TWI312412B - Gluey intensity testing apparatus - Google Patents

Description

1312412 IX. Description of the Invention: [Technical Field] The present invention relates to a gluing strength testing device, and more particularly to a gluing strength test capable of accurately measuring the peeling force of a liquid rubber material from a test object. Device. However, [Prior Art] Encapsulation of 1C wafers by ceramic or plastic materials is an important step in the process of semi-slipping. In the electronic packaging process, the interface between the materials requires a number of bonding steps. The large adhesion will cause many problems, such as affecting the difficulty of the material being heated into 2, and even affecting the problems of materials and materials, materials and adhesions, and thermal stress, which may affect the failure of the sealing. The production yield is reduced by two sides, and the reliability is not good. Therefore, it is necessary to accurately detect the ς strength of the semiconductor material. * Figure 1 shows the conventional bonding strength test device, as described in Chinese Patent No. 200520127, "Detecting Material Shearing Force Detection Method". Please refer to Figure 1 for the customary bonding strength test device. The one side of the measuring platform 10 is fixed on a single side. The crystal is doubled. The shape of the adhesive is formed into a one-cut outer force. The size of the adhesion force. However, the shearing force applied by the detecting rod 13 detects the side of one side of the platform 10, so that there is a neighboring eight 1 which is only known to be added to the worker\# to the outward force, which will become the adhesive surface = the force component, breaking into a turn Forming "12 with the inspection station 1〇

UndaXPK Pat\«l0226.doe Qufu change 'and then cause the amount of position _ the cut (four) stress distortion nG/12/2&/U-24 Al —5 — 1312412 Another glue strength test device, such as The Republic of China Bulletin No. 428263, "Method for Testing the Bond Strength of a Package Between a Lead-on-Chip (LOC) Wafer and a Lead Frame," is described in the invention patent. It uses a fixture plate to apply a force to adhere to the side of a wafer of a wire holder until the wafer is separated from the wire holder, and the package bonding strength is known. In general, the above-mentioned practices have a number of disadvantages, such as the fact that the test results need to destroy the wafer to obtain, the measured package bond strength or the shear-to-adhesion force is inaccurate. Based on the above reasons, the glue strength testing device disclosed in the embodiment of the present invention can accurately measure the bonding strength after heat curing of a liquid glue. [Summary of the Invention]

The object of the present invention is to provide a gluing strength testing device capable of accurately measuring and recording the peeling of a liquid rubber material from a test object by using two liquid glue filling and measuring platforms located above and below a detecting platform. The amount of peeling force required to be applied. The invention provides a glue strength testing device, comprising a detection platform, a first liquid glue filling platform and a second liquid glue filling platform. The detecting platform is configured to fix a first object to be tested and a second object to be tested. The first object to be tested is fixed on the first surface of the detecting platform, and the second object to be tested is fixed on the detecting platform. surface. The first liquid glue filling platform is spaced apart from the first surface of the detecting platform to adhere the liquid glue to the first object to be tested. a second liquid glue filling platform, the second object to be tested is disposed on the second surface of the detecting platform, and is used by O:\ni-I Linda\PK Pat\PK10226.d〇e-6fn/12/20/ n

AN 1312412 is to adhere a liquid glue to the second object to be tested. In the above-mentioned bonding strength testing device, the bonding strength testing device is cured according to the liquid curing material heat curing condition, and after the liquid rubber material is adhered and fixed to the first object to be tested and the second object to be tested, the detection platform is pulled. The first test object and the second test object, thereby applying a peeling force to the liquid glue to measure and record the peeling of the liquid glue from the first object to be tested and the second object to be tested The amount of peeling force required to be applied. • The gluing strength testing apparatus according to the preferred embodiment of the present invention, the peeling external force system - the shearing shear force of the plane relative to the detecting platform and the liquid coffin filling platform. According to the gluing strength testing device of the preferred embodiment of the present invention, the liquid rubber filling and measuring platform has a filling groove, a filling hole and a vent hole, and the filling hole and the vent hole are connected to the filling. Glue groove. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to make the other objects, features and gamma of the present invention more obvious, the preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings: Fig. 2 is a side view of the gluing strength testing device of the embodiment of the present invention. Please refer to Figure 2, the actual _, combined strength _ platform buckle and liquid glue filling platform 22, 22,. Detection platform ‘ ^方© placed copper sample 21, under the detection platform 2Q is to be tested,. The object to be tested 2, 21, is a semiconductor material, for example, the same type of chip or the same type of substrate. The liquid glue and the leveling σ 22 are disposed above the detecting platform 2Q for applying the liquid glue village ηπ/Ι2/2Γ, /ιι; 2 (| 1312412 23 to the object to be tested 21, & a The upper liquid and liquid rubber filling platform 22 is set below the double measuring platform 20 for the face and the object 21, and is used to apply the liquid adhesive 23 to be tested. The glue strength test is carried out according to the curing. The liquid material is 23, 23% of the people _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The materials 2, 21, and the liquid succulents 23, 23' are simultaneously subjected to a system of 々k ^ to π me external force, and the liquid state = 2, 23 self-test specimens 21, 21 are measured and recorded. The size of the stripping force to be applied. Because the liquid material conversion platform 22 and 22, and (4) and 2Γ are the upper and lower symmetrical settings, the following is only to detect the flat; 2〇' collocation liquid_material_platform 22 and The material to be tested 2 is described in detail. FIG. 3 is an enlarged view of the liquid glue filling platform 22 of the embodiment of FIG. 2. FIG. 4 is the liquid glue filling platform 22 of the embodiment of FIG. Please also refer to pictures 3 and 4, liquid glue filling platform π嗖• gum groove 22 padding hole 22Π and vent hole 2212. mouth filling glue 2211 and vent hole 2212 are set in the filling concave Above the slot 221, the glue hole 2211 is used for filling (4) riding 23, and the button 2212 is used to discharge the air in the filling groove 221 during the filling of the liquid glue 23. The vent hole can be in the four corners of the filling groove 221 The upper part is arranged to increase the fluency of the air discharged from the filling groove 221. The liquid glue filling platform 22 is further provided with a fixing hole 222 for fixing the liquid glue filling platform 22 to the testing machine, such as Tensile testing machine (not shown), so that the liquid glue filling platform 22 is on the detecting platform 2〇 liquid glue D:\0I-I LindaXPt: Pat\Pkl022r>.<i〇c-8-XJl24i2 = When the external force is applied, it is more stable to maintain the stability of the liquid rubber filling platform 22 = the parallelity of the liquid energy filling platform 22 and the detection platform 2 () plane energy _ * ,, increasing the measurement accuracy of the peeling external force Detect flat a 20

:;:5 Further, a fixing hole 201 ′ can be disposed therein, and a pulling device (not shown) can be disposed, and k is used for detecting the external force of the platform 2Q. _ external force divided by the area of liquid glue = 3 applied to the object 21 to obtain liquid glue μ = adhesion. Generally speaking, the smaller the area coated by the liquid glue 23 is, the better the area is. The better the knowledge of the adhesives in the field, the manufacturers should know the test platform and the liquid glue. Material filling and testing platform 2, 21, the design methods are different, Yan 2 and (four) riding can be used according to various semiconductor processes _ choice, liquid glue 3 j slant is also a thief, the financial should be used as For example, the vent hole 2212 can be arbitrarily disposed above the filling groove 221 . The liquid material filling platform 22 may also be provided with a fixing hole, for example, and directly combined with the structure of the crucible (such as the chassis of the testing machine) in a body-forming manner to increase the stability of the liquid rubber filling platform 22. Similarly, the detection of the two ports 20 can also be used to fix the pupil without σ, and directly with the tension device (not shown), and the mouth. Tian Ran, a tension device (not shown) can be combined with a recorder (not shown, such as a personal computer and analysis software) to record the peeling force required for previous tests. In other words, as long as the liquid balance platform Μ, 22, symmetrically disposed symmetrically on both sides of the detection platform 20, the detection platform 2 can be applied to the liquid sample coated on the phase test material 2 23, 23, simultaneous application

UndaNPK Pat\PKinZ2C.doc —9 — 1312412 ^The same amount of peeling force, which minimizes the positive force of the peeling force on the liquid glue 23, 4, so that the measurement can be accurately peeled = external force That is, the spirit of the present invention. In summary, compared to the conventional glue strength test device, because only the test side of the t-side is used to cause the measured package bond strength or the shearer force to be inaccurate, or to destroy the crystal), the test value can be obtained. The lack of pure waiting is because the detection platform is used to fix the two to be tested, /JW, /, one is fixed on the detection platform, the other is fixed on the detection platform I, and the second liquid glue is used for testing. Platform, which is located at the inspection platform = another - located below the inspection platform to apply liquid glue to

II: Death can be: 2: After the liquid glue is bonded and fixed to the object to be tested, the mouth applies to the two liquid glue materials on the two test objects: the most = Bu 2: and: the coffee is peeling off the external force The peeling required for the coffee is to peel off the liquid glue from the object to be tested. The limit =:::=r case reveals that it is not within the scope of the god and the scope. The application scope of the patent application is as follows: the cause of the invention: dr'DH LindeSPIs Pat\PKJ022fi. doc 1312412 [Simplified illustration of the drawing] Fig. 1 is a side view of a conventional bonding strength testing device. FIG. 3 is a side view of the liquid glue filling platform 22 of the embodiment of the second embodiment. FIG. 4 is a liquid glue filling platform 22 of the second embodiment. Body map.

[Main component symbol description] 10 Inspection platform 12 glue molding finished product 20 Detection platform 21 'Test object 22 'Liquid coffin filling platform 23' Liquid glue 221' Knee-filled groove 2211' Filling hole 2212' Vent hole 222' fixing hole 11 wafer to be tested 13 detecting rod 21 to be tested 22 liquid glue filling platform 23 liquid glue 221 filling groove 2211 filling hole 2212 vent hole 222 fixing hole 201 fixing hole D: \QI-I LindeNPK Pat\PK10226.doc ηΓ'^2/2Γ, /||..; ——11——

Claims (1)

1312412 X. Patent application scope: 1. A glue strength testing device, comprising: - a detection platform for fixing - the first to be tested and the second to be tested - the first test - the test platform ―Surface, the first object to be tested is fixed on the surface of the detection platform. The first-liquid glue filling platform is spaced from the first surface. The waiting object is disposed on the first surface of the detection platform for pickling. For the At test object; and using the sputum to adhere the liquid sorrow material to the first to be a second liquid glue filling platform, the second surface of the testing platform, the second test object is set on the test object; Adhesive material is adhered to the second to be rotated (four) and fixed (4) the first test article and the second test piece 'the detection platform axis the first test object and the third pass, thereby using the liquid __ _ In order to measure the amount of external force of the material to be measured from the first object to be tested and the second to be tested 2; i state; material: 胶1 item of the bonding strength test device, wherein the liquid energy material 1σ 11 & method is to cure the glue strength test device according to the conditions. 3 According to the scope of the patent application, the gluing strength testing device described in the item measures the shearing force of the plane τ relative to the detection platform and the plane of the liquid glue and the mouth of the mouth. 4. According to the scope of application of the patent, the glue strength test device described in the liquid item, > the real test platform has a glue filling groove. Linde\PK Pat\Ptri〇22C. doc 1312412 5. The glue strength testing device according to claim 4, wherein the liquid glue filling platform has a glue filling hole and a vent hole connected to the glue filling Groove. 6. The glue strength testing device according to claim 1 or 2, wherein the liquid glue filling platform has a fixing hole. 7. The gluing strength testing device according to claim 1 or 2, wherein the detecting platform has a fixing hole. 8. The bonding strength testing device according to claim 1 or 2, wherein the contact area of the liquid glue with the object to be tested is smaller than the area of the object to be tested.