WO2012006796A1 - 发光二极管封装构造及背光模块 - Google Patents

发光二极管封装构造及背光模块 Download PDF

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Publication number
WO2012006796A1
WO2012006796A1 PCT/CN2010/075926 CN2010075926W WO2012006796A1 WO 2012006796 A1 WO2012006796 A1 WO 2012006796A1 CN 2010075926 W CN2010075926 W CN 2010075926W WO 2012006796 A1 WO2012006796 A1 WO 2012006796A1
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Prior art keywords
led
package structure
light
led package
blue
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PCT/CN2010/075926
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English (en)
French (fr)
Inventor
贺成明
任杰
林博瑛
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深圳市华星光电技术有限公司
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Priority to US12/996,847 priority Critical patent/US20120014091A1/en
Publication of WO2012006796A1 publication Critical patent/WO2012006796A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H01L33/504—Elements with two or more wavelength conversion materials

Definitions

  • the present invention relates to an LED package structure and a backlight module, and more particularly to an LED package structure capable of performing monochrome control and improving luminous efficiency of each color light, and a backlight module having the LED package structure.
  • Liquid crystal displays have been widely used in various electronic products.
  • Most of the liquid crystal displays are backlit liquid crystal displays, which are composed of a liquid crystal display panel and a backlight module.
  • the backlight module can be divided into a side-light type and a direct-light type according to different incident positions of the light source, thereby providing a backlight to the liquid crystal display panel, wherein the direct-lit light enters the light.
  • the backlight of the backlight module structure may be a cold cathode fluorescent lamp (CCFL), a light emitting diode (LED), an electroluminescent sheet (EL), or the like.
  • CCFL cold cathode fluorescent lamp
  • LED light emitting diode
  • EL electroluminescent sheet
  • an LED package structure 10 includes: a blue LED chip B that emits blue light after being energized; and, a yellow package Y And comprising a transparent encapsulant material and a yellow phosphor mixed therein, the yellow package Y coating protecting the blue LED chip B.
  • a portion of the blue light excites the yellow phosphor to produce yellow light.
  • the remaining blue light and the yellow light generated by the excitation are mixed with each other to become white light after being collectively emitted from the yellow package Y.
  • the first LED package structure 11 comprises: a blue LED chip B, which can emit blue light after being energized; a red package R, which comprises a transparent encapsulant material and a red phosphor mixed therein, the red package R coated Protecting the blue LED chip B; and a green package G comprising a transparent encapsulant and a green phosphor mixed therein, the green package G being stacked above the red package R.
  • a blue LED chip B which can emit blue light after being energized
  • a red package R which comprises a transparent encapsulant material and a red phosphor mixed therein, the red package R coated Protecting the blue LED chip B
  • a green package G comprising a transparent encapsulant and a green phosphor mixed therein, the green package G being stacked above the red package R.
  • the blue LED chip B During the passage of the blue light emitted by the blue LED chip B through the red package R, a portion of the blue light excites the red phosphor to generate red light, so that the remaining blue light and the red light generated by the excitation are co-injected into the Inside the green package G. At this time, another part of the blue light excites the green phosphor to generate green light. As a result, the remaining blue light and the red and green light generated by the excitation are mixed with each other to become white light after being collectively emitted from the green package G.
  • FIG. 1C discloses another conventional light emitting diode (LED) package structure, wherein an LED package structure 12 includes: a blue LED chip B that emits blue light after being energized; a red-green mixed color package R+G, which comprises a transparent encapsulant and a red and green phosphor mixed therein, the red-green mixed color package R+G coating protects the blue LED chip B.
  • a blue LED chip B that emits blue light after being energized
  • a red-green mixed color package R+G which comprises a transparent encapsulant and a red and green phosphor mixed therein
  • the red-green mixed color package R+G coating protects the blue LED chip B.
  • the blue light emitted by the blue LED chip B penetrating the red-green color mixing package R+G a part of the blue light excites the red phosphor to generate red light, and a part of the blue light excites the green phosphor to generate green.
  • the LED package construction 10 of Figure 1A has the disadvantage that white light produced by mixing blue light with excited yellow light can only exhibit a color gamut of about 70%, failing to meet the needs of a wider color gamut.
  • the LED package structures 11, 12 of Figs. 1B and 1C have the disadvantage that a part of the red light is absorbed or scattered by the green phosphor, resulting in insufficient luminous efficiency of the red portion.
  • a main object of the present invention is to provide an LED package structure and a backlight module, wherein the LED package structure provides three mutually adjacent but independent LED package structures for respectively generating red, green, and blue light, which can mutually
  • the combination is white light, and the above design ensures that various color lights are not absorbed or scattered by phosphors of other colors, thereby facilitating monochrome control, improving the luminous efficiency of each color light, and augmenting the color gamut of white light.
  • the present invention provides a light emitting diode (LED) package structure, wherein the LED package structure includes: a first LED package structure having a blue LED chip and a red package, the blue light a part of the blue light generated by the LED chip excites the red phosphor mixed with the red package to emit red light; and a second LED package structure having a blue LED chip and a green package, the blue LED chip generates a portion of the blue light excites the green phosphor mixed with the green package to emit green light; and a third LED package structure having a blue LED chip and a colorless package, the blue LED chip generating blue light, The red light, the green light and the blue light are mixed with each other to become white light.
  • the LED package structure includes: a first LED package structure having a blue LED chip and a red package, the blue light a part of the blue light generated by the LED chip excites the red phosphor mixed with the red package to emit red light; and a second LED package structure having a blue LED chip and a green package, the blue
  • the present invention provides another light emitting diode (LED) package structure, wherein the LED package structure comprises: a first LED package structure having an ultraviolet LED chip and a red package, the ultraviolet LED chip a part of the generated ultraviolet light excites the red phosphor mixed with the red package to emit red light; a second LED package structure having an ultraviolet LED chip and a green package, the ultraviolet LED chip is generated a portion of the ultraviolet light excites the green phosphor mixed with the green phosphor to emit green light; and a third LED package structure having an ultraviolet LED chip and a blue package, the ultraviolet LED A portion of the ultraviolet light generated by the chip excites the blue phosphor mixed with the blue package to emit blue light; wherein the red, green, and blue light are mixed with each other to become white light.
  • the LED package structure comprises: a first LED package structure having an ultraviolet LED chip and a red package, the ultraviolet LED chip a part of the generated ultraviolet light excites the red phosphor mixed with the red package to emit red light; a second LED package structure having an ultraviolet LED chip and
  • the present invention provides another light emitting diode (LED) package structure, wherein the LED package structure includes: a first LED package structure having an ultraviolet LED chip and a red package, the ultraviolet LED chip is generated Part of the ultraviolet light excites the red package to be mixed The red phosphor emits red light; a second LED package structure has an ultraviolet LED chip and a green package, and a portion of the ultraviolet light generated by the ultraviolet LED chip excites the green package a green phosphor emits green light; and a third LED package structure having a blue LED chip and a colorless package, the blue LED chip generating blue light, wherein the red light, the green light, and the blue light are mixed with each other to become white light .
  • LED light emitting diode
  • the LED package structure is assembled in a backlight module to serve as a backlight of the backlight module. That is, the backlight module includes a plurality of backlights, wherein at least one of the backlights has the light emitting diode (LED) package configuration.
  • LED light emitting diode
  • the material of the red package, the green package, the colorless package or the blue package is transparent silica gel or epoxy resin.
  • the wavelength of the blue light is between 440 and 460 nanometers (nm); the wavelength of the red light is between 620 and 660 nm; and the wavelength of the green light is Between 520 and 570 nm.
  • the third LED package structure is between the first and second LED package configurations.
  • the third LED package structure is located on one side of the first or second LED package construction.
  • the adjacent wall surfaces of the first, second, and third LED package structures are respectively coated with a reflective layer.
  • 1A is a schematic view of a conventional LED package construction
  • 1B is a schematic diagram of another conventional LED package construction
  • 1C is a schematic view of still another conventional LED package construction
  • FIG. 2 is a schematic view showing a light emitting diode package structure according to a first embodiment of the present invention
  • 3 is a schematic view showing a light emitting diode package structure according to a second embodiment of the present invention
  • FIG. 4 is a schematic view showing a light emitting diode package structure according to a third embodiment of the present invention. detailed description
  • FIG. 2 a schematic diagram of a light emitting diode (LED) package structure according to a first embodiment of the present invention is disclosed.
  • One LED package structure 20 is mainly used for assembly in a backlight module (not shown) as a The backlight of the backlight module, in particular, the backlight module of the liquid crystal display. That is, the backlight module includes a plurality of backlights, at least one of which has the light emitting diode (LED) package configuration. Furthermore, the arrangement and number of the LED package structures 20 of the present invention in the backlight module are not limited.
  • the LED package structure 20 includes a first LED package structure 21, a second LED package structure 22, and a third LED package structure 23, wherein the third LED package structure 23 can be Located on one side of the first or second LED package structures 21, 22, the third LED package structure 23 may also be located between the first and second LED package structures 21, 22 in accordance with the present invention.
  • the first LED package structure 21 is mainly used to generate red light (and part of blue light)
  • the second LED package structure 22 is mainly used to generate green light (and part of blue light)
  • the third LED package structure 23 is mainly For generating blue light, the red, green and blue light described above can be mixed with each other to become white light.
  • the first LED package structure 21 of the first embodiment of the present invention has a blue LED chip B and a red package R, wherein the blue LED chip B can generate blue light after passing current.
  • the material of the red package R is preferably transparent silica gel or epoxy resin, and A uniform blend is doped with a red phosphor, and a portion of the blue light generated by the blue LED chip B excites the red phosphor to produce red light.
  • the second LED package structure 22 has a blue LED chip B and a green package G, wherein the blue LED chip B can generate blue light after the current is supplied, and the material of the green package G is preferably A transparent silica gel or epoxy resin, and uniformly mixed with a green phosphor, a portion of the blue light generated by the blue LED chip excites the green phosphor to produce green light.
  • the third LED package structure 23 has a blue LED chip B and a colorless package X, and the blue LED chip B can generate blue light after the current is supplied, and the material of the colorless package X is preferably Transparent silica gel or epoxy resin with essentially no phosphor inside.
  • the first, second and third LED package structures 21, 22, 23 can generally be selectively constructed on a leadframe or a circuit substrate, and the blue LED chip B can be It is a regular or flip-chip LED setting type. Furthermore, the present invention does not limit the types of the three blue LED chips B. As long as the LED chips can emit blue light having a wavelength between 440 and 460 nanometers (nm), they can be used as the blue LED chips of the present invention. B. In addition, the present invention does not limit the kind of the red phosphor or the green phosphor as long as the phosphor can invent red light having a wavelength between 620 and 660 nm or green light between 520 and 570 nm. Both can be used as the red phosphor or green phosphor of the present invention.
  • the blue LED of the first LED package structure 21 A portion of the blue light generated by the chip B excites the red phosphor of the red package R to generate red light, and a portion of the blue light; a portion of the blue light generated by the blue LED chip B of the second LED package structure 22 excites The green phosphor of the green package G is used to generate green light, and the remaining portion of the blue light; and the blue LED chip B of the third LED package structure 23 is mainly used to generate blue light, and the red, green and blue light can be mutually Mix into white light.
  • the first, second, and third LED package structures 21, 22, and 23 that emit the three primary colors are adjacent to each other, the luminous efficiencies of the respective generated red, green, and blue light are not mutually influences. That is, the red light generated by the first LED package structure 21 is not absorbed or scattered by the green phosphor or other phosphor, and the green light generated by the second LED package structure 22 is not affected by the red light. Absorption or scattering of powder or other phosphors, while the blue light of the third LED package construction 23 is also not absorbed or scattered by red, green phosphors or other phosphors.
  • a reflective layer may be pre-coated on adjacent wall surfaces of the first, second, and third LED package structures 21, 22, and 23, respectively, to surely avoid color light incident of each package structure itself.
  • the adjacent package structure is absorbed or scattered by the phosphor of the adjacent package structure.
  • the LED package structure of the second embodiment of the present invention is similar to the first embodiment of the present invention, but the difference between the second embodiment is that the LED package structure 30 of the second embodiment includes a first LED package structure 31, a second LED package structure 32, and a third LED package structure 33, wherein the first LED package structure 31 has an ultraviolet LED chip UV and a red package R, The red package R is doped with a red phosphor, and a portion of the ultraviolet light generated by the ultraviolet LED chip can excite the red phosphor to generate red light.
  • the second LED package structure 32 has an ultraviolet LED chip UV and a green package G, and the green package G is mixed with a green phosphor, and a part of the ultraviolet light generated by the UV LED chip UV can be excited.
  • the green phosphor produces green light.
  • the third LED package structure 33 has an ultraviolet LED chip UV and a blue package B.
  • the blue package B is mixed with a blue phosphor, and the ultraviolet LED chip generates UV light.
  • a portion of the blue phosphor may be excited to generate blue light, wherein the red, green, and blue light are mixed with each other to become white light.
  • the first, second, and third LED package structures 31, 32, and 33 that emit the three primary colors are adjacent to each other, the luminous efficiencies of the respective generated red, green, and blue light do not affect each other. .
  • the red light of the first LED package structure 31 is not absorbed or scattered by the green light, the blue light phosphor or other phosphors, and the green light of the second LED package structure 32 is not It will be absorbed or scattered by red, blue phosphor or other phosphors, while the blue light of the third LED package construction 33 will not be absorbed or scattered by red, green phosphor or other phosphors. Therefore, it is not only beneficial to improve the luminous efficiency of each color light, but also facilitates the monochrome control of each primary color, and can widen the color gamut of white light.
  • the third LED package structure 33 may be located at one side of the first or second LED package structures 31, 32, but according to the present invention, the third LED package structure 33 may also be located Between the first and second LED package structures 31, 32.
  • the LED package structure of the third embodiment of the present invention is similar to the first and second embodiments of the present invention, but the difference of the third embodiment is: the LED package of the third embodiment
  • the structure 40 includes a first LED package structure 41, a second LED package structure 42 and a third LED package structure 43.
  • the first LED package structure 41 has an ultraviolet LED chip UV and a red package R.
  • the red package R is mixed with a red phosphor, and a part of the ultraviolet light generated by the ultraviolet LED chip can excite the red phosphor to generate red light.
  • the second LED package structure 42 has an ultraviolet LED chip UV and a green package G, the green package G is mixed with a green phosphor, and a part of the ultraviolet light generated by the UV LED chip UV can be excited.
  • the green phosphor produces green light.
  • the third LED package structure 43 has a blue LED chip B and a colorless package X for generating blue light, wherein the red light, the green light and the blue light are mixed with each other to become white light.
  • the first, second and third LED package structures 41, 42 and 43 which emit three primary colors are adjacent to each other, the luminous efficiencies of the respective red, green and blue light generated do not affect each other. .
  • the red light of the first LED package structure 41 is not absorbed or scattered by the green phosphor or other phosphor, and the green light of the second LED package structure 42 is not affected by the red phosphor or The absorption or scattering of other phosphors, while the blue light of the third LED package construction 43 is also not absorbed or scattered by red, green phosphor or other phosphors. Therefore, it is not only beneficial to improve the luminous efficiency of each color light, but also facilitates the monochrome control of each primary color and can broaden the color gamut of white light.
  • the third LED package structure 43 can be located in the first and second LED packages. Between the configurations 41, 42, but in accordance with the present invention, the third LED package construction 43 may also be located on one side of the first or second LED package construction 41, 42.
  • the light-emitting diode package structures 20, 30, and 40 of the present invention of FIGS. 2 to 4 are different from the conventional white light-emitting diode package structure in that a wider color gamut is not required or a part of the color light has insufficient luminous efficiency.
  • Three mutually adjacent but independent LED package structures 21-23, 31-33, 41-43 can be provided for respectively generating red, green and blue light, which can be mixed with each other to become white light, and can ensure various color lights. It is not absorbed or scattered by phosphors of other colors, so it is advantageous for monochromatic control, enhancement of luminous efficiency of various colors of light, and augmentation of the color gamut of white light.

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
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Abstract

一种发光二极管封装构造及背光模块，发光二极管封装构造提供三个相互邻接但各自独立的LED封装构造，用以分别产生红光、绿光及蓝光，其可相互混合成为白光。可确保各种色光不会被其它颜色的荧光粉所吸收或散射，因此有利于进行单色调控、增进各色光的发光效率与增广白光的色域。

Description

发光二极管封装构造及背光模块 技术领域
本发明是有关于一种发光二极管封装构造及背光模块， 特别是有关于一 种可进行单色调控及增进各色光的发光效率的发光二极管封装构造及具有所 述发光二极管封装构造的背光模块。 龍
液晶显示器 (liquid crystal display , LCD)已被广泛应用于各种电子产品 中， 液晶显示器大部分为背光型液晶显示器， 其是由液晶显示面板及背光模 块 (backlight module)所组成。 背光模块可依照光源入射位置的不同分成侧向 式入光 (side-light type)与直下式入光 (direct-light type)两种， 藉以提供背光源 至液晶显示面板， 其中直下式入光的背光模块结构的背光源可选用冷阴极萤 光管 (cold cathode fluorescent lamp, CCFL)、 发光二极管 (light emitting diode, LED)及电激发光片 (EL)等。 虽然目前直下式入光的背光模块结构大多仍以使 用冷阴极灯管来做为背光源， 但考虑到节能、 广色域与薄型化等新兴需求， 因此有愈来愈多的液晶显示器新产品进一步选用发光二极管来做为背光源。
请参照图 1A所示， 其揭示一种现有的发光二极管 (LED)封装构造， 其中 一 LED封装构造 10包含：一蓝光 LED芯片 B ,可在通电后发出蓝光； 以及， 一黄色封装体 Y, 其包含透明封胶材料与混掺其中的黄色荧光粉， 所述黄色 封装体 Y包覆保护所述蓝光 LED芯片 B。 在所述蓝光 LED芯片 B发出的蓝 光穿透所述黄色封装体 Y的期间， 一部分的蓝光激发了黄色荧光粉而产生黄 光。 结果， 使得剩余的蓝光与激发产生的黄光在共同射出所述黄色封装体 Y 之后相互混合成为白光。
请参照图 1B所示， 其揭示另一种现有的发光二极管 (LED)封装构造， 其 中一 LED封装构造 11包含： 一蓝光 LED芯片 B， 可在通电后发出蓝光； 一 红色封装体 R, 其包含透明封胶材料与混掺其中的红色荧光粉， 所述红色封 装体 R包覆保护所述蓝光 LED芯片 B; 以及， 一绿色封装体 G, 其包含透明 封胶材料与混掺其中的绿色荧光粉， 所述绿色封装体 G堆栈在所述红色封装 体 R上方。 在所述蓝光 LED芯片 B发出的蓝光穿透所述红色封装体 R的期 间， 一部分的蓝光激发了红色荧光粉而产生红光， 使得剩余的蓝光与激发产 生的红光再共同射入所述绿色封装体 G内。 此时， 又一部分的蓝光激发了绿 色荧光粉而产生绿光。 结果， 使得剩余的蓝光与激发产生的红光及绿光在共 同射出所述绿色封装体 G之后相互混合成为白光。
请参照图 1C所示， 其揭示又一种现有的发光二极管 (LED)封装构造， 其 中一 LED封装构造 12包含： 一蓝光 LED芯片 B , 可在通电后发出蓝光； 一 红绿混色封装体 R+G, 其包含透明封胶材料与混掺其中的红色及绿色荧光 粉， 所述红绿混色封装体 R+G包覆保护所述蓝光 LED芯片 B。 在所述蓝光 LED芯片 B发出的蓝光穿透所述红绿混色封装体 R+G的期间， 一部分的蓝 光激发了红色荧光粉而产生红光， 又一部分的蓝光激发了绿色荧光粉而产生 绿光。 结果， 使得剩余的蓝光与激发产生的红光及绿光在共同射出所述红绿 混色封装体 R+G之后相互混合成为白光。
然而， 图 1A的 LED封装构造 10的缺点在于： 由蓝光与激发黄光相混 产生的白光仅能呈现出约 70%的色域， 无法达到更广色域的需求。 再者， 图 1B及 1C的 LED封装构造 11、 12的缺点在于： 一部分红光会被绿光荧光粉 所吸收或散射， 而导致红光部分的发光效率不足。
故， 有必要提供一种发光二极管封装构造， 以解决现有技术所存在的问 题。 发明内容 本发明的主要目的在于提供一种发光二极管封装构造及背光模块， 其中 发光二极管封装构造提供三个相互邻接但各自独立的 LED封装构造，用以分 别产生红光、 绿光及蓝光， 其可相互混合成为白光， 上述设计可确保各种色 光不会被其它颜色的荧光粉所吸收或散射， 因此有利于进行单色调控、 增进 各色光的发光效率与增广白光的色域。
为达成本发明的前述目的， 本发明提供一种发光二极管 (LED)封装构造， 其中所述 LED封装构造包含：一第一 LED封装构造，具有一蓝光 LED芯片 及一红色封装体，所述蓝光 LED芯片产生的蓝光的一部分激发所述红色封装 体混掺有的红色荧光粉而发出红光；一第二 LED封装构造，具有一蓝光 LED 芯片及一绿色封装体，所述蓝光 LED芯片产生的蓝光的一部分激发所述绿色 封装体混掺有的绿色荧光粉而发出绿光； 以及， 一第三 LED封装构造， 具有 一蓝光 LED芯片及一无色封装体， 所述蓝光 LED芯片产生蓝光， 其中上述 红光、 绿光及蓝光相互混合成为白光。
再者， 本发明提供另一种发光二极管 (LED)封装构造， 其中所述 LED封 装构造包含：一第一 LED封装构造， 具有一紫外光 LED芯片及一红色封装 体，所述紫外光 LED芯片产生的紫外光的一部分激发所述红色封装体混掺有 的红色荧光粉而发出红光； 一第二 LED封装构造， 具有一紫外光 LED芯片 及一绿色封装体，所述紫外光 LED芯片产生的紫外光的一部分激发所述绿色 封装体混掺有的绿色荧光粉而发出绿光； 以及， 一第三 LED封装构造， 具有 一紫外光 LED芯片及一蓝色封装体， 所述紫外光 LED芯片产生的紫外光的 一部分激发所述蓝色封装体混掺有的蓝色荧光粉而发出蓝光；其中上述红光、 绿光及蓝光相互混合成为白光。
另外， 本发明提供另一种发光二极管 (LED)封装构造， 其中所述 LED封 装构造包含：一第一 LED封装构造， 具有一紫外光 LED芯片及一红色封装 体，所述紫外光 LED芯片产生的紫外光的一部分激发所述红色封装体混掺有 的红色荧光粉而发出红光； 一第二 LED封装构造， 具有一紫外光 LED芯片 及一绿色封装体，所述紫外光 LED芯片产生的紫外光的一部分激发所述绿色 封装体混掺有的绿色荧光粉而发出绿光； 以及， 一第三 LED封装构造， 具有 一蓝光 LED芯片及一无色封装体， 所述蓝光 LED芯片产生蓝光， 其中上述 红光、 绿光及蓝光相互混合成为白光。
在本发明的一实施例中， 所述 LED封装构造组装在一背光模块内， 以作 为所述背光模块的背光源。 也就是， 所述背光模块包含数个背光源， 其中至 少一个所述背光源具有所述发光二极管 (LED)封装构造。
在本发明的一实施例中， 所述红色封装体、 绿色封装体、 无色封装体或 蓝色封装体的材料为透明的硅胶或环氧树脂。
在本发明的一实施例中，所述蓝光的波长介于 440至 460纳米 (nm)之间； 所述红光的波长介于 620至 660 nm之间； 以及， 所述绿光的波长介于 520 至 570 nm之间。
在本发明的一实施例中， 所述第三 LED 封装构造位于所述第一及第二 LED封装构造之间。
在本发明的一实施例中， 所述第三 LED 封装构造位于所述第一或第二 LED封装构造的一侧。
在本发明的一实施例中， 所述第一、第二及第三 LED封装构造的相邻接 壁面上分别涂布有一反射层。 附图说明
图 1A是一现有的发光二极管封装构造的示意图；
图 1B是另一现有的发光二极管封装构造的示意图；
图 1C是又一现有的发光二极管封装构造的示意图；
图 2是本发明第一实施例发光二极管封装构造的示意图； 图 3是本发明第二实施例发光二极管封装构造的示意图；
图 4是本发明第三实施例发光二极管封装构造的示意图。 具体实施方式
为让本发明上述目的、 特征及优点更明显易懂， 下文特举本发明较佳实 施例， 并配合附图， 作详细说明如下。 再者， 本发明所提到的方向用语， 例 如 「上」、 「下」、 「前」、 「后」、 「左」、 「右」、 「内」、 「外」、 「侧面」 等， 仅是 参考附加图式的方向。因此，使用的方向用语是用以辅助说明及理解本发明， 而非用以限制本发明。
请参照图 2所示， 其揭示本发明第一实施例的发光二极管 (LED)封装构 造的示意图，其中一 LED封装构造 20主要应用于组装在一背光模块 (未绘示) 内， 以做为所述背光模块的背光源， 所述背光模块特别是指液晶显示器的背 光模块。 也就是， 所述背光模块包含数个背光源， 其中至少一个所述背光源 具有所述发光二极管 (LED)封装构造。再者， 本发明的 LED封装构造 20在 所述背光模块内的排列方式及数量则不加以限制。 在本发明第一实施例中， 所述 LED封装构造 20包含一第一 LED封装构造 21、 一第二 LED封装构造 22及一第三 LED封装构造 23， 其中所述第三 LED封装构造 23可位于所述 第一或第二 LED封装构造 21、 22的一侧， 但根据本发明， 所述第三 LED封 装构造 23亦可以位于所述第一及第二 LED封装构造 21、 22之间。所述第一 LED封装构造 21主要用以产生红光 (及部分蓝光)， 所述第二 LED封装构造 22主要用以产生绿光 (及部分蓝光)， 及所述第三 LED封装构造 23主要用以 产生蓝光， 上述红光、 绿光及蓝光可相互混合成为白光。
请再参照图 2所示， 本发明第一实施例的第一 LED封装构造 21具有一 蓝光 LED芯片 B及一红色封装体 R, 其中所述蓝光 LED芯片 B可在通入电 流后产生蓝光， 所述红色封装体 R的材料优选为透明的硅胶或环氧树脂， 且 其均匀的混掺有红色荧光粉， 所述蓝光 LED芯片 B产生的蓝光的一部分激 发所述红色荧光粉而产生红光。 再者， 所述第二 LED封装构造 22具有一蓝 光 LED芯片 B及一绿色封装体 G, 其中所述蓝光 LED芯片 B可在通入电流 后产生蓝光， 所述绿色封装体 G的材料优选为透明的硅胶或环氧树脂， 且其 均匀的混掺有绿色荧光粉，所述蓝光 LED芯片产生的蓝光的一部分激发所述 绿色荧光粉而产生绿光。 另外， 所述第三 LED封装构造 23具有一蓝光 LED 芯片 B及一无色封装体 X, 所述蓝光 LED芯片 B可在通入电流后产生蓝光， 所述无色封装体 X的材料优选为透明的硅胶或环氧树脂， 且其内部基本上不 具有任何荧光粉。 在本发明中， 上述第一、 第二及第三 LED封装构造 21、 22、 23通常可以选择建构在一导线架 (leadframe)或一电路基板 (substrate)上， 且所述蓝光 LED芯片 B可以是正规型或倒装芯片 (flip-chip)型的 LED设置型 态。 再者， 本发明并不限制三个所述蓝光 LED芯片 B的种类， 只要 LED芯 片能发出波长介于 440至 460纳米 (nm)之间的蓝光， 其皆可做为本发明的蓝 光 LED芯片 B。另外，本发明也不限制所述红色荧光粉或绿色荧光粉的种类， 只要荧光粉能发明波长介于 620至 660 nm之间的红光或介于 520至 570 nm 之间的绿光， 其皆可做为本发明的红色荧光粉或绿色荧光粉。
请参照图 2所示， 当本发明第一实施例的 LED封装构造 20的三个所述 蓝光 LED芯片 B分别通入电流而产生蓝光时， 所述第一 LED封装构造 21 的所述蓝光 LED芯片 B产生的蓝光的一部分激发所述红色封装体 R的红色 荧光粉而产生红光， 及剩余部分蓝光； 所述第二 LED封装构造 22的所述蓝 光 LED芯片 B产生的蓝光的一部分激发所述绿色封装体 G的绿色荧光粉而 产生绿光， 及剩余部分蓝光； 而所述第三 LED封装构造 23的蓝光 LED芯片 B主要用以产生蓝光， 上述红光、 绿光及蓝光即可相互混合成为白光。 特别 是， 由于发出三种原色的第一、 第二及第三 LED封装构造 21、 22、 23是彼 此独立的邻接设置， 因此各自产生的红光、 绿光及蓝光的发光效率不会相互 影响。 也就是， 所述第一 LED封装构造 21产生的红光不会受到绿光荧光粉 或其它荧光粉的吸收或散射， 所述第二 LED封装构造 22产生的绿光也不会 受到红光荧光粉或其它荧光粉的吸收或散射， 同时所述第三 LED 封装构造 23的蓝光也不会受到红光、 绿光荧光粉或其它荧光粉的吸收或散射。 因此不 但有利于增进各色光的发光效率， 而且也方便进行各原色的单色调控， 并能 增广白光的色域。 另外， 本发明也可以在所述第一、 第二及第三 LED封装构 造 21、 22、 23的相邻接壁面上分别预先涂布一反射层， 以确实避免各封装构 造自身的色光射入邻接的封装构造中而被相邻封装构造的荧光粉所吸收或散 射。
请参照图 3所示， 本发明第二实施例的发光二极管封装构造相似于本发 明第一实施例， 但第二实施例的差异特征在于： 所述第二实施例的发光二极 管封装构造 30包含：一第一 LED封装构造 31、 一第二 LED封装构造 32及 一第三 LED封装构造 33，其中所述第一 LED封装构造 31具有一紫外光 LED 芯片 UV及一红色封装体 R， 所述红色封装体 R混掺有红色荧光粉， 所述紫 外光 LED芯片产生的紫外光的一部分可以激发所述红色荧光粉而产生红光。 所述第二 LED封装构造 32具有一紫外光 LED芯片 UV及一绿色封装体 G, 所述绿色封装体 G混掺有绿色荧光粉， 所述紫外光 LED芯片 UV产生的紫 外光的一部分可以激发所述绿色荧光粉而产生绿光。所述第三 LED封装构造 33具有一紫外光 LED芯片 UV及一蓝色封装体 B , 所述蓝色封装体 B混掺 有蓝色荧光粉，所述紫外光 LED芯片 UV产生的紫外光的一部分可以激发所 述蓝色荧光粉而产生蓝光， 其中上述红光、 绿光及蓝光相互混合成为白光。 同样的， 由于发出三种原色的第一、 第二及第三 LED封装构造 31、 32、 33 是彼此独立的邻接设置， 因此各自产生的红光、 绿光及蓝光的发光效率不会 相互影响。 也就是， 所述第一 LED封装构造 31的红光不会受到绿光、 蓝光 荧光粉或其它荧光粉的吸收或散射， 所述第二 LED封装构造 32的绿光也不 会受到红光、蓝光荧光粉或其它荧光粉的吸收或散射， 同时所述第三 LED封 装构造 33的蓝光也不会受到红光、 绿光荧光粉或其它荧光粉的吸收或散射。 因此不但有利于增进各色光的发光效率，而且也方便进行各原色的单色调控， 并能增广白光的色域。 在本实施例中， 所述第三 LED封装构造 33可位于所 述第一或第二 LED封装构造 31、 32的一侧， 但根据本发明， 所述第三 LED 封装构造 33也可以位于所述第一及第二 LED封装构造 31、 32之间。
请参照图 4所示， 本发明第三实施例的发光二极管封装构造相似于本发 明第一及第二实施例， 但第三实施例的差异特征在于： 所述第三实施例的发 光二极管封装构造 40包含：一第一 LED封装构造 41、 一第二 LED封装构 造 42及一第三 LED封装构造 43， 其中所述第一 LED封装构造 41具有一紫 外光 LED芯片 UV及一红色封装体 R,所述红色封装体 R混掺有红色荧光粉， 所述紫外光 LED 芯片产生的紫外光的一部分可以激发所述红色荧光粉产生 红光。所述第二 LED封装构造 42具有一紫外光 LED芯片 UV及一绿色封装 体 G, 所述绿色封装体 G混掺有绿色荧光粉， 所述紫外光 LED芯片 UV产 生的紫外光的一部分可以激发所述绿色荧光粉产生绿光。所述第三 LED封装 构造 43具有一蓝光 LED芯片 B及一无色封装体 X， 所述蓝光 LED芯片 B 用以产生蓝光， 其中上述红光、 绿光及蓝光相互混合成为白光。 同样的， 由 于发出三种原色的第一、 第二及第三 LED封装构造 41、 42、 43是彼此独立 的邻接设置， 因此各自产生的红光、 绿光及蓝光的发光效率不会相互影响。 也就是， 所述第一 LED封装构造 41的红光不会受到绿光荧光粉或其它荧光 粉的吸收或散射， 所述第二 LED封装构造 42的绿光也不会受到红光荧光粉 或其它荧光粉的吸收或散射， 同时所述第三 LED封装构造 43的蓝光也不会 受到红光、 绿光荧光粉或其它荧光粉的吸收或散射。 因此不但有利于增进各 色光的发光效率，而且也方便进行各原色的单色调控，并能增广白光的色域。 在本实施例中，所述第三 LED封装构造 43可位于所述第一及第二 LED封装 构造 41、 42之间， 但根据本发明， 所述第三 LED封装构造 43也可以位于所 述第一或第二 LED封装构造 41、 42的一侧。
如上所述， 相较于现有白光发光二极管封装构造无法达到更广色域的需 求或其部分色光的发光效率不足等缺点， 图 2至 4的本发明发光二极管封装 构造 20、 30、 40皆可提供三个相互邻接但各自独立的 LED封装构造 21-23、 31-33、 41-43， 用以分别产生红光、 绿光及蓝光， 其可相互混合成为白光， 且可确保各种色光不会被其它颜色的荧光粉所吸收或散射， 因此确实有利于 进行单色调控、 增进各色光的发光效率与增广白光的色域。
本发明已由上述相关实施例加以描述， 然而上述实施例仅为实施本发明 的范例。 必需指出的是， 已公开的实施例并未限制本发明的范围。 相反地， 包含于权利要求书的精神及范围的修改及均等设置均包括于本发明的范围 内。

Claims

权 利 要 求
1. 一种发光二极管封装构造， 其包含一第一 LED封装构造、 一第二 LED封 装构造及一第三 LED封装构造， 其特征在于：
所述第一 LED封装构造具有一蓝光 LED芯片及一红色封装体，所述蓝光 LED 芯片产生的蓝光的一部分激发所述红色封装体混掺有的红色荧光粉 而产生红光；
所述第二 LED封装构造具有一蓝光 LED芯片及一绿色封装体，所述蓝光 LED 芯片产生的蓝光的一部分激发所述绿色封装体混掺有的绿色荧光粉 而产生绿光； 以及
所述第三 LED封装构造具有一蓝光 LED芯片及一无色封装体，所述蓝光 LED芯片产生蓝光；
其中上述红光、 绿光及蓝光相互混合成为白光。
2. 如权利要求 1 所述的发光二极管封装构造， 其特征在于： 所述第三 LED 封装构造位于所述第一或第二 LED封装构造的一侧；或是，所述第三 LED 封装构造位于所述第一及第二 LED封装构造之间。
3. 如权利要求 1所述的发光二极管封装构造， 其特征在于： 所述第一、 第二 及第三 LED封装构造的相邻接壁面上分别涂布有一反射层。
4. 如权利要求 2所述的发光二极管封装构造， 其特征在于： 所述第一、 第二 及第三 LED封装构造的相邻接壁面上分别涂布有一反射层。
5. 一种背光模块， 其特征在于： 所述背光模块包含数个背光源， 其中至少一 个所述背光源具有如权利要求 1所述的发光二极管封装构造。
6. 一种发光二极管封装构造， 其包含一第一 LED封装构造、 一第二 LED封 装构造及一第三 LED封装构造， 其特征在于：
所述第一 LED封装构造具有一紫外光 LED芯片及一红色封装体，所述紫 外光 LED芯片产生的紫外光的一部分激发所述红色封装体混掺有的红色 荧光粉而产生红光；
所述第二 LED封装构造具有一紫外光 LED芯片及一绿色封装体，所述紫 外光 LED芯片产生的紫外光的一部分激发所述绿色封装体混掺有的绿色 荧光粉而产生绿光； 以及
所述第三 LED封装构造具有一紫外光 LED芯片及一蓝色封装体，所述紫 外光 LED芯片产生的紫外光的一部分激发所述蓝色封装体混掺有的蓝色 荧光粉而产生蓝光；
其中上述红光、 绿光及蓝光相互混合成为白光。
7. 如权利要求 6所述的发光二极管封装构造， 其特征在于： 所述第三 LED 封装构造位于所述第一或第二 LED封装构造的一侧；或是，所述第三 LED 封装构造位于所述第一及第二 LED封装构造之间。
8. 如权利要求 6所述的发光二极管封装构造， 其特征在于： 所述第一、 第二 及第三 LED封装构造的相邻接壁面上分别涂布有一反射层。
9. 如权利要求 7所述的发光二极管封装构造， 其特征在于： 所述第一、 第二 及第三 LED封装构造的相邻接壁面上分别涂布有一反射层。
10.—种背光模块， 其特征在于： 所述背光模块包含数个背光源， 其中至少一 个所述背光源具有如权利要求 6所述的发光二极管封装构造。
11.一种发光二极管封装构造， 其包含一第一 LED封装构造、一第二 LED封 装构造及一第三 LED封装构造， 其特征在于：
所述第一 LED封装构造具有一紫外光 LED芯片及一红色封装体，所述紫 外光 LED芯片产生的紫外光的一部分激发所述红色封装体混掺有的红色 荧光粉而产生红光；
所述第二 LED封装构造具有一紫外光 LED芯片及一绿色封装体，所述紫 外光 LED芯片产生的紫外光的一部分激发所述绿色封装体混掺有的绿色 荧光粉而产生绿光； 以及 所述第三 LED封装构造具有一蓝光 LED芯片及一无色封装体，所述蓝光 LED芯片产生蓝光；
其中上述红光、 绿光及蓝光相互混合成为白光。
如权利要求 11所述的发光二极管封装构造， 其特征在于： 所述第三 LED 封装构造位于所述第一或第二 LED封装构造的一侧；或是，所述第三 LED 封装构造位于所述第一及第二 LED封装构造之间。
如权利要求 11所述的发光二极管封装构造， 其特征在于： 所述第一、 第 二及第三 LED封装构造的相邻接壁面上分别涂布有一反射层。
如权利要求 12所述的发光二极管封装构造， 其特征在于： 所述第一、 第 二及第三 LED封装构造的相邻接壁面上分别涂布有一反射层。
—种背光模块， 其特征在于： 所述背光模块包含数个背光源， 其中至少一 个所述背光源具有如权利要求 11所述的发光二极管封装构造。
PCT/CN2010/075926 2010-07-14 2010-08-12 发光二极管封装构造及背光模块 WO2012006796A1 (zh)

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