WO2011142512A1 - Pcb module for a capacitor microphone - Google Patents

Pcb module for a capacitor microphone Download PDF

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Publication number
WO2011142512A1
WO2011142512A1 PCT/KR2010/007315 KR2010007315W WO2011142512A1 WO 2011142512 A1 WO2011142512 A1 WO 2011142512A1 KR 2010007315 W KR2010007315 W KR 2010007315W WO 2011142512 A1 WO2011142512 A1 WO 2011142512A1
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WO
WIPO (PCT)
Prior art keywords
chip
pcb
metal pattern
ecm
gnd
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Application number
PCT/KR2010/007315
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French (fr)
Korean (ko)
Inventor
이진효
이규홍
이용식
문현자
Original Assignee
(주)알에프세미
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Application filed by (주)알에프세미 filed Critical (주)알에프세미
Publication of WO2011142512A1 publication Critical patent/WO2011142512A1/en

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2209/00—Details of transducers of the moving-coil, moving-strip, or moving-wire type covered by H04R9/00 but not provided for in any of its subgroups
    • H04R2209/022—Aspects regarding the stray flux internal or external to the magnetic circuit, e.g. shielding, shape of magnetic circuit, flux compensation coils

Definitions

  • the present invention relates to a capacitor microphone, and more particularly, an RF filter chip and an ECM chip for the purpose of blocking a signal in which an external high frequency noise signal induced by the microphone is amplified in an ECM chip, and a wiring length of a voice signal processing circuit.
  • Die bonding to the upper surface of the PCB Die bonding
  • electrical connection between the two chips and the upper surface of the PCB by a bonding wire molding a certain area including the ECM chip, the RF filter chip, bonding wires.
  • the structure of applying the upper surface of the molding to the GND electrode to block the high frequency noise signal induced from the outside is transmitted to the vibration plate of the microphone, that is, the input terminal of the ECM chip, has a capacitor microphone PCB module.
  • the PCB package structure for thinning is required, and according to the multi-mode trend of mobile phones, the external high frequency noise generated when various electric devices, especially antennas, are mounted inside the mobile phones is applied to the microphone. To prevent ingress.
  • FIG. 1 is a cutaway cross-sectional view of a microphone according to the prior art, and FIGS. 2 and 3 show the configuration circuit of FIG.
  • the microphone 100 module configuration generally includes a diaphragm 170, an electrostatic film 180, an ECM 110, and a passive element 121 serving as an RF filter.
  • the ECM 110 converts the change in capacitance between the diaphragm 170, the back plate 190, and the electrostatic film 180 according to the voice signal into an electric signal, and passes through the passive element 121 serving as an RF filter.
  • the voice signal is transmitted to the final output terminal of the microphone.
  • the ECM 110 is configured to be separated from the passive element 121, which serves as an RF filter, a predetermined distance apart.
  • a high frequency signal of a large instantaneous power ranging from several milliwatts (mW) to several watts (W) is radiated through an antenna. Is induced on the line of the microphone 100 and the external voice signal processing circuit and applied to the ECM chip 110 inside the microphone 100. In addition, the high frequency noise signal is also induced in the vibration plate inside the microphone, and the distance between the vibration plate and the ECM chip 110 is shortened and applied to the input terminal of the ECM chip 110 due to the thinning of the microphone.
  • the non-linear operation is performed, and a noise component corresponding to the peak envelope is generated along with the harmonics wave. Since the frequency envelope of the peak envelope is largely overlapped with the audio frequency, the signal is amplified with the voice signal and enters the voice signal processing circuit, making it the microphone's loudest noise.
  • the existing microphone 100 serves as one or more RF filters by being spaced apart at regular intervals on the same PCB 160 as the packaged ECM 110. It was configured using a passive element 121.
  • FIGS. 2 and 3 are circuit diagrams of a capacitor microphone in which a passive element 121 serving as this RF filter is constructed. It consists of capacitors C1 (C2) (C3), resistors (R1), varistors, etc., which act as RF filters.
  • the passive elements are connected to the upper surface of the PCB by metal patterns.
  • the wiring of the circuit for processing the input voice signal becomes long. That is, the voice signal processing circuit includes a lead frame and a bonding wire inside the packaged ECM chip, and a metal pattern on the upper surface of the PCB on which a passive element for acting as an RF filter is SMD. As such, as the length of the audio signal processing circuit becomes longer, the noise is generated when the microphone is operated because of the high frequency noise signal which is radiated and coupled in the signal processing circuit and not removed.
  • FIGS. 4 and 5 are cross-sectional views schematically illustrating a cross section of a capacitor microphone to which a bonding wire PCB is applied in the prior art.
  • the capacitor microphone 210 bonds the circuit pattern 220 to the PCB substrate 200 and bonds the circuit element 230 to the PCB substrate 200.
  • the circuit element 230 and the circuit pattern 220 are electrically connected by the wire 240.
  • the encapsulation is performed by using the epoxy resin 290 to surround the circuit device 230 and the wire 240.
  • reference numeral 39 denotes a sound wave inlet.
  • FIG. 5 also wires a circuit with a conductive material on the PCB substrate 41 inside the capacitor microphone case 38 and is bonded on the PCB substrate 41 to match the potential change according to the change in capacitance with an electrical signal. After bonding the matching and amplifying circuit chip 32 including the ECM and the capacitor to amplify, the matching and amplifying circuit chip 32 is molded on the PCB substrate 41.
  • FIGS. 4 and 5 do not consider the wiring length of the voice signal processing circuit of the microphone, and thus are aimed at improving the manufacturing cost, improving the yield by omitting SMD process, removing noise by contact resistance, and improving terminal disconnection.
  • the high frequency noise signal is radiated and coupled to generate noise when the microphone is operated.
  • a high frequency noise signal introduced from the outside is induced to the vibration plate of the microphone, which is an input terminal of the ECM chip located at a close distance to the ECM chip.
  • the induced high frequency noise signal is transmitted to the input terminal of the ECM chip is amplified through the ECM chip, causing a noise problem when the microphone is operated.
  • the present invention is a problem of generating a high frequency noise signal generated in the conventional microphone as described above, that is, the circuit of the length of the voice signal processing circuit generated while the passive element acting as an ECM chip and the RF filter in the form of a package SMD on the PCB
  • the main purpose is to solve the high frequency noise problem caused by the radiation and coupling of high frequency noise signal by wiring.
  • the externally induced high frequency noise signal is induced to the diaphragm of the microphone, which is an input terminal of the ECM chip located close to the ECM chip, and the high frequency noise signal is transmitted to the input terminal of the ECM chip.
  • Another goal is to solve the noise problem that occurs when the microphone is operating while being amplified.
  • the capacitor microphone PCB module according to the present invention for solving the above-described conventional problems and to achieve the technical problem,
  • the PCB module for a capacitor microphone comprising a sound unit vibrating according to an external sound pressure, and a circuit unit for receiving a signal from the sound unit and amplifying it
  • An ECM chip including an amplifier circuit for amplifying the voltage generated by the sound unit
  • the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and when the adhesive backing (substrate) of the ECM chip is an input electrode, the ECM chip is connected to the input electrode metal pattern. Bonding, wherein the RF filter chip is bonded to the GND electrode metal pattern.
  • the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and an ECM chip bonding metal pattern, and the ECM chip has an adhesive electrode when the substrate is an output electrode.
  • the chip is bonded to the metal pattern for ECM chip bonding, and the RF filter chip is bonded to the GND electrode metal pattern.
  • the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and when the adhesive backing (substrate) of the ECM chip is an input electrode, the ECM chip is connected to the input electrode metal pattern. Bonding, wherein the RF filter chip is bonded to the output electrode metal pattern of the upper surface of the PCB.
  • the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and an ECM chip bonding metal pattern, and the ECM chip has an adhesive electrode when the substrate is an output electrode.
  • the chip is bonded to the metal pattern for ECM chip bonding, and the RF filter chip is bonded to the output electrode metal pattern on the upper surface of the PCB.
  • the GND terminal of the upper surface of the ECM chip bonded in the present invention is electrically connected to the GND electrode of the upper surface of the PCB through a bonding wire, and the output terminal of the upper surface of the ECM chip is electrically connected to the input terminal of the RF filter chip through a bonding wire.
  • the output terminal of the RF filter chip is electrically connected to the output electrode metal pattern through a bonding wire, and the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern on the back of the PCB module are connected to the corresponding metal pattern on the upper surface of the PCB. It is characterized in that the electrical connection through the via hole (Via Hole).
  • the input terminal of the upper surface of the ECM chip bonded in the present invention is connected to the input electrode metal pattern of the upper surface of the PCB through bonding wires, and the GND terminal of the ECM chip is electrically connected to the GND electrode of the upper surface of the PCB through bonding wires.
  • the ECM chip bonding metal pattern, to which the output electrode of the ECM chip is bonded, and the input terminal of the RF filter chip are electrically connected through bonding wires, and the output terminal of the RF filter chip is connected to the output electrode metal pattern through bonding wires.
  • the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern on the back of the PCB module are electrically connected to each other through a via hole in the corresponding metal pattern on the upper surface of the PCB.
  • the GND terminal of the upper surface of the ECM chip bonded in the present invention is electrically connected to the GND electrode of the upper surface of the PCB through a bonding wire, and the output terminal of the upper surface of the ECM chip is electrically connected to an input terminal of the RF filter chip through a bonding wire.
  • the GND terminal of the RF filter chip is electrically connected to the GND electrode metal pattern of the upper surface of the PCB through bonding wires, and the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern of the PCB module are connected to the upper surface of the PCB.
  • the metal pattern may be electrically connected through a via hole.
  • the GND terminal of the upper surface of the ECM chip bonded in the present invention is electrically connected to the GND electrode of the upper surface of the PCB through bonding wires, and the input terminal of the upper surface of the ECM chip is connected to the input electrode metal pattern of the upper surface of the PCB through bonding wires. It is electrically connected, and the ECM chip bonding metal pattern in which the output electrode of the ECM chip is bonded and the input terminal of the RF filter chip are electrically connected through a bonding wire, and the GND terminal of the RF filter chip is connected through a bonding wire.
  • the GND electrode metal pattern on the upper surface of the PCB is electrically connected, and the Vout electrode (output electrode) metal pattern on the back of the PCB module and the GND electrode metal pattern are electrically connected through via holes in the corresponding metal pattern on the upper surface of the PCB. Characterized in that.
  • a high frequency noise signal induced during use of a microphone is removed by applying an RF filter chip, and voice signal processing is performed by directly bonding an RF filter chip and an ECM chip to a printed circuit board.
  • the wiring length of the circuit can be minimized to reduce high frequency noise radiated and coupled.
  • the GND electrode is placed on the upper surface of the molding to block the high frequency noise signal generated from outside from being amplified by being transmitted to the microphone's diaphragm, that is, the input terminal of the ECM chip. It works.
  • the die bonding and molding of the upper surface of the PCB minimizes the exposure of the input stage of the ECM chip on the upper surface of the PCB, and the moisture or resin on the upper surface of the PCB due to the elimination of the SMD process of the ECM chip and other passive devices. It is also possible to obtain an effect of reducing the leakage current of the ECM chip, which may be generated by the method.
  • FIG. 1 is a cutaway sectional view of a capacitor microphone according to the prior art.
  • FIG. 2 is a circuit diagram of a capacitor microphone of the prior art.
  • FIG. 3 is a circuit diagram of a capacitor microphone of the prior art.
  • FIG. 4 is a cross-sectional view of a capacitor microphone to which a wire bonding PCB of the prior art is applied.
  • FIG. 5 is a cross-sectional view of a capacitor microphone to which a wire bonding PCB of the prior art is applied.
  • FIG. 6 is a circuit diagram of a capacitor microphone to which the present invention is applied.
  • FIG. 7 is a cross-sectional view of the PCB module cut-out of the first embodiment according to the present invention.
  • FIG. 8 is a plan view of the PCB of FIG.
  • FIG. 9 is a cross-sectional view of a PCB module cut in a second embodiment according to the present invention.
  • FIG. 10 is a plan view of the PCB of FIG.
  • FIG. 11 is a cross-sectional view of a PCB module cut in a third embodiment according to the present invention.
  • FIG. 12 is a plan view of the PCB of FIG.
  • Fig. 13 is a sectional view of a PCB module cut in a fourth embodiment according to the present invention.
  • FIG. 14 is a plan view of the PCB of FIG.
  • FIG. 6 is a circuit diagram of a capacitor microphone according to the present invention
  • FIG. 7 is a cross-sectional view of a PCB module according to a first embodiment of the present invention
  • FIG. 8 is a PCB plan view of FIG. 7
  • FIG. 9 is a PCB module cut of a second embodiment according to the present invention.
  • Fig. 10 is a plan view of the PCB of Fig. 9
  • Fig. 11 is a sectional view of the PCB module of the third embodiment according to the present invention
  • Fig. 12 is a plan view of the PCB of Fig. 11
  • Fig. 13 is a PCB module cut of the fourth embodiment according to the present invention.
  • 14 is a plan view of the PCB of FIG.
  • FIG. 6 is a circuit diagram constructed according to the present invention.
  • a capacitor microphone including a sound unit vibrating according to an external sound pressure and a circuit unit for receiving a signal from the sound unit and amplifying the signal
  • the circuit unit amplifies a voltage generated in the sound unit.
  • An RF filter chip 120 including an ECM chip 110 including an amplification circuit, a capacitor C4, C5, and a resistor R2 for blocking an external high frequency noise signal accompanying the amplification process.
  • FIG. 7 is a cross-sectional view of a PCB module to which the ECM chip 110 whose adhesive backing is an input electrode and the RF filter chip 120 whose adhesive backing is a GND electrode are applied, and FIG. PCB top view.
  • the GND terminal of the top surface of the ECM chip 110 bonded is electrically connected to the GND electrode 16b of the top surface of the PCB 1 through a bonding wire 20a, and the output terminal of the top surface of the ECM chip 110 is bonded wire. Electrical connection is made to the input terminal of the RF filter chip 120 through 20b.
  • the output terminal of the RF filter chip 120 is electrically connected to the output electrode metal pattern 15a through a bonding wire 20c.
  • the back of the PCB module is composed of a Vout electrode (output electrode) metal pattern and a GND electrode metal pattern, the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern is a via hole (Via Hole, 18) Connect electrically.
  • the two ECM chips 110, the RF filter chip 120, and the bonding wires 20a, 20b, and 20c may be insulated from the outside and protected from the outside.
  • the molding region 30 including the two chips 110 and 120 and the bonding wires 20a, 20b, and 20c is molded with an epoxy mold compound (EMC).
  • an external high frequency noise signal is induced to the diaphragm 170 of the microphone 100 through the ECM chip 110 and the RF filter chip 120 on the upper surface of the PCB 1 to input the terminal of the ECM chip 110.
  • the GND conductive layer 31 is connected to the upper surface of the molding by connecting the upper surface of the molding with a conductive solution from the GND electrode plating region 13 spaced at a predetermined distance from the molding region 30 to block the transfer to the upper surface of the molding region 30. ).
  • FIG. 9 is a cross-sectional view of a PCB module to which the ECM chip 110 having an adhesive backside as an output electrode and the RF filter chip 120 having a GND electrode with a backing substrate are applied.
  • FIG. 10 is a cross-sectional view of FIG. PCB top view.
  • the metal pattern of the input electrode 17, the output electrode 15, and the GND electrode 16, which are voice signal processing circuits, is wired on the upper surface of the PCB 1 with a minimum distance, and the ECM chip 110 is an ECM chip bonding metal. Bonding to the pattern 19, the RF filter chip 120 is bonded to the GND electrode metal pattern (16a).
  • the input terminal of the bonded upper surface of the ECM chip 110 is connected to the input electrode metal pattern 17b of the upper surface of the PCB through a bonding wire 20d, and the GND terminal of the ECM chip 110 is bonded wire 20e. It is electrically connected to the GND electrode (16b) of the upper surface of the PCB (1) through.
  • the ECM chip bonding metal pattern 19 to which the output electrode of the ECM chip 110 is bonded and the input terminal of the RF filter chip 120 are electrically connected through a bonding wire 20f.
  • the output terminal of the chip 120 is electrically connected to the output electrode metal pattern 15a through the bonding wire 20g.
  • the back surface of the PCB module is composed of a metal pattern of the Vout electrode (output electrode) and a metal electrode of the GND electrode, and the metal pattern of the Vout electrode (output electrode) and the GND electrode metal is a via hole (Via Hole, 18) Connect electrically.
  • a method of molding the ECM chip 110, the RF filter chip 120, and bonding wires 20d, 20e, 20f, and 20g on the upper surface of the PCB 1 and coating a GND conductive film on the upper surface of the molding The method is the same as that described in Example 1.
  • FIG. 11 is a cross-sectional view of a PCB module to which the ECM chip 110 having an adhesive backside as an input electrode and the RF filter chip 120 having an adhesive backside as an output electrode are applied, and FIG. PCB top view.
  • the GND terminal of the top surface of the ECM chip 110 bonded is electrically connected to the GND electrode 16a of the top surface of the PCB 1 through a bonding wire 20h, and the output terminal of the top surface of the ECM chip 110 is bonded wire.
  • An electrical connection is made to an input terminal of the RF filter chip 120 through 20i.
  • the GND terminal of the RF filter chip 120 is electrically connected to the GND electrode metal pattern 16b on the upper surface of the PCB 1 through a bonding wire 20j.
  • the back of the PCB module is composed of a Vout electrode (output electrode) metal pattern and a GND electrode metal pattern, the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern is a via hole (18) in the corresponding metal pattern on the upper surface of the PCB. Electrically connected through
  • the method of molding the ECM chip 110, the RF filter chip 120, and the bonding wires 20h, 20i, and 20j on the upper surface of the PCB 1 and applying a GND conductive film to the upper surface of the molding are performed. Same as the method specified in Example 1.
  • FIG. 13 is a cross-sectional view of a PCB module to which the ECM chip 110 whose adhesive backing is an output electrode and the RF filter chip 120 whose adhesive backing is an output electrode are applied, and FIG. PCB top view.
  • the metal pattern of the input electrode 17, the output electrode 15, and the GND electrode 16, which are voice signal processing circuits, is wired on the upper surface of the PCB 1 with a minimum distance, and the ECM chip 110 is an ECM chip bonding metal. Bonding to the pattern 19, the RF filter chip 120 is bonded to the output electrode metal pattern (15a).
  • the bonded GND terminal of the upper surface of the ECM chip 110 is electrically connected to the GND electrode 16a of the upper surface of the PCB 1 through a bonding wire 20m, and the input terminal of the upper surface of the ECM chip 110 is bonded.
  • the wire 20n is electrically connected to the input electrode metal pattern 17b of the upper surface 1 of the PCB.
  • the ECM chip bonding metal pattern 19 to which the output electrode of the ECM chip 110 is bonded and the input terminal of the RF filter chip 120 are electrically connected through a bonding wire 20p.
  • the GND terminal of the chip 120 is electrically connected to the GND electrode metal pattern 16b on the upper surface of the PCB 1 through the bonding wire 20r.
  • the back of the PCB module is composed of a Vout electrode (output electrode) metal pattern and a GND electrode metal pattern, the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern is a via hole 18 in the corresponding metal pattern on the upper surface of the PCB. Electrically connected through
  • the method of molding the ECM chip 110, the RF filter chip 120, the bonding wire (20m) (20n) (20p) (20r) on the upper surface of the PCB (1) and a GND conductive film on the upper surface of the molding is the same as that described in Example 1.
  • the method of bonding the ECM chip and the RF filter chip on the upper surface of the PCB is preferably formed by one of the epoxy (Epoxy), Eutectic (Eutectic), lead reflow method.
  • the conductive film is formed by using one of AG epoxy spray (Spray), Screen Printing, deposition method.
  • the core technology according to the present invention in the capacitor microphone consisting of a sound unit that changes according to the sound pressure and a circuit unit for receiving and amplifying a signal from the sound unit, in the circuit unit, ECM for amplifying the signal
  • the RF filter chip is used and the wiring length of the voice signal processing circuit is minimized, and the high frequency noise is induced outside and introduced into the input terminal of the ECM chip through the microphone diaphragm. It is characterized in that it comprises a GND conductive film on the upper surface of the molding to block the.
  • the die bonding of the RF filter chip 120 and the ECM chip 110 on the upper surface of the PCB (1) of the voice signal processing circuit By minimizing the wiring length, high frequency noise radiated and coupled can be reduced.
  • the high frequency noise signal introduced from the outside by disposing a GND electrode on the molding upper surface after die bonding is effectively induced to the vibration plate of the microphone to block the high frequency noise signal transmitted to the input terminal of the ECM chip.
  • die bonding is performed on the upper surface of the PCB, molding minimizes the exposure of the ECM chip input terminal on the upper surface of the PCB, and is caused by moisture or resin on the upper surface of the PCB by omitting the SMD process of the ECM chip and other passive devices. It can also reduce the leakage current of the ECM chip.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

The present invention relates to a PCB module for a capacitor microphone, and more particularly, to a PCB module for a capacitor microphone for preventing a high-frequency external noise signal from occurring in the capacitor microphone, including: a sound unit vibrating according to external sound pressure; and a circuit unit receiving a signal from the sound unit to amplify the received signal, wherein the circuit unit includes: an ECM chip including an amplification circuit which amplifies a voltage generated from the sound unit; and an RF filter chip for preventing a high-frequency external noise signal from occurring in the amplifying operation.

Description

커패시터 마이크로폰용 피씨비 모듈PC Module for Capacitor Microphone
본 발명은 커패시터 마이크로폰에 관한 것으로, 더욱 상세하게는 마이크로폰에 유기되는 외부의 고주파 잡음 신호가 ECM 칩에서 증폭된 신호를 차단하기 위한 목적의 RF 필터 칩과 상기 ECM 칩을 음성신호 처리회로의 배선길이를 최소화하기 위한 방안으로 PCB 상면에 다이(Die) 본딩하고, 두 칩과 PCB 상면은 본딩 와이어로 전기적 연결을 하며, 상기 ECM 칩과 상기 RF 필터 칩, 본딩와이어를 포함한 일정영역을 몰딩(Molding) 한 후, 외부로부터 유기된 고주파 잡음 신호가 마이크로폰의 진동판 즉, 상기 ECM 칩의 입력단으로 전달되어 증폭되는 것을 차단하고자 몰딩 상면을 GND 전극으로 도포하는 구조는 갖는 커패시터 마이크로폰 피씨비(PCB) 모듈에 관한 것이다.The present invention relates to a capacitor microphone, and more particularly, an RF filter chip and an ECM chip for the purpose of blocking a signal in which an external high frequency noise signal induced by the microphone is amplified in an ECM chip, and a wiring length of a voice signal processing circuit. Die bonding to the upper surface of the PCB (Die bonding), electrical connection between the two chips and the upper surface of the PCB by a bonding wire, molding a certain area including the ECM chip, the RF filter chip, bonding wires. Afterwards, the structure of applying the upper surface of the molding to the GND electrode to block the high frequency noise signal induced from the outside is transmitted to the vibration plate of the microphone, that is, the input terminal of the ECM chip, has a capacitor microphone PCB module. .
최신 휴대전화는 소형화, 다기능화를 추구하기 위해 탑재되고 있는 부품의 소형, 박막, 경량화를 필요로 하고 있으며, 휴대전화 등 전자 기기의 동영상 녹화 기능이 충실해짐에 따라 마이크로폰의 고음질화에 대한 관심도 높아지고 있는 추세이다.The latest mobile phones require miniaturization, thin film, and light weight of components installed in order to pursue miniaturization and multifunctionality, and as the video recording function of electronic devices such as mobile phones is enhanced, interest in high-quality microphones is also increasing. There is a trend.
이에 따라, 이동통신기기 개발 및 제조 업체들은 현재 공간이 협소하지만 보다 많은 부품들을 추가하고 이를 저렴하게 만들기 위한 연구를 진행하고 있으며, 마이크로폰의 경우도 그 예외가 아니다.Accordingly, mobile communication device developers and manufacturers are currently working to add more components and make them cheaper, although space is limited, and the microphone is no exception.
즉, ECM이 적용되는 마이크로폰의 박막화가 진행될수록 박막화를 위한 PCB 패키지 구조가 요구되며, 휴대폰의 멀티 모드화 추세에 따라 다양한 전기 장치, 특히 안테나가 휴대폰 내부로 탑재되면서 발생되는 외부 고주파 잡음이 마이크로폰에 유입되는 것을 차단하여야 한다.In other words, as the thinning of the microphone to which the ECM is applied increases, the PCB package structure for thinning is required, and according to the multi-mode trend of mobile phones, the external high frequency noise generated when various electric devices, especially antennas, are mounted inside the mobile phones is applied to the microphone. To prevent ingress.
도 1 은 종래 기술에 따른 마이크로폰의 절개 단면도이며, 도 2와 도 3은 종래 기술의 마이크로폰 단면도인 도 1의 구성 회로를 나타낸 것이다.1 is a cutaway cross-sectional view of a microphone according to the prior art, and FIGS. 2 and 3 show the configuration circuit of FIG.
우선 도 1은, 도시된 바와 같이, 일반적으로 마이크로폰(100) 모듈 구성은 진동판(170), 정전필름(180), ECM(110), RF 필터 역할을 하는 수동소자(121)로 이루어진다. 음성신호에 따른 진동판(170)과 백플레이트(190) 및 정전필름(180) 사이의 정전 용량의 변화를 ECM(110)이 전기 신호로 변환하며, RF 필터 역할을 하는 수동소자(121)을 통과하여 마이크로폰의 최종 출력단으로 음성신호를 전달하게 된다. 이때 ECM(110)은 RF 필터역할을 하는 수동소자(121)와 일정거리 이격되어 별도로 위치하여 구성된다.First, as shown in FIG. 1, the microphone 100 module configuration generally includes a diaphragm 170, an electrostatic film 180, an ECM 110, and a passive element 121 serving as an RF filter. The ECM 110 converts the change in capacitance between the diaphragm 170, the back plate 190, and the electrostatic film 180 according to the voice signal into an electric signal, and passes through the passive element 121 serving as an RF filter. The voice signal is transmitted to the final output terminal of the microphone. At this time, the ECM 110 is configured to be separated from the passive element 121, which serves as an RF filter, a predetermined distance apart.
도 1의 마이크로폰 구조에서는 마이크로폰이 장착된 이동통신 단말기가 동작할 때 송신부에서는 대략 수 밀리와트(mW) 내지 수 와트(W)에 이르는 큰 순간 전력의 고주파 신호가 안테나를 통하여 방사되는데, 이 고주파 신호는 상기 마이크로폰(100)과 외부 음성신호 처리 회로의 선로에 유기되어 상기 마이크로폰(100) 내부의 상기 ECM 칩(110)으로 인가된다. 또한, 고주파 잡음 신호는 마이크로폰 내부의 진동판에도 유기되어, 마이크로폰의 박막화로 진동판과 상기 ECM 칩(110)의 거리가 가까워 상기 ECM 칩(110)의 입력단으로 인가되어 증폭된다. In the microphone structure of FIG. 1, when a mobile terminal equipped with a microphone operates, a high frequency signal of a large instantaneous power ranging from several milliwatts (mW) to several watts (W) is radiated through an antenna. Is induced on the line of the microphone 100 and the external voice signal processing circuit and applied to the ECM chip 110 inside the microphone 100. In addition, the high frequency noise signal is also induced in the vibration plate inside the microphone, and the distance between the vibration plate and the ECM chip 110 is shortened and applied to the input terminal of the ECM chip 110 due to the thinning of the microphone.
이때, 상기 ECM(110)에 인가되는 고주파 신호의 크기가 일정 레벨 이상이 되면 비선형적으로 동작하게 되어 고조파(Harmonics wave)와 더불어 피크 인벨로프(Peak envelop)에 해당하는 잡음 성분이 발생하게 되는데, 이 피크 인벨로프(Peak envelop)의 주파수 대역은 대체로 오디오 주파수와 겹쳐있기 때문에 이 신호가 음성 신호와 함께 증폭되어 음성 신호 처리 회로로 들어가 마이크로폰의 가장 큰 잡음이 된다.In this case, when the magnitude of the high frequency signal applied to the ECM 110 is greater than or equal to a predetermined level, the non-linear operation is performed, and a noise component corresponding to the peak envelope is generated along with the harmonics wave. Since the frequency envelope of the peak envelope is largely overlapped with the audio frequency, the signal is amplified with the voice signal and enters the voice signal processing circuit, making it the microphone's loudest noise.
따라서, 이러한 고주파 잡음을 차단시키고 원하는 가청 주파수 대역만을 출력시키기 위한 방법으로, 기존 마이크로폰(100)에서는 패키지된 상기 ECM(110)과 동일한 PCB(160) 상면에 일정 간격 이격되어 하나 이상의 RF 필터 역할을 하는 수동소자(121)를 이용하여 구성하였다.Therefore, as a method for blocking such high frequency noise and outputting only a desired audible frequency band, the existing microphone 100 serves as one or more RF filters by being spaced apart at regular intervals on the same PCB 160 as the packaged ECM 110. It was configured using a passive element 121.
도 2와 도 3는 이 RF 필터역할을 하는 수동소자(121)가 구성된 커패시터 마이크로폰의 회로도이다. 이 RF 필터 역할의 커패시터(C1)(C2)(C3), 저항(R1), 바리스터 등으로 구성되어 있으며, 이 수동소자는 PCB 상면에 금속 패턴으로 각각 연결하여 구성되었다.2 and 3 are circuit diagrams of a capacitor microphone in which a passive element 121 serving as this RF filter is constructed. It consists of capacitors C1 (C2) (C3), resistors (R1), varistors, etc., which act as RF filters. The passive elements are connected to the upper surface of the PCB by metal patterns.
이와 같이 고주파 잡음 신호를 제거하는 방법은 입력된 음성신호의 처리를 위한 회로의 배선이 길어지게 된다. 즉, 음성신호 처리회로는 패키지된 상기 ECM 칩 내부의 리드프레임(Lead Frame)과 본딩 와이어, 그리고 RF 필터 역할을 하기 위한 수동소자가 SMD 되는 상기 PCB 상면의 금속패턴이 이에 속한다. 이처럼, 음성신호 처리회로 배선이 길어 짐에 따라 음성신호는 신호처리 회로에서 방사 및 커플링(Coupling) 되어 제거되지 않은 고주파 잡음 신호 때문에 마이크로폰이 동작할 때 잡음이 발생되었다.As described above, in the method of removing the high frequency noise signal, the wiring of the circuit for processing the input voice signal becomes long. That is, the voice signal processing circuit includes a lead frame and a bonding wire inside the packaged ECM chip, and a metal pattern on the upper surface of the PCB on which a passive element for acting as an RF filter is SMD. As such, as the length of the audio signal processing circuit becomes longer, the noise is generated when the microphone is operated because of the high frequency noise signal which is radiated and coupled in the signal processing circuit and not removed.
또한, 도 4와 도 5는 종래기술에서 본딩와이어 PCB가 적용된 커패시터 마이크로폰의 단면을 간략하게 나타낸 단면도이다.4 and 5 are cross-sectional views schematically illustrating a cross section of a capacitor microphone to which a bonding wire PCB is applied in the prior art.
먼저, 도 4는 도시화된 바와 같이 커패시터 마이크로폰(210)은 PCB 기판(200)에 회로패턴(220)하고, PCB 기판(200)에 회로소자(230)를 본딩한다. 이때, 회로소자(230)와 회로패턴(220)은 와이어(240)에 의해 전기적으로 연결한다. 이와 같이 와이어(240)에 의해 회로소자(230)과 회로패턴(220)이 연결되면, 회로소자(230)와 와이어(240)를 감싸도록 에폭시 레진(290)을 이용하여 갭슐화(Encapsulation)하는 구조를 갖는다. 여기서, 도면 부호 39는 음파 유입구이다.First, as shown in FIG. 4, the capacitor microphone 210 bonds the circuit pattern 220 to the PCB substrate 200 and bonds the circuit element 230 to the PCB substrate 200. In this case, the circuit element 230 and the circuit pattern 220 are electrically connected by the wire 240. As such, when the circuit device 230 and the circuit pattern 220 are connected by the wire 240, the encapsulation is performed by using the epoxy resin 290 to surround the circuit device 230 and the wire 240. Has a structure. Here, reference numeral 39 denotes a sound wave inlet.
또한, 도 5는 커패시터 마이크로폰 케이스(38) 내부의 PCB 기판(41)위에 도전성 물질로 회로를 배선하고, 상기 PCB 기판(41)위에 접합되어 정전용량의 변화에 따른 전위변화를 전기신호로 정합 및 증폭하는 ECM과 커패시터 등을 포함하는 정합 및 증폭회로 칩(32)을 본딩한 후 상기 정합 및 증폭회로 칩(32)을 PCB 기판(41)에 몰딩하는 구조를 갖는다.FIG. 5 also wires a circuit with a conductive material on the PCB substrate 41 inside the capacitor microphone case 38 and is bonded on the PCB substrate 41 to match the potential change according to the change in capacitance with an electrical signal. After bonding the matching and amplifying circuit chip 32 including the ECM and the capacitor to amplify, the matching and amplifying circuit chip 32 is molded on the PCB substrate 41.
이처럼, 도 4와 도 5의 구조는 마이크로폰의 음성신호 처리회로의 배선길이를 고려하지 않은 구조로 제조비용 개선 및 SMD 공정 생략에 의한 수율 향상, 접촉저항에 의한 노이즈 제거, 단자 단선불량 개선에 목적을 두고 있어 고주파 잡음 신호가 방사 및 커플링되어 마이크로폰이 동작될 때 잡음이 발생하게 된다. As described above, the structures of FIGS. 4 and 5 do not consider the wiring length of the voice signal processing circuit of the microphone, and thus are aimed at improving the manufacturing cost, improving the yield by omitting SMD process, removing noise by contact resistance, and improving terminal disconnection. The high frequency noise signal is radiated and coupled to generate noise when the microphone is operated.
또한, 마이크로폰의 소형화, 박막화로 인하여 외부로부터 유입된 고주파 잡음 신호가 상기 ECM 칩과 가까운 거리에 위치하고 있는 상기 ECM 칩의 입력단인 마이크로폰의 진동판으로 유기된다. 이때 유기된 고주파 잡음 신호는 상기 ECM 칩의 입력단으로 전달된 고주파 잡음 신호는 상기 ECM 칩을 통해 증폭되어 마이크로폰이 동작할 때 잡음문제를 발생한다.In addition, due to the miniaturization and thinning of the microphone, a high frequency noise signal introduced from the outside is induced to the vibration plate of the microphone, which is an input terminal of the ECM chip located at a close distance to the ECM chip. At this time, the induced high frequency noise signal is transmitted to the input terminal of the ECM chip is amplified through the ECM chip, causing a noise problem when the microphone is operated.
본 발명은 상기와 같은 종래 마이크로폰에서 발생되는 고주파 잡음 신호 발생의 문제 즉, ECM 칩과 RF 필터 역할을 하는 수동소자가 패키지 형태로 PCB 상면에 SMD되면서 발생된 음성신호 처리회로 길이의 배선이 길어져 회로배선에 의해 고주파 잡음 신호가 방사 및 커플링되어 발생되는 고주파 잡음문제를 해결하는데 주 목적이 있다.The present invention is a problem of generating a high frequency noise signal generated in the conventional microphone as described above, that is, the circuit of the length of the voice signal processing circuit generated while the passive element acting as an ECM chip and the RF filter in the form of a package SMD on the PCB The main purpose is to solve the high frequency noise problem caused by the radiation and coupling of high frequency noise signal by wiring.
또한 마이크로폰의 소형화, 박막화로 외부에서 유기된 고주파 잡음 신호가 상기 ECM 칩과 가까운 거리에 위치하고 있는 ECM 칩의 입력단인 마이크로폰의 진동판으로 유기되어, 고주파 잡음 신호가 ECM 칩의 입력단으로 전달되어 ECM 칩을 통해 증폭되면서 마이크로폰이 동작할 때 발생하는 잡음 문제를 해결하고자 하는 데 또 다른 목적이 있다.In addition, due to the miniaturization and thinning of the microphone, the externally induced high frequency noise signal is induced to the diaphragm of the microphone, which is an input terminal of the ECM chip located close to the ECM chip, and the high frequency noise signal is transmitted to the input terminal of the ECM chip. Another goal is to solve the noise problem that occurs when the microphone is operating while being amplified.
상기한 종래 문제점을 해결하고 상기 기술적 과제를 달성하기 위한 본 발명에 따른 커패시터 마이크로폰 피씨비(PCB) 모듈은, The capacitor microphone PCB module according to the present invention for solving the above-described conventional problems and to achieve the technical problem,
외부 음압에 따라 진동하는 음향부와, 상기 음향부에서 신호를 입력 받아서 이를 증폭하기 위한 회로부로 구성되는 커패시터 마이크로폰용 PCB 모듈에 있어서,In the PCB module for a capacitor microphone comprising a sound unit vibrating according to an external sound pressure, and a circuit unit for receiving a signal from the sound unit and amplifying it,
상기 회로부는,The circuit portion,
상기 음향부에서 발생한 전압을 증폭하기 위한 증폭 회로를 포함하는 ECM 칩과; An ECM chip including an amplifier circuit for amplifying the voltage generated by the sound unit;
상기 증폭 과정에서 수반되는 고주파 외부 잡음 신호 차단의 RF 필터 칩;으로 구성되되,RF filter chip for blocking the high frequency external noise signal involved in the amplification process;
상기 ECM 칩과 상기 RF 필터 칩을 음성신호 처리회로의 배선길이를 최소화하여 외부로부터 유입되는 고주파 잡음의 방사 및 커플링되는 것을 줄일 수 있도록 PCB 상면의 칩 형태로 본딩하고, Bonding the ECM chip and the RF filter chip in the form of a chip on the upper surface of the PCB so as to minimize the wire length of the voice signal processing circuit to reduce the radiation and coupling of high frequency noise from the outside,
상기 PCB 상면에 상기 ECM 칩과 상기 RF 필터 칩의 절연 및 외부로부터 보호하기 위해 몰딩(Molding)하고, 외부에서 유입된 고주파 잡음이 상기 PCB 상면의 상기 ECM 칩과 상기 RF 필터칩을 통해서 마이크로폰의 진동판으로 유기되어 상기 ECM 칩의 입력단에 전달되는 고주파 잡음을 차단하기 위해 상기 몰딩(Molding) 상면에 GND 도전막을 배치하는 것을 특징으로 한다.Molding on the upper surface of the PCB to protect the insulation and the outside of the ECM chip and the RF filter chip, and the high frequency noise introduced from the outside of the vibration plate of the microphone through the ECM chip and the RF filter chip on the PCB And a GND conductive layer on the upper surface of the molding to block the high frequency noise that is induced and transferred to the input terminal of the ECM chip.
본 발명에서 상기 PCB 상면의 패턴은 입력전극 금속패턴, 출력전극 금속패턴, GND 전극 금속패턴으로 구성되고, 상기 ECM 칩의 접착배면(substrate)이 입력전극일 때 상기 ECM 칩을 입력전극 금속패턴에 본딩하며, 상기 RF 필터 칩은 GND 전극 금속패턴에 본딩하는 것을 특징으로 한다.In the present invention, the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and when the adhesive backing (substrate) of the ECM chip is an input electrode, the ECM chip is connected to the input electrode metal pattern. Bonding, wherein the RF filter chip is bonded to the GND electrode metal pattern.
본 발명에서 상기 PCB 상면의 패턴은 입력전극 금속패턴, 출력전극 금속패턴, GND 전극 금속패턴, ECM 칩 본딩용 금속패턴으로 구성되고, 상기 ECM 칩의 접착배면(substrate)이 출력전극일 때 상기 ECM 칩을 ECM 칩 본딩용 금속패턴에 본딩하며, 상기 RF 필터 칩은 GND 전극 금속패턴에 본딩하는 것을 특징으로 한다.In the present invention, the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and an ECM chip bonding metal pattern, and the ECM chip has an adhesive electrode when the substrate is an output electrode. The chip is bonded to the metal pattern for ECM chip bonding, and the RF filter chip is bonded to the GND electrode metal pattern.
본 발명에서 상기 PCB 상면의 패턴은 입력전극 금속패턴, 출력전극 금속패턴, GND 전극 금속패턴으로 구성되고, 상기 ECM 칩의 접착배면(substrate)이 입력전극일 때 상기 ECM 칩을 입력전극 금속패턴에 본딩하며, 상기 RF 필터 칩은 상기 PCB 상면의 출력전극 금속패턴에 본딩하는 것을 특징으로 한다.In the present invention, the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and when the adhesive backing (substrate) of the ECM chip is an input electrode, the ECM chip is connected to the input electrode metal pattern. Bonding, wherein the RF filter chip is bonded to the output electrode metal pattern of the upper surface of the PCB.
본 발명에서 상기 PCB 상면의 패턴은 입력전극 금속패턴, 출력전극 금속패턴, GND 전극 금속패턴, ECM 칩 본딩용 금속패턴으로 구성되고, 상기 ECM 칩의 접착배면(substrate)이 출력전극일 때 상기 ECM 칩을 ECM 칩 본딩용 금속패턴에 본딩하며, 상기 RF 필터 칩은 상기 PCB 상면의 출력전극 금속패턴에 본딩하는 것을 특징으로 한다.In the present invention, the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and an ECM chip bonding metal pattern, and the ECM chip has an adhesive electrode when the substrate is an output electrode. The chip is bonded to the metal pattern for ECM chip bonding, and the RF filter chip is bonded to the output electrode metal pattern on the upper surface of the PCB.
본 발명에서 본딩된 상기 ECM 칩 상면의 GND 단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극에 전기적으로 연결하며, 상기 ECM 칩 상면의 출력단자는 본딩와이어를 통해 상기 RF 필터 칩의 입력단자로 전기적인 연결을 하고, 상기 RF 필터 칩의 출력단자는 본딩와이어를 통해 출력전극 금속패턴에 전기적으로 연결하며, PCB 모듈 배면의 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(Via Hole)을 통하여 전기적으로 연결하는 것을 특징으로 한다.The GND terminal of the upper surface of the ECM chip bonded in the present invention is electrically connected to the GND electrode of the upper surface of the PCB through a bonding wire, and the output terminal of the upper surface of the ECM chip is electrically connected to the input terminal of the RF filter chip through a bonding wire. The output terminal of the RF filter chip is electrically connected to the output electrode metal pattern through a bonding wire, and the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern on the back of the PCB module are connected to the corresponding metal pattern on the upper surface of the PCB. It is characterized in that the electrical connection through the via hole (Via Hole).
본 발명에서 본딩된 상기 ECM 칩 상면의 입력 단자는 본딩와이어를 통해 상기 PCB 상면의 입력전극 금속패턴에 연결하며, 상기 ECM 칩의 GND단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극에 전기적으로 연결하고, 상기 ECM 칩의 출력전극이 본딩된 ECM칩 본딩용 금속패턴과 상기 RF 필터칩의 입력단자는 본딩와이어를 통하여 전기적으로 연결하며, 상기 RF 필터 칩의 출력단자는 본딩와이어를 통해 출력전극 금속패턴에 전기적으로 연결하고, PCB 모듈 배면의 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(Via Hole)을 통하여 전기적으로 연결하는 것을 특징으로 한다.The input terminal of the upper surface of the ECM chip bonded in the present invention is connected to the input electrode metal pattern of the upper surface of the PCB through bonding wires, and the GND terminal of the ECM chip is electrically connected to the GND electrode of the upper surface of the PCB through bonding wires. The ECM chip bonding metal pattern, to which the output electrode of the ECM chip is bonded, and the input terminal of the RF filter chip are electrically connected through bonding wires, and the output terminal of the RF filter chip is connected to the output electrode metal pattern through bonding wires. And the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern on the back of the PCB module are electrically connected to each other through a via hole in the corresponding metal pattern on the upper surface of the PCB.
본 발명에서 본딩된 상기 ECM 칩 상면의 GND 단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극에 전기적으로 연결하며, 상기 ECM 칩 상면의 출력단자는 본딩와이어를 통해 상기 RF 필터 칩의 입력단자로 전기적으로 연결하고, 상기 RF 필터 칩의 GND 단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극 금속패턴에 전기적으로 연결하며, PCB 모듈 배면의 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(Via Hole)을 통하여 전기적으로 연결하는 것을 특징으로 한다.The GND terminal of the upper surface of the ECM chip bonded in the present invention is electrically connected to the GND electrode of the upper surface of the PCB through a bonding wire, and the output terminal of the upper surface of the ECM chip is electrically connected to an input terminal of the RF filter chip through a bonding wire. The GND terminal of the RF filter chip is electrically connected to the GND electrode metal pattern of the upper surface of the PCB through bonding wires, and the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern of the PCB module are connected to the upper surface of the PCB. The metal pattern may be electrically connected through a via hole.
본 발명에서 본딩된 상기 ECM 칩 상면의 GND 단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극에 전기적으로 연결하며, 상기 ECM 칩 상면의 입력단자는 본딩와이어를 통해 상기 PCB 상면의 입력전극 금속패턴에 전기적으로 연결하고, 상기 ECM 칩의 출력전극이 본딩된 ECM 칩 본딩용 금속패턴과 상기 RF 필터 칩의 입력단자는 본딩와이어를 통하여 전기적으로 연결하며, 상기 RF 필터 칩의 GND 단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극 금속패턴에 전기적으로 연결하고, PCB 모듈 배면의 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(Via Hole)을 통하여 전기적으로 연결하는 것을 특징으로 한다.The GND terminal of the upper surface of the ECM chip bonded in the present invention is electrically connected to the GND electrode of the upper surface of the PCB through bonding wires, and the input terminal of the upper surface of the ECM chip is connected to the input electrode metal pattern of the upper surface of the PCB through bonding wires. It is electrically connected, and the ECM chip bonding metal pattern in which the output electrode of the ECM chip is bonded and the input terminal of the RF filter chip are electrically connected through a bonding wire, and the GND terminal of the RF filter chip is connected through a bonding wire. The GND electrode metal pattern on the upper surface of the PCB is electrically connected, and the Vout electrode (output electrode) metal pattern on the back of the PCB module and the GND electrode metal pattern are electrically connected through via holes in the corresponding metal pattern on the upper surface of the PCB. Characterized in that.
이와 같이 구성된 본 발명에 따르면, 마이크로폰의 사용 중에 유기되는 고주파 잡음 신호를 RF 필터 칩을 적용하여 제거하며, 인쇄회로기판에 RF 필터 칩과 ECM 칩을 직접 다이(Die) 본딩하는 방식으로 음성신호 처리회로의 배선 길이를 최소화하여 방사 및 커플링되는 고주파 잡음을 줄일 수 있다.According to the present invention configured as described above, a high frequency noise signal induced during use of a microphone is removed by applying an RF filter chip, and voice signal processing is performed by directly bonding an RF filter chip and an ECM chip to a printed circuit board. The wiring length of the circuit can be minimized to reduce high frequency noise radiated and coupled.
또한, 다이(Die) 본딩 후 몰딩 상면에 GND 전극을 배치하여 외부에서 유기된 고주파 잡음 신호가 마이크로폰의 진동판, 즉 ECM 칩의 입력단으로 전달되어 증폭되는 것을 차단하여 마이크로폰의 고음질 음성통화 또는 동영상 녹음에 효과가 있다.Also, after die bonding, the GND electrode is placed on the upper surface of the molding to block the high frequency noise signal generated from outside from being amplified by being transmitted to the microphone's diaphragm, that is, the input terminal of the ECM chip. It works.
또한, 상기 PCB 상면의 다이(Die) 본딩 및 몰딩으로 상기 PCB 상면에서 ECM 칩의 입력 단 노출은 최소화되며, ECM 칩 및 기타 수동소자의 SMD 공정의 생략으로 상기 PCB 상면에서 습기나 레진(Resin) 등에 의해 발생될 수 있는 ECM 칩의 누설전류(Leakage Current)를 줄이는 효과도 얻을 수 있다.In addition, the die bonding and molding of the upper surface of the PCB minimizes the exposure of the input stage of the ECM chip on the upper surface of the PCB, and the moisture or resin on the upper surface of the PCB due to the elimination of the SMD process of the ECM chip and other passive devices. It is also possible to obtain an effect of reducing the leakage current of the ECM chip, which may be generated by the method.
도 1은 종래 기술에 따른 커패시터 마이크로폰의 절개단면도이다.1 is a cutaway sectional view of a capacitor microphone according to the prior art.
도 2는 종래 기술의 커패시터 마이크로폰 회로도이다.2 is a circuit diagram of a capacitor microphone of the prior art.
도 3은 종래 기술의 커패시터 마이크로폰 회로도이다.3 is a circuit diagram of a capacitor microphone of the prior art.
도 4는 종래 기술의 와이어본딩 PCB가 적용된 커패시터 마이크로폰 단면도이다.4 is a cross-sectional view of a capacitor microphone to which a wire bonding PCB of the prior art is applied.
도 5는 종래 기술의 와이어본딩 PCB가 적용된 커패시터 마이크로폰 단면도이다.5 is a cross-sectional view of a capacitor microphone to which a wire bonding PCB of the prior art is applied.
도 6은 본 발명이 적용된 커패시터 마이크로폰 회로도이다.6 is a circuit diagram of a capacitor microphone to which the present invention is applied.
도 7은 본 발명에 의한 제 1 실시예의 PCB 모듈 절개 단면도이다.7 is a cross-sectional view of the PCB module cut-out of the first embodiment according to the present invention.
도 8은 도 7의 PCB 평면도이다.8 is a plan view of the PCB of FIG.
도 9는 본 발명에 의한 제 2 실시예의 PCB 모듈 절개 단면도이다.9 is a cross-sectional view of a PCB module cut in a second embodiment according to the present invention.
도 10은 도 9의 PCB 평면도이다.10 is a plan view of the PCB of FIG.
도 11은 본 발명에 의한 제 3 실시예의 PCB 모듈 절개 단면도이다.11 is a cross-sectional view of a PCB module cut in a third embodiment according to the present invention.
도 12는 도 11의 PCB 평면도이다.12 is a plan view of the PCB of FIG.
도 13은 본 발명에 의한 제 4 실시예의 PCB 모듈 절개 단면도이다.Fig. 13 is a sectional view of a PCB module cut in a fourth embodiment according to the present invention.
도 14는 도 13의 PCB 평면도이다.14 is a plan view of the PCB of FIG.
<부호의 설명><Description of the code>
1 : 인쇄회로기판 10 : 음성신호처리 금속패턴1: printed circuit board 10: voice signal processing metal pattern
13 : 몰딩 상면 GND 전극 도포용 GND 도금영역 13: GND plating area for coating GND electrode on top of molding
20 : 본딩 와이어 30 : 몰딩(Molding) 영역 20: bonding wire 30: molding area
31 : GND 도전막 110 : ECM 칩31: GND conductive film 110: ECM chip
120 : RF 필터 칩 120: RF filter chip
상기와 같은 목적을 달성하기 위해 안출된 본 발명의 구성을, 첨부되는 도면을 참조하여 상세하게 설명하면 다음과 같다. 도 6은 본 발명이 적용된 커패시터 마이크로폰 회로도, 도 7은 본 발명에 의한 제 1 실시 예의 PCB 모듈 절개 단면도, 도 8은 도 7의 PCB 평면도, 도 9 는 본 발명에 의한 제 2 실시 예의 PCB 모듈 절개 단면도, 도 10은 도 9의 PCB 평면도, 도 11 은 본 발명에 의한 제 3 실시 예의 PCB 모듈 절개 단면도, 도 12는 도 11의 PCB 평면도, 도 13 은 본 발명에 의한 제 4 실시 예의 PCB 모듈 절개 단면도, 도 14는 도 13의 PCB 평면도이다.When described in detail with reference to the accompanying drawings, the configuration of the present invention devised to achieve the above object is as follows. 6 is a circuit diagram of a capacitor microphone according to the present invention, FIG. 7 is a cross-sectional view of a PCB module according to a first embodiment of the present invention, FIG. 8 is a PCB plan view of FIG. 7, and FIG. 9 is a PCB module cut of a second embodiment according to the present invention. Fig. 10 is a plan view of the PCB of Fig. 9, Fig. 11 is a sectional view of the PCB module of the third embodiment according to the present invention, Fig. 12 is a plan view of the PCB of Fig. 11, Fig. 13 is a PCB module cut of the fourth embodiment according to the present invention. 14 is a plan view of the PCB of FIG.
도 6은 본 발명에 의해 구성된 회로도이다.6 is a circuit diagram constructed according to the present invention.
도 6에 도시된 바와 같이, 외부 음압에 따라 진동하는 음향부와, 상기 음향부에서 신호를 입력받아 이를 증폭하기 위한 회로부로 구성되는 커패시터 마이크로폰에 있어서, 상기 회로부는 상기 음향부에서 발생한 전압을 증폭하기 위한 증폭회로를 포함하는 ECM 칩(110)과, 상기 증폭 과정에서 수반되는 외부 고주파 잡음 신호를 차단하는 목적으로 커패시터(C4)(C5)와, 저항(R2)으로 구성된 RF 필터 칩(120)을 사용한다.As shown in FIG. 6, in a capacitor microphone including a sound unit vibrating according to an external sound pressure and a circuit unit for receiving a signal from the sound unit and amplifying the signal, the circuit unit amplifies a voltage generated in the sound unit. An RF filter chip 120 including an ECM chip 110 including an amplification circuit, a capacitor C4, C5, and a resistor R2 for blocking an external high frequency noise signal accompanying the amplification process. Use
이하에서는 본 발명에 따른 바람직한 실시 예를 첨부된 도면을 참조하여 상세하게 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[실시 예 1]Example 1
도 7은, 접착배면(substrate)이 입력전극인 상기 ECM 칩(110)과 접착배면(substrate)이 GND 전극인 상기 RF 필터 칩(120)이 적용된 PCB 모듈의 단면도이고, 도 8은 도 7의 PCB 평면도이다. FIG. 7 is a cross-sectional view of a PCB module to which the ECM chip 110 whose adhesive backing is an input electrode and the RF filter chip 120 whose adhesive backing is a GND electrode are applied, and FIG. PCB top view.
상기 PCB(1) 상면에 음성신호 처리회로인 입력전극(17), 출력전극(15), GND 전극(16) 금속패턴을 최소간격으로 배선하며, 상기 ECM칩(110)은 입력전극 금속패턴(17a)에 본딩하고, 상기 RF 필터칩(120)은 GND 전극 금속패턴(16a)에 본딩한다. 본딩된 상기 ECM 칩(110) 상면의 GND 단자는 본딩와이어(20a)를 통해 상기 PCB(1) 상면의 GND 전극(16b)에 전기적으로 연결하며, 상기 ECM 칩(110) 상면의 출력단자는 본딩와이어(20b)를 통해 상기 RF 필터 칩(120)의 입력단자로 전기적인 연결을 한다. The metal pattern of the input electrode 17, the output electrode 15, and the GND electrode 16, which is a voice signal processing circuit, is wired on the upper surface of the PCB 1 with a minimum distance, and the ECM chip 110 includes the input electrode metal pattern ( 17A), the RF filter chip 120 is bonded to the GND electrode metal pattern 16a. The GND terminal of the top surface of the ECM chip 110 bonded is electrically connected to the GND electrode 16b of the top surface of the PCB 1 through a bonding wire 20a, and the output terminal of the top surface of the ECM chip 110 is bonded wire. Electrical connection is made to the input terminal of the RF filter chip 120 through 20b.
또한 상기 RF 필터 칩(120)의 출력단자는 본딩와이어(20c)을 통해 출력전극 금속패턴(15a)에 전기적으로 연결한다.In addition, the output terminal of the RF filter chip 120 is electrically connected to the output electrode metal pattern 15a through a bonding wire 20c.
이때, PCB 모듈 배면은 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴으로 구성되며, Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(Via Hole,18)을 통하여 전기적으로 연결한다.At this time, the back of the PCB module is composed of a Vout electrode (output electrode) metal pattern and a GND electrode metal pattern, the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern is a via hole (Via Hole, 18) Connect electrically.
또한, 본딩된 상기 ECM 칩(110)과 상기 RF 필터 칩(120), 본딩와이어 (20a)(20b)(20c)를 외부로부터 절연하고, 보호하기 위한 목적으로 상기 PCB(1) 상면에서 상기 두 개의 칩(110)(120)과 본딩 와이어(20a)(20b)(20c)가 포함된 몰딩(Molding) 영역(30)을 화학수지(EMC: Epoxy Mold Compound)로 몰딩한다.In addition, the two ECM chips 110, the RF filter chip 120, and the bonding wires 20a, 20b, and 20c may be insulated from the outside and protected from the outside. The molding region 30 including the two chips 110 and 120 and the bonding wires 20a, 20b, and 20c is molded with an epoxy mold compound (EMC).
그리고, 외부 고주파 잡음 신호가 상기 PCB(1) 상면의 상기 ECM 칩(110)과 상기 RF 필터 칩(120)을 통해서 마이크로폰(100)의 진동판(170)으로 유기되어 상기 ECM 칩(110)의 입력단에 전달되는 것을 차단하기 위해 몰딩(Molding) 영역(30)에서 일정간격 이격되어 있는 GND 전극 도금영역(13)에서부터 도전성 용액을 매개체로 하여 상기 몰딩 상면과 연결하여 상기 몰딩 상면에 GND 도전막(31)을 배치한다.In addition, an external high frequency noise signal is induced to the diaphragm 170 of the microphone 100 through the ECM chip 110 and the RF filter chip 120 on the upper surface of the PCB 1 to input the terminal of the ECM chip 110. The GND conductive layer 31 is connected to the upper surface of the molding by connecting the upper surface of the molding with a conductive solution from the GND electrode plating region 13 spaced at a predetermined distance from the molding region 30 to block the transfer to the upper surface of the molding region 30. ).
[실시예 2]Example 2
도 9는, 접착배면(substrate)이 출력전극인 상기 ECM 칩(110)과 접착배면(substrate)이 GND 전극인 상기 RF 필터 칩(120)이 적용된 PCB 모듈의 단면도이고, 도 10은 도 9의 PCB 평면도이다. FIG. 9 is a cross-sectional view of a PCB module to which the ECM chip 110 having an adhesive backside as an output electrode and the RF filter chip 120 having a GND electrode with a backing substrate are applied. FIG. 10 is a cross-sectional view of FIG. PCB top view.
상기 PCB(1) 상면에 음성신호 처리회로인 입력전극(17), 출력전극(15), GND 전극(16) 금속패턴을 최소간격으로 배선하며, 상기 ECM칩(110)은 ECM칩 본딩용 금속패턴(19)에 본딩하고, 상기 RF 필터칩(120)은 GND 전극 금속패턴(16a)에 본딩한다. 본딩된 상기 ECM 칩(110) 상면의 입력단자는 본딩와이어(20d)를 통해 상기 PCB 상면의 입력전극 금속패턴(17b)에 연결하며, 상기 ECM 칩(110)의 GND단자는 본딩와이어(20e)를 통해 상기 PCB(1) 상면의 GND 전극(16b)에 전기적으로 연결한다. 또한, 상기 ECM 칩(110)의 출력전극이 본딩된 ECM칩 본딩용 금속패턴(19)과 상기 RF 필터칩(120)의 입력단자는 본딩와이어(20f)를 통하여 전기적으로 연결하며, 상기 RF 필터 칩(120)의 출력단자는 본딩와이어(20g)를 통해 출력전극 금속패턴(15a)에 전기적으로 연결한다. The metal pattern of the input electrode 17, the output electrode 15, and the GND electrode 16, which are voice signal processing circuits, is wired on the upper surface of the PCB 1 with a minimum distance, and the ECM chip 110 is an ECM chip bonding metal. Bonding to the pattern 19, the RF filter chip 120 is bonded to the GND electrode metal pattern (16a). The input terminal of the bonded upper surface of the ECM chip 110 is connected to the input electrode metal pattern 17b of the upper surface of the PCB through a bonding wire 20d, and the GND terminal of the ECM chip 110 is bonded wire 20e. It is electrically connected to the GND electrode (16b) of the upper surface of the PCB (1) through. In addition, the ECM chip bonding metal pattern 19 to which the output electrode of the ECM chip 110 is bonded and the input terminal of the RF filter chip 120 are electrically connected through a bonding wire 20f. The output terminal of the chip 120 is electrically connected to the output electrode metal pattern 15a through the bonding wire 20g.
이때, PCB 모듈 배면은 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴으로 구성되며, Vout전극 (출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(Via Hole,18)을 통하여 전기적으로 연결한다.At this time, the back surface of the PCB module is composed of a metal pattern of the Vout electrode (output electrode) and a metal electrode of the GND electrode, and the metal pattern of the Vout electrode (output electrode) and the GND electrode metal is a via hole (Via Hole, 18) Connect electrically.
상기 ECM 칩(110), 상기 RF 필터칩(120), 본딩와이어(20d)(20e)(20f)(20g)를 상기 PCB(1) 상면에서 몰딩하는 방법과 상기 몰딩 상면에 GND 도전막을 도포하는 방법은 실시 예 1에 명시된 방법과 동일하다.A method of molding the ECM chip 110, the RF filter chip 120, and bonding wires 20d, 20e, 20f, and 20g on the upper surface of the PCB 1 and coating a GND conductive film on the upper surface of the molding The method is the same as that described in Example 1.
[실시예 3]Example 3
도 11은, 접착배면(substrate)이 입력전극인 상기 ECM 칩(110)과 접착배면(substrate)이 출력전극인 상기 RF 필터 칩(120)이 적용된 PCB 모듈의 단면도이고, 도 12는 도 11의 PCB 평면도이다. FIG. 11 is a cross-sectional view of a PCB module to which the ECM chip 110 having an adhesive backside as an input electrode and the RF filter chip 120 having an adhesive backside as an output electrode are applied, and FIG. PCB top view.
상기 PCB(1) 상면에 음성신호 처리회로인 입력전극(17), 출력전극(15), GND 전극(16) 금속 패턴을 최소간격으로 배선하며, 상기 ECM칩(110)은 입력전극 금속패턴(17a)에 본딩하고, 상기 RF 필터칩(120)은 출력전극 금속패턴(15a)에 본딩한다. 본딩된 상기 ECM 칩(110) 상면의 GND 단자는 본딩와이어(20h)를 통해 상기 PCB(1) 상면의 GND 전극(16a)에 전기적으로 연결하며, 상기 ECM 칩(110) 상면의 출력단자는 본딩와이어(20i)를 통해 상기 RF 필터 칩(120)의 입력단자로 전기적 연결을 한다. The metal pattern of the input electrode 17, the output electrode 15, and the GND electrode 16, which is a voice signal processing circuit, is wired on the upper surface of the PCB 1 with a minimum distance, and the ECM chip 110 includes the input electrode metal pattern ( 17A), the RF filter chip 120 is bonded to the output electrode metal pattern 15a. The GND terminal of the top surface of the ECM chip 110 bonded is electrically connected to the GND electrode 16a of the top surface of the PCB 1 through a bonding wire 20h, and the output terminal of the top surface of the ECM chip 110 is bonded wire. An electrical connection is made to an input terminal of the RF filter chip 120 through 20i.
또한 상기 RF 필터 칩(120)의 GND 단자는 본딩와이어(20j)을 통해 상기 PCB(1) 상면의 GND 전극 금속패턴(16b)에 전기적으로 연결한다. 이때, PCB 모듈 배면은 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴으로 구성되며, Vout전극 (출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(18)을 통하여 전기적으로 연결한다.In addition, the GND terminal of the RF filter chip 120 is electrically connected to the GND electrode metal pattern 16b on the upper surface of the PCB 1 through a bonding wire 20j. At this time, the back of the PCB module is composed of a Vout electrode (output electrode) metal pattern and a GND electrode metal pattern, the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern is a via hole (18) in the corresponding metal pattern on the upper surface of the PCB. Electrically connected through
상기 ECM 칩(110), 상기 RF 필터칩(120), 본딩와이어(20h)(20i)(20j)를 상기 PCB(1) 상면에서 몰딩하는 방법과 상기 몰딩 상면에 GND 도전막을 도포하는 방법은 실시 예 1에 명시된 방법과 동일하다.The method of molding the ECM chip 110, the RF filter chip 120, and the bonding wires 20h, 20i, and 20j on the upper surface of the PCB 1 and applying a GND conductive film to the upper surface of the molding are performed. Same as the method specified in Example 1.
[실시예 4]Example 4
도 13은, 접착배면(substrate)이 출력전극인 상기 ECM 칩(110)과 접착배면(substrate)이 출력전극인 상기 RF 필터 칩(120)이 적용된 PCB 모듈의 단면도이고, 도 14는 도 13의 PCB 평면도이다. FIG. 13 is a cross-sectional view of a PCB module to which the ECM chip 110 whose adhesive backing is an output electrode and the RF filter chip 120 whose adhesive backing is an output electrode are applied, and FIG. PCB top view.
상기 PCB(1) 상면에 음성신호 처리회로인 입력전극(17), 출력전극(15), GND 전극(16) 금속패턴을 최소간격으로 배선하며, 상기 ECM칩(110)은 ECM칩 본딩용 금속패턴(19)에 본딩하고, 상기 RF 필터칩(120)은 출력전극 금속패턴(15a)에 본딩한다. 본딩된 상기 ECM 칩(110) 상면의 GND 단자는 본딩와이어(20m)를 통해 상기 PCB(1) 상면의 GND 전극(16a)에 전기적으로 연결하며, 상기 ECM 칩(110) 상면의 입력단자는 본딩와이어(20n)를 통해 상기 PCB 상면(1)의 입력전극 금속패턴(17b)에 전기적으로 연결된다. 또한, 상기 ECM 칩(110)의 출력전극이 본딩된 ECM칩 본딩용 금속패턴(19)과 상기 RF 필터칩(120)의 입력단자는 본딩와이어(20p)를 통하여 전기적으로 연결하며, 상기 RF 필터 칩(120)의 GND단자는 본딩와이어(20r)를 통해 상기 PCB(1) 상면의 GND 전극 금속패턴(16b)에 전기적으로 연결한다. 이때, PCB 모듈 배면은 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴으로 구성되며, Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(18)을 통하여 전기적으로 연결한다.The metal pattern of the input electrode 17, the output electrode 15, and the GND electrode 16, which are voice signal processing circuits, is wired on the upper surface of the PCB 1 with a minimum distance, and the ECM chip 110 is an ECM chip bonding metal. Bonding to the pattern 19, the RF filter chip 120 is bonded to the output electrode metal pattern (15a). The bonded GND terminal of the upper surface of the ECM chip 110 is electrically connected to the GND electrode 16a of the upper surface of the PCB 1 through a bonding wire 20m, and the input terminal of the upper surface of the ECM chip 110 is bonded. The wire 20n is electrically connected to the input electrode metal pattern 17b of the upper surface 1 of the PCB. In addition, the ECM chip bonding metal pattern 19 to which the output electrode of the ECM chip 110 is bonded and the input terminal of the RF filter chip 120 are electrically connected through a bonding wire 20p. The GND terminal of the chip 120 is electrically connected to the GND electrode metal pattern 16b on the upper surface of the PCB 1 through the bonding wire 20r. At this time, the back of the PCB module is composed of a Vout electrode (output electrode) metal pattern and a GND electrode metal pattern, the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern is a via hole 18 in the corresponding metal pattern on the upper surface of the PCB. Electrically connected through
상기 ECM 칩(110), 상기 RF 필터칩(120), 본딩와이어(20m)(20n)(20p)(20r)을 상기 PCB(1) 상면에서 몰딩하는 방법과 상기 몰딩 상면에 GND 도전막을 도포하는 방법은 실시 예 1에 명시된 방법과 동일하다.The method of molding the ECM chip 110, the RF filter chip 120, the bonding wire (20m) (20n) (20p) (20r) on the upper surface of the PCB (1) and a GND conductive film on the upper surface of the molding The method is the same as that described in Example 1.
한편, 상기 PCB 상면에 상기 ECM 칩과 상기 RF 필터 칩이 본딩되는 방법은 에폭시(Epoxy), 유텍틱(Eutectic), 납 리플로우 방법 중 하나로 하여 형성하는 것이 바람직하다.On the other hand, the method of bonding the ECM chip and the RF filter chip on the upper surface of the PCB is preferably formed by one of the epoxy (Epoxy), Eutectic (Eutectic), lead reflow method.
또한, 더욱 바람직하게는 상기 도전막은 AG 에폭시를 스프레이(Spray), Screen Printing, 증착 방법 중 어느 하나로 하여 형성하는 것이 바람직하다.In addition, more preferably, the conductive film is formed by using one of AG epoxy spray (Spray), Screen Printing, deposition method.
이상에서와 같이, 본 발명에 따른 핵심 기술은, 음압에 따라 변동하는 음향부와 상기 음향부에서 신호를 입력 받아서 증폭하기 위한 회로부로 구성되는 커패시터 마이크로폰에 있어서, 상기 회로부에서, 신호를 증폭하는 ECM 칩과 신호 증폭과정에서 발생되는 고주파 잡음 신호를 차단하기 위해 RF 필터 칩의 사용 및 음성신호 처리회로의 배선길이를 최소화하고, 외부에서 유기되어 마이크로폰의 진동판을 통해 ECM칩의 입력단으로 인입되는 고주파 잡음을 차단하기 위해 몰딩 상면의 GND 도전막을 포함하여 이루어지는 것을 특징으로 하고 있다.As described above, the core technology according to the present invention, in the capacitor microphone consisting of a sound unit that changes according to the sound pressure and a circuit unit for receiving and amplifying a signal from the sound unit, in the circuit unit, ECM for amplifying the signal In order to block the high frequency noise signal generated during the chip and signal amplification process, the RF filter chip is used and the wiring length of the voice signal processing circuit is minimized, and the high frequency noise is induced outside and introduced into the input terminal of the ECM chip through the microphone diaphragm. It is characterized in that it comprises a GND conductive film on the upper surface of the molding to block the.
상기한 기술적 특징에 따라 본 발명의 다양한 실시 예를 적용할 경우, 상기 PCB(1) 상면에 상기 RF 필터 칩(120)과 상기 ECM 칩(110)의 다이(Die) 본딩으로 음성신호 처리회로의 배선 길이를 최소화하여 방사 및 커플링되는 고주파 잡음을 줄일 수 있다.When applying various embodiments of the present invention according to the technical features described above, the die bonding of the RF filter chip 120 and the ECM chip 110 on the upper surface of the PCB (1) of the voice signal processing circuit By minimizing the wiring length, high frequency noise radiated and coupled can be reduced.
또한, 다이(Die) 본딩 후 몰딩 상면에 GND 전극을 배치하여 외부에서 유입된 고주파 잡음 신호는 마이크로폰의 진동판으로 유기되어 상기 ECM 칩의 입력단에 전달되는 고주파 잡음 신호를 차단하는데 효과적이다. In addition, the high frequency noise signal introduced from the outside by disposing a GND electrode on the molding upper surface after die bonding is effectively induced to the vibration plate of the microphone to block the high frequency noise signal transmitted to the input terminal of the ECM chip.
그리고, PCB 상면에 다이(Die) 본딩되고, 몰딩하여 PCB 상면에서 ECM 칩 입력단의 노출이 최소화되며, ECM 칩 및 기타 수동소자의 SMD 공정 생략으로 상기 PCB 상면에서 습기나 레진(Resin) 등에 의해 발생될 수 있는 ECM 칩의 누설전류(Leakage Current)를 줄이는 효과도 얻을 수 있다.In addition, die bonding is performed on the upper surface of the PCB, molding minimizes the exposure of the ECM chip input terminal on the upper surface of the PCB, and is caused by moisture or resin on the upper surface of the PCB by omitting the SMD process of the ECM chip and other passive devices. It can also reduce the leakage current of the ECM chip.
이상과 같이, 본 발명은 비록 한정된 실시 예와 도면에 의해 설명되었으나, 본 발명은 이것에 의해 한정되지 않으며 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에 의해 본 발명의 기술 사항과 아래에 기재될 특허청구범위의 균등 범위 내에서 다양한 수정 및 변형이 가능함은 물론이다.As described above, although the present invention has been described with reference to the limited embodiments and the drawings, the present invention is not limited thereto and the technical matters of the present invention will be described below by those skilled in the art to which the present invention pertains. Of course, various modifications and variations are possible within the scope of equivalents of the claims to be described.

Claims (8)

  1. 외부 음압에 따라 진동하는 음향부와, 상기 음향부에서 신호를 입력 받아서 이를 증폭하기 위한 회로부로 구성되는 커패시터 마이크로폰용 피씨비(PCB) 모듈에 있어서,In the PCB module for a capacitor microphone comprising a sound unit vibrating according to an external sound pressure, and a circuit unit for receiving a signal from the sound unit and amplifying it,
    상기 회로부는,The circuit portion,
    상기 음향부에서 발생한 전압을 증폭하기 위한 증폭 회로를 포함하는 ECM 칩과; An ECM chip including an amplifier circuit for amplifying the voltage generated by the sound unit;
    상기 증폭 과정에서 수반되는 고주파 외부 잡음 신호 차단의 RF 필터 칩;으로 구성되되,RF filter chip for blocking the high frequency external noise signal involved in the amplification process;
    상기 ECM 칩과 상기 RF 필터 칩을 음성신호 처리회로의 배선길이를 최소화하여 외부로부터 유입되는 고주파 잡음의 방사 및 커플링되는 것을 줄일 수 있도록 PCB 상면의 칩 형태로 본딩하고, Bonding the ECM chip and the RF filter chip in the form of a chip on the upper surface of the PCB so as to minimize the wire length of the voice signal processing circuit to reduce the radiation and coupling of high frequency noise from the outside,
    상기 PCB 상면에 상기 ECM 칩과 상기 RF 필터 칩의 절연 및 외부로부터 보호하기 위해 몰딩(Molding) 하고, 외부에서 유입된 고주파 잡음이 상기 PCB 상면의 상기 ECM 칩과 상기 RF 필터칩을 통해서 마이크로폰의 진동판으로 유기되어 상기 ECM 칩의 입력단에 전달되는 고주파 잡음을 차단하기 위해 상기 몰딩(Molding) 상면에 GND 도전막을 배치하며,Molding on the upper surface of the PCB to protect the insulation and the outside of the ECM chip and the RF filter chip, the high frequency noise introduced from the outside of the vibration plate of the microphone through the ECM chip and the RF filter chip of the PCB A GND conductive film is disposed on the upper surface of the molding to block the high frequency noise which is induced by being transferred to the input terminal of the ECM chip.
    상기 PCB 상면의 패턴은 입력전극 금속패턴, 출력전극 금속패턴, GND 전극 금속패턴으로 구성되고, 상기 ECM 칩의 접착배면(substrate)이 입력전극일 때 상기 ECM 칩을 입력전극 금속패턴에 본딩하며, 상기 RF 필터 칩은 GND 전극 금속패턴에 본딩하는 것을 특징으로 하는 커패시터 마이크로폰용 피씨비 모듈.The upper surface pattern of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, and a GND electrode metal pattern, and when the adhesive backing of the ECM chip is an input electrode, bonding the ECM chip to the input electrode metal pattern, And the RF filter chip is bonded to a GND electrode metal pattern.
  2. 외부 음압에 따라 진동하는 음향부와, 상기 음향부에서 신호를 입력 받아서 이를 증폭하기 위한 회로부로 구성되는 커패시터 마이크로폰용 피씨비(PCB) 모듈에 있어서,In the PCB module for a capacitor microphone comprising a sound unit vibrating according to an external sound pressure, and a circuit unit for receiving a signal from the sound unit and amplifying it,
    상기 회로부는,The circuit portion,
    상기 음향부에서 발생한 전압을 증폭하기 위한 증폭 회로를 포함하는 ECM 칩과; An ECM chip including an amplifier circuit for amplifying the voltage generated by the sound unit;
    상기 증폭 과정에서 수반되는 고주파 외부 잡음 신호 차단의 RF 필터 칩;으로 구성되되,RF filter chip for blocking the high frequency external noise signal involved in the amplification process;
    상기 ECM 칩과 상기 RF 필터 칩을 음성신호 처리회로의 배선길이를 최소화하여 외부로부터 유입되는 고주파 잡음의 방사 및 커플링되는 것을 줄일 수 있도록 PCB 상면의 칩 형태로 본딩하고, Bonding the ECM chip and the RF filter chip in the form of a chip on the upper surface of the PCB so as to minimize the wire length of the voice signal processing circuit to reduce the radiation and coupling of high frequency noise from the outside,
    상기 PCB 상면에 상기 ECM 칩과 상기 RF 필터 칩의 절연 및 외부로부터 보호하기 위해 몰딩(Molding)하고, 외부에서 유입된 고주파 잡음이 상기 PCB 상면의 상기 ECM 칩과 상기 RF 필터칩을 통해서 마이크로폰의 진동판으로 유기되어 상기 ECM 칩의 입력단에 전달되는 고주파 잡음을 차단하기 위해 상기 몰딩(Molding) 상면에 GND 도전막을 배치하며,Molding on the upper surface of the PCB to protect the insulation and the outside of the ECM chip and the RF filter chip, and the high frequency noise introduced from the outside of the vibration plate of the microphone through the ECM chip and the RF filter chip on the PCB A GND conductive film is disposed on the upper surface of the molding to block the high frequency noise which is induced by being transferred to the input terminal of the ECM chip.
    상기 PCB 상면의 패턴은 입력전극 금속패턴, 출력전극 금속패턴, GND 전극 금속패턴, ECM 칩 본딩용 금속패턴으로 구성되고, 상기 ECM 칩의 접착배면(substrate)이 출력전극일 때 상기 ECM 칩을 ECM 칩 본딩용 금속패턴에 본딩하며, 상기 RF 필터 칩은 GND 전극 금속패턴에 본딩하는 것을 특징으로 하는 커패시터 마이크로폰용 피씨비 모듈.The upper surface pattern of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and an ECM chip bonding metal pattern, and the ECM chip is ECM chip when the adhesive substrate of the ECM chip is an output electrode. Bonding to a chip bonding metal pattern, wherein the RF filter chip is bonded to a GND electrode metal pattern, the PCB module for capacitor microphones.
  3. 외부 음압에 따라 진동하는 음향부와, 상기 음향부에서 신호를 입력 받아서 이를 증폭하기 위한 회로부로 구성되는 커패시터 마이크로폰용 피씨비(PCB) 모듈에 있어서,In the PCB module for a capacitor microphone comprising a sound unit vibrating according to an external sound pressure, and a circuit unit for receiving a signal from the sound unit and amplifying it,
    상기 회로부는,The circuit portion,
    상기 음향부에서 발생한 전압을 증폭하기 위한 증폭 회로를 포함하는 ECM 칩과; An ECM chip including an amplifier circuit for amplifying the voltage generated by the sound unit;
    상기 증폭 과정에서 수반되는 고주파 외부 잡음 신호 차단의 RF 필터 칩;으로 구성되되,RF filter chip for blocking the high frequency external noise signal involved in the amplification process;
    상기 ECM 칩과 상기 RF 필터 칩을 음성신호 처리회로의 배선길이를 최소화하여 외부로부터 유입되는 고주파 잡음의 방사 및 커플링되는 것을 줄일 수 있도록 PCB 상면의 칩 형태로 본딩하고, Bonding the ECM chip and the RF filter chip in the form of a chip on the upper surface of the PCB so as to minimize the wire length of the voice signal processing circuit to reduce the radiation and coupling of high frequency noise from the outside,
    상기 PCB 상면에 상기 ECM 칩과 상기 RF 필터 칩의 절연 및 외부로부터 보호하기 위해 몰딩(Molding)하고, 외부에서 유입된 고주파 잡음이 상기 PCB 상면의 상기 ECM 칩과 상기 RF 필터칩을 통해서 마이크로폰의 진동판으로 유기되어 상기 ECM 칩의 입력단에 전달되는 고주파 잡음을 차단하기 위해 상기 몰딩(Molding) 상면에 GND 도전막을 배치하며,Molding on the upper surface of the PCB to protect the insulation and the outside of the ECM chip and the RF filter chip, and the high frequency noise introduced from the outside of the vibration plate of the microphone through the ECM chip and the RF filter chip on the PCB A GND conductive film is disposed on the upper surface of the molding to block the high frequency noise which is induced by being transferred to the input terminal of the ECM chip.
    상기 PCB 상면의 패턴은 입력전극 금속패턴, 출력전극 금속패턴, GND 전극 금속패턴으로 구성되고, 상기 ECM 칩의 접착배면(substrate)이 입력전극일 때 상기 ECM 칩을 입력전극 금속패턴에 본딩하며, 상기 RF 필터 칩은 상기 PCB 상면의 출력전극 금속패턴에 본딩하는 것을 특징으로 하는 커패시터 마이크로폰용 피씨비 모듈.The upper surface pattern of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, and a GND electrode metal pattern, and when the adhesive backing of the ECM chip is an input electrode, bonding the ECM chip to the input electrode metal pattern, The RF filter chip is a PCB module for a capacitor microphone, characterized in that bonding to the output electrode metal pattern of the upper surface of the PCB.
  4. 외부 음압에 따라 진동하는 음향부와, 상기 음향부에서 신호를 입력 받아서 이를 증폭하기 위한 회로부로 구성되는 커패시터 마이크로폰용 피씨비(PCB) 모듈에 있어서,In the PCB module for a capacitor microphone comprising a sound unit vibrating according to an external sound pressure, and a circuit unit for receiving a signal from the sound unit and amplifying it,
    상기 회로부는,The circuit portion,
    상기 음향부에서 발생한 전압을 증폭하기 위한 증폭 회로를 포함하는 ECM 칩; An ECM chip including an amplifier circuit for amplifying the voltage generated by the sound unit;
    상기 증폭 과정에서 수반되는 고주파 외부 잡음 신호 차단의 RF 필터 칩;으로 구성되되,RF filter chip for blocking the high frequency external noise signal involved in the amplification process;
    상기 ECM 칩과 상기 RF 필터 칩을 음성신호 처리회로의 배선길이를 최소화하여 외부로부터 유입되는 고주파 잡음의 방사 및 커플링되는 것을 줄일 수 있도록 PCB 상면의 칩 형태로 본딩하고, Bonding the ECM chip and the RF filter chip in the form of a chip on the upper surface of the PCB so as to minimize the wire length of the voice signal processing circuit to reduce the radiation and coupling of high frequency noise from the outside,
    상기 PCB 상면에 상기 ECM 칩과 상기 RF 필터 칩의 절연 및 외부로부터 보호하기 위해 몰딩(Molding)하고, 외부에서 유입된 고주파 잡음이 상기 PCB 상면의 상기 ECM 칩과 상기 RF 필터칩을 통해서 마이크로폰의 진동판으로 유기되어 상기 ECM 칩의 입력단에 전달되는 고주파 잡음을 차단하기 위해 상기 몰딩(Molding) 상면에 GND 도전막을 배치하며,Molding on the upper surface of the PCB to protect the insulation and the outside of the ECM chip and the RF filter chip, and the high frequency noise introduced from the outside of the vibration plate of the microphone through the ECM chip and the RF filter chip on the PCB A GND conductive film is disposed on the upper surface of the molding to block the high frequency noise which is induced by being transferred to the input terminal of the ECM chip.
    상기 PCB 상면의 패턴은 입력전극 금속패턴, 출력전극 금속패턴, GND 전극 금속패턴, ECM 칩 본딩용 금속패턴으로 구성되고, 상기 ECM 칩의 접착배면(substrate)이 출력전극일 때 상기 ECM 칩을 ECM 칩 본딩용 금속패턴에 본딩하며, 상기 RF 필터 칩은 상기 PCB 상면의 출력전극 금속패턴에 본딩하는 것을 특징으로 하는 커패시터 마이크로폰용 피씨비 모듈.The upper surface pattern of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and an ECM chip bonding metal pattern, and the ECM chip is ECM chip when the adhesive substrate of the ECM chip is an output electrode. Bonding to a metal pattern for chip bonding, wherein the RF filter chip is bonded to the output electrode metal pattern of the upper surface of the PCB.
  5. 제 1항에 있어서,The method of claim 1,
    본딩된 상기 ECM 칩 상면의 GND 단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극에 전기적으로 연결하며, 상기 ECM 칩 상면의 출력단자는 본딩와이어를 통해 상기 RF 필터 칩의 입력단자로 전기적인 연결을 하고, 상기 RF 필터 칩의 출력단자는 본딩와이어를 통해 출력전극 금속패턴에 전기적으로 연결하며, PCB 모듈 배면의 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(Via Hole)을 통하여 전기적으로 연결하는 것을 특징으로 하는 커패시터 마이크로폰용 피씨비 모듈.The bonded GND terminal of the upper surface of the ECM chip is electrically connected to the GND electrode of the upper surface of the PCB through a bonding wire, and the output terminal of the upper surface of the ECM chip is electrically connected to the input terminal of the RF filter chip through a bonding wire. The output terminal of the RF filter chip is electrically connected to the output electrode metal pattern through a bonding wire, and the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern on the back of the PCB module are connected to the via holes in the corresponding metal pattern on the PCB. PC module for capacitor microphone, characterized in that the electrical connection through the (via hole).
  6. 제 2항에 있어서,The method of claim 2,
    본딩된 상기 ECM 칩 상면의 입력 단자는 본딩와이어를 통해 상기 PCB 상면의 입력전극 금속패턴에 연결하며, 상기 ECM 칩의 GND단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극에 전기적으로 연결하고, 상기 ECM 칩의 출력전극이 본딩된 ECM칩 본딩용 금속패턴과 상기 RF 필터칩의 입력단자는 본딩와이어를 통하여 전기적으로 연결하며, 상기 RF 필터 칩의 출력단자는 본딩와이어를 통해 출력전극 금속패턴에 전기적으로 연결하고, PCB 모듈 배면의 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(Via Hole)을 통하여 전기적으로 연결하는 것을 특징으로 하는 커패시터 마이크로폰용 피씨비 모듈.The input terminal of the upper surface of the bonded ECM chip is connected to the input electrode metal pattern of the upper surface of the PCB through bonding wires, and the GND terminal of the ECM chip is electrically connected to the GND electrode of the upper surface of the PCB through bonding wires. The ECM chip bonding metal pattern bonded to the output electrode of the ECM chip and the input terminal of the RF filter chip are electrically connected through a bonding wire, and the output terminal of the RF filter chip is electrically connected to the output electrode metal pattern through a bonding wire. And a Vout electrode (output electrode) metal pattern on the back of the PCB module and a GND electrode metal pattern are electrically connected through a via hole in a corresponding metal pattern on the upper surface of the PCB module.
  7. 제 3항에 있어서,The method of claim 3, wherein
    본딩된 상기 ECM 칩 상면의 GND 단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극에 전기적으로 연결하며, 상기 ECM 칩 상면의 출력단자는 본딩와이어를 통해 상기 RF 필터 칩의 입력단자로 전기적으로 연결하고, 상기 RF 필터 칩의 GND 단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극 금속패턴에 전기적으로 연결하며, PCB 모듈 배면의 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(Via Hole)을 통하여 전기적으로 연결하는 것을 특징으로 하는 커패시터 마이크로폰용 피씨비 모듈.The bonded GND terminal of the upper surface of the ECM chip is electrically connected to the GND electrode of the upper surface of the PCB through a bonding wire, and the output terminal of the upper surface of the ECM chip is electrically connected to the input terminal of the RF filter chip through a bonding wire. The GND terminal of the RF filter chip is electrically connected to the GND electrode metal pattern on the upper surface of the PCB through bonding wires, and the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern on the back of the PCB module are corresponding metal patterns on the upper surface of the PCB. The PCB module for the capacitor microphone, characterized in that the electrical connection through the via hole (Via Hole).
  8. 제 4항에 있어서,The method of claim 4, wherein
    본딩된 상기 ECM 칩 상면의 GND 단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극에 전기적으로 연결하며, 상기 ECM 칩 상면의 입력단자는 본딩와이어를 통해 상기 PCB 상면의 입력전극 금속패턴에 전기적으로 연결하고, 상기 ECM 칩의 출력전극이 본딩된 ECM 칩 본딩용 금속패턴과 상기 RF 필터 칩의 입력단자는 본딩와이어를 통하여 전기적으로 연결하며, 상기 RF 필터 칩의 GND 단자는 본딩와이어를 통해 상기 PCB 상면의 GND 전극 금속패턴에 전기적으로 연결하고, PCB 모듈 배면의 Vout전극(출력전극) 금속패턴과 GND 전극 금속패턴은 PCB 상면의 해당 금속패턴에서 비아 홀(Via Hole)을 통하여 전기적으로 연결하는 것을 특징으로 하는 커패시터 마이크로폰용 피씨비 모듈.The bonded GND terminal of the upper surface of the ECM chip is electrically connected to the GND electrode of the upper surface of the PCB through bonding wires, and the input terminal of the upper surface of the ECM chip is electrically connected to the input electrode metal pattern of the upper surface of the PCB through bonding wires. The ECM chip bonding metal pattern, to which the output electrode of the ECM chip is bonded, and the input terminal of the RF filter chip are electrically connected through a bonding wire, and the GND terminal of the RF filter chip is connected to the upper surface of the PCB through a bonding wire. Electrically connected to the GND electrode metal pattern of the PCB, and the Vout electrode (output electrode) metal pattern on the back of the PCB module and the GND electrode metal pattern are electrically connected to each other through a via hole in the corresponding metal pattern on the upper surface of the PCB. PCB module for capacitor microphone.
PCT/KR2010/007315 2010-05-12 2010-10-25 Pcb module for a capacitor microphone WO2011142512A1 (en)

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