WO2012046746A1 - PROCÉDÉ DE FABRICATION DE COUCHE D'ABSORPTION DE LUMIÈRE POUR CELLULE SOLAIRE À FILM MINCE SEMI-CONDUCTEUR COMPOSÉ, ET CIBLE DE PULVÉRISATION CATHODIQUE D'ALLIAGE In-Cu - Google Patents
PROCÉDÉ DE FABRICATION DE COUCHE D'ABSORPTION DE LUMIÈRE POUR CELLULE SOLAIRE À FILM MINCE SEMI-CONDUCTEUR COMPOSÉ, ET CIBLE DE PULVÉRISATION CATHODIQUE D'ALLIAGE In-Cu Download PDFInfo
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- WO2012046746A1 WO2012046746A1 PCT/JP2011/072899 JP2011072899W WO2012046746A1 WO 2012046746 A1 WO2012046746 A1 WO 2012046746A1 JP 2011072899 W JP2011072899 W JP 2011072899W WO 2012046746 A1 WO2012046746 A1 WO 2012046746A1
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- WO
- WIPO (PCT)
- Prior art keywords
- film
- alloy
- alloy film
- sputtering
- forming
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- 239000010409 thin film Substances 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 150000001875 compounds Chemical class 0.000 title claims abstract description 19
- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 75
- 238000005477 sputtering target Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 title abstract description 41
- 239000010408 film Substances 0.000 claims abstract description 227
- 238000004544 sputter deposition Methods 0.000 claims abstract description 56
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 13
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 12
- 229910000807 Ga alloy Inorganic materials 0.000 claims description 46
- 229910045601 alloy Inorganic materials 0.000 claims description 25
- 239000000956 alloy Substances 0.000 claims description 25
- 229910017767 Cu—Al Inorganic materials 0.000 claims description 19
- 239000012535 impurity Substances 0.000 claims description 4
- 238000009751 slip forming Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 abstract description 22
- 230000003647 oxidation Effects 0.000 abstract description 6
- 238000007254 oxidation reaction Methods 0.000 abstract description 6
- 230000031700 light absorption Effects 0.000 description 44
- 239000002243 precursor Substances 0.000 description 33
- 239000000203 mixture Substances 0.000 description 28
- 239000000758 substrate Substances 0.000 description 19
- 238000006243 chemical reaction Methods 0.000 description 11
- 239000007789 gas Substances 0.000 description 8
- 229910052738 indium Inorganic materials 0.000 description 7
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000000151 deposition Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 239000005361 soda-lime glass Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229910052795 boron group element Inorganic materials 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 238000006557 surface reaction Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910000846 In alloy Inorganic materials 0.000 description 1
- 229910001370 Se alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000010532 solid phase synthesis reaction Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03923—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIBIIICVI compound materials, e.g. CIS, CIGS
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type
- H01L31/0749—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN heterojunction type including a AIBIIICVI compound, e.g. CdS/CulnSe2 [CIS] heterojunction solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
L'invention fournit un procédé de fabrication de couche d'absorption de lumière pour cellule solaire à film mince conducteur composé permettant d'empêcher la formation d'une couche discontinue lors de la formation d'un film In pure par un procédé de pulvérisation, et permettant de réguler l'oxydation de Ga lors de la fabrication par exemple d'une couche d'absorption de lumière à base de CIGS contenant de préférence un Ga. Plus précisément, l'invention concerne un procédé de fabrication de couche d'absorption de lumière pour cellule solaire à film mince semi-conducteur composé contenant un Cu, un In, au moins un élément parmi un Ga et un Al, et un Se; et ce procédé comporte une étape de formation de film en alliage In-Cu par pulvérisation cathodique.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-225591 | 2010-10-05 | ||
JP2010225591A JP2012079997A (ja) | 2010-10-05 | 2010-10-05 | 化合物半導体薄膜太陽電池用光吸収層の製造方法、およびIn−Cu合金スパッタリングターゲット |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012046746A1 true WO2012046746A1 (fr) | 2012-04-12 |
Family
ID=45927741
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/072899 WO2012046746A1 (fr) | 2010-10-05 | 2011-10-04 | PROCÉDÉ DE FABRICATION DE COUCHE D'ABSORPTION DE LUMIÈRE POUR CELLULE SOLAIRE À FILM MINCE SEMI-CONDUCTEUR COMPOSÉ, ET CIBLE DE PULVÉRISATION CATHODIQUE D'ALLIAGE In-Cu |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2012079997A (fr) |
TW (1) | TWI460874B (fr) |
WO (1) | WO2012046746A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017106091A (ja) * | 2015-12-11 | 2017-06-15 | Jx金属株式会社 | In−Cu合金スパッタリングターゲット及びその製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8703524B1 (en) * | 2012-11-29 | 2014-04-22 | Tsmc Solar Ltd. | Indium sputtering method and materials for chalcopyrite-based material usable as solar cell absorber layers |
AT13564U1 (de) | 2013-01-31 | 2014-03-15 | Plansee Se | CU-GA-IN-NA Target |
JP6798852B2 (ja) | 2015-10-26 | 2020-12-09 | 三菱マテリアル株式会社 | スパッタリングターゲット及びスパッタリングターゲットの製造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0483378A (ja) * | 1990-07-25 | 1992-03-17 | Matsushita Electric Ind Co Ltd | カルコパイライト薄膜の作製方法及び太陽電池 |
JPH05145100A (ja) * | 1991-11-21 | 1993-06-11 | Fuji Electric Corp Res & Dev Ltd | 薄膜太陽電池の製造方法および製造装置 |
JP2000501232A (ja) * | 1995-12-12 | 2000-02-02 | デイヴィス,ジョセフ アンド ネグレイ | 高効率太陽電池製造のための電着によるCu▲下x▼In▲下y▼Ga▲下z▼Se▲下n▼(x=0〜2,y=0〜2,z=0〜2,n=0〜3)先駆薄膜の製造 |
WO2003005456A1 (fr) * | 2001-07-06 | 2003-01-16 | Honda Giken Kogyo Kabushiki Kaisha | Procede de formation d'une couche absorbant la lumiere |
JP2003282600A (ja) * | 2002-03-25 | 2003-10-03 | Honda Motor Co Ltd | 光吸収層の作製方法および装置 |
JP2007503708A (ja) * | 2003-08-14 | 2007-02-22 | ユニヴァーシティ オブ ヨハネスバーグ | Ib−iiia−via族四元合金又は五元合金以上の合金から成る半導体薄膜を製造するための方法 |
JP2007529907A (ja) * | 2004-03-15 | 2007-10-25 | ソロパワー、インコーポレイテッド | 太陽電池製造のための半導体の薄層を堆積する方法および装置 |
JP2009513020A (ja) * | 2005-10-19 | 2009-03-26 | ソロパワー、インコーポレイテッド | 前駆体層を光起電性吸収体に変換するための方法と装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM385798U (en) * | 2010-02-25 | 2010-08-01 | Univ Minghsin Sci & Tech | Photovoltaic cell structure |
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2010
- 2010-10-05 JP JP2010225591A patent/JP2012079997A/ja not_active Withdrawn
-
2011
- 2011-10-04 WO PCT/JP2011/072899 patent/WO2012046746A1/fr active Application Filing
- 2011-10-05 TW TW100136086A patent/TWI460874B/zh not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0483378A (ja) * | 1990-07-25 | 1992-03-17 | Matsushita Electric Ind Co Ltd | カルコパイライト薄膜の作製方法及び太陽電池 |
JPH05145100A (ja) * | 1991-11-21 | 1993-06-11 | Fuji Electric Corp Res & Dev Ltd | 薄膜太陽電池の製造方法および製造装置 |
JP2000501232A (ja) * | 1995-12-12 | 2000-02-02 | デイヴィス,ジョセフ アンド ネグレイ | 高効率太陽電池製造のための電着によるCu▲下x▼In▲下y▼Ga▲下z▼Se▲下n▼(x=0〜2,y=0〜2,z=0〜2,n=0〜3)先駆薄膜の製造 |
WO2003005456A1 (fr) * | 2001-07-06 | 2003-01-16 | Honda Giken Kogyo Kabushiki Kaisha | Procede de formation d'une couche absorbant la lumiere |
JP2003282600A (ja) * | 2002-03-25 | 2003-10-03 | Honda Motor Co Ltd | 光吸収層の作製方法および装置 |
JP2007503708A (ja) * | 2003-08-14 | 2007-02-22 | ユニヴァーシティ オブ ヨハネスバーグ | Ib−iiia−via族四元合金又は五元合金以上の合金から成る半導体薄膜を製造するための方法 |
JP2007529907A (ja) * | 2004-03-15 | 2007-10-25 | ソロパワー、インコーポレイテッド | 太陽電池製造のための半導体の薄層を堆積する方法および装置 |
JP2009513020A (ja) * | 2005-10-19 | 2009-03-26 | ソロパワー、インコーポレイテッド | 前駆体層を光起電性吸収体に変換するための方法と装置 |
Non-Patent Citations (1)
Title |
---|
STEVEN P. GRINDLE ET AL.: "Preparation and properties of CuInS2 thin films produced by exposing rf-sputtered Cu-In films to an H2S atmosphere", APPL. PHYS. LETT., vol. 35, no. 1, 1979, pages 24 - 26 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017106091A (ja) * | 2015-12-11 | 2017-06-15 | Jx金属株式会社 | In−Cu合金スパッタリングターゲット及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2012079997A (ja) | 2012-04-19 |
TWI460874B (zh) | 2014-11-11 |
TW201220522A (en) | 2012-05-16 |
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