WO2012040885A1 - 一种模切型标签的加工方法及加工设备 - Google Patents

一种模切型标签的加工方法及加工设备 Download PDF

Info

Publication number
WO2012040885A1
WO2012040885A1 PCT/CN2010/001743 CN2010001743W WO2012040885A1 WO 2012040885 A1 WO2012040885 A1 WO 2012040885A1 CN 2010001743 W CN2010001743 W CN 2010001743W WO 2012040885 A1 WO2012040885 A1 WO 2012040885A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
raw material
circuit structure
layer circuit
folding
Prior art date
Application number
PCT/CN2010/001743
Other languages
English (en)
French (fr)
Inventor
黄佳佳
Original Assignee
Huang Jiajia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huang Jiajia filed Critical Huang Jiajia
Publication of WO2012040885A1 publication Critical patent/WO2012040885A1/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar

Definitions

  • the invention relates to a method and a device for processing a substrateless electronic soft label, in particular to a method and a processing device for a die-cut label.
  • a high-precision radio frequency soft tag is disclosed, for example, in the Chinese invention patent specification (authorization bulletin number: CN100423026C).
  • the base layer of the label is composed of an insulating film layer and a conductive layer respectively disposed on the front surface and the back surface of the insulating film layer, and the conductive layer has a decoding circuit composed of a capacitor, a wire and a decoding point, and the capacitor is located by a wire.
  • the periphery of the coil is characterized in that: the width of the capacitor wire and the coil wire gradually decreases from the outside to the inside.
  • the width of the capacitor wire on the decoding circuit is larger than the width of the coil wire, which is advantageous for increasing the capacity of the capacitor region, and is advantageous for improving the accuracy of the label.
  • the existing electronic tag does have the following disadvantages: (1) The existing electronic tag requires a substrate material (insulating film layer), resulting in an increase in the thickness of the product. (2) The existing electronic labels all require a substrate material (insulating film layer), resulting in an increase in the production cost of the product. (3) The existing electronic labels all require the substrate material (insulating film layer), which causes the design of the decoding point (or connection point) and the design process of the capacitor to take into account the factors of the insulating film layer. Otherwise, the performance of the tag (eg sensitivity) will be difficult to guarantee.
  • a substrateless electronic label As shown in Figure 1-3: It has a circuit consisting of two conductive layers of front and back directly bonded to each other, said front and back conductive layers having a coil with a capacitance and a corresponding connection point in the middle of the coil.
  • the bonded hot melt adhesive not only functions to conform to the front and back circuits, but also the hot melt adhesive layer also functions as an insulating film layer.
  • the product has the following advantages: (1) The substrate material of the insulating film layer is reduced in thickness and weight of the label, and the production cost is also lowered. (2) Design and production can reduce the consideration of insulating film factors, and is more conducive to controlling the sensitivity of electronic tags.
  • the above-mentioned substrateless electronic label has structurally compensated for the defects of the lining label having the insulating film, but how to realize the large-scale industrial production processing of the substrateless label and the production and processing thereof, There is no mention in the technology.
  • the object of the present invention is to provide a method and a processing device for a die-cut label, which are mainly used for large-scale production of the above-mentioned substrateless electronic label, which not only requires improvement of production efficiency, but also ensures product in the production process. quality.
  • the present invention has been achieved in this way.
  • a method of processing a die-cut label characterized in that the production steps are:
  • Step 1 feeding the raw material with the conductive layer material on the bottom layer to the die-cutting machine, and continuously processing the front conductive layer circuit structure and the back conductive layer circuit structure on the raw material by the die-cutting machine, the front conductive layer circuit structure And the back conductive layer circuit structure is symmetrically distributed on both sides of the intermediate boundary line on the raw material to ensure the front conductive layer circuit structure after the raw material is folded according to the intermediate boundary line between the adjacent front conductive layer circuit structure and the back conductive layer circuit structure. Combining with the back conductive layer circuit structure to form a complete tag circuit;
  • Step 2 The stripping mechanism peels off the scrap material of the conductive layer material on the raw material from the bottom layer, and rolls the bottom a material having a front conductive layer circuit structure and a back conductive layer circuit structure on the layer;
  • Step 3 coating a hot melt adhesive on the conductive layer material of the raw material
  • Step 4 accurately folding the raw material along the intermediate boundary line by the folding mechanism, and conveying the folded raw material to the hot pressing mechanism;
  • Step 5 hot-pressing the front conductive layer circuit structure and the back conductive layer circuit structure on the hot-melt-coated raw material by hot pressing, and transferring the raw material after the hot pressing is completed to the winding mechanism;
  • Step 6 The electronic label raw material after hot press forming is rolled up by the winding mechanism.
  • the method for processing a die-cut label is characterized in that the coating of the hot-melt adhesive on the conductive layer material of the raw material is performed before the raw material is fed into the die-cutting machine.
  • the method for processing a die-cut label is characterized in that the intermediate boundary line and the conductive layer material in the vicinity thereof are retained in the die-cutting process of the first step, and the film is cut in a space on the remaining conductive layer material. Cut out the middle dividing line.
  • a die-cut label processing apparatus for carrying out the method as described above, characterized in that it comprises a film slitter for carrying out step one, a stripping mechanism for carrying out step two and an uninterrupted implementation step three - a combination of six electronic tags;
  • the bonding mechanism of the electronic tag is disposed between a feeding roller and a take-up roller, wherein the feeding roller is used for feeding the raw material before folding, and the take-up roller is used for winding the hot-pressed electronic label tape;
  • a folding pusher, a folding presser and a hot press are sequentially disposed on a side of the conveying path between the feeding roller and the take-up roller;
  • the front side of the folding pusher has a folding positioning piece at a position of a middle boundary line of the strip , for folding the raw material based on the position of the intermediate boundary line;
  • the folded pressure plate is also disposed at the middle boundary position of the tape, which is an L-shaped structure, and forms a folding groove with the hot pressing table for
  • the material after folding by the folding pusher is further folded to ensure the front conductive layer circuit on the raw material
  • the structure and the back conductive layer circuit structure are folded and located at a position where they can be directly thermocompression bonded;
  • the hot press is used for hot pressing bond
  • the processing apparatus of the die-cut type label characterized in that: the peeling mechanism is composed of a peeling roller for continuously stripping the conductive layer material scrap on the raw material, and a take-up roller for The raw material having the front conductive layer circuit structure and the back conductive layer circuit structure on the bottom layer is wound up.
  • the processing device for the die-cut label is characterized in that: the film cutter is a WQM series automatic self-adhesive label die-cutting machine.
  • the present invention provides a method and a processing apparatus for stably and efficiently producing a substrateless die-cut type electronic tag by the above technical solution.
  • Fig. 1 is a schematic view showing the circuit structure of a front conductive layer of an electronic tag produced by the method of the present invention.
  • 2 is a schematic view showing the circuit structure of the back surface conductive layer of the electronic tag produced by the method of the present invention.
  • Fig. 3 is a schematic view showing the structure of the front and back conductive layer circuits of the electronic tag produced by the method of the present invention.
  • Figure 4 is a flow chart of the process steps of the present invention.
  • Fig. 5 is a top plan view showing the coupling mechanism of the electronic tag of the production equipment of the present invention.
  • Figure 6 is a structural view of the raw material after the film cutting step in the production process of the method of the present invention.
  • Figure 7 is a view showing another structure of the raw material after the film cutting step in the production process of the method of the present invention.
  • the present invention discloses a method for processing a die-cut label.
  • the production steps are as follows: Step 1: feeding the raw material of the conductive layer material (such as aluminum foil) on the bottom layer to the die-cutting machine, The die-cutting machine continuously processes the front conductive layer circuit structure and the back conductive layer circuit junction on the raw material.
  • the front conductive layer circuit structure and the back conductive layer circuit structure are symmetrically distributed on both sides of the intermediate boundary line (see FIG. 6) to ensure that the raw material is electrically conductive according to the adjacent front conductive layer circuit structure and the back surface.
  • the front conductive layer circuit structure and the back conductive layer circuit structure are combined to form a complete label circuit;
  • Step 2 The stripping mechanism peels off the scrap of the conductive layer material on the raw material from the bottom layer, and winds up the raw material having the circuit structure of the front conductive layer and the circuit structure of the back conductive layer on the bottom layer;
  • Step 3 coating a hot melt adhesive on the conductive layer material of the raw material
  • Step 4 accurately folding the raw material along the intermediate boundary line by the folding mechanism, and conveying the folded raw material to the hot pressing mechanism;
  • Step 5 hot-pressing the front conductive layer circuit structure and the back conductive layer circuit structure on the hot-melt-coated raw material by hot pressing, and transferring the raw material after the hot pressing is completed to the winding mechanism;
  • Step 6 The electronic label raw material after hot press forming is rolled up by the winding mechanism.
  • the method of processing a die-cut label is characterized in that the application of the hot-melt adhesive on the conductive layer material of the raw material is performed before the raw material is fed into the die-cutting machine.
  • the intermediate boundary line and the conductive layer material in the vicinity thereof are retained, and the intermediate boundary line is cut out on the remaining conductive layer material in the form of a gap cut, as shown in FIG. 7 Shown.
  • the invention further discloses a processing apparatus for carrying out the method as described above, which comprises a film slitter for carrying out step one, a stripping mechanism for carrying out step two, and an electronic label for the uninterrupted implementation of steps three-six Combine institutions.
  • Membrane cutting machine can use general-purpose products, such as: WQM
  • the automatic self-adhesive label die-cutting machine; and the peeling mechanism is also a relatively conventional structure, which can be composed of a peeling roller and a take-up roller, wherein the peeling roller is used for continuously peeling off the conductive layer material waste on the raw material, and the receiving roller is used for The raw material having the front conductive layer circuit structure and the back conductive layer circuit structure on the bottom layer is wound up.
  • An inventive feature of the present invention is the uninterrupted implementation of the electronic label attachment mechanism of steps three-six.
  • the bonding mechanism of the electronic tag is disposed between a feeding roller 41 for feeding the raw material before folding, and a winding roller 42 for winding and shrinking.
  • the following electronic tape is provided with a folding pusher 43, a folding presser 44 and a hot press 45 on the side of the conveying path between the feeding roller 41 and the take-up roller 42; the folding pusher 43
  • the front side has a folding positioning piece 461, 462 at a position of a middle boundary line of the strip for folding the raw material on the basis of the position of the intermediate boundary line; the folded platen 44 is also disposed at the middle boundary of the strip.
  • the hot press 45 is used for hot-press bonding the front conductive layer circuit structure and the back conductive layer circuit structure on the raw material corresponding to the folded position.
  • the hot head, the folding platen 44, and the folding positioning pieces 461, 462 of the hot press 45 may be disposed above the hot pressing table 47.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Making Paper Articles (AREA)

Description

一种模切型标签的加工方法及加工设备 技术领域
本发明涉及一种无衬底的电子软标签的加工方法和设备， 特别是一种模 切型标签的加工方法及加工设备。
背景技术
随着电子技术的发展， 具有安全防伪功能的电子标签逐渐走入到我们的 生活中， 它还同时具有灵敏度高、 体积小、 成本低等优点。
如中国发明专利说明书（授权公告号： CN100423026C)公开了一种高精 度射频软标签。 该标签的基层由一绝缘膜层和在绝缘膜层正面和背面分别贴 设的导电层构成， 所述的导电层上具有由电容、 导线和解码点构成的解码电 路， 该电容位于由导线构成的线圈外围， 其特征在于： 该电容导线和线圈导 线的宽度由外向内逐渐减小。 该解码电路上的电容导线的宽度大于线圈导线 的宽度， 有利于增加电容区的容量， 有利于提高标签的精度。 该线圈导线宽 度由外向内逐渐减小， 有利于增加线圈的绕线圈数， 进而增长了线圈导线， 使线圈的电感量得到很大的提高， 也有利于提高标签的精度。 但是， 现有的 这种电子标签确具有如下缺点： （1 )现有的电子标签均需要衬底材料（绝缘 膜层） ， 造成了产品的厚度增加。 （2)现有的电子标签均需要衬底材料（绝 缘膜层）， 造成了产品的生产成本上升。 （3)现有的电子标签均需要衬底材 料（绝缘膜层） ， 造成了其解码点 （或连接点） 的设计加工、 电容的设计加 工过程中均需要将绝缘膜层的因素考虑在内， 否则标签的性能（如： 灵敏度) 将难以保障。
为了解决上述问题， 业者开发了一种无衬底电子标签， 如图 1-3所示： 它具有由直接相互贴合的正面和背面两层导电层构成的电路， 所述的正面和 背面导电层上具有带电容的线圈和位置对应的位于线圈中间的连接点。 正面 和背面贴合时， 粘接的热熔胶不但起到了贴合正面和背面电路的作用， 而且 热熔胶层还具有绝缘膜层的作用， 该产品具有的优点是： （1 )减少了绝缘膜 层的衬底材料， 因此标签的厚度和重量均降低， 生产成本也有所下降。 （2) 设计和生产中可以减少对绝缘膜层因素的考虑， 更有利于控制电子标签的灵 敏度。
目前， 上述无衬底的电子标签已经从结构上弥补了具有绝缘膜的衬第标 签所存在的缺陷， 但是， 如何实现无衬底标签大规模工业生产加工以及其生 产加工的设备， 在现有技术中均没有提及。
发明内容
本发明的目的在于提供一种模切型标签的加工方法及加工设备， 主要用 于规模化的生产上述的无衬底电子标签， 它不但要求提高生产效率， 而且要 求在生产过程中确保产品的质量。
为实现上述目的， 本发明是这样实现的。
一种模切型标签的加工方法， 其特征在于生产步骤是：
步骤一、 将底层上粘接有导电层材料的原料送入模切机， 通过模切机在 原料上不断加工出正面导电层电路结构和背面导电层电路结构， 所述的正面 导电层电路结构和背面导电层电路结构在原料上对称的分布在中间分界线两 侧， 以确保当原料按相邻的正面导电层电路结构和背面导电层电路结构的中 间分界线折叠后， 正面导电层电路结构和背面导电层电路结构结合形成完整 的标签电路；
步骤二、 剥料机构将原料上的导电层材料废料从底层上剥离， 并卷收底 层上具有正面导电层电路结构和背面导电层电路结构的原料；
步骤三、 在原料的导电层材料上涂覆热熔胶；
步骤四、 通过折叠机构将原料沿着中间分界线进行准确折叠， 并将折叠 后的原料输送到热压机构；
步骤五、 通过热压机构将涂覆有热熔胶的原料上的正面导电层电路结构 和背面导电层电路结构进行热压结合， 热压结合完成后的原料输送到卷收机 构；
步骤六、 通过卷收机构将热压成型后的电子标签原料进行卷收。
所述的模切型标签的加工方法， 其特征在于所述的在原料的导电层材料 上涂覆热熔胶是在原料送入模切机前完成。
所述的模切型标签的加工方法， 其特征在于所述的步骤一的模切过程中 保留中间分界线及其附近的导电层材料， 并在保留的导电层材料上以间隔切 断的形式膜切出中间分界线。
一种模切型标签的加工设备， 用于实施如上所述的方法， 其特征在于它 包括用于实施步骤一的膜切机、 用于实施步骤二的剥离机构和不间断的实施 步骤三-六的电子标签的结合机构；
该电子标签的结合机构设置在一送料辊和一卷收辊之间， 其中送料辊用 于送出折叠前的原料， 卷收辊用于卷收热压结合后的电子标签料带； 所述的 送料辊和卷收辊之间的输送路径一侧依次设有折叠推头、折叠压板和热压机； 所述的折叠推头前方两侧分别具有位于料带的中间分界线位置的折叠定位 片， 用于将原料以中间分界线位置为基准进行折叠； 所述的折叠压板也设置 在料带的中间分界线位置， 它为 L型结构， 并与热压台面形成一折叠槽， 用 于将经过折叠推头推折后的原料进一步折叠以确保原料上的正面导电层电路 结构和背面导电层电路结构折叠后位于可直接热压结合的位置； 所述的热压 机用于将折叠后位置对应的原料上的正面导电层电路结构和背面导电层电路 结构进行热压结合。
所述的模切型标签的加工设备， 其特征在于： 所述的剥离机构由剥离辊 和收料辊构成， 其中， 剥离辊用于不断剥离原料上的导电层材料废料， 收料 辊用于卷收底层上具有正面导电层电路结构和背面导电层电路结构的原料。
所述的模切型标签的加工设备， 其特征在于： 所述的膜切机是 WQM系列 自动不干胶商标模切机。
本发明通过上述技术方案提供了一种稳定和高效地生产无衬底模切型电 子标签的方法以及加工设备。
附图说明
图 1是本发明方法所生产的电子标签的正面导电层电路结构示意图。 图 2是本发明方法所生产的电子标签的背面导电层电路结构示意图。 图 3是本发明方法所生产的电子标签的正面、 背面导电层电路结合后的 结构示意图。
图 4是本发明的工艺步骤流程图。
图 5是本发明的生产设备电子标签的结合机构的俯视结构示意图。
图 6是本发明方法生产过程中膜切步骤后的原料结构图。
图 7是本发明方法生产过程中膜切步骤后的另一种原料结构图。
具体实施方式
如图 4所示， 本发明公开了一种模切型标签的加工方法， 生产步骤是： 步骤一、 将底层上粘接有导电层材料（如： 铝箔） 的原料送入模切机， 通过模切机在原料上不断加工出正面导电层电路结构和背面导电层电路结 构， 所述的正面导电层电路结构和背面导电层电路结构在原料上对称的分布 在中间分界线两侧（如图 6)， 以确保当原料按相邻的正面导电层电路结构和 背面导电层电路结构的中间分界线折叠后， 正面导电层电路结构和背面导电 层电路结构结合形成完整的标签电路；
步骤二、 剥料机构将原料上的导电层材料废料从底层上剥离， 并卷收底 层上具有正面导电层电路结构和背面导电层电路结构的原料；
步骤三、 在原料的导电层材料上涂覆热熔胶；
步骤四、 通过折叠机构将原料沿着中间分界线进行准确折叠， 并将折叠 后的原料输送到热压机构；
步骤五、 通过热压机构将涂覆有热熔胶的原料上的正面导电层电路结构 和背面导电层电路结构进行热压结合， 热压结合完成后的原料输送到卷收机 构；
步骤六、 通过卷收机构将热压成型后的电子标签原料进行卷收。
作为一种变化的实施例， 所述的模切型标签的加工方法， 其特征在于所 述的在原料的导电层材料上涂覆热熔胶是在原料送入模切机前完成。
通过上述方法， 可以很高效地完成无衬底电子软标签的生产加工。
本发明方法中， 所述的步骤一的模切过程中保留中间分界线及其附近的 导电层材料，并在保留的导电层材料上以间隔切断的形式膜切出中间分界线， 如图 7所示。 通过这种结构设置， 在步骤四的折叠过程中不但可以确保折叠 位置的精确性， 而且其间隔切断的结构可以降低折叠的难度。
本发明进一步公开了用于实施如上所述的方法的加工设备， 它包括用于 实施步骤一的膜切机、 用于实施步骤二的剥离机构和不间断的实施步骤三- 六的电子标签的结合机构。 其中： 膜切机可以使用通用的产品， 如： WQM系 列自动不干胶商标模切机； 而剥离机构也是比较传统的结构， 它可由剥离辊 和收料辊构成， 其中， 剥离辊用于不断剥离原料上的导电层材料废料， 收料 辊用于卷收底层上具有正面导电层电路结构和背面导电层电路结构的原料。
本发明中具有创造性特点的是不间断的实施步骤三 -六的电子标签的结 合机构。如图 5所示：该电子标签的结合机构设置在一送料辊 41和一卷收辊 42之间， 其中送料辊 41用于送出折叠前的原料， 卷收辊 42用于卷收热压结 合后的电子标签料带； 所述的送料辊 41和卷收辊 42之.间的输送路径一侧依 次设有折叠推头 43、折叠压板 44和热压机 45;所述的折叠推头 43前方两侧 分别具有位于料带的中间分界线位置的折叠定位片 461、 462， 用于将原料以 中间分界线位置为基准进行折叠;所述的折叠压板 44也设置在料带的中间分 界线位置， 它为 L型结构， 并与热压台面 47形成一折叠槽， 用于将经过折叠 推头推折后的原料进一步折叠以确保原料上的正面导电层电路结构和背面导 电层电路结构折叠后位于可直接热压结合的位置；所述的热压机 45用于将折 叠后位置对应的原料上的正面导电层电路结构和背面导电层电路结构进行热 压结合。 所述的热压机 45的热压头、 折叠压板 44、 折叠定位片 461、 462均 可设置于热压台面 47上方。
综上所述仅为本发明的较佳实施例而已， 并非用来限定本发明的实施范 围。 即凡依本发明申请专利范围的内容所作的等效变化与修饰， 都应为本发 明的技术范畴。

Claims

权 利 要 求
1、 一种模切型标签的加工方法， 其特征在于生产步骤是：
步骤一、 将底层上粘接有导电层材料的原料送入模切机， 通过模切机在 原料上不断加工出正面导电层电路结构和背面导电层电路结构， 所述的正面 导电层电路结构和背面导电层电路结构在原料上对称的分布在中间分界线两 侧， 以确保当原料按相邻的正面导电层电路结构和背面导电层电路结构的中 间分界线折叠后， 正面导电层电路结构和背面导电层电路结构结合形成完整 的标签电路；
步骤二、 剥料机构将原料上的导电层材料废料从底层上剥离， 并卷收底 层上具有正面导电层电路结构和背面导电层电路结构的原料；
步骤三、 在原料的导电层材料上涂覆热熔胶；
步骤四、 通过折叠机构将原料沿着中间分界线进行准确折叠， 并将折叠 后的原料输送到热压机构；
步骤五、 通过热压机构将涂覆有热熔胶的原料上的正面导电层电路结构 和背面导电层电路结构进行热压结合， 热压结合完成后的原料输送到卷收机 构；
步骤六、 通过卷收机构将热压成型后的电子标签原料进行卷收。
2、根据权利要求 1所述的模切型标签的加工方法，其特征在于所述的在 原料的导电层材料上涂覆热熔胶是在原料送入模切机前完成。
3、根据权利要求 1或 2所述的模切型标签的加工方法，其特征在于所述 的步骤一的模切过程中保留中间分界线及其附近的导电层材料， 并在保留的 导电层材料上以间隔切断的形式膜切出中间分界线。
4、一种模切型标签的加工设备，用于实施如权利要求 1或 2或 3所述的 方法， 其特征在于它包括用于实施步骤一的膜切机、 用于实施步骤二的剥离 机构和不间断的实施步骤三-六的电子标签的结合机构；
该电子标签的结合机构设置在一送料辊（41 )和一卷收辊（42)之间， 其中送料辊（41 )用于送出折叠前的原料， 卷收辊（42)用于卷收热压结合 后的电子标签料带； 所述的送料辊 （41 )和卷收辊（42)之间的输送路径一 侧依次设有折叠推头 （43)、 折叠压板（44)和热压机（45); 所述的折叠推 头 （43)前方两侧分别具有位于料带的中间分界线位置的折叠定位片 （461、 462),用于将原料以中间分界线位置为基准进行折叠；所述的折叠压板（44) 也设置在料带的中间分界线位置， 它为 L型结构， 并与热压台面 （47) 形成 一折叠槽， 用于将经过折叠推头推折后的原料进一步折叠以确保原料上的正 面导电层电路结构和背面导电层电路结构折叠后位于可直接热压结合的位 置； 所述的热压机（45)用于将折叠后位置对应的原料上的正面导电层电路 结构和背面导电层电路结构进行热压结合。
5、根据权利要求 4所述的模切型标签的加工设备， 其特征在于： 所述的 剥离机构由剥离辊和收料辊构成， 其中， 剥离辊用于不断剥离原料上的导电 层材料废料， 收料辊用于卷收底层上具有正面导电层电路结构和背面导电层 电路结构的原料。
6、根据权利要求 4所述的模切型标签的加工设备， 其特征在于： 所述的 膜切机是 WQM系列自动不干胶商标模切机。
PCT/CN2010/001743 2010-09-28 2010-11-01 一种模切型标签的加工方法及加工设备 WO2012040885A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201010293953.3 2010-09-28
CN2010102939533A CN101923656B (zh) 2010-09-28 2010-09-28 一种模切型标签的加工方法及加工设备

Publications (1)

Publication Number Publication Date
WO2012040885A1 true WO2012040885A1 (zh) 2012-04-05

Family

ID=43338579

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2010/001743 WO2012040885A1 (zh) 2010-09-28 2010-11-01 一种模切型标签的加工方法及加工设备

Country Status (2)

Country Link
CN (1) CN101923656B (zh)
WO (1) WO2012040885A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103679243B (zh) * 2012-09-20 2016-12-21 一芯智能科技股份有限公司 智能双界面卡芯片触点点锡、粘热熔胶自动化设备
CN104050492A (zh) * 2013-03-13 2014-09-17 深圳市华阳微电子股份有限公司 易碎纸防伪rfid标签及其制备方法
CN103235966A (zh) * 2013-04-16 2013-08-07 凤宝珍 环保型标签的生产工艺及加工设备
CN105070674B (zh) * 2015-07-31 2018-01-09 华中科技大学 一种适用于成卷柔性电子器件的逐片转移装置
CN111383512A (zh) * 2018-12-31 2020-07-07 佛山艾仕仑科技有限公司 一种可方便标识的水标签及其生产方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0844964A (ja) * 1994-07-26 1996-02-16 Sunny Shiiring:Kk 共振ラベル及びその製造方法
CN1922619A (zh) * 2004-02-23 2007-02-28 关卡系统股份有限公司 安全标签和制造标签的方法
CN201010081Y (zh) * 2006-12-31 2008-01-23 刘述江 一种无底纸贴标机
CN101609926A (zh) * 2008-06-17 2009-12-23 深圳市华阳微电子有限公司 采用分体天线的超高频电子标签及其制造方法
CN201429857Y (zh) * 2009-07-08 2010-03-24 黄佳佳 一种无衬底电子标签

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2873470A1 (fr) * 2004-07-21 2006-01-27 Fci Sa Dispositif de connexion pour circuits plats
JP2009026042A (ja) * 2007-07-19 2009-02-05 Toppan Forms Co Ltd Ｒｆ−ｉｄメディア及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0844964A (ja) * 1994-07-26 1996-02-16 Sunny Shiiring:Kk 共振ラベル及びその製造方法
CN1922619A (zh) * 2004-02-23 2007-02-28 关卡系统股份有限公司 安全标签和制造标签的方法
CN201010081Y (zh) * 2006-12-31 2008-01-23 刘述江 一种无底纸贴标机
CN101609926A (zh) * 2008-06-17 2009-12-23 深圳市华阳微电子有限公司 采用分体天线的超高频电子标签及其制造方法
CN201429857Y (zh) * 2009-07-08 2010-03-24 黄佳佳 一种无衬底电子标签

Also Published As

Publication number Publication date
CN101923656A (zh) 2010-12-22
CN101923656B (zh) 2012-01-11

Similar Documents

Publication Publication Date Title
CN100380399C (zh) 纸状rfid标签及其制造方法
WO2012040885A1 (zh) 一种模切型标签的加工方法及加工设备
CN106954344B (zh) 柔性线路板模切生产线
CN103481655B (zh) 一种保护膜印刷斩型机及其生产工艺
JP2004342755A (ja) 平面コイルの製造方法
CN107057587A (zh) 平刀异步制作双面胶模组工艺
US8368538B2 (en) Method of making an RFID label
CN101609514B (zh) 一种高效电子标签制作方法
CN202156099U (zh) 印刷电路板保护层制造装置
CN102360443A (zh) 一种生产双界面卡的方法
US20070221738A1 (en) Method and device for producing RFID smart labels or smart label inlays
CN109702810A (zh) 一种用于rfid天线制作的模切基材及模切方法
CN202702805U (zh) 一种实现rfid芯片或衬垫与底纸之间粘接的复合装置
JP6597082B2 (ja) シート付与装置およびそれを用いた電子部品の製造方法
CN203031671U (zh) 一种圆刀刀腔排废装置
CN201784230U (zh) 一种模切型标签的原料热压结合机构
CN115103581B (zh) 笔记本电脑用面板屏蔽组件及其生产工艺
CN213752192U (zh) 一种纳米晶导磁薄片碎磁保护结构及多层纳米晶导磁薄片
CN206937486U (zh) 一种胶带自动裁切装置
CN210308194U (zh) 一种fpc模切生产设备
CN204077059U (zh) 一种定位冷烫机
CN110766121B (zh) 一种可定位防伪电子布标标签的加工方法
CN110481048A (zh) 一种不同种胶带贴合方法
CN201429857Y (zh) 一种无衬底电子标签
CN204560008U (zh) 一种柔性线路板覆盖膜的预加工结构

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10857648

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10857648

Country of ref document: EP

Kind code of ref document: A1