WO2012011361A1 - 電気化学デバイス - Google Patents
電気化学デバイス Download PDFInfo
- Publication number
- WO2012011361A1 WO2012011361A1 PCT/JP2011/064505 JP2011064505W WO2012011361A1 WO 2012011361 A1 WO2012011361 A1 WO 2012011361A1 JP 2011064505 W JP2011064505 W JP 2011064505W WO 2012011361 A1 WO2012011361 A1 WO 2012011361A1
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- WIPO (PCT)
- Prior art keywords
- film
- welded
- rigid
- conductive lid
- frame portion
- Prior art date
Links
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Images
Classifications
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- H01G11/02—Hybrid capacitors, i.e. capacitors having different positive and negative electrodes; Electric double-layer [EDL] capacitors; Processes for the manufacture thereof or of parts thereof using combined reduction-oxidation reactions, e.g. redox arrangement or solion
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- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
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- Y02E60/13—Energy storage using capacitors
Definitions
- the present invention relates to an electrochemical device having a structure in which a storage element and an electrolytic solution are enclosed in a rigid package made of metal, ceramics, or the like, and which can be surface-mounted on a circuit board or the like.
- This type of electrochemical device generally includes a substantially rectangular parallelepiped rigid package, a storage element and an electrolyte solution enclosed in the internal space of the rigid package, a negative electrode terminal and a positive electrode terminal provided on the flat lower surface of the rigid package, It has.
- the rigid package has a rigid case having a recess in the upper surface opening, and a conductive lid in which the opening in the recess is closed in a watertight and airtight manner.
- the power storage element has a structure in which a negative electrode plate and a positive electrode plate are stacked via a separate sheet.
- the rigid case is provided with wiring for electrically connecting the negative electrode plate of the energy storage element to the negative electrode terminal via the conductive lid, and wiring for electrically connecting the positive electrode plate of the energy storage element to the positive electrode terminal. Yes.
- Patent Document 1 Japanese Unexamined Patent Application Publication No. 2009-278068 (Patent Document 1) and Japanese Unexamined Patent Application Publication No. 2006-049289 (Patent Document 2) disclose a joining structure of a rigid case and a conductive lid in this type of electrochemical device. Yes.
- Patent Document 1 (1) a laminated film made of Cr, Pd, Ni, Cu or the like is formed on the upper surface of a case made of soda lime glass or crystallized glass so as to surround a recess, and (2) on the upper surface of the laminated film.
- a plating film made of Cu, Ni, Au is formed, and (3) a metal ring made of Fe—Ni alloy or Fe—Ni—Co alloy is made of Ag—Cu alloy or Ag—Cu—Sn alloy on the upper surface of the plating film.
- a metal film made of Ni and Au is formed on the upper surface of the metal ring, and (5) a flat plate made of Fe—Ni alloy or Fe—Ni—Co alloy on the upper surface of the metal ring.
- a structure is disclosed in which conductive conductive lids are joined by seam welding.
- a W (tungsten) layer is formed on an upper surface of a case made of an alumina sintered body so as to surround a recess, and a Ni layer is formed on the surface.
- a frame-like member made of an Fe—Ni—Co alloy, Al, or Fe—Ni—Co alloy with an Al layer formed on the upper surface is brazed via Ag brazing or Al brazing, and (3) a frame Disclosed is a structure in which a flat conductive lid made of an Fe-Ni-Co alloy, Al alloy, or Fe-Ni-Co alloy with Al clad joined to the upper surface of a member is joined by seam welding. .
- seam welding is employed as a joining method.
- the workpieces are mutually pressed by the roller electrode (the conductive lid and the metal ring in Patent Document 1, the conductive lid and the frame-shaped member in Patent Document 2), and the welding is performed while rotating the roller electrode.
- the objects are energized with each other, and the objects to be welded are melted by the resistance heat generated by the energization, and the desired joining is performed.
- Patent Document 1 discloses that laser welding can be used instead of seam welding, the structure of the electrochemical device is welded by seam welding. This is the same as the case of performing, and the structure and method specific to laser welding are not described.
- Embodiments of the present invention provide an electrochemical device that does not deteriorate characteristics due to the joining of a rigid case and a conductive lid.
- An electrochemical device includes a rigid package, a power storage element and an electrolyte solution sealed in an internal space of the rigid package, and a negative electrode terminal and a positive electrode terminal provided on a lower surface of the rigid package.
- the rigid package includes a rigid case having a concave portion with an upper surface opening, and a conductive lid for closing the upper surface opening of the concave portion in a water-tight and air-tight manner, and the rigid case includes a negative electrode plate of the power storage element.
- a first wiring electrically connected to the negative electrode terminal via a lid; and a second wiring electrically connecting a positive electrode plate of the power storage element to the positive electrode terminal.
- a welded frame portion having a predetermined width is integrally formed on an upper portion of the rigid case so as to surround the recess, and the welded portion and the welded frame portion are laser welded.
- the weld beads formed on the welded part and the welded frame part by the laser welding are not exposed in the internal space of the rigid package.
- the rigid package such as a melt or a solidified product thereof generated when laser welding is performed. Intrusion into the internal space can be prevented. Therefore, in the electrochemical device according to the embodiment of the present invention, it is possible to prevent deterioration of characteristics due to a melted product or a solidified product thereof caused by laser welding mixed into the electrolytic solution or attached to the storage element.
- FIG. 1A is a top view of an electrochemical device according to an embodiment of the present invention
- FIG. 1B is a bottom view thereof.
- FIG. 2 is an enlarged cross-sectional view showing a cross section of the electrochemical device of FIG. 1 (A) taken along line S1-S1.
- FIG. 3 is a top view of the first sheet constituting the rigid case.
- FIG. 4 is a top view of the second sheet constituting the rigid case.
- FIG. 5 is a top view of the third sheet constituting the rigid case.
- FIG. 6 is a top view of a temporary rigid case obtained by stacking and firing the first sheet, the second sheet, and the third sheet.
- FIG. 7 is a diagram showing a procedure for forming the welded frame portion on the temporary rigid case.
- FIG. 1A is a top view of an electrochemical device according to an embodiment of the present invention
- FIG. 1B is a bottom view thereof.
- FIG. 2 is an enlarged cross-sectional view showing a cross section of the
- FIG. 8 is a diagram showing a procedure for forming a welded frame portion on the temporary rigid case.
- FIG. 9 is a diagram showing a procedure for forming a current collecting film on the temporary rigid case.
- FIG. 10 is a diagram showing a procedure for forming the negative electrode terminal in the temporary rigid case.
- FIG. 11 is a diagram showing a procedure for forming the positive terminal in the temporary rigid case.
- FIG. 12 is a partially enlarged sectional view of the conductive lid.
- FIG. 13 is a diagram showing a procedure for producing an electrochemical device.
- FIG. 14 is a diagram showing a procedure for producing an electrochemical device.
- FIG. 15 is a diagram showing a procedure for producing an electrochemical device.
- FIG. 16 is a diagram showing a procedure for producing an electrochemical device.
- the electrochemical device according to an embodiment of the present invention is enclosed in a substantially rectangular parallelepiped rigid package 10 and an internal space of the rigid package 10 as shown in FIGS. 1 (A), 1 (B) and 2.
- the power storage element 20, the electrolytic solution (not shown), and the negative electrode terminal 30 and the positive electrode terminal 40 provided on the flat lower surface of the rigid package 10 are provided.
- the rigid package 10 has a rigid case 11 having a concave portion CP with an upper surface opening, and a conductive lid 12 that closes the opening of the concave portion CP in a watertight and airtight manner.
- the first wiring 31 for electrically connecting the negative electrode plate 21 of the electricity storage element 20 to the negative electrode terminal 30 through the conductive lid 12, and the positive electrode plate 22 of the electricity storage element 20 to the positive electrode terminal 40.
- a second wiring 41 for electrical connection is provided.
- the rigid case 11 includes a first layer 11a having a substantially rectangular plate shape, a second layer 11b having a substantially rectangular plate shape positioned thereon, and a first layer having a substantially rectangular frame shape positioned thereon.
- the three-layer 11c and a substantially rectangular frame-shaped welded frame portion 11d positioned thereon are integrally provided.
- FIG. 3 shows a top view of the first sheet S11a.
- the first sheet S11a is manufactured by forming unfired W (tungsten) films WIa1 to WIa10 on a substantially rectangular green sheet mainly composed of Al 2 O 3 by a method such as screen printing. As shown, notches CRa1 are formed at the four corners of the green sheet. Further, a cutout CRa2 is formed on one set of short sides of the green sheet, a W film WIa2 is formed on one inner surface of the cutout CRa2, and a W film WIa7 is formed on the other inner surface.
- the “inner surface” of a notch refers to a surface that connects the lower surface and the upper surface of a green sheet and defines the notch. For example, the inner surface of the notch CRa2 refers to a surface that connects the lower surface and the upper surface of the green sheet on which the notch is formed to define the notch CRa2.
- a substantially rectangular W film WIa1 is formed on the lower surface of the green sheet so as to be in contact with the left side of the green sheet.
- the W film WIa1 is continuous with the substantially rectangular W film WIa3 formed on the upper surface of the green sheet via the W film WIa2.
- arc-shaped W films WIa5 are respectively formed on the edges facing the pair of cutouts CRa1 (inner edges of the cutouts CRa1) located at both ends of the left side of the green sheet.
- the W film WIa5 is connected to the W film WIa3 through a pair of band-shaped W films WIa4 formed on the upper surface of the green sheet.
- a substantially rectangular W film WIa6 is formed on the lower surface of the green sheet so as to be in contact with the right side of the green sheet.
- the W film WIa6 is continuous with the substantially rectangular W film WIa8 formed on the upper surface of the green sheet via the W film WIa7 formed on the inner surface of the cutout CRa2 on the right side of the green sheet.
- a circular W film WIa10 is formed near the center of the upper surface of the green sheet, and this W film WIa10 is continuous with the W film WIa8 via a band-shaped W film WIa9.
- FIG. 4 shows a top view of the second sheet S11b.
- the second sheet S11b is composed mainly in a substantially rectangular shape green sheet mainly composed of Al 2 O 3, unfired W (tungsten) film WIb1 ⁇ WIb4 formed by a technique such as screen printing, the Al 2 O 3
- the non-fired insulating film CO is formed by a technique such as coating.
- notches CRb1 are formed at the four corners of the green sheet.
- arc-shaped W films WIb1 are respectively formed on edges facing the pair of cutouts CRa1 located at both ends of the left side of the green sheet.
- the set of W films WIb1 are formed at positions corresponding to the set of W films WIa5 of the first sheet S11a.
- arc-shaped W films WIb3 are respectively formed at the edges facing the pair of cutouts CRb1 located at both ends of the left side of the green sheet. Are connected to each other through a W film WIb2 formed on the inner surface.
- a cylindrical W film WIb4 that penetrates the green sheet in the thickness direction is formed at the center of the gree sheet.
- the W film WIb4 is formed at a position corresponding to the circular W film WIa10 of the first sheet S11a, and the diameter thereof is substantially equal to the diameter of the W film WIa10.
- An insulating film CO is formed on the upper surface of the grease sheet so as not to cover the W film WIa3 and the W film WIb4. That is, the insulating film CO is formed on the upper surface of the green sheet over substantially the entire surface excluding the region where the W film WIa3 and the W film WIb4 are formed.
- FIG. 5 shows a top view of the third sheet S11c.
- the third sheet S11c is manufactured by forming unfired W (tungsten) films WIc1 to WIc4 on a substantially rectangular frame green sheet mainly composed of Al 2 O 3 by a method such as screen printing. As shown, notches CRc1 are formed at the four corners of the green sheet. On the lower surface of the green sheet, arc-shaped W films WIc1 are respectively formed on edges facing the pair of cutouts CRc1 located at both ends of the left side of the green sheet. The set of W films WIc1 are formed at positions corresponding to the set of W films WIb1 of the second sheet S11b, respectively.
- arc-shaped W films WIc3 are respectively formed at edges facing the pair of cutouts CRc1 located at both ends of the left side of the green sheet. Are connected to each other through a W film WIc2 formed on the inner surface.
- a substantially rectangular frame-shaped W film WIc4 is further formed on the upper surface of the green sheet.
- the W film WIc4 has a width smaller than the width of the upper surface of the substantially rectangular frame-shaped green sheet, and a part of the outer periphery thereof is continuous with the set of W films WIc3.
- the second sheet S11b is overlaid on the first sheet S11a prepared as described above, the third sheet S11c is overlaid on the second sheet S11b, and the whole is pressure-bonded.
- the temporary rigid case 11 ′ shown in FIG. 6 is obtained by charging and firing the whole.
- Each of the fired W films WIa1 to WIa10, WIb1 to WIb3, and WIc1 to WIc4 has a thickness of, for example, about 10 ⁇ m
- the fired insulating film 11b1 (CO) has a thickness of, for example, about 5 ⁇ m.
- the fired W films WIa1, WIa2, WIa3, WIa4, WIa5, WIb1, WIb2, WIb3, WIc1, WIc2, WIc3 and WIc4 are electrically connected to each other. Further, the fired W films WIa6, WIa7, WIa8, WIa9, WIa10, and WIb4 are electrically connected to each other.
- the fired W film WIa1 is used as the base film 30a of the negative electrode terminal 30
- the fired W film WIc4 is used as the base film 11d1 of the substantially rectangular frame-shaped welded frame portion 11d
- the fired W film WIa6 is It is used as a base film 40 a for the positive terminal 40.
- a Ni film 11d2 having a thickness of about 4 ⁇ m is formed on the surface of the base film 11d1 (fired W film WIc4) of the temporary rigid case 11 ′ by a technique such as electrolytic plating.
- a base material 11d4 made of an Fe—Ni—Co alloy (Kovar) is joined to the surface of 11d2 via an Ag—Cu solder 11d3 having a thickness of about 5 ⁇ m.
- a Ni film 11d5 having a thickness of about 4 ⁇ m is coated by a technique such as electrolytic plating so as to cover all the surfaces of the base film 11d1, Ni film 11d2, Ag—Cu solder 11d3, and base material 11d4. Is formed.
- an Au film 11d6 having a thickness of about 2 ⁇ m is formed by a technique such as electrolytic plating so as to cover the surface of the Ni film 11d5.
- a welded frame portion 11d including the base film 11d1, the Ni film 11d2, the Ag—Cu brazing 11d3, the base material 11d4, the Ni film 11d5, and the Au film 11d6 is formed.
- the to-be-welded frame portion 11d is formed in a substantially rectangular frame shape like the base film 11d1.
- the welded frame portion 11d having a substantially rectangular frame shape provided so as to surround the concave portion CP on the rigid case 11 includes the base film 11d1, the Ni film 11d2, and the Ag— A Cu solder 11d3, a base material 11d4, a Ni film 11d5, and an Au film 11d6 are included.
- the welded frame portion 11d is formed in a rectangular frame shape having a substantially constant top view width W11d.
- the surface of the Au film 11d6 that faces the recess CP constitutes the upper part of the inner surface that defines the recess CP.
- a Ni film 41a having a thickness of about 4 ⁇ m is formed on the surface (exposed surface) of the W film WIb4 after the temporary rigid case 11 'is fired by a technique such as electrolytic plating.
- An Au film 41b having a thickness of about 2 ⁇ m is formed on the upper surface of the Ni film 41a by a technique such as electrolytic plating.
- a current collecting film 41c made of Al and having a thickness of about 30 ⁇ m is formed by a technique such as coating or vapor deposition so as to cover the surfaces of the Ni film 41a and the Au film 41b and the surface of the insulating film 11b1 (CO).
- the size of the current collecting film 41 c is substantially the same as the size of the positive electrode plate 22 of the power storage element 20.
- a Ni film having a thickness of about 4 ⁇ m is formed by a technique such as electrolytic plating so as to cover the surface of the base film 30a (the W film WIa1 after firing) and the W film WIa2 of the temporary rigid case 11 ′.
- 30b is formed, and an Au film 30c having a thickness of about 2 ⁇ m is formed by a technique such as electrolytic plating so as to cover the surface of the Ni film 30b.
- the negative electrode terminal 30 including the base film 30a (the W film WIa1 after firing), the Ni film 30b, and the Au film 30c is formed.
- a Ni film having a thickness of about 4 ⁇ m is formed by a technique such as electrolytic plating so as to cover the surface of the base film 40a (the W film WIa6 after firing) and the W film WIa7 of the temporary rigid case 11 ′.
- 40b is formed, and an Au film 40c having a thickness of about 2 ⁇ m is formed by a technique such as electrolytic plating so as to cover the surface of the Ni film 40b.
- the positive electrode terminal 40 composed of the base film 40a (baked W film WIa6), the Ni film 40b, and the Au film 40c is formed.
- the Ni film 11d5, the Ni film 41a, the Ni film 30b, and the Ni film 40b may be simultaneously formed by a common process.
- the Au film 11d6, the Au film 41b, the Au film 30c, and the Au film 40c may be simultaneously formed by a common process.
- the production of the rigid case 11 is completed.
- the first wiring 31 is constituted by the fired W films WIa2, WIa3, WIa4, WIa5, WIb1, WIb2, WIb3, WIc1, WIc2, WIc3, and the welded frame portion 11d.
- First wiring 31 electrically connects negative electrode plate 21 of power storage element 20 to negative electrode terminal 30 through conductive lid 12.
- the second wiring 41 is constituted by the fired W films WIa7, WIa8, WIa9, WIa10, WIb4, the Ni film 41a, the Au film 41b, and the current collecting film 41c.
- Second wiring 41 electrically connects positive electrode plate 22 of power storage element 20 to positive electrode terminal 40.
- FIG. 12 shows a partially enlarged sectional view of the conductive lid.
- the conductive lid 12 is made of a clad material in which Ni layers 12b and 12c having a thickness of about 5 ⁇ m are formed on the upper and lower surfaces of the base material 12a.
- the base material 12a is made of an Fe—Ni—Co alloy (Kovar) and has a thickness of about 90 ⁇ m, for example.
- An alloy layer is formed by diffusion bonding at the boundary surface between the base material 12a and the Ni layers 12b and 12c.
- the linear expansion coefficient of the conductive lid 12 is the same as the linear expansion coefficient of the insulating portion of the package mainly composed of Al 2 O 3. Or it can be a close value. That is, if the linear expansion coefficient of the conductive lid 12 and the linear expansion coefficient of the insulating portion are substantially the same, the conductive lid 12 and the insulating portion in the reflow soldering process when the electrochemical device is surface-mounted on a circuit board or the like. Even when thermal expansion and contraction occur, the joint portion between the conductive lid 12 and the insulating portion is not easily destroyed.
- the conductive lid 12 extends flatly and annularly to-be-welded portion PP facing the upper surface of the welded frame portion 11d, and inclined inward from the inner periphery of the to-be-welded portion PP.
- the reinforcing part RP has a ring-shaped reinforcing part RP and a flat part (without reference numeral) inside the reinforcing part RP.
- the outline in top view is the outline in top view of the outer peripheral edge of the welded frame portion 11d of the rigid case 11. Is almost the same.
- the conductive lid 12 is not flat, but has a shape in which a flat portion existing inside the reinforcing portion RP protrudes above the welded portion PP on the outer periphery.
- the reinforcement part RP By providing the reinforcement part RP, it becomes difficult to cause a breakage in the joint part between the welded part PP and the welded frame part 11d.
- the inclination angle of the reinforcing portion RP with respect to the lower surface of the welded portion PP is, for example, 5 to 30 degrees.
- the storage element 20 has a rectangular negative plate 21 having a thickness of about 200 ⁇ m, a rectangular positive plate 22 having a thickness of about 250 ⁇ m, and a thickness of about 100 ⁇ m interposed therebetween. And a rectangular separate sheet 23.
- These thicknesses are examples, and the thicknesses of the negative electrode plate 21, the positive electrode plate 22, and the separate sheet 23 can be appropriately changed according to the application.
- the negative electrode plate 21 and the positive electrode plate 22 are made of an active material such as activated carbon or PAS (polyacenic semiconductor), and the separate sheet 23 is made of an ion permeable sheet such as a glass sheet, a cellulose sheet, or a plastic sheet.
- the top view contours of the negative electrode plate 21 and the positive electrode plate 22 are substantially equal to each other, but the top view contour of the separate sheet 23 is larger than the top view contours of the negative electrode plate 21 and the positive electrode plate 22.
- FIG. 13 the upper surface of the negative electrode plate 21 of the electricity storage element 20 is placed at the center of the lower surface of the lower Ni layer 12c of the conductive lid 12 (reinforcing portion) using a conductive adhesive (not shown) such as graphite paste.
- the negative electrode plate 21 attached to the conductive lid 12 is dried at 250 ° C. or higher for 10 hours under reduced pressure.
- the negative electrode plate 21 is injected and impregnated with an electrolytic solution or the like.
- the positive electrode plate 22 of the electricity storage element 20 is inserted into the concave portion CP of the rigid case 11, and the lower surface of the positive electrode plate 22 is collected using a conductive adhesive such as graphite paste.
- the positive electrode plate 22 attached to the upper surface of the film 41c and attached to the current collecting film 41c is dried at 250 ° C. or higher for 10 hours under reduced pressure.
- the positive electrode plate 22 is injected and impregnated with the same electrolytic solution as described above, and a separate sheet 23 is placed on the upper surface of the positive electrode plate 22.
- the electrolyte solution impregnated in the negative electrode plate 21 and the positive electrode plate 22 is, for example, propylene carbonate (solvent) added with triethylmethylammonium borofluoride (solute).
- the conductive lid 12 is placed on the rigid case 11 so that the lower surface of the welded portion PP overlaps the upper surface of the welded frame portion 11d.
- the conductive lid 12 is placed on the rigid case 11 so that the gap between the lower surface of the welded portion PP and the upper surface of the welded frame portion 11d is 20 ⁇ m or less.
- the gap between the lower surface of the welded portion PP and the upper surface of the welded frame portion 11d is determined by a method of pressing the conductive lid 12 against the welded frame portion 11d using an appropriate jig when laser beam LB, which will be described later, is irradiated. It can be adjusted by a technique of temporarily fixing before LB irradiation.
- the upper surface of the welded portion PP of the conductive lid 12 is irradiated with a laser beam LB having a predetermined irradiation diameter LBs.
- the laser beam LB is irradiated while moving the irradiation position at a constant speed along the arrow shown in FIG.
- a shielding gas Ar, He or N 2 ) for preventing oxidation is sprayed on the irradiation position.
- the laser beam LB is, for example, a YAG laser beam.
- the laser beam LB is transmitted from a laser oscillator to a condensing lens via an appropriate optical system, and the irradiation diameter LBs is adjusted by the condensing lens.
- the top surface of the welded part PP is irradiated.
- the irradiation diameter LBs of the laser beam LB is smaller than the width W11d (see FIG. 8) of the substantially rectangular frame-shaped welded frame portion 11d, and the irradiation center of the laser beam LB (center of the irradiation diameter LBs) is It substantially coincides with the center in the width direction of the welded frame portion 11d (see FIG. 15).
- the thickness of the conductive lid 12 is 100 ⁇ m
- the thickness of the Au film 11d6 of the welded frame portion 11d is 2 ⁇ m
- the thickness of the Ni film 11d5 is 4 ⁇ m
- the irradiation energy of 10 to 50 kW can be obtained. Laser welding can be performed accurately.
- the irradiation energy of the laser beam LB changes the upper Ni layer 12b, the base material 12a, and the lower Ni of the welded portion PP. Conduction is conducted through the layer 12c to the Au film 11d6, the Ni film 11d5, and the base material 11d4 of the welded frame portion 11d. With this irradiation energy, the metal is melted in the keyhole type, and the melted metal is solidified over time to form the weld bead 50.
- the weld bead 50 is formed to extend from the welded part PP to the welded frame part 11d, and joins the welded part PP and the welded frame part 11d in a watertight and airtight manner. Since the laser beam LB is irradiated while moving its irradiation position at a constant speed in the direction of the arrow shown in FIG. 15, the weld bead 50 has an annular shape in plan view having a predetermined width as shown in FIG. It becomes the shape.
- the weld bead 50 passes through the substantially center in the width direction of the welded frame portion 11d so that the width thereof becomes smaller than the width W11d of the welded frame portion 11d (see FIG. 8). Therefore, it is not exposed to the internal space (recessed portion CP) of the rigid package 10.
- the welded part PP may be laser welded to the welded frame part 11d in a state where the welded part PP is temporarily fixed to the welded frame part 11d.
- a method of performing laser welding partially (several places), a method of performing spot welding several times, a method of performing seam welding partially (several places), and an adhesive that disappears during laser welding are used. Includes a method of pasting.
- This temporary fixing is performed in order to adjust the gap between the lower surface of the welded part PP and the upper surface of the welded frame part 11d, and a minimum necessary joining force is provided between the welded part PP and the welded frame part 11d. It should just be generated.
- the irradiation energy when laser welding is used for temporary fixing can be set lower than the irradiation energy used when forming the weld bead 50.
- the applied voltage can be set lower than the normal applied voltage. Therefore, a melt produced by spot welding or seam welding for temporary fixing, or a solidified product thereof, etc. Does not enter the internal space of the rigid package 10.
- the weld bead 50 formed by laser welding of the welded portion PP of the conductive lid 12 and the welded frame portion 11d of the rigid case 11 is a rigid package. Since it is not exposed to the internal space 10, it is possible to prevent the melt and solidified product produced by laser welding from entering the internal space of the rigid package 10. Therefore, it is possible to prevent characteristic deterioration caused by the laser welding melt and its solidified product.
- the width of the weld bead 50 can be reduced to 1.0 mm or less, for example, about 100 ⁇ m by adjusting the irradiation diameter LBs of the laser beam LB.
- the width W11d (see FIG. 8) of the welded frame portion 11d is reduced as the size of the welded frame portion 11 is reduced, for example, even when the width W11d is 1.0 mm or less, the melted product and its solidified material are contained inside the rigid package 10. Laser welding can be performed without entering the space.
- this to-be-welded frame part 11d since the surface which faces the internal space of the rigid package 10 of the to-be-welded frame part 11d is formed from Au which has corrosion resistance with respect to electrolyte solution, this to-be-welded frame part 11d It is possible to prevent the base material 11d4 made of Fe—Ni—Co alloy from corroding due to contact with the electrolytic solution.
- the conductive lid 12 is formed of a clad material having Ni layers 12b and 12c on the upper and lower surfaces of a base material (Fe—Ni—Co alloy) 12a. Compared to the case where the layer 12c is formed by plating, it is possible to prevent the base material 12a made of the Fe—Ni—Co alloy of the conductive lid 12 from being corroded by being in contact with the electrolytic solution and causing pinholes.
- the linear expansion coefficient of the conductive lid 12 is changed from a ceramic mainly composed of Al 2 O 3.
- the linear expansion coefficient of the insulating part of the circuit board to be formed can be the same or close to the linear expansion coefficient. That is, if the linear expansion coefficient of the conductive lid 12 and the linear expansion coefficient of the insulating portion are substantially the same, the conductive lid 12 and the insulating portion in the reflow soldering process when the electrochemical device is surface-mounted on a circuit board or the like. Even when thermal expansion and contraction occur, the joined portion between the conductive lid 12 and the insulating portion is not easily broken, and the occurrence of cracks can be prevented.
- the formation position of the weld bead 50 is not limited to the approximate center in the width direction of the welded frame portion 11 d, and can be formed at any position as long as the weld bead 50 is not exposed to the internal space of the rigid package 10.
- it can replace with Au film
- the upper Ni layer 12b of the conductive lid 12 is omitted, and the conductive lid 12 is formed from a two-layer clad material (without the base material 12a made of a Fe—Ni—Co alloy and a Ni layer 12c on the lower surface side). It may be formed.
- the Ni layers 12b and 12c for the conductive lid 12 other metal layers such as Pt, Ag, Au, or Pd can be used.
- each film constituting the welded frame portion 11d of the rigid case 11 described in this specification and the thickness of each layer constituting the conductive lid 12 are merely examples, and the present invention has been exemplified. The thickness is not limited. Other than those explicitly described in the present specification, the disclosed embodiments can be appropriately modified without departing from the spirit of the present invention.
- the present invention can be widely applied to various electrochemical devices such as an electric double layer capacitor, a lithium ion capacitor, a redox capacitor, or a lithium ion battery.
- SYMBOLS 10 Rigid package, 11 ... Rigid case, CP ... Recessed part of rigid case, 11d ... Frame to be welded of rigid case, 12 ... Conductive lid, PP ... Part to be welded of conductive lid, 20 ... Power storage element, 21 ... Negative electrode plate , 22 ... positive electrode plate, 23 ... separate sheet, 30 ... negative electrode terminal, 31 ... first wiring, 40 ... positive electrode terminal, 41 ... second wiring, 50 ... weld bead.
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- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Sealing Battery Cases Or Jackets (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Electric Double-Layer Capacitors Or The Like (AREA)
Abstract
Description
Claims (4)
- 剛性パッケージと、前記剛性パッケージの内部空間に封入された蓄電素子及び電解液と、前記剛性パッケージの下面に設けられた負極端子及び正極端子とを備え、前記剛性パッケージは、上面開口の凹部を有する剛性ケースと、前記凹部の上面開口を水密及び気密に閉塞する導電リッドとを有し、前記剛性ケースは、前記蓄電素子の負極プレートを前記導電リッドを介して前記負極端子に電気的に接続する第1配線と、前記蓄電素子の正極プレートを前記正極端子に電気的に接続する第2配線とを含み、
前記剛性ケースの上部には、前記凹部を囲むように、所定幅を有する被溶接枠部が一体形成され、
前記被溶接部分と前記被溶接枠部とはレーザ溶接により互いに接合され、前記レーザ溶接により前記被溶接部分と前記被溶接枠部に形成された溶接ビードは前記剛性パッケージの内部空間に露出していない電気化学デバイス。 - 前記溶接ビードは、その幅が前記被溶接枠部の幅よりも小さくなるように、前記被溶接枠部の略幅方向中心を通る位置に形成される請求項1に記載の電気化学デバイス。
- 前記被溶接枠部の前記剛性パッケージの内部空間と向き合う面が、前記電解液に対して耐食性を有する材料から形成される請求項1または2に記載の電気化学デバイス。
- 前記導電リッドは、前記剛性ケースの線膨張係数と実質的に同一の線膨張係数を有するクラッド材から形成されている請求項1~3の何れか1項に記載の電気化学デバイス。
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US13/810,889 US20130202951A1 (en) | 2010-07-22 | 2011-06-24 | Electrochemical device |
CN201180044199.2A CN103119676B (zh) | 2010-07-22 | 2011-06-24 | 电化学装置 |
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JP2010164713A JP2012028490A (ja) | 2010-07-22 | 2010-07-22 | 電気化学デバイス |
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US20130294012A1 (en) * | 2012-05-01 | 2013-11-07 | Taiyo Yuden Co., Ltd. | Electrochemical device |
US11830672B2 (en) | 2016-11-23 | 2023-11-28 | KYOCERA AVX Components Corporation | Ultracapacitor for use in a solder reflow process |
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JP5905731B2 (ja) * | 2011-02-15 | 2016-04-20 | セイコーインスツル株式会社 | 電気化学素子及びその製造方法 |
JP5737412B2 (ja) * | 2011-09-15 | 2015-06-17 | 富士電機株式会社 | 半導体装置の製造方法およびその製造方法を用いて製造した半導体装置 |
JP5394587B1 (ja) * | 2013-05-02 | 2014-01-22 | 太陽誘電株式会社 | 電気化学デバイスの製造方法及び電気化学デバイス、並びに仮接合装置 |
WO2014196230A1 (ja) * | 2013-06-07 | 2014-12-11 | 太陽誘電株式会社 | 電気化学デバイス |
KR101491645B1 (ko) | 2014-02-06 | 2015-02-12 | 김상진 | 패키지형 전기이중층 커패시터 |
JP6811003B2 (ja) * | 2014-11-19 | 2021-01-13 | セイコーインスツル株式会社 | 電気化学セル及び電気化学セルの製造方法 |
KR102522106B1 (ko) | 2019-06-10 | 2023-04-14 | 주식회사 엘지에너지솔루션 | 다층 구조의 전지케이스를 갖는 원통형 이차전지 및 그 제조방법 |
KR20220036810A (ko) * | 2020-09-16 | 2022-03-23 | 주식회사 엘지에너지솔루션 | 이차전지 제조방법 및 그 제조방법을 이용하여 제조된 이차전지 |
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- 2011-06-24 CN CN201180044199.2A patent/CN103119676B/zh not_active Expired - Fee Related
- 2011-06-24 WO PCT/JP2011/064505 patent/WO2012011361A1/ja active Application Filing
- 2011-06-24 US US13/810,889 patent/US20130202951A1/en not_active Abandoned
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JP2006165319A (ja) * | 2004-12-08 | 2006-06-22 | Sii Micro Parts Ltd | 電気化学セル及びその製造方法 |
JP2006286271A (ja) * | 2005-03-31 | 2006-10-19 | Seiko Instruments Inc | 電気化学セル及び電気化学セルの製造方法 |
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US20130294012A1 (en) * | 2012-05-01 | 2013-11-07 | Taiyo Yuden Co., Ltd. | Electrochemical device |
US11830672B2 (en) | 2016-11-23 | 2023-11-28 | KYOCERA AVX Components Corporation | Ultracapacitor for use in a solder reflow process |
Also Published As
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US20130202951A1 (en) | 2013-08-08 |
JP2012028490A (ja) | 2012-02-09 |
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CN103119676B (zh) | 2015-12-09 |
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