JP4947728B2 - Holding transfer jig and a set of holding transfer jig - Google Patents

Description

  The present invention relates to a holding transfer jig and a set of holding transfer jigs. More specifically, the present invention is capable of sticking and holding a large number of objects to be adhered without damaging the objects to be adhered, and a large number of objects to be adhesively held. Holding and transferring jigs that can transfer adhesive objects all at once, and many adhesive objects that can be adhesively held without damaging the objects to be adhered and many that are adhesively held on one holding and transferring jig The present invention relates to a set of holding transfer jigs capable of transferring the object to be adhered to the other holding transfer jig at a time.

  2. Description of the Related Art Conventionally, when manufacturing small parts such as a chip capacitor, a holding jig capable of sticking and holding a member for small parts capable of manufacturing the small parts on the surface thereof has been used. Such a holding jig is usually provided with an elastic member having an adhesive surface and a jig body that supports the elastic member. For example, Patent Document 1 discloses "a perspective view showing an electronic component chip holder 21 according to an embodiment of the present invention. The holder 21 includes a plate-like main body 22 made of a material such as metal or resin. The adhesive film 23 is formed on the main body 22, thereby providing the adhesive surface 24 on the surface of the adhesive film 23 ”(see column 0029 and FIG. 1).

  Taking a chip capacitor as an example, a chip capacitor is formed by forming electrodes at both ends in the axial direction of a prism or cylinder, and such a jig body has a prism or cylinder on its surface. An end face formed by sticking and holding the formed small part member, forming one electrode on the lower end face of the small part member, then removing the adherend from the holding jig and then forming the electrode Needs to be held in close contact with the surface of the holding jig again.

  As a holding jig that meets this need, for example, an electronic component chip holder described in Patent Document 1 is “for an electronic component chip for holding an electronic component chip having first and second end faces facing each other”. In the holder, the electronic component chip holder includes a first member and a second member, the first member includes a first adhesive surface for holding the electronic component chip, and the second member includes A second adhesive surface that adheres to the second end face of the electronic component chip and that holds the electronic component chip and that provides an adhesive force stronger than the adhesive force provided by the first adhesive surface. (Refer to claim 1 of Patent Document 1).

  In this electronic component chip holder, in order to adhere and hold the electronic component chip on the first adhesive surface, “a flat press plate 27 is used. Is pressed toward the first holder 21a "(see column 0039 of Patent Document 1). In addition, in order to cause a large number of electronic component chips adhered and held on the first adhesive surface to be adhered and retained on the second adhesive surface, “the first holder 21 a holding the electronic component chip 1 is indicated by an arrow 32. Next, the second adhesive surface 24b is adhered to the second end face 3 of each electronic component chip 1 by being brought close to the second holder 21b, and in this step, each electronic component is interposed via the first holder 21a. The chip 1 is pressed toward the second holder 21b as in the step shown in FIG. 3 ”(see column 0039 of Patent Document 1).

  As described above, in the conventional holding jig, when the object to be adhered is held in an adhesive manner, the object to be adhered is pressed against the holding jig, and the object to be adhered is transferred to another holding jig. In this case, the distance between both holding jigs is shortened to a distance shorter than the length of the object to be adhered, and the objects to be adhered are pressed by both holding jigs.

  However, when the flatness of the electronic component chip holder 21, particularly the adhesive film 23, is low, when the dimensional accuracy of the small parts to be adhesively held is low, a large number of small parts may be adhesively held on the first adhesive surface. In addition, it is impossible not only to transfer a large number of small parts adhesively held on the first adhesive surface to the second adhesive surface, but also to damage the small parts.

  Small parts in recent years have been miniaturized, and their dimensional tolerances have been decreasing year by year. There are also small parts with low dimensional accuracy that do not adequately accommodate such dimensional tolerances. If such a small component is used, it may not be possible to press and hold all the small components against the first adhesive surface, and the first adhesive surface and the second adhesive surface may not be retained. Even if the small components are pressed, all the small components that are adhesively held on the first adhesive surface are not pressed against the second adhesive surface, and may not be transferred to the second adhesive surface. On the other hand, when all the small components are strongly pressed against the first adhesive surface, and in order to press all the small components that are adhesively held on the first adhesive surface against the second adhesive surface, When the distance from the adhesive surface 2 is further reduced, a small component having a relatively large size may be damaged.

  The surface of the electronic component chip holder 21, particularly the adhesive film 23, is smoothed. However, with the recent miniaturization of small components, the electronic component chip holder 21, particularly the adhesive film 23, is required to have a very high flatness. It has come to be. On the other hand, in order to satisfy the recent demand for improving productivity, it is effective to increase the number of small parts to be adhesively held, and the holding transfer jig is also enlarged. Then, it is difficult to adjust the flatness of the electronic component chip holder 21, particularly the adhesive film 23, and even if the flatness is adjusted high, the enlarged electronic component chip holder 21, particularly the central portion of the adhesive film 23, As a result, the flatness of the electronic component chip holder 21, particularly the adhesive film 23, is greatly reduced. As a result, a large number of small components cannot be adhered and held on the first adhesive surface, or all the small components adhered and retained on the first adhesive surface cannot be transferred to the second adhesive surface. .

Japanese Patent No. 2682250

  The present invention provides a holding and transferring jig capable of sticking and holding a large number of objects to be adhered without damaging the objects to be adhered and simultaneously transferring a large number of objects to be adhesively held. With the goal.

  In addition, the present invention is capable of sticking and holding a large number of objects to be adhered without damaging the objects to be adhered, and at the same time holding a number of objects to be adhered and held on one holding and transferring jig by the other holding and transferring jig. It is an object of the present invention to provide a set of holding transfer jigs that can be transferred at once.

As means for solving the problems,
Claim 1 is a holding and transfer jig comprising a base and an adhesive sheet capable of sticking and holding an adherend on the surface, wherein the base is formed along an edge thereof And an internal space surrounded by the dam portion, and a vent hole communicating with the internal space, and the adhesive sheet is fixed to the dam portion so as to cover the internal space A holding transfer jig characterized by
A second aspect of the present invention provides a holding transfer jig comprising a holding transfer jig including a base and an adhesive sheet capable of holding an object to be adhered to the surface. At least one of the jigs is a holding and transferring jig according to claim 1, wherein the holding and transferring jig is a set.

  In the holding and transferring jig according to the present invention, since the adhesive sheet is fixed so as to cover the internal space formed on the substrate, the holding and transferring jig can be used even if the flatness of the adhesive sheet is low. Even if the size is increased, the pressure-sensitive adhesive sheet can be raised by filling the internal space with gas. Then, when the object to be adhered is held in an adhesive state, the object to be adhered contacts the pressure-sensitive adhesive sheet without pressing the object to be adhered to the holding transfer jig more than necessary. In addition, when transferring an object to be adhered, the object to be adhered contacts another holding transfer jig by the adhesive sheet raised in the gas without pressing the object to be adhered more than necessary between the holding transfer jigs. Then, a large number of objects to be adhered and held by the holding and transfer jig according to the present invention can be transferred to other holding and transferring jigs at once, or the pressure-sensitive adhesive sheet is raised by another A large number of objects to be adhered can be brought into contact with the holding transfer jig and transferred to the holding transfer jig according to the present invention at once.

  And the holding transfer jig which concerns on this invention can adjust the protruding amount of an adhesive sheet as desired by adjusting the pressure of the gas with which the said interior space is filled. Then, even if the dimensional accuracy of the adherend is low, it is not necessary to press the adherend to the holding transfer jig more than necessary when holding the adherend, and the adherend having a relatively large size is not required. The object pushes the adhesive sheet back to the substrate side, and the pressing force can be prevented from concentrating on the adherend. Furthermore, when transferring the object to be adhered, it is not necessary to press the object to be adhered more than necessary between the holding transfer jigs, and the object to be adhered having a relatively large size pushes the adhesive sheet back to the substrate side, It is possible to prevent the pressing force from being concentrated on the adherend.

  Therefore, according to the present invention, a holding transfer jig capable of sticking and holding a large number of objects to be adhered without damaging the objects to be adhered and simultaneously transferring a large number of objects to be adhesively held. Can be provided.

  Further, since the set of holding and transferring jigs according to the present invention includes the holding and transferring jig according to the present invention, it is possible to stick and hold a large number of objects to be bonded without damaging the objects to be bonded. At the same time, a large number of objects to be adhered can be transferred at once. Therefore, according to the present invention, a large number of objects can be adhered and held without damaging the objects to be adhered, and a large number of objects to be adhered and held in one holding transfer jig can be held and transferred to the other. A set of holding and transfer jigs that can be transferred to the jigs at once can be provided.

  A holding transfer jig as an embodiment of the holding transfer jig according to the present invention will be described with reference to the drawings. As shown in FIGS. 1 and 2, the holding and transferring jig 1 includes a base 2 and an adhesive sheet 3 that can hold and adhere an adherend to the surface. The adherend can be adhered and held on the surface (adhesive surface).

  Examples of the object to be adhered and held by the holding and transfer jig according to the present invention include small component members capable of manufacturing small components, such as small instrument members, small machine element members, and small electronic component members. It is done. In addition, since the manufacture of small parts includes a process of transporting small parts, the adherend includes small parts themselves, for example, small instruments, small machine elements, and small electronic parts. Therefore, in the present invention, it is not necessary to clearly distinguish the small component from the small component member. Among these adherends, small electronic components and / or members for small electronic components and the like are preferable as the adherends suitable for the holding and transferring jig according to the present invention to stick and hold. As the small electronic component and the small electronic component member, for example, a capacitor chip (sometimes referred to as a chip capacitor), an inductor chip, a resistor chip, an FPC, a wafer, or a finished product or an unfinished product, or these Examples include a manufacturable member.

  As shown in FIGS. 1 to 3, the base body 2 includes a dam portion 4 formed along an edge thereof, an internal space 5 surrounded by the dam portion 4, and a vent hole communicating with the internal space 5. 6.

  As shown in FIGS. 1 to 3, the dam portion 4 is flush with each edge of the rectangular plate-like body 7 (see FIG. 2), and on each edge of the rectangular plate-like body 7. It is formed to make a round along. In other words, the dam portion 4 is a frame-shaped peripheral wall portion protruding from each end edge of the plate-like body 7 in the thickness direction. The height of the dam portion 4 is not particularly limited as long as a hollow space 8 (see FIG. 2) in which a gas can be pressed between the base 2 and the adhesive sheet 3 is defined, but is too high. As a result, the adhesive holding state of the object to be adhesively held becomes unstable. Therefore, the height of the dam portion 4 is usually 10 to 1000 μm, preferably 100 to 500 μm. Although the top part of the dam part 4 is made into the plane, if the adhesive sheet 3 can be fixed, the top part of the dam part 4 may not be a plane. The width of the dam portion 4 is appropriately adjusted according to the size of the adhesive sheet 3 and the like.

  As shown in FIGS. 1 to 3, particularly FIG. 2, the plate-like body 7 supports the adhesive sheet 3 through a dam portion 4 formed on the edge thereof. The disk-like body 7 is formed in a rectangular shape, but can be in various forms based on various design changes as long as the adhesive sheet 3 can be held or supported via the dam portion 4. For example, the plate-like body 7 is formed into a plate-like body having a desired dimension according to productivity, such as a polygon such as a pentagon, a hexagon, a circle, an ellipse, an indeterminate shape, or a combination thereof. can do. The thickness of the plate-like body 7 may be determined as long as it is adjusted so that the dam portion 4 and the adhesive sheet 3 can be supported. For example, the disk-shaped body 7 is adjusted to a thickness of 1 to 20 mm.

  As shown in FIGS. 1 to 3, the base 2 has an internal space 5 surrounded by a dam portion 4. In other words, the internal space 5 is defined as an open space having the plate-like body 7 as a bottom surface and the dam portion 4 as a side surface. The internal space 5 is adjusted to have an opening area smaller than the bottom area of the adhesive sheet 3, and the depth thereof matches the height of the dam portion 4. As shown in FIG. 2, the internal space 5 becomes a hollow space 8 into which gas is press-fitted when the holding transfer jig 1 is used.

  As shown in FIGS. 1 to 3, the base 2 has a vent hole 6 through which a gas flows. The vent hole 6 is formed so as to penetrate from the bottom surface of the internal space 5 in the thickness direction of the disc-like body 7, and communicates the internal space 5 with the outside of the base 2. That is, as shown in FIG. 2, the vent 6 communicates the hollow space 8 with the outside of the holding transfer jig 1 when the holding transfer jig 1 is used. The vent 6 is connected to an external compression device such as a compressor (not shown), and serves as a passage for pressurizing gas into the internal space 5, that is, the hollow space 8. The diameter and number of the air holes 6 are not particularly limited as long as a gas can be press-fitted into the internal space 5. In this example, one air hole 6 having a diameter of 0.2 to 3 mm is formed. .

  The substrate 2 and the plate-like body 7 and the dam part 4 constituting the substrate 2 may be pressed when the adherend is held while being pressed, or may be pressed by another holding transfer jig when the adherend is transferred. Moreover, even if a gas is press-fitted between the base 2 and the adhesive sheet 3, it is formed of a material having a strength that does not deform. Examples of such a material include metals such as carbon steel, stainless steel, aluminum alloy, and nickel alloy, and resins. Among these, it is good to form with stainless steel or aluminum alloy from a viewpoint of workability and operability. The plate-like body 7 and the dam portion 4 may be formed of the same material or different materials.

As shown in FIGS. 1 and 2, the adhesive sheet 3 is formed in a rectangular sheet shape so that a large number of objects to be adhered according to desired productivity can be held by adhesion. Tacky surface of the adhesive sheet 3 is formed, for example, with a cured product of the later-described adhesive materials, adhesive strength capable of holding adhesive and adherend include, for example, has an adhesive strength of 1 to 50 g / mm ² ing. The adhesive strength of the adhesive sheet 3 can be measured according to the “Shin-Etsu Polymer Method” described in Japanese Patent Application Laid-Open No. 2007-165397. The adhesive sheet 3 has a surface hardness of 5 to 60 (JIS K6253 [durometer E]). The pressure-sensitive adhesive sheet 3 is capable of holding the object to be adhered in a stable pressure-sensitive adhesive holding state, and is preferably adjusted to a uniform thickness that is easily raised by the gas press-fitted into the hollow space 8. The thickness is adjusted to 0.1 to 5 mm. In addition, since this adhesive sheet 3 protrudes at the time of adhesion holding and transfer of the adherend as will be described later, the adhesive surface may not be adjusted to be highly smooth.

  As a material for forming the pressure-sensitive adhesive sheet 3, any material may be used as long as it can provide the pressure-sensitive adhesive sheet 3 with an adhesive force in the above range. Examples of such an adhesive material include fluorine resin or fluorine rubber, fluorine composition containing fluorine resin or fluorine rubber, silicone resin or silicone rubber, silicone composition containing silicone resin or silicone rubber, and the like. Products, urethane elastomers, natural rubber, and various elastomers such as styrene-butadiene copolymer elastomer. Among these, “silicone raw rubber (a), crosslinking component (b), adhesive component (c), catalyst (d), and silica-based filler (e) described in JP2007-307529A. “Adhesive Silicone Rubber Composition”, “Silicone Raw Rubber (a), Adhesive Component (c), Silica-Based Filler (e), and Organic Peroxide (f)” described in JP-A-2007-307529 And an adhesive silicone rubber composition containing

  The holding transfer jig 1 is manufactured by fixing the adhesive sheet 3 to the dam portion 4 of the base 2 with, for example, an adhesive. If the base | substrate 2 can be formed in a desired shape with the said material, the preparation method will not be specifically limited, For example, vacuum forming, injection molding, metal mold | molding etc. are mentioned. The ventilation hole 6 may be excavated separately. The base body 2 and the dam portion 4 are preferably formed integrally, but may be separately manufactured. The adhesive sheet 3 is produced by molding the material into a predetermined shape and size.

  The holding and transferring jig according to the present invention is not limited to the above-described embodiments, and various modifications can be made within a range in which the object of the present invention can be achieved. For example, in the holding and transferring jig 1, the substrate has one internal space 5, but in the present invention, the substrate may have a plurality of internal spaces.

  Further, in the holding transfer jig 1, the base 2 is provided with a dam portion 4 for fixing the adhesive sheet 3. In this invention, the base is provided with an adhesive sheet in the internal space in addition to the dam portion. A holding portion for holding may be formed. Examples of the holding portion include a convex body that protrudes in the thickness direction from the disk-shaped body, such as a columnar body and a wall body. This convex body is usually adjusted to the same height as the dam part.

  Further, in the holding transfer jig 1, the air holes 6 are formed through the bottom surface of the internal space 5 in the thickness direction of the disc-like body 7. In the present invention, the air holes are formed from the surface of the internal space to the substrate. May be drilled in the thickness direction up to a predetermined position, and then drilled in the base from there to the side surface of the disk-shaped body.

  A set of holding and transferring jigs as an example of the set of holding and transferring jigs according to the present invention will be described with reference to the drawings. As shown in FIG. 4, the set of holding transfer jig 10 includes a holding transfer jig 1A and a holding transfer jig 1B. The holding transfer jig 1A includes a base 2A and an adhesive sheet 3A that can hold an object to be adhered to the surface. The holding transfer jig 1B includes a base 2B and an object to be adhered to the surface. And an adhesive sheet 3B that can be adhesively held. The holding transfer jig 1A and the holding transfer jig 1B are basically configured in the same manner as the holding transfer jig 1, that is, the set of holding transfer jigs 10 is the holding transfer jig 10 according to the present invention. Two holding transfer jigs 1 which are one embodiment of the transfer jig are provided.

In a set of holding transfer jigs 10, the adhesive sheet 3A and the adhesive sheet 3B each have an adhesive force of the adhesive sheet 3B within the range of the adhesive force according to the “Shin-Etsu Polymer Method”. It is adjusted to have a greater adhesive strength than force. Since the adhesive sheet 3A and the adhesive sheet 3B have such an adhesive force relationship, the object to be adhered is transferred from the adhesive sheet 3A of the holding transfer jig 1A to the adhesive sheet 3B of the holding transfer jig 1B. be able to. The difference in adhesive strength between the adhesive sheet 3A and the adhesive sheet 3B by the “Shin-Etsu Polymer Method” in that the adherend can be smoothly transferred from the adhesive sheet 3A to the adhesive sheet 3B without dropping off. Is preferably 15 to 43 g / mm ² .

  The set of holding and transferring jigs according to the present invention is not limited to the above-described embodiments, and various modifications can be made within a range in which the object of the present invention can be achieved. For example, in the set of holding transfer jigs 10, the holding transfer jig includes two holding transfer jigs according to the present invention. In the present invention, at least one set of holding transfer jigs includes at least one holding transfer jig. Any holding and transfer jig according to the present invention may be used. An example of a holding jig other than the holding transfer jig according to the present invention is a holding jig 12 shown in FIG. As shown in FIG. 6, the holding jig 12 includes a flat substrate 2 </ b> C in which no dam portion and a vent hole are formed, and an adhesive sheet 3 formed on the substrate 2 </ b> C. Any holding jig can be used without any particular limitation.

  Further, in the set of holding transfer jigs 10, the holding transfer jig includes two holding transfer jigs according to the present invention. In the present invention, the set of holding transfer jigs includes three or more holding transfer jigs. A holding transfer jig may be provided.

  A method for forming an electrode on a chip capacitor body 11 which is one of small electronic components using a set of holding transfer jig 10 which is an embodiment of a set of holding transfer jig according to the present invention, In addition, the operation of the holding transfer jig 1 and the set of holding transfer jig 10 will be described. Note that the chip capacitor is formed, for example, by forming electrodes on both ends of the chip capacitor body 11 forming a quadrangular prism.

  First, a large number of chip capacitor bodies 11 are adhered and held on the holding transfer jig 1 </ b> A of the set of holding transfer jigs 10. As a method of sticking and holding a large number of chip capacitor bodies 11 on the holding and transferring jig 1A, for example, a method described in Japanese Patent Application Laid-Open No. 2007-165397 can be given. Briefly, the chip placed in the placement hole is placed on the adhesive sheet 3A by placing on the adhesive sheet 3A a standing arrangement plate or the like in which a large number of placement holes for accommodating a large number of chip capacitor bodies 11 are stood up. By pressing the lower end surface of the capacitor body 11 against the adhesive sheet 3A, the holding and transferring jig 1A can adhere and hold a large number of chip capacitor bodies 11. When the chip capacitor body 11 is pressed against the pressure sensitive adhesive sheet 3A, gas flows into the hollow space 8A of the holding transfer jig 1A through the air holes 6A, and the pressure sensitive adhesive sheet 3A rises against the pressure of the chip capacitor main body 11. Press-fit as shown.

  Then, since it is not necessary to press the chip capacitor body 11 against the adhesive sheet 3A more than necessary, many chip capacitor bodies 11 are adhered to the adhesive sheet 3A all at once without damaging the many chip capacitor bodies 11. Can be retained. A specific description will be given with reference to FIG. 5 on the assumption that the holding and transferring jig 1B shown in FIG. As described above, when the lower end surface of the chip capacitor body 11 is pressed against the adhesive sheet 3A with the upright arrangement plate, the dimensional accuracy of the chip capacitor body 11 is low, and the length in the axial direction is another chip capacitor body 11A. Even if a longer chip capacitor body 11B is present, the adhesive sheet 3A can be pushed back to the base 2A side by an excessive length against the pressure of the gas that is pressed into the raised adhesive sheet 3A. When the long chip capacitor body 11B pushes the adhesive sheet 3A back to the base body 2A in this way, even if the chip capacitor body 11B is pressed by the standing arrangement plate that is not deformed, the long chip capacitor body 11B comes into contact with the adhesive. The vicinity of the portion of the sheet 3A is recessed to offset the excessive length of the long chip capacitor body 11B, and the other chip capacitor body 11A comes into contact with the adhesive sheet 3A. Thus, in the holding transfer jig 1A, in addition to the long chip capacitor body 11B, a large number of chip capacitor bodies 11A that are shorter (higher in dimensional accuracy) than the chip capacitor body 11B may come into contact with the adhesive sheet 3A. it can. Even if a large number of chip capacitor bodies 11A are brought into contact with the adhesive sheet 3A, the long chip capacitor body 11B pushes back the adhesive sheet 3A by the excessive length as described above. Is applied to the adhesive sheet 3A. Therefore, when sticking and holding a large number of chip capacitor bodies 11 to the adhesive sheet 3A, it is not necessary to press the chip capacitor body 11 more than necessary even if the standing arrangement plate or the like that does not deform is used. The chip capacitor body 11 can be adhered and held at once without damaging the chip capacitor body 11.

  After the large number of chip capacitor main bodies 11 are adhered and held on the adhesive sheet 3A, the standing arrangement plate is removed. The electrodes are formed by immersing the lower ends of a large number of chip capacitor bodies 11 held in an adhesive state on the adhesive sheet 3A of the holding transfer jig 1A in this manner in a conductive paste bath.

  Next, as shown in FIG. 5, the holding transfer jig 1A and the holding transfer jig 1B are arranged so that the adhesive sheet 3A of the holding transfer jig 1A faces the adhesive sheet 3B of the holding transfer jig 1B. And the lower end part in which the electrode of many chip capacitor | condenser main bodies 11 adhere | attached and hold | maintained at the adhesive sheet 3A is pressed against the adhesive sheet 3B.

  When the chip capacitor body 11 is pressed against the adhesive sheet 3B, gas is passed through the air holes 6A into the hollow space 8A of the holding transfer jig 1A, and the adhesive sheet 3A rises against the chip capacitor body 11 ( In FIG. 5, the pressure-sensitive adhesive sheet 3A is in a substantially flat state.) As shown in FIG. 5, the pressure-sensitive adhesive sheet 3B is inserted into the hollow space 8B of the holding transfer jig 1B. It press-fits so that it may protrude against the press of the capacitor body 11. In addition, the pressure of the gas with which the hollow space 8A and the hollow space 8B are filled may be the same or different, and is appropriately adjusted according to the thickness of the adhesive sheet.

  Then, for example, as shown in FIG. 5, even if a long chip capacitor body 11B exists, both ends of this long chip capacitor body 11B are held elastically by the adhesive sheet 3A and the adhesive sheet 3B. Therefore, the protruding adhesive sheet 3A and adhesive sheet 3B can be pushed back to the base 2A side and the base 2B side by an excessive length against the pressure of the injected gas. Then, as described above, the adhesive sheet 3A with which the long chip capacitor body 11B abuts and the vicinity of the adhesive sheet 3B are recessed so that the excessive length of the long chip capacitor body 11B is offset, and other chip capacitors The main body 11A contacts the adhesive sheet 3B. Further, the pressing force applied to the long chip capacitor body 11B is dispersed by the adhesive sheet 3A and the adhesive sheet 3B. Therefore, when transferring a large number of chip capacitor bodies 11 from the adhesive sheet 3A to the adhesive sheet 3B, even if the chip capacitor body 11 is not pressed more than necessary, the multiple chip capacitor bodies 11 are not damaged. The adhesive sheet 3A can be transferred at once to the adhesive sheet 3B.

  After sticking and holding a large number of chip capacitor bodies 11 to the adhesive sheet 3B in this manner, the lower end portion of the chip capacitor body 11 where no electrode is formed is immersed in a conductive paste bath in the same manner as described above. An electrode is formed. Thereafter, the chip capacitor having electrodes formed at both ends can be detached from the holding transfer jig 1B to manufacture the chip capacitor.

  The method for forming electrodes on the chip capacitor body 11 has been described by taking the case where the dimensional accuracy of the chip capacitor body 11 is low as an example. In the present invention, the adhesive sheet 3A and / or holding transfer of the holding transfer jig 1A Even when the flatness of the adhesive sheet 3B of the jig 1B is low, and when the holding transfer jig 1A and / or the holding transfer jig 1B is enlarged, the holding transfer jig according to the present invention and this The set of holding and transferring jigs according to the invention works similarly. Accordingly, even in these cases, a large number of chip capacitor bodies 11 can be adhered and held without damaging the chip capacitor body 11, and a large number of chip capacitor bodies 11 adhered and held by the holding transfer jig 1A can be retained. It can be transferred to the transfer jig 1B all at once.

  Thus, the set of holding and transferring jigs according to the present invention including the holding and transferring jig according to the present invention can adhere and hold a large number of objects to be bonded without damaging the objects to be bonded. In addition, since a large number of objects to be adhered and held on one holding / transfer jig can be transferred to the other holding / transfer jig at once, the holding / transfer jig according to the present invention is disclosed in, for example, Japanese Patent Application Laid-Open No. 2007-165397. It is suitably used as a holding and transferring jig in the “small electronic component holding device” described in the Japanese Patent Publication. This “small electronic component holding device” and its operation are described in detail in Japanese Patent Application Laid-Open No. 2007-165397.

FIG. 1 is a schematic top view showing a holding transfer jig as an embodiment of the holding transfer jig according to the present invention. FIG. 2 is a cross-sectional view showing a cross section taken along line AA of FIG. FIG. 3 is a schematic perspective view showing a substrate of a holding transfer jig which is an embodiment of the holding transfer jig according to the present invention. FIG. 4 is a schematic top view showing a set of holding and transferring jigs as an embodiment of the set of holding and transferring jigs according to the present invention. FIG. 5 shows a set of holding transfer jigs as an example of a set of holding transfer jigs according to the present invention, in which a chip capacitor body suspended from the holding transfer jig is replaced with another holding transfer jig. It is a schematic explanatory drawing which shows the state pressed on the adhesive sheet. FIG. 6 is a perspective view showing a conventional holding jig.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 1A, 1B Holding transfer jig 2, 2A, 2B, 2C Base | substrate 3, 3A, 3B Adhesive sheet 4 Dam part 5 Internal space 6, 6A, 6B Vent hole 7 Disc body 8, 8A, 8B Hollow space 10 One set of holding transfer jig 11 Chip capacitor body 11A (High dimensional accuracy) Chip capacitor body 11B Long chip capacitor body 12 Holding jig

Claims (2)

A holding transfer jig comprising a substrate and an adhesive sheet that can hold an object to be adhered on the surface,
The base body includes a dam portion formed along an edge thereof, an internal space surrounded by the dam portion, and a vent hole communicating with the internal space.
The holding and transfer jig, wherein the adhesive sheet is fixed to the dam portion so as to cover the internal space.   A set of holding and transferring jigs comprising a base and an adhesive sheet that can hold an object to be adhered to the surface, wherein at least one of the holding and transferring jigs is provided. One set of holding and transfer jigs according to claim 1, wherein the set is a holding and transferring jig.

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