WO2014040306A1 - 直下式背光模组 - Google Patents

直下式背光模组 Download PDF

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Publication number
WO2014040306A1
WO2014040306A1 PCT/CN2012/081708 CN2012081708W WO2014040306A1 WO 2014040306 A1 WO2014040306 A1 WO 2014040306A1 CN 2012081708 W CN2012081708 W CN 2012081708W WO 2014040306 A1 WO2014040306 A1 WO 2014040306A1
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WO
WIPO (PCT)
Prior art keywords
light
phosphor layer
led
direct
backlight
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Application number
PCT/CN2012/081708
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English (en)
French (fr)
Inventor
王烨文
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深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/703,877 priority Critical patent/US20140071655A1/en
Publication of WO2014040306A1 publication Critical patent/WO2014040306A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133614—Illuminating devices using photoluminescence, e.g. phosphors illuminated by UV or blue light

Definitions

  • the present invention relates to the field of liquid crystal displays, and in particular, to a direct type backlight module. Background technique
  • Liquid crystal display has many advantages such as thin body, power saving, and no radiation, and has been widely used.
  • Most of the liquid crystal display devices on the market are backlight type liquid crystal display devices, which include a liquid crystal panel and a backlight module.
  • the working principle of the liquid crystal panel is to place liquid crystal molecules in two parallel glass substrates. There are many vertical and horizontal small wires between the two glass substrates, and the liquid crystal molecules are controlled to change direction by energization or not, and the light of the backlight module is refracted. Come out to produce the picture. Since the liquid crystal panel itself does not emit light, the light source provided by the backlight module needs to be used to display the image normally. Therefore, the backlight module becomes one of the key components of the liquid crystal display device.
  • the backlight module is divided into a side-in backlight module and a direct-lit backlight module according to different incident positions of the light source.
  • a backlight such as a CCFL (Cold Cathode Fluorescent Lamp) or an LED (Light Emitting Diode) is disposed behind the liquid crystal panel to directly form a surface light source to be supplied to the liquid crystal panel.
  • CCFL Cold Cathode Fluorescent Lamp
  • LED Light Emitting Diode
  • the conventional direct type backlight module includes: a back plate 100 , an LED light bar 200 installed in the back plate 100 , a reflective sheet 300 disposed in the back plate 100 , and a diffusion disposed on the reflective sheet 300 .
  • the light is further adjusted by the diffusion plate 400 and the optical film group 500 to adjust the similar point light source of the LED light bar 200 to a surface light source.
  • replacing the CCFL light source with an LED light source is more environmentally friendly and more efficient.
  • the existing LED lamps are generally packaged by Phosphor and Chip.
  • LED light sources in direct-lit backlight modules generally use high-power LED lamps, but in use, If it is not able to dissipate heat effectively, it will easily affect the Phosphor in the LED lamp, resulting in a decrease in brightness and chromaticity drift.
  • LED Mura it is necessary to have a high light box thickness. This will result in an excessive thickness of the backlight module, which runs counter to the current trend of thinning.
  • the object of the present invention is to provide a direct-lit backlight module, which effectively solves the influence of the heat generated by the light-emitting chip on the luminous efficacy of the phosphor, further saves energy, is environmentally friendly, and facilitates uniform illumination of the phosphor, and increases color. And the uniformity of brightness, reducing the color shift phenomenon, and effectively reducing the problem that the LED light box is too thick in the direct type backlight module, and achieving the purpose of thinning.
  • the present invention provides a direct-lit backlight module, including: a backplane, a backlight mounted in the backplane, and a diffuser mounted on the backplane and located above the backlight, the backlight includes An LED light bar, each of the LED light bars includes a plurality of LED lights, the diffuser plate has a light incident surface disposed opposite to the backlight, and the light incident surface of the diffuser plate is coated with a phosphor layer.
  • the light emitted by the LED lamp excites the phosphor layer to emit light, and the phosphor layer is excited by the light emitted by the LED lamp to be mixed with a part of the light emitted by the LED lamp to form white light required for the backlight.
  • the LED lamp is a blue LED lamp.
  • the phosphor layer coated on the diffusion plate is a yellow YAG phosphor layer.
  • the phosphor layer coated on the diffusion plate is a green phosphor layer and a red phosphor layer, the green phosphor layer is coated on the light incident surface of the diffusion plate, and the red phosphor layer is coated on the green phosphor. On the floor.
  • the backlight further includes a PCB mounted in the backplane, and the plurality of LED lamps are mounted and electrically connected to the PCB.
  • the LED lamp includes a bracket, a light emitting chip mounted in the bracket, and an encapsulant that encapsulates the light emitting chip in the bracket.
  • the encapsulant is an epoxy resin.
  • a plurality of LED lights on each of the LED strips are spaced apart.
  • the backboard includes a bottom plate and a side plate connecting the bottom plate, and the LED light bar is mounted on the bottom plate of the back plate.
  • the direct type backlight module further includes a reflective sheet disposed between the backplane bottom plate and the LED strip, and an optical film set disposed on the diffuser.
  • the present invention also provides a direct-lit backlight module, comprising: a backplane, a backlight mounted in the backplane, and a diffuser mounted on the backplane and located above the backlight, the backlight comprising a plurality of LED strips
  • the backlight comprising a plurality of LED strips
  • the diffuser plate has a light incident surface disposed opposite to the backlight, and the light incident surface of the diffuser plate is coated with a phosphor layer, and the LED light is emitted The light excites the phosphor layer to emit light, and the phosphor layer is mixed with the light emitted by the LED lamp to form a white light required for the backlight;
  • the LED lamp is a blue LED lamp
  • the phosphor layer coated on the diffusion plate is a yellow YAG phosphor layer; wherein the backlight further comprises a PCB board mounted in the back plate, the plurality of LEDs The lamp is mounted and electrically connected to the PCB board;
  • the LED lamp comprises a bracket, a light-emitting chip mounted in the bracket, and an encapsulant for packaging the light-emitting chip in the bracket;
  • the encapsulant is an epoxy resin
  • the backplane includes a bottom plate and a side plate connecting the bottom plate, and the LED light bar is mounted on the bottom plate of the back plate;
  • the invention also includes a reflective sheet disposed between the backplane substrate and the LED strip and an optical film set disposed on the diffuser.
  • the direct-lit backlight module of the present invention effectively separates the heat generated by the light-emitting chip of the LED lamp by separating the phosphor from the LED lamp and coating the phosphor on the light-incident surface of the diffuser plate.
  • the effect of phosphor light effect, further saving energy, is conducive to environmental protection, also increases the uniformity of color and brightness, reduces color shift phenomenon, and effectively reduces the problem of excessive thickness of LED light box in direct-lit backlight module, achieving thin type Purpose.
  • FIG. 1 is a schematic structural view of a conventional direct type backlight module
  • FIG. 2 is a schematic structural view of a direct type backlight module according to a preferred embodiment of the present invention.
  • FIG. 3 is a schematic structural view of another preferred embodiment of the direct type backlight module of the present invention. detailed description
  • the present invention provides a direct type backlight module, comprising: a back plate 2, a backlight 4 mounted in the back plate 2, and a diffusion plate 6 mounted on the back plate 2 and located above the backlight 4.
  • the backlight 4 includes a plurality of LED strips 42. Each of the LED strips 42 includes a plurality of LEDs 44. Preferably, the plurality of LEDs 44 are evenly spaced, each of the The LED lamp 44 includes a light-emitting chip 46.
  • the diffuser plate 6 has a light-incident surface 62 disposed opposite to the backlight. The light-incident surface 62 of the diffuser plate 6 is coated with a phosphor layer 5, and the LED light 44 is provided. The emitted light excites the phosphor layer 5 to emit light, and the phosphor layer 5 is excited to emit light and a part of the light emitted from the LED lamp 44 to be mixed into the white light required for the backlight 4.
  • the phosphor layer 5 is separated from the light-emitting chip 46, and the phosphor layer 5 is disposed on the light-incident surface 62 of the diffusing plate 6, which facilitates uniform light emission of the phosphor layer 5 and reduces the direct-lit backlight module.
  • the thickness of the LED light box also effectively solves the effect of the heat generated by the light-emitting chip 46 on the luminous efficacy of the phosphor, further saving energy and contributing to environmental protection.
  • the LED lamp 42 is a blue LED lamp, and includes a bracket (not shown), a light-emitting chip 46 mounted in the bracket, and an encapsulant 49 for packaging the light-emitting chip 46 in the bracket.
  • the encapsulating adhesive 49 is an epoxy resin;
  • the light emitting chip 46 is a blue light chip, which emits blue light after excitation, and the phosphor layer 5 coated on the diffusing plate 6 is a yellow YAG phosphor layer, which is excited. The yellow light is then emitted, and the yellow light is mixed with a portion of the blue light emitted by the light-emitting chip 46 to form white light required for the backlight 4.
  • the backlight 4 further includes a PCB board 48 mounted in the backboard 2, and the plurality of LED lamps 44 are mounted and electrically connected to the PCB board 48.
  • the heat generated by the light-emitting chip 46 is quickly dissipated, and aluminum extrusion (not shown) may be disposed between the PCB board 48 and the back sheet 2.
  • the distance between the LED lamp 44 and the phosphor layer 5 is H, and the distance between two adjacent LED lamps 44 on the LED strip 42 is L, H>0.3L.
  • the backboard 2 includes a bottom plate 22 and a side plate 24 connecting the bottom plate 22, and the LED light bar 42 is mounted on the bottom plate 22 of the backboard 2.
  • the direct-lit backlight module further includes: a reflective sheet disposed between the bottom plate 22 of the backboard 2 and the LED strip 42 and an optical film set 8 disposed on the diffusing plate 6, the light emitted by the backlight 4 Directly, or reflected by the reflection sheet 7, enters the phosphor layer 5 to mix the white light required for the backlight, enters the diffusion plate 6, and finally enters the optical film group 8, thereby providing a uniform surface light source.
  • the light emitting chip 46 is a blue light chip, and emits blue light after being turned on.
  • the phosphor layer 5 coated on the diffusing plate 6 is a green phosphor.
  • a layer 54 and a red phosphor layer 52 are applied to the light incident surface 62 of the diffuser plate 6, and the red phosphor layer 52 is applied to the green phosphor layer 54.
  • the green phosphor layer 54 and the red phosphor layer 52 emit light under the excitation of the blue light emitted by the light-emitting chip 46 and are mixed into red-green light, and further mixed with a portion of the blue light emitted by the light-emitting chip 46 to form white light required for the backlight 4.
  • the present invention provides a direct type backlight module by using a phosphor in a backlight
  • the LED lamp is separated and designed to apply phosphor on the light-incident side of the diffuser plate, which effectively solves the effect of the heat generated by the light-emitting chip on the luminous efficacy of the phosphor, further saves energy, is environmentally friendly, and is beneficial to phosphors.
  • Uniform illumination increases the uniformity of color and brightness, reduces the color shift phenomenon, and effectively reduces the problem of the LED light box being too thick in the direct type backlight module, thereby achieving the purpose of thinning.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)

Abstract

一种直下式背光模组，包括：背板（2）、安装于背板（2）内的背光源（4）及安装于背板（2）上且位于背光源（4）上方的扩散板（6）。背光源（4）包括数条LED灯条（42），每条LED灯条（42）包括数个LED灯（44）。扩散板（6）具有一相对背光源（4）设置的入光面（62），扩散板（6）的入光面（62）上涂覆有荧光粉层（5，5'），LED灯（44）发出的光激发荧光粉层（5，5'）发光，荧光粉层（5，5'）受激发发出的光与LED灯（44）发出的部分光混合成背光源（4）所需的白光。该直下式背光模组通过将荧光粉与LED灯分离设计，把荧光粉涂覆在扩散板的入光面上，有效地解决了LED灯的发光芯片产生的热量对荧光粉光效的影响，进一步节省能源，有利于环保，还增加了色彩和亮度的均匀度，减少色偏现象，而且有效地降低直下式背光模组中LED灯箱过厚的问题，达到薄型化的目的。

Description

直下式背光模组 技术领域
本发明涉及一种液晶显示器领域， 尤其涉及一种直下式背光模组。 背景技术
液晶显示装置（LCD, Liquid Crystal Display )具有机身薄、 省电、 无 辐射等众多优点， 得到了广泛的应用。 现有市场上的液晶显示装置大部分 为背光型液晶显示装置， 其包括液晶面板及背光模组 （ backlight module ) 。 液晶面板的工作原理是在两片平行的玻璃基板当中放置液晶分 子， 两片玻璃基板中间有许多垂直和水平的细小电线， 通过通电与否来控 制液晶分子改变方向， 将背光模组的光线折射出来产生画面。 由于液晶面 板本身不发光， 需要借由背光模组提供的光源来正常显示影像， 因此， 背 光模组成为液晶显示装置的关键组件之一。 背光模组依照光源入射位置的 不同分成侧入式背光模组与直下式背光模组两种。 直下式背光模组是将背 光源例如 CCFL(Cold Cathode Fluorescent Lamp , 阴极萤光灯管）或 LED(Light Emitting Diode发光二极管)设置在液晶面板后方， 直接形成面 光源提供给液晶面板。
请参阅图 1 , 现有的直下式背光模组包括： 背板 100、 安装于背板 100 内的 LED灯条 200、 设于背板 100内的反射片 300、 设于反射片 300上的 扩散板 400、 设于扩散板 400上的光学膜片组 500及安装于背板 100上的 胶框 600, 其中 LED灯条 200作为光源， 通过由背板 100与扩散板 400形 成的背光腔 150混光， 再经过扩散板 400和光学膜片组 500的均勾化， 将 LED灯条 200的类似点光源调整为面光源。 而且釆用 LED光源取代 CCFL 光源更加环保， 更高效率。
现有的 LED灯一般是由 Phosphor (荧光粉）与 Chip (发光芯片）封 装而成， 为了降低成本， 直下式背光模组中 LED 光源普遍釆用大功率的 LED 灯， 但在使用过程中， 若无法有效地散热， 就会艮容易对 LED 灯中 的 Phosphor产生影响， 导致亮度下降， 色度漂移； 而且为避免产生 LED Mura (斑） ， 使其充分混光， 需要较高的灯箱厚度， 这就会致使背光模组 厚度过大， 与现有薄型化趋势背道而驰。 发明内容 本发明的目的在于提供一种直下式背光模组， 有效地解决发光芯片产 生的热量对荧光粉光效的影响， 进一步节省能源， 有利于环保， 还有利于 荧光粉的均匀发光， 增加了色彩和亮度的均匀度， 减少色偏现象， 而且有 效地降低直下式背光模组中 LED灯箱过厚的问题， 达到薄型化的目的。
为实现上述目的， 本发明提供一种直下式背光模组， 包括： 背板、 安 装于背板内的背光源及安装于背板上且位于背光源上方的扩散板， 所述背 光源包括数条 LED灯条， 所述每条 LED灯条包括数个 LED灯， 所述扩散 板具有一相对背光源设置的入光面， 所述扩散板的入光面上涂覆有荧光粉 层， 所述 LED 灯发出的光激发荧光粉层发光， 所述荧光粉层受激发发出 的光与 LED灯发出的部分光混合成背光源所需的白光。
所述 LED灯为蓝光 LED灯。
所述扩散板上涂覆的荧光粉层为黄色的 YAG荧光粉层。
所述扩散板上涂覆的荧光粉层为绿色荧光粉层和红色荧光粉层， 所述 绿色荧光粉层涂覆于扩散板的入光面， 所述红色荧光粉层涂覆于绿色荧光 粉层上。
所述背光源还包括一安装于背板内的 PCB板， 所述数个 LED灯安装 并电性连接于该 PCB板上。
所述 LED 灯包括支架、 安装于支架内的发光芯片、 及将发光芯片封 装于支架内的封装胶。
所述封装胶为环氧树脂。
所述每条 LED灯条上数个 LED灯均勾间隔设置。
所述背板包括底板及连接底板的侧板， 所述 LED 灯条安装于背板的 底板上。
所述直下式背光模组还包括设于背板底板与 LED 灯条之间的反射片 及设于扩散板上的光学膜片组。
本发明还提供一种直下式背光模组， 包括： 背板、 安装于背板内的背 光源及安装于背板上且位于背光源上方的扩散板， 所述背光源包括数条 LED灯条， 所述每条 LED灯条包括数个 LED灯， 所述扩散板具有一相对 背光源设置的入光面， 所述扩散板的入光面上涂覆有荧光粉层， 所述 LED 灯发出的光激发荧光粉层发光， 所述荧光粉层受激发发出的光与 LED 灯 发出的部分光混合成背光源所需的白光；
其中， 所述 LED灯为蓝光 LED灯；
其中， 所述扩散板上涂覆的荧光粉层为黄色的 YAG荧光粉层； 其中， 所述背光源还包括一安装于背板内的 PCB板， 所述数个 LED 灯安装并电性连接于该 PCB板上；
其中， 所述 LED 灯包括支架、 安装于支架内的发光芯片、 及将发光 芯片封装于支架内的封装胶；
其中， 所述封装胶为环氧树脂；
其中， 所述每条 LED灯条上数个 LED灯均匀间隔设置；
其中， 所述背板包括底板及连接底板的侧板， 所述 LED 灯条安装于 背板的底板上；
还包括设于背板底板与 LED 灯条之间的反射片及设于扩散板上的光 学膜片组。
本发明的有益效果： 本发明直下式背光模组通过将荧光粉与 LED 灯 分离设计， 把荧光粉涂覆在扩散板的入光面上， 有效地解决了 LED 灯的 发光芯片产生的热量对荧光粉光效的影响， 进一步节省能源， 有利于环 保， 还增加了色彩和亮度的均勾度， 减少色偏现象， 而且有效地降低直下 式背光模组中 LED灯箱过厚的问题， 达到薄型化的目的。
为了能更进一步了解本发明的特征以及技术内容， 请参阅以下有关本 发明的详细说明与附图， 然而附图仅提供参考与说明用， 并非用来对本发 明加以限制。 附图说明
下面结合附图， 通过对本发明的具体实施方式详细描述， 将使本发明 的技术方案及其它有益效果显而易见。
附图中，
图 1为现有直下式背光模组的结构示意图；
图 2为本发明直下式背光模组一较佳实施例的结构示意图；
图 3为本发明直下式背光模组另一较佳实施例的结构示意图。 具体实施方式
为更进一步阐述本发明所釆取的技术手段及其效果， 以下结合本发明 的优选实施例及其附图进行详细描述。
请参阅图 2 , 本发明提供一种直下式背光模组， 包括： 背板 2、 安装 于背板 2 内的背光源 4及安装于背板 2上且位于背光源 4上方的扩散板 6。
所述背光源 4包括数条 LED灯条 42, 所述每条 LED灯条 42包括数 个 LED 灯 44, 优选的， 所述数个 LED 灯 44 均匀间隔设置， 所述每个 LED灯 44包括有发光芯片 46, 所述扩散板 6具有一相对背光源设置的入 光面 62, 所述扩散板 6的入光面 62上涂覆有荧光粉层 5 , 所述 LED灯 44 发出的光激发荧光粉层 5 发光， 所述荧光粉层 5 受激发发出的光与 LED 灯 44发出的部分光混合成背光源 4所需的白光。 本发明将荧光粉层 5与 发光芯片 46分离设计， 并把荧光粉层 5设置于扩散板 6的入光面 62上， 有利于荧光粉层 5 均匀发光， 并且降低了直下式背光模组中 LED 灯箱的 厚度， 同时还有效地解决了发光芯片 46 产生的热量对荧光粉光效的影 响， 进一步节省能源， 有利于环保。
在本较佳实施例中， 所述 LED灯 42为蓝光 LED灯， 其包括支架 (未 图示） 、 安装于支架内的发光芯片 46、 及将发光芯片 46封装于支架内的 封装胶 49, 其中， 所述封装胶 49为环氧树脂； 所述发光芯片 46为蓝光芯 片， 其激发后发出蓝光， 所述扩散板 6上涂覆的荧光粉层 5为黄色的 YAG 荧光粉层， 受激发后发出黄光， 该黄光与发光芯片 46发出的部分蓝光混 合成背光源 4所需的白光。
所述背光源 4还包括一安装于背板 2内的 PCB板 48 , 所述数个 LED 灯 44安装并电性连接于该 PCB板 48上。 为了增强导热效果， 把发光芯片 46产生的热量快速地散发出去， 所述 PCB板 48与背板 2之间可以设置铝 挤（未图示） 。
其中， 所述 LED灯 44到荧光粉层 5的距离为 H, 所述 LED灯条 42 上相邻的两 LED灯 44的距离为 L, H>0.3L。
所述背板 2包括底板 22及连接底板 22的侧板 24, 所述 LED灯条 42 安装于背板 2的底板 22上。
所述直下式背光模组还包括： 设于背板 2底板 22与 LED灯条 42之 间的反射片 Ί及设于扩散板 6上的光学膜片组 8 , 所述背光源 4发出的光 线直接、 或经由反射片 7反射后进入荧光粉层 5 混合成背光源所需的白 光， 再进入扩散板 6, 最后进入光学膜片组 8 , 进而提供均匀的面光源。
请参阅图 3 , 作为可供选择的另一较佳实施例， 所述发光芯片 46为蓝 光芯片， 导通后发出蓝光， 所述扩散板 6上涂覆的荧光粉层 5，为绿色荧光 粉层 54和红色荧光粉层 52, 所述绿色荧光粉层 54涂覆于扩散板 6的入光 面 62, 所述红色荧光粉层 52涂覆于绿色荧光粉层 54上。 所述绿色荧光粉 层 54和红色荧光粉层 52在发光芯片 46发出的蓝光激发下发光并混合成 红绿光， 并与发光芯片 46发出的部分蓝光进一步混合成背光源 4 所需的 白光。
综上所述， 本发明提供的直下式背光模组， 通过将背光源中荧光粉与 LED灯分离设计， 把荧光粉涂覆在扩散板的入光侧面上， 有效地解决了发 光芯片产生的热量对荧光粉光效的影响， 进一步节省能源， 有利于环保， 还有利于荧光粉的均匀发光， 增加了色彩和亮度的均匀度， 减少色偏现 象， 而且有效地降低直下式背光模组中 LED 灯箱过厚的问题， 达到薄型 化的目的。
以上所述， 对于本领域的普通技术人员来说， 可以根据本发明的技术 方案和技术构思作出其他各种相应的改变和变形， 而所有这些改变和变形 都应属于本发明权利要求的保护范围。

Claims

权 利 要 求
1、 一种直下式背光模组， 包括： 背板、 安装于背板内的背光源及安 装于背板上且位于背光源上方的扩散板， 所述背光源包括数条 LED 灯 条， 所述每条 LED灯条包括数个 LED灯， 所述扩散板具有一相对背光源 设置的入光面， 所述扩散板的入光面上涂覆有荧光粉层， 所述 LED 灯发 出的光激发荧光粉层发光， 所述荧光粉层受激发发出的光与 LED 灯发出 的部分光混合成背光源所需的白光。
2、 如权利要求 1所述的直下式背光模组， 其中， 所述 LED灯为蓝光 LED灯。
3、 如权利要求 2 所述的直下式背光模组， 其中， 所述扩散板上涂覆 的荧光粉层为黄色的 YAG荧光粉层。
4、 如权利要求 2 所述的直下式背光模组， 其中， 所述扩散板上涂覆 的荧光粉层为绿色荧光粉层和红色荧光粉层， 所述绿色荧光粉层涂覆于扩 散板的入光面， 所述红色荧光粉层涂覆于绿色荧光粉层上。
5、 如权利要求 1 所述的直下式背光模组， 其中， 所述背光源还包括 一安装于背板内的 PCB板， 所述数个 LED灯安装并电性连接于该 PCB板 上。
6、 如权利要求 1所述的直下式背光模组， 其中， 所述 LED灯包括支 架、 安装于支架内的发光芯片、 及将发光芯片封装于支架内的封装胶。
7、 如权利要求 6 所述的直下式背光模组， 其中， 所述封装胶为环氧 树脂。
8、 如权利要求 1所述的直下式背光模组， 其中， 所述每条 LED灯条 上数个 LED灯均匀间隔设置。
9、 如权利要求 1 所述的直下式背光模组， 其中， 所述背板包括底板 及连接底板的侧板， 所述 LED灯条安装于背板的底板上。
10、 如权利要求 9 所述的直下式背光模组， 还包括设于背板底板与 LED灯条之间的反射片及设于扩散板上的光学膜片组。
11、 一种直下式背光模组， 包括： 背板、 安装于背板内的背光源及安 装于背板上且位于背光源上方的扩散板， 所述背光源包括数条 LED 灯 条， 所述每条 LED灯条包括数个 LED灯， 所述扩散板具有一相对背光源 设置的入光面， 所述扩散板的入光面上涂覆有荧光粉层， 所述 LED 灯发 出的光激发荧光粉层发光， 所述荧光粉层受激发发出的光与 LED 灯发出 的部分光混合成背光源所需的白光；
其中， 所述 LED灯为蓝光 LED灯；
其中， 所述扩散板上涂覆的荧光粉层为黄色的 YAG荧光粉层； 其中， 所述背光源还包括一安装于背板内的 PCB板， 所述数个 LED 灯安装并电性连接于该 PCB板上；
其中， 所述 LED 灯包括支架、 安装于支架内的发光芯片、 及将发光 芯片封装于支架内的封装胶；
其中， 所述封装胶为环氧树脂；
其中， 所述每条 LED灯条上数个 LED灯均匀间隔设置；
其中， 所述背板包括底板及连接底板的侧板， 所述 LED 灯条安装于 背板的底板上；
还包括设于背板底板与 LED 灯条之间的反射片及设于扩散板上的光 学膜片组。
PCT/CN2012/081708 2012-09-11 2012-09-21 直下式背光模组 WO2014040306A1 (zh)

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