WO2012029472A1 - 電磁波伝送媒体及び電磁波伝送システム - Google Patents
電磁波伝送媒体及び電磁波伝送システム Download PDFInfo
- Publication number
- WO2012029472A1 WO2012029472A1 PCT/JP2011/067386 JP2011067386W WO2012029472A1 WO 2012029472 A1 WO2012029472 A1 WO 2012029472A1 JP 2011067386 W JP2011067386 W JP 2011067386W WO 2012029472 A1 WO2012029472 A1 WO 2012029472A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electromagnetic wave
- conductor
- wave transmission
- mesh
- transmission medium
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B3/00—Line transmission systems
- H04B3/50—Systems for transmission between fixed stations via two-conductor transmission lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/007—Details of, or arrangements associated with, antennas specially adapted for indoor communication
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/20—Non-resonant leaky-waveguide or transmission-line antennas; Equivalent structures causing radiation along the transmission path of a guided wave
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B3/00—Line transmission systems
- H04B3/52—Systems for transmission between fixed stations via waveguides
Definitions
- the present invention relates to a surface-shaped (sheet-like) electromagnetic wave transmission medium capable of simultaneously transmitting a plurality of types of electromagnetic waves while easily reducing leakage electromagnetic waves, and a transmission system using the medium as a transmission path.
- an electromagnetic wave transmission medium in which a dielectric is sandwiched between one mesh-like conductor and a sheet-like conductor, and an interface that extracts the electromagnetic waves that ooze out from the mesh-like conductor A combination is proposed.
- the above-mentioned system can take out electromagnetic waves that ooze out from the mesh-like conductor from any position of the sheet-like conductor. For this reason, the above-described system is attracting attention as one of means for realizing connectionless communication and power feeding.
- a first mesh conductor used for transmitting an electromagnetic wave having a first power and a second mesh conductor used for transmitting an electromagnetic wave having a second power, Consists of.
- the use of two mesh conductors can reduce the leakage electromagnetic wave when transmitting a large electromagnetic wave.
- the figure which shows the cross-sectional structural example of the electromagnetic wave transmission medium which concerns on this invention The figure which shows the usage example in the case of constructing
- stacked two mesh conductors from which coarse density differs.
- the figure which shows the cross-sectional structure example of the electromagnetic wave transmission medium which has two mesh conductors from which coarse density differs on the same plane.
- FIG. 1 shows an example of a cross-sectional structure of an electromagnetic wave transmission medium according to the first embodiment.
- 101 is a conductor layer
- 102 is a dielectric layer
- 103 is a mesh conductor layer having a low conductor density
- 105 is a mesh conductor layer having a high conductor density
- 106 is an interface for extracting electromagnetic waves from an electromagnetic wave transmission medium.
- 104-1 and 104-2 are protective layers for protecting the mesh conductor layer, respectively, and one or both of them can be omitted depending on the application. Further, the protective layer may be attached to the contact surface of the interface 106 instead of being attached to the surface of the mesh conductor layers 103 and 105.
- the mesh conductor layer has a two-layer structure.
- a mesh conductor layer 103 having a relatively low or low conductor density is disposed on the lower layer side (dielectric 102 side), and a mesh having a relatively higher or dense conductor density is disposed on the upper layer side (interface 106 side).
- a conductor layer 105 is disposed. That is, in the case of FIG. 1, the conductor density of the mesh conductor layer on the interface 106 side from which the electromagnetic wave is extracted is relatively high.
- This structure means that the upper mesh conductor layer can also function as an electromagnetic shield for the lower mesh conductor layer.
- the protective layers 104-1 and 104-2 and the upper mesh conductor layer 105 are preferably made of a material and / or structure that can be easily processed with a blade. In particular, it is preferable that the protective layer and the mesh conductor layer can be easily peeled at the boundary surface. By exposing the mesh conductor layer 103 on the lower layer side by peeling off the mesh conductor layer 105 on the upper layer side, it is possible to increase the extraction strength of electromagnetic waves from the mesh conductor layer 103 on the lower layer side.
- FIG. 2 shows a usage example suitable for simultaneously transmitting a power feeding electromagnetic wave and a communication electromagnetic wave using the electromagnetic wave transmission medium according to the embodiment.
- 201 is an interface used for communication
- 202 is an interface used for power feeding. That is, in a preferable usage example, the electromagnetic wave for communication is transmitted using the mesh conductor layer 105 on the upper layer side, and the electromagnetic wave for power supply is transmitted using the mesh conductor layer 103 on the lower layer side.
- the upper mesh conductor layer 105 also functions as an electromagnetic shield for the lower mesh conductor layer 103. Therefore, if the interface 202 used for power feeding is arranged on the surface of the protective layer 104-2, electromagnetic waves cannot be extracted efficiently.
- the mesh conductor layer 105 having a high conductor density is partially removed to expose the lower protective layer 104-1 and the power supply interface 202 is attached to the region.
- the power supply interface 202 by attaching the power supply interface 202 to the mesh conductor layer 203 with only the protective layer 104-1 interposed therebetween, a larger electric power can be obtained than when electromagnetic waves are taken out with the mesh conductor layer 105 having a high conductor density interposed therebetween. Can be taken out.
- the communication interface 201 is in contact with the mesh conductor layer 105 having a high conductor density. For this reason, only small electric power can be taken out. However, since communication generally uses weak signals, communication is sufficiently possible even by electromagnetic waves leaking from the mesh conductor layer 105 having a high conductor density.
- the transmission efficiency of electromagnetic waves for communication applications realized through the mesh conductor layer 105 having a high conductor density is not necessarily high.
- an electromagnetic wave leaking to the outside from an area other than the exposed area of the mesh conductor layer 103 having a low conductor density is also small. That is, the transmission efficiency for power feeding applications in which the total amount of electromagnetic waves leaking to the outside from the entire surface of the electromagnetic wave transmission medium is reduced, and at the same time, electromagnetic waves are transmitted through the power feeding interface 202 in contact with the mesh conductor layer 103 having a low conductor density.
- the usage mode shown in FIG. 2 improves the transmission efficiency of the entire system compared to the case where only one type of mesh conductor layer is used as in the conventional system. be able to.
- the frequency F1 of the electromagnetic waves for communication is higher than the frequency F2 of the electromagnetic waves for power supply (F1> F2). desirable. This is because the electromagnetic wave leaking from the mesh conductor layer to the outside increases as the frequency increases.
- the frequency F1 of the communication electromagnetic wave the power of the electromagnetic wave that can be taken out via the communication interface 201 in contact with the mesh conductor layer 105 having a high conductor density is increased.
- the frequency F2 of the electromagnetic wave for feeding the power of the electromagnetic wave for feeding leaking from the mesh conductor layer 105 having a high conductor density can be reduced.
- the coarse density of the mesh conductor layer 103 having a low conductor density can be selected independently of the mesh conductor layer 105 having a high conductor density. For this reason, if the coarse density of the mesh conductor layer 103 having a low conductor density is determined in accordance with the frequency of the electromagnetic wave for power supply, the transmission efficiency can be optimized, and the power for power supply that can be taken out from the transmission medium does not decrease. That's it.
- the mesh conductor layer is constituted by a laminated structure of a plurality of mesh conductor layers. Due to this configuration, the user can partially remove the mesh layer having a high conductor density from an arbitrary surface portion of the electromagnetic wave transmission medium in accordance with the arrangement position of the electronic device that requires power feeding. That is, the user can freely determine a region portion used for power feeding.
- FIG. 3 shows a state in which the mesh conductor layer 105 having a high conductor density on the surface side is partially removed in the present embodiment.
- reference numeral 301 denotes a mesh conductor layer having a high conductor density removed from the surface.
- the mesh conductor layer 103 having a low conductor density is exposed only in a portion where the mesh conductor layer 301 having a high conductor density is removed. That is, a state where the conductor density is rough is realized only in the surface region where the electromagnetic wave for power feeding is extracted, and the state where the conductor density is dense is realized in the other surface regions.
- the mesh conductor layer 105 having a high conductor density and the mesh conductor layer 103 having a low conductor density are bonded to each other using an adhesive, a frictional force, or a pressure.
- an adhesive for example, if a cut is made from the surface side of the mesh conductor layer 105 having a high conductor density and the mesh conductor layer 103 having a low conductor density is peeled off, only the mesh conductor layer having a high conductor density can be removed.
- an irreversible method using heat or pressure such as melting, cutting, or opening a hole of the mesh conductor layer 105 can be used as a method of removing the mesh conductor layer 105 can be used.
- the mesh on the lower layer side is adopted.
- the electromagnetic wave for communication can be transmitted to the mesh conductor layer 105 on the upper layer side while the electromagnetic wave for power feeding is transmitted to the conductor layer 103.
- the upper mesh conductor layer 105 acts as an electromagnetic shield except for a portion where the power supply interface 202 is attached while transmitting a power supply electromagnetic wave with high power. For this reason, the electromagnetic wave transmission medium with a small electromagnetic wave leaking from the surface can be realized.
- the conductor density of the mesh conductor layer 105 on the upper layer side (interface side) is equal to the conductor density of the mesh conductor layer 103 on the lower layer side (dielectric layer side).
- the same structure or a structure lower than the conductor density of the mesh conductor layer 103 can also be adopted.
- FIG. 4 shows a cross-sectional structure example of the electromagnetic wave transmission medium when the conductor density of the mesh conductor layers 103 and 105 is the same.
- the same reference numerals are given to the portions corresponding to those in FIG. 1.
- the surface of the electromagnetic wave transmission medium is viewed from the outside (two mesh conductor layers 103).
- 105 can be made higher than a single mesh conductor layer.
- the conductor density of the first embodiment (the conductor density of the mesh conductor layer 105 on the upper layer side is the conductor density of the mesh conductor layer 103 on the lower layer side) The same effect as in the case of higher) can be realized.
- the conductor density of the mesh conductor layer 105 on the upper layer side (interface side) and the conductor density of the mesh conductor layer 103 on the lower layer side (dielectric layer side) are the same, as shown in FIG.
- the conductor density of the entire mesh conductor layer seen transparently from the surface side can be made higher than the conductor density of the mesh conductor layer 103 on the lower layer side (dielectric side). That is, the electromagnetic wave transmission medium according to the second embodiment can achieve the same effect as the electromagnetic wave transmission medium according to the first embodiment.
- FIG. 5 shows an example of a cross-sectional structure of this type of electromagnetic wave transmission medium.
- the electromagnetic wave transmission medium shown in FIG. 5 includes two types of mesh conductor layers having different coarse densities.
- 501 is a conductor layer
- 502 is a dielectric layer
- 503 is a mesh conductor layer having a low conductor density
- 504 is a mesh conductor layer having a high conductor density
- 505 is a protective layer
- 506 is a communication interface
- 507 is a power supply interface. It is.
- a mesh conductor layer 503 for feeding with a large leaked electromagnetic wave is disposed on the medium surface.
- the entire surface is a mesh conductor layer having a low conductor density, whereas in the case of this embodiment, the mesh conductor layer 503 having a low conductor density is used.
- the arrangement region can be limited to a part of the electromagnetic wave transmission medium, and the other region can be covered with a communication mesh conductor layer 504 that transmits a communication electromagnetic wave with high conductor density and low power. Therefore, the leakage of the electromagnetic wave seen from the whole electromagnetic wave transmission medium can be greatly reduced as compared with the conventional electromagnetic wave transmission medium as in the case of the above-described embodiment.
- FIG. 6 shows an example of constructing a monitoring system (electromagnetic wave transmission system) using the electromagnetic wave transmission medium according to each embodiment.
- reference numeral 601 denotes a communication mesh conductor layer having a high conductor density.
- Reference numeral 602 denotes a power supply mesh conductor layer exposed by removing the mesh conductor layer 601 having a high conductor density or disposed in advance as in the third embodiment and having a low conductor density.
- Reference numeral 603 denotes a surveillance camera that is powered by the mesh conductor layer 602 and operates.
- electromagnetic waves can be transmitted to an arbitrary position on the ceiling by laying an electromagnetic wave transmission medium on the entire surface of the ceiling. That is, it can communicate and / or supply power to any point within the ceiling.
- the laying area of the mesh conductor layer 602 having a low conductor density is drawn considerably large so that the difference between the regions can be easily identified.
- an interface for taking out the electromagnetic wave from the electromagnetic wave transmission medium is built in the contact surface of the monitoring camera 603 with the electromagnetic wave transmission medium so that signals and electric power can be received through the electromagnetic wave transmission medium.
- the communication interface needs to be attached to the mesh conductive layer 601 and the power supply interface needs to be attached to the mesh conductive layer 602 so as to communicate with each other.
- wireless communication can be used.
- the mesh conductor layer removed at the time of attachment to the current position is returned to the original position, and the mesh conductor layer having a high conductor density is removed at a new installation position, thereby enabling efficient power feeding.
- the effect of reducing the leaked electromagnetic wave can be further realized by using the electromagnetic wave transmission medium according to Examples 1 to 3.
- FIG. 7 shows a configuration example of the electromagnetic wave transmission system.
- 701 is the electromagnetic wave transmission medium described in each embodiment
- 702 is an interface for extracting electromagnetic waves
- 703 is an interface on the communication / feeding station side
- 704 is a communication / feeding station.
- the interface 703 on the communication / feed station side may be fixed to the transmission medium, or may be configured to be sealed in the transmission medium.
- the communication / power supply station 704 includes a signal source 705 having a frequency F1 and a signal source 706 having a frequency F2, and each transmits electromagnetic waves at different frequencies.
- an amplifier for amplifying electromagnetic waves is inserted between the signal sources 705 and 706 and the interface 703.
- the communication / power supply station 704 performs power transmission and signal transmission / reception with the electromagnetic wave transmission medium 701.
- the electromagnetic waves having the frequency F1 and the frequency F2 are taken out via the interface 702 corresponding to each mesh conductor layer constituting the electromagnetic wave transmission medium 701.
- the controller 707 controls transmission / reception of communication signals and transmission of power signals performed through the electromagnetic wave transmission medium 701.
- the communication / power supply station 704 is connected to the wired interface 708.
- the communication / power supply station 704 secures power and connects to the Internet 709 through the wired interface 708.
- an electronic circuit (receiving circuit) for receiving communication from the interface 702 is also mounted on the communication / power supply station 704.
- the electromagnetic wave transmission medium is realized by a laminated structure or a planar arrangement structure of two mesh conductor layers.
- the electromagnetic wave transmission medium may be configured using three or more mesh conductor layers.
- each mesh conductor layer is assigned a different frequency for transmission of electromagnetic waves, and it is preferable that the lower layer side frequency is low and the upper layer side frequency is high.
- the mesh conductor layer in the above-described embodiment includes a conductor formed in a mesh shape as well as a meshed conductor.
- the size and shape of the opening of the mesh conductor layer may be arbitrary. For example, a rectangular shape as shown in FIG. 3, a circular shape, a polygonal shape, or the like may be used.
- the difference in opening size here includes a difference in opening size due to a difference in line width of the conductor pattern constituting the mesh conductor layer.
Landscapes
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Near-Field Transmission Systems (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
まず、第1の実施例を、図面を用いて説明する。以下では、説明の都合上、相対的に大きな電力を有する電磁波を伝送する場合を「給電」、相対的に小さい電力を有する電磁波を伝送する場合を「通信」と記載する。しかし、本発明に係る電磁波伝送媒体は、必ずしも「給電」と「通信」の組み合わせに限って使用することを前提としない。すなわち、本発明は、電力に差がある2種類の電磁波を伝送する場合であれば、任意の伝送用途に使用できる。
第1の実施例では、上層側のメッシュ導体層105の導体密度が下層側のメッシュ導体層103の導体密度より高い場合を示した。
前述の2つの実施例においては、2つのメッシュ導体層を積層する構造について説明した。しかしながら、給電に用いる領域位置が事前に決まっている場合には、本実施例のように同一平面内に導体密度の異なる2つのメッシュ導体層を配置する構造を採用することもできる。この実施例の場合も、2つのメッシュ導体層とは給電用と通信用を意味し、給電用のメッシュ導体層の導体密度は、通信用のメッシュ導体層の導体密度より低いものとする。
以下では、前述した各実施例に係る電磁波伝送媒体の施工例について説明する。図6に、各実施例に係る電磁波伝送媒体を用いて監視システム(電磁波伝送システム)を構築する例を示す。
続いて、実施例1~3に係る電磁波伝送媒体を用いた通信システム(電磁波伝送システム)の構成例を説明する。
前述の実施例においては、電磁波伝送媒体が2つのメッシュ導体層の積層構造又は平面配置構造により実現される場合について説明した。しかしながら、電磁波伝送媒体は、3つ以上メッシュ導体層を用いて構成されていても良い。その場合、各メッシュ導体層には、電磁波の伝送用に異なる周波数が割り当てられることが好ましく、下層側の周波数が低く、上層側の周波数が高いことが好ましい。
102 誘電体層
103 導体密度の低いメッシュ導体層
104-1 保護層
104-2 保護層
105 導体密度の高いメッシュ導体層
106 インターフェース
201 通信用のインターフェース
202 給電用のインターフェース
301 取り除かれた導体密度の高いメッシュ導体層
501 導体層
502 誘電体層
503 導体密度の低いメッシュ導体層
504 導体密度の高いメッシュ導体層
505 保護層
506 通信用のインターフェース
507 給電用のインターフェース
601 導体密度の高いメッシュ導体層
602 導体密度の低いメッシュ導体層
603 監視カメラ
701 電磁波伝送媒体
702 インターフェース
703 通信・給電局側のインターフェース
704 通信・給電局
705 周波数F1の信号源
706 周波数F2の信号源
707 コントローラ
708 有線インターフェース
709 インターネット
Claims (12)
- シート形状の電磁波伝送媒体において、
シート状の導体と、
前記シート状の導体の上層に形成される誘電体と、
前記誘電体の上層に形成され、第1の電力を有する電磁波の伝送に用いられる第1のメッシュ導体と、
前記誘電体の上層に形成され、第2の電力を有する電磁波の伝送に用いられる第2のメッシュ導体とを有する
ことを特徴とする電磁波伝送媒体。 - 請求項1に記載の電磁波伝送媒体において、
前記第1及び第2のメッシュ導体は異なる導体密度を有する
ことを特徴とする電磁波伝送媒体。 - 請求項2に記載の電磁波伝送媒体において、
前記第1のメッシュ導体の上層に積層される前記第2のメッシュ導体の導体密度は、前記第1のメッシュ導体の導体密度より大きい
ことを特徴とする電磁波伝送媒体。 - 請求項1に記載の電磁波伝送媒体において、
前記第1のメッシュ導体の上層には、当該第1のメッシュ導体と同じ導体密度を有する前記第2のメッシュ導体が積層される
ことを特徴とする電磁波伝送媒体。 - 請求項1~4のいずれか1項に記載の電磁波伝送媒体において、
前記第1のメッシュ導体の上層に積層された前記第2のメッシュ導体は、前記第1のメッシュ導体に対して取り外し可能である
ことを特徴とする電磁波伝送媒体。 - 請求項2に記載の電磁波伝送媒体において、
前記第1及び第2のメッシュ導体が同一平面内に配置される
ことを特徴とする電磁波伝送媒体。 - シート形状の電磁波伝送媒体を伝送路とし、前記電磁波伝送媒体に電磁波を印加するインターフェースを有する電磁波伝送システムにおいて、
前記電磁波伝送媒体は、シート状の導体と、前記シート状の導体の上層に形成される誘電体と、前記誘電体の上層に形成され、第1の電力を有する電磁波の伝送に用いられる第1のメッシュ導体と、前記誘電体の上層に形成され、第2の電力を有する電磁波の伝送に用いられる第2のメッシュ導体とを有し、
前記インターフェースは、前記第1のメッシュ導体を通じて第1の電磁波を伝送する第1のインターフェースと、前記第2のメッシュ導体を通じて第2の電磁波を伝送する第2のインターフェースを有する
ことを特徴とする電磁波伝送システム。 - 請求項7に記載の電磁波伝送システムにおいて、
前記第1のインターフェースは、第1の電力を有する前記第1の電磁波の伝送に周波数F1を使用し、
前記第2のインターフェースは、第2の電力を有する前記第2の電磁波の伝送に、前記第1のインターフェースとは異なる周波数F2(>F1)を使用する
ことを特徴とする電磁波伝送システム。 - 請求項8に記載の電磁波伝送システムにおいて、
前記第1のメッシュ導体は給電に用いられ、前記第2のメッシュ導体は通信に用いられる
ことを特徴とする電磁波伝送システム。 - 請求項9に記載の電磁波伝送システムにおいて、
前記第1のメッシュ導体の上層に積層される前記第2のメッシュ導体の導体密度は、前記第1のメッシュ導体の導体密度より大きい
ことを特徴とする電磁波伝送システム。 - 請求項9に記載の電磁波伝送システムにおいて、
前記第1のメッシュ導体の上層には、当該第1のメッシュ導体と同じ導体密度を有する前記第2のメッシュ導体が積層される
ことを特徴とする電磁波伝送システム。 - 請求項9に記載の電磁波伝送システムにおいて、
前記第1及び第2のメッシュ導体が同一平面内に配置される
ことを特徴とする電磁波伝送システム。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012531760A JP5367174B2 (ja) | 2010-09-03 | 2011-07-29 | 電磁波伝送媒体及び電磁波伝送システム |
US13/811,944 US9337894B2 (en) | 2010-09-03 | 2011-07-29 | Electromagnetic wave transmission medium and electromagnetic wave transmission system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-198019 | 2010-09-03 | ||
JP2010198019 | 2010-09-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012029472A1 true WO2012029472A1 (ja) | 2012-03-08 |
Family
ID=45772581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/067386 WO2012029472A1 (ja) | 2010-09-03 | 2011-07-29 | 電磁波伝送媒体及び電磁波伝送システム |
Country Status (3)
Country | Link |
---|---|
US (1) | US9337894B2 (ja) |
JP (1) | JP5367174B2 (ja) |
WO (1) | WO2012029472A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2515769A (en) * | 2013-07-02 | 2015-01-07 | Roke Manor Research | A guiding medium |
US9252473B2 (en) | 2011-03-14 | 2016-02-02 | Hitachi, Ltd. | Electromagnetic wave propagation medium |
JP2020178322A (ja) * | 2019-04-23 | 2020-10-29 | 凸版印刷株式会社 | 電磁波伝送シート |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013124935A1 (ja) * | 2012-02-24 | 2013-08-29 | 日本電気株式会社 | 受電装置、給電装置、通信装置 |
US9711998B2 (en) | 2013-03-27 | 2017-07-18 | International Business Machines Corporation | Power transmitting device, power receiving device, power supply system, and power supply method |
US11374618B2 (en) | 2019-10-19 | 2022-06-28 | Meta Platforms, Inc. | Surface waveguide with a two-dimensional conductive surface surrounded by a conductive wall |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007066406A1 (ja) * | 2005-12-08 | 2007-06-14 | The University Of Tokyo | 通信装置 |
JP2008177881A (ja) * | 2007-01-19 | 2008-07-31 | Hoya Corp | 通信機能付きシート、信号伝送基板の導電層、及び、導電層製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3610933A (en) * | 1968-08-08 | 1971-10-05 | John A Shaver | Coupling device for transmitting electromagnetic energy from floor covering |
BE789519A (fr) * | 1971-10-01 | 1973-03-29 | Dole Electro Systems | Systeme de distribution d'energie electrique d'alimentation et d'energie porteuse d'informations au moyen d'une structure stratifiee |
BE790390A (fr) * | 1971-10-21 | 1973-04-20 | Dole Electro Systems | Systeme a structure stratifiee pour une distribution d'energie d'alimentation electrique et d'energie porteuse de signaux |
JP4538594B2 (ja) * | 2005-09-12 | 2010-09-08 | 株式会社セルクロス | 信号伝達システム |
US9070962B2 (en) * | 2009-10-30 | 2015-06-30 | Nec Corporation | Surface communication device |
-
2011
- 2011-07-29 JP JP2012531760A patent/JP5367174B2/ja not_active Expired - Fee Related
- 2011-07-29 WO PCT/JP2011/067386 patent/WO2012029472A1/ja active Application Filing
- 2011-07-29 US US13/811,944 patent/US9337894B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007066406A1 (ja) * | 2005-12-08 | 2007-06-14 | The University Of Tokyo | 通信装置 |
JP2008177881A (ja) * | 2007-01-19 | 2008-07-31 | Hoya Corp | 通信機能付きシート、信号伝送基板の導電層、及び、導電層製造方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9252473B2 (en) | 2011-03-14 | 2016-02-02 | Hitachi, Ltd. | Electromagnetic wave propagation medium |
GB2515769A (en) * | 2013-07-02 | 2015-01-07 | Roke Manor Research | A guiding medium |
GB2516763A (en) * | 2013-07-02 | 2015-02-04 | Roke Manor Research | A guiding medium |
JP2020178322A (ja) * | 2019-04-23 | 2020-10-29 | 凸版印刷株式会社 | 電磁波伝送シート |
JP7410486B2 (ja) | 2019-04-23 | 2024-01-10 | Toppanホールディングス株式会社 | 電磁波伝送シート |
Also Published As
Publication number | Publication date |
---|---|
JPWO2012029472A1 (ja) | 2013-10-28 |
US20130147573A1 (en) | 2013-06-13 |
US9337894B2 (en) | 2016-05-10 |
JP5367174B2 (ja) | 2013-12-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5367174B2 (ja) | 電磁波伝送媒体及び電磁波伝送システム | |
US10341756B2 (en) | Pure wireless earphones using optimal monopole antennae | |
US9445528B2 (en) | Thermal gap pad | |
JP5678888B2 (ja) | 通信伝達装置、通信カプラ及びインピーダンス調整シート | |
JP2007012710A (ja) | アンテナ内蔵発電装置 | |
JP2016213927A (ja) | 電力送受信用アレイアンテナ | |
JP2013243428A (ja) | 構造体 | |
JP4656318B2 (ja) | アンテナ装置 | |
CN111818728A (zh) | 包括印刷电路板的天线模块和包括该天线模块的基站 | |
TWM546649U (zh) | 可撓性電路板 | |
US20130214613A1 (en) | Surface communication device | |
CN216288512U (zh) | 电池极片及电池 | |
KR102472232B1 (ko) | 배터리 모듈 | |
JP7189367B2 (ja) | アンテナ装置 | |
KR20190060626A (ko) | Emi 개스킷 | |
JP5545091B2 (ja) | 静電型スピーカ | |
JP6351393B2 (ja) | 電池モジュールの製造方法および携帯電子機器の製造方法 | |
JP2010021822A (ja) | 伝達装置 | |
WO2014049920A1 (ja) | 電磁波伝播システム及び電磁波インターフェースコネクタ | |
JP5104700B2 (ja) | 複合アンテナ装置 | |
WO2017138474A1 (ja) | 2次元通信シートへの電力供給システム、給電ポート | |
JP2007311990A (ja) | 通信装置 | |
JP6269857B2 (ja) | 平面アンテナ及びその製造方法 | |
JP2014116130A (ja) | 蓄電装置 | |
KR101395133B1 (ko) | 전파의 노이즈 제거기능을 갖는 안테나 패치의 제조방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11821490 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2012531760 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13811944 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 11821490 Country of ref document: EP Kind code of ref document: A1 |