JP2002211506A - Method for carrying substrate for forming component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for carrying a substrate for forming a component in which positioning and carriage can be performed with excellent accuracy, and generation of cracks, dropping during the transfer, etc., of the substrate for forming the component can be prevented. SOLUTION: In this method for carrying the substrate for forming the component, when the substrate 3 for forming the component is affixed to a tape frame 2 with an adhesive tape 5 provided thereon, positioning surfaces 6 and 7 of the substrate 3 for forming the component of a table 4 for holding the substrate 3 are affixed at the angular position so that the advancing direction of a roller 1 for pressing the adhesive tape forms diagonal.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding step in which a pressure-sensitive adhesive tape is used as a carrier, and a component-forming substrate is bonded to the pressure-sensitive adhesive tape. The present invention relates to a method for transporting a component-forming substrate, comprising a peeling step of peeling the component-forming substrate from the adhesive tape.

[0002]

2. Description of the Related Art Conventionally, in order to perform various process operations, a component forming substrate which is a body for forming an electronic component is attached to an adhesive tape, and the adhesive tape is used as a carrier.
A tape carrier method of sequentially transferring the component forming substrate to each processing step is employed. Here, as a method of attaching the component forming substrate to the adhesive tape, the adhesive tape attaching method of FIG. 3 will be described.

FIG. 3 (a) is a schematic plan view of a main part showing a conventional configuration before sticking an adhesive tape, and FIG. 3 (b) is a schematic plan view of a main part showing a state after sticking a conventional adhesive tape. .

That is, one or a plurality of component forming substrates 3 made of an alumina base material or the like are fixed to a table 4 made of a resin or metal material plate which is positioned and arranged at a predetermined position by a tape frame 2, In addition, an adhesive tape 5 having an adhesive layer for holding the component forming substrate 3 on one surface is covered, and the adhesive tape is applied to the component forming substrate 3 by the roller 1 for attaching the adhesive tape 5 and the component forming substrate 3. The pressure-sensitive adhesive tape 5 and the component-forming substrate 3 are adhered by pressing and moving the roller 1 while rotating the roller 1 in, for example, a roller moving direction 8 indicated by an arrow in FIG.

[0005] Further, after a predetermined process for forming an electronic component is completed, a method of peeling off an unnecessary adhesive tape has been proposed.
There was a method as shown in a schematic side process drawing for explaining the adhesive tape peeling method of FIG.

That is, the component-forming substrate 1 made of an alumina base material or the like which has been adhered to the adhesive tape 15 and has undergone a predetermined process.
3 is placed on the upper surface of the plate 17 with the adhesive surface of the adhesive tape 15 facing the surface, and the edge plate 18 made of a metal material having a knife edge at one end is attached to the adhesive tape 1.
5 is peeled off by being brought into contact with the non-sticking surface, which is the back surface of 5. Thereafter, one end of the adhesive tape 15 is sandwiched by the chuck 14 for peeling the adhesive tape, and the adhesive tape 15 is moved in the oblique direction 15a of the knife edge and the edge plate 18 is moved in the backward direction 15b as shown in FIG. 6B. By letting
As shown in FIG. 6C, the unnecessary adhesive tape 15 is peeled off from the component forming substrate 13 while the component forming substrate 13 is placed on the plate 17.

[0007]

However, in the conventional method, when the roller 1 is pressed against the component-forming substrate 3 as shown in FIG. If the entry angle to the component-forming substrate 3 cannot be accurately maintained, a shearing force acting between the roller 1 and the component-forming substrate 3 causes a positional shift at the time of adhering, and conveys with accurate positioning. There was a problem that it became difficult.

An object of the present invention is to solve the above-mentioned problems, and to provide a component-forming substrate for precisely attaching a component-forming substrate to an adhesive tape and conveying the electronic component at a predetermined position. It is an object to provide a transport method.

[0009]

In order to achieve the above object, the present invention has the following arrangement.

According to the invention of claim 1 of the present invention, in particular, two adjacent end faces of the component forming substrate are brought into contact with the table,
In addition, it has a configuration in which the roller is moved in the pressing direction, so that even if the component forming substrate is adhered with the roller, predetermined positioning is performed on the two end surfaces of the component forming substrate that is in contact with the table. The effect of being able to maintain can be expected.

According to a second aspect of the present invention, a component-forming substrate and a holding plate are placed on an upper surface of an edge plate.
The adhesive tape is moved to the lower side of the edge plate along the knife edge, whereby the adhesive tape is peeled off by a simple operation of moving one of the adhesive tapes, and the component forming substrate is received. It has an operational effect that it can be transferred to a plate.

The invention according to claim 3 of the present invention particularly has a structure in which a receiving plate is provided at a high position corresponding to the thickness of the adhesive tape, whereby the component forming substrate from which the adhesive tape has been peeled off. The peeled surface of the component can be uniformly contacted with the receiving plate, local stress of the component forming substrate does not occur, cracks and damage of the component forming substrate are suppressed, and the adhesive tape is stably peeled off. This has the effect of being able to be transferred to the receiving plate.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) A method for applying an adhesive tape in a method for transporting a component-forming substrate according to the first aspect of the present invention will be described with reference to the drawings. I do.

FIG. 1 is a schematic plan view illustrating a method for attaching an adhesive tape according to a first embodiment of the present invention, and FIG. 2 is a perspective view of the essential part.

In FIG. 1, reference numeral 1 denotes a rotatable and movable roller made of an elastic material such as rubber or sponge.
To stick.

Reference numeral 2 denotes a tape frame which is made of a metal material and serves as a frame-shaped jig. Reference numeral 3 denotes an element body for forming an electronic component, which is a component forming substrate made of a thin plate of alumina material or the like.

Reference numeral 4 denotes a table made of a resin to which the adhesive tape 5 does not adhere or a metal material which has been subjected to a surface treatment so that the adhesive tape 5 does not adhere. The detailed structure is positioned by making contact with a surface (not shown).

Reference numeral 5 denotes an adhesive tape having an adhesive layer for adhering the component-forming substrate 3 on one surface, and is attached to the tape frame 2 with the adhesive surface facing downward.

Reference numerals 6 and 7 are imaginary lines showing surfaces for positioning by bringing two adjacent end surfaces of the component forming substrate 3 provided on the table 4 into contact with each other.

Next, the operation of attaching the adhesive tape to the component forming substrate will be described. First, as shown in FIG.
The four component forming substrates 3 are placed in alignment with the positioning surfaces 6 and 7, which are predetermined locations on the upper surface of the table 4, and are brought into contact with the positioning surfaces 6 and 7. Then, the pressing direction 8 is set by the table 4 so that the moving direction of the roller 1 is the direction in which the roller 1 is brought into contact with the positioning surfaces 6 and 7.

Next, the tape frame 2 to which the adhesive tape 5 is adhered is placed above the table 4 on which the component forming substrate 3 is placed.

Subsequently, while rotating the roller 1 provided on the non-adhesive surface side above the adhesive tape 5, it is moved in the pressing direction 8 indicated by the arrow in the figure, whereby the four component forming substrates 3 are adhered. The tape 5 is attached to the adhesive on the lower surface. At this time, the component forming substrate 3 is adhered to the adhesive tape 5 while being regulated in the direction and position determined by the positioning surfaces 6 and 7 depending on the moving direction of the roller 1.

Thereafter, the tape frame 2 is detached from the table 4 so that the four component-forming substrates 3 are accurately adhered to predetermined positions of the adhesive tape 5 adhered to the tape frame. It is used as a pasted tape frame 2 in a later process.

(Embodiment 2) A second embodiment of the present invention will be described with reference to the drawings.

FIG. 4 is a schematic perspective view illustrating the structure of the adhesive tape peeling method according to Embodiment 2 of the present invention, and FIG. 5 is a schematic process diagram illustrating the operation of the adhesive tape peeling method.

In FIG. 4, reference numeral 13 denotes a component-forming substrate, which is obtained by subjecting the component-forming substrate 3 attached to the adhesive tape 5 described above to a process of forming a component, for example, printing or cutting. .

Reference numeral 15 denotes an adhesive tape that adheres the component forming substrate 13 to the upper adhesive surface, and 16 denotes a pressing plate made of a resin material, a metal material, or the like, which is mounted on the upper surface of the component forming substrate 13. The holding plate 16 has a larger outer size than the component-forming board 13, and the load of the holding plate 16 is reduced even when the component-forming board 13 is moved horizontally.
In addition, the movement of the component-forming substrate 13 can be stabilized by an appropriate load by adding to (3).

Reference numeral 11 denotes an edge plate made of a metal material provided with a knife edge 11a at the tip, and reference numeral 12 denotes a receiving plate made of a metal material or resin adjacent to the edge plate 11, which is close to the tip of the knife edge 11a of the edge plate 11. The tip is chamfered 12a by taper processing.

As shown in FIG. 5A, the upper surface of the edge plate 11 and the upper surface of the receiving plate 12 have a height corresponding to the thickness t of the adhesive tape 15 or slightly smaller than the thickness t. The receiving plate 12 is provided with a step t ′ and the upper surface of the receiving plate 12 is raised.

Numeral 14 denotes a movable chuck, which guides the adhesive tape 15 to the lower surface of the edge plate while holding the tip of the adhesive tape 15 as one piece.

Next, the adhesive tape 1
The peeling operation for peeling 5 will be described. First, as shown in FIGS. 4 and 5A, the adhesive tape 15 attached to the component forming substrate 13 is placed on the upper surface of the edge plate 11, and the holding plate 16 is attached to the upper surface of the component forming substrate 13. Of the adhesive tape 15 that is placed on the edge plate 11 and passed through the knife edge 11a at the tip of the edge plate 11 by rotating the knife edge 11a.
The piece is held by the chuck 14.

The adhesive tape 15 to which the component-forming substrate 13 is attached is placed on the upper surface of the edge plate 11 such that the surface of the component-forming substrate 13 to which the component is not attached is parallel to the upper surface of the edge plate 11. are doing.

Next, as shown in FIG.
4 is a knife edge 1 at one end of the edge plate 11
1a is arranged in the extending direction of the inclined surface, and guides the chuck 14 in a direction toward the lower surface side of the edge plate 11,
The component forming substrate 13 loaded by the holding plate 16 is moved to the tip of the tapered receiving plate 12.

Further, the chuck 14 is guided to separate the adhesive tape 15 from the component-forming substrate 13, and the moment applied to the component-forming substrate 13 on which the holding plate 16 is mounted is uniformly received on the upper surface of the plate 12. Make contact.

As described above, the adhesive tape 15 is easily peeled from the component-forming substrate 13 by a simple and simple structure in which one piece of the adhesive tape 15 is guided by the chuck 14 and transferred to the receiving plate. Further, by disposing the upper surface of the receiving plate 12 at a position higher than the upper surface of the edge plate 11 by the thickness of the adhesive tape 15, the receiving plate 12 can be smoothly placed without damaging the component forming substrate 13. Can be transferred to

[0036]

As described above, according to the method for attaching and detaching an adhesive tape in the method for transporting a component-forming substrate according to the present invention, the component-forming substrate is displaced in a direction orthogonal to the traveling direction (X direction). Can be transported with accurate positioning at a predetermined position on the adhesive tape,
In addition, the stress at the interface between the component forming substrate and the adhesive tape, which is generated when the adhesive tape is peeled off from the component forming substrate, is uniformly and suppressed, thereby preventing the component forming substrate from cracking or cracking and transferring the component forming substrate to the receiving plate. Stable peeling of the adhesive tape and smooth transfer of the receiving plate, which does not damage the component forming board, can be easily performed with a simple configuration by suppressing rattling or dropping of the component forming board during mounting. Has the effect of

[Brief description of the drawings]

FIG. 1 is a schematic plan view illustrating a method of attaching an adhesive tape to a component forming substrate according to a first embodiment of the present invention.

FIG. 2 is a perspective view of the main part.

FIG. 3 (a) is a schematic plan view of a main part showing a configuration before sticking an adhesive tape in the related art;

FIG. 4 is a schematic configuration perspective view illustrating a method of peeling an adhesive tape according to a second embodiment of the present invention.

FIG. 5 is a schematic process diagram illustrating the operation of the adhesive tape peeling method.

FIG. 6 is a schematic side process chart for explaining a conventional adhesive tape peeling method.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 roller 2 tape frame (jig) 3 component forming substrate 4 table 5 adhesive tape 6 positioning surface 7 positioning surface 8 pressing direction 11 edge plate 11 a knife edge 12 receiving plate 13 component forming substrate 14 chuck 15 adhesive tape 16 pressing plate 17 plate 18 edge plate

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Yoshinori Ando 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroshi Yamada 1006 Kadoma, Kazuma, Osaka Prefecture F-term (reference) in Matsushita Electric Industrial Co., Ltd. CA04 FA02 FA17 GA53 HA01 KA02 KA17 MA37 MA38 PA20 PA30

Claims (3)

[Claims] An adhesive tape is used as a carrier, and a component forming substrate is attached to the adhesive tape, and after the component forming substrate is subjected to various processes, the processed component forming substrate is processed. A component forming substrate transport method comprising a peeling step of peeling off the adhesive tape from the adhesive tape, wherein the adhering step of the component forming substrate comprises: Positioning the component forming substrate in contact with a table holding the forming substrate, disposing an adhesive tape with a predetermined gap with respect to the component forming substrate, on the non-adhesive surface side of the adhesive tape The adhesive tape is pressed against the component-forming substrate by the provided roller, and the roller is moved in a pressing direction in which the two adjacent end surfaces of the component-forming substrate are brought into contact with the table. A method for transporting a component-forming substrate, wherein the component-forming substrate is attached to a position. 2. The peeling step of a processed component-forming substrate includes an edge plate having a knife edge at one end with a non-adhesive surface serving as a back surface of an adhesive surface of the adhesive tape to which the plate-shaped component-forming substrate is attached. The component forming substrate is placed on the upper surface of the edge plate in contact with the upper surface of the component plate, and a pressing plate abutting on the upper surface of the component forming substrate is loaded from above the component forming substrate, and the adhesive tape The non-adhesive surface is rotated around the knife edge, a piece of the adhesive tape rotated around the knife edge is sandwiched, and a piece of the adhesive tape is moved along the knife edge toward a lower surface of the edge plate. 2. The component according to claim 1, wherein the component forming substrate is transferred to a receiving plate disposed adjacent to the edge plate, and the adhesive tape is peeled from the component forming substrate. 3. A method of transporting a forming substrate. 3. An upper surface of the receiving plate is provided at a position higher than an upper surface of the edge plate corresponding to a thickness of the adhesive tape attached to the component forming substrate, and a peeling surface of the component forming substrate from which the adhesive tape is peeled off. 3. A component forming substrate according to claim 2, wherein said component forming substrate is transferred to said receiving plate by contacting said component plate with an upper surface of said receiving plate, and said adhesive tape is separated from said component forming substrate. Substrate transfer method.