WO2012029865A1 - Procédé de fabrication de panneau de câblage multicouche - Google Patents

Procédé de fabrication de panneau de câblage multicouche Download PDF

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Publication number
WO2012029865A1
WO2012029865A1 PCT/JP2011/069805 JP2011069805W WO2012029865A1 WO 2012029865 A1 WO2012029865 A1 WO 2012029865A1 JP 2011069805 W JP2011069805 W JP 2011069805W WO 2012029865 A1 WO2012029865 A1 WO 2012029865A1
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layer
group
adhesion
conductive layer
resin layer
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PCT/JP2011/069805
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English (en)
Japanese (ja)
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植木　志貴
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富士フイルム株式会社
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Publication of WO2012029865A1 publication Critical patent/WO2012029865A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating

Definitions

  • the present invention relates to a method for manufacturing a multilayer wiring board.
  • a metal wiring board in which wiring with a metal pattern is formed on the surface of an insulating substrate has been widely used for electronic components and semiconductor elements.
  • a “subtractive method” is mainly used.
  • a photosensitive layer that is exposed by irradiation with actinic rays is provided on a metal film formed on the surface of the substrate, the photosensitive layer is exposed imagewise, and then developed to form a resist image.
  • the metal film is etched to form a metal pattern, and finally the resist image is peeled off.
  • the adhesion between the substrate and the metal film is expressed by an anchor effect generated by providing irregularities on the substrate surface. Therefore, due to the unevenness of the substrate interface part of the obtained metal pattern, the wiring edge part becomes uneven, the wiring thickness cannot be made constant, and it is difficult to obtain the wiring shape as designed, or fine wiring When trying to form, there existed a problem that the part connected with an adjacent wiring was made or the wiring disconnected.
  • Patent Document 1 a method for forming a multilayer wiring board with high connection reliability suitable for forming a fine wiring by a semi-additive method is disclosed (Patent Document 1). More specifically, in this document, first, a patterned metal film is formed on the surface of a first wiring substrate having metal wiring via an insulating layer and a polymer adhesion layer, and the patterned A via hole is formed using the metal film as a mask. Next, by applying an electroless plating catalyst to the wall surface of the via hole and performing a plating process such as electroless plating, the metal wiring on the wiring board is connected to the patterned metal film formed on the upper part thereof, Manufactures multilayer wiring boards.
  • Patent Document 1 In recent years, from the viewpoint of reducing manufacturing costs, it is required to manufacture a multilayer wiring board with high throughput and high productivity. On the other hand, the method described in Patent Document 1 is not always sufficient from the viewpoint of productivity of producing a practically durable metal film having a large number of steps and excellent adhesion and the like.
  • the present invention can produce a metal wiring with high definition and excellent adhesion, and can produce a multilayer wiring board with excellent via connection reliability with high yield. It aims at providing the manufacturing method of the outstanding multilayer wiring board.
  • a step of forming a laminate including the adhesion resin layer obtained in this order and (B) After providing the plating resin or precursor thereof to the adhesion resin layer after the step (A), performing plating, and forming a second conductive layer on the adhesion resin layer; (C) After the step (B), a via hole is formed by laser processing or drilling so as to penetrate the second conductive layer, the adhesion resin layer, and the insulating layer and reach the first conductive layer.
  • the present invention is capable of manufacturing a metal wiring having high definition and excellent adhesion, and also capable of manufacturing a multilayer wiring board having excellent via connection reliability with a high yield.
  • a manufacturing method can be provided.
  • FIG. 1 is a schematic cross-sectional view showing a via chain obtained in Examples 1 to 5 and Comparative Examples 1 and 2.
  • FIG. 1 is a schematic cross-sectional view showing a via chain obtained in Examples 1 to 5 and Comparative Examples 1 and 2.
  • the manufacturing method includes the following five steps.
  • (A) Applying energy to the insulating substrate and a layer containing a polymer having a functional group and a polymerizable group that interact with the plating catalyst or its precursor on the surface of the wiring board including the first conductive layer.
  • Step of forming a laminate comprising the obtained adhesion resin layer in this order
  • (B) After applying the plating catalyst or its precursor to the adhesion resin layer after the step (A), plating is performed, and the adhesion resin layer is formed.
  • Step of forming via hole to reach (D) Step of performing desmear treatment after step (C)
  • the manufacturing method of the present invention forms via holes without patterning the adhesive resin layer, and has fewer steps. Further, as one of the characteristics of the manufacturing method of the present invention, a step of forming a conductive metal film (E) for electrically connecting the first conductive layer and the second conductive layer after the via hole is formed (E ) In which electroplating is performed using carbon black and graphite. By passing through this step, it is advantageous in terms of the yield and durability of interlayer connection. Hereinafter, each step will be sequentially described with reference to the drawings.
  • energy is applied to a layer containing a polymer having a functional group and a polymerizable group that interact with the insulating layer and the plating catalyst or its precursor on the surface of the wiring substrate including the first conductive layer.
  • a laminate including the adhesion resin layer obtained by applying in this order is formed.
  • the insulating layer and the adhesion resin layer are provided on the entire surface of the wiring substrate surface where these layers are to be formed. More specifically, as shown in FIG. 1A, in this step, the wiring substrate 10 in which the first conductive layer 14 is formed on the substrate 12 and the insulating layer provided on the wiring substrate 10 are used.
  • a laminate 22 including the adhesion auxiliary layer 18 provided on the insulating layer 16 and the adhesion resin layer 20 provided on the adhesion auxiliary layer 18 is formed.
  • the wiring substrate 10, the insulating layer 16, the adhesion auxiliary layer 18, and the adhesion resin layer 20 will be described in detail.
  • the wiring board 10 used in the present invention typically includes those formed by a subtractive method using an etching process, and those formed by a semi-additive method using electrolytic plating. You may use what was formed. More specifically, the wiring board 10 may be a double-sided or single-sided copper-clad laminate (CCL), or a copper-clad laminate made of a copper film in a pattern, which is a flexible substrate. It may be a rigid substrate.
  • CCL copper-clad laminate
  • substrate 12 in the wiring board 10 a glass epoxy material, BT resin, a polyimide film, a polyamide film, a liquid crystal film, an aramid etc. are mentioned, for example. Of these, glass epoxy materials and BT resins are preferred from the viewpoint of thermal or mechanical properties such as dimensional stability and heat resistance.
  • the material constituting the first conductive layer (first metal layer) 14 include copper, silver, tin, nickel, and gold. Note that the first conductive layer 14 functions as a first metal wiring and may be provided over the entire surface of the substrate 12 or may be formed in a pattern as shown in FIG.
  • the insulating layer 16 is a layer provided to ensure insulation reliability in the multilayer wiring board (for example, between the first conductive layers 14), and the formation method thereof is not particularly limited. More specifically, a method (coating method) for forming an insulating layer 16 by applying an insulating resin composition containing an insulating resin, or an insulating layer 16 containing an insulating resin on the wiring substrate 10. The method of laminating etc. is mentioned.
  • the thickness of the insulating layer 16 is appropriately selected according to the purpose of use of the multilayer wiring board, but is preferably 5 to 150 ⁇ m, more preferably 10 to 100 ⁇ m.
  • the “insulating resin” in the present invention means a resin having an insulating property that can be used for a known insulating film or insulating layer, and is not a perfect insulator.
  • any resin having insulating properties according to the purpose can be applied to the present invention.
  • the insulating resin may be, for example, a thermosetting resin, a thermoplastic resin, or a mixture thereof.
  • the thermosetting resin include an epoxy resin, a phenol resin, a polyimide resin, a polyester resin, and a bismaleimide. Examples thereof include resins, polyolefin resins, isocyanate resins and the like.
  • the thermoplastic resin include phenoxy resin, polyether sulfone, polysulfone, polyphenylene sulfone, polyphenylene sulfide, polyphenyl ether, polyether imide, and the like.
  • the insulating resin composition used for forming the insulating layer may contain a compound such as a compound having a polymerizable double bond in order to promote crosslinking, specifically, an acrylate or methacrylate compound.
  • a compound having a polymerizable double bond in order to promote crosslinking, specifically, an acrylate or methacrylate compound.
  • polyfunctional ones are preferred.
  • the insulating resin composition may be provided with a filler (for example, silica, alumina, clay, talc, etc.), a colorant, a flame retardant, an adhesion-imparting agent, a silane coupling agent, and an antioxidant as necessary.
  • a filler for example, silica, alumina, clay, talc, etc.
  • a colorant for example, silica, alumina, clay, talc, etc.
  • a flame retardant for example, silica, alumina, clay, talc, etc.
  • an adhesion-imparting agent for example, silane coupling agent, and an antioxidant
  • an antioxidant for example, silica, silica, alumina, clay, talc, etc.
  • an ultraviolet absorber may be added.
  • any of them is preferably added in the range of 1 to 200% by mass, more preferably in the range of 10 to 80% by mass with respect to the resin. Is done.
  • the adhesion auxiliary layer 18 plays a role of assisting adhesion between the insulating layer 16 and the adhesion resin layer 20 to be described later.
  • the adhesion assistance layer 18 is used. Layer 18 may be omitted.
  • the adhesion assisting layer 18 gives an active species as a starting point of the binding reaction with the adhesion resin layer 20, and can generate many bonds between the adhesion assisting layer 18 and the adhesion resin layer 20 from the starting point. .
  • a layer containing a polymerization initiator (polymerization initiation layer) or a layer having a functional group capable of initiating polymerization (polymerization initiation layer) can be used as the adhesion auxiliary layer 18.
  • the thickness of the adhesion auxiliary layer 18 is not particularly limited, but is preferably from 0.1 to 10 ⁇ m, preferably from 0.2 to 10 ⁇ m from the viewpoints of sufficient polymerization initiation ability and prevention of film peeling while maintaining film properties. 5 ⁇ m is more preferable.
  • In mass after drying is preferably 0.1 ⁇ 20g / m 2, more preferably 0.1 ⁇ 15g / m 2, more preferably 0.1 ⁇ 2g / m 2.
  • the adhesion auxiliary layer 18 examples include a layer containing a polymer compound and a polymerization initiator, a layer containing a polymerizable compound and a polymerization initiator, a layer having a functional group capable of initiating polymerization, and polymerization can be initiated by applying energy.
  • Examples include a layer that generates an active site and a layer that forms a chemical bond with the adhesive resin layer 20 by applying energy.
  • the adhesion auxiliary layer 18 can be formed by dissolving necessary components in a solvent that can be dissolved, providing the components on the substrate surface by a method such as coating, and hardening by heating or light irradiation.
  • the insulating layer 16 formed on the wiring substrate 10 is made of a known insulating resin that has been used as a material for a multilayer laminate, a build-up substrate, or a flexible substrate, it is in close contact with the insulating layer 16.
  • assistant layer 18 formed from an insulating resin composition is demonstrated.
  • the insulating resin composition used when forming the adhesion assisting layer 18 may contain the same electrically insulating resin that constitutes the insulating layer 16 formed on the wiring substrate 10, and is different. However, it is preferable to use materials having similar thermal properties such as glass transition point, elastic modulus, and linear expansion coefficient. Specifically, for example, it is preferable in terms of adhesion to use the same type of insulating resin as the insulating resin constituting the insulating layer 16 formed on the wiring substrate 10. In addition, inorganic or organic particles may be added in order to increase the strength of the adhesion auxiliary layer 18 and to improve electrical characteristics.
  • the insulating resin may be, for example, a thermosetting resin, a thermoplastic resin, or a mixture thereof.
  • the thermosetting resin include an epoxy resin, a phenol resin, a polyimide resin, a polyester resin, and a bismaleimide. Examples thereof include resins, polyolefin resins, isocyanate resins and the like.
  • thermoplastic resin examples include phenoxy resin, polyether sulfone, polysulfone, polyphenylene sulfone, polyphenylene sulfide, polyphenyl ether, polyether imide, and the like.
  • the adhesion auxiliary layer 18 may contain a compound having a polymerizable double bond, specifically an acrylate or methacrylate compound, in order to promote crosslinking within the layer, It is preferable to use one.
  • various compounds can be added to the adhesion auxiliary layer 18 depending on the purpose.
  • Specific examples include materials such as rubber and SBR latex that can relieve stress during heating, binders for improving film properties, plasticizers, surfactants, viscosity modifiers, and the like.
  • the adhesion auxiliary layer 18 may be filled with a filler (for example, inorganic filler such as silica, alumina, clay, talc, aluminum hydroxide, calcium carbonate, cured epoxy resin, crosslinked benzoguanamine resin, crosslinked acrylic polymer, etc., if necessary.
  • a filler for example, inorganic filler such as silica, alumina, clay, talc, aluminum hydroxide, calcium carbonate, cured epoxy resin, crosslinked benzoguanamine resin, crosslinked acrylic polymer, etc.
  • Organic fillers colorants, flame retardants, adhesion-imparting agents, silane coupling agents, antioxidants, ultraviolet absorbers and the like may be added singly or in combination.
  • the adhesion auxiliary layer 18 preferably contains an active species (compound) that generates an active site capable of forming an interaction with the polymer compound constituting the adhesion resin layer 20.
  • an active species compound
  • some energy may be applied, and preferably, light (ultraviolet light, visible light, X-ray, etc.), plasma (oxygen, nitrogen, carbon dioxide, argon, etc.), heat, electricity, Etc. are used.
  • active sites may be generated by chemically decomposing the surface with an oxidizing liquid (potassium permanganate solution) or the like.
  • the active species include polymerization initiators (for example, thermal polymerization initiators and photopolymerization initiators).
  • the amount of the polymerization initiator contained in the adhesion auxiliary layer 18 is preferably 0.1 to 50% by mass, and more preferably 1.0 to 30% by mass in terms of solid content.
  • the adhesion assisting layer 18 can be formed by disposing a composition for forming an adhesion assisting layer on the insulating layer 16 by coating and removing the solvent to form a film. At this time, it is preferable that the film is hardened by heating and / or light irradiation. In particular, if the film is dried by heating and then preliminarily cured by light irradiation, the polymerizable compound is cured to some extent in advance, so that the adhesion assisting layer 18 is formed after the adhesion resin layer 20 is formed on the adhesion assisting layer 18. This is preferable because the situation where the layer 18 is dropped can be effectively suppressed.
  • the heating temperature and time may be selected as long as the coating solvent can be sufficiently dried. From the viewpoint of production suitability, the temperature is preferably 200 ° C. or less, and the drying time is preferably within 60 minutes, and the drying temperature is 40 to 100 ° C. It is more preferable to select heating conditions within a drying time of 20 minutes.
  • the solvent used when applying the components constituting the adhesion auxiliary layer 18 is not particularly limited as long as these components can be dissolved. From the viewpoint of ease of drying and workability, a solvent having a boiling point that is not too high is preferable. Specifically, a solvent having a boiling point of about 40 to 150 ° C. may be selected. Specifically, cyclohexanone, methyl ethyl ketone, or the like can be used. The concentration of the solid content in the coating solution is preferably 2 to 50% by mass from the viewpoint of handleability.
  • the adhesion assisting layer 18 can be formed by a known layer forming method such as a transfer method or a printing method in addition to the coating method.
  • a transfer method When the transfer method is applied, a transfer laminate having a two-layer structure of the adhesion resin layer 20 and the adhesion auxiliary layer 18 may be manufactured and transferred onto the surface of the insulating layer 16 at once by the lamination method. .
  • the adhesion resin layer 20 is a layer obtained by using a polymer having a functional group (also referred to as an interaction group as appropriate) and a polymerizable group that forms an interaction with the plating catalyst or its precursor, and an adhesion auxiliary layer. 18 (on the insulating layer 16 when there is no adhesion auxiliary layer 18).
  • the adhesion resin layer 20 adsorbs a later-described plating catalyst or a precursor thereof according to the function of a functional group that forms an interaction with the plating catalyst or the precursor in the polymer. That is, the adhesion resin layer 20 functions as a good receiving layer (layer to be plated) of the plating catalyst (or its precursor).
  • the thickness of the adhesive resin layer 20 is not particularly limited, but is preferably 0.1 to 5 ⁇ m and more preferably 0.2 to 2 ⁇ m from the viewpoint of handling properties and manufacturing cost. Further, the surface roughness (Ra) of the adhesive resin layer 20 is preferably 0.01 to 0.3 ⁇ m, more preferably 0.02 to 0.15 ⁇ m from the viewpoint of the wiring shape and the adhesive strength.
  • the surface roughness (Ra) was measured using Surfcom 3000A (manufactured by Tokyo Seimitsu Co., Ltd.) based on Ra described in JIS B 0601 (Revision of 201010120) by non-contact interference method.
  • the adhesion resin layer 20 includes a functional group and a polymerizable group, which are formed on the adhesion auxiliary layer 18 (or the insulating layer 16 when there is no adhesion auxiliary layer 18) and interact with the plating catalyst or its precursor. It is the layer which applied the energy to the layer containing the polymer which has, and was hardened.
  • the reaction between the polymers proceeds via the polymerizable group, and the adhesion auxiliary layer 18 adjacent to the polymer (if there is no adhesion auxiliary layer 18, an insulating layer) It is possible to form a chemical bond directly with the surface of 16), and to form the adhesion resin layer 20 firmly bonded to the adhesion auxiliary layer 18 (or the insulating layer 16 when there is no adhesion auxiliary layer 18).
  • the method for forming the layer containing a polymer to which energy is applied is not particularly limited, and it is preferable to use a composition containing a polymer (hereinafter, referred to as a composition for forming an adhesive resin layer as appropriate).
  • a composition for forming an adhesive resin layer as appropriate.
  • a method of immersing a substrate in the composition for forming an adhesive resin layer and a method of applying the composition for forming an adhesive resin layer on the insulating layer 16 (or the adhesion auxiliary layer 18) can be mentioned.
  • a mode in which a polymer-containing layer is formed by applying and drying the adhesive resin layer-forming composition on the insulating layer 16 (or the adhesion auxiliary layer 18) is preferable.
  • the aspect of the composition for forming an adhesive resin layer will be described in detail later.
  • the coating amount is solid from the viewpoint of sufficient interaction with the plating catalyst or its precursor described later. 0.1 to 10 g / m 2 in terms of minutes is preferable, and 0.5 to 5 g / m 2 is particularly preferable.
  • Examples of the energy application method for generating the adhesion resin layer 20 include exposure processing (for example, radiation irradiation such as exposure) or heat treatment.
  • exposure processing for example, radiation irradiation such as exposure
  • heat treatment for example, light irradiation with a UV lamp, visible light, or the like is possible.
  • the light source include a mercury lamp, a metal halide lamp, a xenon lamp, a chemical lamp, and a carbon arc lamp.
  • Examples of radiation include electron beams, X-rays, ion beams, and far infrared rays.
  • g-line, i-line, deep-UV light, and high-density energy beam (laser beam) are used.
  • a heating method using a thermal recording head or the like, a scanning exposure method using an infrared laser, or the like, and a high-illuminance flash exposure such as a xenon discharge lamp or an infrared lamp exposure are also preferable methods.
  • the time required for energy application varies depending on the polymer structure used and the light source, but is usually between 10 seconds and 5 hours.
  • the exposure power is in the range of 10 to 5000 mJ / cm 2 in order to facilitate the graft polymerization and to suppress the decomposition of the produced graft polymer. More preferably, it is in the range of 50 to 3000 mJ / cm 2 .
  • a polymer having an average molecular weight of 20,000 or more and a degree of polymerization of 200 or more is used as a polymer having a polymerizable group and an interactive group, graft polymerization proceeds easily with low energy exposure. Degradation of the polymer can be further suppressed.
  • the polymer used in the present invention has a functional group and a polymerizable group that interact with the plating catalyst or its precursor.
  • Interactive group examples of the interactive group include non-dissociable functional groups such as polar groups, groups capable of forming multidentate coordination, nitrogen-containing functional groups, sulfur-containing functional groups, and oxygen-containing functional groups (functions that do not generate protons by dissociation). Group).
  • the polar group may be a functional group having a positive charge such as ammonium or phosphonium, or an acid having a negative charge such as a sulfonic acid group, a carboxyl group, a phosphoric acid group, or a phosphonic acid group or capable of dissociating into a negative charge.
  • Groups. These adsorb metal ions in the form of counterions of dissociating groups.
  • nonionic polar groups such as a hydroxyl group, an amide group, a sulfonamide group, an alkoxy group, and a cyano group can also be used.
  • an imino group, primary or secondary amino group, amide group, urethane group, hydroxyl group (including phenol), thiol group, and the like can also be used.
  • non-dissociable functional group specifically, a group capable of forming a coordination with a metal ion, a nitrogen-containing functional group, a sulfur-containing functional group, an oxygen-containing functional group and the like are preferable.
  • imide group pyridine group, tertiary amino group, ammonium group, pyrrolidone group, amidino group, group containing triazine ring structure, group containing isocyanuric structure, nitro group, nitroso group, azo group, diazo group
  • a nitrogen-containing functional group such as azide group, cyanate group (R—O—CN), ether group, carbonyl group, ester group, group containing N-oxide structure, group containing S-oxide structure, N-hydroxy structure
  • Oxygen-containing functional groups such as containing groups, thioether groups, thioxy groups, sulfoxide groups, sulfone groups, sulfite groups, groups containing sulfoximine structures, groups containing
  • Examples thereof include phosphorus-containing functional groups such as sulfur functional groups and phosphine groups, and groups containing halogen atoms such as chlorine and bromine.
  • an imidazole group, a urea group, or a thiourea group may be used as long as it is non-dissociative due to a relationship with an adjacent atom or atomic group.
  • the interactive group a cyano group or a carboxylic acid group is particularly preferable because of its high polarity and high adsorption ability to a plating catalyst or the like.
  • both the cyano group and the carboxylic acid group are contained as an interactive group in the polymer from the viewpoint that the connection reliability and yield of the obtained multilayer wiring board are more excellent.
  • the polymerizable group is a functional group capable of forming a bond between polymers or between the polymer and the adhesion auxiliary layer 18 (or the insulating layer 16) by applying energy, for example, a radical polymerizable group, a cationic polymerizable group. Groups and the like. Of these, a radical polymerizable group is preferable from the viewpoint of reactivity.
  • radical polymerizable group examples include unsaturated carboxylic acid ester groups such as acrylic acid ester groups, methacrylic acid ester groups, itaconic acid ester groups, crotonic acid ester groups, isocrotonic acid ester groups, maleic acid ester groups, styryl groups, Examples thereof include a vinyl group, an acrylamide group, and a methacrylamide group.
  • a methacrylic acid ester group (methacryloyloxy group), an acrylic acid ester group (acryloyloxy group), a vinyl group, a styryl group, an acrylamide group, and a methacrylamide group are preferable, and an acryloyloxy group, a methacryloyloxy group, and a styryl group. Is particularly preferred.
  • Examples of the polymer having a polymerizable group and an interactive group include homopolymers and copolymers obtained using a monomer having an interactive group, such as a vinyl group, an allyl group, and a (meth) acryl group.
  • a polymer having an ethylene addition polymerizable unsaturated group (polymerizable group) introduced therein is preferable, and the polymer having a polymerizable group and an interactive group has a polymerizable group at least at the main chain terminal or side chain. And those having a polymerizable group in the side chain are preferred.
  • a method for synthesizing such a polymer having a polymerizable group and an interactive group is not particularly limited, and a known synthesis method (see paragraphs [0097] to [0125] of Patent Publication No. 2009-280905) is used.
  • a method for synthesized as follows i) a method in which a monomer having an interactive group and a monomer having a polymerizable group are copolymerized, and ii) a monomer having an interactive group and a monomer having a double bond precursor are copolymerized.
  • the weight average molecular weight of a polymer is not specifically limited, 1000 or more and 700,000 or less are preferable, More preferably, it is 2000 or more and 200,000 or less. In particular, from the viewpoint of polymerization sensitivity, the weight average molecular weight is preferably 20000 or more. Moreover, as a polymerization degree of a polymer, it is preferable to use a 10-mer or more thing, More preferably, it is a 20-mer or more thing. Moreover, 7000-mer or less is preferable, 3000-mer or less is more preferable, 2000-mer or less is still more preferable, 1000-mer or less is especially preferable.
  • a polymer having a unit (unit having a polymerizable group) represented by the following formula (1) can be mentioned.
  • excellent adhesion to the adhesion auxiliary layer 18 or the resin layer 16 is expressed, and a film having excellent strength can be obtained by a crosslinking reaction in the film.
  • R 1 to R 4 each independently represents a hydrogen atom or a substituted or unsubstituted alkyl group.
  • R 1 to R 4 are a substituted or unsubstituted alkyl group
  • an alkyl group having 1 to 6 carbon atoms is preferable
  • an alkyl group having 1 to 4 carbon atoms is more preferable.
  • examples of the unsubstituted alkyl group include a methyl group, an ethyl group, a propyl group, and a butyl group
  • examples of the substituted alkyl group include a methoxy group, a hydroxy group, and a halogen atom (for example, a chlorine atom).
  • a bromine atom, a fluorine atom) and the like and a methyl group, an ethyl group, a propyl group, and a butyl group.
  • R 1 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a hydroxy group or a bromine atom.
  • R 2 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a hydroxy group or a bromine atom.
  • R 3 is preferably a hydrogen atom.
  • R 4 is preferably a hydrogen atom.
  • Y and Z each independently represent a single bond or a substituted or unsubstituted divalent organic group.
  • the divalent organic group include a substituted or unsubstituted aliphatic hydrocarbon group (preferably having 1 to 3 carbon atoms), a substituted or unsubstituted aromatic hydrocarbon group (preferably having 6 to 12 carbon atoms), —O —, —S—, —N (R) — (R: alkyl group), —CO—, —NH—, —COO—, —CONH—, or a combination thereof (eg, alkyleneoxy group, alkyleneoxy group) Carbonyl group, alkylenecarbonyloxy group, etc.).
  • the organic group may have a substituent such as a hydroxy group as long as the effects of the invention are not impaired.
  • Examples of the substituted or unsubstituted aliphatic hydrocarbon group include a methylene group, an ethylene group, a propylene group, a butylene group, a pentylene group, a hexylene group, or a methoxy group, a hydroxy group, a halogen atom (for example, a chlorine atom). , Bromine atom, fluorine atom) and the like.
  • the substituted or unsubstituted aromatic hydrocarbon group is preferably an unsubstituted phenylene group or a phenylene group substituted with a methoxy group, a hydroxy group, a halogen atom (for example, a chlorine atom, a bromine atom, or a fluorine atom). .
  • a halogen atom for example, a chlorine atom, a bromine atom, or a fluorine atom.
  • — (CH 2 ) n — (n is an integer of 1 to 3) is preferable, and —CH 2 — is more preferable.
  • Y and Z are preferably an ester group (—COO—), an amide group (—CONH—), an ether group (—O—), or a substituted or unsubstituted aromatic hydrocarbon group.
  • L 1 represents a substituted or unsubstituted divalent organic group.
  • the definition of the divalent organic group is synonymous with the organic group represented by Y and Z described above, for example, a substituted or unsubstituted aliphatic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group, —O -, -S-, -N (R)-(R: alkyl group), -CO-, -NH-, -COO-, -CONH-, or a combination thereof.
  • L 1 is preferably an unsubstituted alkylene group or a divalent organic group having a urethane bond or a urea bond, particularly preferably those having a total carbon number of 1 to 9.
  • the total number of carbon atoms of L 1 means the total number of carbon atoms contained in the substituted or unsubstituted divalent organic group represented by L 1.
  • the structure of L 1 is preferably a structure represented by Formula (1-1) or Formula (1-2).
  • R a and R b each independently represent a divalent organic group.
  • the definition of the divalent organic group is the same as described above.
  • a substituted or unsubstituted alkylene group such as a methylene group, an ethylene group, a propylene group, or a butylene group, or an ethylene oxide group, a diethylene oxide group
  • examples thereof include polyoxyalkylene groups such as ethylene oxide group, tetraethylene oxide group, dipropylene oxide group, tripropylene oxide group and tetrapropylene oxide group.
  • a preferred embodiment of the unit represented by the formula (1) is a unit represented by the formula (1-A).
  • R 1 , R 2 , Z and L 1 are the same as the definitions of each group in the unit represented by the formula (1).
  • T represents an oxygen atom or NR (R represents a hydrogen atom or an alkyl group, preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms).
  • a preferred embodiment of the unit represented by the formula (1-A) is a unit represented by the formula (1-B).
  • R 1 , R 2 , and L 1 are the same as the definitions of each group in the unit represented by the formula (1-A).
  • V and T each represents an oxygen atom or NR (R represents a hydrogen atom or an alkyl group, preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms).
  • T is preferably an oxygen atom.
  • L 1 is preferably an unsubstituted alkylene group or a divalent organic group having a urethane bond or a urea bond, Are more preferred, and those having a total carbon number of 1 to 9 are particularly preferred.
  • the content of the unit represented by the formula (1) in the polymer is not particularly limited, it is based on the total unit (100 mol%) in terms of reactivity (polymerizability, curability) and adhesion to the substrate. 5 to 50 mol% is preferable, and 5 to 40 mol% is more preferable. When the amount is less than 5 mol%, the reactivity (curability and polymerizability) may be reduced. When the amount exceeds 50 mol%, gelation is likely to occur during the synthesis of the polymer, and the control of the reaction becomes difficult.
  • a polymer having a unit represented by the following formula (2) (unit having an interactive group) can be mentioned.
  • the adsorptivity to the plating catalyst or its precursor described later is improved, and excellent adhesion between the adhesive resin layer 20 and the second conductive film 24 described later is ensured. .
  • R 5 represents a hydrogen atom or a substituted or unsubstituted alkyl group.
  • the substituted or unsubstituted alkyl group represented by R 5 has the same meaning as the substituted or unsubstituted alkyl group represented by R 1 to R 4 described above.
  • R 5 is preferably a hydrogen atom, a methyl group, or a methyl group substituted with a hydroxy group or a bromine atom.
  • X and L 2 each independently represents a single bond or a substituted or unsubstituted divalent organic group.
  • the definition of the divalent organic group is synonymous with the divalent organic group represented by Z and Y, for example, a substituted or unsubstituted aliphatic hydrocarbon group, a substituted or unsubstituted aromatic hydrocarbon group. , —O—, —S—, —N (R) — (R: alkyl group), —CO—, —NH—, —COO—, —CONH—, or a combination thereof.
  • X preferably includes a single bond, an ester group (—COO—), an amide group (—CONH—), an ether group (—O—), or a substituted or unsubstituted aromatic hydrocarbon group, and more preferably. Is a single bond, an ester group (—COO—) or an amide group (—CONH—).
  • L 2 is preferably a linear, branched, or cyclic alkylene group, an aromatic group, or a group obtained by combining these.
  • the group obtained by combining the alkylene group and the aromatic group may further be via an ether group, an ester group, an amide group, a urethane group, or a urea group.
  • L 2 preferably has 1 to 15 total carbon atoms, and particularly preferably unsubstituted.
  • the total number of carbon atoms of L 2 means the total number of carbon atoms contained in the substituted or unsubstituted divalent organic group represented by L 2.
  • a methylene group an ethylene group, a propylene group, a butylene group, a phenylene group, and those groups substituted with a methoxy group, a hydroxy group, a chlorine atom, a bromine atom, a fluorine atom, etc., The group which combined these is mentioned.
  • W represents a functional group (interactive group) that forms an interaction with the plating catalyst or its precursor, and its definition is as described above.
  • a cyano group or a carboxylic acid group is preferable because it is excellent in adsorptivity to the plating catalyst or its precursor.
  • the unit represented by the formula (2) of two or more different types of W may be included, and the connection reliability and yield of the obtained multilayer wiring board are more excellent. It is preferable that a unit represented by the formula (2) in which W is a cyano group and a unit represented by the formula (2) in which W is a carboxylic acid group are included.
  • a preferred embodiment of the unit represented by the formula (2) is a unit represented by the formula (2-A).
  • R 5 , L 2 and W are as defined for each group in the unit represented by the formula (2).
  • U represents an oxygen atom or NR ′ (R ′ represents a hydrogen atom or an alkyl group, preferably a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms).
  • L 2 in the formula (2-A) is a linear, branched, or cyclic alkylene group, an aromatic group (in particular, a divalent aromatic hydrocarbon group is preferable), or a combination thereof. Is preferred.
  • the connecting site with W in L 2 is preferably a divalent organic group having a linear, branched, or cyclic alkylene group. These organic groups preferably have 1 to 10 carbon atoms in total.
  • the connecting site with W in L 2 in the formula (2-A) is preferably a divalent organic group having an aromatic group, and among these, the divalent organic group The group preferably has 6 to 15 carbon atoms in total.
  • the content of the unit represented by the formula (2) in the polymer is not particularly limited, but is preferably 5 to 95 mol% with respect to all units (100 mol%) in terms of adsorptivity to the plating catalyst and the like. 10 to 95 mol% is more preferable.
  • the bonding mode of the above units in the polymer (unit represented by formula (1), unit represented by formula (2)) is not particularly limited, and even if each unit is a random polymer bonded at random, A block polymer in which each unit is connected to the same type to form a block portion may be used.
  • the polymer may contain other units in addition to the unit represented by the formula (1) and the unit represented by the formula (2).
  • the above polymer is contained in the composition for forming an adhesive resin layer.
  • the content of the polymer in the composition for forming an adhesive resin layer is not particularly limited, but is preferably 2 to 50% by mass and more preferably 5 to 30% by mass with respect to the total amount of the composition. If it is in the said range, it is excellent in the handleability of a composition and it is easy to control the layer thickness of the contact
  • the composition for forming an adhesive resin layer may contain a solvent as necessary in addition to the polymer.
  • solvents that can be used include alcohol solvents such as methanol, ethanol, propanol, ethylene glycol, glycerin, and propylene glycol monomethyl ether, acids such as acetic acid, ketone solvents such as acetone, methyl ethyl ketone, and cyclohexanone, formamide, dimethylacetamide, Amide solvents such as N-methylpyrrolidone, nitrile solvents such as acetonitrile and propionitrile, ester solvents such as methyl acetate and ethyl acetate, carbonate solvents such as dimethyl carbonate and diethyl carbonate, and other ether solvents A solvent, a glycol solvent, an amine solvent, a thiol solvent, a halogen solvent, etc.
  • amide solvents amide solvents, ketone solvents, nitrile solvents, and carbonate solvents are preferable.
  • acetone, dimethylacetamide, methyl ethyl ketone, cyclohexanone, acetonitrile, propionitrile, N-methylpyrrolidone, and dimethyl carbonate are preferable.
  • the content of the solvent in the composition for forming an adhesive resin layer is not particularly limited, but is preferably 50 to 98% by mass and more preferably 70 to 95% by mass with respect to the total amount of the composition. If it is in the said range, it is excellent in the handleability of a composition and control of the layer thickness of the contact
  • the adhesive resin layer forming composition further includes a surfactant, a plasticizer, a polymerization inhibitor, a curing agent, a radical generator, a sensitizer, a rubber component (for example, CTBN), a flame retardant (for example, , Phosphorus flame retardants), diluents and thixotropic agents, pigments, antifoaming agents, leveling agents, coupling agents and the like may be added.
  • a surfactant for example, a plasticizer, a polymerization inhibitor, a curing agent, a radical generator, a sensitizer, a rubber component (for example, CTBN), a flame retardant (for example, , Phosphorus flame retardants), diluents and thixotropic agents, pigments, antifoaming agents, leveling agents, coupling agents and the like may be added.
  • a laminate 22 is obtained in which the insulating layer 16, the adhesion auxiliary layer 18 and the adhesion resin layer 20 that are formed as desired are formed on the surface of the wiring substrate 10 [see FIG. 1A].
  • the adhesion resin layer 20 is useful as a plating metal receiving layer. Therefore, the laminate 22 in the present invention is useful for forming the second conductive film 24 (second wiring) with good adhesion on the wiring substrate 10.
  • the insulating layer 16, the adhesion auxiliary layer 18, and the adhesion resin layer 20 are provided on both surfaces of the wiring substrate 10, but may be provided only on one surface.
  • a plating catalyst or a precursor thereof is applied to the adhesion resin layer after the step (A), and then plating is performed to form a second conductive layer on the adhesion resin layer. More specifically, as shown in FIG. 1B, the second conductive layer 24 (second metal layer) is formed on the adhesion resin layer 20.
  • the metal which comprises the 2nd conductive layer 24 can be suitably selected according to the kind of plating mentioned later, copper, silver, tin, palladium, gold
  • the interactive group contained in the adhesive resin layer 20 adheres (adsorbs) the applied plating catalyst or its precursor depending on its function. More specifically, a plating catalyst or a precursor thereof is attached in the adhesive resin layer 20 or on the surface thereof.
  • the plating catalyst or its precursor include those that function as a plating catalyst or an electrode in the plating treatment described later. Therefore, the type of the plating catalyst or its precursor is appropriately determined depending on the type of plating.
  • the plating catalyst used in this process or its precursor is an electroless plating catalyst or its precursor.
  • electroless plating or a precursor thereof will be described in detail.
  • Electroless plating catalyst Any electroless plating catalyst can be used as long as it becomes an active nucleus at the time of electroless plating.
  • a metal having catalytic ability for autocatalytic reduction reaction for example, ionization tendency from Ni
  • metals that can be electrolessly plated with a low level include Pd, Ag, Cu, Ni, Al, Fe, Co, and the like.
  • Pd palladium
  • Ag silver
  • Cu copper
  • Ni nickel
  • Al nickel
  • Fe iron
  • Co a metal colloid
  • a metal colloid may be used as the electroless plating catalyst.
  • a metal colloid can be prepared by reducing metal ions in a solution containing a charged surfactant or a charged protective agent. The charge of the metal colloid can be adjusted by the surfactant or protective agent used here.
  • the electroless plating catalyst precursor can be used without particular limitation as long as it can become an electroless plating catalyst by a chemical reaction.
  • the metal ions of the metals mentioned as the electroless plating catalyst are mainly used.
  • the metal ion that is an electroless plating catalyst precursor becomes a zero-valent metal that is an electroless plating catalyst by a reduction reaction.
  • the metal ion which is the electroless plating catalyst precursor may be applied to the adhesion resin layer 20 and then converted into a zero-valent metal by a reduction reaction before immersion in the electroless plating bath, and may be used as an electroless plating catalyst.
  • the electroless plating catalyst precursor may be immersed in an electroless plating bath and changed to a metal (electroless plating catalyst) by a reducing agent in the electroless plating bath.
  • the metal ion that is the electroless plating precursor is preferably applied to the adhesion resin layer 20 using a metal salt.
  • the metal salt used is not particularly limited as long as it is dissolved in a suitable solvent and dissociated into a metal ion and a base (anion), and M (NO 3 ) n , MCl n , M 2 / n (SO 4 ), M 3 / n (PO 4 ) Pd (OAc) n (M represents an n-valent metal atom), and the like.
  • a metal ion the thing which said metal salt dissociated can be used suitably.
  • Specific examples include, for example, Ag ions, Cu ions, Al ions, Ni ions, Co ions, Fe ions, and Pd ions. Among them, those capable of multidentate coordination are preferable, and in particular, functionalities capable of coordination. In view of the number of types of groups and catalytic ability, Ag ions and Pd ions are preferable.
  • a palladium compound may be mentioned.
  • This palladium compound acts as a plating catalyst (palladium) or a precursor thereof (palladium ions), which acts as an active nucleus during the plating treatment and plays a role of depositing metal.
  • the palladium compound is not particularly limited as long as it contains palladium and acts as a nucleus in the plating process, and examples thereof include a palladium (II) salt, a palladium (0) complex, and a palladium colloid.
  • the palladium salt examples include palladium acetate, palladium chloride, palladium nitrate, palladium bromide, palladium carbonate, palladium sulfate, bis (benzonitrile) dichloropalladium (II), bis (acetonitrile) dichloropalladium (II), and bis (ethylenediamine).
  • Palladium (II) chloride and the like are preferable in terms of ease of handling and solubility.
  • the palladium complex examples include tetrakistriphenylphosphine palladium complex and dipalladium trisbenzylideneacetone complex.
  • the palladium colloid is a particle composed of palladium (0), and its size is not particularly limited, but is preferably 5 nm to 300 nm, more preferably 10 nm to 100 nm, from the viewpoint of stability in the liquid.
  • the palladium colloid may contain other metals as necessary, and examples of the other metals include tin.
  • Examples of the palladium colloid include tin-palladium colloid.
  • the palladium colloid may be synthesized by a known method or a commercially available product may be used. For example, a palladium colloid can be prepared by reducing palladium ions in a solution containing a charged surfactant or a charged protective agent.
  • a zero-valent metal other than those described above can also be used as a catalyst used for performing electroplating directly on the adhesive resin layer 20 without performing electroless plating.
  • a dispersion in which a metal is dispersed in an appropriate dispersion medium or a metal salt is dissolved in an appropriate solvent. Then, a solution containing the dissociated metal ions (plating catalyst solution containing a plating catalyst or a precursor thereof) is prepared, and the dispersion or solution is applied on the adhesive resin layer 20, or in the dispersion or solution. What is necessary is just to immerse the laminated body in which the contact
  • the composition for forming an adhesive resin layer containing a polymer having a polymerizable group and an interactive group may be brought into contact with the adhesion auxiliary layer 18.
  • a composition containing a polymer having a polymerizable group and an interactive group, and a composition containing a plating catalyst or a precursor thereof is brought into contact with the adhesion assisting layer 18 to apply the surface graft polymerization method, thereby allowing the interaction.
  • the adhesion resin layer 20 having a group and containing a polymer directly chemically bonded to the adhesion auxiliary layer 18 and a plating catalyst or a precursor thereof can be formed.
  • the plating catalyst or a precursor thereof as described above can be applied to the adhesion resin layer 20 as a dispersion or a solution (plating catalyst liquid).
  • An organic solvent or water is used as the solvent for the catalyst solution.
  • Water may be used for the catalyst solution, and it is preferable that this water does not contain impurities. From such a viewpoint, it is preferable to use RO water, deionized water, distilled water, purified water, or the like. It is particularly preferable to use deionized water or distilled water.
  • the organic solvent used for the preparation of the catalyst solution is not particularly limited as long as it is a solvent that can penetrate into the adhesive resin layer 20, and specifically, acetone, methyl acetoacetate, ethyl acetoacetate, ethylene glycol diacetate, Cyclohexanone, acetylacetone, acetophenone, 2- (1-cyclohexenyl), propylene glycol diacetate, triacetin, diethylene glycol diacetate, dioxane, N-methylpyrrolidone, dimethyl carbonate, dimethyl cellosolve, and the like can be used.
  • a water-soluble organic solvent is preferable from the viewpoint of compatibility with the plating catalyst or its precursor and permeability to the adhesive resin layer 20, and acetone, dimethyl carbonate, dimethyl cellosolve, triethylene glycol monomethyl ether, diethylene glycol dimethyl ether, Diethylene glycol diethyl ether is preferred.
  • the content of the solvent is preferably 0.5 to 40% by mass, more preferably 5 to 30% by mass, and particularly preferably 5 to 20% by mass with respect to the total amount of the catalyst solution.
  • the plating catalyst solution may contain other additives depending on the purpose within a range not impairing the effects of the present invention. Examples of the additive include those shown below. Examples include swelling agents (such as organic compounds such as ketones, aldehydes, ethers, esters, etc.) and surfactants (such as anionic, cationic, zwitterionic, nonionic, low molecular or polymeric). .
  • the interaction group in the adhesion resin layer 20 interacts with an intermolecular force such as van der Waals force or is coordinated with a lone electron pair.
  • the plating catalyst or its precursor can be adsorbed by utilizing the interaction by bonding.
  • the metal concentration in the dispersion, solution, composition (plating catalyst solution), or metal ion concentration in the solution (plating catalyst or its precursor concentration) is 0.
  • the range is preferably 0.001 to 50% by mass, and more preferably 0.005 to 30% by mass.
  • the contact time is preferably about 30 seconds to 24 hours, more preferably about 1 minute to 1 hour.
  • an interaction can be formed between the interactive group in the adhesive resin layer 20 and the plating catalyst or its precursor.
  • the second conductive layer (plating film) 24 is formed on the surface of the adhesion resin layer 20 by plating the adhesion resin layer 20 to which the plating catalyst or its precursor is applied [FIG. B)].
  • the formed second conductive layer 24 functions as a second metal wiring and has excellent conductivity and adhesion.
  • the thickness of the second conductive layer is not particularly limited, but is preferably 0.2 to 20 ⁇ m, more preferably 0.4 to 10 ⁇ m from the viewpoint of ease of laser drilling and via connection reliability. 5 to 10 ⁇ m is particularly preferable.
  • the type of plating performed in this step includes electroless plating and electroplating, and can be appropriately selected depending on the function of the plating catalyst or its precursor. Especially, it is preferable to perform electroless plating from the point of the formation of the hybrid structure expressed in the adhesive resin layer 20 and the improvement of adhesiveness. In order to obtain a plating layer having a desired film thickness, it is a more preferable aspect that electroplating is further performed after electroless plating.
  • the plating suitably performed in this process will be described.
  • Electroless plating refers to an operation of depositing a metal by a chemical reaction using a solution in which metal ions to be deposited as a plating are dissolved.
  • the electroless plating in this step is performed, for example, by immersing the laminate provided with the electroless plating catalyst in water to remove excess electroless plating catalyst (metal) and then immersing it in an electroless plating bath.
  • the electroless plating bath to be used a generally known electroless plating bath can be used.
  • the laminate to which the electroless plating catalyst precursor is applied is immersed in an electroless plating bath in a state where the electroless plating catalyst precursor is adsorbed or impregnated in the adhesion resin layer 20, the laminate is washed with water. It is preferable to immerse in an electroless plating bath after removing excess precursors (such as metal salts). In this case, reduction of the plating catalyst precursor and subsequent electroless plating are performed in the electroless plating bath.
  • the electroless plating bath used here a generally known electroless plating bath can be used as described above.
  • the reduction of the electroless plating catalyst precursor may be performed as a separate step before electroless plating by preparing a catalyst activation liquid (reducing liquid) separately from the embodiment using the electroless plating liquid as described above.
  • the catalyst activation liquid is a liquid in which a reducing agent capable of reducing an electroless plating catalyst precursor (mainly metal ions) to zero-valent metal is dissolved, and its concentration is preferably 0.1 to 50% by mass, and preferably 1 to 30% by mass. % Is more preferable.
  • the reducing agent it is possible to use a boron-based reducing agent such as sodium borohydride or dimethylamine borane, or a reducing agent such as formaldehyde or hypophosphorous acid.
  • composition of electroless plating bath is as follows: 1. metal ions for plating; 2. reducing agent; Additives (stabilizers) that improve the stability of metal ions are mainly included.
  • the plating bath may contain known additives such as a plating bath stabilizer.
  • Examples of the solvent used in the electroless plating bath include water and organic solvents.
  • the organic solvent it is necessary to be a solvent that can be used for water, and from this point, ketones such as acetone and alcohols such as methanol, ethanol, and isopropanol are preferably used.
  • a copper electroless plating bath contains CuSO 4 as a copper salt, HCOH as a reducing agent, a chelating agent such as EDTA or Rochelle salt, which is a stabilizer for copper ions, and a trialkanolamine. .
  • the plating bath used for electroless plating of CoNiP includes cobalt sulfate and nickel sulfate as metal salts, sodium hypophosphite as a reducing agent, sodium malonate, sodium malate, and sodium succinate as complexing agents. It is included.
  • the palladium electroless plating bath contains (Pd (NH 3 ) 4 ) Cl 2 as metal ions, NH 3 and H 2 NNH 2 as reducing agents, and EDTA as a stabilizer. These plating baths may contain components other than the above components.
  • the immersion time in the plating bath is preferably about 1 minute to 6 hours, and more preferably about 1 minute to 3 hours.
  • step (B) when the plating catalyst or precursor thereof applied in step (B) has a function as an electrode, electroplating is performed on the adhesive resin layer 20 to which the catalyst or precursor thereof is applied. It can be carried out.
  • the formed plating film may be used as an electrode, and electroplating may be further performed.
  • the second conductive layer 24 (metal layer) having an arbitrary thickness can be easily formed on the electroless plating film having excellent adhesion to the substrate.
  • the second conductive layer 24 (metal layer) can be formed to a thickness according to the purpose.
  • the electroplating method a conventionally known method can be used.
  • the metal used for electroplating include copper, chromium, lead, nickel, gold, silver, tin, and zinc. From the viewpoint of conductivity, copper, gold, and silver are preferable, and copper is more preferable. preferable.
  • the thickness of the metal layer obtained by electroplating varies depending on the application, and can be controlled by adjusting the concentration of metal contained in the plating bath or the current density.
  • the metal deposited in the adhesive resin layer 20 by the plating process is formed as a fractal microstructure in the layer, whereby the second conductive
  • the adhesion between the layer 24 and the adhesion resin layer 20 can be further improved.
  • the amount of metal present in the adhesive resin layer 20 is such that when the cross section of the substrate is photographed with a metal microscope, the proportion of metal in the region from the outermost surface of the adhesive resin layer 20 to a depth of 0.5 ⁇ m is 5 to 50 areas. %, And when the arithmetic average roughness Ra (JIS B0633-2001) between the adhesion resin layer 20 and the metal interface is 0.05 ⁇ m to 0.5 ⁇ m, a stronger adhesion is expressed.
  • the second conductive layer, the adhesive resin layer, and the insulating layer are removed / penetrated by laser processing or drilling so as to reach the surface of the first conductive layer.
  • assistant layer is also removed and penetrated by the said process. More specifically, as shown in FIG. 1C, in this step, the first conductive layer penetrates through the second conductive layer 24, the adhesion resin layer 20, the adhesion auxiliary layer 18, and the insulating layer 16.
  • a via hole 26 is formed in order to connect the first conductive layer 14 to the second conductive layer 24.
  • the laser used for the laser processing is not particularly limited as long as the second conductive layer 24, the adhesion resin layer 20, the adhesion auxiliary layer 18 and the insulating layer 16 can be removed and a via hole having a desired diameter can be formed.
  • CO 2 laser carbon dioxide laser
  • UV-YAG laser excimer laser
  • a UV-YAG laser is preferable in that a micro via having a size of less than 60 ⁇ m is formed.
  • the drilling is not particularly limited as long as the second conductive layer 24, the adhesion resin layer 20, the adhesion auxiliary layer 18 and the insulating layer 16 can be removed and a via hole having a desired diameter can be formed. From the viewpoint of the workability and small diameter via workability, the spin drill method is generally used.
  • the diameter of the via hole 26 formed in this step is appropriately selected according to the purpose of use, but the top diameter ( ⁇ ) is 20 to 150 ⁇ m from the viewpoint of forming a high-density multilayer substrate.
  • the bottom diameter ( ⁇ ) is preferably 20 to 120 ⁇ m, the top diameter ( ⁇ ) is 20 to 60 ⁇ m, and the bottom diameter ( ⁇ ) is 20 to 50 ⁇ m from the viewpoint of miniaturization and integration of wiring. Then, it is more preferable.
  • a desmear process for removing smear (residue) remaining in the via hole 26 formed in the step (C) is performed.
  • the second conductive layer 24, the adhesion resin layer 20, the adhesion auxiliary layer 18 and the insulating layer 16 are partially removed by laser machining or drilling, a melt or decomposition product when the resin melts or decomposes
  • the insulating layer 16 is attached to the bottom of the via hole by adjusting the laser processing so that it adheres to the side surface and bottom of the via hole 26 and does not directly affect the first conductive layer 14 present at the bottom of the via hole 26. Some may remain. In this step, such a residue is removed.
  • the desmear treatment method is not particularly limited, and a known method is adopted.
  • the surface of the via hole 26 is roughened by a dry method and / or a wet method.
  • the dry roughening method include mechanical polishing such as buffing and sandblasting, and plasma etching.
  • wet roughening methods include chemical methods such as a method using an oxidizing agent such as permanganate, dichromate, ozone, hydrogen peroxide / sulfuric acid, nitric acid, or a method using a strong base or a resin swelling solvent. Examples include chemical treatment. From the simplicity of the process, chemical treatment using permanganate or the like is preferable.
  • a commercially available product MLB211 manufactured by Rohm and Haas Electronic Materials Co., Ltd.
  • a swelling bath containing 20% by volume and Kewposit Z10% by volume is used at 1 to 60 to 85 ° C.
  • a known method may be used, such as immersion in a neutralization bath containing 20% by volume of MLB 216-2 (manufactured by Rohm and Haas Electronic Materials Co., Ltd.) at 35 ° C. to 55 ° C. for 2 to 10 minutes.
  • MLB 216-2 manufactured by Rohm and Haas Electronic Materials Co., Ltd.
  • the surface of the first conductive layer 14 and the second conductive layer 24 is maintained without being affected by chemicals, but the exposed portion of the side surface of the via hole 26 is smeared.
  • the surface is also roughened with the removal. Therefore, the affinity and adhesion between the conductive metal film 28 that conducts the first conductive layer 14 and the second conductive layer 24 and the wall surface of the via hole 26, which are formed in the step (E) described later, are improved. It will also have the advantage.
  • electroplating is performed without performing electroless plating, and the first conductive layer and the second conductive layer are formed.
  • the conductive layer is electrically connected. More specifically, as shown in FIG. 1D, in this step, electroplating treatment after applying graphite or carbon black between the first conductive layer 14 and the second conductive layer 26 is performed.
  • a conductive metal film 28 formed by the above is provided. As shown in FIG. 1D, the conductive metal film 28 may be formed not only on the side surface of the via hole 26 but also on the surfaces of the first conductive layer 14 and the second conductive layer 26. The conductive metal film 28 may be provided so as to fill the via hole 26.
  • graphite or carbon black In this step, graphite and / or carbon black (hereinafter also referred to as a carbon catalyst) is used from the viewpoint of improving via filling, and graphite is particularly preferable.
  • the type of graphite is not particularly limited, and for example, scaly graphite, artificial graphite, earthy graphite and the like are used.
  • the average particle size of graphite is not particularly limited, but is preferably 0.05 to 8 ⁇ m from the viewpoint of improving via filling.
  • the BET specific surface area of graphite is not particularly limited, but is preferably 1 to 100 m 2 / g in view of higher connection reliability of the obtained multilayer wiring board.
  • the type of carbon black is not particularly limited, and conventionally known carbon black such as SAF, ISAF, HAF, and FEF can be used.
  • the average particle size of carbon black is not particularly limited, but is preferably 0.01 to 1 ⁇ m from the viewpoint of improving via filling.
  • the BET specific surface area of graphite is not particularly limited, but is preferably 1 to 100 m 2 / g from the viewpoint of improving via filling.
  • the method for applying the carbon catalyst to the wall surface of the via hole 26 is not particularly limited. However, from the viewpoint of excellent operability and easy control of the amount of catalyst on the wall surface, a solution or dispersion containing the carbon catalyst is added to the via hole 26. A method of contacting the wall surface is preferred. A method for bringing the solution or dispersion into contact with the wall surface of the via hole 26 is not particularly limited. For example, a method of applying the solution or dispersion on a laminate having the via hole 26 or a via hole 26 in the solution or dispersion is used. The method of immersing the laminated body which has this is mentioned. When performing the dipping method, it is preferable to immerse the laminate in the solution or dispersion for 3 to 10 minutes from the viewpoint of productivity and the like.
  • the solvent used in the solution or dispersion is not particularly limited, and examples thereof include a solvent contained in the above-described composition for forming an adhesive resin layer. Of these, water, ethanol, diol (glycol) and the like are preferable from the viewpoint of excellent catalyst application and cleaning efficiency.
  • the content of the carbon catalyst in the solution or dispersion is appropriately selected according to the type of solvent and catalyst used, but the total amount of the solution or dispersion is excellent in terms of catalyst application efficiency.
  • the content is preferably 0.1 to 5% by mass, and more preferably 0.2 to 3% by mass.
  • a cleaning step may be provided in order to remove excess carbon catalyst attached on the first conductive layer 14 and the second conductive layer 24.
  • a method of removing excess carbon catalyst by bringing the cleaning liquid into contact with the first conductive layer 14 and the second conductive layer 24 can be mentioned.
  • the method of bringing the cleaning liquid into contact is not particularly limited, and a method of applying the cleaning liquid onto the first conductive layer 14 and the second conductive layer 24, or a laminate including the first conductive layer 14 and the second conductive layer 24.
  • cleaning liquid is mentioned.
  • the cleaning liquid include sulfuric acid / hydrogen peroxide aqueous solution.
  • Electroplating is performed.
  • the connection between the first conductive layer 14 and the second conductive layer 24 becomes insufficient, and connection reliability is impaired. Furthermore, the problem that the adhesiveness of the plating film formed on the 2nd conductive layer 24 is not enough arises.
  • the same method as the electroplating described in the above step (B) can be performed.
  • the process (F) and (G) mentioned later may be performed, a pattern-form resist layer may be formed on the contact
  • the resist layer may be removed by performing step (I) described later after electroplating.
  • the thickness of the conductive metal film 28 that conducts the first conductive layer 14 and the second conductive layer 24 can be appropriately controlled, but is preferably 4 to 50 ⁇ m from the viewpoint of circuit design such as impedance control. More preferably, it is 30 ⁇ m.
  • the multilayer wiring board having two layers of wiring obtained by the above process can also be used as a board serving as a core for forming further wiring so as to be suitable for mounting.
  • a method of laminating further wiring on the multilayer wiring board obtained by the forming method of the present invention a known semi-additive method, subtractive method, or the like can be applied.
  • a typical forming method for forming further wiring using the multilayer wiring board obtained by the forming method of the present invention will be described.
  • the following steps (F) to (I) can be performed.
  • a plating resist layer is formed on the surface of the metal film formed on the adhesion resin layer. More specifically, as shown in FIG. 2A, a plating resist layer 30 is formed on the surface of the conductive metal film 28.
  • the plating resist layer 30 can be formed by a known method, and a general dry film resist or solder resist is used, and a dry film resist is preferable. Any material can be used as the dry film resist, and negative, positive, liquid, and film-like ones can be used.
  • the thickness of the plating resist layer 30 is selected according to the thickness of the wiring to be formed, but is generally preferably 5 to 200 ⁇ m. If the thickness is less than 5 ⁇ m, the film is easily cut and difficult to handle. On the other hand, it is preferably 200 ⁇ m or less from the viewpoint of handling properties such as satisfying folding resistance.
  • the formed plating resist layer 30 is patterned by pattern exposure and development. More specifically, as shown in FIG. 2B, the plating resist layer 30 is not provided in the same region as the wiring pattern (metal pattern) to be formed, and plating is performed only in the region where the metal pattern is not formed. A pattern is formed so that the resist layer 30 exists.
  • the pattern forming method of the dry film resist any method used at the time of manufacturing the printed wiring board can be used.
  • electroplating is performed using a plating resist layer to form a wiring pattern. More specifically, as shown in FIG. 2C, electroplating is performed using the patterned plating resist layer 30 as a mask to form a patterned metal layer 32 in a region where the plating resist layer 30 is not formed. . This forms a further wiring pattern.
  • the electroplating can be performed by the same method as the electroplating described in the step (B).
  • the thickness of the metal layer 32 to be formed is selected according to the purpose of the wiring, but is generally preferably in the range of 0.3 to 3 ⁇ m.
  • the plating resist layer in the non-wiring pattern portion used for energization of electroplating is removed. More specifically, as shown in FIG. 2D, after the metal layer 32 is formed, the plating resist layer 30 in the non-wiring region is removed. In this way, as shown in FIG. 2D, a patterned metal layer 32 (wiring pattern) is formed only in the region where the plating resist layer 30 is not formed. As shown in FIG. 2D, the formed patterned metal layer 32 is electrically connected to each other by the lower second conductive layer 24 and the conductive metal film 28 formed on the surface thereof.
  • etching method any method used at the time of manufacturing a printed wiring board can be used, and either wet etching or dry etching may be used, but wet etching is preferable from the viewpoint of workability.
  • an etching solution for example, an aqueous solution of cupric chloride, ferric chloride, or the like can be used.
  • the multilayer wiring board obtained by the forming method of the present invention can be applied to various uses such as a semiconductor chip, various electric wiring boards, FPC, COF, TAB, a motherboard, a package interposer board, and the like.
  • the multilayer wiring board produced by the method of the present invention can easily form wiring with excellent adhesion to a smooth substrate, has good high-frequency characteristics, and is a fine high-density wiring. Excellent connection reliability between wires.
  • the acid value of the obtained polymer B was measured using a potentiometric automatic titrator (manufactured by Kyoto Electronics Industry Co., Ltd.) and a 0.1 M sodium hydroxide aqueous solution as the titrant, the acid value of the polymer B was 3 0.2 mmol / g.
  • the obtained polymer B was identified using an IR measuring machine (manufactured by Horiba, Ltd.). The measurement was performed by dissolving the polymer in acetone and using KBr crystals. As a result of IR measurement, a peak was observed in the vicinity of 2240 cm ⁇ 1 and it was found that acrylonitrile, which is a nitrile unit, was introduced into the polymer. Moreover, it was found from the acid value measurement that acrylic acid was introduced as a carboxylic acid unit. Further, it was dissolved in heavy DMSO (dimethyl sulfoxide) and measured by Bruker 300 MHz NMR (AV-300).
  • DMSO dimethyl sulfoxide
  • Example 1 [1. Preparation of insulating layer] An epoxy insulating film GX-13 (film thickness 45 ⁇ m) manufactured by Ajinomoto Fine-Techno Co., Ltd. as an electrically insulating layer is heated and pressurized on a glass epoxy substrate on which a first conductive layer (copper foil) is formed in advance. An insulating film was formed by bonding with a vacuum laminator at a pressure of 0.2 MPa under conditions of 100 to 110 ° C.
  • JER806 bisphenol F type epoxy resin: made by Japan Epoxy Resin
  • LA7052 phenolite, curing agent: Dainippon Ink & Chemicals
  • YP50-35EK phenoxy resin, Toto) Kasei
  • cyclohexanone 61.6 parts by mass cyclohexanone 61.6 parts by mass
  • 2-ethyl-4-methylimidazole curing accelerator
  • This coating solution was applied to the substrate with a spin coater (rotated at 300 rpm for 5 seconds and then rotated at 1500 rpm for 20 seconds), and then dried and cured at 180 ° C. for 30 minutes. Thereby, a substrate A1 was obtained.
  • the thickness of the cured adhesion auxiliary layer was 1.0 ⁇ m.
  • the surface roughness (Ra) of the substrate A1 was 0.10 ⁇ m (200 ⁇ m 2 ).
  • composition for forming adhesive resin layer composition for forming adhesive resin layer
  • preparation of adhesive resin layer To 7% acetonitrile solution of polymer A having a polymerizable group and an interactive group, 20 parts by mass of synthetic rubber [Nipol 1041, trade name: manufactured by Nippon Zeon Co., Ltd.] is added to 100 parts by weight of polymer A, and an adhesive resin layer A coating solution for forming composition 1 was prepared.
  • the prepared coating solution was applied onto the adhesion auxiliary layer of the substrate A1 by a spin coater (rotated at 300 rpm for 5 seconds and then rotated at 750 rpm for 20 seconds) and dried at 80 ° C. for 30 minutes. After drying, using a UV exposure machine (model number: UVF-502S, lamp: UXM-501MD) manufactured by Mitsunaga Electric, an irradiation power of 10 mW / cm 2 through a quartz mask (Ushio's UV integrated light meter UIT150) -Irradiation power measurement with light receiving sensor UVD-S254), irradiation was performed for 100 seconds to generate a graft polymer on the entire surface of the adhesion assisting layer, and an adhesion resin layer containing a polymer directly bonded to the adhesion assisting layer was formed.
  • the integrated exposure amount was 500 mJ.
  • the substrate on which the graft polymer was produced was immersed in agitated acetonitrile for 5 minutes, and then washed with distilled water. Thereby, the laminated body which has an adhesion resin layer was obtained.
  • the thickness of the adhesive resin layer was 0.3 ⁇ m.
  • Electroless plating As described above, the laminated body provided with the plating catalyst was subjected to electrolysis plating at a temperature of 26 ° C. for 60 minutes using an electroless plating bath having the following composition using a sulcup PGT manufactured by Uemura Kogyo Co., Ltd. Plating was performed to obtain a laminate having a second conductive layer on the surface of the laminate. The thickness of the obtained electroless copper plating film was 1.0 ⁇ m.
  • the preparation order and raw materials of the electroless plating solution are as follows.
  • a via hole that reaches the surface of the first conductive layer with a top diameter of 60 ⁇ m is adjusted using a UV-YAG laser with a frequency of 5000 HZ and a shot number of 200 to 300 and a pulse energy of 0.05 to 0.12 mJ. Formed.
  • Electroplating Using the first conductive layer, the second conductive layer, and the applied carbon catalyst as a power feeding layer, electroplating was performed for 45 minutes under the condition of 3 A / dm 2 using an electrolytic copper plating bath having the following composition. The thickness of the obtained electrolytic copper plating film was 20 ⁇ m.
  • the plating resist pattern was stripped and removed by applying it to the surface at a spray pressure of 0.2 MPa at 80 ° C. for 100 seconds using a 4 mass% sodium hydroxide aqueous solution as the resist stripping solution.
  • the wiring pattern 34 was prepared by removing the copper used as the underlying conductive layer in the non-circuit pattern portion with a perhydrosulfuric acid-based soft etching solution (see FIG. 3).
  • the obtained substrate was washed with water to obtain a semi-additive pattern in which interlayer connections were made by blind vias. Specifically, 20 units of via chains (daisy chains) (see FIG. 3) connected with 100 50 ⁇ m ⁇ blind vias were produced. The evaluation test mentioned later was done using this unit.
  • Example 2 It implemented in Example 1 [5.
  • the electroless plating] treatment time was changed to 20 minutes to produce an electroless copper plating having a thickness of 0.3 ⁇ m.
  • the copper plating was used as a power feeding layer, and an electrolytic copper plating bath having the following composition was used.
  • 3A / dm A multilayer wiring board was produced in the same manner as in Example 1 except that electroplating was performed for 10 minutes under the condition 2 to obtain a copper plating having a thickness of 5 ⁇ m.
  • Example 3 A multilayer wiring board was produced in the same manner as in Example 1 except that Polymer B was used instead of Polymer A used in Example 1.
  • Example 4 It implemented in Example 1 [8. Carbon catalyst addition] and [9. Instead of the “cleaning step”, the carbon catalyst is adsorbed and washed on the via wall surface by the following [Adsorption of dispersion liquid on the via wall surface (“MacDermide Blackhole TM SP solution”)]. Otherwise, Example 1 Similarly, a multilayer wiring board was produced.
  • Procedure A “6.5 g of tannic acid was added to 200 g of distilled water at 25 ° C. Thereafter, granular carbon black (manufactured by Mitsubishi Chemical Co., Ltd., brand name # 3230B, average particle size 23 nm, BET specific surface area 220 m 2 / g) 4.0 g was added and stirred for 30 minutes to obtain a dispersion, and the laminate subjected to desmear treatment was immersed in the obtained dispersion (25 ° C.) for 15 minutes, Conductive carbon black was applied. " Procedure B: “To remove excess carbon black catalyst adhering to the first conductive layer and the second conductive layer, an aqueous sulfuric acid / hydrogen peroxide solution at 25 ° C. (100 g of distilled water, 16 g of sulfuric acid 3.2N, The laminate was immersed in 90 g of hydrogen oxide water for 40 seconds. "
  • the laminate having a via hole was immersed in a 0.05 mass% acetone solution of palladium nitrate for 30 minutes, and then washed with acetone and distilled water for 1 to 2 minutes, respectively.
  • the laminate with the plating catalyst applied to the wall surface of the via hole is subjected to electroless plating for 20 minutes at an electroless plating temperature of 26 ° C. using an electroless plating bath having the following composition, using Sulcup PGT manufactured by Uemura Kogyo Co., Ltd.
  • an electroless copper plating film (thickness: 0.3 ⁇ m) was produced so as to make the first conductive layer and the second conductive layer conductive.
  • the preparation order and raw materials of the electroless plating solution are as follows. Approximately 60% by volume of distilled water PGT-A 9.0% by volume PGT-B 6.0% by volume PGT-C 3.5% by volume Formalin solution * 2.3% by volume Finally, the liquid level was adjusted with distilled water so that the total amount would be 100% by volume. * The formalin used here is a Wako Pure Chemical formaldehyde solution (special grade).
  • Example 4 the [dispersion of the dispersion liquid (“MacDermid ⁇ Blackhole TM SP solution”) on the via wall surface] performed in Example 4 was performed, and then [10. Formation and patterning of plating resist layer for electroplating] to [12. Removal of resist and etching] were performed, and a multilayer wiring board was manufactured.
  • the [dispersion of the dispersion liquid (“MacDermid ⁇ Blackhole TM SP solution”) on the via wall surface] performed in Example 4 was performed, and then [10. Formation and patterning of plating resist layer for electroplating] to [12. Removal of resist and etching] were performed, and a multilayer wiring board was manufactured.
  • Comparative Example 1 a multilayer wiring board was manufactured by using an electroless plating method corresponding to Japanese Patent Application Laid-Open No. 2008-334602 when forming a conductive metal film.
  • Comparative Example 2 a multilayer wiring board was produced without using an adhesive resin layer.
  • Example 1 to 5 obtained by the production method of the present invention, the connection failure rate and the yield failure rate of the fine wiring are low, and the adhesion of the copper foil (metal film) formed on the surface is excellent. It was. In Example 3 using polymer B, the connection failure rate and the yield failure rate of fine wiring were lower. On the other hand, in Comparative Example 1 in which electroless plating was performed without using a conductive catalyst, both the connection failure rate and the yield of fine wiring were high. Although the via wall surface and the via bottom portion of Comparative Example 1 are joined by electroless plating and electroplating, the adhesion between the electroless plating film and the electroplating film tends to be generally low. Due to such a low adhesion, via connection failure is expected.
  • Comparative Example 1 the 90 ° peel strength measured under the conditions of JIS C 6481 (1996) is high.
  • the degree of in-plane variation of the adhesion force on the wiring scale is more important than the value of the adhesion force of 1 cm width size, but this measurement is difficult.
  • the reason for the high yield failure in Comparative Example 1 is that the planar region has a configuration in which the in-plane variation, particularly the variation on a minute scale, that is a lamination of an electroless plating film and an electroplating film tends to be large. ,I think that the.
  • Comparative Example 2 that does not use the adhesive resin layer also has a high connection failure rate and yield failure.
  • Comparative Example 2 since the surface roughness of the insulating layer is large, it can be determined that the yield defect rate is extremely high. On the other hand, the reason why the connection failure rate of Comparative Example 2 is low is that the adhesive resin layers of Examples 1 to 5 function as stress relaxation layers, which showed an effect more than expected, and extremely severe conditions of thermal shock. Is mentioned. As a result, it seems that the difference between the comparative example 2 and the examples 1 to 5 appears remarkably.
  • Wiring substrate 12 Substrate 14: First conductive layer 16: Insulating layer 18: Adhesion auxiliary layer 20: Adhesion resin layer 22, 36: Laminate 24: Second conductive layer 26: Via hole 28, 42: For conduction Metal film 30: Plating resist 32: Metal layer 34: Wiring pattern

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Abstract

La présente invention concerne un procédé de fabrication d'un panneau de câblage multicouche qui présente une excellente productivité, selon lequel un câblage métallique extrêmement fin ayant une forte adhésivité peut être fabriqué et un panneau de câblage multicouche ayant une fiabilité de connexion à un trou de raccordement peut être fabriqué à grand rendement. Ce procédé de fabrication de panneau de câblage multicouche se compose : (A) d'une étape dans laquelle un corps laminé est formé sur la surface du panneau de câblage qui est munie d'une première couche conductrice, ledit corps laminé étant muni d'une couche isolante et d'une couche de résine adhésive dans cet ordre ; (B) d'une étape dans laquelle, après application d'un catalyseur de placage ou d'un de ses précurseurs à la couche de résine adhésive, cette dernière est plaquée et une seconde couche conductrice est formée sur la couche de résine adhésive ; (C) une étape dans laquelle la seconde couche conductrice, la couche de résine adhésive et la couche isolante sont pénétrées par traitement laser ou forage et un trou de connexion est formé de sorte qu'il atteigne la première couche conductrice ; (D) une étape dans laquelle un traitement desmear est réalisé ; et (E) une étape dans laquelle, après application de noir de carbone ou de graphite sur la surface de la paroi du trou de connexion, la surface de la paroi est plaquée par électrolyse sans réalisation d'un dépôt autocatalytique.
PCT/JP2011/069805 2010-08-31 2011-08-31 Procédé de fabrication de panneau de câblage multicouche WO2012029865A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242648A (ja) * 1997-02-27 1998-09-11 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JPH10270853A (ja) * 1997-03-25 1998-10-09 Matsushita Electric Works Ltd プリント配線板の製造方法
JP2009094191A (ja) * 2007-10-05 2009-04-30 Ube Ind Ltd 多層配線基板の製造方法
JP2010157589A (ja) * 2008-12-26 2010-07-15 Fujifilm Corp 多層配線基板の形成方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10242648A (ja) * 1997-02-27 1998-09-11 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JPH10270853A (ja) * 1997-03-25 1998-10-09 Matsushita Electric Works Ltd プリント配線板の製造方法
JP2009094191A (ja) * 2007-10-05 2009-04-30 Ube Ind Ltd 多層配線基板の製造方法
JP2010157589A (ja) * 2008-12-26 2010-07-15 Fujifilm Corp 多層配線基板の形成方法

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