JP6135150B2 - Removal method of electronic parts - Google Patents

Description

  The present invention relates to a method for detaching an electronic component from a holder that holds the electronic component.

  In order to inspect defects (for example, scratches, cracks, cracks) of electronic components after manufacturing, a step of holding a plurality of electronic components on a holder via an adhesive layer, and the inside or outside of each electronic component in that state In some cases, a step of performing a flaw detection inspection and a step of detaching the electronic component after the inspection from the holder may be performed. As a method of detaching an electronic component after inspection from a holder, for example, techniques described in Patent Documents 1 to 4 are known.

  In Patent Documents 1 and 2, a scraping blade having a sharp tip is used to move the scraping blade so that the tip is inserted between the electronic component and the adhesive layer to scrape the electronic component from the adhesive layer. Thus, a method for detaching an electronic component from an adhesive layer is disclosed. Patent Documents 3 and 4 disclose a method of detaching an electronic component from an adhesive layer by extruding the side surface of the electronic component with a detaching tool. In these methods, since the electronic component is detached from the adhesive layer in a state of being located below the holder, the electronic component detached from the adhesive layer falls downward.

JP 2003-077772 A JP 2004-193366 A JP 2009-054675 A JP 2011-142273 A

  However, in the methods described in Patent Documents 1 to 4, when the electronic component is pushed by the scraping blade or the detaching tool, not only the direction in which the electronic component is separated from the holder but also the scraping blade or the detaching tool. A force was also applied to the electronic components in the traveling direction. Therefore, the electronic component detached from the adhesive layer drops downward while moving in the lateral direction. Therefore, there is a possibility that the electronic components collide with each other during the fall, and the electronic components are damaged.

  Therefore, an object of the present invention is to provide an electronic component removing method that can prevent the electronic component from being damaged when the electronic component is detached from the holder.

  An electronic component detachment method according to one aspect of the present invention includes a holding step of placing an electronic component on an adhesive layer of the holder and holding the electronic component on the holder, and the adhesive layer facing the receiver. The installation step of installing the holder and the receiver so that the receiver is positioned below the holder, and the thread-like member that is flexible and in a state where tension is applied, relative to the holder A detachment step of allowing the threaded member to pass between the electronic component and the adhesive layer by displacing and detaching the electronic component from the holder to the receiver.

  In the method for detaching an electronic component according to one aspect of the present invention, a thread-like member is passed between the electronic component and the adhesive layer, so that the electronic component is detached from the holder. Therefore, compared with the conventional method using the scraping blade or the detaching tool, the force applied to the electronic component in the moving direction of the holder or the thread-like member is extremely small. Therefore, the electronic components are transferred to the receiving device while the arrangement of the electronic components held by the holding device is substantially maintained. As a result, the electronic components are unlikely to collide with each other during the fall, so that the electronic components can be prevented from being damaged when the electronic components are detached from the holder. Further, the thread-like member has a very small surface area compared to the scraping blade or the detaching tool. Therefore, it can prevent that a thread-like member adheres to an adhesion layer and a movement is prevented.

  The electronic component includes a first surface facing the holder, a second surface adjacent to the first surface and intersecting the first surface, and a curved ridge connecting the first and second surfaces The diameter of the thread-like member may be 1/2 to 1 times the radius of curvature of the ridge. In this case, the thread-like member can surely enter between the electronic component and the adhesive layer.

  The hardness of the thread member may be lower than the hardness of the electronic component. In this case, even if the thread-like member comes into contact with the electronic component, the electronic component is hardly damaged.

  The thread member may be made of resin.

  In the detaching step, the linear distance between the holder and the holder may be not more than twice the height of the electronic component in the direction in which the holder and the holder face each other. In this case, the distance until the electronic component that has been detached from the holder and dropped reaches the receiver is extremely small. For this reason, the electronic component can be transferred from the holder to the holder without changing the posture of the electronic component, and the impact applied to the electronic component when the electronic component reaches the holder can be extremely reduced.

  In the holding step, the plurality of electronic components are arranged in the adhesive layer so that the plurality of electronic components are arranged in a line, and in the detaching step, the thread-like member extends so as to be inclined with respect to the direction in which the plurality of electronic components are arranged. In the state, the thread-like member may be moved relative to the holder. When the thread-like member is parallel to the direction in which the plurality of electronic components are arranged, the thread-like member acts on the plurality of electronic components at the same time, so that the force acting on the electronic component from the thread-like member can be dispersed. However, when the thread-like members are inclined with respect to the direction in which the plurality of electronic components are arranged, the thread-like members individually act on the electronic components in the row. Therefore, the force from the thread-like member is more concentrated on the electronic component, so that a larger force can be applied from the thread-like member to the electronic component. Accordingly, the detachment of the electronic component from the holder can be promoted.

  According to the present invention, it is possible to prevent the electronic component from being damaged when the electronic component is detached from the holder.

FIG. 1 is a view showing one step of a method for detaching an electronic component, FIG. 1 (a) is a view of the holder viewed from above, and FIG. 1 (b) is a view of the holder from the side. FIG. 1 (c) is a view of the holder viewed from below. FIG. 2 is a partially enlarged view of FIG. FIG. 3 is a diagram illustrating a state subsequent to FIG. FIG. 4 is a diagram showing a state subsequent to FIG. FIG. 5 is a view showing a state subsequent to FIG. 4, FIG. 5 (a) is a view of the holder viewed from above, and FIG. 5 (b) is a view of the holder viewed from the side. FIG.5 (c) is the figure which looked at the holder from the downward direction. FIG. 6 is a view showing the subsequent process of FIG. 5, FIG. 6 (a) is a view of the holder viewed from above, and FIG. 6 (b) is a view of the holder viewed from the side. FIG.6 (c) is the figure which looked at the holder from the downward direction. FIG. 7 is a view showing one step of a method for detaching an electronic component according to another example, FIG. 7 (a) is a view of the holder viewed from below, and FIG. 7 (b) is a view of FIG. It is the elements on larger scale of 7 (a), Comprising: It is a figure which shows a mode that a filamentous member moves.

  An electronic component detaching method according to an embodiment of the present invention will be described with reference to the drawings. However, the following embodiment is an example for explaining the present invention, and the present invention is limited to the following contents. Not the purpose. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  First, the holder 10 having the adhesive layer 10a is prepared. The holder 10 is a flat plate having a rectangular shape. The holder 10 has a pair of main surfaces S1 and S2. The holder 10 is made of, for example, a metal plate (such as a stainless steel plate) or a resin plate.

  The pressure-sensitive adhesive layer 10a is disposed on the main surface S1 of the holder 10. The adhesive layer 10 a has an adhesive force that can hold the electronic component 1 described later on the holder 10. The adhesive layer 10a is made of, for example, silicone rubber.

  Subsequently, the plurality of electronic components 1 are arranged on the adhesive layer 10 a of the holder 10. As shown in detail in FIG. 2 and the like, the electronic component 1 used in the method according to this embodiment includes an element body 1a having a rectangular parallelepiped shape and a pair of external electrodes 1b provided at both ends of the element body 1a. . Therefore, the electronic component 1 exhibits a rectangular parallelepiped shape as a whole. As the size of the electronic component 1, for example, a so-called 0402 size (length in the longitudinal direction is about 0.4 mm, width and height is about 0.2 mm, for example), or 0603 size (length in the longitudinal direction is about 0.2 mm, respectively). For example, a width of about 0.6 mm and a width and height of about 0.3 mm may be employed.

  The electronic component 1 has a pair of main surfaces facing each other, a pair of side surfaces facing each other, and a pair of end surfaces facing each other. The pair of main surfaces are adjacent to the pair of side surfaces and the pair of end surfaces. The pair of side surfaces are adjacent to the pair of main surfaces and the pair of end surfaces. The pair of end surfaces are adjacent to the pair of main surfaces and the pair of side surfaces. These adjacent surfaces are connected to each other by a ridge portion having a curved surface shape. The curvature radius of the ridge is, for example, about 0.2 mm.

  The element body 1a is obtained, for example, by firing a ceramic material. The external electrode 1b is obtained, for example, by plating a metal material. For example, an internal electrode or an internal conductor is disposed in the element body 1a. By electrically connecting these internal electrodes and internal conductors to the external electrode 1b, the electronic component 1 functions as a capacitor, an inductor, or the like. However, even when the electronic component 1 is only the element body 1a, the method according to the present embodiment can be employed.

  In the present embodiment, the electronic component 1 has two directions: a short side direction of the holder 10 (X direction in FIG. 1C) and a long side direction of the holder 10 (Y direction in FIG. 1C). Are arranged on the holder 10 so as to be along each. In FIG. 1C, the number of electronic components 1 arranged in the X direction differs depending on the column, but the number of electronic components 1 arranged in the X direction may be the same in all the columns. In this case, the plurality of electronic components 1 are arranged in a lattice pattern. The plurality of electronic components 1 may not be arranged along the X direction or the Y direction on the holder 10 and may be scattered irregularly.

  In this embodiment, as shown in FIG. 1C, one of the pair of main surfaces of the electronic component 1 adheres to the adhesive layer 10a so that the opposing direction of the pair of external electrodes 1b is along the Y direction. ing. However, the opposing direction of the pair of external electrodes 1b may be along the X direction, and the opposing direction of the pair of external electrodes 1b may be oblique to the X direction or the Y direction. A side surface or an end surface (external electrode 1b) of the electronic component 1 may adhere to the adhesive layer 10a.

  Subsequently, the holder 10 is set in the flaw detection inspection apparatus in a state where the plurality of electronic components 1 are held by the holder 10. Next, a flaw detection inspection of each electronic component 1 is performed in the flaw detection inspection apparatus. Next, the holder 10 is taken out from the flaw detection inspection apparatus, and the flaw detection inspection is completed.

  Subsequently, as illustrated in FIG. 1B, the holding tool 10 is positioned on the receiving tool 12 so that the electronic component 1 is located below the holding tool 10. That is, the holder 12 is positioned below the holder 10 and the main surface S <b> 1 of the holder 10 faces the holder 12. The receptacle 12 is a flat plate having a rectangular shape. The receiving tool 12 is comprised by the resin board (PET board etc.), for example. Alternatively, the receiver 12 is preferably, for example, one having an antistatic treatment on the surface or one made of an antistatic material. The linear distance between the holder 10 and the receiver 12 is preferably not more than twice the height of the electronic component 1 in the facing direction of the holder 10 and the receiver 12.

  Subsequently, as shown in FIGS. 1 and 2, the thread-like member 14 is disposed below the adhesive layer 10 a of the holder 10 and near one short side of the holder 10. The thread-like member 14 is provided with a tension from both ends, and has a linear shape extending in the X direction. The thread-like member 14 has flexibility and can be deformed according to an external force applied when the electronic component 1 is detached from the holder 10, but also has a strength that does not cause breakage due to the external force. The diameter of the thread-like member 14 is preferably ½ to 1 times the radius of curvature of the ridge portion of the electronic component 1, and can be set to, for example, about 0.1 mm to 0.2 mm.

  The thread-like member 14 may be composed of a single fiber, or may be a single thread formed by twisting a plurality of fibers. Examples of the material of the thread member 14 include resin and carbon. If it has a predetermined tensile strength, natural fibers such as cotton can be used as the thread-like member 14. If the electronic component 1 is not damaged, a metal wire can be used as the thread member 14. Examples of the resin include nylon, polyester, polyethylene, poly (paraphenylene benzobisoxazole), and polyparaphenylene terephthalamide. In particular, poly (paraphenylene benzobisoxazole) and polyparaphenylene terephthalamide have a relatively large tensile strength, and thus are preferable as resins constituting the thread member 14. The hardness of the thread-like member 14 is preferably lower than the hardness of the electronic component 1 (element body 1a or external electrode 1b). In this case, even if the thread-like member 14 comes into contact with the electronic component 1, the electronic component 1 is hardly damaged such as a scratch. The hardness of the thread member 14 and the electronic component 1 can be evaluated by, for example, Vickers hardness.

  Subsequently, as shown in FIGS. 1 and 2, the thread-like member 14 is moved from one short side to the other short-side of the holder 10 while maintaining the state where the thread-like member 14 is attached to the adhesive layer 10a. And move. The thread-like member 14 may be moved relative to the holder 10. Therefore, the thread-like member 14 may move and the holder 10 may stop, the thread-like member 14 may stop and the holder 10 may move, or the thread-like member 14 and the holder 10 may move together. Also good. When the thread-like member 14 moves relative to the holder 10, the thread-like member 14 may be pushed toward the adhesive layer 10a side. In this case, the adhesive layer 10a is recessed toward the holder 10, and a gap is formed between the adhesive layer 10a and the electronic component 1, so that the thread-like member 14 can be easily inserted between the adhesive layer 10a and the electronic component 1. .

  Subsequently, as shown in FIG. 3, the thread-like member 14 is further moved to the other short side of the holder 10 while the thread-like member 14 is slid between the adhesive layer 10 a and the electronic component 1. As a result, the electronic component 1 is gradually separated from the adhesive layer 10 a from the short side portion of the holder 10 of the electronic component 1. When the thread-like member 14 moves over the entire width of the electronic component 1, the electronic component 1 is completely pulled away from the adhesive layer 10 a and detached from the holder 10 as shown in FIG. 4. The electronic component 1 detached from the holding tool 10 falls almost directly below and is transferred to the receiving tool 12.

  Subsequently, the thread-like member 14 is further moved to the other short side of the holder 10. As a result, as shown in FIG. 5, the plurality of electronic components 1 arranged in a line in the X direction are sequentially detached from the holder 10 for each line. When the thread-like member 14 reaches the other short side of the holder 10, all the electronic components 1 are detached from the holder 10 and transferred to the holder 12 as shown in FIG. 6. At this time, if the linear distance between the holder 10 and the receiver 12 is set to be not more than twice the height of the electronic component 1 in the facing direction of the holder 10 and the receiver 12, the attitude of the electronic component 1 The electronic component 1 can be transferred to the receiving device 12 without changing, and the impact applied to the electronic component 1 when the electronic component 1 reaches the receiving device 12 can be made extremely small.

  In the present embodiment as described above, the thread-like member 14 is passed between the electronic component 1 and the adhesive layer 10 a to detach the electronic component 1 from the holder 10. Therefore, compared to the conventional method using a scraping blade or a detaching tool, the force applied to the electronic component 1 in the moving direction of the holder 10 or the thread-like member 14 becomes extremely small. Therefore, the electronic component 1 is transferred to the receiving device 12 while the arrangement state of the electronic components 1 held by the holding device 10 is substantially maintained. As a result, it becomes difficult for the electronic components 1 to collide with each other during the fall, so that the electronic component 1 can be prevented from being damaged when the electronic component 1 is detached from the holder 10. Further, the thread-like member 14 has a very small surface area compared to the scraping blade or the detaching tool. Therefore, it can prevent that the thread-like member 14 adheres to the adhesion layer 10a, and a movement is prevented.

  As mentioned above, although embodiment of this invention was described in detail, this invention is not limited to above-described embodiment. For example, in this embodiment, when the thread-like member 14 moves relative to the holder 10, the thread-like member 14 has a linear shape extending in the X direction. That is, the arrangement direction of the electronic components 1 and the direction in which the thread-like member 14 extends are both parallel in the X direction. However, as shown in FIG. 7A, the thread-like member 14 is held in the holder 10 in a state in which the thread-like member 14 extends obliquely with respect to the arrangement direction (X direction or Y direction) of the electronic components 1. You may move relatively with respect to. When the thread-like member 14 is parallel to the arrangement direction (X direction or Y direction) of the electronic component 1, the thread-like member 14 acts on the plurality of electronic components 1 at the same time. The acting force can be dispersed. However, when the thread-like member 14 is inclined with respect to the arrangement direction (X direction or Y direction) of the electronic components 1, the thread-like member 14 is located with respect to the holder 10 as shown in FIG. When moving relatively, the thread members 14 individually act on the electronic components 1 in the row. Therefore, the force from the thread-like member 14 is more concentrated on the electronic component 1, so that a larger force can be applied to the electronic component 1 from the thread-like member 14. Accordingly, the detachment of the electronic component 1 from the holder 10 can be promoted.

  DESCRIPTION OF SYMBOLS 1 ... Electronic component, 10 ... Holder, 10a ... Adhesive layer, 12 ... Receiver, 14 ... Thread member.

Claims (5)

A holding step of placing an electronic component on the adhesive layer of the holder and holding the electronic component on the holder;
An installation step of installing the holder and the receiver so that the adhesive layer faces the receiver and the receiver is positioned below the holder;
By moving the thread-like member that is flexible and in a tensioned state relative to the holder, the thread-like member is passed between the electronic component and the adhesive layer, and electronic components possess a desorption step of desorbing into the receptacle from the holder,
The electronic component connects a first surface facing the holder, a second surface adjacent to the first surface and intersecting the first surface, and the first and second surfaces. And a curved ridge that
The diameter of the said thread-like member is the removal method of an electronic component which is 1/2 times-1 time of the curvature radius of the said ridge part . The method according to claim 1 , wherein the hardness of the thread-like member is lower than the hardness of the electronic component. The method according to claim 2 , wherein the thread-like member is made of a resin. Wherein in the desorption step, the linear distance between the receptacle and the retainer is 2 times or less of the electronic component height in the opposite direction between the receptacle and the holder, according to claim 1 to 3 The method according to any one of the above. In the holding step, the plurality of electronic components are arranged in the adhesive layer so that the plurality of electronic components are arranged in a line,
2. The detachment step moves the thread-like member relative to the holder in a state where the thread-like member extends obliquely with respect to a direction in which the plurality of electronic components are arranged. the method according to any one of 1-4.

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