TWI556274B - Holding jig, handling jig, set of holding jigs, and apparatus for holding stuck objects - Google Patents

Description

Holding fixture, mounting fixture, a set of holding fixtures, and an adherent retaining device

The present invention relates to a holding jig, a mounting jig, a set of holding jigs, and an adherent holding device. In particular, the present invention relates to a holding jig, a mounting jig, a set of holding jigs, and an adherend holding device which can easily make almost all of them adhered while holding the adherend in a desired manner. The adhesive that is held by the adhesive is detached.

In the past, for example, when a small component such as a chip capacitor is manufactured, a holding jig capable of adhering a small component or the like capable of manufacturing the above-described small component or the like to the surface is used. For example, the holding jig disclosed in Patent Document 1 is characterized in that at least the surface portion is formed of an adhesive rubber elastic material, and the small portion can be closely held on the surface of the elastic material by the adhesion of the surface portion (refer to the patent) Patent Application No. 1 of Document 1). When such a holding jig is used to manufacture a small-sized component or the like, the small-sized component is used as an adherend and adhered to the holding jig to be used in various manufacturing steps. Next, a small part or the like which is manufactured by being adhered and held in a holding jig is removed from the holding jig.

A method of removing a small-sized component or the like from the holding jig, for example, a small-sized scraping member such as a scraper is slid on the surface of the elastic material to remove a small-sized member to be adhered and the like. Such a method is specifically disclosed in Patent Document 2: "A method of mounting an electronic component, comprising the steps of: adhering a plurality of electronic components to an electronic component holder including an adhesive layer formed on one side thereof by adhesion; a layer; performing a predetermined treatment on the electronic component held on the adhesive layer; and recessing the adhesive layer by the front end of the blade, in which the blade is relatively moved in the direction of the surface of the adhesive layer, thereby disengaging the electronic component Layer." (Refer to the fourth paragraph of the patent application scope, etc.).

The method shown in Patent Document 2 is that "the adhesive layer is recessed by the tip end of the blade, and the blade is relatively moved in the direction of the surface of the adhesive layer in this state", whereby the electronic component 2 is tilted away from the adhesive layer, as shown in FIG. 3 of Patent Document 2. Shown. Therefore, if the size of the electronic component, the recessed state of the adhesive layer, the adhesive force of the adhesive layer, and the moving speed of the blade are not properly set, the electronic component will be poured and adhered to the surface of the adhesive layer again, so that it cannot be expected in a desired manner. The above electronic parts are removed from the adhesive layer.

Further, regarding other methods, Patent Document 3 discloses "a method of mounting an electronic component, the feature comprising the steps of: preparing a holding unit including a layer of an adhesive material, and a non-adhesive portion or a low-adhesive portion having an adhesive force smaller than that of the adhesive material layer; One end surface of the part is adhered to the adhesive material layer of the holding unit to hold the electronic component; and the scraping unit is moved along the surface of the adhesive material layer, and the scraping unit is moved toward the non-adhesive portion or the low-adhesive portion Move in the direction of the end of the direction, and scrape the electronic parts from the adhesive material layer (refer to item 8 of the patent application, etc.). Even if the small-sized component scraping member slides on the surface of the elastic material as in the method disclosed in Patent Document 3, the adherend is poured and adhered to the surface of the adhesive layer again, and the small component is not easily removed.

In particular, since small parts and the like are miniaturized year by year, the size of small parts is becoming smaller and smaller, and the above-mentioned problem of re-adhesion of small parts is more likely to occur.

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Special Publication No. 07-93247

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2003-77772

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2004-193366

SUMMARY OF THE INVENTION An object of the present invention is to provide a holding jig, a mounting jig, a set of holding jigs, and an adherend holding device which can be easily kept almost all of them adhered while holding the adherend in a desired manner. The adhesive is detached.

It is a common knowledge that a holding jig that presses an adherend against an elastic member to be adhered to the elastic member and presses the adherend toward the elastic member to the side, is that the adhesive is not adhered to the adhesive. The adhesive surface is highly flat and cannot adhere to the adhesive in the desired way. The inventors of the present invention have found that, if contrary to the prior art common knowledge, the surface of the adhesive surface is thickened to some extent, and even if the adherend is brought into contact with the adhesive surface, it cannot be firmly adhered and adhered without being pressed. But if the adhesive is pressed against the adhesive surface, the adhesive surface will exhibit almost the same adhesion as the flat adhesive surface, and it can adhere to the adhesive, and as long as it is pressed sideways By adhering the adhered material, almost all of the adherend can be easily detached from the above adhesive surface. The present invention has thus been completed with new discoveries.

As described above, the inventors of the present invention have found that if the surface of the adhesive surface is made thicker to a certain extent, the high adhesion force when the adherend is pressed and the detachment property of the adherend can be highly balanced, and the adhesion cannot be adjusted only by adjusting the adhesion. High adhesion from the adhesion of the surface. The present invention has thus been completed with new discoveries.

The first means for solving the above problem, that is, the holding jig of the present invention is characterized in that the jig body and the maximum roughness Ry (Japanese Industrial Standard (JIS) B 0601-1994) provided on the surface thereof are elastic members of 1.0 to 6.0 μm. .

In a preferred embodiment of the holding jig, the average interval Sm (JIS B 0601-1994) of the unevenness of the elastic member is 5.0 to 15.0 μm.

A second means for solving the above problems, that is, the mounting jig of the present invention includes: the holding jig of the present invention; and a releasing member which relatively moves along the surface of the elastic member in the holding jig to adhere the adhered object Leaving the surface of the above elastic member.

A third means for solving the above problems, that is, the set of holding jigs of the present invention includes: a first holding jig including a first jig main body and a first elastic member provided on a surface thereof; and a second holding jig including a second The clamp body and the second elastic member provided on the surface thereof, at least one of the first and second holding jigs is the holding jig of the present invention, and the adhesion force of the second elastic member is larger than the adhesion of the first elastic member .

In a preferred embodiment of the above-described set of holding jigs, the second holding jig is the holding jig of the present invention.

A fourth means for solving the above problems, that is, the adherend holding device of the present invention is characterized by comprising a set of holding jigs of the present invention.

The holding jig of the present invention includes a jig body, and an elastic member having a maximum roughness Ry of 1.0 to 6.0 μm provided on the surface of the jig body. Therefore, when the adherend is pressed against the elastic member, the contact surface of the adherend adheres to the surface of the elastic member and adheres to the elastic member. On the other hand, when the adherend is pressed from the side, the contact surface of the adherend is peeled off from the surface of the elastic member, and the adherend is released from the elastic member.

Further, the mounting jig of the present invention includes the holding jig of the present invention, and the set of holding jigs of the present invention includes at least one holding jig of the present invention, and the adherend holding device of the present invention includes a set of holding jigs of the present invention.

Accordingly, the present invention provides a holding jig, a mounting jig, a set of holding jigs, and an adherend retaining device that can easily hold almost all of the adherends while adhering to the adherend in a desired manner. Being detached from the adhesive.

In the holding jig, the mounting jig, the set of holding jigs, and the adherends held by the adherend holding device of the present invention, an adherend member capable of adhering to the adherend held by the above invention can be exemplified. For example, members for small appliances, members for small mechanical components, and members for small electronic components. Moreover, the process of transporting the adherend also includes the step of transporting the adherend, and the like, and the adherend also includes the adherend itself, such as a small appliance, a small mechanical component, and a small electronic component. Therefore, in the present invention, it is not necessary to clearly distinguish between the adherend and the member for the adherend. The above-mentioned adherend is preferably a holding jig, a mounting jig, a set of holding jigs, and an adherend holding device which are held by the present invention, and may be a small electronic component and/or a member for a small electronic component. The components for small electronic components and small electronic components may be, for example, finished products of capacitor chips (sometimes referred to as wafer capacitors), inductor chips, resistor chips, flexible printed circuit boards (FPC), wafers, and the like. a finished product or the like, and/or a corner cylinder or a cylinder having a flange at one end, and a corner cylinder having a flange at both ends, for example, a corner cylinder or a cylinder capable of manufacturing the above-mentioned finished product or unfinished product. Or a cylinder or the like.

The holding jig of the present invention comprises an elastic member having a jig body and an adhesive surface having a maximum roughness Ry within the above range, and the adhesive surface of the elastic member can be adhered to hold the adherend in a desired manner, and is easy if necessary. The adhesive is adhered to the elastic member. In order to adhere the adherend to the holding jig of the present invention, it is pressed against the adhesive surface of the elastic member. In this way, the adhesive surface of the elastic member pressed by the contact surface of the adherend, for example, the mountain portion having the maximum roughness Ry is elastically deformed to flatten the valley portion and adhere to the contact surface of the adherend, thereby being The adhesive adheres to the elastic member. On the other hand, in order to remove the adherend held by the holding jig of the present invention, the adherend is pressed from the side so that the adherend is poured. In this way, the elastically deformed mountain portion is restored, and the roughness of the adhesive surface becomes the maximum roughness Ry in the above range, and the contact surface of the adherend is easily peeled off from the surface of the elastic member, and the adherend is released from the elastic member. As described above, when the adhesive surface of the elastic member has the maximum roughness Ry in the above range, contrary to the prior art, the high adhesion force when the adherend is pressed and the detachability of the adherend can be highly balanced. As a result, almost all of the adherend can be easily detached although it can be adhered to maintain the adherend in a desired manner. The above-mentioned prior art common knowledge means that if the adhesive surface is not made flat, it is impossible to adhere to the adherend.

An example of the holding jig of the present invention will be described below with reference to the drawings. As shown in Fig. 1, the holding jig 1 includes a jig body 2 and an elastic member 3 provided on the surface of the jig body 2 and having an adhesive surface capable of adhering to the adherend.

As shown in Fig. 1, the jig body 2 supports an elastic member 3 to be described later, and has a smooth surface. As long as the elastic member 3 can be supported, various shapes can be changed based on various designs. For example, as shown in FIG. 1, the jig body 2 is formed as a disk-shaped sheet body having a size larger than that of the elastic member 3 so as to protrude from the end edge of the elastic member 3 in the vicinity of the end edge. The jig body 2 may be formed as a square disk-shaped sheet body that exhibits substantially the same size as the elastic member 3.

The jig body 2 may be formed of a material that can support the elastic member 3, for example, a metal plate such as stainless steel or aluminum; a metal foil such as aluminum foil or copper foil; and polyester, polytetrafluoroethylene, polyimine, and polyphenylene. A resin film such as thioether, polyamine, polycarbonate, polystyrene, polypropylene, polyethylene, or polyvinyl chloride, or a resin plate. Further, the jig body 2 may be designed as a laminated body in which a plurality of sheets are laminated.

The elastic member 3 is designed to be in contact with a plane of the adherend to adhere to the plurality of adherends. For example, as shown in FIG. 1, the elastic member 3 is formed on the surface of the jig body 2 to form a square smaller than the clamp body 2. Disc shape. The elastic member 3 is formed, for example, of an adhesive material having an adhesive force to be described later or a cured material of the adhesive material, and the entire surface of the elastic member 3 is an adhesive surface that can adhere to the adherend.

Since the adhesive surface of the elastic member 3 adheres to the surface of the adherend and adheres to the adherend, it has an adhesive force capable of adhering and holding the adherend. Specifically, the elastic member 3 generally preferably has an adhesive force of 1 to 60 g/mm ² and preferably has an adhesive force of 7 to 60 g/mm ² . The adhesive force of the elastic member 3 is a value measured by the following "Shin-Etsu Polymer Method" in which the elastic member 3 is fixed to an adsorption fixing device or a vacuum suction chuck plate in a load measuring device, and the measurement environment is set to 21 ±1 ° C, humidity set to 50 ± 5%. The load measuring device includes an adsorption fixing device for horizontally fixing the elastic member 3 (for example, trade name: electromagnetic chuck KET-1530B, manufactured by KANETEC Co., Ltd.) or a vacuum suction chuck plate, and the like at the front end of the measuring unit. A digital dynamometer (trade name: ZP-50N, manufactured by IMADA) equipped with a contact made of stainless steel (SUS304) having a diameter of 10 mm. Next, the contact member attached to the load measuring device is lowered at a speed of 20 mm/min until it comes into contact with the portion to be tested of the elastic member 3, and then contacts the measuring portion at a predetermined load of 25 g/mm ² . The piece is pressed against the site to be tested for 3 seconds. Next, the contact member was pulled away from the tested portion at a speed of 180 mm/min, and the pull-out load measured by the above-mentioned digital dynamometer was read. The above operation is performed at a plurality of locations of the measured portion, and the obtained plurality of pull-off loads are arithmetically averaged, and the arithmetic mean value obtained is set as the adhesive force of the elastic member 3.

The maximum roughness Ry (JIS B 0601-1994) of the adhesive surface of the elastic member 3 is 1.0 to 6.0 μm. If it is less than 1.0 μm, the mountain with the largest roughness is too small, and the contact surface of the adherend is excessively adhered, so that the adhesion of the adherend is not good; on the other hand, if it exceeds 6.0 μm, the maximum roughness is obtained. The degree of the mountain is too large, and even if the mountain is elastically deformed by being pressed by the adhesive, the adhesiveness of the adhesive surface is not good, and the adhesive cannot be adhered with high adhesion; in either case, the high adhesion cannot be achieved at all. The detachment of force from the adhesive. The maximum roughness Ry is preferably 1.0 to 5.0 μm, preferably 2.0 to 4.0 μm, in view of the fact that the high adhesion and the adhesion of the adherend can be more highly balanced and the object of the present invention can be satisfactorily achieved. The maximum roughness Ry is the maximum roughness when the adhesive surface is not adhered to maintain the adherend, and at least 3 points are measured under conditions of a cutoff of 0.8 mm and a length of 2.4 mm according to JIS B 0601-1994. The maximum roughness Ry is set as the arithmetic mean of the measured values at the above three points. The maximum roughness Ry can be adjusted by a method or the like described later.

The average interval Sm (JIS B 0601-1994) of the unevenness of the adhesive surface of the elastic member 3 is preferably 5.0 to 15.0 μm, more preferably 5.0 to 11.0 μm, and particularly preferably 6.0 to 11.0 μm. When the average interval Sm of the unevenness of the adhesive surface is in the above range, the interval between the mountain portion and the mountain portion (or the valley portion and the valley portion) becomes a desired interval, and therefore, the adhesive surface due to the elastic deformation of the mountain portion The flatness is higher, and the object of the present invention can be satisfactorily achieved. The average interval Sm of the unevenness of the adhesive surface is the average interval of the unevenness when the adhesive surface is not adhered to maintain the adherend, and is basically measured by the method disclosed in JIS B 0601-1994, and the cutoff wavelength is 0.8 mm, and the length is evaluated. For 2.4 mm, the cutoff wavelength category is Gaussian, and the average interval Sm is the arithmetic mean of at least 3 points. The average interval Sm of the unevenness of the adhesive surface can be adjusted by a method or the like described later.

In order to achieve the object of the present invention, the center line average roughness Ra (JIS B 0601-1994) of the adhesive surface of the elastic member 3 is preferably 0.1 to 0.5 μm, and particularly preferably 0.2 to 0.4 μm. Ra is the center line average roughness when the adhesive surface is not adhered to maintain the adherend. According to JIS B 0601-1994, at least 3 points are measured at a cutoff wavelength of 0.8 mm and a length of 2.4 mm, and the center line is averaged rough. The degree Ra is set to the arithmetic mean of the measured values at the three points. The Ra value can be adjusted by a method or the like described later.

For the purpose of achieving the present invention, the ten-point average roughness Rz (JIS B 0601-1994) of the adhesive surface of the elastic member 3 is preferably 1.0 to 5.0 μm, more preferably 2.0 to 4.0 μm. Rz is the ten-point average roughness when the adhesive surface is not adhered to maintain the adherend. According to JIS B 0601-1994, at least 3 points are measured at a cut-off wavelength of 0.8 mm and a length of 2.4 mm, and the average of ten points is rough. The degree Rz is set to the arithmetic mean of the measured values at the three points. The Rz value can be adjusted by a method or the like described later.

The maximum roughness Ry of the adhesive surface of the elastic member 3, the average interval Sm of the unevenness, the center line average roughness Ra, and the ten point average roughness Rz can each be adjusted as follows. For example, a method of surface-treating the adhesive surface of the elastic member 3 by a well-known roughening treatment such as sand blasting, or a forming mold having a cavity inner surface having a surface treatment by a well-known roughening treatment can be exemplified. A method of forming the elastic member 3, and a method of forming the elastic member 3 or the adhesive material forming the elastic member 3 with a granular material.

A method of causing the elastic member 3 or the adhesive material forming the elastic member 3 to contain a granular material (hereinafter referred to as a surface roughening method of the present invention) will be briefly described. The granular material used in the surface roughening method of the present invention may be a particle, and the shape, material, and the like are not particularly limited, and a known particulate filler or the like can be exemplified.

The granular material satisfying the above criteria may, for example, be an inorganic filler such as an alumina-based filler. The bauxite filler material may, for example, be bauxite synthesized by a dry method such as smoked sputum or calcined bauxite; and bauxite synthesized by a wet method such as bauxite or tannin. Among the above-mentioned bauxites, smoked and precipitated bauxite are preferred.

Whether the granule is an alumina-based filler or not, in order to be hardly condensed and substantially uniformly dispersed in the elastic member 3, the surface of the granule is preferably coated with an organic substance. The organic substance coated with the granules may also be a low molecular organic compound, but in view of dispersibility at the time of mixing, it is preferably an organic resin. The organic resin may, for example, be polyethylene, polypropylene, polystyrene, polyester, fluororesin (such as polytetrafluoroethylene), polyimide, polyphenylene sulfide, polyamine, and polycarbonate. High heat resistance and durability are preferred. The granular material coated with the organic material may, for example, be alumina coated with polyethylene.

Whether or not the granules are alumina-based fillers, in order to be substantially uniformly dispersed in the elastic member 3, the maximum roughness Ry, the average interval Sm of the concavities and convexities, the center-line average roughness Ra, and the ten-point average roughness Rz are At least the maximum roughness Ry is adjusted to the above range, and the average particle diameter of the granular material is preferably 3 to 30 μm, more preferably 3 to 20 μm, and particularly preferably 5 to 10 μm. The method of measuring the average particle diameter is based on the secondary particle diameter d50 (laser method).

Whether or not the granules are alumina-based fillers, in order to be substantially uniformly dispersed in the elastic member 3, the maximum roughness Ry, the average interval Sm of the concavities and convexities, the center-line average roughness Ra, and the ten-point average roughness Rz are At least the maximum roughness Ry is adjusted to the above range, and it is preferable that the elastic member 3 contains the above-mentioned granular material in a ratio of 1 to 25 parts by mass, and 3 to 25 parts by mass, per 100 parts by mass of the rubber or resin forming the elastic member 3. Especially good. In addition, in order to make the elastic member 3 contain the above-mentioned granular material, the method of adding a granular material to the adhesive material which forms the elastic member 3, etc. are mentioned.

The hardness of the adhesive surface of the elastic member 3 (JIS K 6253 [durometer A]) is preferably 5 to 50, and particularly preferably 30 to 50. If the hardness of the adhesive surface is within the above range, the adhesive is pressed against the adhesive surface and adhered to the latter, especially the mountain portion of the adhesive surface is easily elastically deformed to make the adhesive surface flatter, and the adhesive is adhered. The contact surface is more closely adhered to the adhesive surface, and can prevent damage and breakage of the adherend. Further, the hardness of the elastic member 3 can be adjusted by the content of the granules or the like.

The elastic member 3 preferably has a thickness of about 0.05 to 5 mm. When the thickness is less than 0.05 mm, the mechanical strength of the elastic member 3 is lowered, and the durability is insufficient. On the other hand, if it exceeds 5 mm, the elastic member 3 is less likely to be elastically deformed, and it is difficult to remove the adherend from the elastic member 3.

The elastic member 3 can be fixed to the surface of the jig body 2 by the adhesive force of the elastic member 3 or by a fixing member or the like by the adhesive layer or the undercoat layer. In the holding jig 1, the elastic member 3 is interposed between the adhesive layers. Or the undercoat layer is fixed to the surface of the jig body 2.

The elastic member 3 may be formed of an adhesive material that can exhibit the above-described adhesive force or a cured material of the adhesive material. The adhesive material may, for example, be a fluorine-based resin or a fluorine-based rubber, a fluorine-based resin or a fluorine-based rubber fluorine-based composition, a polyoxynoxy resin or a polyoxyxene rubber, or a polyoxyxene-containing rubber or a polyoxyxene rubber. An oxygen composition, various elastomers such as an amine elastomer, a natural rubber, and a styrene-butadiene copolymer elastomer. Among the above-mentioned adhesive materials, a polyoxyxene rubber and/or an addition reaction-hardening adhesive polyfluorene-containing composition containing a polyoxyxylene rubber and a peroxide-curable adhesive polyfluorene-oxygen composition are preferable. The addition reaction hardening type adhesive polyfluorene composition may, for example, be an adhesive composition disclosed in Japanese Laid-Open Patent Publication No. 2008-091659, which comprises: polyoxynized raw rubber (a), crosslinked component (b), Adhesion enhancer (c), catalyst (d) and alumina fill material (e). The peroxide-curable adhesive polysiloxane composition may, for example, be an adhesive composition disclosed in Japanese Laid-Open Patent Publication No. 2008-091659, which comprises: polyoxynized raw rubber (a), and an adhesion promoter (c). , alumina earth filler (e) and organic peroxide (f). Adhesive materials harden under appropriate conditions. Further, in order to adjust the maximum roughness Ry to the above range by the surface roughening method of the present invention, the above-mentioned adhesive material contains a predetermined amount of granular material.

Since the adhesive jig 1 has the maximum roughness Ry in the above range, the holding jig 1 can have the opposite characteristics as described above, that is, the high adhesion force when the adherend is pressed and the detachability of the adherend, and The object of the invention can be achieved well. Further, the entire adhesive surface of the holding jig 1 has adhesiveness, and if necessary, it is easy to adhere and hold the adherend, and it is not necessary to accurately position the adhesive holding position of the adherend, and the productivity and the mountability are excellent.

The mounting jig of the present invention will now be described. The mounting jig includes the holding jig of the present invention, and a detaching member that is detached from the holding jig by the relative movement of the surface of the elastic member in the holding jig to cause the adhesive to be held. For example, when a plurality of adherends are temporarily adhered in order to manufacture, convey, store, or inspect a plurality of adherends, and then the adhered adherends are removed, the mounting jig of the present invention is suitably used. As described above, the holding jig in the mounting jig of the present invention may be a holding jig 1 or the like.

The detaching member in the mounting jig of the present invention may have a form that can be relatively moved relative to the holding jig along the surface of the elastic member in the holding jig so that the adhering member held by the holding jig is detached from the holding jig, for example, A detaching member including the collision portion is appropriately exemplified, and the collision portion can be pressed against the adhering member held by the holding jig. The detaching member may be, for example, a triangular columnar blade having a tip end as a collision portion, or a wire or the like as a collision portion. The detaching member in the mounting jig of the present invention is relatively moved in a state of being in contact with the surface of the elastic member in the holding jig or in a state in which it is not in contact with the surface, and is preferably moved in a state of not coming into contact with the surface.

The mounting jig 4, which is an example of the mounting jig of the present invention, includes the holding jig 1 and the detaching member 5. As shown above, the holding jig 1 is, for example, as shown in FIG. 2, and the detaching member 5 is a triangular column having a tilting arrangement and a tip end serving as a blade of the collision portion. In order to allow the plurality of adherends adhered to the elastic member 3 of the holding jig 1 to be detached from the elastic member 3 at a time, the length of the extending direction of the detaching member 5, that is, the height of the triangular prism is preferably larger than the length of the elastic member 3. . Further, since the distal end of the detaching member 5 serves as a collision portion that collides with the adherend, the tip end of the detaching member 5 can be formed or covered with an elastic material in order to prevent damage to the adherend or the like.

Hereinafter, an example of a mounting method when the adherend is attached using the mounting jig of the present invention will be described with reference to the mounting jig 4 (hereinafter sometimes referred to as a mounting method). The mounting method includes the step of disengaging the release member along the adhesive surface of the holding jig 1 holding the adherend to remove the adherend, and preferably including pressing the adherend into the holding jig 1 The adhesive surface of the elastic member 3 is adhered to the holding step of the adhesive surface. That is, the above-described one mounting method is a method of adhering and holding the adherend and removing the adherend which is adhered and held.

The adhesion step is a step of pressing the adherend against the adhesive surface of the elastic member 3 to adhere the adherend to the adhesive surface. In order to hold the adherend in the standing state in the holding jig 1 of the mounting jig 4, a plurality of adherends are arranged in a predetermined pattern on the elastic member 3 in a predetermined pattern, and these adherends are attached. The bottom surface is pressed against the adhesive surface of the elastic member 3 in the holding jig 1. Thus, the bottom surface of the adherend is crimped to the adhesive surface, and as described above, the mountain portion of the elastic member 3 is elastically deformed, the adhesive surface is flattened, and a plurality of adherends are adhered by the adhesive force of the adhesive surface. The adhesive is held by the elastic member 3. The method of adhering and holding the adherend in the above manner can be exemplified by the method disclosed in Japanese Laid-Open Patent Publication No. 2008-091659. Specifically, if a standing arrangement plate having a thickness smaller than the axial length of the adherend and having a plurality of arrangement holes through which the adherend can pass is placed on the elastic member 3, the adhesive is inserted into the state in this state. By providing a hole, and then pressing the free end of the adherend toward the elastic member 3, for example, with a flat plate member or the like, the adherend is adhered and held by the elastic member 3.

In the above-described one mounting method, in order to remove the adhering member held by the holding jig 1 by adhesion, the detaching member 5 is relatively moved along the adhesive surface of the holding jig 1, and the adherend is pressed sideways. Specifically, the detaching member 5 is disposed so as not to come into contact with the vicinity of the adhesive surface of the holding jig 1 . At this time, even if the detaching member 5 does not come into contact with the surface of the holding jig 1, the holding jig of the present invention can detach the adherend in a desired manner. The detachment member 5 thus configured is moved relatively forward along the adhesive surface, that is, toward the adherend side. In this manner, the front end of the release member 5 abuts against the side surface of the adherend, and the adherend is pressed in the direction, that is, the adhesive is tilted to restore the elastically deformed mountain portion, and the roughness of the adhesive surface becomes the maximum roughness in the above range. At the degree Ry, the contact surface of the adherend is peeled off from the adhesive surface of the elastic member 3. Thus, the adherend pressed by the detaching member 5 can be detached from the elastic member 3 of the holding jig 1. Thus, the mounting jig 4 can detach almost all of the adherends that have been adhered and held.

Further, the method disclosed in Patent Document 2 is a method of "the front end of the blade is recessed to make the adhesive layer relatively move in the direction of the surface of the adhesive layer in this state", and the method disclosed in Patent Document 3 is "making the scraping unit" Moving along the surface of the layer of adhesive material, and moving the scraping unit toward the end of the non-adhesive or low-adhesive portion reaching the moving direction, scraping the electronic component from the layer of adhesive material, but even making the small component scraping member elastic Sliding on the surface of the material sometimes causes the adherend to fall over and adhere to the surface of the adhesive layer again, and the small parts cannot be easily removed. Moreover, if the scraping member is slid on the surface of the elastic material, especially if the scraping member is strongly pressed against the surface of the elastic material and is slid in order to surely remove the adherend, or the scraping member is suddenly slammed on the surface of the elastic material. When sliding, the small part scraping member may cause scratches on the surface of the elastic material and damage the surface of the elastic material. On the other hand, the mounting jig of the present invention includes the holding jig of the present invention which is excellent in detachability, and therefore, the adherend does not adhere to the adhesive surface as long as it is not strongly pressed against the adhesive surface even if it is poured by the adhesive. And does not cause almost all of the adhered adherend to adhere to the adhesive surface, and the adherend can be easily detached from the elastic member 3, and the release member 5 does not need to be slid on the adhesive surface, and there is no need Press it. Therefore, the mounting jig of the present invention can highly prevent the damage of the detaching member to the elastic member, particularly the adhesive surface.

As described above, the holding jig of the present invention and the mounting jig of the present invention can adhere and hold a plurality of adherends in a desired manner, and it is easy to cause almost all of the adherends held by the holding jig to be detached. Therefore, the holding jig of the present invention and the mounting jig of the present invention can be suitably used, for example, in the manufacturing process of the adherend and the recovery of the dispersed adherend.

Hereinafter, a set of holding jigs according to the present invention will be described with reference to the drawings, comprising: a first holding jig having a first jig main body and a first elastic member provided on a surface thereof, and a second jig main body and a surface provided on the surface thereof In the second holding jig of the elastic member, at least one of the first and second holding jigs is the holding jig of the present invention, and the adhesive force of the second elastic member is larger than the adhesive force of the first elastic member. In the set of holding jigs of the present invention, it is preferable that the second holding jig in the first and second holding jigs is the holding jig of the present invention, and it is particularly preferable that the first and second holding jigs are the holding jigs of the present invention. . In the set of holding jigs of the present invention, the first and second holding jigs may be configured in substantially the same manner except for the adhesive force. For example, after the predetermined treatment is performed on the both ends of the plurality of adherends to form the adherend, and the adherend held by the retaining jig is transferred to the other, when the transferred adherend is removed, A set of holding fixtures suitable for use with the present invention.

As shown in FIG. 3, a set of holding jigs 6 which is an example of a group of holding jigs of the present invention includes a first holding jig 1A, and has a first jig main body 2A and a first jig body 2A which is adhered to the surface thereof and can adhere to the adherend. The elastic member 3A and the second holding jig 1B have a second jig main body 2B and a second elastic member 3B which is provided on the surface thereof and can adhere and hold the adherend. The 1/2th holding jig 1A/1B is basically constructed in the same manner as the holding jig 1.

In the first holding jig 1A and the second holding jig 1B, the first elastic member 3A and the second elastic member 3B preferably have an adhesive force capable of adhering and holding the adherend, and it is usually preferably 1 to 60 g/mm ² . Adhesion (based on the above-mentioned "Shin-Etsu Polymer Method"), and preferably has an adhesion of 7 to 60 g/mm ² .

Further, the adhesion force of the second elastic member 3B in the second holding jig 1B is larger than the adhesion force of the first elastic member 3A. Since the adhesive force of the first elastic member 3A and the second elastic member 3B has the above-described relationship, the adherend can be transferred from the first elastic member 3A of the first holding jig 1A to the second elastic member 3B of the second holding jig 1B. . In order to smoothly transfer the adherend from the first elastic member 3A to the second elastic member 3B without causing the adherend to fall off, the adhesion between the first elastic member 3A and the second elastic member 3B (based on the above-mentioned "Shin-Etsu Polymer" The difference between the methods is preferably 15 to 43 g/mm ² , more preferably 18 to 35 g/mm ² , and particularly preferably 20 to 30 g/mm ² . The adhesion of each of the first elastic members 3A and 3B can be adjusted by the content of the adhesion enhancer and the content of the granules.

In the group of the holding jigs 6, the first holding jig 1A and the second holding jig 1B are each a holding jig 1 , in other words, the first elastic member 3A and the second holding jig 1B in the first holding jig 1A. 2 The elastic members 3B each have the maximum roughness Ry of the above range. When the first and second holding jigs 1A and 1B are both the holding jigs 1, it is possible to adhere and hold a plurality of adherends in a desired manner, and it is possible to maintain almost all of the adherends that are adhered and held by the adhering state. The first elastic member 3A of the first holding jig 1A is transferred to the second elastic member 3B of the second holding jig 1B.

The adherend holding device of the present invention, which includes a set of holding jigs of the present invention, is explained below. An example of the adherend holding device of the present invention will be described below with reference to the drawings. As shown in FIG. 4, the adherend holding device 10 includes a pair of holding jigs including the first and second holding jigs 1A and 1B, which can adhere and hold the adherend, and can transfer the adherend from the first holding jig 1A. To the second holding jig 1B. The set of holding jigs possessed by the adherend holding device 10 is constructed in the same manner as a set of holding jigs 6.

As shown in FIG. 4, the first and second holding jigs 1A and 1B of the adherend holding device 10 can be disposed such that the first elastic member 3A and the second elastic member 3B face each other. By this, for example, the adherend held by the first holding jig 1A can be maintained in an upright state and transferred to the second holding jig 1B. The arrangement of the first elastic member 3A and the second elastic member 3B can be realized by a shift unit including a mechanical structure, or can be realized manually.

As shown in FIG. 4, in the first holding jig 1A, the surface side of the jig main body 2A on which the first elastic member 3A is not formed is fixed to the front end of the support arm 13 which is provided to extend downward from the holding jig shift unit 12. The member 14 is supported and supported to hold the jig shift unit 12.

The holding jig shifting unit 12 is attached to the rail 11 and is configured to be movable in the horizontal direction along the rail 11 and to move the support arm 13 in the up and down direction. Therefore, the first holding jig 1A supported by the holding jig shifting unit 12 can be freely moved in the horizontal direction and the vertical direction by the holding jig shifting unit 12. In other words, the first holding jig 1A including the first elastic member 3A that hangs the adherend can be transferred, for example, to the upper side of the conductive paste bath, or can be transferred from the position to the upper side of the conductive paste bath. The appropriate position, for example, the position above the second holding jig 1B, and can be lowered toward the second holding jig 1B, and the adherend is held by the second elastic member 3B of the second holding jig 1B, and the first holding jig is placed. 1A rises from the second holding jig 1B.

Further, the holding jig shifting unit 12 is configured to be rotatable about the rail 11 as a central axis. When the holding jig shifting unit 12 can be rotated in this manner, the state of the first holding jig 1A can be changed to maintain the state of being adhered by the first elastic member 3A, and the first elastic member can be borrowed by the first elastic member 3A. 3A stands up to maintain the state of being stuck.

In addition, as shown in FIG. 4, the second holding jig 1B is fixed to the surface side of the second jig body 2B where the second elastic member 3B is not formed, and is supported by the self-retaining jig shifting unit 16 so as to extend upward. The support member 18 at the front end of the arm 17 is supported by the holding jig shift unit 16.

The above-described holding jig shifting unit 16 is attached to the rail 15 substantially orthogonal to the rail 11, and is basically formed in the same manner as the holding jig shifting unit 12. Therefore, the second holding jig 1B supported by the holding jig shifting unit 16 can be freely moved in the horizontal direction and the vertical direction by the former, and can be rotated around the rail 15 as a central axis.

The moving mechanism in the holding jig shifting units 12 and 16 is not particularly limited, and may be exemplified by a driving unit that generates a driving force such as a motor, and a transmission of the output of the above motor to the rail 11 or 15 and the support arm 13 or 17. Transmission units such as gears, wires, and the like. The above motion mechanism can be controlled by a usual personal computer or the like, or can be manually controlled.

In the adherend holding device 10, the first and second holding jigs 1A and 1B can be disposed so that the first elastic member 3A and the second elastic member 3B face each other in the vicinity of the position where the rails 11 and 15 intersect. The adherend held by the first holding jig 1A is transferred to the second holding jig 1B.

Next, a method of forming an electrode by using the above-described adherend holding device 10 as a chip capacitor body which is one of members for a small electronic component, thereby manufacturing a small-sized electronic component, that is, a wafer capacitor, and the action of the adherend holding device 10 will be described. As shown in FIG. 5, the wafer capacitor body 7 is formed as a quadrangular prism. For example, as shown in FIG. 9, the wafer capacitor 9 is formed by forming electrodes 8 at both ends of the wafer capacitor body 7.

In order to form the electrode 8 on the wafer capacitor body 7 using the adherend holding device 10, the wafer capacitor body 7 is first adhered and held to the first elastic member 3A. Specifically, the holding jig shifting unit 12 is rotated around the rail 11 as a central axis, and the first holding jig 1A is placed such that the first elastic member 3A is placed upward. For example, the standing arrangement plate is used as described above. The wafer capacitor body 7 is pressed against the first elastic member 3A. In this manner, the first elastic member 3A is elastically deformed and flattened by the wafer capacitor body 7, and the wafer capacitor body 7 is adhered and held by the first elastic member 3A.

After the wafer capacitor body 7 is adhered as such, as shown in FIG. 5, when the holding jig shifting unit 12 is rotated about the rail 11 as a central axis, a plurality of wafer capacitor bodies 7 are suspended and held in the first elastic state. The state of the member 3A. Next, the holding jig shifting unit 12 (not shown) is moved in the horizontal direction along the rail 11 (not shown), and the plurality of wafer capacitor bodies 7 that are suspended and held are horizontally moved to the conductive paste bath (not shown). Above, the support arm 13 is moved downward, and the lower end portion of the wafer capacitor body 7 is immersed in the conductive paste bath. Soon after, the support arm 13 is moved upward to dry the conductive paste applied to the wafer capacitor body 7. As described above, as shown in FIG. 6, the electrode 8 having a substantially uniform size is formed at the lower end portion of each of the wafer capacitor bodies 7 that are suspended and held by the first elastic member 3A. At this time, the adherend is adhered and held to the first elastic member 3A in a desired manner, and therefore, the adherend does not fall off from the first elastic member 3A when immersed in the conductive paste and pulled from the conductive paste. It will not tilt.

Next, the holding jig shifting unit 12 is moved in the horizontal direction along the rail 11 to horizontally move the first holding jig 1A above the second holding jig 1B, and as shown in FIG. 7, the support arm 13 is moved downward, so that The first holding jig 1A is lowered toward the second holding jig 1B. The first holding jig 1A is further lowered, and the lower end portion of the wafer capacitor main body 7 that is adhered and held by the first holding jig 1A is pressed against the second elastic member 3B of the second holding jig 2A. In this way, the second elastic member 3B is elastically deformed and flattened by the wafer capacitor body 7, and exerts a larger adhesive force than the first elastic member 3A. Therefore, the wafer capacitor body 7 adhered to the first elastic member 3A is adhered. Adhered to the second elastic member 3B due to a large adhesive force. Then, after the support arm 13 is moved upward and the first holding jig 1A is raised, the second elastic member 3B exhibits a desired adhesive force larger than the adhesive force of the first elastic member 3A. Therefore, the wafer capacitor body 7 is provided. The second elastic member 3B is firmly adhered to the electrode 8 and the wafer capacitor body 7 is separated from the first elastic member 3A in the first holding jig 1A with almost no residue. In this manner, the plurality of wafer capacitor bodies 7 can be transferred from the first holding jig 1A to the second holding jig 1B in a desired manner without falling off or tilting.

Then, the holding jig shifting unit 16 (not shown) is rotated around the rail 15 (not shown) as a central axis, and the wafer capacitor main body 7 is suspended and held by the second holding jig 1B. Then, a conductive paste is applied to the lower end portion of the wafer capacitor body 7 that is suspended and held in the same manner as described above, and the conductive paste is dried to form the electrode 8.

In this manner, as shown in FIG. 8, the wafer capacitor 9 in which the electrodes 8 of substantially equal size are formed at both end portions of the wafer capacitor body 7 are adhered and held by the second elastic member 3B of the second holding jig 1B in a suspended state. Then, for example, the wafer capacitor 9 adhered to the second holding jig 1B is pressed laterally by the detaching member 5 that moves relative to the adhesive surface of the second holding jig 1B, whereby the second elastic member 3B that is elastically deformed In the recovery, the wafer capacitor 9 is easily separated from the second elastic member 3B and dropped.

Thus, by using the set of holding jigs 6 and the adherend retaining device of the present invention, a plurality of adherends can be adhered to a holding jig in an upright state in a desired manner, and when the adherend is held from one to the other, When the jig is transferred to another one, it can effectively prevent the adherend from remaining on a holding jig and dumping, and can maintain the standing state to transfer a plurality of adherends from one holding jig to the other. In other words, when a set of the holding jig and the adherend holding device of the present invention are used, the adherend can be produced with good productivity.

The holding jig, the mounting jig, the set of holding jigs, and the adherend holding device of the present invention are not limited to the above examples, and various modifications can be made within the scope in which the object of the present invention can be achieved. For example, the entire surface of the elastic member 3 in the holding jig 1 is an adhesive surface, but in the present invention, at least a part of the surface of the elastic member itself may be an adhesive surface.

In the holding jig 1 described above, the jig body 2 and the elastic member 3 are each formed in a rectangular shape, but the jig body and the elastic member may be in a shape suitable for manufacturing a small component, and may be shaped according to the shape of the adherend and the adhering device. The manufacturing process, workability, and the like are set to an arbitrary shape. For example, the holding jig may be a plate-shaped body such as a square, a rectangle, a pentagon, or a hexagon, such as a polygon, a circle, an ellipse, an indefinite shape, or a shape in which the above shapes are combined. Further, one surface side of the jig main body 2 on which the elastic member 3 is not formed may have a planar shape, or may have a three-dimensional shape such as a semi-cylindrical body.

The holding jig 1 includes the jig body 2 in the form of a square disk-shaped body. However, in the present invention, the holding jig may form a supporting member in a part of the elastic member. The support member may also be formed of a flexible material together with the elastic member.

The holding jig 1 is formed into a square disk-shaped body. However, in the present invention, the holding jig can be appropriately formed into an endless belt shape, a thick plate-like body, a sheet-like body, an elongated body, or the like depending on the application. For example, the holding jig forming the endless belt shape is formed substantially in the same manner as the holding jig 1 except that the endless belt shape is integrally formed. Therefore, the above-described holding jig includes a support member that forms an endless belt shape, and an elastic member that is laminated on the surface of the support member in an endless belt shape.

The mounting jig 4 includes a holding jig and a detaching member. However, in the present invention, the mounting jig may include components or components other than the holding jig and the detaching member, such as a detaching member for detaching the object, a driving unit for the detaching member, or The erecting arranging plate disclosed in Japanese Laid-Open Patent Publication No. 2008-091659, for example, the erecting arranging plate, and a pressing plate that inserts an adherend inserted into a arranging hole of the erecting arranging plate toward the first holding jig Press.

The set of holding jigs 6 includes the first and second holding jigs 1A and 1B. However, in the present invention, the set of holding jigs may include other members or components, such as the third holding jig and the above, in addition to the first and second holding jigs. Disengagement pieces, etc.

The adherend holding device 10 includes the first holding jig 1A and the second holding jig 1B. However, in the present invention, the adherend holding device may include other members in addition to the first holding jig and the second holding jig. Or an element such as a third holding jig and the above-described detaching member.

Further, in the above-described group of holding jigs 6 and the adherend holding device 10, the first elastic member 3A and the second elastic member 3B may be formed of the same adhesive material or may be formed of different adhesive materials.

Further, the adherend holding device 10 is provided with the rails 11 and the rails 15 so as to intersect at substantially right angles. However, in the present invention, the rails and the rails may be disposed substantially in parallel.

Further, in the adherend holding device 10, the holding jig shifting units 12 and 16 are configured to be rotatable around the rails 11 and 15 as a central axis, but the holding jig shifting unit may be configured not to be rotatable. In this case, the first holding jig that adheres and holds the wafer capacitor body to the first elastic member is supported by the holding jig shifting unit, and the second holding jig that adheres and holds the wafer capacitor to the second elastic member is moved from the holding jig. The bit unit is removed, and the wafer capacitor is removed from the second elastic member.

[Example] (Example 1)

A square disk having a side length of 120 mm was cut out from a stainless steel plate (manufactured by SUS304, thickness: 0.5 mm), and one surface of the polymer was degreased with acetone, and an appropriate amount of a primer for the adhesion of the polyoxyethylene rubber was used. "X-33-156-20", manufactured by Shin-Etsu Chemical Co., Ltd.) is applied to an elastic member forming region (a square having a side length of 110 mm, the center is coincident with the center of the disk), and dried at 23 ° C to form a primer layer. (thickness 3 μm). The jig body 2 is fabricated in the above manner.

An addition reaction-curing adhesive polyfluorene composition having the following composition is prepared as an adhesive material for forming the elastic member 3.

●Polyoxime rubber composition containing polyoxynized raw rubber (a), cross-linking component (b), adhesion promoter (c) and catalyst (d) (trade name "X-34-632A/B" , manufactured by Shin-Etsu Chemical Co., Ltd.) 90 parts by mass

- 10 parts by mass of alumina having an average particle diameter of 10 μm coated with polyethylene (the converted content when the polyfluorene raw rubber (a) is 100 parts by mass (labeled as converted in Table 1) is 13 masses. Share)

The prepared jig body 2 is housed in a mold, and the prepared addition reaction hardening type adhesive polyfluorene oxygen composition is injected into a cavity formed on the elastic member forming region of the mold (having a length of 110 mm and a thickness of 0.8 mm) The rectangular parallelepiped was subjected to transfer molding at 120 ° C and 10 MPa, and further hardened at 200 ° C for 4 hours to form the elastic member 3 on the surface of the jig body 2, thereby manufacturing the holding jig 1 .

(Example 2)

The holding jig 1 was produced in the same manner as in Example 1 except that the average particle diameter of the alumina was changed to 6 μm.

(Examples 3~5)

The content of the above-mentioned alumina is changed to 3 parts by mass (the converted content when the polyfluorene raw rubber (a) is 100 parts by mass is 4 parts by mass), and 7 parts by mass (the conversion when (a) is 100 parts by mass) The holding jig 1 was basically produced in the same manner as in Example 1 except that the content was 9 parts by mass and 14 parts by mass (the amount of the converted content in the case of (a) was 100 parts by mass).

(Comparative Examples 1 and 2)

In the same manner as in Example 1, except that the content of the above-mentioned alumina was changed to 0 parts by mass and 21 parts by mass (the converted content when the polyfluorene raw rubber (a) was 100 parts by mass) was 27 parts by mass. Manufacturing a holding fixture.

(measurement of adhesive surface)

Based on the above measurement methods, the maximum roughness Ry of the adhesive surface, the average interval Sm of the unevenness, the adhesion, and the hardness of the adhesive surface in each of the holding examples and the respective comparative examples were measured, and the results are shown in Table 1.

(adhesion assessment)

Similarly, about 25,000 rectangular parallelepiped adherends (0.3 mm in length × 0.3 mm in width × 0.6 mm in height) were arranged, and the adhesive surfaces of the elastic members in the holding jigs manufactured by the respective examples and comparative examples were pressed to the respective adherends. The top surface (0.3 mm in length × 0.3 mm in width) was evaluated for the adhesion state of the adherend. As a result, the holding jigs of Examples 1 to 5 were adhered to hold most of the adherends, and in particular, the adhesives of Examples 3 and 4 retained almost all of the adherends. On the contrary, the holding jigs of Comparative Examples 1 and 2 could not adhere to hold most of the adherend.

(disengagement assessment)

Basically, in the same manner as the above-described adhesion evaluation, about 25,000 rectangular parallelepiped adherends (0.3 mm in length × 0.3 mm in width × 0.6 mm in height) were adhered to the elastic members of the holding jigs manufactured by the respective examples and comparative examples. . Further, the elastic members of the holding jigs of Comparative Examples 1 and 2 were firmly pressed against the adherend, and the adherend was forcibly adhered to the elastic member. After the adherend is adhered in the standing state, the polyacetal blade is moved along the adhesive surface so as not to contact the adhesive surface of the elastic member to scrape the adherend. As a result, the holding jigs of Examples 1 to 5 can cause the adhesive member to be detached from the elastic member 3 without damaging the elastic member 3, and exhibit high detachment. On the other hand, in the holding jigs of Comparative Examples 1 and 2, in particular, in Comparative Example 1, if the polyacetal blade was not moved in contact with the adhesive surface or pressed against the adhesive surface, adhesion could not be maintained. The adhesive is detached from the adhesive surface, and the detached adhesive sometimes adheres to the adhesive surface again, and the detachment is insufficient.

(transferability evaluation)

The adhesive test was carried out using the holding jig manufactured in Example 3 and the manufacturer of Example 5 (the difference in adhesive force of the elastic member was 22 g/mm ² ). Specifically, basically, in the same manner as the above-described adhesion evaluation, about 25,000 rectangular parallelepiped adherends (0.3 mm in length × 0.3 mm in width × 0.6 mm in height) were adhered and held in the elastic state of the holding jig manufactured in Example 5. member. Next, the elastic member of the holding jig manufactured in Example 3 was placed over the holding jig of Example 5, and gently lowered. The elastic member of the holding jig of Example 3 was brought into contact with the upper end portions of a plurality of rectangular parallelepiped adherents provided on the surface of the elastic member of the holding jig of Example 5. 3 seconds after the contact, the holding jig of Example 3 was lifted upward at a speed of 180 mm/min, and the holding jig of Example 3 was pulled away from the holding jig of Example 5. When the state of the cuboid-shaped adherend in the holding jig of the example 3 which was pulled away was observed, the number of the cuboid-shaped adherends remaining in the holding jig of Example 5 was less than 0.5% with respect to the whole, showing High transferability.

[Industry Utilization]

For example, when manufacturing, transporting, storing, or inspecting an adherend such as a small component, the holding jig, the mounting jig, the set of holding jigs, and the adherend holding device of the present invention are suitably used.

1‧‧‧Keeping fixture

1A‧‧‧1st holding fixture

1B‧‧‧2nd holding fixture

2‧‧‧Clamp body

2A‧‧‧1st fixture body

2B‧‧‧2nd fixture body

3‧‧‧Flexible components

3A‧‧‧1st elastic member

3B‧‧‧2nd elastic member

4‧‧‧Installation fixture

5‧‧‧Disengagement

6‧‧‧A set of holding fixtures

7‧‧‧ Chip Capacitor Body

8‧‧‧Electrode

9‧‧‧Wafer capacitor

10‧‧‧Adhesive holding device

11, 15‧‧ ‧ rails

12,16‧‧‧Keeping fixture shifting unit

13, 17‧‧‧ Support arm

14, 18‧‧‧ Supporting components

Fig. 1 is a schematic perspective view showing an example of a holding jig of the present invention.

Fig. 2 is a front elevational view showing an example of a mounting jig of the present invention.

3 is a schematic view of an example of a set of holding jigs of the present invention.

Fig. 4 is a schematic explanatory view showing an example of the adherend holding device of the present invention.

FIG. 5 is a schematic explanatory view showing a state in which the wafer holder main body is suspended by the first holding jig in an example of the adherend holding device of the present invention.

FIG. 6 is a schematic explanatory view showing a state in which the wafer capacitor body in which the electrode is formed is suspended and held by the first holding jig in an example of the adherend holding device of the present invention.

FIG. 7 is a schematic explanatory view showing a state in which the wafer capacitor main body that is suspended and held by the first holding jig is pressed against the second holding jig in an example of the adherend holding device of the present invention.

FIG. 8 is a schematic explanatory view showing a state in which the wafer capacitor is suspended and held by the second holding jig in the example of the adherend holding device of the present invention, and the wafer capacitor is formed by coating the electrodes on both end portions.

1. . . Holding fixture

2. . . Fixture body

3. . . Elastic member

Claims (5)

A holding jig comprising: a jig body; and an elastic member disposed on a surface of the jig body, and having a maximum roughness Ry (JIS B 0601-1994) of 1.0 to 6.0 μm, and an average interval Sm of the unevenness of the elastic member (JIS B 0601-1994) is 5.0 to 15.0 μm. A mounting jig comprising: the holding jig according to claim 1; and a disengagement member that relatively moves along a surface of the elastic member in the holding jig to disengage the adhered retained adhesive from the elasticity The surface of the component. a set of holding jigs including: a first holding jig including a first jig main body and a first elastic member provided on a surface of the first jig main body; and a second holding jig including a second jig main body and being disposed on the second a second elastic member on the surface of the jig body, wherein at least one of the first holding jig and the second holding jig is the holding jig according to the first aspect of the patent application, and the second elastic member is adhered The force is greater than the adhesion of the first elastic member. A group holding jig according to item 3 of the patent application scope, wherein the second holding jig is the holding jig described in claim 1 of the patent application. An adherent holding device comprising a set of holding jigs as described in claim 3 or 4.