WO2012043951A1 - Appareil à scier les barreaux monocristallins - Google Patents

Appareil à scier les barreaux monocristallins Download PDF

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Publication number
WO2012043951A1
WO2012043951A1 PCT/KR2011/002510 KR2011002510W WO2012043951A1 WO 2012043951 A1 WO2012043951 A1 WO 2012043951A1 KR 2011002510 W KR2011002510 W KR 2011002510W WO 2012043951 A1 WO2012043951 A1 WO 2012043951A1
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WO
WIPO (PCT)
Prior art keywords
slurry
single crystal
wire saw
sawing apparatus
crystal ingot
Prior art date
Application number
PCT/KR2011/002510
Other languages
English (en)
Inventor
Yang Sub Kim
Original Assignee
Lg Siltron Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Siltron Inc. filed Critical Lg Siltron Inc.
Priority to JP2013531465A priority Critical patent/JP2013539231A/ja
Priority to EP11829457.8A priority patent/EP2621699B1/fr
Publication of WO2012043951A1 publication Critical patent/WO2012043951A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire

Definitions

  • Embodiments relate to a sawing apparatus of a single crystal ingot.
  • Wafers such as silicon are manufactured by slicing a single silicon ingot into slices having a thin thickness.
  • a single crystal ingot is sliced in a wafer form using a predetermined sawing apparatus, e.g., a wire saw while the ingot mounted on a table is moved and slurry is supplied.
  • a predetermined sawing apparatus e.g., a wire saw
  • the slurry (abrasive + oil) acting as slicing and lubricating agents in the wire saw largely affects the quality of the sliced wafer.
  • the slurry smeared on a wire acts as the slicing agent for slicing the ingot, scattered slurry or slurry scattered by the wire reciprocated at a high speed may be permeated and accumulated between wafers generated by slicing the ingot to deform a shape of the wafer.
  • Fig. 1 is a graph illustrating a sliced wrap profile due to slurry supply failure in a related art.
  • Fig. 2 is a nano-map illustrating an example of nano-waviness due to nonuniformly sliced wrap profile.
  • the slurry scattered when an end (a rear end to be sliced) of the silicon ingot is sliced within the wire saw may have a bad influence on the wafer or straightness of the wire to deform a shape of the end of the wafer.
  • a flow amount of slurry may be generally reduced at the rear end of the ingot to be sliced.
  • a slurry curtain phenomenon slurry is uniformly spread
  • the slurry supply failure may occur at a specific portion of the ingot. Therefore, the sliced wrap profile of the wafer may be nonuniform. Also, due to the nonuniform shape of the sliced wrap profile of the wafer, as shown in Fig. 2, waviness pattern errors may occur in a nanotopography process after a polishing process.
  • Embodiments provide a single crystal ingot sawing apparatus in which scattered slurry or slurry permeated and accumulated between wafers generated by slicing the ingot except slurry smeared on a wire saw used for slicing an ingot is controlled to prevent a sliced shape of the wafer from being deformed in a wire saw process.
  • a single crystal ingot sawing apparatus includes: a wire saw configured to slice an ingot; a roller for configured to drive the wire saw; and a slurry bath for configured to receive slurry supplied onto the wire saw.
  • the slurry bath may be disposed on each of both sides of the ingot.
  • the slurry bath may have a groove through which the wire saw passes.
  • the groove may be defined in a side surface or an upper portion of the slurry bath.
  • the single crystal ingot sawing apparatus may further include a guide roller guiding the wire saw inside the slurry bath.
  • the guide roller may be immersed into the slurry received in the slurry bath.
  • the guide roller may be provided in plurality of along a movement direction of the wire saw.
  • a single crystal ingot sawing apparatus includes: a wire saw configured to slice an ingot; a roller for configured to drive the wire saw; and a slurry blocking cover configured to prevent slurry supplied onto the wire saw from being scattered.
  • the slurry blocking cover may have a groove through which the wire saw passes.
  • the groove may have a vertical width greater than a horizontal width thereof.
  • the deformation, which may occur by the scattered slurry and the slurry curtain phenomenon failure, of the sliced shape of the wafer at an end of the ingot to be sliced may be improved.
  • an occurrence of the waviness of the wafer disposed at a machine-side may be controlled to improve the nanotopography.
  • the guide roller may be disposed within the slurry bath to stably supply the slurry onto the surface of the ware saw taken into the slurry bath.
  • Fig. 1 is a graph illustrating a sliced wrap profile due to a slurry supply failure in a related art.
  • Fig. 2 is a nano-map illustrating an example of non-waviness due to nonuniformly sliced wrap profile.
  • Fig. 3 is a view of a single crystal ingot sawing apparatus according to an embodiment.
  • Fig. 4 is a view illustrating an example of a slurry blocking cover in the single crystal ingot sawing apparatus according to an embodiment.
  • Fig. 5 is a view illustrating another example of a slurry blocking cover in the single crystal ingot sawing apparatus according to an embodiment.
  • Fig. 6 is a perspective view of a slurry bath in the single crystal ingot sawing apparatus according to an embodiment.
  • Fig. 7 is a side view of the slurry bath in the single crystal ingot sawing apparatus according to an embodiment.
  • Fig. 8 is a sectional view of the slurry bath in the single crystal ingot sawing apparatus according to an embodiment.
  • Figs. 9 and 10 are sectional views of a slurry bath in a single crystal ingot sawing apparatus according to another embodiment.
  • Fig. 11 is a view illustrating an example of a sliced wrap profile when the single crystal ingot sawing apparatus is applied according to an embodiment.
  • a single crystal ingot is manufactured as follows: a single crystal body having a rod shape is manufactured using a czochralski (CZ) method or a float zone (FZ) method. Then, an external surface of the single crystal body is processed to allow the single crystal body to have a uniform diameter. Thereafter, the single crystal body is sliced at a certain length.
  • CZ czochralski
  • FZ float zone
  • the single crystal body ingot manufactured as described above may be sliced in a wafer form using a predetermined sawing apparatus, e.g., a wire saw while the ingot mounted on a table is moved and slurry is supplied.
  • a predetermined sawing apparatus e.g., a wire saw
  • Fig. 3 is a view of a single crystal ingot sawing apparatus 100 according to an embodiment.
  • the current embodiment provides a single crystal ingot sawing apparatus in which scattered slurry or slurry permeated and accumulated between wafers generated by slicing the ingot except slurry smeared on a wire saw used for slicing an ingot may be controlled to prevent a sliced shape of the wafer from being deformed in a wire saw process.
  • the single crystal ingot sawing apparatus 100 may include a wire saw W for slicing an ingot IG, rollers R1 and R2 for driving the wire saw W, and a slurry blocking cover 130 for preventing slurry S supplied into the wire saw W from being scattered.
  • the ingot IG may be mounted on a work plate 110 using a beam 112 and then loaded on the single crystal ingot sawing apparatus 100. Thereafter, the ingot IG may be sliced.
  • Fig. 4 is a view illustrating an example of a slurry blocking cover in the single crystal ingot sawing apparatus according to an embodiment
  • Fig. 5 is a view illustrating another example of a slurry blocking cover in the single crystal ingot sawing apparatus according to an embodiment.
  • a slurry blocking cover 130 may be disposed to prevent unnecessary slurry S except slurry S smeared on the wire saw from being accessed to the ingot IG. That is, the single crystal ingot sawing apparatus 100 may control a flow of the slurry which may have a bad influence on quality depending on the sliced shape.
  • the slurry blocking cover 130 may have a groove through which the wire saw W passes.
  • the groove may be a groove G1 having an oval shape or a groove G2 having a square shape, but is not limited thereto.
  • the groove may have a circular shape.
  • the groove may have a vertical width greater than a horizontal width thereof.
  • the slurry S is injected onto the wire saw reciprocated at a high speed, a phenomenon in which the slurry S is scattered in an undesired direction may be controlled.
  • the slurry blocking cover 130 may include the groove through which the wire saw W passes.
  • the groove may have a gap equal to that of a pitch of a wire guide (not shown).
  • the groove is a path through which the wire saw passes, the groove may be sufficiently considered so that it does not interfere with the wire saw.
  • the single crystal ingot sawing apparatus 100 may be designed in consideration of the wire saw hanging by a weight of the ingot IG and a downward load of the table (work plate) when the ingot is sliced.
  • the slurry blocking cover 130 may be disposed both sides of the ingot due to the reciprocating motion of the wire saw, but is not limited thereto.
  • Fig. 6 is a perspective view of a slurry bath in the single crystal ingot sawing apparatus according to an embodiment.
  • Fig. 7 is a side view of the slurry bath in the single crystal ingot sawing apparatus according to an embodiment.
  • Fig. 8 is a sectional view of the slurry bath in the single crystal ingot sawing apparatus according to an embodiment.
  • the single crystal ingot sawing apparatus may adopt a slurry bath 140 for receiving the slurry to prevent a slurry curtain phenomenon form nonuniformly occurring and prevent the slurry S injected from a slurry nozzle from being scattered.
  • the slurry bath 140 may be disposed on both sides of the ingot, but is not limited thereto.
  • the wire saw W may pass through the slurry bath 140 to supply the slurry S to the wire saw W.
  • the slurry bath 140 may control the nonuniform slurry curtain phenomenon which may occur during the slicing of the ingot in an existing nozzle method to realize the uniform slurry curtain phenomenon.
  • wire saw W passes through the slurry bath 140 and is reciprocated, unnecessary slurry scattering may be prevented when compared to the existing nozzle method in which slurry is injected through a nozzle.
  • a flow of the slurry except the slurry S smeared on the wire saw W may be controlled.
  • a groove H may be defined in a lower end of the slurry bath 140 to prevent Si and Fe fine powder generated during the slicing of the ingot from being accumulated.
  • a gap of the groove H may be adequately designed.
  • the single crystal ingot sawing apparatus 100 may adopt a slurry nozzle above a main roller to realize a cooling effect for controlling an expansion of a wire guide, which may occur during the slicing of the ingot, but is not limited thereto.
  • the slurry may be supplied from the slurry bath 140 to the slurry nozzle 120 through a slurry pipe 142, but is not limited thereto.
  • the single crystal ingot sawing apparatus 100 includes a slurry collection bath (not shown) in the structure as shown in Fig. 3 to collect the slurry dropping down from an upper side. Also, the collected slurry may be filtered using a predetermined filter to circulate the filtered slurry again into the slurry bath 140, but is not limited thereto.
  • a second groove G3 may be defined in both side surfaces of the slurry bath 140 facing each other to pass through the wire saw W.
  • the second groove G3 may have an oval shape, a square shape, or a circular shape.
  • the present disclosure is not limited to the shape of the second grove G3.
  • a guide roller 150 may be further provided within the above-described slurry bath 140 to immerse the wire saw W into the slurry.
  • the guide roller 150 may include first to third guide rollers 152, 154, and 156.
  • the first and second guide rollers 152 and 154 are disposed on a side of the second groove G3 through which the wire saw W is taken in or out.
  • the third guide roller 156 is disposed between the first guide roller 152 and the second guide roller 154.
  • the third guide roller 156 may be vertically spaced from the first and second guide rollers 152 and 154 so that it is immersed in the slurry received in the slurry bath 140.
  • the wire saw W taken into the slurry bath 140 is moved toward the third guide roller 156 via the first guide roller 152. Also, the slurry is uniformly supplied onto a surface of the wire saw W while the wire saw W is moved toward the third guide roller 156.
  • the wire saw W on which the slurry is uniformly supplied may be taken out to the outside of the slurry bath 140 via the second guide roller 154.
  • slurry bath 140 and the guide roller 150 may be operated as follows.
  • Figs. 9 and 10 are sectional views of a slurry bath in a single crystal ingot sawing apparatus according to another embodiment.
  • a groove H is defined in a lower end of a slurry bath 140.
  • a second groove G3 through which a wire saw W is taken in or out is disposed on both side surfaces of the slurry bath 140 facing each other.
  • a guide roller is disposed within the slurry bath 140.
  • the guide roller 150 moves the wire saw W to uniformly supply slurry onto the wire saw W taken in the slurry bath 140.
  • the guide roller 150 includes first to fourth guide rollers 152, 154, 156, and 158.
  • the first and second rollers 152 and 154 are disposed on a side of the second groove G3 through which the wire saw W is taken in or out.
  • the third guide roller 156 and the fourth guide roller 158 are vertically spaced from the first guide roller 152 and the second guide roller 154, respectively.
  • the third guide roller 156 and the fourth guide roller 158 are immersed in the slurry received in the slurry bath 140.
  • the wire saw W taken in the slurry bath 140 is immersed in the slurry bath 140 while it passes through the third guide roller 156 and the fourth guide roller 158 to more uniformly supply the slurry onto a surface of the wire saw W.
  • a groove H may be defined in a lower end of the slurry bath 140.
  • a second groove G3 through which the wire saw W is taken in or out may be defied in an upper portion of the slurry bath 140.
  • a guide roller 150 for immersing the wire saw W into the slurry is disposed within the slurry bath 140.
  • the guide roller 150 may be disposed so that it is immersed into the slurry received in the slurry bath 140. Also, the guide roller 150 may be provided in plurality. Here, the plurality of guide rollers 150 may be disposed horizontally spaced from each other. Thus, the slurry may be uniformly supplied onto a surface of the wire saw W while the wire saw W taken in the slurry bath 140 passes through the guide rollers 156 and 158. Here, auxiliary rollers 162 and 164 may be further disposed outside the surly bath 140 to guide the wire saw W to the inside of the slurry bath 140.
  • Fig. 11 is a view illustrating an example of a sliced wrap profile when the single crystal ingot sawing apparatus is applied according to an embodiment.
  • the deformation, which may occur by the scattered slurry and the slurry curtain phenomenon failure, of the sliced shape of the wafer at an end of the ingot to be sliced may be improved as shown in Fig. 11.
  • the warp quality of the wafer may be improved.
  • the warp represents a degree of the deformation of the wafer, and also represents a difference between a maximum vibration and a minimum vibration from a reference surface to a medium surface.
  • a related-art warp average of about 15 ⁇ m or more may be improved to a warp average of less than about 15 ⁇ m.
  • an occurrence of the waviness of the wafer disposed at a machine-side may be controlled to improve the nanotopography.
  • the nano represents a value which expresses a height difference of about 20 nm to about 100 nm on the surface of the wafer having a width of about 0.5 mm to about 25 mm as a figure.
  • a related-art peak to valley (PV) of about 30 nm may be improved to a PV of about 26 nm.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

La présente invention concerne un appareil à scier les barreaux monocristallins. Cet appareil à scier les barreaux monocristallins comprend un fil scieur configuré pour débiter en tranches un barreau, un cylindre configuré pour entraîner le fil scieur, et un bain de boue de sciage configuré pour recevoir la boue de sciage appliquée sur le fil scieur.
PCT/KR2011/002510 2010-09-29 2011-04-11 Appareil à scier les barreaux monocristallins WO2012043951A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013531465A JP2013539231A (ja) 2010-09-29 2011-04-11 単結晶インゴット切断装置
EP11829457.8A EP2621699B1 (fr) 2010-09-29 2011-04-11 Appareil à scier les barreaux monocristallins

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0094437 2010-09-29
KR1020100094437A KR101279681B1 (ko) 2010-09-29 2010-09-29 단결정 잉곳 절단장치

Publications (1)

Publication Number Publication Date
WO2012043951A1 true WO2012043951A1 (fr) 2012-04-05

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PCT/KR2011/002510 WO2012043951A1 (fr) 2010-09-29 2011-04-11 Appareil à scier les barreaux monocristallins

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US (1) US8752537B2 (fr)
EP (1) EP2621699B1 (fr)
JP (1) JP2013539231A (fr)
KR (1) KR101279681B1 (fr)
WO (1) WO2012043951A1 (fr)

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CN111421688A (zh) * 2020-05-09 2020-07-17 西安奕斯伟硅片技术有限公司 多线切割装置及多线切割方法

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JP6402700B2 (ja) * 2015-10-20 2018-10-10 信越半導体株式会社 ワークの切断方法及びワイヤソー
CN106124525A (zh) * 2016-08-24 2016-11-16 镇江荣德新能源科技有限公司 一种晶体硅块表面研磨及杂质检测一体化装置
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Also Published As

Publication number Publication date
US20130081606A1 (en) 2013-04-04
EP2621699A4 (fr) 2017-08-30
KR20120032891A (ko) 2012-04-06
EP2621699B1 (fr) 2021-07-21
KR101279681B1 (ko) 2013-06-27
US8752537B2 (en) 2014-06-17
JP2013539231A (ja) 2013-10-17
EP2621699A1 (fr) 2013-08-07

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