WO2011142512A1 - Module de carte de circuit imprimé pour microphone électrostatique - Google Patents

Module de carte de circuit imprimé pour microphone électrostatique Download PDF

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Publication number
WO2011142512A1
WO2011142512A1 PCT/KR2010/007315 KR2010007315W WO2011142512A1 WO 2011142512 A1 WO2011142512 A1 WO 2011142512A1 KR 2010007315 W KR2010007315 W KR 2010007315W WO 2011142512 A1 WO2011142512 A1 WO 2011142512A1
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WIPO (PCT)
Prior art keywords
chip
pcb
metal pattern
ecm
gnd
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Application number
PCT/KR2010/007315
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English (en)
Korean (ko)
Inventor
이진효
이규홍
이용식
문현자
Original Assignee
(주)알에프세미
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Publication date
Application filed by (주)알에프세미 filed Critical (주)알에프세미
Publication of WO2011142512A1 publication Critical patent/WO2011142512A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2209/00—Details of transducers of the moving-coil, moving-strip, or moving-wire type covered by H04R9/00 but not provided for in any of its subgroups
    • H04R2209/022—Aspects regarding the stray flux internal or external to the magnetic circuit, e.g. shielding, shape of magnetic circuit, flux compensation coils

Definitions

  • the present invention relates to a capacitor microphone, and more particularly, an RF filter chip and an ECM chip for the purpose of blocking a signal in which an external high frequency noise signal induced by the microphone is amplified in an ECM chip, and a wiring length of a voice signal processing circuit.
  • Die bonding to the upper surface of the PCB Die bonding
  • electrical connection between the two chips and the upper surface of the PCB by a bonding wire molding a certain area including the ECM chip, the RF filter chip, bonding wires.
  • the structure of applying the upper surface of the molding to the GND electrode to block the high frequency noise signal induced from the outside is transmitted to the vibration plate of the microphone, that is, the input terminal of the ECM chip, has a capacitor microphone PCB module.
  • the PCB package structure for thinning is required, and according to the multi-mode trend of mobile phones, the external high frequency noise generated when various electric devices, especially antennas, are mounted inside the mobile phones is applied to the microphone. To prevent ingress.
  • FIG. 1 is a cutaway cross-sectional view of a microphone according to the prior art, and FIGS. 2 and 3 show the configuration circuit of FIG.
  • the microphone 100 module configuration generally includes a diaphragm 170, an electrostatic film 180, an ECM 110, and a passive element 121 serving as an RF filter.
  • the ECM 110 converts the change in capacitance between the diaphragm 170, the back plate 190, and the electrostatic film 180 according to the voice signal into an electric signal, and passes through the passive element 121 serving as an RF filter.
  • the voice signal is transmitted to the final output terminal of the microphone.
  • the ECM 110 is configured to be separated from the passive element 121, which serves as an RF filter, a predetermined distance apart.
  • a high frequency signal of a large instantaneous power ranging from several milliwatts (mW) to several watts (W) is radiated through an antenna. Is induced on the line of the microphone 100 and the external voice signal processing circuit and applied to the ECM chip 110 inside the microphone 100. In addition, the high frequency noise signal is also induced in the vibration plate inside the microphone, and the distance between the vibration plate and the ECM chip 110 is shortened and applied to the input terminal of the ECM chip 110 due to the thinning of the microphone.
  • the non-linear operation is performed, and a noise component corresponding to the peak envelope is generated along with the harmonics wave. Since the frequency envelope of the peak envelope is largely overlapped with the audio frequency, the signal is amplified with the voice signal and enters the voice signal processing circuit, making it the microphone's loudest noise.
  • the existing microphone 100 serves as one or more RF filters by being spaced apart at regular intervals on the same PCB 160 as the packaged ECM 110. It was configured using a passive element 121.
  • FIGS. 2 and 3 are circuit diagrams of a capacitor microphone in which a passive element 121 serving as this RF filter is constructed. It consists of capacitors C1 (C2) (C3), resistors (R1), varistors, etc., which act as RF filters.
  • the passive elements are connected to the upper surface of the PCB by metal patterns.
  • the wiring of the circuit for processing the input voice signal becomes long. That is, the voice signal processing circuit includes a lead frame and a bonding wire inside the packaged ECM chip, and a metal pattern on the upper surface of the PCB on which a passive element for acting as an RF filter is SMD. As such, as the length of the audio signal processing circuit becomes longer, the noise is generated when the microphone is operated because of the high frequency noise signal which is radiated and coupled in the signal processing circuit and not removed.
  • FIGS. 4 and 5 are cross-sectional views schematically illustrating a cross section of a capacitor microphone to which a bonding wire PCB is applied in the prior art.
  • the capacitor microphone 210 bonds the circuit pattern 220 to the PCB substrate 200 and bonds the circuit element 230 to the PCB substrate 200.
  • the circuit element 230 and the circuit pattern 220 are electrically connected by the wire 240.
  • the encapsulation is performed by using the epoxy resin 290 to surround the circuit device 230 and the wire 240.
  • reference numeral 39 denotes a sound wave inlet.
  • FIG. 5 also wires a circuit with a conductive material on the PCB substrate 41 inside the capacitor microphone case 38 and is bonded on the PCB substrate 41 to match the potential change according to the change in capacitance with an electrical signal. After bonding the matching and amplifying circuit chip 32 including the ECM and the capacitor to amplify, the matching and amplifying circuit chip 32 is molded on the PCB substrate 41.
  • FIGS. 4 and 5 do not consider the wiring length of the voice signal processing circuit of the microphone, and thus are aimed at improving the manufacturing cost, improving the yield by omitting SMD process, removing noise by contact resistance, and improving terminal disconnection.
  • the high frequency noise signal is radiated and coupled to generate noise when the microphone is operated.
  • a high frequency noise signal introduced from the outside is induced to the vibration plate of the microphone, which is an input terminal of the ECM chip located at a close distance to the ECM chip.
  • the induced high frequency noise signal is transmitted to the input terminal of the ECM chip is amplified through the ECM chip, causing a noise problem when the microphone is operated.
  • the present invention is a problem of generating a high frequency noise signal generated in the conventional microphone as described above, that is, the circuit of the length of the voice signal processing circuit generated while the passive element acting as an ECM chip and the RF filter in the form of a package SMD on the PCB
  • the main purpose is to solve the high frequency noise problem caused by the radiation and coupling of high frequency noise signal by wiring.
  • the externally induced high frequency noise signal is induced to the diaphragm of the microphone, which is an input terminal of the ECM chip located close to the ECM chip, and the high frequency noise signal is transmitted to the input terminal of the ECM chip.
  • Another goal is to solve the noise problem that occurs when the microphone is operating while being amplified.
  • the capacitor microphone PCB module according to the present invention for solving the above-described conventional problems and to achieve the technical problem,
  • the PCB module for a capacitor microphone comprising a sound unit vibrating according to an external sound pressure, and a circuit unit for receiving a signal from the sound unit and amplifying it
  • An ECM chip including an amplifier circuit for amplifying the voltage generated by the sound unit
  • the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and when the adhesive backing (substrate) of the ECM chip is an input electrode, the ECM chip is connected to the input electrode metal pattern. Bonding, wherein the RF filter chip is bonded to the GND electrode metal pattern.
  • the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and an ECM chip bonding metal pattern, and the ECM chip has an adhesive electrode when the substrate is an output electrode.
  • the chip is bonded to the metal pattern for ECM chip bonding, and the RF filter chip is bonded to the GND electrode metal pattern.
  • the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and when the adhesive backing (substrate) of the ECM chip is an input electrode, the ECM chip is connected to the input electrode metal pattern. Bonding, wherein the RF filter chip is bonded to the output electrode metal pattern of the upper surface of the PCB.
  • the pattern of the upper surface of the PCB is composed of an input electrode metal pattern, an output electrode metal pattern, a GND electrode metal pattern, and an ECM chip bonding metal pattern, and the ECM chip has an adhesive electrode when the substrate is an output electrode.
  • the chip is bonded to the metal pattern for ECM chip bonding, and the RF filter chip is bonded to the output electrode metal pattern on the upper surface of the PCB.
  • the GND terminal of the upper surface of the ECM chip bonded in the present invention is electrically connected to the GND electrode of the upper surface of the PCB through a bonding wire, and the output terminal of the upper surface of the ECM chip is electrically connected to the input terminal of the RF filter chip through a bonding wire.
  • the output terminal of the RF filter chip is electrically connected to the output electrode metal pattern through a bonding wire, and the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern on the back of the PCB module are connected to the corresponding metal pattern on the upper surface of the PCB. It is characterized in that the electrical connection through the via hole (Via Hole).
  • the input terminal of the upper surface of the ECM chip bonded in the present invention is connected to the input electrode metal pattern of the upper surface of the PCB through bonding wires, and the GND terminal of the ECM chip is electrically connected to the GND electrode of the upper surface of the PCB through bonding wires.
  • the ECM chip bonding metal pattern, to which the output electrode of the ECM chip is bonded, and the input terminal of the RF filter chip are electrically connected through bonding wires, and the output terminal of the RF filter chip is connected to the output electrode metal pattern through bonding wires.
  • the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern on the back of the PCB module are electrically connected to each other through a via hole in the corresponding metal pattern on the upper surface of the PCB.
  • the GND terminal of the upper surface of the ECM chip bonded in the present invention is electrically connected to the GND electrode of the upper surface of the PCB through a bonding wire, and the output terminal of the upper surface of the ECM chip is electrically connected to an input terminal of the RF filter chip through a bonding wire.
  • the GND terminal of the RF filter chip is electrically connected to the GND electrode metal pattern of the upper surface of the PCB through bonding wires, and the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern of the PCB module are connected to the upper surface of the PCB.
  • the metal pattern may be electrically connected through a via hole.
  • the GND terminal of the upper surface of the ECM chip bonded in the present invention is electrically connected to the GND electrode of the upper surface of the PCB through bonding wires, and the input terminal of the upper surface of the ECM chip is connected to the input electrode metal pattern of the upper surface of the PCB through bonding wires. It is electrically connected, and the ECM chip bonding metal pattern in which the output electrode of the ECM chip is bonded and the input terminal of the RF filter chip are electrically connected through a bonding wire, and the GND terminal of the RF filter chip is connected through a bonding wire.
  • the GND electrode metal pattern on the upper surface of the PCB is electrically connected, and the Vout electrode (output electrode) metal pattern on the back of the PCB module and the GND electrode metal pattern are electrically connected through via holes in the corresponding metal pattern on the upper surface of the PCB. Characterized in that.
  • a high frequency noise signal induced during use of a microphone is removed by applying an RF filter chip, and voice signal processing is performed by directly bonding an RF filter chip and an ECM chip to a printed circuit board.
  • the wiring length of the circuit can be minimized to reduce high frequency noise radiated and coupled.
  • the GND electrode is placed on the upper surface of the molding to block the high frequency noise signal generated from outside from being amplified by being transmitted to the microphone's diaphragm, that is, the input terminal of the ECM chip. It works.
  • the die bonding and molding of the upper surface of the PCB minimizes the exposure of the input stage of the ECM chip on the upper surface of the PCB, and the moisture or resin on the upper surface of the PCB due to the elimination of the SMD process of the ECM chip and other passive devices. It is also possible to obtain an effect of reducing the leakage current of the ECM chip, which may be generated by the method.
  • FIG. 1 is a cutaway sectional view of a capacitor microphone according to the prior art.
  • FIG. 2 is a circuit diagram of a capacitor microphone of the prior art.
  • FIG. 3 is a circuit diagram of a capacitor microphone of the prior art.
  • FIG. 4 is a cross-sectional view of a capacitor microphone to which a wire bonding PCB of the prior art is applied.
  • FIG. 5 is a cross-sectional view of a capacitor microphone to which a wire bonding PCB of the prior art is applied.
  • FIG. 6 is a circuit diagram of a capacitor microphone to which the present invention is applied.
  • FIG. 7 is a cross-sectional view of the PCB module cut-out of the first embodiment according to the present invention.
  • FIG. 8 is a plan view of the PCB of FIG.
  • FIG. 9 is a cross-sectional view of a PCB module cut in a second embodiment according to the present invention.
  • FIG. 10 is a plan view of the PCB of FIG.
  • FIG. 11 is a cross-sectional view of a PCB module cut in a third embodiment according to the present invention.
  • FIG. 12 is a plan view of the PCB of FIG.
  • Fig. 13 is a sectional view of a PCB module cut in a fourth embodiment according to the present invention.
  • FIG. 14 is a plan view of the PCB of FIG.
  • FIG. 6 is a circuit diagram of a capacitor microphone according to the present invention
  • FIG. 7 is a cross-sectional view of a PCB module according to a first embodiment of the present invention
  • FIG. 8 is a PCB plan view of FIG. 7
  • FIG. 9 is a PCB module cut of a second embodiment according to the present invention.
  • Fig. 10 is a plan view of the PCB of Fig. 9
  • Fig. 11 is a sectional view of the PCB module of the third embodiment according to the present invention
  • Fig. 12 is a plan view of the PCB of Fig. 11
  • Fig. 13 is a PCB module cut of the fourth embodiment according to the present invention.
  • 14 is a plan view of the PCB of FIG.
  • FIG. 6 is a circuit diagram constructed according to the present invention.
  • a capacitor microphone including a sound unit vibrating according to an external sound pressure and a circuit unit for receiving a signal from the sound unit and amplifying the signal
  • the circuit unit amplifies a voltage generated in the sound unit.
  • An RF filter chip 120 including an ECM chip 110 including an amplification circuit, a capacitor C4, C5, and a resistor R2 for blocking an external high frequency noise signal accompanying the amplification process.
  • FIG. 7 is a cross-sectional view of a PCB module to which the ECM chip 110 whose adhesive backing is an input electrode and the RF filter chip 120 whose adhesive backing is a GND electrode are applied, and FIG. PCB top view.
  • the GND terminal of the top surface of the ECM chip 110 bonded is electrically connected to the GND electrode 16b of the top surface of the PCB 1 through a bonding wire 20a, and the output terminal of the top surface of the ECM chip 110 is bonded wire. Electrical connection is made to the input terminal of the RF filter chip 120 through 20b.
  • the output terminal of the RF filter chip 120 is electrically connected to the output electrode metal pattern 15a through a bonding wire 20c.
  • the back of the PCB module is composed of a Vout electrode (output electrode) metal pattern and a GND electrode metal pattern, the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern is a via hole (Via Hole, 18) Connect electrically.
  • the two ECM chips 110, the RF filter chip 120, and the bonding wires 20a, 20b, and 20c may be insulated from the outside and protected from the outside.
  • the molding region 30 including the two chips 110 and 120 and the bonding wires 20a, 20b, and 20c is molded with an epoxy mold compound (EMC).
  • an external high frequency noise signal is induced to the diaphragm 170 of the microphone 100 through the ECM chip 110 and the RF filter chip 120 on the upper surface of the PCB 1 to input the terminal of the ECM chip 110.
  • the GND conductive layer 31 is connected to the upper surface of the molding by connecting the upper surface of the molding with a conductive solution from the GND electrode plating region 13 spaced at a predetermined distance from the molding region 30 to block the transfer to the upper surface of the molding region 30. ).
  • FIG. 9 is a cross-sectional view of a PCB module to which the ECM chip 110 having an adhesive backside as an output electrode and the RF filter chip 120 having a GND electrode with a backing substrate are applied.
  • FIG. 10 is a cross-sectional view of FIG. PCB top view.
  • the metal pattern of the input electrode 17, the output electrode 15, and the GND electrode 16, which are voice signal processing circuits, is wired on the upper surface of the PCB 1 with a minimum distance, and the ECM chip 110 is an ECM chip bonding metal. Bonding to the pattern 19, the RF filter chip 120 is bonded to the GND electrode metal pattern (16a).
  • the input terminal of the bonded upper surface of the ECM chip 110 is connected to the input electrode metal pattern 17b of the upper surface of the PCB through a bonding wire 20d, and the GND terminal of the ECM chip 110 is bonded wire 20e. It is electrically connected to the GND electrode (16b) of the upper surface of the PCB (1) through.
  • the ECM chip bonding metal pattern 19 to which the output electrode of the ECM chip 110 is bonded and the input terminal of the RF filter chip 120 are electrically connected through a bonding wire 20f.
  • the output terminal of the chip 120 is electrically connected to the output electrode metal pattern 15a through the bonding wire 20g.
  • the back surface of the PCB module is composed of a metal pattern of the Vout electrode (output electrode) and a metal electrode of the GND electrode, and the metal pattern of the Vout electrode (output electrode) and the GND electrode metal is a via hole (Via Hole, 18) Connect electrically.
  • a method of molding the ECM chip 110, the RF filter chip 120, and bonding wires 20d, 20e, 20f, and 20g on the upper surface of the PCB 1 and coating a GND conductive film on the upper surface of the molding The method is the same as that described in Example 1.
  • FIG. 11 is a cross-sectional view of a PCB module to which the ECM chip 110 having an adhesive backside as an input electrode and the RF filter chip 120 having an adhesive backside as an output electrode are applied, and FIG. PCB top view.
  • the GND terminal of the top surface of the ECM chip 110 bonded is electrically connected to the GND electrode 16a of the top surface of the PCB 1 through a bonding wire 20h, and the output terminal of the top surface of the ECM chip 110 is bonded wire.
  • An electrical connection is made to an input terminal of the RF filter chip 120 through 20i.
  • the GND terminal of the RF filter chip 120 is electrically connected to the GND electrode metal pattern 16b on the upper surface of the PCB 1 through a bonding wire 20j.
  • the back of the PCB module is composed of a Vout electrode (output electrode) metal pattern and a GND electrode metal pattern, the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern is a via hole (18) in the corresponding metal pattern on the upper surface of the PCB. Electrically connected through
  • the method of molding the ECM chip 110, the RF filter chip 120, and the bonding wires 20h, 20i, and 20j on the upper surface of the PCB 1 and applying a GND conductive film to the upper surface of the molding are performed. Same as the method specified in Example 1.
  • FIG. 13 is a cross-sectional view of a PCB module to which the ECM chip 110 whose adhesive backing is an output electrode and the RF filter chip 120 whose adhesive backing is an output electrode are applied, and FIG. PCB top view.
  • the metal pattern of the input electrode 17, the output electrode 15, and the GND electrode 16, which are voice signal processing circuits, is wired on the upper surface of the PCB 1 with a minimum distance, and the ECM chip 110 is an ECM chip bonding metal. Bonding to the pattern 19, the RF filter chip 120 is bonded to the output electrode metal pattern (15a).
  • the bonded GND terminal of the upper surface of the ECM chip 110 is electrically connected to the GND electrode 16a of the upper surface of the PCB 1 through a bonding wire 20m, and the input terminal of the upper surface of the ECM chip 110 is bonded.
  • the wire 20n is electrically connected to the input electrode metal pattern 17b of the upper surface 1 of the PCB.
  • the ECM chip bonding metal pattern 19 to which the output electrode of the ECM chip 110 is bonded and the input terminal of the RF filter chip 120 are electrically connected through a bonding wire 20p.
  • the GND terminal of the chip 120 is electrically connected to the GND electrode metal pattern 16b on the upper surface of the PCB 1 through the bonding wire 20r.
  • the back of the PCB module is composed of a Vout electrode (output electrode) metal pattern and a GND electrode metal pattern, the Vout electrode (output electrode) metal pattern and the GND electrode metal pattern is a via hole 18 in the corresponding metal pattern on the upper surface of the PCB. Electrically connected through
  • the method of molding the ECM chip 110, the RF filter chip 120, the bonding wire (20m) (20n) (20p) (20r) on the upper surface of the PCB (1) and a GND conductive film on the upper surface of the molding is the same as that described in Example 1.
  • the method of bonding the ECM chip and the RF filter chip on the upper surface of the PCB is preferably formed by one of the epoxy (Epoxy), Eutectic (Eutectic), lead reflow method.
  • the conductive film is formed by using one of AG epoxy spray (Spray), Screen Printing, deposition method.
  • the core technology according to the present invention in the capacitor microphone consisting of a sound unit that changes according to the sound pressure and a circuit unit for receiving and amplifying a signal from the sound unit, in the circuit unit, ECM for amplifying the signal
  • the RF filter chip is used and the wiring length of the voice signal processing circuit is minimized, and the high frequency noise is induced outside and introduced into the input terminal of the ECM chip through the microphone diaphragm. It is characterized in that it comprises a GND conductive film on the upper surface of the molding to block the.
  • the die bonding of the RF filter chip 120 and the ECM chip 110 on the upper surface of the PCB (1) of the voice signal processing circuit By minimizing the wiring length, high frequency noise radiated and coupled can be reduced.
  • the high frequency noise signal introduced from the outside by disposing a GND electrode on the molding upper surface after die bonding is effectively induced to the vibration plate of the microphone to block the high frequency noise signal transmitted to the input terminal of the ECM chip.
  • die bonding is performed on the upper surface of the PCB, molding minimizes the exposure of the ECM chip input terminal on the upper surface of the PCB, and is caused by moisture or resin on the upper surface of the PCB by omitting the SMD process of the ECM chip and other passive devices. It can also reduce the leakage current of the ECM chip.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

L'invention concerne un module de carte de circuit imprimé pour microphone électrostatique, et plus particulièrement un module de carte de circuit imprimé pour microphone électrostatique qui permet de prévenir la production d'un signal de bruit externe haute fréquence dans ledit microphone, ce module comprenant: une unité acoustique vibrant selon une pression acoustique externe; et une unité de circuit qui reçoit un signal provenant de l'unité acoustique afin d'amplifier le signal reçu, l'unité de circuit incluant une puce ECM qui comprend un circuit d'amplification amplifiant une tension produite par l'unité acoustique; et une puce de filtre RF destinée à prévenir la production d'un signal de bruit externe haute fréquence pendant l'opération d'amplification.
PCT/KR2010/007315 2010-05-12 2010-10-25 Module de carte de circuit imprimé pour microphone électrostatique WO2011142512A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100044662A KR101001108B1 (ko) 2010-05-12 2010-05-12 커패시터 마이크로폰용 피시비 모듈
KR10-2010-0044662 2010-05-12

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WO2011142512A1 true WO2011142512A1 (fr) 2011-11-17

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CN (1) CN102244833B (fr)
WO (1) WO2011142512A1 (fr)

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KR101276353B1 (ko) * 2011-12-09 2013-06-24 주식회사 비에스이 다기능 마이크로폰 조립체 및 그 제조방법
CN104980849A (zh) * 2015-07-15 2015-10-14 河南芯睿电子科技有限公司 用于传声器的线路板组件及其加工方法
CN111432325B (zh) * 2020-04-23 2021-05-07 深圳市当智科技有限公司 一种下进音麦克风的封装方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040050821A (ko) * 2002-12-10 2004-06-17 주식회사 비에스이 광대역 저지필터를 사용하고 정전방전에 대한 내성을강화한 콘덴서 마이크로폰
KR20050076316A (ko) * 2004-01-20 2005-07-26 주식회사 비에스이 메인 ｐｃｂ에 실장하기 적합한 콘덴서 마이크로폰
KR100675025B1 (ko) * 2005-08-20 2007-01-29 주식회사 비에스이 실리콘 콘덴서 마이크로폰
KR20080110319A (ko) * 2007-06-15 2008-12-18 (주) 알에프세미 초소형 커패시터 마이크로폰

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3985609B2 (ja) * 2002-07-04 2007-10-03 ソニー株式会社 コンデンサーマイクロホン
CN2896771Y (zh) * 2006-05-17 2007-05-02 潍坊歌尔电子有限公司 抗射频干扰的电容式麦克风
KR20080082825A (ko) * 2007-03-09 2008-09-12 주식회사 비에스이 무선단말기용 마이크로폰의 고주파 무선 잡음 제거 회로
WO2009025090A1 (fr) * 2007-08-22 2009-02-26 Panasonic Corporation Dispositif de microphone à directivité

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040050821A (ko) * 2002-12-10 2004-06-17 주식회사 비에스이 광대역 저지필터를 사용하고 정전방전에 대한 내성을강화한 콘덴서 마이크로폰
KR20050076316A (ko) * 2004-01-20 2005-07-26 주식회사 비에스이 메인 ｐｃｂ에 실장하기 적합한 콘덴서 마이크로폰
KR100675025B1 (ko) * 2005-08-20 2007-01-29 주식회사 비에스이 실리콘 콘덴서 마이크로폰
KR20080110319A (ko) * 2007-06-15 2008-12-18 (주) 알에프세미 초소형 커패시터 마이크로폰

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CN102244833A (zh) 2011-11-16
CN102244833B (zh) 2014-03-12

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