JP4771645B2 - Electronic component chip holder and electronic component chip handling method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for handling an electronic component chip and an electronic component chip holder that is advantageously used in carrying out the method.
[0002]
[Prior art]
FIG. 9 is a perspective view showing an example of an electronic component chip 1 to which the present invention can be applied. The electronic component chip 1 may be a capacitor chip such as a multilayer ceramic capacitor, a resistor chip, or an inductor chip.
[0003]
The electronic component chip 1 has first and second end faces 2 and 3 that face each other. An external electrode 4 is formed at the first end including the first end surface 2, and an external electrode 5 is formed at the second end including the second end surface 3. In this specification, the term “electronic component chip” refers to an electronic component chip as a finished product in which the external electrodes 4 and 5 have already been formed, and the external electrodes 4 and / or 5 that have not yet been formed. It also includes electronic component chips as products.
[0004]
When considering the process of forming the external electrodes 4 and 5 on the electronic component chip 1 as described above, even if the electronic component chip is miniaturized, the large number of them are properly held, and the process of forming the external electrodes is efficiently performed. In order to be able to achieve this, the following technique has been proposed (for example, see Patent Document 1). In the technique, as shown in FIG. 10, a holder body 21 a having a first adhesive surface 24 a that adheres to the first end surface 2 of each of the multiple electronic component chips 1 and holds each electronic component chip 1 is used. . A large number of electronic component chips 1 held by the holder body 21a are immersed in the electrode paste 30, whereby the external electrodes 5 are formed on the respective second end surfaces 3 as shown in FIG. Next, as shown in FIG. 12, the electronic component chip 1 is adhered to the second adhesive surface 24b of another holder body 21b having a stronger adhesive force than the first adhesive surface 24a. As a result, as shown in FIG. 13, a large number of electronic component chips 1 are simultaneously transferred to the other holder body 21b. In this state, the first end surface 2 is also subjected to processing for forming an external electrode.
[0005]
[Patent Document 1]
Japanese Patent No. 2682250 [0006]
[Problems to be solved by the invention]
However, when only the second adhesive surface that gives stronger adhesive force than the adhesive force that the first adhesive surface gives is provided, when trying to transfer a large number of electronic component chips all at once, some of the chips become 1 may remain on the pressure-sensitive adhesive surface side or may drop off from the pressure-sensitive adhesive surface.
[0007]
Therefore, the present invention is capable of reliably performing a transfer operation, appropriately holding a large number of electronic component chips, and efficiently performing processing such as external electrode formation, and an electronic component chip holder An object is to provide a method of handling component chips.
[0008]
[Means for Solving the Problems]
To achieve the above object, an electronic component chip holder according to the present invention is an electronic component chip holder for holding an electronic component chip having first and second end faces facing each other, and is a first member. And the second member, wherein the first member has a first adhesive surface for adhering to the first end surface of the electronic component chip to hold the electronic component chip, and the second member Has a second adhesive surface for adhering to the second end face of the electronic component chip to hold the electronic component chip, and the adhesive duration from when the first adhesive surface is pulled off is The adhesive duration when the second adhesive surface is pulled apart is longer. By adopting this configuration, the electronic component chip holder only needs to be provided with a predetermined adhesive surface, so that it can have a very simple structure. Further, regardless of the size and number of electronic component chips, only by adhesive to the adhesive surface can retain the electronic component chips, even and easy sorting operations of the electronic component chips due to a difference in tackiness duration of time distancing It can be done reliably.
[0009]
In the above invention, preferably, the first and second adhesive surfaces are formed of an elastic material. By adopting this configuration, variations in the size of the electronic component chips can be absorbed by the elastic deformation of the elastic material, and all desired electronic component chips can be reliably attached without leakage. Also, an excessive load applied to the electronic component chip during work can be absorbed by the elastic deformation of the elastic material, and the electronic component chip can be prevented from being damaged.
[0010]
In order to achieve the above object, an electronic component chip handling method according to the present invention is a method of handling an electronic component chip having first and second end faces facing each other, which is for the first electronic component chip. Adhering the first end surface of the electronic component chip to the first adhesive surface of the holder and holding the electronic component chip with the first electronic component chip holder; and for the first electronic component chip A step of applying a predetermined process to the second end portion including the second end face of the electronic component chip in a state of being held by the holder; and the first electronic component chip holder holding the electronic component chip; closer together and a holder for the second electronic component chip having a second adhesive surface having an adhesive duration during detachment longer than tack duration during pull-off with the first adhesive surface Adhering the second adhesive surface to the second end surface of the electronic component chip; and the first electronic component chip holder and the second in a state where the adhesive force of the first adhesive surface is lost. Separating the electronic component chip holder from each other and holding the electronic component chip by the second electronic component chip holder, and holding the electronic component chip in the state held by the second electronic component chip holder Performing a predetermined process on the first end including the first end face. By adopting this method, the electronic component chip can maintain the alignment state on the first electronic component chip holder as it is, while taking advantage of the difference in adhesive duration at the time of separation , 2 can be transferred to the electronic component chip holder.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
(Electronic component chip holder)
FIG. 1 is a perspective view showing an electronic component chip holder 20 according to the first embodiment of the present invention. The electronic component chip holder 20 includes two parts, a holder body 21a and a holder body 21c. The holder bodies 21a and 21c include plate-like base materials 22a and 22c made of a material such as metal or resin, respectively. Adhesive films 23a and 23c are formed on one surface of each of the base materials 22a and 22c, whereby the adhesive surfaces 24a and 24c are provided on the surfaces of the adhesive films 23a and 23c. In FIG. 1, the holder bodies 21a and 21c are arranged so that the adhesive surfaces 24a and 24c face each other. Here, the adhesive surface 24c is set so as to give an adhesive duration longer than the adhesive duration provided by the adhesive surface 24a.
[0012]
In the present embodiment, the above-described adhesive films 23a and 23c are made of an elastic material such as rubber. In this case, even if the adhesive surfaces 24a and 24c are given by the adhesiveness of the elastic body such as rubber, the adhesive surfaces 24a and 24c can be obtained by coating another adhesive on the elastic body such as rubber. You may make it give 24c. In addition, the adhesive films 23a and 23c may be formed by sticking a material molded at another place on the base materials 22a and 22c, or may be formed by molding on the base materials 22a and 22c. Good.
[0013]
As an example, the above-mentioned adhesive films 23a and 23c can be made of silicon rubber. However, the type of silicon rubber is selected so that the adhesive surface 24c provides an adhesive duration longer than the adhesive duration provided by the adhesive surface 24a.
[0014]
Further, as described above, when the adhesive films 23a and 23c are made of an elastic body, as will be described later, the electronic component chip is pressed toward the adhesive surfaces 24a and 24c in order to adhere the electronic component chip. In this case, the adhesive films 23a and 23c are deformed against the elasticity of the adhesive films 23a and 23c. Can be reliably contacted. Therefore, the reliability of the adhesion of the electronic component chip by the adhesive surfaces 24a and 24c is improved. However, if such an advantage is not desired, the adhesive surface may be formed on the surface of the rigid body by, for example, coating an adhesive or applying a double-sided adhesive tape.
[0015]
(Handling method of electronic component chips)
Hereinafter, a method of forming the external electrodes 4 and 5 on the electronic component chip 1 shown in FIG. 9 will be described as a method of handling the electronic component chip in the present embodiment. In this method, an electronic component chip holder 20 having a structure as shown in FIG. 1 is prepared. The electronic component chip holder 20 includes a first holder body 21a and a second holder body 21c. These first and second holder bodies 21a and 21c include base films 22a and 22c and adhesive films 23a and 23c made of an elastic body such as rubber, respectively. Further, on each surface of the adhesive films 23a and 23c, a first adhesive surface 24a is provided for the first holder body 21a, and a second adhesive surface 24c is provided for the second holder body 21c. Given. Here, the second adhesive surface 24c is set to give an adhesive duration longer than the adhesive duration given by the first adhesive surface 24a. When the adhesive films 23a and 23c are formed of silicon rubber, the exposed surfaces of the silicon rubber can be used as they are as the first and second adhesive surfaces 24a and 24b. In order to form the pressure-sensitive adhesive surface, an adhesive may be coated instead of providing an elastic layer.
[0016]
As shown in FIG. 2, a plurality of electronic component chips 1 are dropped from a conveyor belt (not shown) onto a chip aligner 6 having a plurality of recesses 7 on the upper surface. By swinging the chip aligner 6, the electronic component chips 1 are directed into the plurality of recesses 7 of the chip aligner 6. As a result, the plurality of electronic component chips 1 are aligned. The entrance of the recess 7 is preferably tapered. The first holder body 21a is held by an arm (not shown), moved onto the chip aligner 6, and lowered with the first adhesive surface 24a facing downward. The first adhesive surface 24 is pressed while in contact with the electronic component chip 1. As a result, as shown in FIG. 3, the electronic component chips 1 arranged in the plurality of recesses 7 of the chip aligner 6 adhere to the first adhesive surface 24a. Accordingly, each electronic component chip 1 is held by the first holder body 21a.
[0017]
If the adhesive surface 24a is formed on the surface of the adhesive film 23a made of an elastic material such as rubber as in the present embodiment, a plurality of electronic component chips 1 can be obtained when the steps shown in FIG. Even if there is a dimensional error in the length direction between them, such a dimensional error can be advantageously absorbed. Therefore, it is possible to prevent a situation in which the specific electronic component chip 1 is damaged or the specific electronic component chip 1 is not adhered to the adhesive surface 24a.
[0018]
On the other hand, as shown in FIG. 4, the electrode paste 30 is formed on the surface plate 29 with a predetermined thickness. The holder body 21a holding the electronic component chip 1 is transported to the dipping stage by an arm or other transport device with the electronic component chip 1 held by the adhesive surface 24a facing downward. In addition, it is good also as conveying the electronic component chip | tip 1 in the state which reversed the holder body 21a at the time of conveyance.
[0019]
With the electronic component chip 1 facing downward again, as indicated by an arrow 31, the holder body 21a is brought close to the surface plate 29, and accordingly, the second end surface 3 including the second end face 3 of the electronic component chip 1 is included. The end is dipped into the electrode paste 30. Next, the electronic component chip 1 is pulled up from the electrode paste 30. As a result, as shown in FIG. 5, external electrodes 5 are formed at the second ends of the electronic component chips 1. The external electrode 5 formed by the electrode paste 30 is dried.
[0020]
Next, the holder body 21a is moved to the transfer stage by a transfer device (not shown). A second holder body 21c is arranged on the transfer stage. As shown in FIG. 6, the first holder body 21 a holding the electronic component chip 1 is brought close to the second holder body 21 c as indicated by an arrow 32, and the second end face 3 of each electronic component chip 1 is placed. The second adhesive surface 24c is adhered to the surface. In this step, each electronic component chip 1 is pressed toward the second holder body 21c through the first holder body 21a, as in the step shown in FIG.
[0021]
As described above, the adhesive duration given by the second adhesive surface 24c of the second holder body 21c is longer than the adhesive duration given by the first adhesive surface 24a of the first holder body 21a. The material is chosen. Therefore, after the step shown in FIG. 6, when the first holder body 21a and the second holder body 21c are separated from each other when the adhesive force of the first adhesive surface 24a is lost, as shown in FIG. In addition, each electronic component chip 1 is held by the second holder body 21c.
[0022]
The second holder body 21c is transported to the dipping stage. In order to form the external electrode 4 at the first end including the first end face 2 of each electronic component chip 1, the second holder body 21 c is turned upside down, and each of those shown in FIG. 4 and FIG. Each step substantially similar to the step is performed.
[0023]
In this way, an electronic component chip 1 as shown in FIG. 9 is obtained in which the external electrodes 4 and 5 are formed on the first and second ends, respectively.
[0024]
(Action / Effect)
The holder for an electronic component chip according to the present invention holds the electronic component chip in order by the adhesive force provided by two adhesive surfaces having different adhesive durations. Therefore, since the electronic component chip holder only needs to be provided with an adhesive surface, the structure thereof becomes extremely simple.
[0025]
The electronic component chip holder according to the present invention can hold the electronic component chip regardless of its size. Moreover, since the electronic component chip holder can hold the electronic component chip by simply adhering the electronic component chip to the adhesive surface, the operation for holding the electronic component chip is extremely simple.
[0026]
The electronic component chip is held by the first end surface being adhered by the electronic component chip holder. Accordingly, since the second end face of the electronic component chip is an open end, a step of performing a predetermined process such as forming an external electrode on the end including the second end face can be applied without any trouble. .
[0027]
Further, the electronic component chip holder according to the present invention does not require a specific structure such as a through hole in order to hold the electronic component chip, and serves as a place for holding the electronic component chip with the entire adhesive surface. Can be used. Therefore, it is possible to deal with electronic component chips having different dimensions with a single type of electronic component chip holder. For example, when a plurality of electronic component chips are held, the distribution state of the electronic component chips in the holding state can be arbitrarily selected.
[0028]
Next, in the electronic component chip handling method according to the present invention, the electronic component chip holder as described above is used. Therefore, the operational effects achieved by the electronic component chip holder are retained in the handling method according to the present invention.
[0029]
In the electronic component chip handling method according to the present invention, the first and second electronic component chip holders are used. The first electronic component chip holder includes a first adhesive surface, while the second electronic component chip holder includes a second adhesive surface. Here, the second adhesive surface is set so as to give a longer adhesive duration than the first adhesive surface. Accordingly, when the predetermined processing is sequentially performed on each end portion of the electronic component chip, the transfer of the electronic component chip from the first electronic component chip holder to the second electronic component chip holder is performed by the above-described adhesive property. It can proceed efficiently based on the difference in duration. That is, after the second adhesive surface provided in the second electronic component chip holder is adhered to the electronic component chip held in the first electronic component chip holder, the first adhesive surface 24a If the second electronic component chip holder is separated from the first electronic component chip holder when the adhesive force is lost, the electronic component chip may be held in the second electronic component chip holder. it can. Therefore, for example, when a plurality of electronic component chips are handled, these electronic component chips are used for the second electronic component chip all at once while maintaining the arrangement state on the first electronic component chip holder. It can be transferred to the holder.
[0030]
In addition, in order to form the external electrodes 4 and 5 in the embodiment described above, a method of applying immersion to the electrode paste 30 is adopted. However, for example, a method such as plating may be adopted.
[0031]
Further, in the above-described embodiment, the electronic component chip 1 is handled to form the external electrodes 4 and 5, but even when processing other than the formation of the external electrodes 4 and 5 is performed. The electronic component chip holder and the electronic component chip handling method according to the present invention can be applied.
[0032]
(Embodiment 2)
(More specific example of electronic component chip holder)
A more specific example of the electronic component chip holder will be described with reference to FIG. The adhesive film 23 is made of silicon rubber. The pressure-sensitive adhesive surface 24 which is the surface of the pressure-sensitive adhesive film 23 is not provided with any irregularities such as dents. Since the electronic component chip holder having the adhesive film 23 formed of silicon rubber in this way has adhesiveness at least on the adhesive surface 24, it is ensured by the adhesive force only by placing a small component thereon. Can hold. For example, in the case of a square chip component, if one flat side surface is brought into close contact with the adhesive surface 24, it can be easily held.
[0033]
In this state, when a small component is pressed with a measurement terminal or the like to measure the electrical characteristics, the load is absorbed by the adhesive film 23, and no impact is applied to the small component. Therefore, cracks and chips are not generated in the small parts. In addition, after the measurement terminal is pressed against the small component, the small component is stably held by the adhesive force of the adhesive surface 24, so that accurate measurement is possible without being displaced during measurement.
[0034]
(Action / Effect)
In the case of a rubber material having a low elastic modulus such as silicon rubber, the rebound resilience is lowered and viscosity is generated. This viscosity exhibits the property of sticking an object on the surface of the rubber material. For example, in the case of soft silicon rubber, it has an adhesive strength of about 1 to ²⁰ gf / mm ² . In the present embodiment, an electronic component chip holder in which at least a surface portion is made of a rubber material as an elastic body having adhesiveness is used by utilizing this property. Therefore, even when the vibration is received or the small component is held upside down, the small component can be stably held without dropping from the electronic component chip holder. When the work is finished and the small component is removed from the adhesive surface, the small component is not attached to the adhesive, so the performance of the small component is not impaired.
[0035]
On the other hand, if dirt adheres to the adhesive surface, the adhesive strength is reduced. However, if the dirt on the adhesive surface is removed, the adhesive strength can be easily recovered, so that the adhesive film can be used repeatedly any number of times.
[0036]
(Experimental example)
An experiment was carried out in which the probe was pressed into the adhesive surfaces of two types of silicone rubbers having different adhesive force durations, stopped, and then separated to measure the adhesive force. As an adhesive force measuring apparatus, it measured with the tacking test apparatus (made by Resuka Co., Ltd.) based on ASTMD-279-71. As the probe, a cylinder having a diameter of 5.1 mm and made of stainless steel (SUS304) was used. FIG. 8 shows a graph in which the probe approach and pull-out speed is 30 mm / min, the applied pressure is 60 gf, the pressurization time is 4 seconds, the time is plotted on the horizontal axis, and the adhesive force is plotted on the vertical axis.
[0037]
In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It is not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and includes all modifications within the scope and meaning equivalent to the terms of the claims.
[0038]
【The invention's effect】
According to the present invention, since the electronic component chip holder only needs to be provided with a predetermined adhesive surface, it can have a very simple structure. In addition, regardless of the size and number of electronic component chips, the electronic component chips can be held simply by adhering to the adhesive surface, and the transfer operation of the electronic component chips can be easily and reliably performed due to the difference in adhesive duration. Can be done.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an electronic component chip holder according to a first embodiment of the present invention.
FIG. 2 is a schematic cross-sectional view showing a first step included in an external electrode forming method as an example of an electronic component chip handling method according to the first embodiment of the present invention.
FIG. 3 is a schematic sectional view showing a second step also included in the external electrode forming method.
FIG. 4 is a schematic cross-sectional view showing a third step which is also included in the external electrode forming method.
FIG. 5 is a schematic cross-sectional view showing a fourth step, also included in the external electrode forming method.
FIG. 6 is a schematic sectional view showing a fifth step, also included in the external electrode forming method.
FIG. 7 is a schematic cross-sectional view showing a sixth step, also included in the external electrode forming method.
FIG. 8 is a graph showing experimental results in the second embodiment based on the present invention.
FIG. 9 is a perspective view of an electronic component chip.
FIG. 10 is a schematic cross-sectional view showing a first step in an example of using an electronic component chip holder according to the prior art.
FIG. 11 is a schematic cross-sectional view showing a second step in an example of using an electronic component chip holder according to the prior art.
FIG. 12 is a schematic cross-sectional view showing a third step in an example of using an electronic component chip holder according to the prior art.
FIG. 13 is a schematic cross-sectional view showing a fourth step in an example of using an electronic component chip holder according to the prior art.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component chip, 2 1st end surface, 3 2nd end surface, 4, 5 External electrode, 6 Chip aligner, 7 Recessed part, 12, 28, 31, 32 Arrow, 20 Electronic component chip holder, 21a, 21b , 21c holder body, 22a, 22b, 22c base material, 23a, 23b, 23c adhesive film, 24a, 24b, 24c adhesive surface, 25 orientation device, 29 surface plate, 30 electrode paste.

Claims (4)

An electronic component chip holder for holding an electronic component chip having first and second end faces facing each other,
A first member and a second member;
The first member has a first adhesive surface for holding the electronic component chip by adhering to the first end surface of the electronic component chip, and the second member is the electronic component chip A second adhesive surface for adhering to the second end surface to hold the electronic component chip, and when the second adhesive surface is separated from the adhesive duration when the first adhesive surface is separated; The holder for an electronic component chip has a longer adhesive duration.   The electronic component chip holder according to claim 1, wherein the first adhesive surface and the second adhesive surface are formed of an elastic material. A method of handling an electronic component chip having first and second end faces facing each other,
Adhering the first end surface of the electronic component chip to the first adhesive surface of the first electronic component chip holder, and holding the electronic component chip with the first electronic component chip holder;
Performing a predetermined process on a second end portion including the second end face of the electronic component chip while being held by the first electronic component chip holder;
The first electronic component chip holder holding the electronic component chip and a second adhesive surface having an adhesive duration at the time of separation longer than an adhesive duration at the time of separation of the first adhesive surface. Bringing the second electronic component chip holder close to each other and adhering the second adhesive surface to the second end surface of the electronic component chip;
The first electronic component chip holder and the second electronic component chip holder are separated from each other in a state where the adhesive force of the first adhesive surface is lost, and the electronic component chip is moved to the second electronic component chip. Holding with a holder for
And a step of performing a predetermined process on a first end portion including the first end face of the electronic component chip while being held by the second electronic component chip holder.   The electronic component chip handling method according to claim 3, wherein surfaces formed of an elastic material are used as the first adhesive surface and the second adhesive surface.

Images