WO2012050279A1 - Dispositif à microphone - Google Patents

Dispositif à microphone Download PDF

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Publication number
WO2012050279A1
WO2012050279A1 PCT/KR2011/002613 KR2011002613W WO2012050279A1 WO 2012050279 A1 WO2012050279 A1 WO 2012050279A1 KR 2011002613 W KR2011002613 W KR 2011002613W WO 2012050279 A1 WO2012050279 A1 WO 2012050279A1
Authority
WO
WIPO (PCT)
Prior art keywords
microphone
metal frame
printed circuit
circuit board
coupled
Prior art date
Application number
PCT/KR2011/002613
Other languages
English (en)
Korean (ko)
Inventor
이상호
심용현
Original Assignee
주식회사 비에스이
톈진 비에스이 일렉트로닉스 컴퍼니 리미티드
동관 바오싱 일렉트로닉스 컴퍼니 리미티드
롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 비에스이, 톈진 비에스이 일렉트로닉스 컴퍼니 리미티드, 동관 바오싱 일렉트로닉스 컴퍼니 리미티드, 롱쳉 바오싱 일렉트로닉 컴퍼니 리미티드 filed Critical 주식회사 비에스이
Publication of WO2012050279A1 publication Critical patent/WO2012050279A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10083—Electromechanical or electro-acoustic component, e.g. microphone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases

Definitions

  • the present invention relates to a microphone device, and more particularly, to a microphone device having a metal frame on the microphone body, and having improved durability against external shocks that may occur during mounting and use in a user product.
  • a microphone is a device that converts an external voice signal into an electrical signal, and is mainly used in a communication device such as a mobile phone, a smartphone, an MP3, a telephone, a medical device such as a hearing aid, or a miniaturized multifunctional smart sensor.
  • Microphones are classified into various types, such as electret condenser microphones, digital microphones, and MEMS silicon microphones, according to specific configuration differences.
  • Such a microphone regardless of its type, includes a printed circuit board and a cover coupled to the printed circuit board to form an inner space.
  • electronic components such as a capacitor, various semiconductor chips, MEMS DIE, ASIC (Application Specific Integrated Circuit), an amplifier, a filter, and the like, are required to convert sound into an electrical signal. do.
  • these electronic components are mounted on a printed circuit board.
  • a plurality of pads are provided on the lower side of the printed circuit board used in most microphones for electrical connection to the outside. Such pads are also called terminals. Many pads are used for grounding, power input data output, and the like.
  • the conventional microphone by soldering the pad provided on the lower side of the printed circuit board of the microphone to the substrate of the user product, the electrical connection with the user product is made, of course, it is fixed to the user product.
  • the microphone is fixed to the user product only by the combination of pads, without a configuration for a separate connection, when an external shock is applied to the user product, the electrical connection between the pad and the user product is broken or unstable. A problem arises in durability such as being degraded.
  • a conventional microphone 100 is illustrated.
  • the conventional microphone 100 has a cover 102 and a printed circuit board 104.
  • the cover 102 is provided with an acoustic hole 103, and the cover 102 is bonded to the adhesive 106 such as epoxy to the printed circuit board 104.
  • pads 108 are provided on the lower side of the printed circuit board 104. Each is for ground, power input and data output, the other is just for balanced coupling.
  • the microphone 100 is mounted on a user product by soldering pads provided on the lower side of the printed circuit board 104 to a substrate 120 of a user product, such as a mobile phone or a PDA.
  • a user product such as a mobile phone or a PDA.
  • the printed circuit board 104 and the substrate 120 of the user product are connected to each other by a coupling member 110 or 112 such as lead or the like.
  • An object of the present invention has been proposed to solve the above-described problem, by providing a microphone frame to the microphone body further, to provide a microphone device with improved durability against external shock, such as shock or vibration.
  • the microphone device of the present invention includes a microphone including a printed circuit board having a plurality of pads for electrical connection on a lower side thereof, and a metal cover which is coupled to the printed circuit board to form a sealed inner space.
  • main body and a metal frame formed around the side of the microphone body and coupled to the microphone body, wherein the metal frame is electrically coupled to the substrate of the user product. At least a portion of the lower end is characterized in that the metal frame that can be fixed to the substrate of the user product.
  • the metal frame is preferably coupled to the outer peripheral portion of the printed circuit board.
  • the metal frame is preferably fitted is coupled to the outer peripheral portion of the printed circuit board.
  • the metal frame is spaced apart from the printed circuit board, it is preferably fixed to the outer surface of the cover.
  • the metal frame is preferably configured such that the bottom surface is located on the same plane as the lower surface of the printed circuit board.
  • the bottom surface of the metal frame is formed to protrude downward, which can be inserted into a fastening hole provided in the substrate of the user product, at least one leg is preferably formed.
  • the pad provided on the lower side of the printed circuit board, the first pad provided in an annular shape along the outer periphery, the second pad and the third pad provided spaced apart from the first pad inside the first pad It is preferably configured to include.
  • the metal frame is preferably coupled to the microphone body by a coupling member and fixed.
  • the coupling member may be provided in a space formed between the microphone body and the metal frame, and the coupling member may be an adhesive including epoxy.
  • the microphone frame is provided in the microphone main body, when the microphone device is mounted on the substrate of the user product, the short circuit of the connected pad does not occur even when an external shock such as a drop or vibration occurs. You can get it.
  • the metal frame has a configuration that is electrically coupled to the cover of the metal material, due to the increase in the ground area, it is possible to obtain the effect that the microphone acoustic properties are improved.
  • the metal frame is provided with at least one leg portion, it is easy to mount the microphone device on the substrate of the user product, it is possible to obtain the effect that the bonding force is improved.
  • FIG. 1 is a perspective view of a conventional microphone
  • FIG. 2 is a view showing the lower side of the microphone of FIG.
  • FIG. 3 is a schematic cross-sectional view of a state in which the microphone of FIG. 1 is mounted on a substrate of a user product;
  • FIG. 4 is a perspective view of a microphone device of one embodiment according to the present invention.
  • FIG. 5 is a schematic exploded perspective view of the microphone device of FIG. 4.
  • FIG. 6 is a view from below of the microphone device of FIG. 4;
  • FIG. 7 is a schematic cross-sectional view taken along line VII-VII of the microphone of FIG. 4; FIG.
  • FIGS. 8 to 10 are views showing a state in which the microphone device of Figure 4 is mounted on the substrate of the user product
  • FIG. 11 is a perspective view of a microphone device of another embodiment according to the present invention.
  • FIG. 12 is a schematic cross-sectional view of a microphone device of another embodiment according to the present invention mounted on a substrate of a user product.
  • a microphone device 1 according to an embodiment of the present invention will be described in detail with reference to FIGS. 4 to 10 of the accompanying drawings.
  • the microphone 1, as described above, is a compact microphone mainly used for communication devices such as mobile phones, MP3s, telephones, and medical devices such as hearing aids.
  • the microphone device 1 includes a microphone body 10 and a metal frame 20. On the other hand, in the present embodiment, the microphone device 1 further comprises a coupling member (30).
  • the microphone body 10 is a conventional microphone.
  • the microphone body 10 is an example of a MEMS microphone, but various types of microphones including an electret condenser microphone, a digital microphone, and the like. It could be
  • the microphone body 10 includes a printed circuit board 11 and a cover 12.
  • the printed circuit board 11 is provided with a plurality of pads 16 and 17 for electrical connection on the lower side thereof, and electrical components are mounted on the upper side thereof. Pads are also called terminals.
  • the plurality of pads are provided with a first pad 16, a second pad 17, and a third pad 18.
  • the first pad 16, as shown in Figure 6, is provided in a ring shape along the outer circumference.
  • the first pad 16 serves as a ground (ground), but since the first pad 16 has a relatively large area, the acoustic characteristics of the microphone device may be improved.
  • the second pad 17 and the third pad 18 serve as a power supply and a data output, respectively.
  • the second and third pads 17 and 18 are provided in the inner space of the first pad 16 but are spaced apart from the first pad 16.
  • the cover 12 is coupled to the printed circuit board 11 to form an inner space 14 sealed therein.
  • the cover 12 is coupled to the printed circuit board 11 by an adhesive 15.
  • the internal space 14 is provided with an electrical and electronic component that serves to convert the sound into an electrical signal roll.
  • Such electrical and electronic components are provided with components including MEMS chips in the present embodiment, but various modifications are possible in other embodiments.
  • the cover 12 is made of a metal material, and at one side thereof, an acoustic hole 13 is formed to allow external sound to flow into the internal space 14.
  • the cover 12 is in the shape of a hexahedron with an open lower side.
  • the microphone main body 10 has a flat hexahedron shape as a whole.
  • the microphone body has a variety of shapes. For example, it can be deformed into a cylinder, an elliptic cylinder, a polygonal cylinder, or the like. If deformed, the shapes of the parts including the cover and the printed circuit board are also appropriately deformed accordingly.
  • the metal frame 20, the metal frame 20 is made of metal. Because it is a metal, it is conductive and its strength is relatively high.
  • the metal frame 20 has a shape surrounding the side surface of the microphone body 10 and is coupled to the microphone body 10. In the present embodiment, since the microphone body 10 has a flat hexahedron shape, the metal frame 20 also has a relatively low height, and is shaped like a rectangular frame to surround four sides of the body 10.
  • the metal frame 20 has at least a portion of its lower end coupled to and fixed to the substrate of the user product when the plurality of pads 16, 17, 18 are electrically coupled to the substrate of the user product.
  • the lower end of the metal frame 20 is also fixed to the substrate of the user product with the pad by the surface mounting technology. It is preferable.
  • the lower side of the metal frame 20 is configured to be located on the same plane as the lower side of the printed circuit board 11. That is, referring to FIG. 7, the bottom surface of the metal frame 20 is on the same plane as the bottom surface of the printed circuit board 11.
  • the metal frame 20 is electrically connected to the cover 12.
  • the metal frame may be configured to be in direct contact with the cover, or an electrical connection member may be used.
  • the coupling member 30 may be a conductor.
  • the metal frame 20 may be coupled to the outer periphery of the printed circuit board 11 in some embodiments, or may be bonded to each other by an adhesive such as epoxy. Adopting an interference fit configuration has the advantage of reduced labor.
  • the metal frame 20 of the present embodiment is provided with all four leg portions 22 protruding downward from the bottom surface.
  • the leg portions 22 provided at the bottom of the metal frame 20 may be inserted into the fastening hole 204 to be fixed.
  • the coupling member 30 is configured to couple the metal frame 20 to the microphone body 10.
  • the coupling member 30 since the lower portion of the metal frame 20 is coupled to the printed circuit board 11, the coupling member 30 is connected to the upper portion of the metal frame 20 and the cut portion 12 of the microphone body 10. Combine them together.
  • the microphone body and the metal frame may be coupled to each other only by the coupling member.
  • the coupling member 30 may be formed by injecting an adhesive, such as an epoxy in a liquid state, between the microphone body and the metal frame, which are assembled to each other, and then curing the adhesive.
  • the coupling member may be formed by a soldering method of a metal component.
  • the bonding member may be any one of silver paste, silicon, urethane, acrylic, cream solder, UV (UV) curing bond, in addition to epoxy.
  • the coupling member 30 may have conductivity for electrical connection between the cover 12 and the metal frame 20.
  • the microphone device 1 of the present embodiment includes a metal frame 20 that surrounds the microphone body 10 as a whole, when the microphone body is mounted on a substrate, the metal frame is also a substrate of the user product. Can be coupled to. Thus, there is an advantage that the durability of the microphone device 1 against the shock that may occur during use of the user product is significantly improved.
  • the pads provided on the lower side of the printed circuit board 11 of the microphone device 1 may be soldered using surface mount technology to the printed circuit patterns 202, 206, and 208 provided on the substrate 200 of the user product. Combined by the method. At this time, the leg portion 22 is also inserted into the fastening hole 204 is coupled by a method such as soldering.
  • the pads provided on the lower side of the printed circuit board, the first pad for ground provided along the outer periphery of the printed circuit board, and the second, third pad provided on the inside of the first pad Since it is provided, when the metal frame is mounted on the substrate of the user product, there is an advantage that the short circuit with the second and third pads is unlikely to occur.
  • the microphone apparatus 1a which does not have the leg part in the metal frame 20a is illustrated. Even if the legs are not provided, the lower end of the metal frame 20a can be fixed to the substrate of the user product with the pads of the microphone main body 10 by soldering or the like, so that a desired degree of coupling force can be obtained. have.
  • the lower portion of the metal frame 20 is coupled to the outer peripheral portion of the printed circuit board 11, and at the same time the upper portion of the metal frame 20 is covered by the coupling member 30 ( 12) is also coupled.
  • the present invention is not limited thereto. That is, in another embodiment, as long as the metal frame 20 is coupled to the microphone body 10, it may be coupled only to the printed circuit board of the microphone body, or may be coupled only to the cover.
  • the microphone apparatus 1b of the structure where the metal frame 20b is spaced apart from the printed circuit board 11b, and is fixed to the outer surface of the cover 12b is illustrated.
  • the metal frame 20b is fixed to the cover 12b by the method of adhesive or soldering.
  • the metal frame 20b is provided with a leg portion 22b, and is inserted into and fixed to the fastening hole 204 provided in the substrate 200 of the user product.
  • the pad provided on the lower side of the printed circuit board 11b is the same as that shown in FIG. Even in the form, there is an advantage that the short circuit with the metal frame 20b is unlikely to occur.
  • the members denoted by 210 and 212 indicate soldering members formed with the pads and the substrate 200.
  • the microphone main body 10 is in the shape of a flat hexahedron.
  • the metal frame 20 is also in the shape of a square frame.
  • the present invention is not limited thereto. That is, in another embodiment, the microphone body has various shapes. For example, it can be deformed into a cylinder, an elliptic cylinder, a polygonal cylinder, or the like. When the microphone body is deformed, the metal frame is also appropriately deformed corresponding to the shape of the microphone body.

Abstract

La présente invention concerne un dispositif à microphone, comprenant : un corps de microphone comportant une carte de circuits imprimés et un couvercle métallique, la carte de circuits imprimés ayant une surface inférieure sur laquelle est implantée une pluralité de pastilles pour la connexion électrique et le couvercle métallique étant accouplé à la carte de circuits imprimés afin de former un espace intérieur clos ; et un cadre métallique formé afin d'entourer le corps de microphone et accouplé au corps de microphone, le cadre métallique possédant une extrémité inférieure dont au moins une partie est accouplée à un substrat d'un produit utilisateur et fixée sur celui-ci lorsque la pluralité de pastilles est couplée électriquement à la surface du produit utilisateur. Le dispositif à microphone selon la présente invention comprend le cadre métallique, ce qui améliore la durabilité en cas de chocs, etc.
PCT/KR2011/002613 2010-10-12 2011-04-13 Dispositif à microphone WO2012050279A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100099302A KR101149894B1 (ko) 2010-10-12 2010-10-12 마이크로폰 장치
KR10-2010-0099302 2010-10-12

Publications (1)

Publication Number Publication Date
WO2012050279A1 true WO2012050279A1 (fr) 2012-04-19

Family

ID=45868718

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/002613 WO2012050279A1 (fr) 2010-10-12 2011-04-13 Dispositif à microphone

Country Status (3)

Country Link
KR (1) KR101149894B1 (fr)
CN (2) CN102447985A (fr)
WO (1) WO2012050279A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101149894B1 (ko) * 2010-10-12 2012-05-31 주식회사 비에스이 마이크로폰 장치
KR101156052B1 (ko) * 2010-10-19 2012-06-20 주식회사 비에스이 표면실장형 마이크로폰
KR101486920B1 (ko) 2013-12-09 2015-01-28 주식회사 비에스이 신호접점 특성을 개선한 접합형 콘덴서 마이크로폰 및 그 제조방법
KR102087644B1 (ko) 2018-12-04 2020-04-20 지엔에스티 주식회사 마이크로폰소자 제조방법 및 이를 이용한 마이크로폰소자의 세팅장치
KR102350882B1 (ko) * 2020-10-29 2022-01-13 (주)다빛센스 마이크로폰 장치
KR102341770B1 (ko) 2020-10-30 2021-12-22 지엔에스티 주식회사 신호레벨 조정과 생산성이 우수한 차량용 마이크로폰
KR102341773B1 (ko) 2020-10-30 2021-12-22 지엔에스티 주식회사 전체 증폭률과 저역/고역 개별 증폭률 제어가 가능한 차량용 마이크로폰
CN112291693B (zh) * 2020-10-30 2022-08-12 维沃移动通信有限公司 Mems麦克风
KR102659603B1 (ko) 2021-12-07 2024-04-24 지엔에스티 주식회사 생산성 향상을 위한 마이크로폰소자 제조방법
KR20230151758A (ko) 2022-04-26 2023-11-02 지엔에스티 주식회사 가속도 센서를 이용한 마이크로폰 소자

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53113369U (fr) * 1977-02-17 1978-09-09
JPS57100251U (fr) * 1980-12-11 1982-06-19
JPS6197290U (fr) * 1984-11-30 1986-06-21
JP2010141720A (ja) * 2008-12-12 2010-06-24 Funai Electric Co Ltd マイクロホンユニット及びそれを備えた音声入力装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040114773A1 (en) * 2002-12-17 2004-06-17 Jensen James M. Assembly for making an electrical connection between components
CN2891564Y (zh) * 2006-05-19 2007-04-18 瑞声声学科技(深圳)有限公司 Mems麦克风封装结构
CN201274562Y (zh) * 2008-08-08 2009-07-15 瑞声声学科技(深圳)有限公司 微型麦克风
KR101149894B1 (ko) * 2010-10-12 2012-05-31 주식회사 비에스이 마이크로폰 장치

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53113369U (fr) * 1977-02-17 1978-09-09
JPS57100251U (fr) * 1980-12-11 1982-06-19
JPS6197290U (fr) * 1984-11-30 1986-06-21
JP2010141720A (ja) * 2008-12-12 2010-06-24 Funai Electric Co Ltd マイクロホンユニット及びそれを備えた音声入力装置

Also Published As

Publication number Publication date
KR101149894B1 (ko) 2012-05-31
CN202178857U (zh) 2012-03-28
CN102447985A (zh) 2012-05-09
KR20120037689A (ko) 2012-04-20

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