WO2012067317A1

WO2012067317A1 - Microphone

Info

Publication number: WO2012067317A1
Application number: PCT/KR2011/002616
Authority: WO
Inventors: 박성호; 이상호; 심용현
Original assignee: 주식회사 비에스이; 톈진 비에스이 일렉트로닉스 컴퍼니 리미티드; 동관 바오싱 일렉트로닉스 컴퍼니 리미티드; 롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드
Priority date: 2010-11-19
Filing date: 2011-04-13
Publication date: 2012-05-24
Also published as: KR20120054244A; TW201223295A; CN202178855U; CN102480657A

Abstract

The present invention relates to a microphone which can remarkably reduce the possibility of product failure according to an increase of tensile force of the microphone. The present invention provides the microphone including: a printed circuit board (110) on which a MEMS chip (111) and a special-purpose type semiconductor chip (113) are mounted; a case (120) provided to cover the MEMS chip (111) and the special-purpose type semiconductor chip (113); a ground terminal (130) formed around a circumference of the printed circuit board (110) on the other side of the printed circuit board (110); and a connective terminal (140) which is electrically separated from the ground terminal (130) on the other side of the printed circuit board (110).

Description

microphone

The present invention relates to a microphone that is resistant to external impact and can improve durability.

In general, microphones are devices that convert sound into electrical signals. The microphone may be applied to various communication devices such as mobile communication devices such as mobile terminals, earphones or hearing aids. Such microphones should have good electronic / acoustic performance, reliability and operability.

The microphone includes a mechanical condenser microphone, a MEMS microphone, and the like.

The mechanical condenser microphone is manufactured by manufacturing a diaphragm, a back plate, a signal processing printed circuit board, and the like, and then stacking the components in the case, and bending the ends of the case in which the components are stacked. At this time, the components are squeezed by bending the case and are electrically connected stably.

The MEMS microphone is manufactured by forming a portion of an acoustic sensing element such as a diaphragm and a back plate using a semiconductor processing technology. Such MEMS microphones can be miniaturized, high-performance, multifunctional, and integrated through ultra-precision micromachining, thereby improving stability and reliability.

A ground terminal and a connection terminal are formed on the bottom surface of the microphone so as to be attached to the main printed circuit board of each product. The microphone provides a signal to the main printed circuit board via a connection terminal.

However, since the ground terminal and the connection terminal of the conventional microphone are formed in the shape of a dot (dot) having a small diameter, the tensile force is weak at the junction of the microphone and the main printed circuit board. Furthermore, since the tensile force is weak at the joint, when the product is applied to a portable product, the product falls to the floor and frequently causes a failure.

An object of the present invention for solving the above problems is to provide a microphone that can improve the tensile force in the joint portion.

Another object of the present invention is to provide a microphone which can reduce the possibility of failure in using the product.

One aspect of the present invention for achieving the above object is a printed circuit board mounted with a MEMS chip and a special purpose semiconductor chip; A case installed to cover the MEMS chip and the special purpose semiconductor chip; A ground terminal formed on the other side of the printed circuit board along a circumference of the printed circuit board; And a connection terminal formed on the other surface of the printed circuit board to be electrically spaced from the ground terminal.

The ground terminal may be formed in a polygonal, circular or elliptical frame shape.

The ground terminal may be formed in a continuous form or an intermittent form.

The ground terminals may be formed to face each other symmetrically.

The ground terminal may further include an extension part extending to a central side of the other surface of the printed circuit board and having a circular shape or a polygonal shape.

A sound hole is formed inside the extension part, so that the bonding portion of the extension part may seal around the sound hole.

Sound holes may be formed in the case or the printed circuit board.

According to the present invention, since the surface area of the terminal can be significantly increased, there is an effect of improving the tensile force at the joint portion of the microphone popphone.

According to the present invention, there is an effect that can significantly reduce the possibility of failure when using the product.

1 is a perspective view showing a first embodiment of a microphone according to the present invention.

FIG. 2 is a perspective view illustrating an internal structure of the microphone of FIG. 1.

3 is a perspective view illustrating a bottom surface of the microphone of FIG. 1.

4 is a bottom view illustrating the bottom of the microphone of FIG. 3.

5 is a perspective view showing a second embodiment of a microphone according to the present invention.

FIG. 6 is a perspective view illustrating the bottom of the microphone of FIG. 5. FIG.

7 is a bottom view illustrating the bottom of the microphone of FIG. 6.

110: printed circuit board 111: MEMS chip

113: semiconductor chip 114: silicon member

120: case 127: sound hole

123: sealing member 130: ground terminal

140: connection terminal 235: extension part

Embodiments of the microphone according to the present invention for achieving the above object will be described in detail.

The present invention relates to a microphone for increasing the surface area of a terminal in a printed circuit board, the technical idea of the present invention can be applied to mechanical condenser microphone and MEMS microphone in common. Hereinafter, the MEMS microphone to which the technical spirit of the present invention is applied will be described.

First, a first embodiment of a microphone according to the present invention will be described in detail with reference to the drawings.

1 is a perspective view showing a first embodiment of a microphone according to the present invention, Figure 2 is a perspective view showing the internal structure of the microphone.

1 and 2, the microphone may include a printed circuit board 110, a case 120, a ground terminal 130, and a connection terminal 140.

One surface of the printed circuit board 110 includes a MEMS chip and a special purpose semiconductor chip 113 (ASIC: Application Specific Integrated Circuit).

The MEMS chip 111 has a structure in which a back plate (not shown) and a vibration membrane (not shown) are formed on a silicon wafer using semiconductor technology. A spacer (not shown) is formed between the back plate and the vibrating membrane so as to be spaced apart from the back plate and the vibrating membrane. The MEMS chip 111 is converted into an electrical signal of sound introduced to the outside by changing the capacitance between the vibrating membrane and the back plate.

The special purpose semiconductor chip 113 is a circuit connected to the MEMS chip 111 to process an electrical signal of the MEMS chip 111. The special purpose semiconductor chip 113 may include a voltage pump (not shown) for providing a voltage to the MEMS chip 111 and an electrical or acoustic signal detected through the MEMS chip 111 to amplify or impedance match a connection terminal ( 140 may be configured as a buffer IC (not shown) provided to the outside. Here, the DC-DC converter is applied as the voltage pump, and an analog amplifier or an analog-to-digital converter (ADC) may be applied as the buffer IC.

The MEMS chip 111 and the special-purpose semiconductor chip 113 are electrically connected by a plurality of conductive wires 115.

In addition, the outer surface of the special purpose semiconductor chip 113 is sealed by the silicon member 114. The special purpose semiconductor chip 113 is protected from moisture or foreign matter by the silicon member 114.

Although the printed circuit board 110 is illustrated as a quadrangle, the printed circuit board 110 may be formed in various shapes such as a polygon, a circle, or an oval except for the quadrangle. In addition, the printed circuit board 110 may be larger than the case 120.

The case 120 may be formed in various shapes such as polygons, circles, or ellipses. In addition, the case 120 has a form in which a lower surface is opened and the upper and side surfaces are closed.

The lower end of the case 120 is electrically connected to a connection pattern (not shown) formed on the printed circuit board 110. In this case, the lower end of the case 120 may be bonded to the connection pattern by a conductive adhesive, welding, or the like. The case 120 may be installed to be sealed from the outside so that sound introduced into the case 120 does not leak to the outside.

The case 120 may be made of a conductive material as a whole. In addition, the case 120 may include a body formed of a plastic material, and a metal layer coated on an inner side surface and / or an outer side surface of the body. In addition, the case 120 may be formed to have conductivity by mixing a metallic material with plastic.

The case 120 serves as a Faraday cage or an EMI filter that is electrically connected to the connection pattern of the printed circuit board 110 to prevent external noise from flowing into the case 120. Do this. In addition, the case 120 is installed to surround the outside of the MEMS chip 111 and the special purpose semiconductor chip 113, thereby preventing foreign substances from entering the MEMS chip 111 and the special purpose semiconductor chip 113. It also plays a role.

At least one sound hole 127 is formed on an upper surface of the case 120 to allow sound to flow into the case 120. In this case, the sound hole 127 may be formed above the special purpose semiconductor chip 113.

Of course, the sound hole 127 may be formed in the printed circuit board 110 without being formed in the case 120.

A sealing member 123 may be installed at an outer circumferential portion of the case 120 to stably seal a gap between the bottom of the case 120 and one surface of the printed circuit board 110. The sealing member 123 may be formed by applying an epoxy.

3 is a perspective view showing the bottom of the microphone, Figure 4 is a bottom view showing the bottom of the microphone.

3 and 4, a ground terminal 130 and a connection terminal 140 may be formed on the other surface of the printed circuit board 110. The ground terminal 130 and the connection terminal may be formed by depositing a conductive material layer and then etching. The conductive material layer may be made of brass, copper, stainless steel, aluminum, nickel, gold, silver, or an alloy of the above materials.

The ground terminal 130 may be formed along the circumference of the printed circuit board 110. Since the printed circuit board 110 is formed along the periphery, the surface area of the ground terminal 130 may be significantly increased.

In this case, the ground terminal 130 may be formed in various shapes such as polygonal, circular, oval frame. In addition, the ground terminal 130 may be formed in various forms such as a wave form, a plurality of straight band form, or a plurality of parallel straight band, a plurality of parallel wave form. 3 and 4 only the rectangular frame shape is shown.

In addition, the ground terminal 130 may be formed in a continuous form without breaking a specific portion. Of course, the ground terminal 130 may be formed in an intermittent form that is broken at predetermined intervals.

In addition, the ground terminal 130 may be formed only on the upper and lower sides of the printed circuit board 110 or only on the left and right sides.

In addition, the ground terminals 130 may be formed to face each other symmetrically. For example, when the ground terminal 130 is a quadrangle, the left side and the right side of FIGS. 3 and 4 are symmetrical to each other, and the upper side and the lower side of the ground terminal 130 are symmetrically formed. In addition, even when the ground terminal 130 is formed in a wave shape, the shape of the left side ground terminal 130 and the shape of the ground terminal 130 on the right side are symmetrical with each other, and the ground terminals 130 of the upper and lower sides are also symmetrical with each other. do.

Since the portions facing the ground terminals 130 are formed symmetrically with each other, the microphone may allow the tensile force to work uniformly without being biased toward one side of the printed circuit board 110.

The surface area of the ground terminal 130 may be appropriately adjusted according to the demand of the tensile force. For example, when the microphone is applied to a portable product, the tensile force may be required relatively large. In this case, the width W of the ground terminal 130 may be relatively wide to increase the surface area. In addition, when the microphone is applied to a non-portable product, the tensile force may be required to be relatively small. In this case, the width W of the ground terminal 130 may be relatively narrow to reduce the surface area.

In addition, the connection terminal 140 is formed on the other surface of the printed circuit board 110 to be electrically spaced apart from the ground terminal 130. In this case, the connection terminal 140 may be formed in a square or a circle. The connection terminal 140 is also formed in a rectangular or circular shape to increase the tensile force with the ground terminal 130.

Meanwhile, a connection pattern (not shown) is formed on the main printed circuit board of the product so as to correspond to the ground terminal 130 and the connection terminal 140, and is connected to the ground terminal 130 of the printed circuit board 110. The terminal 140 is bonded to the connection pattern of the main printed circuit board of the product. In this case, the ground terminal 130 and the connection terminal 140 may be bonded by a conductive adhesive.

Since the surface area of the ground terminal 130 is significantly increased as described above, the bonding area of the printed circuit board is also significantly increased. Thus, the tensile strength of the microphone is significantly increased.

Referring to the test results of the first embodiment of the present invention configured as described above are as follows.

The microphone used in the tensile test below is an example of having a size of 3.76 × 2.95 × 1.10 Hz.

The table below shows the results of the tensile test.

In the table below, the conventional first embodiment has a structure in which a microphone in which two circular connection terminals and two circular ground terminals are formed is bonded to a main printed circuit board. In addition, the second conventional embodiment has a structure in which a microphone in which two circular connection terminals and three circular ground terminals are formed is bonded to a main printed circuit board. In addition, the present invention has a structure in which a microphone in which two rectangular-shaped connecting terminals and a rectangular frame-shaped ground terminal 130 are formed is bonded to a main printed circuit board. In the table below, the unit of tensile force is Kgf.

Table 1

Count	Conventional first form	Conventional 2nd form	The present invention
One	4.478	3.518	10.184
2	3.778	4.210	13.008
3	3.216	4.416	11.926
4	4.002	5.158	11.106
5	5.532	6.532	10.168
6	3.404	4.854	12.616
7	5.582	5.404	13.127
8	3.700	5.082	10.792
9	3.328	4.540	10.671
10	3.754	4.316	9.802
Minimum value	3.216	3.518	11.340
Value	5.582	6.532	13.127
medium	4.077	4.803	9.802

[Tensile force test]

Referring to the tensile force test table, the first type of the conventional type has a tensile force in the range of 3.216 ~ 5.582Kgf, and the average tensile force is 4.077Kgf. Conventional second aspect, the tensile force of the microphone appears in the range of 3.518 ~ 6.532Kgf, the average tensile force is represented by 4.803Kgf.

In comparison, the present invention has a tensile force in the range of 11.340 ~ 13.127Kgf, the average tensile force of 9.802Kgf.

From these test results, it can be seen that the present invention significantly increases the average tensile force by almost twice as compared with the conventional first and second forms.

As described above, by significantly increasing the surface area of the ground terminal 130, the tensile force of the microphone can be improved. Furthermore, the possibility of failure can be significantly reduced even when an external shock is applied to the product in which the microphone is mounted.

First, a second embodiment of a microphone according to the present invention will be described in detail with reference to the drawings.

Figure 5 is a perspective view showing a second embodiment of the microphone according to the present invention, Figure 6 is a perspective view showing the bottom of the microphone, Figure 7 is a bottom view showing the bottom of the microphone.

5 to 7, the microphone may include a printed circuit board 210, a case 220, a ground terminal 230, and a connection terminal 240.

A MEMS chip and a special purpose semiconductor chip 213 (ASIC) are mounted on one surface of the printed circuit board 210. Since the MEMS chip (not shown) and the special-purpose semiconductor chip (not shown) are substantially the same as those described in the first embodiment, description thereof will be omitted.

Although the printed circuit board 210 is illustrated as a quadrangle, the printed circuit board 210 may be formed in various shapes such as a polygon, a circle, or an oval except for the quadrangle. In addition, the printed circuit board 210 may be formed larger than the case 220.

A sound hole 227 is formed in the printed circuit board 210 so that sound flows into the space between the printed circuit board 210 and the case 220. In this case, the sound hole 227 may be formed on the lower side of the mass chip. In addition, the sound hole 227 may be formed in a portion avoiding the mass chip and the special purpose semiconductor chip 113.

Of course, the sound hole 227 may be formed in the case 220 without being formed in the printed circuit board 210.

The case 220 may be formed in various shapes such as polygons, circles, or ellipses. In addition, the case 220 has a form in which the lower surface is open and the upper and side surfaces are closed.

The lower end of the case 220 is electrically connected to a connection pattern formed on the printed circuit board 210. At this time, the lower end of the case 220 may be bonded to the connection pattern by a conductive adhesive, welding or the like. The case 220 may be installed to be sealed from the outside so that sound introduced into the case 220 does not leak to the outside.

The case 220 may be made of a conductive material as a whole. In addition, the case 220 may include a body formed of a plastic material, and a metal layer coated on an inner side surface and / or an outer side surface of the body. In addition, the case 220 may be formed to have conductivity by mixing a metallic material with plastic.

The case 220 is a Faraday cage (Electromagnetic Interference Filter) to be electrically connected to the connection pattern of the printed circuit board 210 to prevent external noise from flowing into the case 220 Play a role. In addition, the case 120 also serves to prevent foreign substances from entering the MEMS chip and the special purpose semiconductor chip.

A sealing member 223 may be installed at an outer circumference of the case 220 to stably seal a gap between the bottom of the case 220 and one surface of the printed circuit board 210. The sealing member 223 may be formed by applying an epoxy.

The ground terminal 230 and the connection terminal 240 may be formed on the other surface of the printed circuit board 210. The ground terminal 230 and the connection terminal may be formed by depositing a conductive material layer and then etching.

The ground terminal 230 may be formed along the circumference of the printed circuit board 210. Since the printed circuit board 210 is formed along the periphery, the surface area of the ground terminal 230 may be significantly increased.

In this case, the ground terminal 230 may be formed in various shapes such as polygonal, circular, oval frame. In addition, the ground terminal 230 may be formed in various forms such as a wave form, a plurality of straight band form, or a plurality of parallel straight band, a plurality of parallel wave form.

In addition, the ground terminal 230 may be formed in a continuous form without breaking a specific portion. Of course, the ground terminal 230 may be formed in an intermittent shape that is broken at predetermined intervals.

In addition, the ground terminal 230 may be formed only on the upper and lower sides of the printed circuit board 210 or only on the left and right sides.

Portions facing the ground terminals 230 may be symmetrically formed. Since the portions facing the ground terminals 230 are formed symmetrically with each other, the microphone may allow the tensile force to work uniformly without being biased toward one side of the printed circuit board 210.

In addition, the ground terminal 230 may further include an extension part 235 extending toward the center of the other surface of the printed circuit board 210 and having a circular or polygonal shape. In this case, a sound hole 227 may be formed inside the extension part 235.

Since the sound hole 227 is double surrounded by a junction portion of the extension part 235 and the ground terminal 230, the peripheral portion of the sound hole 227 when the ground terminal 120 is bonded to the main printed circuit board. This can prevent double leakage of sound.

The extension part 235 may increase the surface area of the ground terminal 230 more than in the first embodiment. Therefore, the tensile force of the microphone can be increased relatively as compared with the first embodiment.

The surface area of the ground terminal 230 may be appropriately adjusted according to the demand of the tensile force. For example, when the microphone is applied to a portable product, the tensile force may be required relatively large. In this case, the width W of the ground terminal 230 may be relatively wide to increase the surface area. In addition, when the microphone is applied to a non-portable product, the tensile force may be required to be relatively small. In this case, the width W of the ground terminal 230 may be formed to be relatively narrow to reduce the surface area.

In addition, the connection terminal 240 is formed to be electrically spaced apart from the ground terminal 230 on the other surface of the printed circuit board 210. In this case, the connection terminal 240 may be formed in a square or a circle. The connection terminal is also formed in a rectangular or circular shape to increase the tensile force with the ground terminal 230.

Meanwhile, a connection pattern is formed on the main printed circuit board of the product so as to correspond to the ground terminal 230 and the connection terminal 240, and the ground terminal 230 and the connection terminal 240 of the printed circuit board 210 are formed. Is bonded to the connection pattern of the main printed circuit board of the product. In this case, the ground terminal 230 and the connection terminal 240 may be bonded by a conductive adhesive.

Since the surface area of the ground terminal 130 is significantly increased as described above, the bonding area of the main printed circuit board is also significantly increased.

The present invention significantly reduces the likelihood of product failure by increasing the tensile force of the microphone, and thus there is considerable industrial applicability.

Claims

A printed circuit board on which MEMS chips and special purpose semiconductor chips are mounted;

A case installed to cover the MEMS chip and the special purpose semiconductor chip;

A ground terminal formed on the other side of the printed circuit board along a circumference of the printed circuit board; And

And a connection terminal formed on the other surface of the printed circuit board to be electrically spaced from the ground terminal.
The method of claim 1,

The ground terminal is a microphone, characterized in that formed in the shape of a polygonal, circular or oval frame.
The method of claim 1,

The ground terminal is a microphone, characterized in that formed in a continuous form or an intermittent form.
The method of claim 1,

The ground terminal is a microphone, characterized in that the facing portions are formed symmetrically to each other.
The method of claim 1,

The ground terminal further comprises a microphone extending to the central side of the other surface of the printed circuit board having a circular or polygonal shape.
The method of claim 5,

A sound hole is formed inside the extension part, and the joint portion of the extension part seals around the sound hole.
The method of claim 1,

The case or the printed circuit board, the microphone, characterized in that the sound hole is formed.