WO2012053708A1 - Microphone pour montage en surface - Google Patents

Microphone pour montage en surface Download PDF

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Publication number
WO2012053708A1
WO2012053708A1 PCT/KR2011/002614 KR2011002614W WO2012053708A1 WO 2012053708 A1 WO2012053708 A1 WO 2012053708A1 KR 2011002614 W KR2011002614 W KR 2011002614W WO 2012053708 A1 WO2012053708 A1 WO 2012053708A1
Authority
WO
WIPO (PCT)
Prior art keywords
cover member
microphone
printed circuit
circuit board
substrate
Prior art date
Application number
PCT/KR2011/002614
Other languages
English (en)
Korean (ko)
Inventor
이상호
송재경
장홍규
Original Assignee
주식회사 비에스이
톈진 비에스이 일렉트로닉스 컴퍼니 리미티드
동관 바오싱 일렉트로닉스 컴퍼니 리미티드
롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 비에스이, 톈진 비에스이 일렉트로닉스 컴퍼니 리미티드, 동관 바오싱 일렉트로닉스 컴퍼니 리미티드, 롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드 filed Critical 주식회사 비에스이
Publication of WO2012053708A1 publication Critical patent/WO2012053708A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present invention relates to a surface mount microphone, and more particularly, to a surface mount microphone having improved durability against external shocks that may occur while being mounted and used in a user product by including a leg part in a cover member.
  • a microphone is a device that converts an external voice signal into an electrical signal, and is mainly used in a communication device such as a mobile phone, a smartphone, an MP3, a telephone, a medical device such as a hearing aid, or a miniaturized multifunctional smart sensor.
  • Microphones are classified into various types, such as electret condenser microphones, digital microphones, and MEMS silicon microphones, according to specific configuration differences.
  • This microphone regardless of its type, comprises a printed circuit board and a cover member coupled to the printed circuit board to form an internal space.
  • electronic components such as a capacitor, various semiconductor chips, MEMS DIE, ASIC (Application Specific Integrated Circuit), an amplifier, a filter, and the like, are required to convert sound into an electrical signal. do.
  • these electronic components are mounted on a printed circuit board.
  • a plurality of pads are provided on a lower side of a printed circuit board used in most microphones for electrical connection with a user product. Such pads are also called terminals. Each of the multiple pads is intended for grounding, power input, data output, and the like.
  • the conventional microphone by soldering the pad provided on the lower side of the printed circuit board of the microphone to the substrate of the user product, the electrical connection with the user product is made, of course, it is fixed to the user product.
  • the microphone is fixed to the user product only by the combination of pads, without a separate configuration for fixing to the user product, when an external shock is applied to the user product, the electrical connection between the pad and the user product is prevented. Problems such as breaking or instability occur.
  • a conventional surface mount microphone 100 is illustrated.
  • the conventional surface mount microphone 100 includes a cover member 102 and a printed circuit board 104.
  • the cover member 102 is provided with an acoustic hole 103, and the cover member 102 is bonded to the printed circuit board 104 by an adhesive 106 such as epoxy.
  • pads 108 are provided on the lower side of the printed circuit board 104. Each is for ground, power input and data output, the other is just for balanced coupling.
  • a conventional surface mount microphone 100 solders pads provided on a lower side of a printed circuit board 104 to a substrate 120 of a user product, such as a mobile phone, a smartphone, or a PDA.
  • a user product such as a mobile phone, a smartphone, or a PDA.
  • SMT surface mount technology
  • the pads 108 of the printed circuit board 104 and the substrate 120 of the user product are coupled to each other through coupling members 110 and 112 such as lead or the like.
  • An object of the present invention is to solve the above-mentioned problem, and by providing a cover part additionally, to provide a surface-mounted microphone with improved durability against external shock, such as shock or vibration.
  • the surface mount microphone of the present invention includes a printed circuit board having a plurality of pads for electrical connection on a lower side thereof; A cover member formed of a metallic material coupled to the printed circuit board to form a sealed inner space, and formed with an acoustic hole through which external sound may be introduced; Coupling means for coupling the printed circuit board and the cover member to each other; A surface mount microphone comprising: at least a portion of a lower end of the cover member is extended to be inserted into a coupling groove provided in a substrate of a user product when the surface mount microphone is mounted on a substrate of a user product. At least one leg is provided, which can be coupled to each other.
  • the cover member is made of a metal material
  • the lower side is a substantially hexahedron
  • the leg portion is formed on each of the pair of side surfaces facing each other of the cover member, the lower end portion of the side is formed to extend desirable.
  • leg portion it is preferable that the two are formed spaced apart from each other at the lower end of each side.
  • the lid member is made of metal, and is substantially a hexahedron whose bottom is opened, wherein the leg portion is formed by extending a portion of the lower end of each side of the lid member.
  • the plurality of pads provided on the lower side of the printed circuit board may include a first pad provided in an annular shape along an outer circumference, and second pads spaced apart from the first pad inside the first pad. It is preferable to comprise three pads.
  • the cover member and the leg portion preferably serves as a ground terminal.
  • the bonding means is preferably any one of epoxy, conductive epoxy, non-conductive epoxy, silver paste, silicone, urethane, acrylic, cream solder and UV (UV) curing bond.
  • the cover member is provided with a leg portion, it is easy to mount the surface mount microphone on the substrate of the user product, and the coupling force can be improved.
  • the cover member is provided with a leg portion, when the surface mount microphone is mounted on a substrate of a user product, it is possible to obtain an effect of improving durability of the electrical coupling of the pad even when an external shock such as dropping or vibration occurs.
  • the cover member is made of a metal material, when the cover member is used as a ground terminal by being bonded to a substrate of a user product, the ground area is increased, thereby improving the surface mount microphone acoustic characteristics.
  • FIG. 1 is a perspective view of a conventional surface mount microphone
  • FIG. 2 is a view showing a lower side of the surface mount microphone of FIG.
  • FIG. 3 is a schematic cross-sectional view of a state in which the surface mount microphone of FIG. 1 is mounted on a substrate of a user product;
  • FIG. 4 is a perspective view of a surface mount microphone of one embodiment according to the present invention.
  • FIG. 5 is a view from below of the surface mount microphone of FIG. 4;
  • FIG. 6 is a cross-sectional view of a portion of the surface mount microphone of FIG. 4;
  • FIG. 7 to 9 are views showing the surface-mounted microphone of Figure 4 mounted on the substrate of the user product.
  • the surface mount microphone 1 is a small surface mount microphone mainly used in precision devices such as communication devices such as mobile phones, smart phones, notebook computers, MP3 phones, and the like.
  • the surface-mounted microphone 1 is an example of a MEMS microphone including a MEMS chip in its inner space, but in addition, an electret condenser microphone and a digital microphone It can be a variety of microphones, including
  • the surface mount microphone 1 includes a printed circuit board 10, a cover member 20, a leg part 30, and a coupling means 40.
  • the printed circuit board 10 is a conventional printed circuit board, and a plurality of pads 12, 14, and 16 are provided on a lower side thereof for electrical connection with a user product.
  • an electric circuit is printed on the upper side of the printed circuit board 10 and electric components are mounted. Pads are also called terminals.
  • the plurality of pads are provided with a first pad 12, a second pad 14, and a third pad 16.
  • the first pad 12 is provided in a ring shape having a substantially rectangular shape along an outer circumference of the printed circuit board 10.
  • the first pad 16 serves as a ground (ground), but since the first pad 16 has a relatively large area, the acoustic characteristics of the microphone can be improved.
  • the second pad 14 and the third pad 16 serve as a power supply and a data output, respectively.
  • the second and third pads 14 and 16 are provided in the inner space of the first pad 12, but are spaced apart from each other to be electrically heated with the first pad 12.
  • the cover member 20 is coupled to the printed circuit board 10 to form a sealed inner space therein.
  • the internal space 14 is provided with an electrical and electronic component that serves to convert the sound into an electrical signal roll.
  • Such electrical and electronic components are provided with components including MEMS chips in the present embodiment, but various modifications are possible in other embodiments.
  • the cover member 20 is made of a metal material, and at one side thereof, an acoustic hole 22 is formed to allow external sounds such as voice to flow into the inner space.
  • the lid member 20 is in the shape of a substantially hexahedron with an open lower side.
  • the leg part 30 is configured to be inserted into a coupling hole pre-prepared in the substrate of the user product when the surface mount microphone 1 is mounted on the substrate of the user product.
  • the leg part 30 is formed integrally with the cover member 20, and therefore is made of metal.
  • the leg part 30 is provided in the side of a long side among two pairs of side surfaces which face the cover member 20 mutually. Two leg parts 20 are formed in each side surface. A part of the lower end of each side surface is extended.
  • the leg part 30 is formed by extending a portion of the side surface of the cover member 20 firstly in a horizontal direction and then again in a vertical downward direction.
  • the length extending in the downward direction of the leg portion 30 is formed to a length that can be sufficiently inserted and fixed in the coupling groove 204 (see Fig. 7) previously formed in the substrate of the user product.
  • the present embodiment four each of the two are provided on each of the pair of side portions that the legs 30 face each other, but the present invention is not limited thereto. That is, in another embodiment, the number and position of the provided with the leg portion 30 can be variously modified.
  • one leg may be formed on each of the four sides, one on each of the adjacent sides, or the entire lower end of the pair of facing sides may be formed to extend.
  • the legs 30 are coupled to and secured with the coupling grooves 204 of the user product substrate (see FIGS. 7 to 9) when the plurality of pads 12, 14, 16 are electrically coupled to the substrate of the user product. do.
  • the legs 30 also have pads of the user product.
  • SMT surface mounting technology
  • the coupling means 40 is configured to couple the printed circuit board 10 and the cover member 20 to each other.
  • the coupling means 40 may include an adhesive, such as an epoxy in a liquid state, and may be formed by injecting into a contact portion between the printed circuit board 10 and the cover member 20, which are assembled to each other, and then hardened.
  • the coupling means 40 may be any one of silver paste, silicon, urethane, acrylic, cream solder, UV (UV) curing bond, in addition to epoxy.
  • the surface mount microphone 1 of the present embodiment has leg portions 30 in which a part of the lower end portion of the lid member 20 is extended, the leg portion when the surface mount microphone is mounted on a substrate of a user product 30 may also be coupled to a coupling groove preformed in the substrate of the user product.
  • the bonding durability of the surface mount microphone 1 to the impact that may occur during use of the user product is significantly improved.
  • cover member 20 and the leg portion 30 are conductive metal materials, there is an advantage that the ground area of the surface mount microphone is improved, and thus the acoustic characteristics are improved.
  • the pads 12, 14, and 16 provided on the lower side of the printed circuit board 11 of the surface mount microphone 1 may be attached to the printed circuit patterns 202, 206, and 208 provided on the substrate 200 of the user product. Each is bonded by a soldering method using surface mount technology. At this time, the legs 30 are also inserted into the corresponding fastening holes 204, respectively, and are coupled by a soldering method or the like.
  • the pads 12, 14, and 16 provided on the lower side of the printed circuit board 10 include the first pad 12 for grounding provided along the outer circumference of the printed circuit board, and Since the second and third pads 14 and 16 are provided on the inner side of the first pad 12, when the surface mount microphone is mounted on the substrate of the user product, the legs 30 and the second, There is an advantage that the short circuit between the three pads 14 and 16 is unlikely to occur.
  • the surface mounted microphone 10 has a flat hexahedron shape except for the leg portion 30.
  • the present invention is not limited to this shape. That is, in the case of another embodiment, the surface-mounted microphone except for the leg portion may have various shapes as long as only the leg portion is formed at the lower end portion of the side surface. For example, it can be deformed into a cylinder, an elliptic cylinder, a polygonal cylinder, or the like.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

La présente invention se rapporte à un microphone pour montage en surface, le microphone comprenant : une carte de circuit imprimé comprenant une pluralité de plages de connexion pour une connexion électrique sur la surface inférieure de celle-ci ; un élément formant couvercle métallique, qui est raccordé à la carte de circuit imprimé et qui forme ainsi un espace intérieur fermé, l'élément formant couvercle comprenant, sur l'un de ses côtés, un trou sonore au travers duquel un son provenant de l'extérieur peut être introduit ; et des moyens de raccordement pour raccorder la carte de circuit imprimé à l'élément formant couvercle. D'autre part, l'élément formant couvercle comprend au moins une section formant patte qui s'étend depuis au moins une partie de la section d'extrémité inférieure de l'élément formant couvercle. De cette manière, quand le microphone pour montage en surface est monté sur un substrat d'un équipement d'utilisateur, la section formant patte peut être insérée dans une fente de couplage prévue dans le substrat d'un équipement d'utilisateur et peut être raccordée à celle-ci. Comme, selon la présente invention, la section formant patte s'étend depuis la section d'extrémité inférieure de l'élément formant couvercle, il est ainsi possible d'atteindre l'objectif visé d'améliorer la force de couplage et la résistance aux chocs, par exemple, etc.
PCT/KR2011/002614 2010-10-19 2011-04-13 Microphone pour montage en surface WO2012053708A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0101883 2010-10-19
KR1020100101883A KR101156052B1 (ko) 2010-10-19 2010-10-19 표면실장형 마이크로폰

Publications (1)

Publication Number Publication Date
WO2012053708A1 true WO2012053708A1 (fr) 2012-04-26

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ID=45830663

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/002614 WO2012053708A1 (fr) 2010-10-19 2011-04-13 Microphone pour montage en surface

Country Status (3)

Country Link
KR (1) KR101156052B1 (fr)
CN (2) CN102457789A (fr)
WO (1) WO2012053708A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990073516A (ko) * 1998-11-19 1999-10-05 장세열 무빙자석구조를갖는전기-음향변환기및전기-음향변환방법
KR100722686B1 (ko) * 2006-05-09 2007-05-30 주식회사 비에스이 부가적인 백 챔버를 갖고 기판에 음향홀이 형성된 실리콘콘덴서 마이크로폰
KR20090045545A (ko) * 2007-11-02 2009-05-08 주식회사 비에스이 피시비에 음공이 형성된 멤스 마이크로폰 패키지

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE602005004271T2 (de) * 2005-06-28 2008-12-24 Research In Motion Ltd., Waterloo Kommunikationsvorrichtung mit abgeschirmtem Mikrophon
CN201072476Y (zh) * 2007-06-21 2008-06-11 中兴通讯股份有限公司 一种带手写功能的液晶显示模组
KR101149894B1 (ko) * 2010-10-12 2012-05-31 주식회사 비에스이 마이크로폰 장치

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990073516A (ko) * 1998-11-19 1999-10-05 장세열 무빙자석구조를갖는전기-음향변환기및전기-음향변환방법
KR100722686B1 (ko) * 2006-05-09 2007-05-30 주식회사 비에스이 부가적인 백 챔버를 갖고 기판에 음향홀이 형성된 실리콘콘덴서 마이크로폰
KR20090045545A (ko) * 2007-11-02 2009-05-08 주식회사 비에스이 피시비에 음공이 형성된 멤스 마이크로폰 패키지

Also Published As

Publication number Publication date
KR20120040452A (ko) 2012-04-27
CN202172476U (zh) 2012-03-21
KR101156052B1 (ko) 2012-06-20
CN102457789A (zh) 2012-05-16

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