JP2002211506A - Method for carrying substrate for forming component - Google Patents
Method for carrying substrate for forming componentInfo
- Publication number
- JP2002211506A JP2002211506A JP2001006027A JP2001006027A JP2002211506A JP 2002211506 A JP2002211506 A JP 2002211506A JP 2001006027 A JP2001006027 A JP 2001006027A JP 2001006027 A JP2001006027 A JP 2001006027A JP 2002211506 A JP2002211506 A JP 2002211506A
- Authority
- JP
- Japan
- Prior art keywords
- forming substrate
- component
- adhesive tape
- plate
- component forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、粘着テープをキャ
リアとし、その粘着テープに部品形成用基板を貼着する
貼着工程と、前記部品形成用基板に各種加工を施した後
に、その加工済みの部品形成用基板を上記粘着テープか
ら剥離する剥離工程を備える部品形成用基板の搬送方法
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding step in which a pressure-sensitive adhesive tape is used as a carrier, and a component-forming substrate is bonded to the pressure-sensitive adhesive tape. The present invention relates to a method for transporting a component-forming substrate, comprising a peeling step of peeling the component-forming substrate from the adhesive tape.
【0002】[0002]
【従来の技術】従来、各種の工程作業を行うために、電
子部品を形成する素体である部品形成用基板を粘着テー
プに貼着し、その粘着テープをキャリアとして利用し、
前記部品形成用基板を各加工ステップへと順次移送する
テープキャリア方法が採用されている。ここで、部品形
成用基板の粘着テープへの貼着方法として、図3の粘着
テープ貼着方法を説明する。2. Description of the Related Art Conventionally, in order to perform various process operations, a component forming substrate which is a body for forming an electronic component is attached to an adhesive tape, and the adhesive tape is used as a carrier.
A tape carrier method of sequentially transferring the component forming substrate to each processing step is employed. Here, as a method of attaching the component forming substrate to the adhesive tape, the adhesive tape attaching method of FIG. 3 will be described.
【0003】図3(a)は従来における粘着テープ貼着
前の構成を示す要部概要平面図、図3(b)は従来にお
ける粘着テープ貼着後の状態を示す要部概要平面図であ
る。FIG. 3 (a) is a schematic plan view of a main part showing a conventional configuration before sticking an adhesive tape, and FIG. 3 (b) is a schematic plan view of a main part showing a state after sticking a conventional adhesive tape. .
【0004】すなわち、アルミナ基材などでなる1枚あ
るいは複数枚の部品形成用基板3を所定位置に位置決め
し配設した樹脂あるいは金属材のプレートでなるテーブ
ル4に、テープフレーム2により固定され、かつ片面に
部品形成用基板3を保持するための粘着層を有する粘着
テープ5を被せ、粘着テープ5と部品形成用基板3を貼
着するためのローラ1により部品形成用基板3に粘着テ
ープを圧接させ、例えば図3(b)における矢印のロー
ラ移動方向8にローラ1を回転させながら移動させるこ
とによって粘着テープ5と部品形成用基板3を貼着して
いた。That is, one or a plurality of component forming substrates 3 made of an alumina base material or the like are fixed to a table 4 made of a resin or metal material plate which is positioned and arranged at a predetermined position by a tape frame 2, In addition, an adhesive tape 5 having an adhesive layer for holding the component forming substrate 3 on one surface is covered, and the adhesive tape is applied to the component forming substrate 3 by the roller 1 for attaching the adhesive tape 5 and the component forming substrate 3. The pressure-sensitive adhesive tape 5 and the component-forming substrate 3 are adhered by pressing and moving the roller 1 while rotating the roller 1 in, for example, a roller moving direction 8 indicated by an arrow in FIG.
【0005】また、電子部品を形成する所定の工程が終
了後、不要となった粘着テープを剥離する方法として、
図6の粘着テープ剥離方法を説明する概要側面工程図に
示すような方法があった。[0005] Further, after a predetermined process for forming an electronic component is completed, a method of peeling off an unnecessary adhesive tape has been proposed.
There was a method as shown in a schematic side process drawing for explaining the adhesive tape peeling method of FIG.
【0006】すなわち、粘着テープ15に貼着し所定工
程を終了したアルミナ基材などでなる部品形成用基板1
3を、プレート17の上面に粘着テープ15の粘着面を
向けて載置するとともに、一端がナイフエッジの形状を
有する金属材でなるエッジプレート18を粘着テープ1
5の裏面となる非貼着面に当接させて剥離する。その
後、粘着テープ15の一端を粘着テープ剥離用のチャッ
ク14に挟持させて図6(b)に示すように粘着テープ
15をナイフエッジの斜め方向15aに、かつエッジプ
レート18を後ろ方向15bに移動させることにより、
図6(c)に示すように部品形成用基板13をプレート
17に載置した状態で、不要な粘着テープ15を部品形
成用基板13から剥離するのである。That is, the component-forming substrate 1 made of an alumina base material or the like which has been adhered to the adhesive tape 15 and has undergone a predetermined process.
3 is placed on the upper surface of the plate 17 with the adhesive surface of the adhesive tape 15 facing the surface, and the edge plate 18 made of a metal material having a knife edge at one end is attached to the adhesive tape 1.
5 is peeled off by being brought into contact with the non-sticking surface, which is the back surface of 5. Thereafter, one end of the adhesive tape 15 is sandwiched by the chuck 14 for peeling the adhesive tape, and the adhesive tape 15 is moved in the oblique direction 15a of the knife edge and the edge plate 18 is moved in the backward direction 15b as shown in FIG. 6B. By letting
As shown in FIG. 6C, the unnecessary adhesive tape 15 is peeled off from the component forming substrate 13 while the component forming substrate 13 is placed on the plate 17.
【0007】[0007]
【発明が解決しようとする課題】しかしながら、前記従
来の方法では、部品形成用基板3に対して図3(b)に
示すようにローラ1を部品形成用基板3に圧接させるに
あたり、ローラ1の部品形成用基板3への突入角を正確
に維持することができなかった場合、ローラ1と部品形
成用基板3間に作用するずり応力により、貼着時に位置
ずれが生じ、精度良い位置決めによる搬送が困難になる
という問題があった。However, in the conventional method, when the roller 1 is pressed against the component-forming substrate 3 as shown in FIG. If the entry angle to the component-forming substrate 3 cannot be accurately maintained, a shearing force acting between the roller 1 and the component-forming substrate 3 causes a positional shift at the time of adhering, and conveys with accurate positioning. There was a problem that it became difficult.
【0008】本発明は、前記課題を解決しようとするも
のであり、粘着テープに対し部品形成用基板を精度良く
貼着し、所定位置に電子部品を形成できるように搬送す
る部品形成用基板の搬送方法を提供することを目的とす
るものである。An object of the present invention is to solve the above-mentioned problems, and to provide a component-forming substrate for precisely attaching a component-forming substrate to an adhesive tape and conveying the electronic component at a predetermined position. It is an object to provide a transport method.
【0009】[0009]
【課題を解決するための手段】上記目的を達成するため
に、本発明は以下の構成を有する。In order to achieve the above object, the present invention has the following arrangement.
【0010】本発明の請求項1記載の発明は、特に部品
形成用基板の隣接する2つの端面をテーブルに当接し、
かつ押付け方向にローラを移動させるという構成を有し
ており、これにより、ローラで部品形成用基板を貼着し
てもテーブルに当接させている部品形成用基板の2つの
端面で所定位置決めを維持することができるという作用
効果が期待できる。According to the invention of claim 1 of the present invention, in particular, two adjacent end faces of the component forming substrate are brought into contact with the table,
In addition, it has a configuration in which the roller is moved in the pressing direction, so that even if the component forming substrate is adhered with the roller, predetermined positioning is performed on the two end surfaces of the component forming substrate that is in contact with the table. The effect of being able to maintain can be expected.
【0011】本発明の請求項2記載の発明は、特にエッ
ジプレートの上面に部品形成用基板と押え板を載置し、
ナイフエッジに沿って粘着テープをエッジプレート下面
側に移動させるという構成を有しており、これにより粘
着テープの一方を移動させるという単純な動作で粘着テ
ープを剥離し、かつ部品形成用基板を受けプレートに移
載することができるという作用効果を有する。According to a second aspect of the present invention, a component-forming substrate and a holding plate are placed on an upper surface of an edge plate.
The adhesive tape is moved to the lower side of the edge plate along the knife edge, whereby the adhesive tape is peeled off by a simple operation of moving one of the adhesive tapes, and the component forming substrate is received. It has an operational effect that it can be transferred to a plate.
【0012】本発明の請求項3記載の発明は、特に、粘
着テープの厚みに相当する高い位置に受けプレートを設
けた構成を有しており、これにより、粘着テープの剥離
した部品形成用基板の剥離面を受けプレートに均一に当
接することができ、部品形成用基板の局部的なストレス
が生じず、部品形成用基板のクラック、損傷などを抑制
し、安定して粘着テープを剥離しながら受けプレートに
移載することができるという作用効果を有する。The invention according to claim 3 of the present invention particularly has a structure in which a receiving plate is provided at a high position corresponding to the thickness of the adhesive tape, whereby the component forming substrate from which the adhesive tape has been peeled off. The peeled surface of the component can be uniformly contacted with the receiving plate, local stress of the component forming substrate does not occur, cracks and damage of the component forming substrate are suppressed, and the adhesive tape is stably peeled off. This has the effect of being able to be transferred to the receiving plate.
【0013】[0013]
【発明の実施の形態】(実施の形態1)以下実施の形態
1を用いて、本発明の特に請求項1記載の部品形成用基
板の搬送方法における粘着テープ貼着方法について図面
を用いて説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS (Embodiment 1) A method for applying an adhesive tape in a method for transporting a component-forming substrate according to the first aspect of the present invention will be described with reference to the drawings. I do.
【0014】図1は、本発明の実施の形態1における粘
着テープ貼着方法を説明する構成概要平面図、図2は同
要部斜視図である。FIG. 1 is a schematic plan view illustrating a method for attaching an adhesive tape according to a first embodiment of the present invention, and FIG. 2 is a perspective view of the essential part.
【0015】図1において、1はゴムやスポンジなどの
弾性体より構成される回転および移動自在なローラであ
り、後述する粘着テープ5を圧接して部品形成用基板3
を貼着させる。In FIG. 1, reference numeral 1 denotes a rotatable and movable roller made of an elastic material such as rubber or sponge.
To stick.
【0016】2は金属材より構成され枠状の治具となる
テープフレームであり、3は電子部品を形成する素体で
あり薄板状アルミナ材などからなる部品形成用基板であ
る。Reference numeral 2 denotes a tape frame which is made of a metal material and serves as a frame-shaped jig. Reference numeral 3 denotes an element body for forming an electronic component, which is a component forming substrate made of a thin plate of alumina material or the like.
【0017】4は粘着テープ5が貼り付かない樹脂また
は粘着テープ5が貼り付かない表面処理が施してある金
属材からなるテーブルであり、1枚あるいは複数枚の部
品形成用基板3を凹部加工(詳細構造は図示せず)され
た面に当接させて位置決めを行う。Reference numeral 4 denotes a table made of a resin to which the adhesive tape 5 does not adhere or a metal material which has been subjected to a surface treatment so that the adhesive tape 5 does not adhere. The detailed structure is positioned by making contact with a surface (not shown).
【0018】5は片面に部品形成用基板3を貼着する粘
着層を有する粘着テープであり、粘着面を下面側にして
テープフレーム2に貼付して配設されている。Reference numeral 5 denotes an adhesive tape having an adhesive layer for adhering the component-forming substrate 3 on one surface, and is attached to the tape frame 2 with the adhesive surface facing downward.
【0019】また6および7はテーブル4に設けられた
部品形成用基板3の隣接する2つの端面を当接させて位
置決めを行う面を示す想像線である。Reference numerals 6 and 7 are imaginary lines showing surfaces for positioning by bringing two adjacent end surfaces of the component forming substrate 3 provided on the table 4 into contact with each other.
【0020】次に粘着テープの部品形成用基板に対する
貼着動作について説明する。まず、図1に示すように、
4枚の部品形成用基板3をテーブル4上面の所定箇所で
ある位置決め面6,7に方向をそろえると共に位置決め
面6,7に当接させて載置する。そして、ローラ1の移
動方向が位置決め面6および7に当接させる方向となる
ように押付け方向8をテーブル4により設定する。Next, the operation of attaching the adhesive tape to the component forming substrate will be described. First, as shown in FIG.
The four component forming substrates 3 are placed in alignment with the positioning surfaces 6 and 7, which are predetermined locations on the upper surface of the table 4, and are brought into contact with the positioning surfaces 6 and 7. Then, the pressing direction 8 is set by the table 4 so that the moving direction of the roller 1 is the direction in which the roller 1 is brought into contact with the positioning surfaces 6 and 7.
【0021】次に粘着テープ5を貼付したテープフレー
ム2を部品形成用基板3が載置されているテーブル4の
上方に設置する。Next, the tape frame 2 to which the adhesive tape 5 is adhered is placed above the table 4 on which the component forming substrate 3 is placed.
【0022】続いて、粘着テープ5の上方の非粘着面側
に設けたローラ1を回転させながら、図中の矢印の押付
け方向8に移動させることにより、4枚の部品形成用基
板3を粘着テープ5の下面の粘着剤に貼着させる。その
際、ローラ1の移動方向により、部品形成用基板3は位
置決め面6,7により決まる方向と位置に規制されて粘
着テープ5に貼着される。Subsequently, while rotating the roller 1 provided on the non-adhesive surface side above the adhesive tape 5, it is moved in the pressing direction 8 indicated by the arrow in the figure, whereby the four component forming substrates 3 are adhered. The tape 5 is attached to the adhesive on the lower surface. At this time, the component forming substrate 3 is adhered to the adhesive tape 5 while being regulated in the direction and position determined by the positioning surfaces 6 and 7 depending on the moving direction of the roller 1.
【0023】その後、テープフレーム2をテーブル4よ
り離脱されることにより、4枚の部品形成用基板3がテ
ープフレームに貼り付けられた粘着テープ5の所定の位
置に精度よく貼着された、基板貼り付け済みテープフレ
ーム2として後工程で使用されるのである。Thereafter, the tape frame 2 is detached from the table 4 so that the four component-forming substrates 3 are accurately adhered to predetermined positions of the adhesive tape 5 adhered to the tape frame. It is used as a pasted tape frame 2 in a later process.
【0024】(実施の形態2)以下実施の形態2を用い
て、本発明の特に請求項2,3記載の部品形成用基板の
搬送方法における粘着テープ剥離方法について図面を用
いて説明する。(Embodiment 2) A second embodiment of the present invention will be described with reference to the drawings.
【0025】図4は本発明の実施の形態2における粘着
テープ剥離方法を説明する構成概要斜視図、図5は同粘
着テープ剥離方法の動作を説明する概要工程図である。FIG. 4 is a schematic perspective view illustrating the structure of the adhesive tape peeling method according to Embodiment 2 of the present invention, and FIG. 5 is a schematic process diagram illustrating the operation of the adhesive tape peeling method.
【0026】図4において、13は部品形成用基板であ
り、前記で説明した粘着テープ5に貼着された部品形成
用基板3に部品となる処理、たとえば印刷やカット加工
を施したものである。In FIG. 4, reference numeral 13 denotes a component-forming substrate, which is obtained by subjecting the component-forming substrate 3 attached to the adhesive tape 5 described above to a process of forming a component, for example, printing or cutting. .
【0027】15は部品形成用基板13を上面の粘着面
に貼着されている粘着テープ、16は樹脂材や金属材な
どでなる押え板であり、部品形成用基板13の上面に載
置しているこの押え板16は部品形成用基板13より外
形サイズが大きく、かつ、部品形成用基板13を水平移
動させた場合でも押え板16の荷重を部品形成用基板1
3に加えることにより滑らかな移動を可能とするととも
に適当な荷重によって部品形成用基板13の挙動を安定
させることができる。Reference numeral 15 denotes an adhesive tape that adheres the component forming substrate 13 to the upper adhesive surface, and 16 denotes a pressing plate made of a resin material, a metal material, or the like, which is mounted on the upper surface of the component forming substrate 13. The holding plate 16 has a larger outer size than the component-forming board 13, and the load of the holding plate 16 is reduced even when the component-forming board 13 is moved horizontally.
In addition, the movement of the component-forming substrate 13 can be stabilized by an appropriate load by adding to (3).
【0028】11は先端にナイフエッジ11aを設けた
金属材よりなるエッジプレート、12はエッジプレート
11と隣接した金属材あるいは樹脂からなる受けプレー
トであり、エッジプレート11のナイフエッジ11a先
端に近接する先端部はテーパ加工により面取り12aを
施している。Reference numeral 11 denotes an edge plate made of a metal material provided with a knife edge 11a at the tip, and reference numeral 12 denotes a receiving plate made of a metal material or resin adjacent to the edge plate 11, which is close to the tip of the knife edge 11a of the edge plate 11. The tip is chamfered 12a by taper processing.
【0029】また、図5(a)に示すように、エッジプ
レート11の上面と受けプレート12の上面とは、粘着
テープ15の厚みtに相当する高さ分か、あるいはその
厚みtよりやや小さく段差t'を有して、受けプレート
12の上面を高くして配設している。As shown in FIG. 5A, the upper surface of the edge plate 11 and the upper surface of the receiving plate 12 have a height corresponding to the thickness t of the adhesive tape 15 or slightly smaller than the thickness t. The receiving plate 12 is provided with a step t ′ and the upper surface of the receiving plate 12 is raised.
【0030】14は移動自在なチャックであり、粘着テ
ープ15の1片となる先端を挟持して粘着テープ15を
エッジプレートの下面側に導引するものである。Numeral 14 denotes a movable chuck, which guides the adhesive tape 15 to the lower surface of the edge plate while holding the tip of the adhesive tape 15 as one piece.
【0031】次に部品形成用基板13から粘着テープ1
5を剥離する剥離動作について説明する。まず、図4お
よび図5(a)に示すように、部品形成用基板13に貼
着した粘着テープ15をエッジプレート11の上面に載
置するとともに、押え板16を部品形成用基板13の上
面に載置し、エッジプレート11の先端に有するナイフ
エッジ11aを係回させて経由した粘着テープ15の1
片をチャック14で挟持する。Next, the adhesive tape 1
The peeling operation for peeling 5 will be described. First, as shown in FIGS. 4 and 5A, the adhesive tape 15 attached to the component forming substrate 13 is placed on the upper surface of the edge plate 11, and the holding plate 16 is attached to the upper surface of the component forming substrate 13. Of the adhesive tape 15 that is placed on the edge plate 11 and passed through the knife edge 11a at the tip of the edge plate 11 by rotating the knife edge 11a.
The piece is held by the chuck 14.
【0032】なお、部品形成用基板13の貼着していな
い面がエッジプレート11の上面と平行となるように部
品形成用基板13を貼着した粘着テープ15をエッジプ
レート11の上面に載置している。The adhesive tape 15 to which the component-forming substrate 13 is attached is placed on the upper surface of the edge plate 11 such that the surface of the component-forming substrate 13 to which the component is not attached is parallel to the upper surface of the edge plate 11. are doing.
【0033】次に図5(b)に示すように、チャック1
4はエッジプレート11の一端に有するナイフエッジ1
1aの傾斜面の延長方向に配置されており、エッジプレ
ート11の下面側となる方向にチャック14を導引し、
押え板16により載荷した部品形成用基板13を、テー
パ加工を施した受けプレート12の先端に移動させる。Next, as shown in FIG.
4 is a knife edge 1 at one end of the edge plate 11
1a is arranged in the extending direction of the inclined surface, and guides the chuck 14 in a direction toward the lower surface side of the edge plate 11,
The component forming substrate 13 loaded by the holding plate 16 is moved to the tip of the tapered receiving plate 12.
【0034】そして、さらにチャック14を導引して粘
着テープ15を部品形成用基板13より剥離するととも
に、押え板16を搭載した部品形成用基板13にかかる
モーメントを受けプレート12の上面に均一に当接させ
るのである。Further, the chuck 14 is guided to separate the adhesive tape 15 from the component-forming substrate 13, and the moment applied to the component-forming substrate 13 on which the holding plate 16 is mounted is uniformly received on the upper surface of the plate 12. Make contact.
【0035】前記のように、粘着テープ15の一片をチ
ャック14により導引するという単純で簡単な構成によ
り、部品形成用基板13から粘着テープ15を容易に剥
離し、かつ受けプレートに移載することができ、さらに
受けプレート12の上面をエッジプレート11の上面に
対して粘着テープ15の厚み分だけ高い位置に配設する
ことにより、部品形成用基板13にダメージを与えるこ
となく滑らかに受けプレートに移載することができる。As described above, the adhesive tape 15 is easily peeled from the component-forming substrate 13 by a simple and simple structure in which one piece of the adhesive tape 15 is guided by the chuck 14 and transferred to the receiving plate. Further, by disposing the upper surface of the receiving plate 12 at a position higher than the upper surface of the edge plate 11 by the thickness of the adhesive tape 15, the receiving plate 12 can be smoothly placed without damaging the component forming substrate 13. Can be transferred to
【0036】[0036]
【発明の効果】以上のように本発明による部品形成用基
板の搬送方法における粘着テープ貼着および剥離方法に
よれば、部品形成用基板をその進行方向に直交(X方
向)する方向などにずれるのを防ぎ、粘着テープの所定
の位置に精度良い位置決めをして搬送することができ、
また、部品形成用基板から粘着テープを剥離する際に発
生する部品形成用基板と粘着テープ界面の応力を均一か
つ抑制することにより部品形成用基板の割れ、クラック
を防止し、受けプレートへの移載時における部品形成用
基板のがたつきや落下などを抑制して、部品形成用基板
にダメージを与えない安定した粘着テープの剥離および
受けプレートの滑らかな移載を単純な構成により容易に
可能とするという効果を有する。As described above, according to the method for attaching and detaching an adhesive tape in the method for transporting a component-forming substrate according to the present invention, the component-forming substrate is displaced in a direction orthogonal to the traveling direction (X direction). Can be transported with accurate positioning at a predetermined position on the adhesive tape,
In addition, the stress at the interface between the component forming substrate and the adhesive tape, which is generated when the adhesive tape is peeled off from the component forming substrate, is uniformly and suppressed, thereby preventing the component forming substrate from cracking or cracking and transferring the component forming substrate to the receiving plate. Stable peeling of the adhesive tape and smooth transfer of the receiving plate, which does not damage the component forming board, can be easily performed with a simple configuration by suppressing rattling or dropping of the component forming board during mounting. Has the effect of
【図1】本発明の実施の形態1における部品形成用基板
への粘着テープの貼着方法を説明する構成概要平面図FIG. 1 is a schematic plan view illustrating a method of attaching an adhesive tape to a component forming substrate according to a first embodiment of the present invention.
【図2】同要部斜視図FIG. 2 is a perspective view of the main part.
【図3】(a)従来における粘着テープ貼着前の構成を
示す要部概要平面図 (b)従来における粘着テープ貼着後の状態を示す要部
概要平面図FIG. 3 (a) is a schematic plan view of a main part showing a configuration before sticking an adhesive tape in the related art;
【図4】本発明の実施の形態2における粘着テープ剥離
方法を説明する構成概要斜視図FIG. 4 is a schematic configuration perspective view illustrating a method of peeling an adhesive tape according to a second embodiment of the present invention.
【図5】同粘着テープ剥離方法の動作を説明する概要工
程図FIG. 5 is a schematic process diagram illustrating the operation of the adhesive tape peeling method.
【図6】従来における粘着テープ剥離方法を説明する概
要側面工程図FIG. 6 is a schematic side process chart for explaining a conventional adhesive tape peeling method.
1 ローラ 2 テープフレーム(治具) 3 部品形成用基板 4 テーブル 5 粘着テープ 6 位置決め面 7 位置決め面 8 押付け方向 11 エッジプレート 11a ナイフエッジ 12 受けプレート 13 部品形成用基板 14 チャック 15 粘着テープ 16 押え板 17 プレート 18 エッジプレート REFERENCE SIGNS LIST 1 roller 2 tape frame (jig) 3 component forming substrate 4 table 5 adhesive tape 6 positioning surface 7 positioning surface 8 pressing direction 11 edge plate 11 a knife edge 12 receiving plate 13 component forming substrate 14 chuck 15 adhesive tape 16 pressing plate 17 plate 18 edge plate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 安東 良典 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 皆藤 裕祥 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 山田 浩志 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Fターム(参考) 3E067 AA12 AB41 AC03 AC13 BA15A BB30A BC04A CA30 EA05 EC01 FA01 FC05 GD10 3E096 AA04 BA15 BB05 CA13 DA14 EA20X FA09 GA01 5F031 CA04 FA02 FA17 GA53 HA01 KA02 KA17 MA37 MA38 PA20 PA30 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Yoshinori Ando 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroshi Yamada 1006 Kadoma, Kazuma, Osaka Prefecture F-term (reference) in Matsushita Electric Industrial Co., Ltd. CA04 FA02 FA17 GA53 HA01 KA02 KA17 MA37 MA38 PA20 PA30
Claims (3)
ープに部品形成用基板を貼着する貼着工程と、前記部品
形成用基板に各種の加工を施した後、その加工済みの部
品形成用基板を上記粘着テープから剥離する剥離工程を
備える部品形成用基板の搬送方法であって、上記部品形
成用基板の貼着工程は、板状の部品形成用基板の隣接す
る2つの端面を、前記部品形成用基板を保持するテーブ
ルに当接させて前記部品形成用基板を位置決めし、前記
部品形成用基板に対し所定空隙を有して粘着テープを配
設し、前記粘着テープの非粘着面側に設けたローラによ
り前記粘着テープを前記部品形成用基板に押付け、前記
部品形成用基板の隣接する2つの前記端面を前記テーブ
ルに当接させる押付け方向に前記ローラを移動させ、前
記粘着テープの所定位置に前記部品形成用基板を貼着す
る部品形成用基板の搬送方法。An adhesive tape is used as a carrier, and a component forming substrate is attached to the adhesive tape, and after the component forming substrate is subjected to various processes, the processed component forming substrate is processed. A component forming substrate transport method comprising a peeling step of peeling off the adhesive tape from the adhesive tape, wherein the adhering step of the component forming substrate comprises: Positioning the component forming substrate in contact with a table holding the forming substrate, disposing an adhesive tape with a predetermined gap with respect to the component forming substrate, on the non-adhesive surface side of the adhesive tape The adhesive tape is pressed against the component-forming substrate by the provided roller, and the roller is moved in a pressing direction in which the two adjacent end surfaces of the component-forming substrate are brought into contact with the table. A method for transporting a component-forming substrate, wherein the component-forming substrate is attached to a position.
は、板状の部品形成用基板を貼着した粘着テープの接着
面の裏面となる非粘着面を一端にナイフエッジを有した
エッジプレートの上面に当接させて前記部品形成用基板
を前記エッジプレートの上面に載置し、前記部品形成用
基板の上面に当接する押え板を前記部品形成用基板の上
方から載荷し、前記粘着テープの前記非粘着面を前記ナ
イフエッジに係回させ、前記ナイフエッジに係回させた
前記粘着テープの一片を挟持して前記ナイフエッジに沿
って前記粘着テープの一片を前記エッジプレートの下面
側に移動させるとともに、前記エッジプレートに隣接さ
せて配置した受けプレートに前記部品形成用基板を移載
させて前記部品形成用基板から前記粘着テープを剥離す
る請求項1記載の部品形成用基板の搬送方法。2. The peeling step of a processed component-forming substrate includes an edge plate having a knife edge at one end with a non-adhesive surface serving as a back surface of an adhesive surface of the adhesive tape to which the plate-shaped component-forming substrate is attached. The component forming substrate is placed on the upper surface of the edge plate in contact with the upper surface of the component plate, and a pressing plate abutting on the upper surface of the component forming substrate is loaded from above the component forming substrate, and the adhesive tape The non-adhesive surface is rotated around the knife edge, a piece of the adhesive tape rotated around the knife edge is sandwiched, and a piece of the adhesive tape is moved along the knife edge toward a lower surface of the edge plate. 2. The component according to claim 1, wherein the component forming substrate is transferred to a receiving plate disposed adjacent to the edge plate, and the adhesive tape is peeled from the component forming substrate. 3. A method of transporting a forming substrate.
用基板に貼着した粘着テープの厚みに相当する高い位置
に受けプレートの上面を設け、前記粘着テープを剥離し
た部品形成用基板の剥離面を前記受けプレートの上面に
当接させて前記部品形成用基板を前記受けプレートに移
載させ、前記部品形成用基板から前記粘着テープを剥離
することを特徴とする請求項2記載の部品形成用基板の
搬送方法。3. An upper surface of the receiving plate is provided at a position higher than an upper surface of the edge plate corresponding to a thickness of the adhesive tape attached to the component forming substrate, and a peeling surface of the component forming substrate from which the adhesive tape is peeled off. 3. A component forming substrate according to claim 2, wherein said component forming substrate is transferred to said receiving plate by contacting said component plate with an upper surface of said receiving plate, and said adhesive tape is separated from said component forming substrate. Substrate transfer method.
Priority Applications (1)
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JP2001006027A JP3991591B2 (en) | 2001-01-15 | 2001-01-15 | Component forming substrate transfer method |
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JP2001006027A JP3991591B2 (en) | 2001-01-15 | 2001-01-15 | Component forming substrate transfer method |
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JP2002211506A true JP2002211506A (en) | 2002-07-31 |
JP3991591B2 JP3991591B2 (en) | 2007-10-17 |
Family
ID=18873983
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JP2001006027A Expired - Fee Related JP3991591B2 (en) | 2001-01-15 | 2001-01-15 | Component forming substrate transfer method |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005317883A (en) * | 2004-05-26 | 2005-11-10 | Lintec Corp | Wafer processing equipment |
JP2007012751A (en) * | 2005-06-29 | 2007-01-18 | Disco Abrasive Syst Ltd | Method of processing wafer |
JP2007281170A (en) * | 2006-04-06 | 2007-10-25 | Denso Corp | Method and apparatus for manufacturing semiconductor device |
-
2001
- 2001-01-15 JP JP2001006027A patent/JP3991591B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005317883A (en) * | 2004-05-26 | 2005-11-10 | Lintec Corp | Wafer processing equipment |
JP4689972B2 (en) * | 2004-05-26 | 2011-06-01 | リンテック株式会社 | Wafer processing apparatus and wafer processing method |
JP2007012751A (en) * | 2005-06-29 | 2007-01-18 | Disco Abrasive Syst Ltd | Method of processing wafer |
JP4705418B2 (en) * | 2005-06-29 | 2011-06-22 | 株式会社ディスコ | Wafer processing method |
JP2007281170A (en) * | 2006-04-06 | 2007-10-25 | Denso Corp | Method and apparatus for manufacturing semiconductor device |
JP4697014B2 (en) * | 2006-04-06 | 2011-06-08 | 株式会社デンソー | Semiconductor device manufacturing method and semiconductor manufacturing apparatus. |
Also Published As
Publication number | Publication date |
---|---|
JP3991591B2 (en) | 2007-10-17 |
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