WO2012067317A1 - Microphone - Google Patents

Microphone Download PDF

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Publication number
WO2012067317A1
WO2012067317A1 PCT/KR2011/002616 KR2011002616W WO2012067317A1 WO 2012067317 A1 WO2012067317 A1 WO 2012067317A1 KR 2011002616 W KR2011002616 W KR 2011002616W WO 2012067317 A1 WO2012067317 A1 WO 2012067317A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
microphone
ground terminal
case
Prior art date
Application number
PCT/KR2011/002616
Other languages
English (en)
Korean (ko)
Inventor
박성호
이상호
심용현
Original Assignee
주식회사 비에스이
톈진 비에스이 일렉트로닉스 컴퍼니 리미티드
동관 바오싱 일렉트로닉스 컴퍼니 리미티드
롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 비에스이, 톈진 비에스이 일렉트로닉스 컴퍼니 리미티드, 동관 바오싱 일렉트로닉스 컴퍼니 리미티드, 롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드 filed Critical 주식회사 비에스이
Publication of WO2012067317A1 publication Critical patent/WO2012067317A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present invention relates to a microphone that is resistant to external impact and can improve durability.
  • microphones are devices that convert sound into electrical signals.
  • the microphone may be applied to various communication devices such as mobile communication devices such as mobile terminals, earphones or hearing aids.
  • mobile communication devices such as mobile terminals, earphones or hearing aids.
  • Such microphones should have good electronic / acoustic performance, reliability and operability.
  • the microphone includes a mechanical condenser microphone, a MEMS microphone, and the like.
  • the mechanical condenser microphone is manufactured by manufacturing a diaphragm, a back plate, a signal processing printed circuit board, and the like, and then stacking the components in the case, and bending the ends of the case in which the components are stacked. At this time, the components are squeezed by bending the case and are electrically connected stably.
  • the MEMS microphone is manufactured by forming a portion of an acoustic sensing element such as a diaphragm and a back plate using a semiconductor processing technology.
  • Such MEMS microphones can be miniaturized, high-performance, multifunctional, and integrated through ultra-precision micromachining, thereby improving stability and reliability.
  • a ground terminal and a connection terminal are formed on the bottom surface of the microphone so as to be attached to the main printed circuit board of each product.
  • the microphone provides a signal to the main printed circuit board via a connection terminal.
  • the ground terminal and the connection terminal of the conventional microphone are formed in the shape of a dot (dot) having a small diameter, the tensile force is weak at the junction of the microphone and the main printed circuit board. Furthermore, since the tensile force is weak at the joint, when the product is applied to a portable product, the product falls to the floor and frequently causes a failure.
  • An object of the present invention for solving the above problems is to provide a microphone that can improve the tensile force in the joint portion.
  • Another object of the present invention is to provide a microphone which can reduce the possibility of failure in using the product.
  • One aspect of the present invention for achieving the above object is a printed circuit board mounted with a MEMS chip and a special purpose semiconductor chip; A case installed to cover the MEMS chip and the special purpose semiconductor chip; A ground terminal formed on the other side of the printed circuit board along a circumference of the printed circuit board; And a connection terminal formed on the other surface of the printed circuit board to be electrically spaced from the ground terminal.
  • the ground terminal may be formed in a polygonal, circular or elliptical frame shape.
  • the ground terminal may be formed in a continuous form or an intermittent form.
  • the ground terminals may be formed to face each other symmetrically.
  • the ground terminal may further include an extension part extending to a central side of the other surface of the printed circuit board and having a circular shape or a polygonal shape.
  • a sound hole is formed inside the extension part, so that the bonding portion of the extension part may seal around the sound hole.
  • Sound holes may be formed in the case or the printed circuit board.
  • the surface area of the terminal can be significantly increased, there is an effect of improving the tensile force at the joint portion of the microphone popphone.
  • FIG. 1 is a perspective view showing a first embodiment of a microphone according to the present invention.
  • FIG. 2 is a perspective view illustrating an internal structure of the microphone of FIG. 1.
  • FIG. 3 is a perspective view illustrating a bottom surface of the microphone of FIG. 1.
  • FIG. 4 is a bottom view illustrating the bottom of the microphone of FIG. 3.
  • FIG. 5 is a perspective view showing a second embodiment of a microphone according to the present invention.
  • FIG. 6 is a perspective view illustrating the bottom of the microphone of FIG. 5.
  • FIG. 7 is a bottom view illustrating the bottom of the microphone of FIG. 6.
  • connection terminal 235 extension part
  • the present invention relates to a microphone for increasing the surface area of a terminal in a printed circuit board, the technical idea of the present invention can be applied to mechanical condenser microphone and MEMS microphone in common.
  • MEMS microphone to which the technical spirit of the present invention is applied will be described.
  • FIG. 1 is a perspective view showing a first embodiment of a microphone according to the present invention
  • Figure 2 is a perspective view showing the internal structure of the microphone.
  • the microphone may include a printed circuit board 110, a case 120, a ground terminal 130, and a connection terminal 140.
  • One surface of the printed circuit board 110 includes a MEMS chip and a special purpose semiconductor chip 113 (ASIC: Application Specific Integrated Circuit).
  • ASIC Application Specific Integrated Circuit
  • the MEMS chip 111 has a structure in which a back plate (not shown) and a vibration membrane (not shown) are formed on a silicon wafer using semiconductor technology. A spacer (not shown) is formed between the back plate and the vibrating membrane so as to be spaced apart from the back plate and the vibrating membrane. The MEMS chip 111 is converted into an electrical signal of sound introduced to the outside by changing the capacitance between the vibrating membrane and the back plate.
  • the special purpose semiconductor chip 113 is a circuit connected to the MEMS chip 111 to process an electrical signal of the MEMS chip 111.
  • the special purpose semiconductor chip 113 may include a voltage pump (not shown) for providing a voltage to the MEMS chip 111 and an electrical or acoustic signal detected through the MEMS chip 111 to amplify or impedance match a connection terminal ( 140 may be configured as a buffer IC (not shown) provided to the outside.
  • the DC-DC converter is applied as the voltage pump, and an analog amplifier or an analog-to-digital converter (ADC) may be applied as the buffer IC.
  • the MEMS chip 111 and the special-purpose semiconductor chip 113 are electrically connected by a plurality of conductive wires 115.
  • the outer surface of the special purpose semiconductor chip 113 is sealed by the silicon member 114.
  • the special purpose semiconductor chip 113 is protected from moisture or foreign matter by the silicon member 114.
  • the printed circuit board 110 is illustrated as a quadrangle, the printed circuit board 110 may be formed in various shapes such as a polygon, a circle, or an oval except for the quadrangle. In addition, the printed circuit board 110 may be larger than the case 120.
  • the case 120 may be formed in various shapes such as polygons, circles, or ellipses.
  • the case 120 has a form in which a lower surface is opened and the upper and side surfaces are closed.
  • the lower end of the case 120 is electrically connected to a connection pattern (not shown) formed on the printed circuit board 110.
  • the lower end of the case 120 may be bonded to the connection pattern by a conductive adhesive, welding, or the like.
  • the case 120 may be installed to be sealed from the outside so that sound introduced into the case 120 does not leak to the outside.
  • the case 120 may be made of a conductive material as a whole.
  • the case 120 may include a body formed of a plastic material, and a metal layer coated on an inner side surface and / or an outer side surface of the body.
  • the case 120 may be formed to have conductivity by mixing a metallic material with plastic.
  • the case 120 serves as a Faraday cage or an EMI filter that is electrically connected to the connection pattern of the printed circuit board 110 to prevent external noise from flowing into the case 120. Do this.
  • the case 120 is installed to surround the outside of the MEMS chip 111 and the special purpose semiconductor chip 113, thereby preventing foreign substances from entering the MEMS chip 111 and the special purpose semiconductor chip 113. It also plays a role.
  • At least one sound hole 127 is formed on an upper surface of the case 120 to allow sound to flow into the case 120.
  • the sound hole 127 may be formed above the special purpose semiconductor chip 113.
  • the sound hole 127 may be formed in the printed circuit board 110 without being formed in the case 120.
  • a sealing member 123 may be installed at an outer circumferential portion of the case 120 to stably seal a gap between the bottom of the case 120 and one surface of the printed circuit board 110.
  • the sealing member 123 may be formed by applying an epoxy.
  • FIG 3 is a perspective view showing the bottom of the microphone
  • Figure 4 is a bottom view showing the bottom of the microphone.
  • a ground terminal 130 and a connection terminal 140 may be formed on the other surface of the printed circuit board 110.
  • the ground terminal 130 and the connection terminal may be formed by depositing a conductive material layer and then etching.
  • the conductive material layer may be made of brass, copper, stainless steel, aluminum, nickel, gold, silver, or an alloy of the above materials.
  • the ground terminal 130 may be formed along the circumference of the printed circuit board 110. Since the printed circuit board 110 is formed along the periphery, the surface area of the ground terminal 130 may be significantly increased.
  • the ground terminal 130 may be formed in various shapes such as polygonal, circular, oval frame.
  • the ground terminal 130 may be formed in various forms such as a wave form, a plurality of straight band form, or a plurality of parallel straight band, a plurality of parallel wave form. 3 and 4 only the rectangular frame shape is shown.
  • ground terminal 130 may be formed in a continuous form without breaking a specific portion.
  • the ground terminal 130 may be formed in an intermittent form that is broken at predetermined intervals.
  • ground terminal 130 may be formed only on the upper and lower sides of the printed circuit board 110 or only on the left and right sides.
  • the ground terminals 130 may be formed to face each other symmetrically.
  • the ground terminal 130 is a quadrangle
  • the left side and the right side of FIGS. 3 and 4 are symmetrical to each other
  • the upper side and the lower side of the ground terminal 130 are symmetrically formed.
  • the ground terminal 130 is formed in a wave shape
  • the shape of the left side ground terminal 130 and the shape of the ground terminal 130 on the right side are symmetrical with each other
  • the ground terminals 130 of the upper and lower sides are also symmetrical with each other. do.
  • the microphone may allow the tensile force to work uniformly without being biased toward one side of the printed circuit board 110.
  • the surface area of the ground terminal 130 may be appropriately adjusted according to the demand of the tensile force. For example, when the microphone is applied to a portable product, the tensile force may be required relatively large. In this case, the width W of the ground terminal 130 may be relatively wide to increase the surface area. In addition, when the microphone is applied to a non-portable product, the tensile force may be required to be relatively small. In this case, the width W of the ground terminal 130 may be relatively narrow to reduce the surface area.
  • connection terminal 140 is formed on the other surface of the printed circuit board 110 to be electrically spaced apart from the ground terminal 130.
  • the connection terminal 140 may be formed in a square or a circle.
  • the connection terminal 140 is also formed in a rectangular or circular shape to increase the tensile force with the ground terminal 130.
  • connection pattern (not shown) is formed on the main printed circuit board of the product so as to correspond to the ground terminal 130 and the connection terminal 140, and is connected to the ground terminal 130 of the printed circuit board 110.
  • the terminal 140 is bonded to the connection pattern of the main printed circuit board of the product.
  • the ground terminal 130 and the connection terminal 140 may be bonded by a conductive adhesive.
  • the surface area of the ground terminal 130 is significantly increased as described above, the bonding area of the printed circuit board is also significantly increased. Thus, the tensile strength of the microphone is significantly increased.
  • the microphone used in the tensile test below is an example of having a size of 3.76 ⁇ 2.95 ⁇ 1.10 Hz.
  • the conventional first embodiment has a structure in which a microphone in which two circular connection terminals and two circular ground terminals are formed is bonded to a main printed circuit board.
  • the second conventional embodiment has a structure in which a microphone in which two circular connection terminals and three circular ground terminals are formed is bonded to a main printed circuit board.
  • the present invention has a structure in which a microphone in which two rectangular-shaped connecting terminals and a rectangular frame-shaped ground terminal 130 are formed is bonded to a main printed circuit board.
  • the unit of tensile force is Kgf.
  • the first type of the conventional type has a tensile force in the range of 3.216 ⁇ 5.582Kgf, and the average tensile force is 4.077Kgf.
  • the tensile force of the microphone appears in the range of 3.518 ⁇ 6.532Kgf, the average tensile force is represented by 4.803Kgf.
  • the present invention has a tensile force in the range of 11.340 ⁇ 13.127Kgf, the average tensile force of 9.802Kgf.
  • the present invention significantly increases the average tensile force by almost twice as compared with the conventional first and second forms.
  • the tensile force of the microphone can be improved. Furthermore, the possibility of failure can be significantly reduced even when an external shock is applied to the product in which the microphone is mounted.
  • Figure 5 is a perspective view showing a second embodiment of the microphone according to the present invention
  • Figure 6 is a perspective view showing the bottom of the microphone
  • Figure 7 is a bottom view showing the bottom of the microphone.
  • the microphone may include a printed circuit board 210, a case 220, a ground terminal 230, and a connection terminal 240.
  • a MEMS chip and a special purpose semiconductor chip 213 are mounted on one surface of the printed circuit board 210. Since the MEMS chip (not shown) and the special-purpose semiconductor chip (not shown) are substantially the same as those described in the first embodiment, description thereof will be omitted.
  • the printed circuit board 210 is illustrated as a quadrangle, the printed circuit board 210 may be formed in various shapes such as a polygon, a circle, or an oval except for the quadrangle. In addition, the printed circuit board 210 may be formed larger than the case 220.
  • a sound hole 227 is formed in the printed circuit board 210 so that sound flows into the space between the printed circuit board 210 and the case 220.
  • the sound hole 227 may be formed on the lower side of the mass chip.
  • the sound hole 227 may be formed in a portion avoiding the mass chip and the special purpose semiconductor chip 113.
  • the sound hole 227 may be formed in the case 220 without being formed in the printed circuit board 210.
  • the case 220 may be formed in various shapes such as polygons, circles, or ellipses.
  • the case 220 has a form in which the lower surface is open and the upper and side surfaces are closed.
  • the lower end of the case 220 is electrically connected to a connection pattern formed on the printed circuit board 210. At this time, the lower end of the case 220 may be bonded to the connection pattern by a conductive adhesive, welding or the like.
  • the case 220 may be installed to be sealed from the outside so that sound introduced into the case 220 does not leak to the outside.
  • the case 220 may be made of a conductive material as a whole.
  • the case 220 may include a body formed of a plastic material, and a metal layer coated on an inner side surface and / or an outer side surface of the body.
  • the case 220 may be formed to have conductivity by mixing a metallic material with plastic.
  • the case 220 is a Faraday cage (Electromagnetic Interference Filter) to be electrically connected to the connection pattern of the printed circuit board 210 to prevent external noise from flowing into the case 220 Play a role.
  • the case 120 also serves to prevent foreign substances from entering the MEMS chip and the special purpose semiconductor chip.
  • a sealing member 223 may be installed at an outer circumference of the case 220 to stably seal a gap between the bottom of the case 220 and one surface of the printed circuit board 210.
  • the sealing member 223 may be formed by applying an epoxy.
  • the ground terminal 230 and the connection terminal 240 may be formed on the other surface of the printed circuit board 210.
  • the ground terminal 230 and the connection terminal may be formed by depositing a conductive material layer and then etching.
  • the ground terminal 230 may be formed along the circumference of the printed circuit board 210. Since the printed circuit board 210 is formed along the periphery, the surface area of the ground terminal 230 may be significantly increased.
  • the ground terminal 230 may be formed in various shapes such as polygonal, circular, oval frame.
  • the ground terminal 230 may be formed in various forms such as a wave form, a plurality of straight band form, or a plurality of parallel straight band, a plurality of parallel wave form.
  • ground terminal 230 may be formed in a continuous form without breaking a specific portion.
  • the ground terminal 230 may be formed in an intermittent shape that is broken at predetermined intervals.
  • ground terminal 230 may be formed only on the upper and lower sides of the printed circuit board 210 or only on the left and right sides.
  • Portions facing the ground terminals 230 may be symmetrically formed. Since the portions facing the ground terminals 230 are formed symmetrically with each other, the microphone may allow the tensile force to work uniformly without being biased toward one side of the printed circuit board 210.
  • the ground terminal 230 may further include an extension part 235 extending toward the center of the other surface of the printed circuit board 210 and having a circular or polygonal shape.
  • a sound hole 227 may be formed inside the extension part 235.
  • the sound hole 227 is double surrounded by a junction portion of the extension part 235 and the ground terminal 230, the peripheral portion of the sound hole 227 when the ground terminal 120 is bonded to the main printed circuit board. This can prevent double leakage of sound.
  • the extension part 235 may increase the surface area of the ground terminal 230 more than in the first embodiment. Therefore, the tensile force of the microphone can be increased relatively as compared with the first embodiment.
  • the surface area of the ground terminal 230 may be appropriately adjusted according to the demand of the tensile force. For example, when the microphone is applied to a portable product, the tensile force may be required relatively large. In this case, the width W of the ground terminal 230 may be relatively wide to increase the surface area. In addition, when the microphone is applied to a non-portable product, the tensile force may be required to be relatively small. In this case, the width W of the ground terminal 230 may be formed to be relatively narrow to reduce the surface area.
  • connection terminal 240 is formed to be electrically spaced apart from the ground terminal 230 on the other surface of the printed circuit board 210.
  • connection terminal 240 may be formed in a square or a circle.
  • the connection terminal is also formed in a rectangular or circular shape to increase the tensile force with the ground terminal 230.
  • a connection pattern is formed on the main printed circuit board of the product so as to correspond to the ground terminal 230 and the connection terminal 240, and the ground terminal 230 and the connection terminal 240 of the printed circuit board 210 are formed. Is bonded to the connection pattern of the main printed circuit board of the product.
  • the ground terminal 230 and the connection terminal 240 may be bonded by a conductive adhesive.
  • the bonding area of the main printed circuit board is also significantly increased.
  • the present invention significantly reduces the likelihood of product failure by increasing the tensile force of the microphone, and thus there is considerable industrial applicability.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Micromachines (AREA)

Abstract

La présente invention se rapporte à un microphone qui peut réduire de façon remarquable le risque de défaillance du produit selon une augmentation de la force de traction du microphone. La présente invention porte sur le microphone qui comprend : une carte de circuit imprimé (110) sur laquelle sont montées une puce MEMS (111) et une puce semi-conductrice de type spécialisé (113) ; un boîtier (120) agencé pour recouvrir la puce MEMS (111) et la puce semi-conductrice de type spécialisé (113) ; une borne de terre (130) formée autour de la circonférence de la carte de circuit imprimé (110) sur l'autre côté de la carte de circuit imprimé (110) ; et une borne de connexion (140) qui est séparée électriquement de la borne de terre (130) sur l'autre côté de la carte de circuit imprimé (110).
PCT/KR2011/002616 2010-11-19 2011-04-13 Microphone WO2012067317A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0115520 2010-11-19
KR1020100115520A KR20120054244A (ko) 2010-11-19 2010-11-19 마이크로폰

Publications (1)

Publication Number Publication Date
WO2012067317A1 true WO2012067317A1 (fr) 2012-05-24

Family

ID=45868716

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/002616 WO2012067317A1 (fr) 2010-11-19 2011-04-13 Microphone

Country Status (4)

Country Link
KR (1) KR20120054244A (fr)
CN (2) CN202178855U (fr)
TW (1) TW201223295A (fr)
WO (1) WO2012067317A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9668047B2 (en) 2015-08-28 2017-05-30 Hyundai Motor Company Microphone
JP7410684B2 (ja) * 2019-10-21 2024-01-10 シャープ株式会社 マイクシステム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040072099A (ko) * 2003-02-08 2004-08-18 송기영 콘덴서 마이크로폰의 케이스 접합 구조 및 그의 제조 방법
KR100650280B1 (ko) * 2005-09-15 2006-11-29 주식회사 비에스이 기판에 음향홀이 형성된 실리콘 콘덴서 마이크로폰
KR20090023871A (ko) * 2007-09-03 2009-03-06 주식회사 비에스이 내벽을 금속성 혹은 전도성 물질로 감싼 세라믹 패키지를이용한 콘덴서 마이크로폰
KR100908452B1 (ko) * 2007-05-17 2009-07-20 주식회사 비에스이 콘덴서 마이크로폰

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06268548A (ja) * 1993-03-15 1994-09-22 Hitachi Ltd 防水機能付き筐体及び携帯電話
JP4239413B2 (ja) * 2001-01-10 2009-03-18 日本電気株式会社 スピーカーおよびそれを使用した携帯端末装置
KR100675023B1 (ko) * 2005-09-14 2007-01-30 주식회사 비에스이 콘덴서 마이크로폰 및 이를 위한 패키징 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040072099A (ko) * 2003-02-08 2004-08-18 송기영 콘덴서 마이크로폰의 케이스 접합 구조 및 그의 제조 방법
KR100650280B1 (ko) * 2005-09-15 2006-11-29 주식회사 비에스이 기판에 음향홀이 형성된 실리콘 콘덴서 마이크로폰
KR100908452B1 (ko) * 2007-05-17 2009-07-20 주식회사 비에스이 콘덴서 마이크로폰
KR20090023871A (ko) * 2007-09-03 2009-03-06 주식회사 비에스이 내벽을 금속성 혹은 전도성 물질로 감싼 세라믹 패키지를이용한 콘덴서 마이크로폰

Also Published As

Publication number Publication date
CN102480657A (zh) 2012-05-30
CN202178855U (zh) 2012-03-28
TW201223295A (en) 2012-06-01
KR20120054244A (ko) 2012-05-30

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