an electronic component or the like, and may be of any shape depending on the shape of the adherend, the shape of the adherend holding device, the manufacturing process, the workability, and the like. be done. For example, the holding jig may be a square, rectangular, pentagonal, hexagonal, or other polygonal shape, circular, elliptical, irregular, or a plate-like shape in which these shapes are combined. Also, the one side of the substrate 11 on which the adhesive layer 12 is not formed may have a flat shape or a three-dimensional shape such as a semi-cylindrical shape.

The holding jig 10 has a substrate 11 which is a rectangular plate-like body, but in the present invention, the holding jig may have a support member formed on a part of the adhesive layer. Also, the support member may be formed of a flexible material together with the adhesive layer.

The adherend holding device 50 includes a first holding jig 10A and a second holding jig 10B. In addition to the jig 10B, other members or elements such as the third holding jig, the detachment device, etc. may be provided.

Further, in the sticky object holding device 50, the rails 11 and 15 are arranged so as to intersect substantially at right angles. good.

In the sticky object holding device 50, the holding jig displacement means 52 and 56 are configured to be rotatable about the rails 51 and 55 as central axes. may be configured to disable.

Hereinafter, the present invention will be described in detail with reference to examples. It should be noted that the present invention is by no means limited to the examples shown below.

(Example 1)
A square plate-shaped body with a side length of 120 mm was cut out from a stainless steel plate (made of SUS304, thickness 0.5 mm). After degreasing one surface of this plate-like body with acetone, a primer for silicone rubber adhesion (trade name “X-33-156-20”, manufactured by Shin-Etsu Chemical Co., Ltd.) is applied to the adhesive layer forming region (length of one side An appropriate amount was applied to a square with a length of 110 mm (the center of the square coincides with the center of the disc) and dried in an environment of 23° C. to form a primer layer (thickness 3 μm). A substrate was thus produced.

As an adhesive material for forming the adhesive layer 12, an addition reaction curing adhesive silicone composition having the following composition was prepared.
・A silicone rubber composition containing a silicone raw rubber (a), a cross-linking component (b), an adhesion improver (c), and a catalyst (d) (trade name “X-34-632 A/B”, Shin-Etsu Chemical Co., Ltd. Co., Ltd.) 100 parts by mass Silica (average secondary particle diameter 2 μm) 2 parts by mass

The prepared substrate was housed in a mold, and the prepared addition reaction curable adhesive silicone composition was placed in a cavity (rectangular parallelepiped with a side length of 110 mm and a thickness of 0.8 mm) formed on the adhesive layer forming area. An object was injected, transfer molded under conditions of 120° C. and 10 MPa, and then further cured under conditions of 200° C. and 4 hours to form an adhesive layer on the surface of the substrate to produce a holding jig.

(Example 2)
A holding jig was manufactured in basically the same manner as in Example 1, except that the amount of silica added was changed to 4 parts by mass.

(Example 3)
A holding jig was manufactured in basically the same manner as in Example 1, except that the amount of silica added was changed to 6 parts by mass.

(Example 4)
A holding jig was manufactured in basically the same manner as in Example 1, except that the amount of silica added was changed to 8 parts by mass.

(Comparative example 1)
A holding jig was manufactured in basically the same manner as in Example 1, except that the amount of silica added was 0 parts by mass.

(Comparative example 2)
A holding jig was manufactured in basically the same manner as in Example 1, except that silica having an average secondary particle size of 6 μm was used and the amount added was 2 parts by mass.

(Comparative Example 3)
A holding jig was manufactured in basically the same manner as in Example 1, except that silica having an average secondary particle size of 6 μm was used and the amount added was 4 parts by mass.

(Comparative Example 4)
A holding jig was manufactured in basically the same manner as in Example 1, except that silica having an average secondary particle size of 6 μm was used and the amount added was 8 parts by mass.

[evaluation]
The skewness Rsk, the load length ratio Mr1 of the core portion, the load length ratio Rmr (50%), the average spacing of the unevenness Sm, and the hardness on the surface of the adhesive layer of the holding jig manufactured in each example and each comparative example. , tensile strength, tear strength, adhesion and abrasion resistance were measured.

(Surface roughness)
The skewness Rsk and the load length ratio Rmr(50) were measured according to JISB0601:2001, the load length ratio Mr1 of the core part was measured according to JISB0671-2, and the average interval Sm of unevenness was measured according to JISB0601:1994. The measurement was performed with a laser microscope V8700 (manufactured by KEYENCE CORPORATION) with a measurement length of 280 μm. The average value of N=5 measurements was used as the measured value.

(Rubber physical properties)
The rubber hardness was measured using a durometer A according to JIS K 6253-3.
Tensile strength and tear strength were measured according to JIS K 6251.

(Adhesive force)
Measured by the above "Shin-Etsu polymer method".

(Abrasion resistance test)
The abrasion resistance test of the adhesive layer was performed according to JIS K 7204 using a Taber abrasion tester (trade name "No 101 Taber type ablation tester", manufactured by Yasuda Seiki Seisakusho Co., Ltd.) under the following conditions, 1000 rotations. , 3000 rpm and 5000 rpm were measured by mass. The whetstone was polished at the end of one sample.
Grindstone: CS-17
acceleration speed: 60rpm
Load: 4.9N

Table 1 shows the evaluation results.

As shown in Table 1, it can be seen that the holding jig of the present invention having the surface skewness Rsk of the adhesive layer of less than 0 has a much smaller amount of wear than the comparative example.

Reference Signs List 10, 10A, 10B holding jig 11, 11A, 11B substrate 12, 12A, 12B adhesive layer 12a surface of adhesive layer 20 detachment tool 30 handling jig 40 set of holding jigs 50 adherend holding device 51, 55 Tracks 52, 56 Holding jig displacement means 53, 57 Support arms 54, 58 Support member 57 Holding jig displacement means 60 Chip capacitor 61 Chip capacitor body 62, 63 Electrodes

Claims (5)

comprising a substrate and an adhesive layer provided on the surface of the substrate,
The adhesive layer is made of silicone rubber, the skewness Rsk on the surface of the adhesive layer is less than 0, and the load length ratio Rmr (50%) on the surface of the adhesive layer is 50% or more and 65% or less. jig. 2. The holding jig according to claim 1, wherein the load length ratio Mr1 of the core portion on the surface of the adhesive layer is 6% or more and 10% or less. 3. The holding jig according to claim 1, wherein an average interval Sm of irregularities on the surface of said adhesive layer is 4 [mu]m or more and 8 [mu]m or less. 4. The holding jig according to any one of claims 1 to 3 , wherein the silicone rubber of said adhesive layer contains silica particles. 5. The holding jig according to claim 4 , wherein the silica particles have an average secondary particle size of 1 μm or more and 5 μm or less.

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