WO2012005479A3 - 레이저 빔의 광경로 거리가 일정한 도광판 레이저 가공장치 - Google Patents

레이저 빔의 광경로 거리가 일정한 도광판 레이저 가공장치 Download PDF

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Publication number
WO2012005479A3
WO2012005479A3 PCT/KR2011/004846 KR2011004846W WO2012005479A3 WO 2012005479 A3 WO2012005479 A3 WO 2012005479A3 KR 2011004846 W KR2011004846 W KR 2011004846W WO 2012005479 A3 WO2012005479 A3 WO 2012005479A3
Authority
WO
WIPO (PCT)
Prior art keywords
light path
guide plate
path distance
laser beam
light guide
Prior art date
Application number
PCT/KR2011/004846
Other languages
English (en)
French (fr)
Other versions
WO2012005479A2 (ko
Inventor
박해광
이호연
Original Assignee
레이져라이팅(주)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 레이져라이팅(주) filed Critical 레이져라이팅(주)
Priority to CN201180039024.2A priority Critical patent/CN103097942B/zh
Priority to JP2013518261A priority patent/JP5611462B2/ja
Priority to US13/808,827 priority patent/US9440309B2/en
Publication of WO2012005479A2 publication Critical patent/WO2012005479A2/ko
Publication of WO2012005479A3 publication Critical patent/WO2012005479A3/ko

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions

Abstract

본 발명은 광경로를 일정하게 유지함으로써 고품질의 도광판을 제공할 수 있는 도광판 레이저 가공장치에 관한 것으로, 레이저 빔을 반사하는 복수의 반사경과, 레이저 조사부가 광경로 거리를 늘이는 방향으로 이송될 때 상기 광경로 거리를 줄이는 방향으로 이송되는 경로조정블럭을 포함하되, 복수의 반사경 중 적어도 하나는 경로조정블럭에 설치된 특징으로 하며, 레이저 빔이 진행하는 전체 광경로 거리를 일정하게 유지할 수 있다.
PCT/KR2011/004846 2010-07-07 2011-07-01 레이저 빔의 광경로 거리가 일정한 도광판 레이저 가공장치 WO2012005479A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201180039024.2A CN103097942B (zh) 2010-07-07 2011-07-01 激光束的光路径距离一定的导光板激光加工装置
JP2013518261A JP5611462B2 (ja) 2010-07-07 2011-07-01 レーザービームの光経路距離が一定の、導光板レーザー加工装置
US13/808,827 US9440309B2 (en) 2010-07-07 2011-07-01 Apparatus for laser processing a light guide plate and having constant light path distance of a laser beam

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100065320A KR100998484B1 (ko) 2010-07-07 2010-07-07 레이저 빔의 광경로 거리가 일정한 도광판 레이저 가공장치
KR10-2010-0065320 2010-07-07

Publications (2)

Publication Number Publication Date
WO2012005479A2 WO2012005479A2 (ko) 2012-01-12
WO2012005479A3 true WO2012005479A3 (ko) 2012-04-12

Family

ID=43512384

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/004846 WO2012005479A2 (ko) 2010-07-07 2011-07-01 레이저 빔의 광경로 거리가 일정한 도광판 레이저 가공장치

Country Status (5)

Country Link
US (1) US9440309B2 (ko)
JP (1) JP5611462B2 (ko)
KR (1) KR100998484B1 (ko)
CN (1) CN103097942B (ko)
WO (1) WO2012005479A2 (ko)

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CN103894735B (zh) * 2012-12-24 2015-12-02 中国科学院沈阳自动化研究所 整体叶盘单/双面激光冲击强化光路系统
WO2015084087A1 (ko) * 2013-12-05 2015-06-11 주식회사 한광 레이저 가공기
CN103624404B (zh) * 2013-12-12 2017-01-11 苏州东山精密制造股份有限公司 一种激光图案加工设备
CN108127250A (zh) * 2016-06-12 2018-06-08 河南高盛企业管理咨询有限公司 一种导光板加工机构
CN111722469A (zh) * 2020-07-28 2020-09-29 苏州苏大维格科技集团股份有限公司 一种导光板光刻设备

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Also Published As

Publication number Publication date
KR100998484B1 (ko) 2010-12-06
CN103097942A (zh) 2013-05-08
US20130153546A1 (en) 2013-06-20
JP2013531562A (ja) 2013-08-08
CN103097942B (zh) 2016-01-20
JP5611462B2 (ja) 2014-10-22
WO2012005479A2 (ko) 2012-01-12
US9440309B2 (en) 2016-09-13

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