JPS62152707A - Method of peeling-off film, peeling needle device therefor and peeling-off device - Google Patents

Abstract

PURPOSE:To make it possible to simply and smoothly peel off the whole film by a method wherein the corner of each one of films, which are fixed by suction or pressure to a plate to be fixed with films, is peeled off so as to form a holding part for peeling-off film in order to joiningly hold said holding part with a peeling-off device, on which an adhering member is provided, or further to pinchingly hold with each one of a pair of fingers. CONSTITUTION:First, the corner parts 6 of films 2, which are fixed by suction or pressure to a base (a plate to be fixed with films) 1, are peeled off with peeling needles 4a and 4b which slide along a plate cam 3 having a triangular tip, so as to form holding parts for peeling-off film which act as starts for peeling-off. Secondly, the holding parts for peeling-off film (the corners 6 of the films 2) are respectively and joiningly held with roller type peeling-off devices B equipped with adhering members 10 or further pinchingly held with peeling-off devices C, each of which is equipped with a pair of a fixed finger 11a and a moving finger 11b in order to be able to easily and quickly peel off the whole films 2.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a film peeling method for peeling off a film adsorbed or pressed onto a film-adhering plate such as a printed circuit board, a peeling needle device used in the method, and a peeling device. Regarding.

[Conventional technology]

Generally, a film is attached to printed circuit boards, etc. to protect the surface, but this film is attached to the printed circuit board to prevent it from peeling off even when some external force or frictional force is applied. It is firmly adsorbed or crimped onto the board.

For this reason, conventionally, when peeling a film from the film-adhering plate, a part of the corner of the film that has been adsorbed or pressed by a wedge-shaped claw is peeled off, and then the corner is held and peeled by hand or the like. Alternatively, as shown in Japanese Unexamined Patent Publication No. 58/56794, a method has been adopted in which the side surface of the edge of the substrate is chamfered and the protective sheet (film) is peeled off using the curling up of the end.

[Problem that the invention seeks to solve]

However, in any of the above cases, there is a problem that the film adhered plate such as a printed circuit board is damaged and cannot be peeled off smoothly.

[Purpose of the invention]

The present invention was made to solve the above-mentioned problems and drawbacks.
Another object of the present invention is to provide a film peeling method that allows smooth peeling, and a peeling needle device and a peeling device used in the method.

[Means for solving problems]

The basic structure of the present invention for solving the above problems is as follows:
The corner of the film adsorbed or pressed onto the film adhering plate is peeled off with a peeling needle, and the peeled corner of the film is adhered and held with a peeling device equipped with an adhesive member, or further moved with a pair of fixed hingers. It is characterized in that it is held and held in a peeling device equipped with a hinge and peeled off.

[Action of the invention]

By peeling off the corners of the film adsorbed or pressed onto the film-adhering plate with a peeling needle, the film can be easily peeled off with almost no scratches (spot marks), and the corners of the peeled film can be peeled off. A peeling film holding portion for the entire film is formed. Thereafter, the entire film can be easily and smoothly peeled off by adhering and holding this peeling film holding part with a peeling device equipped with an adhesive member, or by holding it in a pinch with a peeling device equipped with a pair of fixed and movable hinges. .

[Embodiments of the invention]

Embodiments of the present invention will be described in detail below with reference to the drawings.

1 to 6 show an example of the film peeling method of the present invention in the order of steps.

(1) First, as shown in Fig. 1, a film adhering plate 1, such as a printed circuit board, with a film 2 attached to both sides by suction or pressure bonding is conveyed from one side to the other, and a plate cam with a triangular tip is transported. 3 and 1. A part of the film 2 is peeled off using a peeling needle device A equipped with a pair of peeling needles 5a and 5b each having a pair of peeling needles 4a and 4b attached thereto, each of which slides using both surfaces of the cam 3 as guides. That is, as shown in FIG.
b is guided by both sides of the plate cam 3, and the tip of each inclined peeling needle 4a, 4b is inserted between the printed circuit board 1 and the film 2 to peel off a corner 6 of the film 2. do. Note that FIG. 7 shows rollers for smooth movement of the hingers 5a and 5b. At this time, slight scratches occur on both sides of the substrate 1, but the scratches are point-like scratches and do not cause any problems in the subsequent processing. By peeling off the corners 6 of the film 2, a film holding part for peeling the entire film 2 is formed.

(2) Next, as shown in FIG. 3, using a peeling device B in which an adhesive member 10, such as double-sided tape, is provided on the outer periphery of the roller body 8 via a vinyl tube 9, as shown in FIG. The peeled corners 6 of the film 2 of the sent printed circuit board 1 are adhered and held.

(3) Then, as shown in FIG. 4, the corners 6 of the film 2 are separated in the vertical direction while being adhered and held by the roller body 8, respectively. The peeled corner 6 of the film 2 is
Since this is the entire peeling film holding portion, by adhering and holding this portion with the adhesive member 10 of the peeling device B, the film 2 can be held securely and peeled off easily.

(4) After that, a pair of hingers Il provided with a fixed hinger 11a and a movable hinger l″lb connected to the rotating shaft 13 of the rotary actuator 12 as shown in FIG.
As shown in FIGS. 5 and 6, a part of the film 2 that has been peeled off is held in place using a peeling bag WC equipped with b, and the film 2 adsorbed or pressed onto the printed circuit board 1 is completely removed. Peel off.

The above-mentioned operation is then repeated to peel off the film 2 of the printed circuit board 1 that is ta-fed in mass production.

When the film 2 adsorbed or pressed onto the printed circuit board (film adhering board) 1 is peeled off in this way, the corner 6 of the film 2 is first peeled off by the peeling needles 4a and 4b, which becomes a trigger for peeling. That is, a peeling film holding part is formed, and then this peeling film holding part (corner 6 of the film 2) is adhesively held by a peeling device B equipped with an adhesive member 10, or further moved with a pair of fixed hinges. The entire film 2 can be easily and quickly peeled off by holding it between the peeling devices C equipped with a peeling device C. Of course, the peeling needle 4a is the starting point for peeling.
, 4b when the corners 6 of the film 2 are peeled off are extremely small dot-like scratches as described above, and do not cause any trouble during subsequent processing.

The above embodiment is an example in which the film 2 is adsorbed or pressed on both sides of the film adhering plate 1 (it may also be a case where the film is provided on both sides to protect a colored galvanized or stainless steel plate). As shown above, even if the film is adsorbed or pressed onto only one side of the film-adhering plate, such as when applying a masking material (film) when painting an automobile body, it can be easily and quickly peeled off using the same method. I can do it.

When the number of films to be peeled is small, or when mass production is not required, the corners of the film are manually peeled off with a peeling needle, etc., and then the film is peeled off using an adhesive member such as adhesive tape or peeling device B. Other embodiments of the present invention, in which the peeled corners are adhesively held and the film is peeled off manually or by mechanical means, allow the film to be peeled easily and quickly. Of course, the damage caused to the film-attached plate is extremely slight, such as leaving no damage.

〔Effect of the invention〕

As described above, according to the present invention, the effects of the present invention are extremely large, such as allowing the film to be peeled off smoothly and easily without damaging the film.

[Brief explanation of drawings]

FIGS. 1 to 6 are cross-sectional views showing each step in order of steps in an embodiment of the film peeling method of the present invention, and FIGS. 7 and 8 are cross-sectional views of a peeling apparatus, respectively. DESCRIPTION OF SYMBOLS 1...Film adhered board (printed circuit board), 2...Film, 3...Plate cam, 4a, 4b...Peeling needle, 5
a, 5b...Hinga, 6...Corner, 8...Roller body, 9...Tube, 10...Double-sided tape, l
la...fixed hinga, llb...movable hinga,
DESCRIPTION OF SYMBOLS 12... 0-Clear actuator, 13... Rotating shaft, A... Peeling needle device, B, C... Peeling device.

Claims (4)

[Claims] (1) Peel the corners of the film adsorbed or pressed onto the film adhering plate with a peeling needle, and then adhere and hold the peeled corners with a peeling device equipped with an adhesive member, or further fix the film with a pair of fixing devices. A film peeling method characterized in that the film is held and peeled using a peeling device equipped with a hinger and a moving hinger. (2) A peeling needle device characterized by comprising a plate cam having a triangular tip and a pair of hingers each having a peeling needle attached to the plate cam and sliding peeling needles using both surfaces of the plate cam as guides. (3) A peeling device characterized in that an adhesive member is provided on the outer periphery of the roller body via a tube. (4) A peeling device comprising a fixed hinger and a pair of movable hingers connected to a rotating shaft of a rotary actuator.